TWI576950B - Substrate alignment device and substrate alignment device control method - Google Patents

Substrate alignment device and substrate alignment device control method Download PDF

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Publication number
TWI576950B
TWI576950B TW103143801A TW103143801A TWI576950B TW I576950 B TWI576950 B TW I576950B TW 103143801 A TW103143801 A TW 103143801A TW 103143801 A TW103143801 A TW 103143801A TW I576950 B TWI576950 B TW I576950B
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TW
Taiwan
Prior art keywords
substrate
substrates
supporting
support
rotating
Prior art date
Application number
TW103143801A
Other languages
English (en)
Chinese (zh)
Other versions
TW201535578A (zh
Inventor
Takayuki Fukushima
Original Assignee
Kawasaki Heavy Ind Ltd
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Filing date
Publication date
Application filed by Kawasaki Heavy Ind Ltd filed Critical Kawasaki Heavy Ind Ltd
Publication of TW201535578A publication Critical patent/TW201535578A/zh
Application granted granted Critical
Publication of TWI576950B publication Critical patent/TWI576950B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H01L2223/54486—Located on package parts, e.g. encapsulation, leads, package substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW103143801A 2013-12-16 2014-12-16 Substrate alignment device and substrate alignment device control method TWI576950B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013258768A JP6263017B2 (ja) 2013-12-16 2013-12-16 基板位置合わせ装置及び基板位置合わせ装置の制御方法

Publications (2)

Publication Number Publication Date
TW201535578A TW201535578A (zh) 2015-09-16
TWI576950B true TWI576950B (zh) 2017-04-01

Family

ID=53402404

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103143801A TWI576950B (zh) 2013-12-16 2014-12-16 Substrate alignment device and substrate alignment device control method

Country Status (6)

Country Link
US (1) US10181418B2 (ko)
JP (1) JP6263017B2 (ko)
KR (1) KR101836320B1 (ko)
CN (1) CN105981155B (ko)
TW (1) TWI576950B (ko)
WO (1) WO2015093035A1 (ko)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6263017B2 (ja) * 2013-12-16 2018-01-17 川崎重工業株式会社 基板位置合わせ装置及び基板位置合わせ装置の制御方法
CN108780770B (zh) * 2016-03-04 2022-12-06 川崎重工业株式会社 基板搬送装置及基板搬送机器人的示教方法
JP2018041910A (ja) * 2016-09-09 2018-03-15 東朋テクノロジー株式会社 基板支持装置
JP2019046941A (ja) * 2017-08-31 2019-03-22 東芝メモリ株式会社 半導体製造装置、ウェハ搬送装置、およびウェハ搬送方法
JP2019067948A (ja) * 2017-10-02 2019-04-25 川崎重工業株式会社 基板搬送装置
JP7145648B2 (ja) * 2018-05-22 2022-10-03 東京エレクトロン株式会社 基板処理方法及び基板処理装置
WO2019244982A1 (ja) * 2018-06-22 2019-12-26 ローツェ株式会社 アライナ及びアライナの補正値算出方法
WO2020084909A1 (ja) * 2018-10-23 2020-04-30 東京エレクトロン株式会社 基板処理装置及び基板処理方法
KR102180211B1 (ko) * 2019-01-07 2020-11-18 주식회사 아바코 마스크 정렬장치용 기판 리프트 장치
CN113066746B (zh) * 2020-01-02 2022-03-22 长鑫存储技术有限公司 预对准装置及应用于该装置的预对准方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6052913A (en) * 1997-07-15 2000-04-25 Tokyo Electron Limited Positioning device and positioning method
US20020070095A1 (en) * 1999-04-07 2002-06-13 Kousai Electric Co., Ltd. Semiconductor manfacturing method and semiconductor manfacturing apparatus
JP2008300609A (ja) * 2007-05-31 2008-12-11 Yaskawa Electric Corp ウェハのアライメント装置、それを備えた搬送装置、半導体製造装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3248129B2 (ja) * 1997-01-21 2002-01-21 東京エレクトロン株式会社 基板搬送処理装置
JP2001053128A (ja) * 1999-08-13 2001-02-23 Hitachi Kokusai Electric Inc 基板処理方法および基板処理装置
US6393337B1 (en) * 2000-01-13 2002-05-21 Applied Materials, Inc. Method and apparatus for orienting substrates
JP2002100664A (ja) * 2000-09-25 2002-04-05 Hitachi Kokusai Electric Inc 基板処理方法および装置
KR100672634B1 (ko) * 2001-12-19 2007-02-09 엘지.필립스 엘시디 주식회사 액정표시소자의 기판 반송 장치 및 방법
JP4601698B2 (ja) * 2008-09-26 2010-12-22 株式会社日立国際電気 半導体製造方法及びその装置
JP5452166B2 (ja) * 2009-10-23 2014-03-26 川崎重工業株式会社 アライナ装置、及びそれを備える半導体処理設備
JP2011091276A (ja) * 2009-10-23 2011-05-06 Kawasaki Heavy Ind Ltd 多段アライナ装置
JP2012129248A (ja) * 2010-12-13 2012-07-05 Yaskawa Electric Corp アライメント装置及び半導体製造装置
KR101685150B1 (ko) * 2011-01-14 2016-12-09 주식회사 원익아이피에스 박막 증착 장치 및 이를 포함한 기판 처리 시스템
JP6184102B2 (ja) * 2013-01-16 2017-08-23 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 位置合わせ装置および基板処理装置
JP6263017B2 (ja) * 2013-12-16 2018-01-17 川崎重工業株式会社 基板位置合わせ装置及び基板位置合わせ装置の制御方法
KR101883804B1 (ko) * 2014-03-25 2018-07-31 카와사키 주코교 카부시키 카이샤 기판 각도정렬 장치, 기판 각도정렬 방법 및 기판 이송 방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6052913A (en) * 1997-07-15 2000-04-25 Tokyo Electron Limited Positioning device and positioning method
US20020070095A1 (en) * 1999-04-07 2002-06-13 Kousai Electric Co., Ltd. Semiconductor manfacturing method and semiconductor manfacturing apparatus
JP2008300609A (ja) * 2007-05-31 2008-12-11 Yaskawa Electric Corp ウェハのアライメント装置、それを備えた搬送装置、半導体製造装置

Also Published As

Publication number Publication date
CN105981155A (zh) 2016-09-28
CN105981155B (zh) 2018-09-28
WO2015093035A1 (ja) 2015-06-25
JP6263017B2 (ja) 2018-01-17
TW201535578A (zh) 2015-09-16
KR101836320B1 (ko) 2018-03-08
US10181418B2 (en) 2019-01-15
JP2015115562A (ja) 2015-06-22
KR20160086381A (ko) 2016-07-19
US20160322248A1 (en) 2016-11-03

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