TWI573996B - 基板分析用噴嘴 - Google Patents

基板分析用噴嘴 Download PDF

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Publication number
TWI573996B
TWI573996B TW102119725A TW102119725A TWI573996B TW I573996 B TWI573996 B TW I573996B TW 102119725 A TW102119725 A TW 102119725A TW 102119725 A TW102119725 A TW 102119725A TW I573996 B TWI573996 B TW I573996B
Authority
TW
Taiwan
Prior art keywords
substrate
nozzle
analysis
tube
nozzle body
Prior art date
Application number
TW102119725A
Other languages
English (en)
Chinese (zh)
Other versions
TW201350820A (zh
Inventor
川端克彥
李晟在
國香仁
鈴木淳司
Original Assignee
埃耶士股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 埃耶士股份有限公司 filed Critical 埃耶士股份有限公司
Publication of TW201350820A publication Critical patent/TW201350820A/zh
Application granted granted Critical
Publication of TWI573996B publication Critical patent/TWI573996B/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N35/00—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
    • G01N35/10—Devices for transferring samples or any liquids to, in, or from, the analysis apparatus, e.g. suction devices, injection devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N35/00—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
    • G01N35/10—Devices for transferring samples or any liquids to, in, or from, the analysis apparatus, e.g. suction devices, injection devices
    • G01N2035/1027—General features of the devices
    • G01N2035/1048—General features of the devices using the transfer device for another function

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Sampling And Sample Adjustment (AREA)
TW102119725A 2012-06-14 2013-06-04 基板分析用噴嘴 TWI573996B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012134629A JP5881166B2 (ja) 2012-06-14 2012-06-14 基板分析用ノズル

Publications (2)

Publication Number Publication Date
TW201350820A TW201350820A (zh) 2013-12-16
TWI573996B true TWI573996B (zh) 2017-03-11

Family

ID=49895844

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102119725A TWI573996B (zh) 2012-06-14 2013-06-04 基板分析用噴嘴

Country Status (4)

Country Link
JP (1) JP5881166B2 (ko)
KR (1) KR101918784B1 (ko)
CN (1) CN103512769B (ko)
TW (1) TWI573996B (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5971289B2 (ja) * 2014-08-20 2016-08-17 株式会社 イアス 基板局所の自動分析装置及び分析方法
JP6108367B1 (ja) * 2015-12-22 2017-04-05 株式会社 イアス シリコン基板用分析装置
JP6156893B1 (ja) * 2016-03-01 2017-07-05 株式会社 イアス 基板分析用のノズル
US10688485B2 (en) * 2017-07-18 2020-06-23 Ias, Inc Substrate analysis nozzle and method for analyzing substrate
US11244841B2 (en) 2017-12-01 2022-02-08 Elemental Scientific, Inc. Systems for integrated decomposition and scanning of a semiconducting wafer
JP6603934B2 (ja) 2018-04-13 2019-11-13 東芝メモリ株式会社 シリコン基板の分析方法
EP4136670A4 (en) * 2020-04-16 2024-04-17 Elemental Scientific Inc SYSTEMS FOR INTEGRATED DISMANTLING AND SCANNING OF A SEMICONDUCTOR WAFER
CN115700899A (zh) * 2021-07-16 2023-02-07 江苏鲁汶仪器股份有限公司 一种用于晶圆扫描的喷嘴及扫描系统、扫描方法
WO2023037564A1 (ja) * 2021-09-10 2023-03-16 株式会社 イアス 分析液の回収方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004101480A (ja) * 2002-09-12 2004-04-02 Ckd Corp 分注装置
JP2004170222A (ja) * 2002-11-20 2004-06-17 Technos:Kk スキャン・回収兼用ノズル
JP2009146866A (ja) * 2007-12-18 2009-07-02 Toyota Motor Corp 注液装置
CN101484808A (zh) * 2006-05-05 2009-07-15 珀金埃尔默·拉斯公司 用质谱法定量分析源自表面的样品
JP2010164421A (ja) * 2009-01-15 2010-07-29 Toshiba Corp 自動分析装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2943309B2 (ja) * 1990-10-29 1999-08-30 東ソー株式会社 ノズル装置
JP3179175B2 (ja) * 1992-03-12 2001-06-25 株式会社ピュアレックス 分析前処理方法
JP2000009615A (ja) * 1998-06-26 2000-01-14 Sony Corp 支持棒誘導液相溶解法および支持棒誘導液相溶解装置
WO2006038472A1 (ja) * 2004-10-06 2006-04-13 Ebara Corporation 基板処理装置及び基板処理方法
US20100224013A1 (en) * 2009-03-05 2010-09-09 Van Berkel Gary J Method and system for formation and withdrawal of a sample from a surface to be analyzed
JP2011232182A (ja) 2010-04-28 2011-11-17 Ias Inc 基板分析装置及び基板分析方法
TWI529833B (zh) 2009-12-18 2016-04-11 埃耶士股份有限公司 基板分析裝置及基板分析方法
JP4897870B2 (ja) 2009-12-18 2012-03-14 株式会社 イアス 基板分析用ノズル及び基板分析方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004101480A (ja) * 2002-09-12 2004-04-02 Ckd Corp 分注装置
JP2004170222A (ja) * 2002-11-20 2004-06-17 Technos:Kk スキャン・回収兼用ノズル
CN101484808A (zh) * 2006-05-05 2009-07-15 珀金埃尔默·拉斯公司 用质谱法定量分析源自表面的样品
JP2009146866A (ja) * 2007-12-18 2009-07-02 Toyota Motor Corp 注液装置
JP2010164421A (ja) * 2009-01-15 2010-07-29 Toshiba Corp 自動分析装置

Also Published As

Publication number Publication date
KR20130140560A (ko) 2013-12-24
JP2013257272A (ja) 2013-12-26
TW201350820A (zh) 2013-12-16
JP5881166B2 (ja) 2016-03-09
KR101918784B1 (ko) 2018-11-14
CN103512769A (zh) 2014-01-15
CN103512769B (zh) 2017-04-12

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