JP6418586B1 - 基板分析用ノズル及び基板分析方法 - Google Patents
基板分析用ノズル及び基板分析方法 Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H01L21/67242—Apparatus for monitoring, sorting or marking
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
- B01L3/02—Burettes; Pipettes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/02—Devices for withdrawing samples
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
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- H01L21/67017—Apparatus for fluid treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
- B01L2200/06—Fluid handling related problems
- B01L2200/0615—Loss of fluid by dripping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
- B01L2200/06—Fluid handling related problems
- B01L2200/0684—Venting, avoiding backpressure, avoid gas bubbles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/08—Geometry, shape and general structure
- B01L2300/0832—Geometry, shape and general structure cylindrical, tube shaped
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/02—Devices for withdrawing samples
- G01N2001/028—Sampling from a surface, swabbing, vaporising
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N2033/0095—Semiconductive materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Abstract
Description
10 ノズル本体
11 細管
20 外管
110 配管
120 第一外管
130 第二外管
W ウェーハ
D 分析液
Claims (2)
- 先端から基板上に分析液を吐出し、吐出した分析液で基板表面を掃引した後に分析液を吸引する基板分析用のノズルにおいて、
分析液を吐出及び吸引する配管と、掃引する分析液を取り囲むよう配管の外周に設けられた第一外管と、第一外管の外周側に設けられた第二外管とからなる三重管で構成され、
配管と第一外管との間を排気経路とする第一排気手段と、第一外管と第二外管との間を排気経路とする第二排気手段とを有することを特徴とする基板分析用ノズル。 - 請求項1記載の基板分析用ノズルを用いて基板を分析する方法において、
配管より基板に分析液を吐出し、第二排気手段により排気しながら吐出した分析液で基板表面を掃引した後、第二排気手段を停止し第一排気手段により排気しながら分析対象物を含む分析液を配管に吸引することを特徴とする基板分析方法。
Applications Claiming Priority (1)
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PCT/JP2017/025852 WO2019016847A1 (ja) | 2017-07-18 | 2017-07-18 | 基板分析用ノズル及び基板分析方法 |
Publications (2)
Publication Number | Publication Date |
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JP6418586B1 true JP6418586B1 (ja) | 2018-11-07 |
JPWO2019016847A1 JPWO2019016847A1 (ja) | 2019-07-18 |
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JP2017552507A Active JP6418586B1 (ja) | 2017-07-18 | 2017-07-18 | 基板分析用ノズル及び基板分析方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US10688485B2 (ja) |
EP (1) | EP3457109B1 (ja) |
JP (1) | JP6418586B1 (ja) |
KR (1) | KR102115107B1 (ja) |
CN (1) | CN109791097B (ja) |
TW (1) | TWI702666B (ja) |
WO (1) | WO2019016847A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113287193A (zh) * | 2018-12-26 | 2021-08-20 | 埃耶士株式会社 | 基板分析方法及基板分析装置 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US11244841B2 (en) | 2017-12-01 | 2022-02-08 | Elemental Scientific, Inc. | Systems for integrated decomposition and scanning of a semiconducting wafer |
CN115398615A (zh) * | 2020-04-16 | 2022-11-25 | 基础科学公司 | 用于半导体晶圆的集成分解和扫描的系统 |
KR102328717B1 (ko) * | 2020-12-23 | 2021-11-22 | 주식회사 헥사 | 삼중관 구조를 갖는 액체수소 주입용 아답터 |
CN115700899A (zh) * | 2021-07-16 | 2023-02-07 | 江苏鲁汶仪器股份有限公司 | 一种用于晶圆扫描的喷嘴及扫描系统、扫描方法 |
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- 2017-07-18 EP EP17882257.3A patent/EP3457109B1/en active Active
- 2017-07-18 WO PCT/JP2017/025852 patent/WO2019016847A1/ja active Application Filing
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- 2017-07-18 KR KR1020187017180A patent/KR102115107B1/ko active IP Right Grant
- 2017-07-18 CN CN201780004607.9A patent/CN109791097B/zh active Active
- 2017-09-14 TW TW106131578A patent/TWI702666B/zh active
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Cited By (2)
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Publication number | Publication date |
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JPWO2019016847A1 (ja) | 2019-07-18 |
KR102115107B1 (ko) | 2020-05-25 |
TWI702666B (zh) | 2020-08-21 |
CN109791097B (zh) | 2022-01-04 |
EP3457109B1 (en) | 2021-09-01 |
CN109791097A (zh) | 2019-05-21 |
WO2019016847A1 (ja) | 2019-01-24 |
EP3457109A4 (en) | 2019-03-20 |
KR20190087965A (ko) | 2019-07-25 |
EP3457109A1 (en) | 2019-03-20 |
US20190358622A1 (en) | 2019-11-28 |
TW201909296A (zh) | 2019-03-01 |
US10688485B2 (en) | 2020-06-23 |
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