TWI570852B - Packaging equipment and packaging methods - Google Patents

Packaging equipment and packaging methods Download PDF

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Publication number
TWI570852B
TWI570852B TW104100899A TW104100899A TWI570852B TW I570852 B TWI570852 B TW I570852B TW 104100899 A TW104100899 A TW 104100899A TW 104100899 A TW104100899 A TW 104100899A TW I570852 B TWI570852 B TW I570852B
Authority
TW
Taiwan
Prior art keywords
packaging
heating
package
container
upper cover
Prior art date
Application number
TW104100899A
Other languages
English (en)
Chinese (zh)
Other versions
TW201541564A (zh
Inventor
Takashi Okamoto
Original Assignee
Cross Osaka Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cross Osaka Co Ltd filed Critical Cross Osaka Co Ltd
Publication of TW201541564A publication Critical patent/TW201541564A/zh
Application granted granted Critical
Publication of TWI570852B publication Critical patent/TWI570852B/zh

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Closing Of Containers (AREA)
  • Vacuum Packaging (AREA)
TW104100899A 2014-01-14 2015-01-12 Packaging equipment and packaging methods TWI570852B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014004098 2014-01-14
JP2014184731A JP5692453B1 (ja) 2014-01-14 2014-09-11 封止装置及び封止方法

Publications (2)

Publication Number Publication Date
TW201541564A TW201541564A (zh) 2015-11-01
TWI570852B true TWI570852B (zh) 2017-02-11

Family

ID=52830785

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104100899A TWI570852B (zh) 2014-01-14 2015-01-12 Packaging equipment and packaging methods

Country Status (3)

Country Link
JP (1) JP5692453B1 (ja)
CN (1) CN104779184B (ja)
TW (1) TWI570852B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6987376B2 (ja) * 2017-03-09 2021-12-22 株式会社昭和真空 封止機構

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011146491A (ja) * 2010-01-14 2011-07-28 Nippon Avionics Co Ltd 電子部品の封止装置
JP2013219237A (ja) * 2012-04-10 2013-10-24 Mitsubishi Electric Corp 真空パッケージおよびその製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2540942B2 (ja) * 1989-05-23 1996-10-09 三菱電機株式会社 混成集積回路のパッケ―ジ方法
JPH04107955A (ja) * 1990-08-28 1992-04-09 Matsushita Electric Ind Co Ltd 電子回路素子の封止方法
JP2933403B2 (ja) * 1991-03-15 1999-08-16 株式会社日立製作所 半導体パッケージ気密封止方法及び半導体パッケージ気密封止装置
JPH11214551A (ja) * 1998-01-21 1999-08-06 Toyo Commun Equip Co Ltd 電子部品のパッケージの封止装置及び封止方法
JP2002176116A (ja) * 2000-12-05 2002-06-21 Daishinku Corp 電子部品用パッケージの気密封止方法
JP3941598B2 (ja) * 2002-06-10 2007-07-04 株式会社村田製作所 圧電部品の製造方法
TW200500206A (en) * 2003-05-22 2005-01-01 Reflectivity Inc Microelectromechanical device packages with integral heaters
KR100951266B1 (ko) * 2007-12-07 2010-04-02 삼성전기주식회사 세라믹 패키지 밀봉장치

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011146491A (ja) * 2010-01-14 2011-07-28 Nippon Avionics Co Ltd 電子部品の封止装置
JP2013219237A (ja) * 2012-04-10 2013-10-24 Mitsubishi Electric Corp 真空パッケージおよびその製造方法

Also Published As

Publication number Publication date
JP5692453B1 (ja) 2015-04-01
JP2015156468A (ja) 2015-08-27
TW201541564A (zh) 2015-11-01
CN104779184B (zh) 2017-10-31
CN104779184A (zh) 2015-07-15

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