TWI570852B - Packaging equipment and packaging methods - Google Patents
Packaging equipment and packaging methods Download PDFInfo
- Publication number
- TWI570852B TWI570852B TW104100899A TW104100899A TWI570852B TW I570852 B TWI570852 B TW I570852B TW 104100899 A TW104100899 A TW 104100899A TW 104100899 A TW104100899 A TW 104100899A TW I570852 B TWI570852 B TW I570852B
- Authority
- TW
- Taiwan
- Prior art keywords
- packaging
- heating
- package
- container
- upper cover
- Prior art date
Links
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Closing Of Containers (AREA)
- Vacuum Packaging (AREA)
Description
本發明為,封裝設備以及封裝方法相關。 The present invention is related to packaging equipment and packaging methods.
石英晶體諧振器、石英晶體震盪器、表面聲聲波濾波器、LED等等電子元件的領域內,其容器開口部與外蓋接合時,該容器需要進行氣密封裝。如此的氣密封裝,要求使用高氣密性封裝。 In the field of quartz crystal resonators, quartz crystal oscillators, surface acoustic acoustic wave filters, LEDs, and the like, when the container opening is engaged with the outer cover, the container needs to be hermetically sealed. Such a hermetic package requires a high airtight package.
專利文獻1裡說明,此封裝設備使用專用盤面,在此盤面搭載外蓋與容器然後封裝。專利文獻1封裝設備圖3中揭示此盤面內上蓋與容器的搭載狀態。在圖3表示裡,上蓋2上載有熔接材3,其上搭載與之接觸的容器1。此情況下,加熱生產線上因為容器1與上蓋2兩者都直接接觸到熔接材3,所以不得不使用比熔接材3熔點低的溫度進行加熱。因此,在封裝程序下要使容器1與上蓋2熔接,必須使用比加熱程序更高的溫度(也就是說,熔接材熔點以上溫度)。 Patent Document 1 describes that the packaging device uses a dedicated disk surface on which the outer cover and the container are mounted and then packaged. Patent Document 1 Packaging Apparatus FIG. 3 discloses a mounted state of the upper cover and the container in the disk surface. In the case shown in Fig. 3, the upper cover 2 carries a welded material 3 on which the container 1 in contact therewith is mounted. In this case, since both the container 1 and the upper cover 2 are in direct contact with the fusion material 3 on the heating line, heating at a temperature lower than the melting point of the fusion material 3 has to be used. Therefore, in order to weld the container 1 to the upper cover 2 under the packaging process, it is necessary to use a higher temperature than the heating process (that is, the temperature above the melting point of the fusion material).
使用上述程序進行封裝,會產生以下問題。在加熱製造程序中熔接材內未揮發掉的成分以及容器內未揮發掉的成分,會在更高溫的封裝程序中揮發。在高氣密度之下進行密封時,此時發生的揮發性成份是導致氣密度低落的原因。特別是近年來電子部品高性能化以及小型化的進步,對於高氣密度密封的要求更加地高,所以此問題必須要有改善。 Encapsulation using the above procedure will cause the following problems. In the heating manufacturing process, the non-volatile components in the fusion splicing material and the non-volatile components in the container are volatilized in a higher temperature packaging process. When sealing under high gas density, the volatile components that occur at this time are responsible for the low gas density. In particular, in recent years, advances in high-performance and miniaturization of electronic components have become more demanding for high-gas density sealing, so this problem must be improved.
專利文獻2中表示,此電子元件封裝設備使用押壓凸起物貫穿封裝盤上設置的開孔,使上蓋與容器與加熱器接觸。 Patent Document 2 shows that the electronic component packaging apparatus uses a pressing protrusion to penetrate an opening provided in the package tray to bring the upper cover and the container into contact with the heater.
但是上述方法中,加熱程序下的上蓋、封裝材、與容器的狀態是互相接觸的,因此無法解決上面所描述的問題。又,加熱程序中容器與加熱器接觸後,容器會黏著在加熱器上,等封裝程序完成後也無法脫離加熱器,是導致生產線問題的原因。 However, in the above method, the states of the upper cover, the packaging material, and the container under the heating process are in contact with each other, and thus the problems described above cannot be solved. Moreover, after the container is in contact with the heater in the heating process, the container adheres to the heater, and the heater cannot be removed from the heater after the packaging process is completed, which is a cause of the production line problem.
專利文獻3中有記載使用薄膜吸收劑的真空容器。但是此狀況下,使用薄膜吸收劑是為了讓真空度提高。又,加熱的方法是將容器埋在設有加熱器的凹槽中,以此方法進行加熱後,不容易將容器從凹槽部分取出,而容易造成生產上的問題。再加上加熱與封裝必須使用同一加熱器,在加熱生產線與封裝生產線只能進行些微差距的溫度調整,所以無法得到高真空度 Patent Document 3 describes a vacuum container using a film absorbent. However, in this case, a film absorbent is used in order to increase the degree of vacuum. Further, the heating method is to embed the container in a recess provided with a heater. After heating in this way, it is not easy to take out the container from the groove portion, which is liable to cause a problem in production. In addition, the same heater must be used for heating and packaging. The heating line and the packaging line can only be adjusted slightly by temperature, so high vacuum cannot be obtained.
〔專利文獻1〕特開2011-14810號公報 [Patent Document 1] JP-A-2011-14810
〔專利文獻2〕特開2011-146491號公報 [Patent Document 2] JP-A-2011-146491
〔專利文獻3〕特開2013-219237號公報 [Patent Document 3] JP-A-2013-219237
鑒於上述,本發明的目的為提供高效率、高氣密性封裝封裝設備以及運用此設備的封裝方法。 In view of the above, it is an object of the present invention to provide a high efficiency, high airtight package packaging apparatus and a packaging method using the same.
本發明為,收納有電子部品的容器與上蓋進行氣密封裝之電子部品的封裝設備。內有加熱生產線,其後為封裝生產線。準備好上述容器與上述上蓋的定位用封裝盤,在設備中有自動移送此封裝盤底達加熱生產線和封裝生產線。上述所謂定位意即,將此封裝盤上搭載的封裝劑與上蓋之間保有空隙的位置,在封裝生產線中至少在上蓋端(下側)設有施壓用頂針、封裝盤上載置有封裝治具蓋為其特徵之封裝設備。 The present invention relates to a packaging device for an electronic component in which a container containing an electronic component and an upper cover are hermetically sealed. There is a heating line inside, followed by a packaging line. The above-mentioned container and the above-mentioned positioning cover disk for the upper cover are prepared, and the package bottom is automatically transferred to the heating production line and the packaging production line in the device. The above-mentioned positioning means that a position where a gap is left between the encapsulant mounted on the packaged disk and the upper cover, and at least the upper cover end (lower side) of the package production line is provided with a ejector pin for pressure application, and a package plate is placed on the package. A packaged device featuring a cover.
上述封裝盤定位方式,最好是將上蓋定位於底部、容器與上蓋之間的位置仍存有空隙。 Preferably, the package tray is positioned such that the upper cover is positioned at the bottom, and there is still a gap between the container and the upper cover.
加熱生產線以及封裝生產線需要調整溫度的加熱器,最好是在上方與下方兩端皆配置。 Heating the production line and the packaging line require a temperature-adjusting heater, preferably at both the upper and lower ends.
本發明在特徵上來說,是使用上述封裝設備來封裝容器與上蓋之封裝方法。 The present invention is, in character, a method of encapsulating a container and an upper cover using the above-described packaging apparatus.
本發明的封裝設備以及封裝方法是使用簡要的設備,實現加熱生產線中的加熱溫度可高於封裝生產線中的封裝溫度。如此一來可抑制封裝時揮發的成分,以達到高氣密性封裝,加上較少發生生產線問題、也能進行良好的溫度管理。使用此方法可以用較低價格得到比從前更高氣密性的元件,可實現電子元件的小型化以及高性能化。 The packaging apparatus and packaging method of the present invention uses a brief apparatus to achieve a heating temperature in the heating line that is higher than a package temperature in the packaging line. In this way, the components that are volatilized during packaging can be suppressed to achieve a high airtight package, and the production line problem is less likely to occur, and good temperature management can be performed. By using this method, it is possible to obtain a component having a higher airtightness than the former at a lower price, and it is possible to achieve miniaturization and high performance of the electronic component.
1‧‧‧容器 1‧‧‧ container
2‧‧‧上蓋 2‧‧‧Upper cover
3‧‧‧熔接材 3‧‧‧welding materials
4‧‧‧封裝盤 4‧‧‧Package tray
5‧‧‧封裝治具蓋 5‧‧‧Package cover
6、7‧‧‧荷重頂針 6, 7‧‧‧ load thimble
8‧‧‧開孔 8‧‧‧opening
9、10‧‧‧加熱生產線用加熱塊板 9, 10‧‧‧ Heating block for heating production line
11、12‧‧‧封裝生產線用加熱塊板 11, 12‧‧‧ Heating block board for packaging production line
101‧‧‧加熱生產線 101‧‧‧heating production line
102‧‧‧封裝生產線 102‧‧‧Packaging line
103‧‧‧常壓減壓切換室(進入端) 103‧‧‧Atmospheric pressure decompression switching chamber (entry end)
104‧‧‧常壓減壓切換室(排出端) 104‧‧‧Atmospheric pressure decompression switching chamber (discharge end)
105‧‧‧減壓幫浦 105‧‧‧Decompression pump
第1圖係顯示本發明封裝設備一例之意示圖。 Fig. 1 is a view showing an example of a package device of the present invention.
第2圖係顯示本發明封裝設備一例之意示圖。 Fig. 2 is a view showing an example of a package device of the present invention.
第3圖係顯示以往封裝設備一例之意示圖。 Fig. 3 is a view showing an example of a conventional packaging device.
第4圖係顯示本發明封裝設備中使用加熱塊板的加熱狀態示意圖。 Fig. 4 is a view showing a state of heating of a heating block used in the packaging apparatus of the present invention.
第5圖係顯示本發明封裝設備中使用加熱塊板的加熱狀態示意圖。 Fig. 5 is a view showing a state of heating of a heating block used in the packaging apparatus of the present invention.
第6圖係顯示本發明封裝設備概要示意圖。 Figure 6 is a schematic diagram showing the outline of the package device of the present invention.
以下針對本發明進行說明。 The invention will now be described.
本發明的封裝設備,在加熱生產線中上蓋與容器維持在沒有接觸的狀態下。因此在加熱生產線中,熔接材就算完全融解也不會使其閉塞。所以在加熱生產線中,加熱溫度可提高到融接材融點以上溫度。 In the packaging apparatus of the present invention, the upper cover and the container are maintained in a state of no contact in the heating line. Therefore, in the heating line, the welded material does not occlude even if it is completely melted. Therefore, in the heating line, the heating temperature can be raised to a temperature above the melting point of the fusion material.
因此,加熱生產線的溫度設定可高於封裝生產線的溫度。依此,可抑制封裝生產線中揮發性物質的產生,以達到高氣密性的電子元件。 Therefore, the temperature setting of the heating line can be higher than the temperature of the packaging line. Accordingly, the generation of volatile substances in the packaging line can be suppressed to achieve high airtight electronic components.
封裝盤收納有定位狀態下的上蓋與容器,在生產線中移動,其上頭載置有封裝治具蓋。也就是說,封裝盤上設置的凹槽內收納好上蓋與容器,為了蓋住此凹槽所以載置有封裝治具蓋的狀態下行進封裝。本發明的封裝設備在封裝時使用荷重頂針由下而上的方向施加力量。此時,加熱器直接與容器接觸後,會發生容器附著在加熱器上的問題。而本封裝設備使用生產線將封裝盤連同上蓋與容器搬送到下個程序,所以當一部分的容器附著到加熱器等封裝設備本體的話,會導致無法搬送到下個程序。而為了排除問題必須要停止生產線並降溫,造成製造效率大幅低下。 The package tray houses the upper cover and the container in a positioned state, and moves in the production line, and the package jig cover is placed on the top. That is to say, the upper cover and the container are housed in the recess provided in the package tray, and the package is carried in a state in which the package jig cover is placed in order to cover the recess. The packaged device of the present invention uses a load ejector pin to apply force from the bottom up direction during packaging. At this time, when the heater is directly in contact with the container, there is a problem that the container adheres to the heater. The packaging device uses the production line to carry the package tray together with the upper cover and the container to the next program. Therefore, when a part of the container is attached to the package device body such as a heater, the package cannot be transferred to the next program. In order to eliminate the problem, it is necessary to stop the production line and cool down, resulting in a significant reduction in manufacturing efficiency.
本發明中,封裝盤上加上封裝治具蓋準備妥當的話,容器除了荷重頂針與封裝治具蓋之外不會接觸到其他部分。所以不會有發生上述問題的優點。 In the present invention, if the package jig cover is properly prepared on the package tray, the container does not contact other parts except the load thimble and the package jig cover. So there is no advantage of the above problems.
另外,本發明相關的加熱程序與封裝程序中在上下兩方皆設計有加熱器,使用此加熱器夾住加溫。本發明如上述所示最好要能控制加熱溫度,依此,使用上下兩方的加熱器夾緊,可進行設定溫度無偏差之高精度加溫。 Further, in the heating program and the packaging program according to the present invention, heaters are designed on both the upper and lower sides, and the heater is used to sandwich the heating. As described above, the present invention preferably controls the heating temperature, and accordingly, the upper and lower heaters are used for clamping, and the high-precision heating without setting the temperature can be performed.
本發明具體之狀態一例如同圖1的示意圖所示。如圖1的加熱程序10a中,上蓋2上的熔接材3與容器1的配置為無互相接觸的狀態。在此狀態下進行加熱後,熔接材3就算熔融也不會與容器1互相接觸。接下來進 行封止程序10a的部分,使用兩支荷重頂針在6與7的地方從兩端夾緊加壓來使容器1和上蓋2與之黏接熔合。 An example of a specific state of the present invention is shown in the schematic view of FIG. In the heating program 10a of Fig. 1, the welded material 3 on the upper cover 2 and the container 1 are disposed in a state of no contact with each other. After the heating in this state, the welded material 3 does not come into contact with the container 1 even if it is melted. Next In the portion of the line sealing process 10a, the two load thimbles are used to clamp and press the pressure from both ends at positions 6 and 7, so that the container 1 and the upper cover 2 are adhesively bonded thereto.
又,如圖1所示封裝盤4以及封裝治具蓋5上設計有荷重頂針6、7可通過的開孔。此開孔尺寸要可讓荷重頂針7、8通過,但無法讓容器和上蓋通過為佳。 Further, as shown in FIG. 1, the package tray 4 and the package jig cover 5 are provided with openings through which the load pins 6 and 7 can pass. This opening is sized to allow the load pins 7, 8 to pass, but the container and the top cover cannot be passed.
圖2則是與圖1方法相異,本發明具體狀態之一例。圖2的封止程序20b中,從上蓋2那一側由荷重頂針6加諸力量使之推附到封裝治具蓋5上的加壓方法。依此方法來使容器1與上蓋2黏接熔合。 Fig. 2 is an example of a specific state of the present invention which is different from the method of Fig. 1. In the sealing program 20b of Fig. 2, a pressing method is applied from the side of the upper cover 2 by the load thimble 6 to push it onto the package jig cover 5. In this way, the container 1 is bonded and fused to the upper cover 2.
如圖2狀態,與圖1相同,封裝盤4底部最好要有荷重頂針6可通過的開孔。加上如圖2所示封裝治具蓋5上也最好有荷重頂針6可通過的開孔。又,圖2中的封裝治具蓋5上設有開孔,但此時開孔尺寸要無法讓容器與上蓋通過。 As in the state of Fig. 2, as in Fig. 1, the bottom of the package tray 4 preferably has an opening through which the load thimble 6 can pass. It is also preferable to have an opening through which the load thimble 6 can pass, as shown in Fig. 2. Moreover, the package jig cover 5 of Fig. 2 is provided with an opening, but at this time, the opening size is such that the container and the upper cover cannot pass.
如圖1、2所示狀態,加上加熱用的加熱塊板9、10、11、12在圖4與圖5有表示。圖4對應圖1的狀態、圖5對應圖2的狀態。 As shown in Figs. 1 and 2, the heating block plates 9, 10, 11, and 12 for heating are shown in Figs. 4 and 5. 4 corresponds to the state of FIG. 1, and FIG. 5 corresponds to the state of FIG.
如圖4、5所表示,本發明中的加熱生產線101與封裝生產線102各有個別的加熱塊板,封裝盤4和封裝治具蓋5以及搭載在其內的容器1、上蓋2一同由加熱程序101移動到封裝程序102。 As shown in FIGS. 4 and 5, the heating line 101 and the packaging line 102 of the present invention each have an individual heating block, and the package tray 4 and the package jig cover 5 and the container 1 and the upper cover 2 mounted therein are heated together. The program 101 moves to the packager 102.
如圖4、5的狀態,荷重頂針6、7是設置在封裝生產線102中用來加熱的加熱塊板11、12上上的突起物。如此可依設定溫度加熱荷重頂針,優點為封裝生產線中可容易進行設定溫度的溫控管理。 In the state of Figures 4 and 5, the load pins 6, 7 are projections disposed on the heating block plates 11, 12 for heating in the package line 102. In this way, the load thimble can be heated according to the set temperature, and the advantage is that the temperature control of the set temperature can be easily performed in the package production line.
加上如圖4、5的狀態所示,上下部雙方設有加熱塊板,從上下方向夾住般的加熱為優。關於本發明,在加熱生產線與封裝生產線中需要個別進行溫度管理。特別是封裝生產線,必須在短時間內有效率地將溫度降低低於加熱生產線的溫度。如上所述,上下部兩方設置加熱塊板,由 上下夾著加熱的方式,可在短時間到達設定溫度,如此更可將上述本發明的效果更好。 As shown in the state of Figs. 4 and 5, the heating plate is provided on both the upper and lower sides, and the heating is preferably performed from the vertical direction. With regard to the present invention, individual temperature management is required in the heating line and the packaging line. In particular, the packaging line must efficiently lower the temperature below the temperature of the heating line in a short time. As described above, the upper and lower sides are provided with heating block plates, The heating can be applied to the upper and lower sides to reach the set temperature in a short time, so that the above-described effects of the present invention can be further improved.
關於本發明的封裝設備,使用有定位效果的封裝盤是重點。意即在該當定位時,搭載於封裝盤近底部的上蓋相對來說,容器必須要固定在觸碰不到上蓋上熔接材的位置。像這樣封裝盤的形狀,就如同圖1中表示的封裝盤4一樣,底部與中央部的斷面面積以及/或是形狀是不同的,所需形狀是要將上蓋2裝載在底部、容器1則裝載在中央部中呈現懸浮的狀態。 Regarding the packaging device of the present invention, it is important to use a packaged disk having a positioning effect. That is to say, when positioning, the upper cover mounted on the bottom of the package tray is relatively fixed, and the container must be fixed at a position where the welding material is not touched on the upper cover. The shape of the packaged disk like this is the same as the packaged disk 4 shown in FIG. 1, the cross-sectional area and/or the shape of the bottom portion and the central portion are different, and the desired shape is to load the upper cover 2 at the bottom, the container 1 Then the loading is in a state of being suspended in the central portion.
上面所述封裝盤,是板狀物的表面上有複數個凹孔部。即是一片封裝板上有多數個圖1、2所表示的凹孔部,使用此封裝盤的話,一片封裝盤可同時進行多數個封裝。上述此封裝盤無特別限定材質,金屬製或是陶瓷製等等皆可,但以金屬製為佳。 The package tray described above has a plurality of recessed holes on the surface of the plate. That is, there are a plurality of recessed holes shown in FIGS. 1 and 2 on one package board. When the packaged disk is used, one package can be packaged at the same time. The above-mentioned packaged disc is not particularly limited in material, and may be made of metal or ceramic, but is preferably made of metal.
本發明的封裝設備概要如圖6所表示。本發明的封裝設備,具備加熱生產線101以及封裝生產線102。如圖1、2所表示,上蓋2、熔接材3、容器1依順序排列狀態放置於封裝盤4,並將其導入設備內。接著使用搬送方法(無圖示)將封裝盤在設備內移動,依序通過加熱生產線101→封裝生產線102,在各個生產線內進行必要的處理來完成封裝處理。 An outline of the packaged device of the present invention is shown in FIG. The packaging apparatus of the present invention is provided with a heating production line 101 and a packaging production line 102. As shown in Figs. 1 and 2, the upper cover 2, the welded material 3, and the container 1 are placed in the packaged state in a sequential arrangement and introduced into the apparatus. Next, the package tray is moved inside the apparatus by a transfer method (not shown), and the package line is sequentially passed through the heating production line 101 → the package production line 102, and necessary processing is performed in each production line to complete the packaging process.
如上所述,封裝盤4之上載有封裝治具蓋5。該封裝治具蓋5的尺寸略同於封裝盤4,當置於封裝盤4上時,要以幾乎全面覆蓋者為佳。此封裝治具上蓋5與封裝盤4之間,為了不讓輕微的震動或是少許荷重導致從封裝盤上脫離,在其中一邊開孔,另一邊則裝上定位銷,利用關孔與定位銷卡住固定。孔洞要開在封裝盤或是蓋板上皆可,並無特別限制。 As described above, the package tray 4 carries the package jig cover 5. The package jig cover 5 is slightly the same size as the package tray 4, and when placed on the package tray 4, it is preferable to cover it almost completely. Between the cover 5 and the package tray 4, the package is detached from the package tray in order to prevent slight vibration or a little load, and one side is opened, and the other side is provided with a positioning pin, and the contact hole and the positioning pin are used. Stuck and fix. The hole is to be opened on the package plate or the cover plate, and is not particularly limited.
上文記載封裝治具蓋5,其材質無規定。但需要能滿足加熱條件的耐熱性素材。舉例來說有陶瓷、碳素、鈦、其他金屬等等。 The package jig cover 5 is described above, and its material is not specified. However, a heat resistant material that satisfies the heating conditions is required. For example, there are ceramics, carbon, titanium, other metals, and the like.
關於本發明封裝設備的加熱生產線101,舉個具體的例子,如同圖1的10a、圖2的20a所呈現的狀態下進行處理;關於封裝生產線102的話如圖1的10b、圖2的20b所呈現的狀態下進行處理。 Regarding the heating production line 101 of the packaging apparatus of the present invention, as a specific example, processing is performed in a state as shown in 10a of FIG. 1 and 20a of FIG. 2; as for the packaging production line 102, 10b of FIG. 1 and 20b of FIG. 2 are shown. Processing is performed in the rendered state.
加熱生產線101同時具備加熱功能與減壓功能為佳。也就是說加熱生產線101的構造,是在減壓狀態下進行加熱,使揮發性能提高。這時用高於熔接材融點溫度進行加熱,加熱生產線下將熔接材融化為優。 It is preferable that the heating line 101 has both a heating function and a pressure reducing function. That is, the structure of the heating line 101 is heated under reduced pressure to increase the volatility. At this time, heating is performed at a temperature higher than the melting point of the fusion material, and the welding material is melted under the heating line to be excellent.
加熱生產線101相關的減壓方法並無特別限制,只要可以將壓力減壓到5帕斯卡(5Pa)以下,一般常見的減壓幫浦等等皆可使用。 The pressure reduction method associated with the heating line 101 is not particularly limited as long as the pressure can be reduced to 5 Pascal (5 Pa) or less, and a common decompression pump or the like can be used.
加熱生產線101相關的加熱溫度並無特別限制,可依所使用的熔接材來設定適當的溫度。原則上,加熱溫度最好高於所使用熔接材的熔點。最為一般的熔接材為金錫合金(AuSn合金),此時的溫度設定以攝氏280度為佳。 The heating temperature associated with the heating line 101 is not particularly limited, and an appropriate temperature can be set depending on the welding material to be used. In principle, the heating temperature is preferably higher than the melting point of the welded material used. The most common fusion material is gold-tin alloy (AuSn alloy), and the temperature setting at this time is preferably 280 degrees Celsius.
封裝生產線102具備有加熱功能、減壓功能以及加壓功能。也就是說,經過加熱生產線後熔接材呈現熔融狀態,以此狀態下使上蓋與容器進行氣密性接合。加熱功能中的加熱溫度並沒有特別限制,但最好將溫度設定為低於前加熱生產線溫度。如此一來可抑制成分揮發的發生。另外,原則上溫度要比所使用的熔接材熔點溫度較低為佳。以熔接材金錫合金(AuSn合金)的來看,溫度設定在攝氏280度以下較優。 The package production line 102 is provided with a heating function, a pressure reducing function, and a pressurizing function. That is to say, after the heating line is passed, the welded material is in a molten state, and in this state, the upper cover and the container are hermetically joined. The heating temperature in the heating function is not particularly limited, but it is preferable to set the temperature to be lower than the temperature of the front heating line. In this way, the occurrence of volatilization of the components can be suppressed. In addition, in principle, the temperature is preferably lower than the melting point temperature of the welded material used. In the case of a welded gold-tin alloy (AuSn alloy), the temperature is preferably set at 280 degrees Celsius or less.
關於封裝生產線102的減壓功能,可以與上述加熱生產線101使用相同手段。另外,上述封裝生產線102中的空間與上述加熱生產線101中的空間可相連接,如此便可雙方同時進行減壓作業。 Regarding the pressure reducing function of the packaging line 102, the same means as the heating line 101 described above can be used. Further, the space in the package production line 102 can be connected to the space in the heating line 101, so that both sides can perform the decompression operation at the same time.
關於封裝生產線102,使用上述提到的施加壓力的方式(圖1、圖2中荷重頂針7、8所表示)在上蓋2與容器1上施加壓力使其密合。該施加壓力的方法並無特別規定,以普遍的加壓方法進行即可。但是如同圖 110b所表示的狀態下進行施壓的話,只針對容器1這端進行加壓也無法成功壓合。也就是說因為封裝盤4的形狀因素,如果只對容器1這端進行加壓,會無法讓容器1與上蓋2導向正確接合的位置。又若只對上蓋2這端進行加壓,不論是上蓋2、熔接材3以及容器1不能依序互相接觸之外,更無法在他們之間施予壓力。 Regarding the package production line 102, pressure is applied to the upper cover 2 and the container 1 to adhere thereto by means of the above-mentioned pressure application (indicated by the load thimbles 7, 8 in Figs. 1 and 2). The method of applying the pressure is not particularly limited, and it may be carried out by a general pressurization method. But like a picture When the pressure is applied in the state indicated by 110b, the pressure is not applied to the end of the container 1 alone. That is to say, because of the shape factor of the package tray 4, if only the end of the container 1 is pressurized, the container 1 and the upper cover 2 cannot be guided to the position where they are properly engaged. Further, if only the end of the upper cover 2 is pressurized, the upper cover 2, the welded material 3, and the container 1 cannot be brought into contact with each other in order, and it is impossible to apply pressure therebetween.
進行施加壓力時,至少要從上蓋2這一端(下側)來加壓(也就是說需要設備配置有從上蓋端加壓的荷重頂針,更具體來說就是在容器這一端也設置荷重頂針的方法(圖1),或是推壓到容器這一面有封裝治具蓋板上的方式來進行荷重加壓(圖2)等等的方法。 When applying pressure, at least the end (lower side) of the upper cover 2 is pressurized (that is, the device is required to be provided with a load thimble that is pressurized from the upper cover end, and more specifically, a load thimble is also provided at the end of the container. The method (Fig. 1), or the method of pushing the pressure on the side of the container with the cover of the package fixture (Fig. 2), etc.
另,荷重頂針如同上述圖4、5所表示,可以是加熱方法的一部分、也可以與加熱方法分開獨立出來、也可以不具加熱機能,單純只在進行封裝時施加荷重的荷重頂針。 Further, the load thimble may be a part of the heating method, or may be separate from the heating method, or may have no heating function, and may only apply a load thimble when the package is performed, as shown in Figs. 4 and 5 above.
此處施加壓力的條件並無特別規定,但依容器的大小不同施加壓力的條件最好也跟著變更。例如長寬2公厘左右的容器可以使用100公克/平方公分的力量做為加壓條件來進行封裝。 The conditions for applying pressure here are not particularly limited, but the conditions for applying pressure depending on the size of the container are preferably changed. For example, a container having a length of about 2 mm can be packaged under pressure using a force of 100 g/cm 2 .
關於本發明封裝設備,為了達成上述目的可以配置有其他構成機構。例如,要將封裝盤導入加熱生產線的時候、或是從封裝生產線中取出封裝盤的時候;需要從大氣壓環境導入到低壓環境又或是從低氣壓環境到大氣壓環境,針對此需求會根據狀況來配置對應(如圖1中、103、104)。 Regarding the packaging device of the present invention, other constituent mechanisms may be disposed in order to achieve the above object. For example, when the package tray is introduced into the heating line or when the package tray is taken out from the packaging line; it needs to be introduced from the atmospheric pressure environment to the low pressure environment or from the low pressure environment to the atmospheric pressure environment, depending on the situation. Configuration corresponds (as in Figure 1, 103, 104).
本發明的封裝設備,要求加熱生產線以及封裝生產線各個溫度誤差越小越好。本設備溫度誤差控制在正負攝氏2.5度以下。 The packaging device of the present invention requires that the temperature error of the heating production line and the packaging production line be as small as possible. The temperature error of this equipment is controlled to be less than or minus 2.5 degrees Celsius.
本發明中,相對來說加熱時間要較長,要比封裝時間來得長為佳。也就是,比較起來長時間進行加熱可使熔接材充分熔融,使揮發成 份充分去除後再進行封裝較優。進一步來說,封裝加壓時間反而要較短為優。加熱生產線中充分讓融接材溶融後,以短時間進行加壓封裝生產線。 In the present invention, the heating time is relatively long, and it is preferable to be longer than the packaging time. That is, by comparing the heating for a long time, the fusion splicing material can be fully melted and volatilized into After the parts are fully removed, the package is better. Further, the package pressurization time is rather shorter. After the fusion material is sufficiently melted in the heating production line, the pressure packaging production line is performed in a short time.
更具體說明的話,生產線設定加熱時間3分鐘~20分鐘、封裝時間10秒~5分鐘為優。 More specifically, the production line is set to a heating time of 3 minutes to 20 minutes, and a packaging time of 10 seconds to 5 minutes is preferred.
如此一來可確保加熱時間,加上為了在加熱生產線內要將溫度或是減壓度要維持整體平均,最好設置複數個加熱生產線。也就是說,加熱生產線的處理時間要長、封裝生產線的處理時間要短的關係,加熱生產線越長的話在製造效率上則變得更佳。這樣的情況下比起大容積的加熱生產線,將加熱生產線複數化的話,封裝設備的製造成本等、以及加熱生產線在整體上較可容易地均勻減壓和加壓。 In this way, the heating time can be ensured, and in order to maintain the overall average temperature or pressure reduction in the heating line, it is preferable to provide a plurality of heating lines. That is to say, the processing time of the heating line is long, and the processing time of the packaging line is short, and the longer the heating line is, the better the manufacturing efficiency is. In such a case, if the heating line is pluralized compared to the heating line of a large volume, the manufacturing cost of the packaging apparatus, and the like, and the heating line can be easily uniformly decompressed and pressurized as a whole.
本發明之封裝設備,在封裝生產線後是可以備有冷卻生產線。也就是說,當進行完減壓加熱封裝後在減壓的狀態下持續進行冷卻後再取出,以此順序是較優。如此,在減壓狀態下進行冷卻的話,當正常氣壓下取出封裝盤時,已降溫到接近室溫的狀態。以此冷卻方法則不會發生封裝盤在常溫狀態下氧化(變色)。 The packaging device of the present invention can be provided with a cooling production line after the packaging production line. That is to say, when the package is cooled under reduced pressure and then cooled and then taken out under reduced pressure, the order is superior. As described above, when cooling is performed under reduced pressure, when the package tray is taken out under normal air pressure, it is cooled to a state close to room temperature. With this cooling method, the packaged disk does not oxidize (discolor) at a normal temperature.
本發明,在特徵上來說是使用上述封裝設備封裝容器與上蓋之封裝方法。 The present invention is characterized by a packaging method for packaging a container and an upper cover using the above-described packaging device.
本發明如上項目所述,使用目的為石英晶體諧振器、石英晶體震盪器、表面聲聲波濾波器、LED等電子元的容器與上蓋的封裝。 According to the present invention, as described in the above item, a container and an upper cover for an electronic component such as a quartz crystal resonator, a quartz crystal oscillator, a surface acoustic acoustic wave filter, and an LED are used.
Claims (4)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014004098 | 2014-01-14 | ||
JP2014184731A JP5692453B1 (en) | 2014-01-14 | 2014-09-11 | Sealing apparatus and sealing method |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201541564A TW201541564A (en) | 2015-11-01 |
TWI570852B true TWI570852B (en) | 2017-02-11 |
Family
ID=52830785
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104100899A TWI570852B (en) | 2014-01-14 | 2015-01-12 | Packaging equipment and packaging methods |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5692453B1 (en) |
CN (1) | CN104779184B (en) |
TW (1) | TWI570852B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6987376B2 (en) * | 2017-03-09 | 2021-12-22 | 株式会社昭和真空 | Sealing mechanism |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011146491A (en) * | 2010-01-14 | 2011-07-28 | Nippon Avionics Co Ltd | Sealing device for electronic component |
JP2013219237A (en) * | 2012-04-10 | 2013-10-24 | Mitsubishi Electric Corp | Vacuum package and manufacturing method of the same |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2540942B2 (en) * | 1989-05-23 | 1996-10-09 | 三菱電機株式会社 | Hybrid integrated circuit packaging method. |
JPH04107955A (en) * | 1990-08-28 | 1992-04-09 | Matsushita Electric Ind Co Ltd | Sealing method of electronic circuit element |
JP2933403B2 (en) * | 1991-03-15 | 1999-08-16 | 株式会社日立製作所 | Semiconductor package hermetic sealing method and semiconductor package hermetic sealing device |
JPH11214551A (en) * | 1998-01-21 | 1999-08-06 | Toyo Commun Equip Co Ltd | Device and method for sealing package of electronic part |
JP2002176116A (en) * | 2000-12-05 | 2002-06-21 | Daishinku Corp | Air-tight sealing method of package for electronic component |
JP3941598B2 (en) * | 2002-06-10 | 2007-07-04 | 株式会社村田製作所 | Method for manufacturing piezoelectric component |
TW200500206A (en) * | 2003-05-22 | 2005-01-01 | Reflectivity Inc | Microelectromechanical device packages with integral heaters |
KR100951266B1 (en) * | 2007-12-07 | 2010-04-02 | 삼성전기주식회사 | Apparatus for Sealing Ceramic Package |
-
2014
- 2014-09-11 JP JP2014184731A patent/JP5692453B1/en active Active
-
2015
- 2015-01-12 TW TW104100899A patent/TWI570852B/en active
- 2015-01-14 CN CN201510017601.8A patent/CN104779184B/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011146491A (en) * | 2010-01-14 | 2011-07-28 | Nippon Avionics Co Ltd | Sealing device for electronic component |
JP2013219237A (en) * | 2012-04-10 | 2013-10-24 | Mitsubishi Electric Corp | Vacuum package and manufacturing method of the same |
Also Published As
Publication number | Publication date |
---|---|
JP2015156468A (en) | 2015-08-27 |
CN104779184B (en) | 2017-10-31 |
TW201541564A (en) | 2015-11-01 |
CN104779184A (en) | 2015-07-15 |
JP5692453B1 (en) | 2015-04-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CA1081411A (en) | Method for hermetically sealing an electronic circuit package | |
WO2017076361A1 (en) | Smd quartz crystal resonator and complete board package machining process therefor | |
TWI495019B (en) | Room temperature bonding apparatus and room temperature bonding method | |
JP2010179507A (en) | Compression molding method | |
JP2014143304A (en) | Thermal bonding device and method of manufacturing thermally bonded product | |
JPS61276237A (en) | Method for airtight sealing of semiconductor package and unit therefor | |
TWI570852B (en) | Packaging equipment and packaging methods | |
JP5064142B2 (en) | Method for manufacturing piezoelectric device | |
JP6175592B1 (en) | Resin sealing device and resin sealing method | |
JP5196677B2 (en) | Electronic component sealing device | |
JP5764629B2 (en) | Manufacturing method of sheet resin | |
US3683146A (en) | Methods for assembling solid state devices | |
JP4483514B2 (en) | Manufacturing method and manufacturing apparatus for electronic component with metal case | |
FR2534108A1 (en) | Improved method and device for hermetic sealing. | |
JP4397339B2 (en) | Electronic component package manufacturing method and manufacturing apparatus | |
JP2015186810A (en) | Solder joint method, production method of ld module and solder joint device | |
JP5700318B1 (en) | Sealing device and sealing / cooling method | |
US20040144835A1 (en) | System and method for seal formation | |
JP4311873B2 (en) | Heating and pressurizing device and pressurizing pressure equalizing member | |
JPH11121484A (en) | Semiconductor device, and method and device for its manufacture | |
JP2005305951A (en) | Method for sealing molded object with resin | |
JP2019193013A (en) | Manufacturing method and manufacturing apparatus of electronic component | |
US20040099715A1 (en) | System and method for seal formation | |
JP2901403B2 (en) | Package sealing device for electronic component storage and sealing method | |
JPH02108314A (en) | Airtight sealing method for small piezoelectric vibrator |