TW201541564A - Packaging equipment and packaging method - Google Patents

Abstract

Provided are a packaging equipment capable of carrying out excellent efficient airtight packaging and a packaging method using the packaging equipment. A receptacle receiving an electronic element and an upper lid together constitute the electronic element packaging equipment for carrying out the airtight packaging, the packaging method comprising a heating procedure followed by a packaging procedure. A packaging board carrying the aforementioned receptacle and upper lid and having a positioning function is prepared, the packaging board is conveyed and moved between the heating procedure and the packaging procedure. The aforementioned positioning function of the packaging board is that a gap is formed between a packaging agent of the packaging surface of the upper lid and the receptacle carried on the packaging board. The packaging equipment is characterized in that the packaging procedure, at least one end side of the upper lid has a loading thimble and a packaging tray carries a packaging tool cover.

Description

Packaging equipment and packaging method

The invention relates to packaging equipment and packaging methods.

In the field of quartz crystal resonators, quartz crystal oscillators, surface acoustic acoustic wave filters, LEDs, and the like, when the container opening is engaged with the outer cover, the container needs to be hermetically sealed. Such a hermetic package requires a high airtight package.

Patent Document 1 describes that the packaging device uses a dedicated disk surface on which the outer cover and the container are mounted and then packaged. Patent Document 1 Packaging Apparatus FIG. 3 discloses a mounted state of the upper cover and the container in the disk surface. In the case shown in Fig. 3, the upper cover 2 carries a welded material 3 on which the container 1 in contact therewith is mounted. In this case, since both the container 1 and the upper cover 2 are in direct contact with the fusion material 3 in the heating process, it is necessary to perform heating at a temperature lower than the melting point of the fusion material 3. Therefore, in order to weld the container 1 to the upper cover 2 under the packaging process, it is necessary to use a higher temperature than the heating process (that is, the temperature above the melting point of the fusion material).

Encapsulation using the above procedure will cause the following problems. In the heating manufacturing process, the non-volatile components in the fusion splicing material and the non-volatile components in the container are volatilized in a higher temperature packaging process. When sealing under high gas density, the volatile components that occur at this time are responsible for the low gas density. In particular, in recent years, advances in high-performance and miniaturization of electronic components have become more demanding for high-gas density sealing, so this problem must be improved.

Patent Document 2 shows that the electronic component packaging apparatus uses a pressing protrusion to penetrate an opening provided in the package tray to bring the upper cover and the container into contact with the heater.

However, in the above method, the states of the upper cover, the packaging material, and the container under the heating process are in contact with each other, and thus the problems described above cannot be solved. Moreover, after the container is in contact with the heater in the heating process, the container adheres to the heater, and after the completion of the packaging process, the heater cannot be separated from the heater, which is a cause of production problems.

Patent Document 3 describes a vacuum container using a film absorbent. However, in this case, a film absorbent is used in order to increase the degree of vacuum. Further, the heating method is to embed the container in a recess provided with a heater. After heating in this way, it is not easy to take out the container from the groove portion, which is liable to cause a problem in production. In addition, the same heater must be used for heating and packaging. The heating program and the packaging program can only be slightly adjusted in temperature, so high vacuum cannot be obtained.

[Patent Document 1] JP-A-2011-146237 (Patent Document 3) JP-A-2013-146237

[Problems to be solved by the present invention]

In view of the above, it is an object of the present invention to provide a high efficiency, high airtight package packaging apparatus and a packaging method using the same. [Technical means to solve the problem]

The present invention relates to a packaging device for an electronic component in which a container containing an electronic component and an upper cover are hermetically sealed. There is a heating program inside, followed by a packaging program. The above-mentioned container and the positioning packaging tray for the above upper cover are prepared, and the heating process and the packaging program are automatically transferred in the device. The above-mentioned positioning means that a position where a gap is left between the encapsulant mounted on the packaged disk and the upper cover, and at least the upper end (lower side) of the package is provided with a ejector pin for pressure application, and a packaged disk is placed on the package. A packaged device featuring a cover.

Preferably, the package tray is positioned such that the upper cover is positioned at the bottom, and there is still a gap between the container and the upper cover.

The heating program and the package program require a temperature-adjusting heater, preferably at both the upper and lower ends.

The present invention is, in character, a method of encapsulating a container and an upper cover using the above-described packaging apparatus. [Compared to the efficacy of prior art]

The packaging apparatus and packaging method of the present invention uses a brief apparatus in which the heating temperature in the heating process can be higher than the sealing temperature in the sealing process. In this way, the volatilized components during packaging can be suppressed to achieve a high airtight package, and with less production problems, good temperature management can be performed. By using this method, it is possible to obtain a component having a higher airtightness than the former at a lower price, and it is possible to achieve miniaturization and high performance of the electronic component.

The invention will now be described.

In the packaging apparatus of the present invention, the upper cover and the container are maintained in a state of no contact during the heating process. Therefore, in the heating process, the fusion material does not occlude even if it is completely melted. Therefore, in the heating process, the heating temperature can be raised to a temperature above the melting point of the fusion material.

Therefore, the temperature setting of the heating program can be higher than the sealing program temperature. Accordingly, the generation of volatile substances in the sealing process can be suppressed to achieve high airtight electronic components.

The package tray houses the upper cover and the container in a positioned state, and moves in the production line, and the package jig cover is placed on the top. That is to say, the upper cover and the container are housed in the recess provided in the package tray, and the package is carried in a state in which the package jig cover is placed in order to cover the recess. The packaged device of the present invention uses a load ejector pin to apply force from the bottom up direction during packaging. At this time, when the heater is directly in contact with the container, there is a problem that the container adheres to the heater. The packaging device uses the production line to carry the package tray together with the upper cover and the container to the next program. Therefore, when a part of the container is attached to the package device body such as a heater, the package cannot be transferred to the next program. In order to eliminate the problem, it is necessary to stop production and cool down, resulting in a drastically low manufacturing efficiency.

In the present invention, if the package jig cover is properly prepared on the package tray, the container does not contact other parts except the load thimble and the package jig cover. So there is no advantage of the above problems.

Further, in the heating program and the packaging program according to the present invention, heaters are designed on both the upper and lower sides, and the heater is used to sandwich the heating. As described above, the present invention preferably controls the heating temperature, and accordingly, the upper and lower heaters are used for clamping, and the high-precision heating without setting the temperature can be performed.

An example of a specific state of the present invention is shown in the schematic view of FIG. In the heating program 10a of Fig. 1, the welded material 3 on the upper cover 2 and the container 1 are disposed in a state of no contact with each other. After the heating in this state, the welded material 3 does not come into contact with the container 1 even if it is melted. Next, the portion of the sealing procedure 10a is carried out, and the container 1 and the upper cover 2 are bonded and fused by clamping and pressurizing from both ends at positions 6 and 7 using two load thimbles.

Further, as shown in FIG. 1, the package tray 4 and the package jig cover 5 are provided with openings through which the load pins 6 and 7 can pass. This opening is sized to allow the load pins 7, 8 to pass, but the container and the top cover cannot be passed.

Fig. 2 is an example of a specific state of the present invention which is different from the method of Fig. 1. In the sealing program 20b of Fig. 2, a pressing method is applied from the side of the upper cover 2 by the load thimble 6 to push it onto the package jig cover 5. In this way, the container 1 is bonded and fused to the upper cover 2.

As in the state of Fig. 2, as in Fig. 1, the bottom of the package tray 4 preferably has an opening through which the load thimble 6 can pass. It is also preferable to have an opening through which the load thimble 6 can pass, as shown in Fig. 2. Moreover, the package jig cover 5 of Fig. 2 is provided with an opening, but at this time, the opening size is such that the container and the upper cover cannot pass.

As shown in Figs. 1 and 2, the heating block plates 9, 10, 11, and 12 for heating are shown in Figs. 4 and 5. 4 corresponds to the state of FIG. 1, and FIG. 5 corresponds to the state of FIG.

As shown in FIGS. 4 and 5, the heating program 101 and the package program 102 of the present invention each have an individual heating block, and the package tray 4 and the package jig cover 5 and the container 1 and the upper cover 2 mounted therein are heated together. The program 101 moves to the packager 102.

In the state of Figures 4 and 5, the load pins 6, 7 are projections provided on the heating block plates 11, 12 for heating in the package program 102. In this way, the load thimble can be heated according to the set temperature, and the advantage is that the temperature control of the set temperature can be easily performed in the packaging process.

As shown in the state of Figs. 4 and 5, the heating plate is provided on both the upper and lower sides, and the heating is preferably performed from the vertical direction. With regard to the present invention, temperature management needs to be performed individually in the heating process and the packaging process. In particular, the packaging process must efficiently lower the temperature below the heating program temperature in a short period of time. As described above, the upper and lower sides are provided with the heating block plates, and the heating temperature can be applied to the set temperature in a short time, so that the above-described effects of the present invention can be further improved.

Regarding the packaging device of the present invention, it is important to use a packaged disk having a positioning effect. That is to say, when positioning, the upper cover mounted on the bottom of the package tray is relatively fixed, and the container must be fixed at a position where the welding material is not touched on the upper cover. The shape of the packaged disk like this is the same as the packaged disk 4 shown in FIG. 1, the cross-sectional area and/or the shape of the bottom portion and the central portion are different, and the desired shape is to load the upper cover 2 at the bottom, the container 1 Then the loading is in a state of being suspended in the central portion.

The package tray described above has a plurality of recessed holes on the surface of the plate. That is, there are a plurality of recessed holes shown in FIGS. 1 and 2 on one package board. When the packaged disk is used, one package can be packaged at the same time. The above-mentioned packaged disc is not particularly limited in material, and may be made of metal or ceramic, but is preferably made of metal.

An outline of the packaged device of the present invention is shown in FIG. The packaging device of the present invention is provided with a heating process 101 and a packaging process 102. As shown in Figs. 1 and 2, the upper cover 2, the welded material 3, and the container 1 are placed in the packaged state in a sequential arrangement and introduced into the apparatus. Then, the package tray is moved in the apparatus by a transport method (not shown), and the package process is completed by performing the necessary processing in each process by sequentially heating the process 101 → the package process 102.

As described above, the package tray 4 carries the package jig cover 5. The package jig cover 5 is slightly the same size as the package tray 4, and when placed on the package tray 4, it is preferable to cover it almost completely. Between the cover 5 and the package tray 4 of the package fixture, in order to prevent slight vibration or a little load from being detached from the package tray, one side is opened, and the other side is provided with a positioning pin, and the opening and the positioning pin are used. Stuck and fix. The hole is to be opened on the package plate or the cover plate, and is not particularly limited.

The package jig cover 5 is described above, and its material is not specified. However, a heat resistant material that satisfies the heating conditions is required. For example, there are ceramics, carbon, titanium, other metals, and the like.

Regarding the heating process 101 of the packaging apparatus of the present invention, a specific example is performed in the state shown in 10a of FIG. 1 and 20a of FIG. 2; as for the packaging process 102, 10b of FIG. 1 and 20b of FIG. 2 are shown. Processing is performed in the rendered state.

The heating process 101 preferably has both a heating function and a pressure reducing function. That is to say, the structure of the heating 101 process is heated under reduced pressure to increase the volatility. At this time, heating is performed at a temperature higher than the melting point of the fusion material, and the fusion material is melted under the heating process to be excellent.

The decompression method associated with the heating process 101 is not particularly limited as long as the pressure can be reduced to 5 Pascal (5 Pa) or less, and a general decompression pump or the like can be used.

The heating temperature associated with the heating process 101 is not particularly limited, and an appropriate temperature can be set depending on the welding material to be used. In principle, the heating temperature is preferably higher than the melting point of the welded material used. The most common fusion material is gold-tin alloy (AuSn alloy), and the temperature setting at this time is preferably 280 degrees Celsius.

The packaging process 102 is provided with a heating function, a pressure reducing function, and a pressurizing function. That is to say, after the heating process, the welded material is in a molten state, and in this state, the upper cover and the container are hermetically joined. The heating temperature in the heating function is not particularly limited, but it is preferable to set the temperature to be lower than the previous heating process temperature. In this way, the occurrence of volatilization of the components can be suppressed. In addition, in principle, the temperature is preferably lower than the melting point temperature of the welded material used. In the case of a welded gold-tin alloy (AuSn alloy), the temperature is preferably set at 280 degrees Celsius or less.

Regarding the pressure reducing function of the packaging process 102, the same means as the heating process 101 described above can be used. In addition, the space in the packaging process 102 can be connected to the space in the heating process 101, so that both sides can perform the decompression operation at the same time.

With regard to the encapsulation process 102, pressure is applied to the upper cover 2 and the container 1 to adhere thereto by means of the pressure application mentioned above (indicated by the load thimbles 7, 8 in Figs. 1 and 2). The method of applying the pressure is not particularly limited, and it may be carried out by a general pressurization method. However, if the pressure is applied in the state shown in Fig. 110b, the pressure is not applied to the end of the container 1 alone. That is to say, because of the shape factor of the package tray 4, if only the end of the container 1 is pressurized, the container 1 and the upper cover 2 cannot be guided to the position where they are properly engaged. Further, if only the end of the upper cover 2 is pressurized, the upper cover 2, the welded material 3, and the container 1 cannot be brought into contact with each other in order, and it is impossible to apply pressure therebetween.

When applying pressure, at least the end (lower side) of the upper cover 2 is pressurized (that is, the device is required to be provided with a load thimble that is pressurized from the upper cover end, and more specifically, a load thimble is also provided at the end of the container. The method (Fig. 1), or the method of pushing the pressure on the side of the container with the cover of the package fixture (Fig. 2), etc.

Further, the load thimble may be a part of the heating method, or may be separate from the heating method, or may have no heating function, and may only apply a load thimble when the package is performed, as shown in Figs. 4 and 5 above.

The conditions for applying pressure here are not particularly limited, but the conditions for applying pressure depending on the size of the container are preferably changed. For example, a container having a length of about 2 mm can be packaged under pressure using a force of 100 g/cm 2 .

Regarding the packaging device of the present invention, other constituent mechanisms may be disposed in order to achieve the above object. For example, when the package tray is introduced into the heating program, or when the package tray is removed from the packaging program; it needs to be introduced from the atmospheric pressure environment to the low pressure environment or from the low pressure environment to the atmospheric pressure environment, depending on the situation. Configuration corresponds (as in Figure 1, 103, 104).

The packaging device of the present invention requires that the temperature error of the heating program and the packaging program be as small as possible. The temperature error of this equipment is controlled to be less than or minus 2.5 degrees Celsius.

In the present invention, the heating time is relatively long, and it is preferable to be longer than the packaging time. That is to say, by comparing the heating for a long time, the fusion splicing material can be sufficiently melted, and the volatile components can be sufficiently removed before being packaged. Further, the package pressurization time is rather shorter. After the fusion material is sufficiently melted in the heating process, the pressure packaging process is performed in a short time.

More specifically, the condition setting heating time is 3 minutes to 20 minutes, and the packaging time is 10 seconds to 5 minutes.

In this way, the heating time can be ensured, and in order to maintain the overall average temperature or pressure reduction in the heating process, it is preferable to set a plurality of heating programs. That is to say, the processing time of the heating program is long, and the processing time of the packaging program is short, and the longer the heating program is, the better the manufacturing efficiency is. In such a case, the heating process is multiplied compared to the heating process of a large volume, and the manufacturing cost of the packaging apparatus and the like, and the heating process can be easily and uniformly reduced and pressurized as a whole.

The packaging device of the present invention can be provided with a cooling program after the packaging process. That is to say, when the package is cooled under reduced pressure and then cooled and then taken out under reduced pressure, the order is superior. As described above, when cooling is performed under reduced pressure, when the package tray is taken out under normal air pressure, it is cooled to a state close to room temperature. With this cooling method, the packaged disk does not oxidize (discolor) at a normal temperature.

The present invention is characterized by a packaging method for packaging a container and an upper cover using the above-described packaging device.

According to the present invention, as described in the above item, a container and an upper cover for an electronic component such as a quartz crystal resonator, a quartz crystal oscillator, a surface acoustic acoustic wave filter, and an LED are used.

1‧‧‧ container
2‧‧‧Upper cover
3‧‧‧welding materials
4‧‧‧Package tray
5‧‧‧Package cover
6, 7‧‧‧ load thimble
8‧‧‧opening
9, 10‧‧‧ heating block for heating process
11, 12 ‧ ‧ heating block board for packaging procedures
101‧‧‧heating procedure
102‧‧‧Packing procedure
103‧‧‧Atmospheric pressure decompression switching chamber (entry end)
104‧‧‧Atmospheric pressure decompression switching chamber (discharge end)
105‧‧‧Decompression pump

Fig. 1 is a view showing an example of a package device of the present invention. Fig. 2 is a view showing an example of a package device of the present invention. Fig. 3 is a view showing an example of a conventional packaging device. Fig. 4 is a view showing a state of heating of a heating block used in the packaging apparatus of the present invention. Fig. 5 is a view showing a state of heating of a heating block used in the packaging apparatus of the present invention. Figure 6 is a schematic diagram showing the outline of the package device of the present invention.

no

Claims (4)

An electronic component packaging device in which a container containing an electronic component and an upper cover are hermetically sealed, and has a heating program and a packaging process immediately after. Preparing the package tray carrying the above-mentioned container and the above-mentioned upper cover and having a positioning effect, and moving the package tray to the heating program and the packaging program; the above description shows that the positioning effect of the package tray is between the encapsulant on the upper cover package surface and the container There will be gaps. In the packaging process, at least at the upper cover end, there is a load ejector pin; the package disk carries a package jig cover, and the package device having the above features. In the above description of the package tray, the upper cover is positioned at the bottom, and the container and the upper cover are controlled at a position with a gap for use in the packaging device as described in the claims. A heater capable of adjusting the temperature is required in the heating program and the packaging program. Therefore, the heater is provided on both the upper and lower ends of the package device as described in claim 1 and claim 2. The packaging method characterized by the container or the upper cover is packaged using the packaging device as claimed in claim 1 or 2.