WO2017076361A1 - Smd quartz crystal resonator and complete board package machining process therefor - Google Patents
Smd quartz crystal resonator and complete board package machining process therefor Download PDFInfo
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- WO2017076361A1 WO2017076361A1 PCT/CN2016/104821 CN2016104821W WO2017076361A1 WO 2017076361 A1 WO2017076361 A1 WO 2017076361A1 CN 2016104821 W CN2016104821 W CN 2016104821W WO 2017076361 A1 WO2017076361 A1 WO 2017076361A1
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- 239000013078 crystal Substances 0.000 title claims abstract description 67
- 239000010453 quartz Substances 0.000 title claims abstract description 65
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 65
- 238000003754 machining Methods 0.000 title abstract 6
- 239000002184 metal Substances 0.000 claims abstract description 105
- 239000000919 ceramic Substances 0.000 claims abstract description 83
- 238000004806 packaging method and process Methods 0.000 claims abstract description 12
- 239000011159 matrix material Substances 0.000 claims abstract description 11
- 238000012545 processing Methods 0.000 claims description 28
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- 238000003698 laser cutting Methods 0.000 claims description 7
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 7
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- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
Abstract
A complete board package machining process for an SMD quartz crystal resonator. The complete board package machining process comprises the following machining steps: (1), machining a plurality of quartz crystal bases (2) arranged, in a matrix manner, on a ceramic complete board (1); (2), forming a plurality of metal sheets (5), in the same matrix shape as each base (2) on the ceramic complete board (1), on a metal complete board (4), the adjacent metal sheets (5) being connected by means of a metal connecting wire (6); (3), machining a quartz crystal resonant part on the ceramic complete board (1); and (4) packaging the ceramic complete board (1) and the metal complete board (4), and finally, partitioning same into a single SMD quartz crystal resonator. The SMD resonator is low in manufacturing cost and small in stress, contributes to long-term stability of product frequency, and has a simple and convenient manufacturing process.
Description
本发明涉及种新型SMD石英晶体谐振器及其整板封装加工工艺，属于电子元器件及其加工工艺技术领域。The invention relates to a novel SMD quartz crystal resonator and a whole board packaging processing technology thereof, and belongs to the technical field of electronic components and processing techniques thereof.
目前，现有的SMD石英晶体谐振器的生产工艺流程如下：1、按石英晶体谐振器陶瓷基板生产工艺完成陶瓷整板的加工，再进行分割挑选，形成单颗SMD石英晶体谐振器陶瓷基座；2、晶片经清洗、镀膜、点胶固定在基座内，形成单颗SMD石英晶体谐振件；3、加工单颗金属片(陶瓷片)，盖在谐振件上密封，形成单颗SMD石英晶体谐振器。上述生产工艺不仅生产效率低，而且用料成本较高。At present, the production process of the existing SMD quartz crystal resonator is as follows: 1. The ceramic whole plate is processed according to the quartz crystal resonator ceramic substrate production process, and then divided and selected to form a single SMD quartz crystal resonator ceramic base. 2, the wafer is cleaned, coated, and glued in the pedestal to form a single SMD quartz crystal resonator; 3. A single metal piece (ceramic piece) is processed, and the cover is sealed on the resonator to form a single SMD quartz. Crystal resonator. The above production process not only has low production efficiency, but also has high material cost.
再者，SMD石英晶体谐振件与金属片之间采用以下四种方式进行封焊：1、平行封焊(金属封装)；2、隧道炉热熔封焊(金锡封装)；3、胶封装(树脂胶或玻璃胶)；4、电子束封焊(金属封装)。Furthermore, SMD quartz crystal resonators and metal sheets are sealed in the following four ways: 1. Parallel sealing (metal packaging); 2. Tunnel furnace hot-melt sealing (gold-tin package); 3. Plastic packaging (resin glue or glass glue); 4, electron beam sealing (metal package).
发明内容Summary of the invention
本发明在于解决已有技术中存在的不足之处，提供一种材料成本低、应力小、有利于产品频率的长期稳定性的SMD石英晶体谐振器以及该谐振器的加工方法，该方法不需要将基座移载在工装加工，生产效率高、占用空间小、生产成本低。The invention solves the deficiencies in the prior art, and provides an SMD quartz crystal resonator with low material cost, small stress and long-term stability of product frequency, and a processing method of the resonator, which does not need The pedestal is transferred to the tooling processing, which has high production efficiency, small space occupation and low production cost.
本发明的一种新型SMD石英晶体谐振器的整板封装加工工艺，其特殊之处在于生产原材料不采用单颗SMD石英晶体谐振器陶瓷基座和单颗金属片，改用整板陶瓷基座加工成整板谐振件，再与金属大板密封，最后分割成单颗SMD石英晶体谐振器，包括以下工艺步骤：The whole process of the whole board packaging process of a novel SMD quartz crystal resonator of the invention is that the raw material for the production does not use a single SMD quartz crystal resonator ceramic base and a single metal piece, and the whole plate ceramic base is used instead. It is processed into a whole plate resonator, sealed with a metal plate, and finally divided into a single SMD quartz crystal resonator, including the following process steps:
1)、加工陶瓷整板1), processing ceramic whole board
在陶瓷整板1上加工制作矩阵排列的若干个石英晶体基座2，陶瓷整板1各基座焊接金属环或不焊接金属环均可，各基座间相连接，但不导通；A plurality of quartz crystal pedestals 2 arranged in a matrix are processed on the ceramic whole plate 1. The susceptors of the ceramic whole plate 1 may be welded with metal rings or not welded, and the pedestals are connected but not electrically connected;
2)、加工金属整板2), processing metal whole board
按照陶瓷整板1的尺寸、结构加工金属整板4，在金属整板4上形成与陶瓷整板1上各基座2相同矩阵形状的若干个金属片5，相邻金属片5之间通过金属连接线6相连接；The metal whole plate 4 is processed according to the size and structure of the ceramic whole plate 1, and a plurality of metal pieces 5 having the same matrix shape as the respective bases 2 on the ceramic whole plate 1 are formed on the metal whole plate 4, and the adjacent metal pieces 5 pass between The metal connecting wires 6 are connected;
3)、在陶瓷整板上加工石英晶体谐振件3) Processing quartz crystal resonators on the ceramic whole plate
晶片经清洗、镀膜形成电极后放入陶瓷整板1上各基座2内，进行点胶、固化，形成若干个
石英晶体谐振件，进一步对陶瓷整板1上各谐振件微调；After the wafer is cleaned and coated to form an electrode, the wafer is placed in each of the susceptors 2 on the ceramic whole plate 1 to be dispensed and solidified to form a plurality of
Quartz crystal resonator, further fine-tuning the resonators on the ceramic whole plate 1;
4)、封装陶瓷整板与金属整板4), package ceramic whole board and metal whole board
进一步，将金属整板4覆盖于陶瓷整板1的各谐振件上，金属整板4的各金属片5周边搭载在与所对应的陶瓷整板1的各基座2金属化镀层11上，经加工密封为一整体；Further, the metal whole plate 4 is covered on the respective resonators of the ceramic whole plate 1, and the periphery of each metal piece 5 of the metal whole plate 4 is mounted on the metallization layer 11 of each of the susceptors 2 of the corresponding ceramic whole plate 1. Processed and sealed as a whole;
5)、加工成石英晶体谐振器5), processed into a quartz crystal resonator
进一步，切断各金属片5之间的金属连接线6，在陶瓷整板1上形成各个连接的石英晶体谐振器；Further, the metal connection lines 6 between the metal sheets 5 are cut, and the respective connected quartz crystal resonators are formed on the ceramic whole board 1;
6)、检测、分割、包装6), detection, segmentation, packaging
进一步，在陶瓷整板1上对各个相连接的石英晶体谐振器进行性能测试，标注出不良品，再对陶瓷整板进行分割，分选出合格的石英晶体晶体谐振器进行编带包装。Further, the performance of each connected quartz crystal resonator is tested on the ceramic whole board 1, and the defective product is marked, and then the ceramic whole board is divided, and a qualified quartz crystal crystal resonator is sorted and packaged.
所述步骤2)加工金属整板4时，采用激光切割工艺在金属整板4上进行镂空处理，形成与陶瓷整板1各基座相同矩阵形状的金属片5及其金属连接线6；The step 2) when processing the metal whole plate 4, using a laser cutting process on the metal whole plate 4 hollowing treatment, forming a metal sheet 5 and its metal connecting line 6 of the same matrix shape as each base of the ceramic whole plate 1;
所述陶瓷整板1的长度方向两侧均设有四个陶瓷整板定位孔7，与之对应加工的金属整板4的相同位置处也设有金属整板定位孔8，所述步骤4)封装陶瓷整板1与金属整板4时，利用夹具，通过定位孔重合，将金属整板4覆盖于陶瓷整板1上；The ceramic whole board 1 is provided with four ceramic whole board positioning holes 7 on both sides in the longitudinal direction, and the metal whole board positioning holes 8 are also provided at the same position of the corresponding metal whole board 4, the step 4 When the ceramic whole plate 1 and the metal whole plate 4 are packaged, the metal whole plate 4 is covered on the ceramic whole plate 1 by using a clamp and overlapping by the positioning holes;
所述步骤4)、封装陶瓷整板1与金属整板4时，金属整板4的各金属片周边搭载在与所对应的陶瓷整板1的各基座2金属镀层上，采用激光焊接方式熔接为一体；或选用金属板材料和选用基座金属镀层通过隧道炉热熔；或在金属整板4各金属片5周边涂上树脂胶或玻璃胶，再与陶瓷整板1的各基座2粘合；In the step 4), when the ceramic whole plate 1 and the metal whole plate 4 are packaged, the periphery of each metal piece of the metal whole plate 4 is mounted on the metal plating layer of each pedestal 2 of the corresponding ceramic whole plate 1, and is laser welded. Fusion welding as one; or use metal plate material and base metal plating to heat melt through the tunnel furnace; or apply resin glue or glass glue on the periphery of each metal plate 5 of the metal whole plate 4, and then the base of the ceramic whole plate 1 2 bonding;
所述5)、加工成石英晶体谐振器时，利用激光切断各金属线6，形成各个连接的石英晶体谐振器。In the case where the 5) is processed into a quartz crystal resonator, the respective metal wires 6 are cut by a laser to form respective connected quartz crystal resonators.
本发明的一种新型SMD石英晶体谐振器及其整板封装加工工艺具有以下有益效果：1、原材料采用陶瓷整板，结构紧密，省略分割工序，采购成本低；2、生产过程直接采用整板传递，不需要单颗移载在工装上，占用空间小，生产效率高，生产成本低；3、金属片采用购买整板金属激光切割完成，不用采购加工好的金属片，节约材料成本；4、创新采用目前先进的激光切割、焊接工艺，产品的形变小、应力降低，有利于产品频率的长期稳定性。以上综上所述，本发明产品材料成本和生产成本比传统产品低，生产效率高在电子元器件加工领域具有很好的应用前景。The novel SMD quartz crystal resonator and the whole board packaging processing technology of the invention have the following beneficial effects: 1. The raw material adopts ceramic whole board, the structure is compact, the dividing process is omitted, the procurement cost is low; 2. The whole process is directly adopted in the production process. Transfer, no need to transfer a single load on the tooling, occupying small space, high production efficiency, low production cost; 3, the metal piece is completed by purchasing the whole plate metal laser cutting, without purchasing the processed metal piece, saving material cost; 4 Innovatively adopts the current advanced laser cutting and welding process, the product has small deformation and reduced stress, which is conducive to the long-term stability of the product frequency. In summary, the material cost and production cost of the product of the invention are lower than that of the conventional product, and the high production efficiency has a good application prospect in the field of electronic component processing.
图1：本发明一种新型SMD石英晶体谐振器陶瓷整板的结构示意图；
Figure 1: Schematic diagram of a novel SMD quartz crystal resonator ceramic whole plate of the present invention;
图2：本发明一种新型SMD石英晶体谐振器基座的结构示意图；2 is a schematic structural view of a novel SMD quartz crystal resonator base according to the present invention;
图3：图2的侧视图；Figure 3: side view of Figure 2;
图4：图2的后视图；Figure 4: Rear view of Figure 2;
图5：本发明一种新型SMD石英晶体谐振器金属整板的结构示意图；FIG. 5 is a schematic structural view of a metal whole plate of a novel SMD quartz crystal resonator according to the present invention; FIG.
图6：本发明一种新型SMD石英晶体谐振器金属片的结构示意图；6 is a schematic structural view of a novel SMD quartz crystal resonator metal piece according to the present invention;
图7：本发明一种新型SMD石英晶体谐振器件的结构示意图；7 is a schematic structural view of a novel SMD quartz crystal resonant device of the present invention;
图8：本发明一种新型SMD石英晶体谐振器陶瓷整板各谐振件与金属整板各金属片的熔按结构示意图。Fig. 8 is a schematic view showing the melting structure of each of the resonating members of the ceramic plate and the metal plates of the whole metal plate of the novel SMD quartz crystal resonator of the present invention.
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。The technical solutions in the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, but not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.
实施例1Example 1
本实施例的一种新型SMD石英晶体谐振器整板封装加工工艺，参考附A novel SMD quartz crystal resonator full-board package processing technology of this embodiment is referred to
图1-6，包括以下加工步骤：Figure 1-6, including the following processing steps:
1、按照石英晶体谐振器陶瓷基板生产工艺加工，陶瓷整板1结构为各个相连接的石英晶体基座2按矩阵排列，且不导通；陶瓷整板1各基座2焊接金属环或不焊接金属环均可；陶瓷整板1的两侧设有陶瓷整板定位孔7；1. According to the production process of quartz crystal resonator ceramic substrate, the ceramic whole plate 1 structure is arranged in a matrix according to each phase of the quartz crystal base 2, and is not conductive; the ceramic whole plate 1 each base 2 is welded with a metal ring or not The welding metal ring can be; the ceramic whole board 1 is provided with ceramic whole board positioning holes 7 on both sides;
2、在陶瓷整板上实现若干个石英晶体谐振件的加工，加工过程如下：2. Realize the processing of several quartz crystal resonators on the ceramic whole board. The processing process is as follows:
选择晶片3、电极夹具，进行排片、清洗、烘干、镀膜；Selecting the wafer 3 and the electrode holder for arranging, cleaning, drying, and coating;
进一步，将晶片3置入陶瓷整板1的每个基座2内，用导电胶12将基座2内点胶平台9和晶片3副电极10进行连接；再将陶瓷整板1放入隧道炉进行导电胶的固化和退火，实现晶片3与基座2的连接，在陶瓷整板1上形成矩阵排列的若干个石英晶体谐振件；Further, the wafer 3 is placed in each of the susceptors 2 of the ceramic whole plate 1, and the dispensing platform 9 and the sub-electrode 10 of the wafer 3 are connected by the conductive adhesive 12; and the ceramic whole plate 1 is placed in the tunnel. The furnace is cured and annealed by the conductive adhesive to realize the connection between the wafer 3 and the susceptor 2, and a plurality of quartz crystal resonators arranged in a matrix are formed on the ceramic whole plate 1;
进一步，将陶瓷整板1放入微调机内，对每个石英晶体谐振件进行微调，达到目标频率；Further, the ceramic whole plate 1 is placed in a fine adjustment machine, and each quartz crystal resonator is finely adjusted to reach a target frequency;
3、在金属料带上制作金属整板4，利用激光切割工艺在金属料带上切割出与陶瓷整板1尺寸、形状、定位孔一致的金属整板4，形成与陶瓷整板1上各基座2相同矩阵形状的若干个金属片5，相邻金属片5之间通过金属连接线6相连接，将切割好的金属整板4超声清洗，进一步在各个相连接的金属片5进行激光印字做标识；3. Forming a metal whole plate 4 on the metal strip, and cutting a metal whole plate 4 which is consistent with the size, shape and positioning hole of the ceramic whole plate on the metal strip by using a laser cutting process, and forming a ceramic whole plate 1 The plurality of metal sheets 5 of the same matrix shape of the susceptor 2 are connected by the metal connecting wires 6 between the adjacent metal sheets 5, ultrasonically cleaning the cut metal whole board 4, and further performing laser processing on the metal sheets 5 connected to each other. Printing to make a logo;
4、金属整板与陶瓷整板的封装
4, metal whole board and ceramic whole board package
利用夹具，通过陶瓷整板定位孔7和金属整板定位孔8进行定位，将金属整板4覆盖在陶瓷整板1上压住，放入真空仓，利用激光通过夹具压板缝隙进行两次焊接，实现金属整板4各金属片与陶瓷整板1各石英晶体谐振件的周边熔接；Using the clamp, the ceramic whole plate positioning hole 7 and the metal whole plate positioning hole 8 are positioned, the metal whole plate 4 is covered on the ceramic whole plate 1 and pressed, and placed in a vacuum chamber, and the laser is passed through the gap of the clamp plate to perform two weldings. , the metal plate of the metal whole plate 4 and the periphery of each quartz crystal resonator of the ceramic whole plate 1 are welded;
5、利用激光切断金属整板4各金属片5间的连接金属连接线6，在陶瓷整板1上形成各个连接的石英晶体谐振器，进一步完成陶瓷整板4各石英晶体谐振器的测试、分割、包装。具体如以下步骤：将密封后的陶瓷整板1上各个石英晶体谐振器经过老化和回流焊条件后，进行检漏测试和电参数测试、温度频率测试，对不合格产品进行识别(喷涂颜色)，然后将陶瓷整板1各个连接的石英晶体谐振器进行分离，形成单个SMD石英晶体谐振器，挑出不合格品后，编带包装。5. Using a laser to cut the connecting metal connecting wires 6 between the metal sheets 5 of the metal whole plate 4, forming respective connected quartz crystal resonators on the ceramic whole plate 1, and further testing the quartz crystal resonators of the ceramic whole plate 4, Segmentation, packaging. Specifically, the following steps are performed: after the quartz crystal resonators on the sealed ceramic whole plate 1 are subjected to aging and reflow soldering conditions, a leak test, an electrical parameter test, and a temperature frequency test are performed to identify the unqualified product (spray color). Then, the quartz crystal resonators connected to the ceramic whole plate 1 are separated to form a single SMD quartz crystal resonator, and after the unqualified products are picked out, the tape is packaged.
实施例2Example 2
本实施例的制作陶瓷整板1，实现若干个石英晶体谐振件以及在金属料带The ceramic whole plate 1 of the embodiment realizes several quartz crystal resonators and the metal strip
上制作金属整板4的加工方式与实施1相同，区别在于：步骤4)实现金属整板4与陶瓷整板1的封装时，在金属整板4各金属片5周边涂上耐高温紫外线树脂胶或玻璃胶，再与陶瓷整板1的各基座2在真空仓内粘合。The processing method for forming the metal whole plate 4 is the same as that of the first embodiment. The difference is that when the metal whole plate 4 and the ceramic whole plate 1 are packaged in step 4), the high-temperature ultraviolet resin is coated on the periphery of each metal piece 5 of the metal whole plate 4. The glue or glass glue is bonded to the susceptors 2 of the ceramic whole plate 1 in a vacuum chamber.
实施例3Example 3
本实施例的制作陶瓷整板1，实现若干个石英晶体谐振件以及在金属料带The ceramic whole plate 1 of the embodiment realizes several quartz crystal resonators and the metal strip
上制作金属整板4的加工方式与实施1相同，区别在于：步骤4)实现金属整板4与陶瓷整板1的封装时，选择熔点在300～400摄氏度的合金材料作为金属整板4材料与陶瓷整板1的金属化镀层材料，在隧道炉内进行热熔密封。The processing method for forming the metal whole plate 4 is the same as that of the first embodiment. The difference is that when the metal whole plate 4 and the ceramic whole plate 1 are packaged in step 4), an alloy material having a melting point of 300 to 400 degrees Celsius is selected as the metal whole plate material. The metallized coating material of the ceramic whole plate 1 is heat-sealed in a tunnel furnace.
本发明的一种SMD石英晶体谐振器及其加工方法具有以下有益效果：1、原材料采用陶瓷整板，结构紧密，省略分割工序，采购成本低；2、生产过程直接采用整板传递，不需要单颗移载在工装上，占用空间小，生产效率高，生产成本低；3、金属片采用购买整板金属激光切割完成，不用采购加工好的金属片，节约材料成本；4、创新采用目前先进的激光切割、焊接工艺，产品的形变小、应力降低，有利于产品频率的长期稳定性。以上综上所述，本发明产品材料成本和生产成本比传统产品低，生产效率高在电子元器件加工领域具有很好的应用前景。The invention relates to an SMD quartz crystal resonator and a processing method thereof, which have the following beneficial effects: 1. The raw material adopts a ceramic whole board, the structure is compact, the dividing process is omitted, and the procurement cost is low; 2. The production process is directly transmitted by the whole board, and is not required. Single transfer on the tooling, small footprint, high production efficiency, low production cost; 3, the metal sheet is completed by purchasing the whole plate metal laser cutting, without purchasing the processed metal sheet, saving material cost; 4, innovation adopts the current Advanced laser cutting and welding processes, the product has small deformation and reduced stress, which is conducive to the long-term stability of the product frequency. In summary, the material cost and production cost of the product of the invention are lower than that of the conventional product, and the high production efficiency has a good application prospect in the field of electronic component processing.
以上所述仅为本发明的较佳实施例，并不用以限制本发明，凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。The above are only the preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalents, improvements, etc., which are within the spirit and scope of the present invention, should be included in the protection of the present invention. Within the scope.
Claims (8)
- 一种新型SMD石英晶体谐振器的整板封装加工工艺，其特征在于采用整板陶瓷基座加工成整板谐振件，再与金属大板密封，最后分割成单颗SMD石英晶体谐振器，包括以下加工步骤：A whole-board package processing process of a novel SMD quartz crystal resonator, characterized in that a whole-plate ceramic base is used to process a whole-plate resonator, and then sealed with a metal plate, and finally divided into single SMD quartz crystal resonators, including The following processing steps:1)、加工陶瓷整板1), processing ceramic whole board在陶瓷整板(1)上加工制作矩阵排列的若干个石英晶体基座(2)，陶瓷整板(1)各基座焊接金属环或不焊接金属环均可，各基座(2)间相连接，但不导通；A plurality of quartz crystal pedestals (2) arranged in a matrix are processed on the ceramic whole plate (1), and the ceramic slabs (1) are welded with metal rings or non-welded metal rings, and each pedestal (2) Connected but not conductive;2)、加工金属整板2), processing metal whole board按照陶瓷整板(1)的尺寸、结构加工金属整板(4)，在金属整板(4)上形成与陶瓷整板(1)上各基座(2)相同矩阵形状的若干个金属片(5)，相邻金属片(5)之间通过金属连接线(6)相连接；The metal whole plate (4) is processed according to the size and structure of the ceramic whole plate (1), and a plurality of metal pieces having the same matrix shape as the bases (2) on the ceramic whole plate (1) are formed on the metal whole plate (4). (5), adjacent metal sheets (5) are connected by a metal connecting line (6);3)、在陶瓷整板上加工石英晶体谐振件3) Processing quartz crystal resonators on the ceramic whole plate晶片(3)经清洗、镀膜形成电极后放入陶瓷整板(1)上各基座(2)内，进行点胶、固化，形成若干个石英晶体谐振件，进一步对陶瓷整板(1)上各谐振件微调；The wafer (3) is cleaned and coated to form an electrode, and then placed in the susceptor (2) on the ceramic whole plate (1) to be dispensed and solidified to form a plurality of quartz crystal resonators, and further to the ceramic whole plate (1) Fine adjustment of each of the upper resonators;4)、封装陶瓷整板与金属整板4), package ceramic whole board and metal whole board进一步，将金属整板(4)覆盖于陶瓷整板(1)上各谐振件上，金属整板(4)的各金属片(5)周边搭载在与所对应的陶瓷整板(1)的各基座(2)金属化镀层(11)上，经加工密封为一整体。Further, the metal whole plate (4) is covered on the respective resonator members on the ceramic whole plate (1), and the periphery of each metal piece (5) of the metal whole plate (4) is mounted on the corresponding ceramic whole plate (1). Each of the pedestal (2) metallization coatings (11) is processed and sealed as a whole.
- 按照权利要求1所述的一种新型SMD石英晶体谐振器的整板封装加工工艺，其特征在于还包括以下加工步骤：A full-board package processing process for a novel SMD quartz crystal resonator according to claim 1, further comprising the following processing steps:5)、加工成石英晶体谐振器5), processed into a quartz crystal resonator进一步，切断各金属片(5)之间的金属连接线(6)，在陶瓷整板(1)上形成各个连接的石英晶体谐振器；Further, the metal connection line (6) between the metal sheets (5) is cut, and each connected quartz crystal resonator is formed on the ceramic whole board (1);6)、检测、分割、包装6), detection, segmentation, packaging进一步，在陶瓷整板(1)上对各个相连接的石英晶体谐振器进行性能测试，标注出不良品，再对陶瓷整板(1)进行分割，分选出合格的石英晶体晶体谐振器进行编带包装。Further, the performance of each connected quartz crystal resonator is tested on the ceramic whole plate (1), and the defective product is marked, and then the ceramic whole plate (1) is divided, and a qualified quartz crystal crystal resonator is sorted. Tape packaging.
- 按照权利要求1或2所述的一种SMD石英晶体谐振器的整板封装加工工艺，其特征在于所述步骤2)加工金属整板时，采用激光切割工艺在金属整板上进行镂空处理，形成与陶瓷整板(1)相同矩阵形状的金属片(5)。The whole board packaging processing process of an SMD quartz crystal resonator according to claim 1 or 2, wherein in the step 2), when the whole metal plate is processed, the laser cutting process is used to perform the hollowing process on the metal whole plate. A metal piece (5) having the same matrix shape as the ceramic whole plate (1) is formed.
- 按照权利要求1或3所述的一种SMD石英晶体谐振器的整板封装加工工艺，其特征在于所述步骤4)封装陶瓷整板(1)与金属整板(4)时，金属整板(4)的各金属片(5)周边 搭载在与所对应的陶瓷整板(1)的各基座(2)金属化镀层(11)上，采用激光焊接方式熔接为一体。The whole board packaging processing process of an SMD quartz crystal resonator according to claim 1 or 3, characterized in that the step 4) is when the ceramic whole board (1) and the metal whole board (4) are packaged, the whole metal board (4) Around each metal piece (5) It is mounted on each of the base (2) metallization layers (11) of the corresponding ceramic whole plate (1), and is welded by laser welding.
- 按照权利要求1或3所述的一种SMD石英晶体谐振器的整板封装加工工艺，其特征在于所述步骤4)封装陶瓷整板(1)与金属整板(4)时，选用金属板材料和选用基座金属化镀层(11)通过隧道炉热熔为一体。The whole board packaging processing process of an SMD quartz crystal resonator according to claim 1 or 3, characterized in that the step 4) is to select a metal plate when the ceramic whole plate (1) and the metal whole plate (4) are packaged. The material and the base metallization coating (11) are integrally melted by a tunnel furnace.
- 按照权利要求1或3所述的一种SMD石英晶体谐振器的整板封装加工工艺，其特征在于所述步骤4)封装陶瓷整板(1)与金属整板(4)时，在金属整板(4)各金属片(5)周边涂上树脂胶或玻璃胶，再与陶瓷整板(1)的各基座(2)粘合。A process for processing a whole board package of an SMD quartz crystal resonator according to claim 1 or 3, wherein said step 4) when encapsulating the ceramic whole board (1) and the metal whole board (4), in the metal whole Each of the metal sheets (5) of the plate (4) is coated with a resin glue or a glass glue, and then bonded to each of the bases (2) of the ceramic whole plate (1).
- 按照权利要求1或3所述的一种SMD石英晶体谐振器的整板封装加工工艺，其特征在于所述5)、加工成石英晶体谐振器时，利用激光切断各金属连接线(6)，形成各个连接的石英晶体谐振器。A process for processing a full-board package of an SMD quartz crystal resonator according to claim 1 or 3, wherein said 5) is processed into a quartz crystal resonator, and each metal connecting wire (6) is cut by a laser. A quartz crystal resonator of each connection is formed.
- 由权利要求1-7所述加工工艺制得的新型SMD石英晶体谐振器。 A novel SMD quartz crystal resonator produced by the processing of claims 1-7.
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| CN105305995B (en) * | 2015-11-05 | 2016-11-30 | 烟台明德亨电子科技有限公司 | A kind of SMD quartz crystal resonator and imposite encapsulation process technique thereof |
| CN106067776B (en) * | 2016-07-06 | 2018-10-02 | 烟台明德亨电子科技有限公司 | Paste contactless spraying colloid system and method in quartz-crystal resonator production in surface |
| CN106067775B (en) * | 2016-07-06 | 2019-04-26 | 四川明德亨电子科技有限公司 | Paste in quartz-crystal resonator production sheet devices and method in whole plate in surface |
| CN108111139B (en) * | 2016-11-25 | 2023-10-31 | 四川明德亨电子科技有限公司 | SMD quartz resonator and processing equipment and method thereof |
| CN106877833B (en) * | 2016-12-29 | 2020-04-14 | 北京晨晶电子有限公司 | Processing method of quartz crystal resonator |
| CN107517043B (en) * | 2017-08-10 | 2023-10-20 | 四川明德亨电子科技有限公司 | SMD quartz crystal resonator processing method and resonator thereof |
| CN107517044B (en) * | 2017-08-10 | 2024-04-09 | 四川明德亨电子科技有限公司 | Substrate structure of whole-board SMD quartz crystal resonator and processing method thereof |
| CN109639254B (en) * | 2018-11-28 | 2023-05-09 | 江苏浩都频率科技有限公司 | Manufacturing process of resonator of SMD3225 wafer |
| CN109617535B (en) * | 2018-11-28 | 2023-09-15 | 江苏浩都频率科技有限公司 | Manufacturing process of resonator of SMD2016 wafer |
| CN110086443A (en) * | 2019-05-07 | 2019-08-02 | 中山市镭通激光科技有限公司 | A kind of manufacturing method of crystal oscillator |
| CN110504939A (en) * | 2019-08-29 | 2019-11-26 | 北京康特睿科光电科技有限公司 | A kind of crystal oscillator and its manufacturing method |
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