CN101651110A - Process for producing miniaturized SMD products - Google Patents
Process for producing miniaturized SMD products Download PDFInfo
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- CN101651110A CN101651110A CN200910304267A CN200910304267A CN101651110A CN 101651110 A CN101651110 A CN 101651110A CN 200910304267 A CN200910304267 A CN 200910304267A CN 200910304267 A CN200910304267 A CN 200910304267A CN 101651110 A CN101651110 A CN 101651110A
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- China
- Prior art keywords
- reflow soldering
- miniaturized smd
- production technology
- welding
- smd products
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Abstract
The invention relates to a process for producing miniaturized SMD (surface mounted device) products, which comprises procedures of film cutting, wafer cutting, wafer fixing and wire solder processing.The process is characterized in that after the procedure of wire soldering, the tray transferring and solder-reflow procedures are carried out in order. The invention instantly combines a cover witha ceramic shell by solder melting in a high-temperature solder-reflow furnace, thereby completing the processes of spot welding and seam welding and solving the problems of unstable tightness and incomplete welding seam of seam welding process in the prior art.
Description
Technical field
The present invention relates to the production technology of a kind of SMD (surface mount device) product, be specially a kind of production technology of miniaturized SMD products.
Background technology
The SMD product comprises lid and shell, lid and shell is assembled into one is called encapsulation.Miniaturized SMD products is meant that package dimension is at the SMD of 2mm * 2.5mm product.The technological process of production of existing SMD product may further comprise the steps: film, wafer cutting, solid crystalline substance, bonding wire, spot welding, seam weldering and test.Wherein, spot welding is earlier lid to be placed on the shell, contacts lid edge by the electrode that has high electric current, thereby produces high temperature, melts the nickel coating on the lid, and the Gold plated Layer on nickel and the shell welds together, and forms two pads; Seam weldering is to rolling across the four edges of product lid through the product of spot welding with circular electrode, to reach the welding of four edges and shell Gold plated Layer.
Present spot-welding equipment and seam-welding equipment can satisfy the production demand of package dimension more than or equal to the SMD product of 3mm * 2.5mm substantially, but in producing miniaturized SMD products, have following shortcoming:
1, because the capabilities limits of spot-welding equipment itself causes the lid skew easily when carrying out the small size electric welding, fraction defective almost can not be used for producing in batches more than 70%;
2, it is incomplete that existing parallel seam welding equipment is easy to cause the weldering of product seam equally, causes product hermeticity bad, thereby influence reliability of products.
Summary of the invention
The present invention is directed to the problems referred to above, a kind of production technology of miniaturized SMD products is provided, adopt this technology can reduce the probability of the skew and the incomplete seam weldering of lid, thereby guarantee reliability of products.
Technical scheme of the present invention is such: the production technology of miniaturized SMD products, it comprises film, wafer cutting, solid crystalline substance and bonding wire manufacturing procedure, it is characterized in that: through after the described bonding wire operation, enter pallet successively and shift and the Reflow Soldering operation
The further technical scheme of the present invention is: enter testing procedure after the described Reflow Soldering operation; The temperature of described Reflow Soldering is 350 degrees centigrade; The package dimension of described miniaturized SMD products is 2mm * 2.5mm.
The present invention combines lid and ceramic package moment in the reflow soldering of high temperature by melts soldering tin, thereby the disposable technology of finishing spot welding and seam weldering has solved the prior art centre joint welder sealing instability of planting, the problem that weld seam is incomplete.The present invention has improved the sealing property of product, has also solved original parallel seam welding yields problem of unstable simultaneously.
Embodiment
The present invention is a kind of production technology of miniaturized SMD products, is applicable to that package dimension is the miniaturized SMD products of 2mm * 2.5mm.
Technological process of the present invention comprises film, wafer cutting, solid crystalline substance, bonding wire, pallet transfer, Reflow Soldering, test step.The film operation is that wafer is attached on the blue film, and blue film is attached on the film basket, for follow-up cutting is prepared; The wafer cutting is that the wafer on the wafer is opened with the cutter cutting and separating, for solid crystalline substance is prepared; Gu crystalline substance is that the wafer after separating is placed into wafer in the ceramic package by suction nozzle, by glue wafer and ceramic package are fixed, and the product that will consolidate behind the crystalline substance is placed in the slide glass; Bonding wire is by bonding equipment aluminum steel to be fixed on wafer and the ceramic package, and wafer and ceramic package are passed through aluminum steel conducting electrical property; Pallet shift be with the transferred product in the slide glass in loading fixture, get ready for entering Reflow Soldering; Golden tin solder Reflow Soldering technology is adopted in Reflow Soldering, by moment high temperature the welding of lid and ceramic package is fixed up; Test is that the product that assembling is finished is tested every performance by test machine, according to different clients' demand, sets different test parameter and standard, gives the client with qualified products, and defective item is directly scrapped.
Adopt the lid that has golden tin solder among the present invention, by stationary fixture that ceramic package and lid combination is close before advancing Reflow Soldering, skew can not be arranged.The highest furnace temperature can reach 350 degrees centigrade in the reflow process.
The present invention gold tin reflow soldering process has solved the difficult problem that parallel seam welding in the prior art can't adapt to the miniaturization product, has improved the sealing property of product, has also solved parallel seam welding yields problem of unstable simultaneously.The result shows according to preliminary experiment, and golden tin solder yields surpasses 99.5%.
Claims (5)
1, the production technology of miniaturized SMD products, it comprises film, wafer cutting, solid crystalline substance and bonding wire manufacturing procedure, it is characterized in that: through after the described bonding wire operation, enter pallet successively and shift and the Reflow Soldering operation.
2, the production technology of miniaturized SMD products according to claim 1 is characterized in that: enter testing procedure after the described Reflow Soldering.
3, the production technology of miniaturized SMD products according to claim 1 and 2 is characterized in that: golden tin solder Reflow Soldering technology is adopted in described Reflow Soldering, by moment high temperature the welding of lid and ceramic package is fixed up.
4, the production technology of miniaturized SMD products according to claim 3 is characterized in that: the temperature of described Reflow Soldering is 350 degrees centigrade.
5, according to the production technology of claim 1 or 4 described miniaturized SMD products, it is characterized in that: the package dimension of described miniaturized SMD products is 2mm * 2.5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910304267A CN101651110A (en) | 2009-07-13 | 2009-07-13 | Process for producing miniaturized SMD products |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910304267A CN101651110A (en) | 2009-07-13 | 2009-07-13 | Process for producing miniaturized SMD products |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101651110A true CN101651110A (en) | 2010-02-17 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910304267A Pending CN101651110A (en) | 2009-07-13 | 2009-07-13 | Process for producing miniaturized SMD products |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101651110A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102386286A (en) * | 2010-08-31 | 2012-03-21 | 隆达电子股份有限公司 | Chip transferring method and chip transferring equipment |
| CN102496593A (en) * | 2011-12-06 | 2012-06-13 | 爱普科斯科技（无锡）有限公司 | Transferring device of ceramic shell |
-
2009
- 2009-07-13 CN CN200910304267A patent/CN101651110A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102386286A (en) * | 2010-08-31 | 2012-03-21 | 隆达电子股份有限公司 | Chip transferring method and chip transferring equipment |
| CN102386286B (en) * | 2010-08-31 | 2014-04-30 | 隆达电子股份有限公司 | Chip transferring method and chip transferring equipment |
| CN102496593A (en) * | 2011-12-06 | 2012-06-13 | 爱普科斯科技（无锡）有限公司 | Transferring device of ceramic shell |
| CN102496593B (en) * | 2011-12-06 | 2013-12-25 | 爱普科斯科技（无锡）有限公司 | Transferring device of ceramic shell |
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Legal Events
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Open date: 20100217 |