CN102386286A - Chip transferring method and chip transferring equipment - Google Patents
Chip transferring method and chip transferring equipment Download PDFInfo
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- CN102386286A CN102386286A CN2010102713611A CN201010271361A CN102386286A CN 102386286 A CN102386286 A CN 102386286A CN 2010102713611 A CN2010102713611 A CN 2010102713611A CN 201010271361 A CN201010271361 A CN 201010271361A CN 102386286 A CN102386286 A CN 102386286A
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Abstract
The invention discloses a chip transferring method and chip transferring equipment. The method is used for a die bond process of a blue tape of unsorted chips. The method comprises the following steps of: providing the blue tape, a plurality of chips assembled on the blue tape and surveying and mapping data, wherein the chips are assembled on the same blue tape and belong to the same wafer and various specifications, the specifications comprise a first specification and a second specification, and the surveying and mapping data comprises the specifications of the chips and the positions of the chips corresponding to the blue tape; moving and fixing the chips belonging to the first specification to an encapsulation carrier corresponding to the first specification from the blue tape according to the surveying and mapping data; and moving and fixing the chips belonging to the second specification to an encapsulation carrier corresponding to the second specification from the blue tape according to the surveying and mapping data.
Description
Technical field
The invention relates to a kind of chip transfer techniques, particularly relevant for a kind of chip transfer method and a kind of chip-transfer apparatus.
Background technology
Because light-emitting diode has long, advantages such as volume is little, high vibration strength, the heating degree is little and power consumption is low of life-span, so light-emitting diode has been applied to indicator light, Backlight For Liquid Crystal Display Panels, traffic signal light, large-scale display billboard and the main lighting source etc. of electronic product at present.From making viewpoint, the processing procedure of light-emitting diode comprises the chip processing procedure of leading portion and the Chip Packaging of back segment.
Fig. 1 is a kind of existing chip transfer method.Please refer to Fig. 1; Shown in step S12; Carry out a testing procedure; Promptly test and a plurality ofly be disposed at blue film (blue tape), belong to the same wafer and the photoelectric characteristic of non-classified light-emitting diode chip for backlight unit still, to produce a surveying and mapping data (mapping data), wherein surveying and mapping data comprises the position and the specification of each chip.Then, shown in step S14, carry out a classifying step,, the chip of the same specification on many blue films (being close photoelectric characteristic) is moved to another blue film, make the chip that has single same size on same the blue film promptly according to aforementioned surveying and mapping data.Afterwards, shown in step S16, carry out one and expand brilliant step, promptly expand blue film, be beneficial to picking up of chip to increase the distance between these chips.At last, shown in step S18, carry out a solid brilliant step, be about to these chips that are categorized as same specification shifted and be fixed to corresponding same specification from same blue film package carrier.Package carrier for example is lead frame (leadframe) or circuit base plate (wiring substrate).
It should be noted that in said method to solid brilliant step, light-emitting diode chip for backlight unit will be gone through blue film twice from testing procedure, i.e. the light-emitting diode chip for backlight unit different blue film that institute disposes respectively before and after classifying step.Yet, use later and irretrievable blue film will be unfavorable for reducing cost and environmental protection.In addition, the secondary transferring of light-emitting diode chip for backlight unit on blue film will increase the possibility of dislocation.
Summary of the invention
The present invention provides a kind of chip transfer method, in order to chip is transferred to package carrier.
The present invention provides a kind of chip-transfer apparatus, in order to chip is transferred to package carrier.
The present invention proposes a kind of chip transfer method, supplies the blue film of unfiled chip to carry out the processing procedure of solid crystalline substance.One blue film, an a plurality of chip and surveying and mapping data that is configured on the blue film are provided; Wherein these chip configuration are on same blue film; And belong to same wafer and be plurality of specifications; These specifications comprise one first specification and one second specification, and surveying and mapping data comprises that specification and these chips under these chips is with respect to the position of blue film.According to surveying and mapping data, these chips that belong to first specification are moved and are fixed to the package carrier of corresponding first specification from blue film.According to surveying and mapping data, these chips that belong to second specification are moved and are fixed to the package carrier of corresponding second specification from blue film.
The present invention proposes a kind of chip-transfer apparatus, comprises following member.One placement platform, in order to carry a blue film and a plurality of chip, wherein these chip configuration are on blue film.One database, in order to store a surveying and mapping data, wherein surveying and mapping data comprises that specification and these chips under these chips is with respect to the position of blue film.One first filling module in order to storing a plurality of respectively package carriers of corresponding these specifications, and is supplied the package carrier of required specification.One second filling module in order to storing a plurality of respectively package carriers of corresponding these specifications, and is supplied the package carrier of required specification.One transport module is in order to transmission supply these package carriers from the first filling module or the second filling module.One picks and places module, these chips is moved to the package carrier of corresponding specification through surveying and mapping data from blue film.
Based on above-mentioned, chip transfer method of the present invention reduces the use of blue film through omitting existing classifying step, to reduce cost and to meet environmental protection.In addition, chip transfer method of the present invention can reduce the transfer number of light-emitting diode chip for backlight unit on blue film, to reduce the possibility of dislocation.In addition, chip-transfer apparatus of the present invention utilizes a plurality of filling modules to cooperate transport module that package carrier is provided, to shorten the time that chip shifts.
For letting the above-mentioned feature and advantage of the present invention can be more obviously understandable, hereinafter is special lifts embodiment, and conjunction with figs. elaborates as follows.
Description of drawings
Fig. 1 is a kind of existing chip transfer method;
Fig. 2 is the chip transfer method of one embodiment of the invention;
Fig. 3 is a kind of chip-transfer apparatus of another embodiment of the present invention.
Wherein, Reference numeral:
100: chip-transfer apparatus
102: placement platform
104: database
106: the first filling modules
106a: magazine
106b: fetching device
108: the second filling modules
108a: magazine
108b: fetching device
110: transport module
110a: fixed area
110b: glue application region
112: pick and place module
114: some rubber moulding piece
116: test module
116a: photoelectric characteristic test cell
116b: visual examination unit
118: supplying module
Embodiment
Present embodiment discloses a kind of chip transfer method; Wherein the object of institute's desire transfer is a plurality of light-emitting diode chip for backlight unit; Wherein these chips have been configured on the same blue film, have belonged to same wafer and still unfiled, and according to the difference of photoelectric characteristic, and these chips will belong to a plurality of different specifications.
Fig. 2 is the chip transfer method of one embodiment of the invention.Please refer to Fig. 2, shown in step S22, carry out a testing procedure, promptly test the photoelectric characteristic of all chips on the same blue film, to produce a surveying and mapping data, wherein surveying and mapping data comprises the specification of each chip and with respect to the position of blue film.
In the present embodiment, testing procedure more can comprise the visual examination of chip, and to check out the non-compliant chip of outward appearance, the visual examination result also can be recorded in the surveying and mapping data.
Then, shown in step S24, carry out one and expand brilliant step, promptly, be beneficial to picking up of chip through expanding blue film to increase the distance between these chips.
Afterwards; Shown in step S26, carry out a solid brilliant step, promptly according to surveying and mapping data; The chip that will belong to same specification moves and is fixed to the package carrier of corresponding this same specification from blue film; Meaning is about to the package carrier that these chips that belong to first specification moved and be fixed to corresponding first specification, and these chips that belong to second specification are moved and be fixed to the package carrier of corresponding second specification, and the rest may be inferred by analogy.
In the present embodiment, the step that chip is fixed to package carrier comprises through viscose chip is fixed to package carrier.
In the present embodiment, comprise a plurality of carrier modules corresponding to the package carrier of same specification, and these chips that belong to same specification are fixed to these carrier modules respectively.
In the present embodiment; More can on each package carrier, form a mark; Follow the mark on these package carriers of identification; To upgrade a carrier data, wherein carrier data comprises whether deposit position, the pairing specification of these package carriers and these package carriers of these package carriers have installed chip.But above-mentioned mark for example is the bar code of optical identification.
It should be noted that in the present embodiment, to solid brilliant step, in solid brilliant step, directly move and fixed chip according to surveying and mapping data from testing procedure, thus the classifying step S14 of existing Fig. 1 can be omitted, so light-emitting diode chip for backlight unit is only gone through once blue film.Must go through blue film twice compared to existing, present embodiment helps removing and can reduce cost and meet environmental protection, and can reduce the transfer number of light-emitting diode chip for backlight unit on blue film, maybe with what reduce dislocation.
Fig. 3 is a kind of chip-transfer apparatus of another embodiment of the present invention.Please refer to Fig. 2; The chip-transfer apparatus 100 of present embodiment comprises a placement platform 102, and in order to carry a blue film and a plurality of chip that is configured on the blue film, wherein these chips belong to same wafer; And, surveying and mapping data is recorded as corresponding specification according to the photoelectric characteristic of each chip.
Chip-transfer apparatus 100 more comprises a database 104, and in order to store a surveying and mapping data, wherein surveying and mapping data comprises that specification and these chips under these chips is with respect to the position of blue film.
Chip-transfer apparatus 100 more comprises one first filling module 106, in order to storing the package carrier of these specifications under a plurality of respectively corresponding these chips, and supplies the package carrier of required specification.In addition, chip-transfer apparatus 100 more comprises one second filling module 108, in order to storing the package carrier of these specifications under a plurality of respectively corresponding these chips, and supplies the package carrier of required specification.
Chip-transfer apparatus 100 more comprises a transport module 110, in order to transmission supply these package carriers from the first filling module 106 or the second filling module 108.In the present embodiment, transport module 110 can be a single track conveyor module or a single band conveyor module.Transport module 110 can comprise a fixed area 110a, temporarily to park these package carriers.
In the present embodiment, the mode that transport module 110 can parallel sequential moves the package carrier that package carrier that these same standard chips are installed and desire are installed the chip of these same or another specifications.Therefore, can shorten the time of shifting these chips on same blue film, to improve production capacity.For example, in the time will using the package carrier of corresponding A specification, transport module 110 capable of using is imported the package carrier of A specification; In the time will using the package carrier of B specification, can export the package carrier of A specification by transport module 110, and the package carrier of input B specification.
Do not illustrate among the embodiment at another, chip-transfer apparatus 100 can comprise plural filling module, and the also removable supply of transport module 110 is from these package carriers of these filling modules.
Chip-transfer apparatus 100 comprises that more one picks and places module 112, these chips is moved to the package carrier of corresponding specification through surveying and mapping data from blue film.In the present embodiment, pick and place module 112 and can chip be moved to the position on the package carrier of the fixed area 110a of transport module 110 from placement platform 102.In addition, in the present embodiment, pick and place module 112 and can be a robot module.
Therefore; Surveying and mapping data in the data-driven storehouse 104; The first filling module 106 or the second filling module 108 provide package carrier to the transport module 110 of corresponding chip specification, and placement platform 102 is attend the chip that institute's desire moves specification move to the package carrier on the transport module 110 by picking and placeing module 112.
For the package carrier of corresponding chip specification is provided, database 104 more stores package carrier data, and the package carrier data comprise whether deposit position, the pairing specification of these package carriers and these package carriers of these package carriers have installed chip.Therefore, the equipment of follow-up encapsulation procedure can come the package carrier data in the access database 104 through an information transmission system, to learn each chip specification on the package carrier of fixed chip.
In order to store the package carrier of these corresponding different chip specifications, the first filling module 106 can comprise a plurality of magazine 106a, and same magazine 106a stores a plurality of package carriers corresponding to same chip specification.In addition, the second filling module 108 also can comprise a plurality of magazine 108a, and same magazine 108a stores a plurality of package carriers corresponding to same chip specification.
For package carrier is moved to transport module 110 from magazine 106a; The first filling module 106 can comprise a fetching device 106b; In order to package carrier is moved to transport module 110 from the magazine 106a of correspondence, or package carrier is moved to corresponding magazine 106a from transport module 110.
In addition; For package carrier is moved to transport module 110 from magazine 108a; The second filling module 108 can comprise a fetching device 108b, in order to package carrier is moved to transport module 110 from the magazine 108a of correspondence, or package carrier is moved to corresponding magazine 108a from transport module 110.
For the chip that will move from placement platform 102 is fixed to package carrier; Chip-transfer apparatus 100 more can comprise a plurality of somes rubber moulding pieces 114; Wherein transport module 110 more comprises a plurality of glue application region 110b; These glue application regions 110b lays respectively at the outside of fixed area 110a, and these rubber moulding pieces 114 difference contrapositions these package carrier point glue on these glue application regions 110b.
In order to produce surveying and mapping data to a plurality of chips on the same wafer, chip-transfer apparatus 100 more can comprise a test module 116, in order to test these chips in advance, to set up surveying and mapping data.
In the present embodiment, test module 116 can comprise a photoelectric characteristic test cell 116a, with the photoelectric characteristic of test chip.In addition, test module 116 more can comprise a visual examination unit 116b, and in order to checking out the non-compliant chip of outward appearance, and the visual examination result also can be recorded in the surveying and mapping data.
In the present embodiment, chip-transfer apparatus 100 more can comprise a supplying module 118, in order to will test the wafer accomplished and under blue film move on the placement platform 102 from test module 116.
In sum, chip transfer method of the present invention reduces the use of blue film through omitting existing classifying step, to reduce cost and to meet environmental protection.In addition, chip transfer method of the present invention can reduce the transfer number of light-emitting diode chip for backlight unit on blue film, to reduce the possibility of dislocation.In addition, chip-transfer apparatus of the present invention utilizes a plurality of filling modules to cooperate transport module that package carrier is provided, to shorten the time that chip shifts.
Though the present invention with embodiment openly as above; But it is not that any those skilled in the art is not breaking away from the spirit and scope of the present invention in order to qualification the present invention; Can do a little change and modification, so protection scope of the present invention is as the criterion when looking the accompanying Claim book person of defining.
Claims (20)
1. a chip transfer method is applicable to the processing procedure that the blue film of unfiled chip is carried out solid crystalline substance, it is characterized in that this method comprises the following step:
One blue film, an a plurality of chip and surveying and mapping data that is configured on this indigo plant film are provided; Wherein a plurality of these chip configuration are on same blue film; And belong to same wafer and be plurality of specifications; Those specifications comprise one first specification and one second specification, and this surveying and mapping data comprises that specification and this chip under this chip is with respect to the position of this indigo plant film;
According to this surveying and mapping data, this chip that belongs to this first specification is moved and is fixed to a pair of package carrier that should first specification from this indigo plant film; And
According to this surveying and mapping data, this chip that belongs to this second specification is moved and is fixed to a pair of package carrier that should second specification from this indigo plant film.
2. chip transfer method as claimed in claim 1 is characterized in that, provides the step of this surveying and mapping data to comprise that this chip of test is to produce this surveying and mapping data.
3. chip transfer method as claimed in claim 2 is characterized in that, the step of testing this chip comprises the photoelectric characteristic test.
4. chip transfer method as claimed in claim 2 is characterized in that the step of testing this chip comprises visual examination.
5. chip transfer method as claimed in claim 2 is characterized in that, also comprises:
Before moving and fixing this chip, through expanding this indigo plant film to increase the distance between this chip.
6. chip transfer method as claimed in claim 1 is characterized in that, should comprise a plurality of carrier modules corresponding to package carrier of this first specification, and the chip that this belongs to this first specification respectively correspondence be fixed to this carrier module.
7. chip transfer method as claimed in claim 6 is characterized in that, the corresponding respectively step that is fixed to this carrier module of this chip is comprised:
Through viscose this chip is fixed to this carrier module.
8. chip transfer method as claimed in claim 1 is characterized in that, also comprises:
On each package carrier, form a mark; And
This mark on this package carrier of identification is to upgrade a carrier data, and wherein this carrier data comprises whether deposit position, the pairing specification of this package carrier and this package carrier of this package carrier have installed chip.
9. a chip-transfer apparatus is characterized in that, comprising:
One placement platform carries a blue film and a plurality of chip, and wherein this chip configuration is on this indigo plant film;
One database stores a surveying and mapping data, and wherein this surveying and mapping data comprises that specification and this chip under this chip is with respect to the position of this indigo plant film;
One first filling module stores a plurality ofly respectively to package carrier that should specification, and supplies this package carrier of required specification;
One second filling module stores a plurality ofly respectively to package carrier that should specification, and supplies this package carrier of required specification;
One transport module, the transmission supply is from this package carrier of this first filling module or this second filling module; And
One picks and places module, this chip is moved to the package carrier of this corresponding specification by this surveying and mapping data from this indigo plant film.
10. chip-transfer apparatus as claimed in claim 9; It is characterized in that; This database also stores package carrier data, and these package carrier data comprise whether deposit position, the pairing specification of this package carrier and this package carrier of this package carrier have installed chip.
11. chip-transfer apparatus as claimed in claim 9; It is characterized in that; This first filling module comprises a plurality of magazines and a fetching device; These a plurality of magazine stores are corresponding to the package carrier of this specification, and this fetching device moves to this transport module with this package carrier from this corresponding magazine, maybe this package carrier is moved to this corresponding magazine from this transport module.
12. chip-transfer apparatus as claimed in claim 9 is characterized in that, this transport module moves this package carrier that this package carrier that this same standard chip has been installed and desire are installed the chip of this same or another specification simultaneously.
13. chip-transfer apparatus as claimed in claim 9 is characterized in that, this transport module comprises a fixed area, and this pick and place module with this chip move to the position on this package carrier of this fixed area.
14. chip-transfer apparatus as claimed in claim 13 is characterized in that, also comprises:
A plurality of somes rubber moulding pieces, wherein this transport module also comprises a plurality of glue application regions, this glue application region lays respectively at the outside of this fixed area, and this rubber moulding piece difference contraposition this package carrier point glue on this glue application region.
15. chip-transfer apparatus as claimed in claim 9 is characterized in that, also comprises:
One test module is tested this chip, to set up this surveying and mapping data.
16. chip-transfer apparatus as claimed in claim 15 is characterized in that, this test module comprises a photoelectric characteristic test cell.
17. chip-transfer apparatus as claimed in claim 15 is characterized in that, this test module comprises a visual examination unit.
18. chip-transfer apparatus as claimed in claim 9 is characterized in that, also comprises:
One supplying module, this chip that test is accomplished and under this indigo plant film move on this placement platform from this test module.
19. chip-transfer apparatus as claimed in claim 9 is characterized in that, this transport module is a single track conveyor module or a single band conveyor module.
20. chip-transfer apparatus as claimed in claim 9 is characterized in that, this picks and places module is a robot module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010271361.1A CN102386286B (en) | 2010-08-31 | 2010-08-31 | Chip transferring method and chip transferring equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010271361.1A CN102386286B (en) | 2010-08-31 | 2010-08-31 | Chip transferring method and chip transferring equipment |
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| CN102386286A true CN102386286A (en) | 2012-03-21 |
| CN102386286B CN102386286B (en) | 2014-04-30 |
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| CN201010271361.1A Expired - Fee Related CN102386286B (en) | 2010-08-31 | 2010-08-31 | Chip transferring method and chip transferring equipment |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105225968A (en) * | 2015-10-13 | 2016-01-06 | 株洲南车时代电气股份有限公司 | Automation chip is separated attaching method |
| CN107331678A (en) * | 2017-06-16 | 2017-11-07 | 长春希达电子技术有限公司 | The integrated LED display module chip shuffling method for packing of colourity difference can be eliminated |
| CN108281361A (en) * | 2017-12-29 | 2018-07-13 | 华灿光电股份有限公司 | A kind of manufacturing method of light emitting diode indicator |
| CN113193097A (en) * | 2021-05-25 | 2021-07-30 | 鸿利智汇集团股份有限公司 | Packaging process of double-color COB |
| CN113782558A (en) * | 2021-09-14 | 2021-12-10 | 深圳市兆驰晶显技术有限公司 | Method for transferring Mini or Micro LED chip to PCB |
| CN115831812A (en) * | 2022-11-10 | 2023-03-21 | 上海威固信息技术股份有限公司 | Module identification packaging method and system for chip module design |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101540291A (en) * | 2009-03-23 | 2009-09-23 | 常州新区爱立德电子有限公司 | Automatic sorting machine for semiconductor chip |
| CN101651110A (en) * | 2009-07-13 | 2010-02-17 | 爱普科斯科技（无锡）有限公司 | Process for producing miniaturized SMD products |
| CN101664931A (en) * | 2009-09-23 | 2010-03-10 | 清华大学 | Pressure-adjustable robot arm with force sensor |
| TW201013199A (en) * | 2008-09-24 | 2010-04-01 | Microelectonics Technology Inc | Testing and sorting method for LED backend process |
| TW201104776A (en) * | 2009-07-23 | 2011-02-01 | Epistar Corp | Chip sorting apparatus |
-
2010
- 2010-08-31 CN CN201010271361.1A patent/CN102386286B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201013199A (en) * | 2008-09-24 | 2010-04-01 | Microelectonics Technology Inc | Testing and sorting method for LED backend process |
| CN101540291A (en) * | 2009-03-23 | 2009-09-23 | 常州新区爱立德电子有限公司 | Automatic sorting machine for semiconductor chip |
| CN101651110A (en) * | 2009-07-13 | 2010-02-17 | 爱普科斯科技（无锡）有限公司 | Process for producing miniaturized SMD products |
| TW201104776A (en) * | 2009-07-23 | 2011-02-01 | Epistar Corp | Chip sorting apparatus |
| CN101664931A (en) * | 2009-09-23 | 2010-03-10 | 清华大学 | Pressure-adjustable robot arm with force sensor |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105225968A (en) * | 2015-10-13 | 2016-01-06 | 株洲南车时代电气股份有限公司 | Automation chip is separated attaching method |
| CN105225968B (en) * | 2015-10-13 | 2019-01-29 | 株洲南车时代电气股份有限公司 | It automates chip and separates attaching method |
| CN107331678A (en) * | 2017-06-16 | 2017-11-07 | 长春希达电子技术有限公司 | The integrated LED display module chip shuffling method for packing of colourity difference can be eliminated |
| CN107331678B (en) * | 2017-06-16 | 2018-08-28 | 长春希达电子技术有限公司 | The integrated LED display module chip shuffling packaging method of coloration difference can be eliminated |
| CN108281361A (en) * | 2017-12-29 | 2018-07-13 | 华灿光电股份有限公司 | A kind of manufacturing method of light emitting diode indicator |
| CN108281361B (en) * | 2017-12-29 | 2019-10-08 | 华灿光电股份有限公司 | A kind of manufacturing method of light emitting diode indicator |
| CN113193097A (en) * | 2021-05-25 | 2021-07-30 | 鸿利智汇集团股份有限公司 | Packaging process of double-color COB |
| CN113782558A (en) * | 2021-09-14 | 2021-12-10 | 深圳市兆驰晶显技术有限公司 | Method for transferring Mini or Micro LED chip to PCB |
| CN115831812A (en) * | 2022-11-10 | 2023-03-21 | 上海威固信息技术股份有限公司 | Module identification packaging method and system for chip module design |
| CN115831812B (en) * | 2022-11-10 | 2024-01-26 | 上海威固信息技术股份有限公司 | Module identification packaging method and system for chip module design |
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| CN102386286B (en) | 2014-04-30 |
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