CN102332409A - Integrated manufacturing equipment for semiconductor component and manufacturing method thereof - Google Patents
Integrated manufacturing equipment for semiconductor component and manufacturing method thereof Download PDFInfo
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- CN102332409A CN102332409A CN2010102302351A CN201010230235A CN102332409A CN 102332409 A CN102332409 A CN 102332409A CN 2010102302351 A CN2010102302351 A CN 2010102302351A CN 201010230235 A CN201010230235 A CN 201010230235A CN 102332409 A CN102332409 A CN 102332409A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The invention relates to integrated manufacturing equipment for a semiconductor component and a manufacturing method thereof. The integrated manufacturing equipment for the semiconductor component comprises a track device, clamping mechanisms, a wafer stage, a packaging carrier holding device, a packaging carrier picking and placing device, a glue dispensing device and a crystal grain picking and placing device. The track device comprises a first track, a second track, a track transfer mechanism, a packaging carrier glue dispensing area and a wafer bonding area. The clamping mechanisms can clamp packaging carriers to move on the track device in an indexing way. The wafer stage can bear a wafer which contains a plurality of crystal grains. The packaging carrier holding device comprises a plurality of magazines. A plurality of packaging carriers can be contained in each magazine. The packaging carrier picking and placing device moves the packaging carriers between the clamping mechanisms and the packaging carrier holding device. The glue dispensing device is arranged above the packaging carrier glue dispensing area of the track device. The crystal grain picking and placing device is arranged above the wafer bonding area of the track device.
Description
Technical field
The present invention is the integrated manufacturing equipment and the manufacturing approach thereof of relevant a kind of semiconductor element, particularly a kind of integrated manufacturing equipment and the manufacturing approach that can on single equipment, accomplish semiconductor grain classification and sticking brilliant technology.
Background technology
In conventionally known semiconductor technology; Wafer is after light shield etching, grinding, cutting; Promptly carry out the program of wafer sort; So-called wafer sort is to each its function of crystal grain test on the wafer (for example LED crystal grain need be tested its brightness, and logic IC need test its signal, electrical etc.), to differentiate the grade of each crystal grain through tester table; Through classifier the crystal grain of different brackets on the wafer is given class wrapping more afterwards, and then get into sticking brilliant (die bond), routing (wire bond) of next stage, encapsulating packaging technologies such as (Encapsulation).Yet; Because classifier is two kinds of different machine station with sticking brilliant machine; Therefore after classifier is with the crystal granules sorted packing, need pack detection, the crystal grain quantity Calculation of quality ... Deng the required program of conversion board, in the program of these conversion boards, often all need great amount of manpower; Not only expend time in, more increase the expenditure of human cost.In addition, before the crystal grain after the packing is gluing brilliant technology, need to pack dismounting, and the packing consumptive material after removing just can't reclaim use again; Thus; Not only the cost of consumptive material is packed in cost, more produces the problem of a large amount of discarded objects, produces greatest threat for environmental protection and waste reduction.
In addition, in aforementioned manufacture process, can be more smooth and easy in order to make production procedure; Usually classifier is wanted in configuration quite with the board quantity of sticking brilliant machine, could make that classification and sticking brilliant technology can be not enough because of board, and expend the time of wait; But thus; Just need spend mint of money and purchase classifier and sticking brilliant machine, need enough big factory building and dust free room simultaneously and place these boards, cause more cost cost.
In addition, general semiconductor can be distinguished into the 2-4 class according to its characteristic usually and not wait through after testing; Yet; If the semiconductor of light-emitting diode often needs more classification, even according to its brightness, wavelength ... Can distinguish more than 100 types etc. the characteristic difference; Therefore utilize traditional classifier and sticking brilliant machine to classify and sticking brilliant technology, then need expend huger manpower.
Because above-mentioned variety of problems, so industry needs badly and proposes a kind of integrated semiconductor board, to meet the fast-developing industry ecological of semiconductor industry.
Summary of the invention
For solving the above problems, so the present invention proposes a kind of integrated manufacturing equipment of semiconductor element, comprises rail set, fixture, wafer carrier, package carrier accommodation apparatus, package carrier fetching device, point glue equipment and crystal grain fetching device.Rail set; Comprise first track, second track and track switching mechanism, track switching mechanism is arranged at an end of first track and second track, in order to connect first track and second track; Simultaneously, rail set further is provided with package carrier glue application region and viscous crystal region.Fixture is arranged on the rail set, but fixture clamping package carrier, and can be displaced into package carrier glue application region, viscous crystal region, track switching mechanism and second track on the rail set in calibration.Wafer carrier is arranged at a side of rail set and is close to viscous crystal region, and wafer carrier is carried the wafer that includes a plurality of crystal grain, and wherein each crystal grain belongs at least two crystal grain grades.The package carrier accommodation apparatus is arranged at an end of rail set, and the package carrier accommodation apparatus includes a plurality of magazines, can place a plurality of package carriers in each magazine.The package carrier fetching device is arranged between rail set and the package carrier accommodation apparatus, and the package carrier fetching device is in order between the magazine that package carrier is displaced into rail set and package carrier accommodation apparatus.At least one point glue equipment is arranged at the package carrier glue application region of rail set, in order to provide viscose glue on the package carrier of the fixture of package carrier glue application region.The crystal grain fetching device is arranged at the viscous crystal region top of wafer carrier and rail set, in order to the crystal grain on the wafer carrier is moved on the package carrier of the fixture that is positioned at viscous crystal region.
Therefore; Main purpose of the present invention is to propose a kind of integrated manufacturing equipment of semiconductor element because rail set is provided with package carrier glue application region and viscous crystal region, therefore by the package carrier fetching device by the crystal grain that picks up particular level on the wafer; Directly be positioned on the package carrier of viscous crystal region; Accomplish classification and sticking brilliant technology simultaneously, making needs the technology of two boards on same board, to accomplish originally, can simplify technology and reduce the cost that board is purchased.
A purpose more of the present invention is to propose a kind of integrated manufacturing equipment of semiconductor element; Owing in single board, integrate classification and sticking brilliant technology; Therefore can effectively reduce grading technology and be converted to packing consumptive material waste in the sticking brilliant technical process, reduce generation of waste in the production process.
Another purpose of the present invention is to propose a kind of integrated manufacturing equipment of semiconductor element, owing in single board, integrate classification and sticking brilliant technology, therefore can effectively reduce manpower required in the semiconductor technology.
Another purpose of the present invention is to propose a kind of integrated manufacturing equipment of semiconductor element, owing in single board, integrate classification and sticking brilliant technology, therefore can reduce by grading technology being converted to waste of time in the sticking brilliant technical process, effectively promotes production capacity.
In addition, the present invention reintroduces a kind of integrated manufacturing approach of semiconductor element, comprises the package carrier accommodation apparatus is provided, and the package carrier accommodation apparatus includes a plurality of magazines, can place a plurality of package carriers in each magazine.The package carrier fetching device is provided, and the package carrier fetching device is in order to take out package carrier in magazine.Rail set is provided, comprise first track, second track, with track switching mechanism, track switching mechanism is in order to link first track and second track, rail mechanism further is provided with package carrier glue application region and viscous crystal region.Fixture is provided, but each fixture clamping package carrier calibration is displaced into package carrier glue application region, viscous crystal region, track switching mechanism and second track on the rail set.This package carrier fetching device takes out package carrier and is positioned on the fixture in magazine, fixture clamping package carrier moves to the package carrier glue application region.Point glue equipment is provided, and point glue equipment can provide viscose glue on the package carrier that is positioned at the package carrier glue application region.Fixture clamping package carrier moves to viscous crystal region.Wafer carrier is provided, and wafer carrier is carried wafer, and wafer includes a plurality of crystal grain, and crystal grain belongs at least two crystal grain grades.The crystal grain fetching device is provided, and the crystal grain fetching device is positioned on the package carrier that is positioned at viscous crystal region from picking up the crystal grain with particular level on the wafer.The package carrier that the fixture clamping is stained with crystal grain moves to the package carrier fetching device, and this package carrier that the package carrier fetching device will be stained with crystal grain moves in the magazine.
Therefore; Main purpose of the present invention is to propose a kind of integrated manufacturing approach of semiconductor element because rail set is provided with package carrier glue application region and viscous crystal region, therefore by the package carrier fetching device by the crystal grain that picks up particular level on the wafer; Directly be positioned on the package carrier of viscous crystal region; Accomplish classification and sticking brilliant technology simultaneously, making needs the technology of two boards on same board, to accomplish originally, reduces the cost that board is purchased.
A purpose more of the present invention is to propose a kind of integrated manufacturing approach of semiconductor element; Owing in single board, integrate classification and sticking brilliant technology; Therefore can effectively reduce grading technology and be converted to packing consumptive material waste in the sticking brilliant technical process, reduce generation of waste in the production process.
Another purpose of the present invention is to propose a kind of integrated manufacturing approach of semiconductor element, owing in single board, integrate classification and sticking brilliant technology, therefore can effectively reduce manpower required in the semiconductor technology.
Another purpose of the present invention is to propose a kind of integrated manufacturing approach of semiconductor element, owing in single board, integrate classification and sticking brilliant technology, therefore can reduce by grading technology being converted to waste of time in the sticking brilliant technical process, effectively promotes production capacity.
Description of drawings
Because the present invention mainly is integrated manufacturing equipment and the manufacturing approach thereof that discloses a kind of semiconductor element; Wherein mentioned semiconductor element is made principle; For having common knowledge the knowledgeable, correlative technology field can understand, so, no longer do complete description with hereinafter explanation.Simultaneously, with the accompanying drawing that is hereinafter contrasted, be to express the structural representation relevant with characteristic of the present invention, also do not need according to the complete drafting of actual size, wherein:
Fig. 1 is the integrated manufacturing equipment sketch map of semiconductor element of the present invention.
Fig. 2 is package carrier accommodation apparatus of the present invention and package carrier fetching device sketch map.
Fig. 3 is the integrated manufacturing equipment sketch map of semiconductor element of the present invention.
Fig. 4 A is the integrated manufacturing approach flow chart of semiconductor element of the present invention.
Fig. 4 B is the integrated manufacturing approach flow chart of semiconductor element of the present invention.
Embodiment
Please refer to Fig. 1, be the integrated manufacturing equipment sketch map of semiconductor element of the present invention.The integrated manufacturing equipment of semiconductor element comprises rail set 11, fixture 12, wafer carrier 13, package carrier accommodation apparatus 14, package carrier fetching device 15, a plurality of point glue equipment 16 and crystal grain fetching device 17.Rail set 11 comprises first track 111, second track 112 and track switching mechanism 113; First track 111 and second track 112 are to laterally arrange; Track switching mechanism 113 is ends that are arranged at first track 111 and second track 112, and removable between first track 111 and second track 112, in order to package carrier 10 is moved to second track 112 from first track 111; In addition, rail set 11 also is provided with package carrier glue application region 116 and viscous crystal region 117.Fixture 12; Be arranged on the rail set 11; And but clamping package carrier 10 calibration are displaced into package carrier glue application region 116, viscous crystal region 117, track switching mechanism 113 and second track 112 on the rail set 11; Simultaneously, can package carrier 10 be converted to second track 112 by first track 111, through the fixture 12 on second track 112 package carrier 10 be sent back package carrier fetching device 15 again by track switching mechanism 113.Wafer carrier 13 is arranged at a side of rail set 11 and the viscous crystal region 116 of adjacent tracks device 11, and wafer carrier 13 is carried the wafer 130 that includes a plurality of crystal grain 131, and each crystal grain 131 belongs at least two crystal grain grades.Point glue equipment 16 is arranged at the package carrier glue application region 116 of rail set 11, and in the present embodiment, the quantity of point glue equipment 16 is two, can be in order to provide on the package carrier 10 of viscose glue to the fixture that is positioned at package carrier glue application region 116 12.Crystal grain fetching device 17 is arranged at viscous crystal region 117 tops of wafer carrier 13 and rail set 11; In order to the crystal grain in the wafer 130 on the wafer carrier 13 131 is moved on the package carrier 10 of the fixture 12 that is positioned at viscous crystal region 117; Because have viscose glue that point glue equipment 16 provided on the package carrier 10 this moment; Therefore placing crystal grain 131 in 10 last times of package carrier, the technology of glue crystalline substance simultaneously through crystal grain fetching device 17.The present invention further also includes solidifies platform 18, is arranged on rail set 11 and is adjacent to viscous crystal region 117, can the package carrier 10 of the chip of having adhered be heated or program curing such as illumination.
Please be simultaneously with reference to figure 1 and Fig. 2, package carrier accommodation apparatus 14 is arranged at an end of rail set 11, and package carrier accommodation apparatus 14 includes a plurality of magazines 141, can ccontaining a plurality of package carriers 10 in each magazine 141.Package carrier fetching device 15; Be arranged between rail set 11 and the package carrier accommodation apparatus 14; Comprise twin shaft mobile platform 151 and connected fetching device 152, by twin shaft mobile platform 151 fetching device 152 can be moved on a vertical plane, simultaneously; Package carrier fetching device 15 can take out package carrier 10 by the magazine in the fetching device 152 self-styled loading body accommodation apparatus 14 141, and package carrier 10 is moved to the fixture 12 on the rail set 11.
When carrying out classification and gluing brilliant technology, package carrier 10 at first is in the magazine 141 of self-styled as previously mentioned loading body accommodation apparatus 14, and the taking-up of being incited somebody to action by fetching device 152 is positioned on the twin shaft mobile platform 151.151 of twin shaft mobile platforms that are loaded with package carrier 10 move near rail set 11 places, and package carrier 10 is moved on the fixture 12 on the rail set 11.Afterwards, be loaded with first track 111 of the fixture 12 of package carrier 10, move to package carrier glue application region 116 along rail set 11.Provide colloid to the package carrier that rest on package carrier glue application region 116 10 on by point glue equipment 16 this moment; Then; Fixture 12 moves to viscous crystal region 117 along first track 111 with package carrier 10 again; In the wafer 130 of crystal grain fetching device 17 on wafer microscope carrier 13, pick up out crystal grain 131 with particular characteristics, the crystal grain 131 that will have particular characteristics again be in place on the package carrier 10 of viscous crystal region 117, carry out bonding.Afterwards; The package carrier 10 that fixture 12 will be stained with crystal grain 131 again moves to curing platform 18; Program curings such as platform 18 heats through solidifying, illumination can be stabilized on the package carrier 10 crystal grain 131, then; Fixture 12 moves to track switching mechanism 113 with package carrier 10; By track switching mechanism 113 package carrier 10 is moved to second track 112, then package carrier 10 is held on the fixture 12 and moves to the end near package carrier fetching device 15 along second track 112, has the fixture 12 of package carrier 10 second track 112 certainly of crystal grain 131 to move in the magazine 141 cementation by package carrier fetching device 15.
Please refer to Fig. 3, in the integrated manufacturing equipment of semiconductor element of the present invention, package carrier stack apparatus 21 and package carrier grabbing device 22 can be set further.Package carrier stack apparatus 21 is arranged at a side and the contiguous package carrier glue application region 116 of rail set 11, but the ccontaining a plurality of package carriers 10 of package carrier stack apparatus 21 storehouses.Package carrier grabbing device 22; Be arranged between package carrier glue application region 116 and the package carrier stack apparatus 21; Can move along first track 111 by fixture 12 again in order to package carrier 10 is grasped the fixture 12 to the rail set 11, to accomplish technologies such as some glue and sticking crystalline substance.In addition; The present invention also can further be provided with control device 19 again; Control device 19 may command package carrier fetching devices 15 take out package carrier 10 from the ad-hoc location that is encapsulated in the carrier accommodating device 14; Control the package carrier 10 that package carrier fetching device 15 will be stained with crystal grain 131 again and insert the position of taking out originally, perhaps in addition in the certain location.Again further; The present invention still is provided with wafer hand basket elevating mechanism 31 and wafer transfer mechanism 32; Wherein, Wafer hand basket elevating mechanism 31 is arranged on a side of wafer carrier 13, but wafer accommodating device (not icon) in the while wafer hand basket elevating mechanism 31, and the wafer accommodating device can be brilliant boat or wafer hand basket; In the wafer accommodating device, can be placed with the wafer 130 of multi-disc; And wafer transfer mechanism 32 is arranged between wafer hand basket elevating mechanism 31 and the wafer carrier 13, mainly is in order to the wafer in the wafer accommodating device 130 is transferred load on the wafer carrier 13, makes crystal grain 131 that crystal grain fetching device 17 can pick up particular level from the wafer on the wafer microscope carrier 13 130 to carry out subsequent technique; After waiting to have picked up the crystal grain 131 of particular level, by wafer transfer mechanism 32 wafer 130 is transferred load in the wafer accommodating device on wafer microscope carrier 13 again.In addition, on magazine 141 or package carrier 10, then can carry information labels (not icon), so that control device 19 identifications and note down the deposit position and the sticking crystal grain situation of putting of this package carrier 10.The aforementioned information label can be that coloured label, one-dimensional bar code, two-dimensional bar or RFID label etc. can scan the label that reads by machinery.
With reference to figure 4, be the integrated manufacturing approach flow chart of semiconductor element of the present invention.At first like step 401: the package carrier accommodation apparatus is provided, and the package carrier accommodation apparatus includes a plurality of magazines, can place a plurality of package carriers in each magazine.Like step 402: the package carrier fetching device is provided, and the package carrier fetching device can take out package carrier in magazine.Like step 403: rail set is provided, comprise first track, second track, with track switching mechanism, track switching mechanism can link first track and second track, in addition, rail mechanism further is provided with package carrier glue application region and viscous crystal region.Like step 404: a plurality of fixtures are provided, and each fixture can move on rail set.Step 405: the package carrier fetching device takes out package carrier and is positioned on the fixture in magazine, and fixture clamping package carrier moves to the package carrier glue application region.Step 406: point glue equipment is provided, and point glue equipment provides viscose glue on the package carrier that is positioned at the package carrier glue application region.Step 407: fixture clamping package carrier moves to viscous crystal region.Step 408: wafer carrier is provided, and wafer carrier is carried wafer, and wafer includes a plurality of crystal grain, and crystal grain belongs at least two crystal grain grades.Step 409: the crystal grain fetching device is provided, and the crystal grain fetching device is positioned on the package carrier that is positioned at viscous crystal region from picking up the crystal grain with particular level on the wafer.Step 410: the package carrier that the fixture clamping is stained with crystal grain moves to the package carrier fetching device.Step 411: this package carrier that the package carrier fetching device will be stained with crystal grain moves in the magazine.
The integrated manufacturing approach of semiconductor element of the present invention can further comprise a program curing after step 409, can be provided with the curing platform in the position of the contiguous viscous crystal region of rail set, so that crystal grain is stable on the package carrier.In addition; In the integrated step of manufacturing of semiconductor element of the present invention; Further comprise the package carrier fetching device in the control device controlled step 405; In the magazine of ad-hoc location, take out package carrier, and the package carrier fetching device in the step 411 is inserted package carrier in the magazine ad-hoc location.Moreover; In the integrated manufacturing approach of semiconductor element of the present invention, can further comprise the wafer loading again and shift out step, mainly be by wafer hand basket elevating mechanism and wafer transfer mechanism; Wafer is loaded or shifts out wafer carrier; Wafer hand basket elevating mechanism is with can ccontaining wafer accommodating device, and the wafer accommodating device can be brilliant boat or wafer hand basket, in the wafer accommodating device, can carry the wafer of multi-disc; The wafer transfer mechanism transfers load to wafer carrier with wafer in can be in the wafer accommodating device, and from the wafer microscope carrier wafer is transferred load in the wafer accommodating device.
The above is merely preferred embodiment of the present invention, is not in order to limit interest field of the present invention; Simultaneously above description should be understood and implemented for the special personage of correlative technology field, so other does not break away from the equivalence of being accomplished under the disclosed spirit and change or modification, all should be included in the claim scope.
Claims (10)
1. the integrated manufacturing equipment of a semiconductor element comprises:
One rail set; Comprise first track, second track and track switching mechanism; This track switching mechanism is arranged at an end of this first track and this second track; And be displaced between this first track and this second track, this rail set further is provided with a package carrier glue application region and a viscous crystal region;
Fixture, this fixture is arranged on this rail mechanism, but this fixture clamping one package carrier, and calibration moves as for this package carrier glue application region on this rail set, this viscous crystal region, this track switching mechanism and this second track;
One wafer carrier is arranged at a side of this rail set and is close to this viscous crystal region, and this wafer carrier is carried a wafer, and this wafer includes a plurality of crystal grain, and said crystal grain belongs at least two crystal grain grades;
One package carrier accommodation apparatus is arranged at an end of this rail set, and this package carrier accommodation apparatus includes a plurality of magazines, can place a plurality of package carriers in each magazine;
One package carrier fetching device is arranged between this rail set and this package carrier accommodation apparatus, and this package carrier fetching device is in order to move this package carrier between the magazine of this rail mechanism and this package carrier accommodation apparatus;
At least one point glue equipment is arranged at the package carrier glue application region of this rail set, in order to provide viscose glue on the package carrier of this fixture of this package carrier glue application region; And
One crystal grain fetching device is arranged at above the viscous crystal region of this wafer carrier and this rail set, in order to the crystal grain on this wafer carrier is moved on the package carrier of this fixture that is positioned at this viscous crystal region.
2. according to the integrated manufacturing equipment of the described semiconductor element of claim 1, wherein this package carrier fetching device comprises a twin shaft mobile platform and a connected fetching device, and this fetching device is moved on a vertical plane.
3. according to the integrated manufacturing equipment of the described semiconductor element of claim 1, further comprise one and solidify platform, be arranged at this rail set and contiguous this viscous crystal region, so that package carrier and adhesion crystal grain are on it imposed a program curing.
4. according to the integrated manufacturing equipment of the described semiconductor element of claim 1; Further comprise a package carrier stack apparatus and a package carrier grabbing device; This package carrier stack apparatus is arranged at a side of this rail set; This package carrier stack apparatus storehouse has a plurality of package carriers, and this package carrier grabbing device is arranged between this package carrier glue application region and this package carrier stack apparatus, in order to package carrier is moved to the fixture on this rail set.
5. according to the integrated manufacturing equipment of the described semiconductor element of claim 1, further include a control device, the ad-hoc location of the self-styled loading body of this control device this package carrier fetching device of control accommodating device takes out and inserts this package carrier.
6. according to the integrated manufacturing equipment of the described semiconductor element of claim 1; Further include a wafer hand basket elevating mechanism and a wafer transfer mechanism; This wafer hand basket elevating mechanism is arranged at a side of this wafer carrier, and this wafer mounted mechanism is arranged between this wafer hand basket elevating mechanism and this wafer carrier.
7. the integrated manufacturing approach of a semiconductor element comprises:
One package carrier accommodation apparatus is provided, and this package carrier accommodation apparatus includes a plurality of magazines, can place a plurality of package carriers in each magazine; One package carrier fetching device is provided, and this package carrier fetching device is in order to take out package carrier in this magazine;
One rail set is provided, this rail set comprise first track, second track, with track switching mechanism, this track switching mechanism is in order to link first track and second track, this rail set further is provided with a package carrier glue application region and a viscous crystal region;
One fixture is provided, and this fixture is arranged on this rail mechanism, but this fixture clamping one package carrier, and calibration moves as for this package carrier glue application region on this rail set, this viscous crystal region, this track switching mechanism and this second track;
This package carrier fetching device takes out package carrier and is positioned on this fixture in this magazine, this this package carrier of fixture clamping moves to this package carrier glue application region;
At least one point glue equipment is provided, and this point glue equipment provides viscose glue on this package carrier that is positioned at this package carrier glue application region;
This fixture carries this package carrier and moves to this viscous crystal region;
One wafer carrier is provided, and this wafer carrier is carried a wafer, and this wafer includes a plurality of crystal grain, and this crystal grain belongs at least two crystal grain grades,
One crystal grain fetching device is provided, and this crystal grain fetching device picks up this crystal grain with particular level on this wafer, is positioned on the package carrier that is positioned at this viscous crystal region again;
This package carrier that this fixture clamping is stained with this crystal grain moves to this package carrier fetching device; And
This package carrier that this package carrier fetching device will be stained with this crystal grain moves in this magazine.
8. according to the integrated manufacturing approach of the described semiconductor element of claim 7, further comprise a program curing, contiguous this viscous crystal region of this rail set is provided with one and solidifies platform, so that this crystal grain is stable on this package carrier.
9. according to the integrated manufacturing approach of the described semiconductor element of claim 7, further comprise by a control device and control this package carrier fetching device, take out and insert this package carrier from this package carrier accommodating device ad-hoc location.
10. according to the integrated manufacturing approach of the described semiconductor element of claim 7; Further comprise a wafer and load and shift out step; Comprise a wafer hand basket elevating mechanism and a wafer transfer mechanism are provided that this wafer hand basket elevating mechanism carries the multi-disc wafer in order to a ccontaining wafer accommodating device in this wafer accommodating device; This wafer transfer mechanism transfers load to this wafer carrier with this wafer in this wafer accommodating device, and this wafer carrier transfers load to this wafer in this wafer accommodating device certainly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN 201010230235 CN102332409B (en) | 2010-07-13 | 2010-07-13 | Integrated manufacturing equipment for semiconductor component and manufacturing method thereof |
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| CN 201010230235 CN102332409B (en) | 2010-07-13 | 2010-07-13 | Integrated manufacturing equipment for semiconductor component and manufacturing method thereof |
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| CN102332409B CN102332409B (en) | 2013-04-17 |
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| CN110718492A (en) * | 2019-09-23 | 2020-01-21 | 苏州均华精密机械有限公司 | Tray body collection module and method thereof |
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| CN110718492A (en) * | 2019-09-23 | 2020-01-21 | 苏州均华精密机械有限公司 | Tray body collection module and method thereof |
| CN113299577A (en) * | 2020-02-21 | 2021-08-24 | 均华精密工业股份有限公司 | Die bonder |
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