CN102386286B - Chip transferring method and chip transferring equipment - Google Patents
Chip transferring method and chip transferring equipment Download PDFInfo
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- CN102386286B CN102386286B CN201010271361.1A CN201010271361A CN102386286B CN 102386286 B CN102386286 B CN 102386286B CN 201010271361 A CN201010271361 A CN 201010271361A CN 102386286 B CN102386286 B CN 102386286B
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Abstract
The invention discloses a chip transferring method and chip transferring equipment. The method is used for a die bond process of a blue tape of unsorted chips. The method comprises the following steps of: providing the blue tape, a plurality of chips assembled on the blue tape and surveying and mapping data, wherein the chips are assembled on the same blue tape and belong to the same wafer and various specifications, the specifications comprise a first specification and a second specification, and the surveying and mapping data comprises the specifications of the chips and the positions of the chips corresponding to the blue tape; moving and fixing the chips belonging to the first specification to an encapsulation carrier corresponding to the first specification from the blue tape according to the surveying and mapping data; and moving and fixing the chips belonging to the second specification to an encapsulation carrier corresponding to the second specification from the blue tape according to the surveying and mapping data.
Description
Technical field
The invention relates to a kind of chip transfer techniques, particularly relevant for a kind of chip transfer method and a kind of chip-transfer apparatus.
Background technology
Because light-emitting diode has that the life-span is long, volume is little, high vibration strength, the advantage such as heating degree is little and power consumption is low, so light-emitting diode has been applied at present the indicator light of electronic product, the backlight of liquid crystal display, traffic signal light, large-scale display billboard and main lighting source etc.From manufacturing viewpoint, the processing procedure of light-emitting diode comprises the chip processing procedure of leading portion and the chip package of back segment.
Fig. 1 is a kind of existing chip transfer method.Please refer to Fig. 1, as shown in step S12, carry out a testing procedure, test and be a plurality ofly disposed at blue film (blue tape), belong to same wafer and the photoelectric characteristic of non-classified light-emitting diode chip for backlight unit still, to produce a surveying and mapping data (mapping data), wherein surveying and mapping data comprises position and the specification of each chip.Then, as shown in step S14, carry out a classification step, according to aforementioned surveying and mapping data, the chip of the same specification on multiple blue films (being close photoelectric characteristic) is moved to another blue film, make to have on same blue film the chip of single-phase same specification.Afterwards, as shown in step S16, carry out the brilliant step of an expansion, expand blue film to increase the distance between these chips, be beneficial to picking up of chip.Finally, as shown in step S18, carry out a die bond step, be about to these chips that are categorized as same specification and from same blue film, shift and be fixed to the package carrier of corresponding same specification.Package carrier is for example lead frame (leadframe) or circuit base plate (wiring substrate).
It should be noted that in said method, from testing procedure to die bond step, light-emitting diode chip for backlight unit will be gone through blue film twice, the blue film of difference that light-emitting diode chip for backlight unit configures respectively before and after classification step.Yet, use later and irretrievable blue film will be unfavorable for reducing costs and environmental protection.In addition, the secondary transferring of light-emitting diode chip for backlight unit on blue film will increase the possibility of dislocation.
Summary of the invention
The invention provides a kind of chip transfer method, in order to chip is transferred to package carrier.
The invention provides a kind of chip-transfer apparatus, in order to chip is transferred to package carrier.
The present invention proposes a kind of chip transfer method, carries out the processing procedure of die bond for the blue film of unfiled chip.One blue film, a plurality of chip and surveying and mapping data being configured on blue film are provided, wherein these chip configuration are on same blue film, and belong to same wafer and for plurality of specifications, these specifications comprise one first specification and one second specification, and surveying and mapping data comprises that specification under these chips and these chips are with respect to the position of blue film.According to surveying and mapping data, the chip that these are belonged to the first specification moves and is fixed to the package carrier of corresponding first specification from blue film.According to surveying and mapping data, the chip that these are belonged to the second specification moves and is fixed to the package carrier of corresponding second specification from blue film.
The present invention proposes a kind of chip-transfer apparatus, comprises following member.One placement platform, in order to carry a blue film and a plurality of chip, wherein these chip configuration are on blue film.One database, in order to store a surveying and mapping data, wherein surveying and mapping data comprises that specification under these chips and these chips are with respect to the position of blue film.One first filling module, in order to store the package carrier of a plurality of respectively corresponding these specifications, and supplies the package carrier of required specification.One second filling module, in order to store the package carrier of a plurality of respectively corresponding these specifications, and supplies the package carrier of required specification.One transport module, these package carriers in order to transmission supply from the first filling module or the second filling module.One picks and places module, by surveying and mapping data, these chips is moved to the package carrier of corresponding specification from blue film.
Based on above-mentioned, chip transfer method of the present invention reduces the use of blue film by omitting existing classification step, to reduce costs and to meet environmental protection.In addition, chip transfer method of the present invention can reduce the transfer number of light-emitting diode chip for backlight unit on blue film, to reduce the possibility of dislocation.In addition, chip-transfer apparatus of the present invention utilizes a plurality of filling modules to coordinate transport module that package carrier is provided, the time of shifting to shorten chip.
For above-mentioned feature and advantage of the present invention can be become apparent, special embodiment below, and coordinate accompanying drawing to be described in detail below.
Accompanying drawing explanation
Fig. 1 is a kind of existing chip transfer method;
Fig. 2 is the chip transfer method of one embodiment of the invention;
Fig. 3 is a kind of chip-transfer apparatus of another embodiment of the present invention.
Wherein, Reference numeral:
100: chip-transfer apparatus
102: placement platform
104: database
106: the first filling modules
106a: magazine
106b: fetching device
108: the second filling modules
108a: magazine
108b: fetching device
110: transport module
110a: fixed area
110b: glue application region
112: pick and place module
114: some rubber moulding piece
116: test module
116a: photoelectric characteristic test cell
116b: visual examination unit
118: supplying module
Embodiment
The present embodiment discloses a kind of chip transfer method, wherein the object that shifts of wish be a plurality of light-emitting diode chip for backlight unit, wherein these chips have been configured on same blue film, have belonged to same wafer and not yet classification, and according to the difference of photoelectric characteristic, these chips will belong to a plurality of different specifications.
Fig. 2 is the chip transfer method of one embodiment of the invention.Please refer to Fig. 2, as shown in step S22, carry out a testing procedure, test the photoelectric characteristic of all chips on same blue film, to produce a surveying and mapping data, wherein surveying and mapping data comprises the specification of each chip and with respect to the position of blue film.
In the present embodiment, testing procedure more can comprise the visual examination of chip, and to check out the non-compliant chip of outward appearance, visual examination result also can be recorded in surveying and mapping data.
Then, as shown in step S24, carry out the brilliant step of an expansion,, by expanding blue film to increase the distance between these chips, be beneficial to picking up of chip.
Afterwards, as shown in step S26, carry out a die bond step, according to surveying and mapping data, the chip that belongs to same specification is moved and is fixed to the package carrier of corresponding this same specification from blue film, meaning is about to the package carrier that these chips that belong to the first specification moved and be fixed to corresponding first specification, and the chip that these are belonged to the second specification moves and be fixed to the package carrier of corresponding second specification, and the rest may be inferred by analogy.
In the present embodiment, the step that chip is fixed to package carrier comprises by viscose chip is fixed to package carrier.
In the present embodiment, corresponding to the package carrier of same specification, comprise a plurality of carrier modules, and these chips that belong to same specification are fixed to respectively these carrier modules.
In the present embodiment, more can on each package carrier, form a mark, follow the mark on these package carriers of identification, to upgrade a carrier data, wherein carrier data comprises whether deposit position, the corresponding specification of these package carriers and these package carriers of these package carriers have installed chip.Above-mentioned mark be for example can optical identification bar code.
It should be noted that in the present embodiment, from testing procedure to die bond step, in die bond step, directly according to surveying and mapping data, move and fixed chip, thus the classification step S14 of existing Fig. 1 can be omitted, so light-emitting diode chip for backlight unit is only gone through once blue film.Compared to existing, must go through blue film twice, the present embodiment is conducive to except reducing costs and meet environmental protection, and can reduce the transfer number of light-emitting diode chip for backlight unit on blue film, may with what reduce dislocation.
Fig. 3 is a kind of chip-transfer apparatus of another embodiment of the present invention.Please refer to Fig. 2, the chip-transfer apparatus 100 of the present embodiment comprises a placement platform 102, and in order to carry a blue film and a plurality of chip being configured on blue film, wherein these chips belong to same wafer, and according to the photoelectric characteristic of each chip, surveying and mapping data is recorded as to corresponding specification.
Chip-transfer apparatus 100 more comprises a database 104, and in order to store a surveying and mapping data, wherein surveying and mapping data comprises that specification under these chips and these chips are with respect to the position of blue film.
Chip-transfer apparatus 100 more comprises one first filling module 106, in order to store the package carrier of these specifications under a plurality of respectively corresponding these chips, and supplies the package carrier of required specification.In addition, chip-transfer apparatus 100 more comprises one second filling module 108, in order to store the package carrier of these specifications under a plurality of respectively corresponding these chips, and supplies the package carrier of required specification.
Chip-transfer apparatus 100 more comprises a transport module 110, these package carriers in order to transmission supply from the first filling module 106 or the second filling module 108.In the present embodiment, transport module 110 can be a single track conveyor module or a single band conveyor module.Transport module 110 can comprise a fixed area 110a, temporarily to park these package carriers.
In the present embodiment, the mode that transport module 110 can parallel sequential moves the package carrier that the package carrier of these same standard chips and wish are installed the chip of these same or another specifications is installed.Therefore, can shorten the time of shifting these chips on same blue film, to improve production capacity.For example, in the time will using the package carrier of corresponding A specification, can utilize transport module 110 to input the package carrier of A specification; In the time will using the package carrier of B specification, can export by transport module 110 package carrier of A specification, and input the package carrier of B specification.
At another, do not illustrate in embodiment, chip-transfer apparatus 100 can comprise plural filling module, and transport module 110 also removable supply from these filling modules these package carriers.
Chip-transfer apparatus 100 more comprises that one picks and places module 112, by surveying and mapping data, these chips is moved to the package carrier of corresponding specification from blue film.In the present embodiment, pick and place module 112 and chip can be moved to position on the package carrier of the fixed area of transport module 110 110a from placement platform 102.In addition, in the present embodiment, pick and place module 112 and can be a robot module.
Therefore, surveying and mapping data in data-driven storehouse 104, the first filling module 106 or the second filling module 108 provide the package carrier of corresponding chip specification to transport module 110, and move to the package carrier on transport module 110 by picking and placeing the chip that module 112 moves specification by institute's wish on placement platform 102.
For the package carrier of corresponding chip specification is provided, database 104 more stores package carrier data, and package carrier data comprise whether deposit position, the corresponding specification of these package carriers and these package carriers of these package carriers have installed chip.Therefore, the equipment of follow-up encapsulation procedure can carry out the package carrier data in access database 104 by an information transmission system, to learn each chip specification on the package carrier of fixed chip.
In order to store the package carrier of these corresponding different chip specifications, the first filling module 106 can comprise a plurality of magazine 106a, and same magazine 106a stores a plurality of package carriers corresponding to same chip specification.In addition, the second filling module 108 also can comprise a plurality of magazine 108a, and same magazine 108a stores a plurality of package carriers corresponding to same chip specification.
For package carrier is moved to transport module 110 from magazine 106a, the first filling module 106 can comprise a fetching device 106b, in order to package carrier is moved to transport module 110 from corresponding magazine 106a, or package carrier is moved to corresponding magazine 106a from transport module 110.
In addition, for package carrier is moved to transport module 110 from magazine 108a, the second filling module 108 can comprise a fetching device 108b, in order to package carrier is moved to transport module 110 from corresponding magazine 108a, or package carrier is moved to corresponding magazine 108a from transport module 110.
For the mobile chip from placement platform 102 is fixed to package carrier, chip-transfer apparatus 100 more can comprise a plurality of somes rubber moulding pieces 114, wherein transport module 110 more comprises a plurality of glue application region 110b, these glue application regions 110b lays respectively at the outside of fixed area 110a, and these rubber moulding pieces 114 difference contrapositions these package carrier point glue on the 110b of these glue application regions.
For a plurality of chips on same wafer produce surveying and mapping data, chip-transfer apparatus 100 more can comprise a test module 116, in order to test in advance these chips, to set up surveying and mapping data.
In the present embodiment, test module 116 can comprise a photoelectric characteristic test cell 116a, with the photoelectric characteristic of test chip.In addition, test module 116 more can comprise a visual examination unit 116b, and in order to check out the non-compliant chip of outward appearance, and visual examination result also can be recorded in surveying and mapping data.
In the present embodiment, chip-transfer apparatus 100 more can comprise a supplying module 118, in order to wafer that test is completed and under blue film from test module 116, move to placement platform 102.
In sum, chip transfer method of the present invention reduces the use of blue film by omitting existing classification step, to reduce costs and to meet environmental protection.In addition, chip transfer method of the present invention can reduce the transfer number of light-emitting diode chip for backlight unit on blue film, to reduce the possibility of dislocation.In addition, chip-transfer apparatus of the present invention utilizes a plurality of filling modules to coordinate transport module that package carrier is provided, the time of shifting to shorten chip.
Although the present invention with embodiment openly as above; but it is not in order to limit the present invention, any those skilled in the art, without departing from the spirit and scope of the present invention; can do a little change and modification, therefore protection scope of the present invention is when being as the criterion depending on accompanying claims person of defining.
Claims (19)
1. a chip transfer method, is applicable to the blue film of unfiled chip to carry out the processing procedure of die bond, it is characterized in that, the method comprises the following step:
One blue film, a plurality of chip and surveying and mapping data being configured on this indigo plant film are provided, wherein a plurality of these chip configuration are on same blue film, and belong to same wafer and for plurality of specifications, those specifications comprise one first specification and one second specification, and this surveying and mapping data comprises that specification under this chip and this chip are with respect to the position of this indigo plant film;
According to this surveying and mapping data, the chip that this is belonged to this first specification moves and is fixed to a pair of package carrier that should the first specification from this indigo plant film;
According to this surveying and mapping data, the chip that this is belonged to this second specification moves and is fixed to a pair of package carrier that should the second specification from this indigo plant film;
On each package carrier, form a mark; And
This mark on this package carrier of identification is to upgrade a carrier data, and wherein this carrier data comprises whether deposit position, the corresponding specification of this package carrier and this package carrier of this package carrier have installed chip.
2. chip transfer method as claimed in claim 1, is characterized in that, provides the step of this surveying and mapping data to comprise that this chip of test is to produce this surveying and mapping data.
3. chip transfer method as claimed in claim 2, is characterized in that, the step of testing this chip comprises photoelectric characteristic test.
4. chip transfer method as claimed in claim 2, is characterized in that, the step of testing this chip comprises visual examination.
5. chip transfer method as claimed in claim 2, is characterized in that, also comprises:
Before moving and fixing this chip, by expanding this indigo plant film to increase the distance between this chip.
6. chip transfer method as claimed in claim 1, is characterized in that, should comprise a plurality of carrier modules corresponding to package carrier of this first specification, and the chip that this belongs to this first specification respectively correspondence be fixed to this carrier module.
7. chip transfer method as claimed in claim 6, is characterized in that, by this chip respectively the corresponding step that is fixed to this carrier module comprise:
By viscose, this chip is fixed to this carrier module.
8. a chip-transfer apparatus, is characterized in that, comprising:
One placement platform, carrying one blue film and a plurality of chip, wherein this chip configuration is on this indigo plant film;
One database, stores a surveying and mapping data and package carrier data, and wherein this surveying and mapping data comprises that specification under this chip and this chip are with respect to the position of this indigo plant film;
One first filling module, stores a plurality ofly respectively to package carrier that should specification, and supplies this package carrier of required specification;
One second filling module, stores a plurality ofly respectively to package carrier that should specification, and supplies this package carrier of required specification;
One transport module, transmission supply is from this package carrier of this first filling module or this second filling module;
One picks and places module, by this surveying and mapping data, this chip is moved to the package carrier of this corresponding specification from this indigo plant film; And
One information transmission system, these package carrier data in this database of access, to learn the chip specification on each package carrier of having fixed this chip.
9. chip-transfer apparatus as claimed in claim 8, is characterized in that, these package carrier data comprise whether deposit position, the corresponding specification of this package carrier and this package carrier of this package carrier have installed chip.
10. chip-transfer apparatus as claimed in claim 8, it is characterized in that, this the first filling module comprises a plurality of magazines and a fetching device, the plurality of magazine stores is corresponding to the package carrier of this specification, and this fetching device moves to this transport module by this package carrier from this corresponding magazine, maybe this package carrier is moved to this corresponding magazine from this transport module.
11. chip-transfer apparatus as claimed in claim 8, is characterized in that, this transport module simultaneously mobile this package carrier that this same standard chip has been installed and wish is installed this package carrier of the chip of this same or another specification.
12. chip-transfer apparatus as claimed in claim 8, is characterized in that, this transport module comprises a fixed area, and this pick and place module by this chip move to position on this package carrier of this fixed area.
13. chip-transfer apparatus as claimed in claim 12, is characterized in that, also comprise:
A plurality of somes rubber moulding pieces, wherein this transport module also comprises a plurality of glue application regions, this glue application region lays respectively at the outside of this fixed area, and this rubber moulding piece difference contraposition this package carrier point glue on this glue application region.
14. chip-transfer apparatus as claimed in claim 8, is characterized in that, also comprise:
One test module, tests this chip, to set up this surveying and mapping data.
15. chip-transfer apparatus as claimed in claim 14, is characterized in that, this test module comprises a photoelectric characteristic test cell.
16. chip-transfer apparatus as claimed in claim 14, is characterized in that, this test module comprises a visual examination unit.
17. chip-transfer apparatus as claimed in claim 8, is characterized in that, also comprise:
One supplying module, this chip that test is completed and under this indigo plant film from this test module, move to this placement platform.
18. chip-transfer apparatus as claimed in claim 8, is characterized in that, this transport module is a single track conveyor module or a single band conveyor module.
19. chip-transfer apparatus as claimed in claim 8, is characterized in that, this picks and places module is a robot module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010271361.1A CN102386286B (en) | 2010-08-31 | 2010-08-31 | Chip transferring method and chip transferring equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010271361.1A CN102386286B (en) | 2010-08-31 | 2010-08-31 | Chip transferring method and chip transferring equipment |
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| Publication Number | Publication Date |
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| CN102386286A CN102386286A (en) | 2012-03-21 |
| CN102386286B true CN102386286B (en) | 2014-04-30 |
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| CN201010271361.1A Expired - Fee Related CN102386286B (en) | 2010-08-31 | 2010-08-31 | Chip transferring method and chip transferring equipment |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105225968B (en) * | 2015-10-13 | 2019-01-29 | 株洲南车时代电气股份有限公司 | It automates chip and separates attaching method |
| CN107331678B (en) * | 2017-06-16 | 2018-08-28 | 长春希达电子技术有限公司 | The integrated LED display module chip shuffling packaging method of coloration difference can be eliminated |
| CN108281361B (en) * | 2017-12-29 | 2019-10-08 | 华灿光电股份有限公司 | A kind of manufacturing method of light emitting diode indicator |
| CN113193097A (en) * | 2021-05-25 | 2021-07-30 | 鸿利智汇集团股份有限公司 | Packaging process of double-color COB |
| CN113782558A (en) * | 2021-09-14 | 2021-12-10 | 深圳市兆驰晶显技术有限公司 | Method for transferring Mini or Micro LED chip to PCB |
| CN115831812B (en) * | 2022-11-10 | 2024-01-26 | 上海威固信息技术股份有限公司 | Module identification packaging method and system for chip module design |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101540291A (en) * | 2009-03-23 | 2009-09-23 | 常州新区爱立德电子有限公司 | Automatic sorting machine for semiconductor chip |
| CN101651110A (en) * | 2009-07-13 | 2010-02-17 | 爱普科斯科技（无锡）有限公司 | Process for producing miniaturized SMD products |
| CN101664931A (en) * | 2009-09-23 | 2010-03-10 | 清华大学 | Pressure-adjustable robot arm with force sensor |
| TW201013199A (en) * | 2008-09-24 | 2010-04-01 | Microelectonics Technology Inc | Testing and sorting method for LED backend process |
| TW201104776A (en) * | 2009-07-23 | 2011-02-01 | Epistar Corp | Chip sorting apparatus |
-
2010
- 2010-08-31 CN CN201010271361.1A patent/CN102386286B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201013199A (en) * | 2008-09-24 | 2010-04-01 | Microelectonics Technology Inc | Testing and sorting method for LED backend process |
| CN101540291A (en) * | 2009-03-23 | 2009-09-23 | 常州新区爱立德电子有限公司 | Automatic sorting machine for semiconductor chip |
| CN101651110A (en) * | 2009-07-13 | 2010-02-17 | 爱普科斯科技（无锡）有限公司 | Process for producing miniaturized SMD products |
| TW201104776A (en) * | 2009-07-23 | 2011-02-01 | Epistar Corp | Chip sorting apparatus |
| CN101664931A (en) * | 2009-09-23 | 2010-03-10 | 清华大学 | Pressure-adjustable robot arm with force sensor |
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