CN105225968A - Automation chip is separated attaching method - Google Patents
Automation chip is separated attaching method Download PDFInfo
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- CN105225968A CN105225968A CN201510657357.1A CN201510657357A CN105225968A CN 105225968 A CN105225968 A CN 105225968A CN 201510657357 A CN201510657357 A CN 201510657357A CN 105225968 A CN105225968 A CN 105225968A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
Abstract
The invention provides a kind of automation chip and be separated attaching method, comprising: steps A: initialization current production sequence number m=0, chip level n=1, goes to step B; Step B: pick up the n-th level chip on described wafer and mount on m product, going to step C; Step C: judge whether described wafer also remains the n-th level chip, if residue, adds 1 by m, goes to step B; If do not remain, n is added 1, go to step B.Automation chip provided by the invention is separated attaching method, by the chip on wafer is carried out classification pickup and directly attachment on product, decrease the manual grading skill of chip and pack, transport, the operation such as fractionation, reduce manual intervention degree, use manpower and material resources sparingly, improve production efficiency.
Description
Technical field
The present invention relates to a kind of separation and attachment field of semiconductor chip, particularly relate to a kind of automation chip and be separated attaching method.
Background technology
At present, a large amount of semiconductor chips is encapsulated in the semiconductor module of such as IGBT module one class, and the various electrical functionality in same module between different chip always there are differences, when module normally works, difference between this electrical functionality can cause some chip to occur that electric current is more concentrated, heating is comparatively serious or open the problems such as the turn-off time is inconsistent, long-term high loaded process will cause chip failure, and even module whole lost efficacy, thus the reliability of impact application side and fail safe, so the final stage that semiconductor chip is being produced can carry out the test of different electrical functionality to guarantee the functional of product, utilize these test results just can form a kind of data file wafer figure (wafermap) in conjunction with the shape of wafer again, chip is divided into different grades by wafer figure, by the adverse effect that the electrical functionality difference existed by chip chamber of can preventing to the full extent in the chip package of grade of the same race to same module is brought, and paster operation is as the direct operation of in semiconductor packaging industry, chip being carried out to classification and attachment, be responsible for important function.
Existing chip sorter and mounting method are that chip is separated attachment, chip separation attachment needs are first artificial to be taken off chip from wafer suction pen, then according to wafer figure, the chip of different brackets is placed in different carriers, then through processes such as packaging and transports, finally again chip is mounted in product according to grade, be that one is typically separated attaching method as shown in Figure 1, the major defect of existing separation attachment is:
1) by chip from after wafer is separated, no matter adopt any mode to transport and store, unavoidablely between this process chips and carrier can produce friction and even collide, wearing and tearing can be caused to chip, if wearing and tearing are comparatively serious, then chip rejection can be caused; If environment or carrier are clean not, also can pollute chip, thus each operations such as follow-up welding, bonding are had a negative impact.
2) manual intervention degree is higher, needs to expend more man power and material, and artificial separating chips workload is larger, the proficiency of dependence personnel and concentrate degree, easily be subject to impact that is external and internal factor, thus chip sorter occurs the problem such as make mistakes, be unfavorable for large-scale production; Artificial separation needs to use the instrument such as pen, carrier of suction and the factory such as vacuum, Compressed Gas business resource, also needs personnel to carry out packing, transports, the operation such as fractionation after separation, labor intensive material resources.
Summary of the invention
The invention provides a kind of automation chip and be separated attaching method, be separated separate and carry out with mounting in order to solve chip of the prior art, manual intervention degree is higher, needs the problem expending more man power and material.
One aspect of the present invention provides a kind of automation chip to be separated attaching method, comprising:
Steps A: initialization current production sequence number m=0, chip level n=1, goes to step B;
Step B: the n-th level chip on pickup wafer also mounts on m product, goes to step C;
Step C: judge whether wafer also remains the n-th level chip, if residue, adds 1 by m, goes to step B; If do not remain, n is added 1, go to step B.
Further, step B specifically comprises:
Step b1: judge whether wafer has the n-th level chip, if having, go to step b2;
Step b2: judge that m product is the need of the n-th level chip, if desired, then picks up the n-th level chip from wafer and mounts on m product, going to step C.
Further, steps A also comprises: chip level kind N on initialization wafer;
In step C, if do not remain, n is added 1, goes to step B, specifically comprise:
Step c1: judge whether n is less than chip level kind N, if be less than, then n is added 1, go to step B; If be not less than, flow process terminates.
Further, working area is set, in working area, place N kind grade each a of chip;
After stepb, before step c1, also comprise,
Step c0: judge whether m product also needs the n-th level chip, if desired, then picks up the n-th level chip in working area and mounts on m product, going to step c1.
Further, working area has multiple, and each working area stores a kind of level chip.
The present invention provides a kind of automation chip to be separated attaching method on the other hand, comprising:
Steps A 2: initialization current wafer m2=0, chip level n2=1, goes to step B2;
Step B2: to pick up on m2 wafer the n-th 2 level chip and attachment on product, go to step C2;
Step C2: to judge on m2 wafer if residue, n2 to be added whether also residue the n-th 2 level chip 1, goes to step B2; If do not remain, m2 is added 1, go to step B2.
Further, step B2 specifically comprises:
Step b1 ': judge that product is the need of the n-th 2 level chip, if desired, goes to step b2 ';
Step b2 ': judge whether m2 wafer has the n-th 2 level chip, if having, then from m2 wafer pickup the n-th 2 level chip and attachment on product, go to step C2.
Further, steps A 2 also comprises: chip level kind N2 on initialization wafer; In step C2, if residue, n2 is added 1, goes to step B2, specifically comprise:
Step c1 ': judge whether n2 is less than chip level kind N2, if be less than, then n2 is added 1, go to step B2; If be not less than, flow process terminates.
Further, working area is set, and after step B2 ', before step c1 ', also comprises,
Step c0 ': be placed into working area from m2 wafer pickup the n-th 2 level chip, go to step c1 '.
Further, working area has multiple, and each working area stores a kind of level chip.
Automation chip provided by the invention is separated attaching method, by the chip on wafer is carried out classification pickup and directly attachment on product, decrease the manual grading skill of chip and pack, transport, the operation such as fractionation, reduce manual intervention degree, use manpower and material resources sparingly, improve production efficiency.
Accompanying drawing explanation
Also will be described in more detail the present invention with reference to accompanying drawing based on embodiment hereinafter.Wherein:
Fig. 1 is typical separation attaching method schematic flow sheet in prior art;
Fig. 2 is the schematic flow sheet being separated attaching method according to the automation chip of the embodiment of the present invention one;
Fig. 3 is the schematic flow sheet being separated attaching method according to the automation chip of the embodiment of the present invention two;
Fig. 4 is the schematic flow sheet being separated attaching method according to the automation chip of the embodiment of the present invention three;
Fig. 5 is the schematic flow sheet being separated attaching method according to the automation chip of the embodiment of the present invention four;
Fig. 6 is the schematic flow sheet being separated attaching method according to the automation chip of the embodiment of the present invention five;
Fig. 7 is the schematic flow sheet being separated attaching method according to the automation chip of the embodiment of the present invention six.
In the accompanying drawings, identical parts use identical Reference numeral.Accompanying drawing is not according to the scale of reality.
Embodiment
Below in conjunction with accompanying drawing, the invention will be further described.
Embodiment one
Fig. 2 is the schematic flow sheet being separated attaching method according to the automation chip of the embodiment of the present invention one, and as shown in Figure 2, automation chip of the present invention is separated attaching method, comprising:
Steps A: initialization current production sequence number m=0, chip level n=1, goes to step B.
Concrete, wafer refers to the silicon wafer that Si semiconductor production of integrated circuits is used, because its shape is circular, therefore is called wafer; The production of semiconductor chip, that circuit is fabricated on wafer by the physico-chemical process of various complexity, carry out the test of different electrical functionality to guarantee the functional of product in the final stage of producing, and the figure utilizing these test results to produce in conjunction with the shape of wafer is again exactly wafer figure.Test result different colours, shape or code, in units of chip, are indicated on the position of each chip by wafer figure, and the chip indicating same color, shape or code is same grade.The sequence number of current production is initialized as 0, and chip level is initialized as 1, and namely chip level mounts from the 1st grade, also according to actual conditions, can arrange and mount from the 2nd grade or 3rd level, do not repeat them here.
Step B: the n-th level chip on pickup wafer also mounts on m product, goes to step C.
Concrete, the chip picking up different brackets on wafer successively mounts product.As first picked up the 1st level chip, then pick up the 2nd level chip, the like, until chips all on wafer has all been picked up.
Step C: judge whether wafer also remains the n-th level chip, if residue, goes to step E; If do not remain, go to step F.
Concrete, due in step B, if the n-th level chip number is not less than the n-th level chip number needed for m product on wafer, then wafer has remaining n-th level chip, otherwise, the n-th level chip on wafer can be taken, and wafer does not remain the n-th level chip, and specifically any situation needs to judge, therefore, judge in step C whether wafer also remains the n-th level chip, if residue, go to step E; If do not remain, go to step F.Step e: m is added 1, goes to step B.Concrete, judge whether wafer also remains the n-th level chip, if residue, m is added 1, after namely m product has been mounted the n-th level chip, changes m+1 product to mount, go to step B.
Step F: if do not remain, n is added 1, go to step B.Concrete, judge whether wafer also remains the n-th level chip, if do not remain, n is added 1, namely the (n+1)th level chip on wafer is picked up, go to step B.
Automation chip provided by the invention is separated attaching method, by the chip on wafer being carried out classification pickup and directly mounting on product, decrease the manual grading skill of chip and pack, transport, the operation such as fractionation, reduce manual intervention degree, use manpower and material resources sparingly, improve production efficiency, simultaneously, this method is by preferentially picking up the chip on wafer according to grade and mounting on product, chip on wafer has not picked up and has not changed next wafer, the waste of chip on wafer can be reduced to the full extent, economize on resources.
Embodiment two
Fig. 3 is the schematic flow sheet being separated attaching method according to the automation chip of the embodiment of the present invention two, and as shown in Figure 3, automation chip of the present invention is separated attaching method, comprising:
Step 101: chip level kind N, product sum M, current production m=0, chip level n=1 on initialization wafer.
Concrete, chip level kind N and different colours number, difformity number or different code indicate number, chip level kind N herein can be the chip level species number for a wafer, may also be the chip level species number for a collection of wafer, specifically can select according to actual conditions, in the present embodiment, be described for the chip level species number of a collection of wafer for chip level kind N.Product sum M and product number to be mounted.In addition, the sequence number of current production is initialized as 0, and chip level is initialized as 1, and namely chip level mounts from the 1st grade, also according to actual conditions, can arrange and mount from the 2nd grade or 3rd level, do not repeat them here.
Step 102: judge whether wafer has the n-th level chip, if having, go to step 103; If no, go to step 105.
Concrete, when preparation mounts the n-th level chip to product, first judge whether wafer there is this n-th level chip, because the present embodiment chips level categories N is the chip level species number for a collection of wafer, so certain level chip occurred in this wafer, may not occur in another wafer, so also need whether wafer there being the n-th level chip judge, if have, go to step 103; If no, go to step 105.
Step 103: judge that m product is the need of the n-th level chip, if desired, go to step 106; If do not need, go to step 107.
Concrete, because for some product, the n-th level chip may not be needed, or for having mounted the product of the n-th level chip, also no longer needing the n-th level chip, so when wafer there being the n-th level chip, also will judge that m product is the need of the n-th level chip, if desired, 106 are gone to step; If do not need, go to step 107.
Step 104: judge whether wafer also remains the n-th level chip, if residue, turns 107; If do not remain, then go to step 105.
Concrete, when wafer there being the n-th level chip, and during m product needed the n-th level chip, pick up the n-th level chip from wafer and mount on m product, because m product may need multiple n-th level chip, so need to judge whether the n-th level chip on wafer meets needed for m product, therefore pick up from wafer the n-th level chip and attachment to m product after, judge whether the n-th level chip on wafer meets needed for m product by whether wafer also remaining the n-th level chip, if residue, turn 107 and perform; If do not remain, then go to step 105 execution.
Step 105: judge whether n is less than chip level kind N, if be less than, go to step 108; If be not less than, flow process terminates.
Concrete, forwarding step 105 to has two kinds of situations, and the first situation is: when wafer not having the n-th level chip, owing to now needing to discuss to the (n+1)th level chip, so need first to judge whether n is less than chip level kind N, if be less than, go to step 108 execution; If be not less than, flow process terminates.
The second situation is: when wafer there being the n-th level chip, and during m product needed the n-th level chip, pick up the n-th level chip from wafer and mount on m product, because m product may need multiple n-th level chip, so need to judge whether the n-th level chip on wafer meets needed for m product, therefore pick up from wafer the n-th level chip and attachment to m product after, judge whether the n-th level chip on wafer meets needed for m product by whether wafer also remaining the n-th level chip, if do not remain, illustrate that the n-th level chip on now wafer is finished, next need to judge the (n+1)th level chip, therefore judge whether n is less than chip level kind N, if be less than, namely illustrate that n now is also less than chip greatest level, can also continue to judge the chip of lower level, go to step 108 continuation to perform, if be not less than, illustrate that n has now arrived chip greatest level, gradational chip has judged complete, and flow process terminates.
Step 106: pick up the n-th level chip from wafer and mount on m product, going to step 104.
Concrete, when wafer there being the n-th level chip, and during m product needed the n-th level chip, can directly picking up the n-th level chip from wafer and mount on m product, go to step 104.
Step 107: m is added 1, goes to step 103.
Concrete, forwarding step 107 to has two kinds of situations, and the first situation is: when wafer there being the n-th level chip, and when m product does not need the n-th level chip, needs to analyze m+1 product, now can forward step 107 to and perform.
The second situation is: when wafer there being the n-th level chip, and during m product needed the n-th level chip, pick up the n-th level chip from wafer and mount on m product, because m product may need multiple n-th level chip, so need to judge whether the n-th level chip on wafer meets needed for m product, therefore, pick up from wafer the n-th level chip and attachment to m product after, judge whether the n-th level chip on wafer meets needed for m product by whether wafer also remaining the n-th level chip, if residue, illustrate that m product has completed the attachment to the n-th level chip, now, interchangeable m+1 product proceeds the attachment of the n-th level chip, 1 is added by m, go to step 103 execution.
Further, in step 107, the step that m value is judged is increased, if the value of m equals product sum M-1 (because the sequence number of m is from 0, so the maximum of m can be only M-1), illustrate that the value of now m can not add again, need process ends; If the value of m is less than product sum M-1, illustrates that the value of now m also can increase, then m is added 1, go to step 103 execution.
Further, in step 107, judge whether the value that m adds 1 is greater than M-1, if be greater than, then m added the value of 1 to M remainder number, then described remainder values is assigned to m, goes to step 103; If be not more than, then m is added 1, go to step 103.Can ensure like this when wafer there being the n-th level chip, can to all product inquiry one time the need of the n-th level chip.
Further, can arrange a counter in step 107, this counters count jumps to the number of times of step 107 continuously from step 103, if centre once jumps to step 106 from step 103, then counter O reset, when the number of times of counters count reaches product sum M, flow process this terminate.Due to when the number of times of counters count reaches product sum M, showing now to travel through once to all products, in order to prevent endless loop, namely traveling through all products when all not need the n-th level chip, process ends can enter analysis to the (n+1)th level chip, namely go to step 105 execution.
Step 108: n is added 1, goes to step 102.
Concrete, when wafer there being the n-th level chip, and during m product needed the n-th level chip, pick up the n-th level chip from wafer and mount on m product, because m product may need multiple n-th level chip, so need to judge whether the n-th level chip on wafer meets needed for m product, therefore pick up from wafer the n-th level chip and attachment to m product after, judge whether the n-th level chip on wafer meets needed for m product by whether wafer also remaining the n-th level chip, if do not remain, illustrate that the n-th level chip on now wafer is finished, next need to judge the (n+1)th level chip, therefore judge whether n is less than chip level kind N, if be less than, namely illustrate that n now is also less than chip greatest level, can also continue to judge the chip of lower level, n is added 1, go to step 102 continuation to perform.
Automation chip provided by the invention is separated attaching method, by the chip on wafer being carried out classification pickup and directly mounting on product, decrease the manual grading skill of chip and pack, transport, the operation such as fractionation, reduce manual intervention degree, use manpower and material resources sparingly, improve production efficiency, simultaneously, this method is by preferentially picking up the chip on wafer according to grade and mounting on product, chip on wafer has not picked up and has not changed next wafer, the waste of chip on wafer can be reduced to the full extent, economize on resources.
Embodiment three
The present embodiment is the supplementary notes of carrying out on the basis of above-described embodiment.
Fig. 4 is the schematic flow sheet being separated attaching method according to the automation chip of the embodiment of the present invention three, and as shown in Figure 4, automation chip of the present invention is separated attaching method, comprising:
Step 101 ': chip level kind N, product sum M, current production m=0, chip level n=1 on initialization wafer.
Step 102 ': judge whether wafer has the n-th level chip, if having, go to step 103 '; If no, go to step 105 '.
Step 103 ': judge that m product is the need of the n-th level chip, if desired, go to step 106 '; If do not need, go to step 107 '.
Above-mentioned steps 101 '-103 ' consistent with the step 101-103 in embodiment two, specifically can record accordingly see in embodiment two, not repeat them here.
Step 104 ': judge whether wafer also remains the n-th level chip, if residue, turn 107 '; If do not remain, then go to step 105 '.
This step is the supplementary notes of carrying out on step 104 basis.
Further, working area is set, in working area, place N kind grade each a of chip; If wafer there is no residue n-th level chip, then go to step 105 ', specifically comprise:
Step 109 ': judge whether m product also needs the n-th level chip, if desired, go to step 110 '; If do not need, go to step 105 '.
Go to step 110 ': the n-th level chip in pickup working area also mounts on m product, goes to step 105 '.
Concrete, arrange working area, in working area, place N kind grade each a of chip, the value of a can be 5 or 10, specifically can arrange according to actual conditions.Arranging working area also can at initial phase, i.e. step 101 ' middle setting.
If wafer there is no residue n-th level chip, now there are two kinds of situations, the first situation is that the n-th level chip has just mounted m product, the second situation is that the n-th level chip has mounted m product not, so to which kind of situation, also need to continue to judge, namely judge whether m product also needs the n-th level chip, if desired, explanation meets above-mentioned the second situation, now pick up the n-th level chip in working area and mount on m product, go to step 105 ' to perform, if do not need, explanation meets the first situation above-mentioned, now directly go to step 105 ' to perform.
Further, the total quantity of value each level chip needed for M product of a, a kind of maximum of extreme case is got by a, namely all chips of M product needed are all same grades, by the total quantity of a value each level chip needed for M product, when can ensure in any case wafer there is no qualified chip, all can pick up corresponding chip from working area and attachment to m product.
Further, working area has N number of, and each working area stores a kind of level chip.Separately stored by the chip of often kind of grade, can conveniently when picking up identify, the quantity of each level chip also can working area being watched more intuitively to store, is convenient to corresponding interpolation.
Step 105 ': judge whether n is less than chip level kind N, if be less than, go to step 108 '; If be not less than, flow process terminates.
Step 106 ': pick up the n-th level chip from wafer and mount on m product, going to step 104 '.
Above-mentioned steps 105 '-106 ' consistent with the step 105-106 in embodiment one, specifically can record accordingly see in embodiment one, not repeat them here.
Step 107 ': m is added 1, goes to step 103 '.
This step is the supplementary notes of carrying out on step 107 basis.
Further, in step 107 ' in, increase the step that m value is judged, if the value of m equals product sum M-1 (because the sequence number of m is from 0, so the maximum of m can be only M-1), illustrate that the value of now m can not add again, need to terminate this flow process, now the n-th level chip on wafer picked up and be placed in working area, then going to step 105 ' and perform; If the value of m is less than product sum M-1, illustrates that the value of now m also can increase, then m is added 1, go to step 103 ' and perform.
Further, can in step 107 ' in a counter is set, the number of times that this counters count is from step 103 ' jump to step 107 continuously ', if centre is once from step 103 ' jump to step 106 ', then counter O reset, when the number of times of counters count reaches product sum M, flow process this terminate.Due to when the number of times of counters count reaches product sum M, show now to travel through once to all products, in order to prevent endless loop, namely all products are traveled through when all not needing the n-th level chip, the n-th level chip on wafer is picked up and is placed in working area, then enter the analysis to the (n+1)th level chip, namely go to step 105 ' and perform.
Step 108 ': n is added 1, goes to step 102 '.
This step is consistent with step 108.
Automation chip provided by the invention is separated attaching method, by the chip on wafer being carried out classification pickup and directly mounting on product, decrease the manual grading skill of chip and pack, transport, the operations such as fractionation, reduce manual intervention degree, use manpower and material resources sparingly, improve production efficiency, simultaneously, this method is by preferentially picking up the chip on wafer according to grade and mounting on product, chip on wafer has not picked up and has not changed next wafer, if when all products of the chip on wafer all no longer need, this chip can be picked up and be placed in working area, the waste of chip on wafer can be reduced to the full extent, economize on resources.
Embodiment four
Fig. 5 is the schematic flow sheet being separated attaching method according to the automation chip of the embodiment of the present invention four, and as shown in Figure 5, automation chip of the present invention is separated attaching method, comprising:
Steps A 2: initialization current wafer m2=0, chip level n2=1, goes to step B2.
Concrete, the sequence number of current wafer is initialized as 0, and chip level is initialized as 1, and namely chip level mounts from the 1st grade, also according to actual conditions, can arrange and mount from the 2nd grade or 3rd level, do not repeat them here.
Step B2: to pick up on m2 wafer the n-th 2 level chip and attachment on product, go to step C2.
Concrete, the chip picking up different brackets on m2 wafer successively mounts product.As first picked up the 1st level chip on m2 wafer, the 1st level chip on m2+1 wafer, the like, until meet product to needed for the 1st level chip, until meet the demand of product to all level chip.
Step C2: to judge on m2 wafer whether also residue the n-th 2 level chip if residue, to go to step D2; If do not remain, go to step E2.
Concrete, due in step B2, if the n-th 2 level chip numbers are not less than the n-th 2 level chip numbers needed for product on m2 wafer, then m2 wafer has remaining the n-th 2 level chip, otherwise, the n-th 2 level chip on m2 wafer can be taken, and m2 wafer does not remain the n-th 2 level chip, specifically any situation needs to judge, therefore, to judge in step C2 on m2 wafer whether also residue the n-th 2 level chip if residue, to go to step D2; If do not remain, go to step E2.
Step D2: n2 is added 1, goes to step B2.Concrete, to judge on m2 wafer whether also residue the n-th 2 level chip if residue, n2 to be added 1, after namely product has been mounted the n-th 2 level chip, changed the n-th 2+1 level chip and mount, go to step B2.
Step e 2: m2 is added 1, goes to step B2.Concrete, to judge on m2 wafer if do not remain, m2 to be added whether also residue the n-th 2 level chip 1, namely pick up the n-th level chip on m2 wafer, go to step B2.
Automation chip provided by the invention is separated attaching method, also directly mounted on product by the chip on classification pickup wafer, decrease the manual grading skill of chip and pack, transport, the operations such as fractionation, reduce manual intervention degree, use manpower and material resources sparingly, improve production efficiency, simultaneously, this method is by preferentially meeting the demand of product to different stage chip on wafer, chip on wafer is carried out classification according to product demand pick up and mount, the attachment of next product is carried out again after a product has been mounted, the integrality that product mounts can be ensured, avoid the attachment of omitting some chip in attachment process, cause product defects.
Embodiment five
Fig. 6 is the schematic flow sheet being separated attaching method according to the automation chip of the embodiment of the present invention five, and as shown in Figure 6, automation chip of the present invention is separated attaching method, comprising:
Step 201: initialization chip level kind N2, wafer sum M 2, current wafer m2=0, chip level n2=1.
Concrete, chip level kind N2 looks like consistent with the chip level kind N in embodiment one step 101, and wafer sum M 2 can be arranged according to actual conditions, and initialization current wafer m2 sequence number is 0, chip level n2 is 1.
Step 202: judge that product is the need of the n-th 2 level chip, if desired, goes to step 203; If do not need, go to step 205.
Concrete, when preparing product attachment the n-th 2 level chip, first judge that product is the need of the n-th 2 level chip, if desired, goes to step 203; If do not need, go to step 205.
Step 203: judge whether m2 wafer has the n-th 2 level chip, if having, go to step 206; If no, go to step 207.
Concrete, when judging product needed the n-th 2 level chip, m2 wafer not necessarily there are the n-th 2 level chip, so now also need to judge whether m2 wafer has the n-th 2 level chip, if having, go to step 206, if do not have, going to step 207.
Step 204: to judge on m2 wafer whether also residue the n-th 2 level chip if do not remain, to go to step 207; If residue, then go to step 205.
Concrete, when product needed the n-th 2 level chip, and when m2 wafer having the n-th 2 level chip, from m2 wafer pickup the n-th 2 level chip and attachment on product, because product may need multiple the n-th 2 level chip, thus from m2 wafer pickup the n-th 2 level chip and attachment to product after, also to need to judge on m2 wafer whether also residue the n-th 2 level chip, if do not remain, go to step 207; If residue, then go to step 205.
Step 205: judge whether n2 is less than chip level kind N2, if be less than, go to step 208; If be not less than, flow process terminates.
Concrete, forwarding step 205 to has two kinds of situations, and the first situation is: when product does not need the n-th 2 level chip, owing to now needing to discuss to the n-th 2+1 level chip, so need first to judge whether n2 is less than chip level kind N2, if be less than, go to step 208 execution; If be not less than, flow process terminates.
The second situation is: when product needed the n-th 2 level chip, and when m2 wafer having the n-th 2 level chip, from m2 wafer pickup the n-th 2 level chip and attachment on product, because product may need multiple the n-th 2 level chip, so from m2 wafer pickup the n-th 2 level chip and attachment to product after, also to need to judge on m2 wafer whether also residue the n-th 2 level chip, if judged result is for also to remain, so now can analyze other chip of next stage, therefore judge whether n2 is less than chip level kind N2, if be less than, namely illustrate that n2 now is also less than chip greatest level, can also continue to judge the chip of lower level, go to step 208 continuation to perform, if be not less than, illustrate that n2 has now arrived chip greatest level, gradational chip has judged complete, and flow process terminates.
Step 206: from m2 wafer pickup the n-th 2 level chip and attachment on product, go to step 204.
Concrete, when product needed the n-th 2 level chip, and when m2 wafer having the n-th 2 level chip, directly from m2 wafer pickup the n-th 2 level chip and attachment on product, go to step 204 execution.
Step 207: m2 is added 1, goes to step 203.
Concrete, forwarding step 207 to has two kinds of situations, and the first situation is: when product needed the n-th 2 level chip, and when m2 wafer not having the n-th 2 level chip, needs to analyze m2+1 wafer, now can forward step 107 to and perform.
The second situation is: when product needed the n-th 2 level chip, and when m2 wafer having the n-th 2 level chip, from m2 wafer pickup the n-th 2 level chip and attachment on product, because product may need multiple the n-th 2 level chip, so from m2 wafer pickup the n-th 2 level chip and attachment to product after, also to need to judge on m2 wafer whether also residue the n-th 2 level chip, if judged result is not for remain, so now current wafer can be replaced with next wafer, add 1 by m2, then go to step 203 execution.
Further, in step 207, the step that m2 value is judged is increased, if the value of m2 equals wafer sum M 2-1 (because the sequence number of m2 is from 0, so the maximum of m2 can be only M2-1), illustrate that the value of now m2 can not add again, need process ends; If the value of m2 is less than wafer sum M 2-1, illustrates that the value of now m2 also can increase, then m2 is added 1, go to step 203 execution.
Further, in step 207, judge whether the value that m2 adds 1 is greater than M2-1, if be greater than, then m2 added the value of 1 to M2 remainder number, then described remainder values is assigned to m2, goes to step 203; If be not more than, then m2 is added 1, go to step 203.Can ensure when product needed the n-th 2 level chip like this, can inquire whether there are the n-th 2 level chip for one time to all wafers.
Further, can arrange a counter in step 207, this counters count jumps to the number of times of step 207 continuously from step 203, if centre once jumps to step 206 from step 203, then counter O reset, when the number of times of counters count reaches product sum M 2, flow process this terminate.Due to when the number of times of counters count reaches product sum M 2, showing now to travel through once to all wafers, in order to prevent endless loop, namely traveling through all wafers when all there is no the n-th level chip, the analysis to the (n+1)th level chip can be entered, go to step 105 execution.
Step 208: n2 is added 1, goes to step 202.
Concrete, judge whether n2 is less than chip level kind N2, if be less than, namely illustrate that n2 now is also less than chip greatest level, can also continue to judge the chip of lower level, now n2 be added 1, go to step 102 continuation and perform.
Automation chip provided by the invention is separated attaching method, also directly mounted on product by the chip on classification pickup wafer, decrease the manual grading skill of chip and pack, transport, the operations such as fractionation, reduce manual intervention degree, use manpower and material resources sparingly, improve production efficiency, simultaneously, this method is by preferentially meeting the demand of product to different stage chip on wafer, chip on wafer is carried out classification according to product demand pick up and mount, the attachment of next product is carried out again after a product has been mounted, the integrality that product mounts can be ensured, avoid the attachment of omitting some chip in attachment process, cause product defects.
Embodiment six
The present embodiment is the supplementary notes of carrying out on the basis of above-described embodiment.
Fig. 7 is the schematic flow sheet being separated attaching method according to the automation chip of the embodiment of the present invention six, and as shown in Figure 7, automation chip of the present invention is separated attaching method, comprising:
Step 201 ': initialization chip level kind N2, wafer sum M 2, current wafer m2=0, chip level n2=1.
This step is consistent with the step 201 in embodiment three, specifically can record accordingly see in embodiment three, not repeat them here.
Step 202 ': judge that product is the need of the n-th 2 level chip, if desired, goes to step 203 '; If do not need, go to step 205 '.
This step is the supplementary notes of carrying out on step 202 basis.
Further, if product does not need the n-th 2 level chip, go to step 205 ', be specially: if product does not need the n-th 2 level chip, go to step 209 '.
Further, working area has N2, and each working area stores a kind of level chip.
Step 203 ': judge whether m2 wafer has the n-th 2 level chip, if having, go to step 206 '; If no, go to step 207 '.
Step 204 ': judge whether product also needs the n-th 2 level chip, if desired, goes to step 207 '; If do not need, then go to step 205 '.
Step 205 ': judge whether n2 is less than chip level kind N2, if be less than, go to step 208 '; If be not less than, flow process terminates.
Step 206 ': from m2 wafer pickup the n-th 2 level chip and attachment on product, go to step 204 '.
Step 207 ': m2 is added 1, goes to step 203 '.
Step 208 ': n2 is added 1, goes to step 202 '.
Above-mentioned steps 203 '-208 ' consistent with the step 203-208 in embodiment three, specifically can record accordingly see in embodiment three, not repeat them here.
Go to step 209 ': working area is set, picks up the n-th 2 level chip on m2 wafer to working area, go to step 205 '.
Concrete, forward step 209 to ' there are two kinds of situations, the first situation is: when product does not need the n-th 2 level chip, pick up the n-th 2 level chip on m2 wafer in working area, as for whether m2 wafer there being the n-th 2 level chip now do not consider, if have, pick up the n-th 2 level chip on m2 wafer in working area, go to step 205 '; If no, then pickup is for empty, goes to step 205 '.
The second situation is: when product needed the n-th 2 level chip, and when m2 wafer having the n-th 2 level chip, from m2 wafer pickup the n-th 2 level chip and attachment on product, from m2 wafer pickup the n-th 2 level chip and attachment to product after, if m2 wafer also remains the n-th 2 level chip, pick up the n-th 2 level chip on m2 wafer to working area, go to step 205 '.
Automation chip provided by the invention is separated attaching method, also directly mounted on product by the chip on classification pickup wafer, decrease the manual grading skill of chip and pack, transport, the operations such as fractionation, reduce manual intervention degree, use manpower and material resources sparingly, improve production efficiency, simultaneously, this method is by preferentially meeting the demand of product to different stage chip on wafer, chip on wafer is carried out classification according to product demand pick up and mount, the attachment of next product is carried out again after a product has been mounted, the integrality that product mounts can be ensured, avoid the attachment of omitting some chip in attachment process, cause product defects.In addition, when product does not need the chip of certain grade on wafer, pick-up chip, in working area, can reduce the waste of chip on wafer to the full extent, economize on resources.
Although invention has been described with reference to preferred embodiment, without departing from the scope of the invention, various improvement can be carried out to it and parts wherein can be replaced with equivalent.Especially, only otherwise there is structural hazard, the every technical characteristic mentioned in each embodiment all can combine in any way.The present invention is not limited to specific embodiment disclosed in literary composition, but comprises all technical schemes fallen in the scope of claim.
Claims (10)
1. automation chip is separated an attaching method, it is characterized in that, comprising:
Steps A: initialization current production sequence number m=0, chip level n=1, goes to step B;
Step B: pick up the n-th level chip on described wafer and mount on m product, going to step C;
Step C: judge whether described wafer also remains the n-th level chip, if residue, adds 1 by m, goes to step B; If do not remain, n is added 1, go to step B.
2. automation chip according to claim 1 is separated attaching method, and it is characterized in that, described step B specifically comprises:
Step b1: judge whether described wafer has the n-th level chip, if having, go to step b2;
Step b2: judge that m product is the need of the n-th level chip, if desired, then picks up described n-th level chip from described wafer and mounts on described m product, going to step C.
3. automation chip according to claim 1 and 2 is separated attaching method, it is characterized in that,
Described steps A also comprises: chip level kind N on initialization wafer;
In described step C, do not remain if described, n added 1, go to step B, specifically comprise:
Step c1: judge whether n is less than chip level kind N, if be less than, then n is added 1, go to step B; If be not less than, flow process terminates.
4. automation chip according to claim 3 is separated attaching method, it is characterized in that,
Working area is set, in described working area, place N kind grade each a of chip;
After described step B, before described step c1, also comprise,
Step c0: judge whether described m product also needs described n-th level chip, if desired, then picks up described n-th level chip in described working area and mounts on described m product, going to step c1.
5. automation chip according to claim 4 is separated attaching method, and it is characterized in that, described working area has multiple, and each described working area stores a kind of level chip.
6. automation chip is separated an attaching method, it is characterized in that, comprising:
Steps A 2: initialization current wafer m2=0, chip level n2=1, goes to step B2;
Step B2: to pick up on described m2 wafer the n-th 2 level chip and attachment on product, go to step C2;
Step C2: to judge on described m2 wafer if residue, n2 to be added whether also residue the n-th 2 level chip 1, goes to step B2; If do not remain, m2 is added 1, go to step B2.
7. automation chip according to claim 6 is separated attaching method, and it is characterized in that, described step B2 specifically comprises:
Step b1 ': judge that described product is the need of the n-th 2 level chip, if desired, goes to step b2 ';
Step b2 ': judge whether described m2 wafer has the n-th 2 level chip, if having, then from described m2 wafer pick up described the n-th 2 level chip and attachment on described product, go to step C2.
8. the automation chip according to claim 6 or 7 is separated attaching method, it is characterized in that,
Described steps A 2 also comprises: chip level kind N2 on initialization wafer; In described step C2, if described residue, n2 is added 1, goes to step B2, specifically comprise:
Step c1 ': judge whether n2 is less than chip level kind N2, if be less than, then n2 is added 1, go to step B2; If be not less than, flow process terminates.
9. automation chip according to claim 8 is separated attaching method, it is characterized in that, arranges working area, and after described step B2 ', before described step c1 ', also comprise,
Step c0 ': pick up described the n-th 2 level chip from described m2 wafer and be placed into described working area, going to step c1 '.
10. automation chip according to claim 9 is separated attaching method, and it is characterized in that, described working area has multiple, and each described working area stores a kind of level chip.
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Address after: The age of 412001 in Hunan Province, Zhuzhou Shifeng District Road No. 169 Patentee after: ZHUZHOU CRRC TIMES ELECTRIC Co.,Ltd. Address before: The age of 412001 in Hunan Province, Zhuzhou Shifeng District Road No. 169 Patentee before: ZHUZHOU CSR TIMES ELECTRIC Co.,Ltd. |
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