KR101210302B1 - Method for sorting a semiconductor device - Google Patents

Abstract

The semiconductor element sorting method of the present invention obtains the interval between semiconductor elements to be picked up using a separate measuring device, determines the interval of the multi-picker to pick up the semiconductor elements based on the interval between the semiconductor elements, and at the determined interval The multi-picker picks up the semiconductor element, checks whether there are no pickers in the multi-picker, identifies the position of the non-picked-up semiconductor element that can be picked up further, and the additional pick-up is possible. The semiconductor device is picked up by moving to the semiconductor at the closest distance among the semiconductor devices, and the semiconductor device picked up by the multi-picker is mounted on the tray.
Therefore, the time required for the pick-up process during the sorting process of the semiconductor device can be reduced.

Description

Semiconductor device sorting method {Method for sorting a semiconductor device}

The present invention relates to a semiconductor device sorting method, and more particularly, to a semiconductor device sorting method using a multi-picker.

In the manufacturing process of the semiconductor device, the soaking process is performed to perform a die bonding process to individualize the semiconductor devices bonded to the substrate for semiconductor. The semiconductor devices separated by the sawing process may be transferred to a tray by a sorter.

In the sawing and sorting apparatus, the discrete semiconductor elements can be picked up by a plurality of pickers and transferred to a tray having a plurality of sockets for accommodating the semiconductor elements. It may be stored in the sockets. Each of the pickers may pick up the semiconductor devices using vacuum pressure.

The pickers are usually arranged in a row and can pick up the semiconductor devices one by one. However, when picking up semiconductor devices one by one into an individual picker, it takes a relatively long time for the picker to pick up.

A plurality of pickers are to be conveyed by one conveying device, but the driving of each picker to pick up the semiconductor elements is driven by a separate sequence. In the process of picking up each of the semiconductor devices, one picker moves to a desired position and then picks up one semiconductor device, and the next picker moves to a desired position and then picks up one semiconductor device again.

In this case, since the picker takes a relatively long time to pick up the semiconductor elements, it becomes one of the factors that greatly delay the overall process time when the movement time of these individual pickers is accumulated.

Accordingly, the technical problem of the present invention has been conceived in this respect, and an object of the present invention is to provide a semiconductor device sorting method using a multi-picker pickup algorithm capable of picking up semiconductor devices more efficiently.

In the semiconductor element sorting method according to an embodiment for achieving the above object of the present invention, by using a separate measuring device to obtain the interval between the semiconductor elements to be picked up, and based on the interval between the semiconductor elements Determine an interval of the multi-pickers to be picked up, and at the determined intervals, the multi-picker picks up the semiconductor elements, and if there are pickers in the multi-picker that do not generate a job for picking up the semiconductor elements, the multi-picker The position of the semiconductor device capable of additional pickup among the semiconductor devices not picked up is determined, the semiconductor device picked up is moved to the closest distance among the semiconductor devices capable of additional pickup, and the semiconductor device picked up by the multi-picker is placed on a tray. To rest.

In an embodiment of the present disclosure, the determining of the interval between the multi-pickers may include adjusting the intervals of the multi-pickers by the distance of the semiconductor elements when the intervals of the semiconductor elements are included within the minimum and maximum intervals of the multi-pickers. It can be characterized by.

In one embodiment of the present invention, determining the interval of the multi-picker may be adjusted so that the picker interval is N times the interval of the semiconductor element when the interval of the semiconductor element is smaller than the minimum interval of the picker. have. Here, N is the minimum natural number value of N such that the interval between the pickers is smaller than N times the interval between the semiconductor devices.

In an embodiment of the present disclosure, the determining of the interval between the multi-pickers may be performed in which the interval between the pickers is 1 / N times the interval between the semiconductor devices when the distance between the semiconductor devices is greater than the maximum distance between the pickers. You can adjust it. Here, N is a minimum natural number value at which the interval between the pickers is equal to 1 / N times the interval between the semiconductor devices.

In one embodiment of the present invention, the step of measuring the interval of the semiconductor device may determine the minimum value as the interval of the semiconductor device when there are several values of the interval of the semiconductor device.

According to the present invention described above, in the pickup operation and the place operation necessary for the sorting of the semiconductor element, the sorting method is optimized because the order and method and the number of operations can be adjusted according to the optimum path and the type of the semiconductor element. Can be achieved. Simultaneous work of the picker for sorting operations, such as the present invention can efficiently sort several semiconductor devices at the same time, it can significantly reduce the overall process time.

1 is a plan view illustrating a schematic configuration of a semiconductor element sorting apparatus using a semiconductor element sorting method according to an embodiment of the present invention.
2 is a schematic flowchart of a semiconductor device sorting method according to an embodiment of the present invention.
3 is a schematic side view illustrating a multi-picker used in the semiconductor device sorting method according to an embodiment of the present invention.
4 is a schematic plan view illustrating semiconductor devices used in a semiconductor device sorting method according to an embodiment of the present invention.
5A to 5C are schematic side views illustrating a process of picking up semiconductor devices by a multi-picker in the semiconductor device sorting method according to an embodiment of the present invention.
6 is a schematic plan view illustrating semiconductor devices used in a semiconductor device sorting method according to another embodiment of the present invention.
7A to 7C are schematic side and plan views illustrating a process of picking up semiconductor devices in a semiconductor device sorting method according to another embodiment of the present invention.

The present invention is capable of various modifications and various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

Like reference numerals are used for like elements in describing each drawing. In the accompanying drawings, the dimensions of the structures are enlarged to illustrate the present invention in order to clarify the present invention.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component. Singular expressions include plural expressions unless the context clearly indicates otherwise.

In this application, the terms "comprises", "having", and the like are used to specify that a feature, a number, a step, an operation, an element, a part or a combination thereof is described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will now be described in more detail with reference to the accompanying drawings.

1 is a plan view illustrating a schematic configuration of a semiconductor element sorting apparatus using a semiconductor element sorting method according to an embodiment of the present invention.

The semiconductor device sorting method of the present invention is characterized in that an efficient operation is drawn in consideration of the optimum path, the type of semiconductor device, and the inspection result in sorting the semiconductor devices for which vision inspection has been completed.

Referring to FIG. 1, a sorting operation of a semiconductor device is performed through a process of picking up semiconductor devices from a pallet 10 in which a sawed semiconductor device is located, and placing the semiconductor devices on a tray 20, which is a space for seating the picked up semiconductor devices. Is done. The present invention is to efficiently proceed with such a pick-up and place (Pick-up and Place) process.

2 is a schematic flowchart of a semiconductor device sorting method according to an embodiment of the present invention.

As can be seen in Figure 2, the semiconductor device sorting method of the present invention determines the picker interval (Picker) and picking up (S10), determining whether the pick-up job generation is complete (S20), simultaneous operation generation Determining whether this is possible (S30), the step of generating a simultaneous task (S41) and the step of generating a separate task (S43).

Determining and picking up the interval of the picker (S10) is a step of obtaining the interval between the semiconductor elements to be picked up using a separate measuring device and the interval of the multi-picker to pick up the semiconductor elements based on the interval between the semiconductor elements Determining and picking up the semiconductor device by the multi-picker at the determined interval.

Determining whether it is possible to generate the simultaneous task (S30) includes a step of checking whether there is a picker for which no task has been created among the multi-pickers, generating a simultaneous task (S41) and generating an individual task ( S43) includes the steps of determining the position of the semiconductor device that can be additionally picked up from the non-picked up semiconductor elements, and moving to and picking up the semiconductor at the closest distance among the semiconductor devices that can be additionally picked up. Determining whether the pick-up job generation is completed (S20) may include transferring a semiconductor device finally picked up by the multi-picker to a tray, and seating on the tray.

3 is a schematic side view illustrating a multi-picker used in the semiconductor device sorting method according to an embodiment of the present invention. 4 is a schematic plan view illustrating semiconductor devices used in a semiconductor device sorting method according to an embodiment of the present invention.

Referring to FIG. 3, the multi-picker used in the semiconductor sorting method of the present invention may include a plurality of pickers 100, and the picker 100 may include a body 130 and a pickup 110. Can be. Eight pickers 100 may form one set to form one multi-picker. As shown in FIG. 3, the multi-picker is designed to increase or decrease the spacing by making the spacing between the pickers 100 uniform. At this time, the pick-up minimum distance (Dpick-min) is the interval between each picker 100 in a state that the picker 100 can narrow the minimum interval, the pick-up maximum distance (Dpick-max) is the picker It may be defined as the interval between the pickers 100 in a state in which the (100) can widen the maximum interval.

Referring to FIG. 4, it can be seen that the semiconductor devices 200 are disposed on the pallet 10. After the semiconductor elements 200 are sawed and before being transferred to a tray in a pick-and-place process, a gap Dpack of each semiconductor element may be obtained through separate visual devices before being transferred. This is obtained through a preset value.

5A to 5C are schematic side views illustrating a process of picking up semiconductor devices by a multi-picker in the semiconductor device sorting method according to an embodiment of the present invention.

FIG. 5A illustrates a case in which a gap Dpack of a semiconductor device is located between a pick-up minimum distance Dpick-min and a pick-up maximum distance Dpick-max of a multi-picker in the semiconductor device sorting method according to an embodiment of the present invention. Drawing. In this case, the multi-picker may pick up the number of semiconductor devices that can be picked up by adjusting the interval in the same manner as the gap Dpack of the semiconductor devices.

FIG. 5B is a diagram illustrating a case in which a gap Dpack of a semiconductor device is smaller than a minimum pick-up interval of a multi-picker in the semiconductor device sorting method according to an embodiment of the present invention. In this case, the picker spacing Dpick is adjusted to be N times the spacing of the semiconductor device. N is the minimum natural number value of N where the spacing of the pickers is smaller than N times the spacing of the semiconductor elements. Therefore, the multi-picker is able to pick up as many semiconductor elements as possible, spaced apart by a minimum interval. In general, the value of N can be determined between 2 or 3.

FIG. 5C is a diagram illustrating a case in which a gap Dpack of a semiconductor device is greater than a maximum pick-up distance Dpick-max of a multi-picker in the semiconductor device sorting method according to an embodiment of the present invention. If the distance between the semiconductor elements is greater than the maximum distance between the pickers, the distance between the pickers is adjusted to be 1 / N times the distance between the semiconductor elements. However, N may be a minimum natural number value at which the interval between the pickers is equal to 1 / N times the interval between the semiconductor devices. In this case, since only a part of the set of pickers can be used, only a corresponding picker moves downward to pick up the semiconductor elements. The value of N may generally be 2 or 3.

6 is a schematic plan view illustrating semiconductor devices used in a semiconductor device sorting method according to another embodiment of the present invention. 7A to 7C are schematic side and plan views illustrating a process of picking up semiconductor devices in a semiconductor device sorting method according to another embodiment of the present invention.

FIG. 7A illustrates a case in which a gap Dpack of a semiconductor device is located between a pick-up minimum distance (Dpick-min) and a pick-up maximum distance (Dpick-max) of a multi-picker in the semiconductor device sorting method according to an embodiment of the present invention. Drawing. The difference between FIG. 5A and FIG. 7A is whether the semiconductor devices are continuously arranged at the same interval or not. When the semiconductor elements are arranged discontinuously at the same interval, the interval of the semiconductor elements is determined as the minimum value of the measured intervals, and the group of semiconductor elements arranged at the minimum value is picked up as one unit.

Referring to FIG. 7A, since the mulberry picker made of one set of eight pickers P1, P2, P3, ... P8 can be adjusted by the minimum distance of the semiconductor device, the gap is adjusted as the semiconductor device spacing. And the first group of semiconductor elements 1, 2, 3 is picked up. Then, the semiconductor devices within the minimum distance are sensed, and the multi-pickers are moved to the second group of semiconductor devices 4, 5, and 6, which are the target semiconductor devices, and the target semiconductor devices 4, 5, 6 are picked up. In FIG. 7A, since the pickers picking up the second group of semiconductor devices 4, 5, and 6 are P4, P5, and P6 pickers, the pickers have a minimum movement path, thereby picking up the second group of semiconductor devices 4, 5, and 6. . Thereafter, the third group of semiconductor elements 11 and 12, which can be picked up in a minimum path, are picked up using P7 and P8 pickers.

FIG. 7B is a diagram illustrating a case in which a gap Dpack of a semiconductor device is smaller than a minimum pick-up interval of a multi-picker in the semiconductor device sorting method according to an embodiment of the present invention. The difference between FIG. 5A and FIG. 7A is whether the semiconductor devices are continuously arranged at the same interval or not. When the semiconductor elements are arranged discontinuously at the same interval, the interval of the semiconductor elements is determined as the minimum value of the measured intervals, and the group of semiconductor elements arranged at the minimum value is picked up as one unit.

Referring to FIG. 7B, since a mulberry picker composed of one set of eight pickers (P1, P2, P3, ... P8) cannot be adjusted by the distance of the semiconductor device, the minimum natural number at the interval of the semiconductor device is reduced. The interval between the pickers is adjusted by the multiplied value, and the first group of semiconductor devices 1 and 3 is picked up using the pickers P1 and P2. Thereafter, the semiconductor devices within the minimum distance are sensed, the multi-picker is moved to the second semiconductor device, which is the target semiconductor device, and the target semiconductor device 2 is picked up using the picker P3. In the same operation, the third semiconductor element groups 4 and 6 are picked up using the P4 and P5 pickers, the fourth semiconductor element 5 is picked up using the P6 pickers, and the fifth semiconductor element groups 10 and 12 are picked up. Pick up using the P7, P8 picker. In this case, all of the semiconductor devices can be picked up to one set of pickers.

FIG. 7C is a diagram illustrating a case in which a gap Dpack of a semiconductor device is greater than a maximum pick-up distance Dpick-max of a multi-picker in the semiconductor device sorting method according to an embodiment of the present invention. The difference between FIG. 5A and FIG. 7A is whether the semiconductor devices are continuously arranged at the same interval or not. When the semiconductor elements are arranged discontinuously at the same interval, the interval of the semiconductor elements is determined as the minimum value of the measured intervals, and the group of semiconductor elements arranged at the minimum value is picked up as one unit.

Referring to FIG. 7C, the mulberry picker, which is a set of eight pickers P1, P2, P3, ... P8, cannot be adjusted by the minimum distance of the semiconductor device, and thus, all the pickers cannot be used. The semiconductor device is picked up by adjusting the gap in such a manner as to skip some pickers as shown in FIG. At this time, the interval of the semiconductor device may be a product of a minimum natural number multiplied by one of the intervals of the picker. In this way, the intervals of the multi-pickers are adjusted, and the first semiconductor element groups 1, 2, and 3 are picked up using P1, P3, and P5 pickers. Thereafter, the semiconductor devices within the minimum distance are sensed, the multi-picker is moved to the second semiconductor device 4 which is the target semiconductor device, and the target semiconductor device 4 is picked up using P7. In the case of FIG. 7C, since there is a limitation of the interval between the multi-pickers, only some of the pickers pick up the semiconductor elements.

As described above, the multi-picker thus picked up moves to the tray and seats the semiconductor elements picked up in the insertion groove of the tray. As a result, the time required for the transfer process during the semiconductor sorting process can be significantly reduced.

Although described above with reference to the embodiments, those skilled in the art can be variously modified and changed within the scope of the invention without departing from the spirit and scope of the invention described in the claims below. I can understand.

10 pallet 20 tray
200: semiconductor device
Dpick-min: Minimum Pickup Interval
Dpick-max: Maximum Pickup Spacing
Dpack: semiconductor device spacing
P1, P2, P3, P4, P5, P6, P7, P8: Picker
1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12: semiconductor device

Claims (5)

Obtaining a distance between semiconductor elements to be picked up using a separate measuring device;
Determining an interval of a multi-picker to pick up the semiconductor elements based on the distance between the semiconductor elements;
Picking up the semiconductor device by the multi-picker at the determined interval;
Checking whether any of the multi-pickers has a picker in which a job of picking up the semiconductor device is not generated;
Determining a position of a semiconductor device capable of additional pickup among semiconductor devices not picked up by the multi-picker;
Moving to and picking up a semiconductor at a closest distance among the semiconductor devices capable of additional pickup; And
And mounting the semiconductor device picked up by the multi-picker on a tray. The method of claim 1,
Determining the interval of the multi-picker,
If the interval between the semiconductor device is included in the minimum interval and the maximum interval of the multi-picker, the semiconductor device sorting method characterized in that for adjusting the distance of the multi-picker by the distance of the semiconductor device. The method of claim 1,
Determining the interval of the multi-picker,
When the distance between the semiconductor element is smaller than the minimum distance of the picker,
And wherein the picker spacing is adjusted to be N times the spacing of the semiconductor elements, where N is the minimum natural number value of N where the spacing of the pickers is less than N times the spacing of the semiconductor elements. Sorting method. The method of claim 1,
Determining the interval of the multi-picker,
In the case where the distance between the semiconductor elements is greater than the maximum distance between the pickers,
Wherein the interval of the pickers is adjusted to be 1 / N times the interval of the semiconductor elements (where N is a minimum natural number value equal to 1 / N times the interval of the semiconductor elements). A semiconductor element sorting method. The method of claim 1,
Measuring the gap of the semiconductor device,
The semiconductor device sorting method, characterized in that the minimum value is determined as the interval of the semiconductor device when there are several values of the interval of the semiconductor device.

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