JPH01309360A - Manufacture of lead pin having silver solder - Google Patents
Manufacture of lead pin having silver solderInfo
- Publication number
- JPH01309360A JPH01309360A JP5622088A JP5622088A JPH01309360A JP H01309360 A JPH01309360 A JP H01309360A JP 5622088 A JP5622088 A JP 5622088A JP 5622088 A JP5622088 A JP 5622088A JP H01309360 A JPH01309360 A JP H01309360A
- Authority
- JP
- Japan
- Prior art keywords
- silver solder
- silver
- pin
- lead pin
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 42
- 238000004519 manufacturing process Methods 0.000 title claims description 21
- 229910052751 metal Inorganic materials 0.000 claims abstract description 13
- 239000002184 metal Substances 0.000 claims abstract description 13
- 238000002788 crimping Methods 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 abstract description 12
- 238000000034 method Methods 0.000 abstract description 5
- 239000012298 atmosphere Substances 0.000 abstract description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract 2
- 229910052757 nitrogen Inorganic materials 0.000 abstract 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 14
- 229910052709 silver Inorganic materials 0.000 description 14
- 239000004332 silver Substances 0.000 description 14
- 238000005452 bending Methods 0.000 description 7
- 229910000833 kovar Inorganic materials 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の目的〕
（産業上の利用分野）
本発明はＰＧＡパッケージなどに使用される銀ろう付き
リードビンの製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Field of Application) The present invention relates to a method for manufacturing a lead bin with silver solder used in PGA packages and the like.
（従来の技術）
電子機器の小形、軽量化に伴い、電子回路の高集積化、
高出力化が急速に進められている。上記回路などに使用
される部品の１ツにＰＧＡパッケージ（Ｐｉｎ Ｇｒｉ
ｄ Ａｒｒａｙパッケージ）がある。上記ＰＧＡパッケ
ージには約１００ないし２００個の銀ろう付きり−ドビ
ンが使用されている。上記リードビンはコバールやニッ
ケル４２重量％、残余鉄の鉄・ニッケル合金などが使用
されており、銀ろうは一般に銀７２重量％、残余鋼など
が使用されている。リードピンに銀ろうを付着させる従
来の方法は、金属リードピンをヒータ治具にとりつけて
上記リードの端部に成形された径大のヘッド部に銀ろう
の粒を載置し、真空中または還元雰囲気中で加熱するか
、または還元雰囲気のトンネル炉内で加熱して銀ろうな
溶解させて溶着させ、上記銀ろう付きリードピンをセラ
ミック基板などに銀ろ５で溶着していた。上記従来の銀
ろう付きリードピンの製造は、治具にとりつげたそれぞ
れのり−ドビンのヘッド部に粒状の銀ろうを個々に載置
しなければならない。これに加えて、リードビンの治具
とのなじみが良いためリードビンの離脱が困難であった
。したがってリードピンの製造は多くの労力を要し、治
具とのなじみ、離脱をよくするための加工に特別の設備
が必要であった。さらにリードピン全体が銀ろうを溶着
するために７００℃ないし８５０℃の高温にしなければ
ならないから、銀によってリードピンの材料のコバール
などが劣化、場合によっては酸化し割れが発生する虞れ
があった。また従来のリードピンはその径大に形成され
たヘッド部の頂部のみに銀ろうが溶着されていたから、
セラミック基板などとの接着力が不十分になる虞れがあ
った。(Conventional technology) As electronic devices become smaller and lighter, electronic circuits become more highly integrated.
High output power is being rapidly increased. One of the components used in the above circuits is a PGA package (Pin Gri
d Array package). Approximately 100 to 200 silver solder dobbins are used in the PGA package. The above-mentioned lead bin is made of Kovar or an iron-nickel alloy with 42% by weight of nickel and residual iron, and the silver solder is generally made of 72% by weight of silver and residual steel. The conventional method for attaching silver solder to lead pins is to attach the metal lead pin to a heater jig, place silver solder grains on a large diameter head formed at the end of the lead, and place the silver solder in a vacuum or in a reducing atmosphere. The silver solder is melted and welded by heating in a tunnel furnace under a reducing atmosphere, and the silver soldered lead pin is welded to a ceramic substrate or the like using a silver filter 5. In manufacturing the conventional silver soldered lead pin described above, granular silver solder must be individually placed on the head of each glue dobbin attached to a jig. In addition, it was difficult to remove the lead bin because it fit well with the jig. Therefore, the production of lead pins requires a lot of labor, and special equipment is required for machining to improve fit and separation from the jig. Furthermore, since the entire lead pin must be heated to a high temperature of 700° C. to 850° C. in order to weld the silver solder, there is a risk that the lead pin material, such as Kovar, may deteriorate due to the silver, and in some cases may be oxidized and cracks may occur. Also, with conventional lead pins, silver solder was welded only to the top of the large diameter head.
There was a risk that the adhesive force with ceramic substrates etc. would be insufficient.
（発明が解決しようとする課題）
上記したように従来の銀ろう付きリードピンの製造方法
は、金属リードピンを治具にとりつけて。(Problems to be Solved by the Invention) As described above, the conventional method for manufacturing silver-brazed lead pins involves attaching metal lead pins to a jig.
リードピンの端部に成形された径大のヘッド部に銀ろう
の粒を載せて加熱して銀ろうな溶着させていたから、銀
ろう付けが多くの労力を要し、治具からの離脱をよくす
るための加工が必要になり。Silver solder grains were placed on a large-diameter head formed at the end of the lead pin and heated to weld the silver solder, which required a lot of effort and made it easier to separate from the jig. Processing is required for this purpose.
また加熱時の高温によってリードピンの材料が劣化する
問題があった。本発明は上記の問題を防止する課題に対
してなされたもので、少ない工数で容易に銀ろ５付きリ
ードピンの製造が可能な改良された銀ろう付きリードピ
ンの製造方法を提供することを目的とする。There was also the problem that the material of the lead pin deteriorated due to the high temperature during heating. The present invention was made to solve the problem of preventing the above-mentioned problems, and an object of the present invention is to provide an improved method for manufacturing a lead pin with silver solder, which allows lead pins with silver solder 5 to be easily manufactured with a small number of man-hours. do.
（課題を解決するための手段）
本発明銀ろう付きリードピンの製造方法は金属リードビ
ンの端部の径大ヘッド部の頂部および少なくとも側面に
かけて銀ろうを圧着する工程を有していることを特徴と
する。(Means for Solving the Problems) The method for producing a lead pin with silver solder according to the present invention is characterized in that it includes a step of crimping silver solder onto the top and at least the sides of the large-diameter head portion at the end of a metal lead bin. do.
（作用）
本発明銀ろう付きリードピンの製造方法は、たとえばコ
バールの金属リードビンの端部の径大ヘッド部の頂部か
ら側面にかけて銀ろうを圧着する。(Function) In the method of manufacturing a lead pin with silver solder according to the present invention, silver solder is crimped from the top to the side of the large-diameter head portion at the end of a metal lead pin made of Kovar, for example.
上記銀ろう付きリードピンをセラミック板に載置し窒素
などの雰囲気炉内で８１０℃に加熱、銀ろうを溶解させ
てリードピンをセラミック板に溶着する。銀ろうはリー
ドピンの径大ヘッド部の頂部のみでなく、側面にかけて
圧着されているから。The silver soldered lead pin is placed on a ceramic plate and heated to 810° C. in a nitrogen atmosphere furnace to melt the silver solder and weld the lead pin to the ceramic plate. This is because the silver solder is crimped not only on the top of the large-diameter head of the lead pin, but also on the sides.
圧着が完全でセラミック板溶着後の強度が強く。The crimping is perfect and the strength after welding the ceramic plate is strong.
しかも加熱加工はセラミック板溶着時のみで、リードピ
ン全体が加熱されないからコバールなどのリードピンの
銀による劣化が防止できる。Moreover, the heating process is only performed when welding the ceramic plate, and the entire lead pin is not heated, so lead pins such as Kovar can be prevented from being deteriorated by silver.
（実施例） 本発明製造方法を実施例を参照して説明する。(Example) The manufacturing method of the present invention will be explained with reference to Examples.
添付第１図は本発明製造方法に使用される金属リードビ
ンの正面図、第２図は本発明製造方法によって製造され
た銀ろう付きリードピンの銀ろう部分を切断して示す正
面図である。金属リードビン（１）の端部に＠大のヘッ
ド部（２）が成形されている。FIG. 1 is a front view of a metal lead bin used in the manufacturing method of the present invention, and FIG. 2 is a cutaway front view showing a silver soldered portion of a lead pin with silver solder manufactured by the manufacturing method of the present invention. A large head portion (2) is formed at the end of the metal lead bin (1).
銀ろつ（３）は上記ヘッド部（２）の頂部（４）および
側面（５）に圧着によって被着されている。銀ろう（３
）は側面（５）だけでなく背面（６）にかけて圧着され
ていてもよい。The silver solder (3) is crimped onto the top (4) and side surfaces (5) of the head (2). Silver wax (3
) may be crimped not only on the side surface (5) but also on the back surface (6).
上記本発明銀ろう付きリードピンの製造方法の一実施例
について述べる。金属リードビンはコバールを使用し、
その一端を成形して第１図示のように径大ヘッド部を形
成する。つづいて同じ製造機で上記ヘッド部に銀ろうを
圧着する。この時銀ろうがリードピンの頂部および少な
くとも側面Ｋかけて圧着されるようにする。リードピン
の頂部のみに銀ろうが圧着されていると圧着が不十分の
ものが発生しやすいが、少なくとも側面にまでかけて圧
着すると圧着不十分のものの発生は皆無であった。An embodiment of the method for manufacturing the silver-brazed lead pin of the present invention will be described. The metal lead bin uses Kovar,
One end thereof is molded to form a large-diameter head portion as shown in the first figure. Subsequently, silver solder is crimped onto the head portion using the same manufacturing machine. At this time, make sure that the silver solder is crimped over the top and at least the side K of the lead pin. If the silver solder was crimped only on the top of the lead pin, insufficient crimping was likely to occur, but if the silver solder was crimped to at least the sides, there was no occurrence of insufficient crimping.
上記本発明製造方法によって製造された銀ろう付きリー
ドピンを前記したようにセラミック板にとりつけ窒素雰
囲気中で８１０℃のトンネル式焼成炉で焼成し銀ろうに
よってセラミック板に溶着した。上記セラミック板に溶
着したリードピンについて引張り強度と折り曲げ強度と
を試験した。The silver soldered lead pin manufactured by the manufacturing method of the present invention was mounted on a ceramic plate as described above, fired in a tunnel type firing furnace at 810° C. in a nitrogen atmosphere, and welded to the ceramic plate with silver solder. The lead pins welded to the ceramic plate were tested for tensile strength and bending strength.
引張り強度は従来の製造方法の銀ろう付きリードピンと
全く同等の８ｋｌ？ないし１０ ｋｇの値を示した。The tensile strength is 8kl, which is exactly the same as the silver soldered lead pin made using the conventional manufacturing method. It showed a value of 10 kg to 10 kg.
また、折り曲げ強度の試験は、第３図のようにセロラミ
ック板（力に銀ろう（８）によってとりつけたり−ドピ
ン（９）を矢印（Ａ）および（Ｂ）方向に折り曲げを繰
り返し折り曲げ強度を試験した。その結果を下表に示す
。In addition, the bending strength test was carried out by attaching the celloramic plate (with silver solder (8)) to the celloramic plate (forced) and repeatedly bending the pin (9) in the directions of arrows (A) and (B) as shown in Figure 3. The results are shown in the table below.
表
上記結果より明らかなように本発明製造方法は従来の製
造方法より折り曲げ強度が強く、銀によるり−ドピンの
劣化が防止されたことを示している。なお、上記結果中
０．５は往復の折り曲げ試験の際の往で外れた事を示し
ている。As is clear from the results in the table above, the manufacturing method of the present invention has higher bending strength than the conventional manufacturing method, indicating that deterioration of the doped pin due to silver was prevented. Note that 0.5 in the above results indicates that the bending test failed during the reciprocating bending test.
以上詳述したように本発明銀ろう付きリードビンの製造
方法は金属リードピンの端部の径大ヘッド部の頂部およ
び少なくとも側面にかけて銀ろうを圧着する工程を有し
ていることを特徴とし、銀ろうのリードビンとの圧着が
完全で、しかも工数が少な（す〜ドビンの銀による劣化
の発生がなく強度の強い銀ろう付きリードビンを提供で
きる効果を有している。As detailed above, the method for manufacturing a lead bottle with silver solder according to the present invention is characterized by having a step of crimping silver solder onto the top and at least the sides of the large-diameter head portion at the end of the metal lead pin. It has the effect of being able to provide a strong silver-brazed lead bin that is completely crimped with the lead bin and requires less man-hours (there is no deterioration of the lead bin due to silver).
第１図は本発明製造方法に使用される金属ＩＪ ＋ドビ
ンの正面図、第２図は本発明製造方法によって製造され
た銀ろう付きリードビンの銀ろう部分を切断して示す正
面図、第３図はセラミック板にとりつけた銀ろう付きリ
ードビンの折り曲げ試験の模式正面図である。
（１） 、 （９）・・・・・・金属リードビン。
（２）・・・・・・ヘッド部、 （３）、（８）
・・・・・・銀ろう（４）・・・・・・頂部、（５）・
・・・・・側面。Fig. 1 is a front view of a metal IJ + dobbin used in the manufacturing method of the present invention, Fig. 2 is a front view cut away showing a silver soldered portion of a lead bin with silver solder manufactured by the manufacturing method of the present invention, and Fig. 3 The figure is a schematic front view of a bending test of a silver-brazed lead bottle attached to a ceramic plate. (1), (9)...Metal lead bin. (2)...Head part, (3), (8)
...Silver solder (4) ...Top, (5)
·····side.
Claims (1)
頂部および少なくとも側面にかけて銀ろうを圧着する工
程を有していることを特徴とする銀ろう付きリードピン
の製造方法。A method for producing a lead pin with silver solder, comprising the step of crimping silver solder onto the top and at least the sides of a large-diameter head portion formed at the end of the metal lead pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5622088A JPH01309360A (en) | 1988-03-11 | 1988-03-11 | Manufacture of lead pin having silver solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5622088A JPH01309360A (en) | 1988-03-11 | 1988-03-11 | Manufacture of lead pin having silver solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01309360A true JPH01309360A (en) | 1989-12-13 |
Family
ID=13021021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5622088A Pending JPH01309360A (en) | 1988-03-11 | 1988-03-11 | Manufacture of lead pin having silver solder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01309360A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5683255A (en) * | 1993-12-03 | 1997-11-04 | Menze; Marion John | Radio frequency connector assembly |
| KR100966337B1 (en) * | 2008-05-16 | 2010-06-28 | 삼성전기주식회사 | method for joining lead pin used as a package board to the package board |
| JP2011141219A (en) * | 2010-01-08 | 2011-07-21 | Micronics Japan Co Ltd | Probe for electric test, method for manufacturing the same, electric connection device, and method for manufacturing the same |
| JP5060965B2 (en) * | 2006-01-25 | 2012-10-31 | 株式会社日本マイクロニクス | Probe for energization test, probe assembly and manufacturing method thereof |
-
1988
- 1988-03-11 JP JP5622088A patent/JPH01309360A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5683255A (en) * | 1993-12-03 | 1997-11-04 | Menze; Marion John | Radio frequency connector assembly |
| JP5060965B2 (en) * | 2006-01-25 | 2012-10-31 | 株式会社日本マイクロニクス | Probe for energization test, probe assembly and manufacturing method thereof |
| KR100966337B1 (en) * | 2008-05-16 | 2010-06-28 | 삼성전기주식회사 | method for joining lead pin used as a package board to the package board |
| JP2011141219A (en) * | 2010-01-08 | 2011-07-21 | Micronics Japan Co Ltd | Probe for electric test, method for manufacturing the same, electric connection device, and method for manufacturing the same |
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