JPS60113449A - Manufacture of lead pin with difficultly processed solder - Google Patents
Manufacture of lead pin with difficultly processed solderInfo
- Publication number
- JPS60113449A JPS60113449A JP22125183A JP22125183A JPS60113449A JP S60113449 A JPS60113449 A JP S60113449A JP 22125183 A JP22125183 A JP 22125183A JP 22125183 A JP22125183 A JP 22125183A JP S60113449 A JPS60113449 A JP S60113449A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- lead pin
- lead
- solder
- brazing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4885—Wire-like parts or pins
Abstract
Description
【発明の詳細な説明】
本発明は、集積回路や電子装置の容器に於いて使用する
端子に、予めAu−3n合金、Au−Al合金等の難加
工性材料をろう材として取付けたリートピンの製造方法
に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention provides a method for manufacturing REIT pins in which a difficult-to-process material such as Au-3n alloy or Au-Al alloy is attached as a brazing material in advance to terminals used in containers for integrated circuits and electronic devices. Regarding the manufacturing method.
Au−3n合金は、常温では加工性が悪い為、従来は〆
審問して作ったインゴットを熱間加工して条材又は板材
となし、さらに切断したりプレス加工してプリフォーム
材料としてろう材に供していた。Au-3n alloy has poor workability at room temperature, so in the past, ingots were made by final processing, then hot-processed into strips or plates, and then cut or pressed to produce brazing materials as preform materials. It was served to
(1)
しかし条+1.板材を圧延した際、加工性が悪い為、耳
割れが発生し易く、耳割れが発生した場合にはその部分
を切除することになるので、甚だ材料の歩留りが悪く、
しかも加工に手間取る等の問題があった。(1) But article +1. When rolling plate materials, due to poor workability, edge cracks are likely to occur, and if edge cracks occur, that part has to be cut out, resulting in a very poor material yield.
Moreover, there were problems such as processing time.
またリードピンはFe−Ni合金やFe−Ni−Co合
金の素材をピン形状に加工して作り、これの一端をメタ
ライズしたセラミック基板の上に載せたA II −S
n合金ろうの上に重ねて溶融ろうイ」けするのである
が、この方法の場合、Au−3n合金ろうをセラミック
基板上にセットしたカーボン治具の孔内へ挿入する際に
2個入ってしまたったり、入れ忘れたりするミスやリー
ドピンの錆等によりリードピンとセラミック基板上のメ
タライズ被膜との間のろう付は不良が発生し易く、また
端子数を100以上も電子装置の容器に据付けたものが
めずらしくない昨今ではろう付は不良は容器の製造歩留
りに対し100倍以上の結果となって影響する。ろう付
は不良発生確率が0.1%であったとすれば、容器の不
良発生率は10%にもなってしく2)
マウ為、更に2桁も3桁も信頼性の高いろう付は方法の
出現が要望されていた。In addition, the lead pin is made by processing Fe-Ni alloy or Fe-Ni-Co alloy material into a pin shape, and one end of this is placed on a metalized ceramic substrate.
In this method, when inserting the Au-3N alloy solder into the hole of the carbon jig set on the ceramic substrate, two pieces are placed on top of the Au-3N alloy solder. Brazing between the lead pin and the metallized coating on the ceramic substrate is prone to failure due to mistakes such as tying or forgetting to insert the lead pin, rust etc. Nowadays, defective brazing has a 100 times greater impact on the manufacturing yield of containers. If brazing has a failure rate of 0.1%, the failure rate of containers would be as high as 10%2) Therefore, brazing is a method that is two or three orders of magnitude more reliable. The appearance of was requested.
本発明は斯かる諸事情に鑑みなされたもので、リードピ
ンのろう付けの信頼性を飛躍的に向上させることができ
、しかも難加工性のろう材の製造歩留りを向上させるこ
とのできる難加工炒ろう利付リードピンの製造方法を提
供せんとするものである。The present invention has been developed in view of the above circumstances, and is a method of brazing that is difficult to process, which can dramatically improve the reliability of brazing lead pins, and also improve the manufacturing yield of brazing filler metal, which is difficult to process. It is an object of the present invention to provide a method for manufacturing a lead pin with a braze.
以下本発明による難加工性ろう材イボリードピンの製造
方法の一実施例を具体的に説明する。An embodiment of the method for manufacturing a difficult-to-process brazing material ivory pin according to the present invention will be described in detail below.
純度99.995%のAuを用いて外径4.Qmm、内
径2.63m+a、長さ1mのパイプを作成し、この中
に直径2.51111長さ 1.1mのSn線を挿入し
、引抜加工にて直径0.5mmまで引落し、A u /
S nのクラッド線を作った。このクラッド線を小型
プレスにて長さ 0.51に切断し、その小片をカーボ
ントレイに並べ、非酸化性雰囲気中にて850℃に加熱
溶融して球状化した。この球を分析した結果、AuとS
nの成分比は80%−20%となっていて、一様な合金
となっていることが確認された。Using Au with a purity of 99.995%, the outer diameter is 4. A pipe with Qmm, inner diameter 2.63m+a, and length 1m was created, and a Sn wire with a diameter of 2.51111 and a length of 1.1m was inserted into this pipe, and it was drawn down to a diameter of 0.5mm using a drawing process, and A u /
A cladding wire of S n was made. This clad wire was cut into lengths of 0.51 mm using a small press, and the pieces were arranged on a carbon tray and heated and melted at 850° C. in a non-oxidizing atmosphere to form spheres. As a result of analyzing this ball, Au and S
The component ratio of n was 80%-20%, and it was confirmed that the alloy was uniform.
(3)
次に第1図に示す如くカーホン治具1の多数の孔2内に
リードピン3を挿入し、夫々その上端に前記Au −S
n 20%合金合金を1個づつ載せてセットした後、
水素雰囲気の炉中にて350°Cで加熱溶着した。この
、A、 u −S n 20%合金合金を加熱溶着した
リードピン3を1本づつ顕微鏡にて20倍に拡大して検
査した結果、全てのり一ドピン3に載せたA u −S
n 20%合金合金が第2図に示されるように確実に
再溶融し、リードピン3に融着していることが確認され
た。(3) Next, as shown in FIG. 1, insert the lead pins 3 into the numerous holes 2 of the carphone jig 1, and attach the Au-S to the upper end of each lead pin 3.
n After placing and setting the 20% alloy one by one,
Heat welding was carried out at 350°C in a hydrogen atmosphere furnace. As a result of inspecting each of the lead pins 3 to which the 20% A, u-S n alloy was heat-welded under a microscope under magnification of 20 times, it was found that all of the A u -S
It was confirmed that the n20% alloy was remelted and fused to the lead pin 3 as shown in FIG.
然して上記の如く製造されたA LJ −S n 20
%ろう材4′付リードピン3′を、!A3図に示す如く
Nl板5−ヒにセットしたカーボン治具6の10001
闇の孔7内に夫々A u −S n 20%ろう材4′
を下側にて挿入し、該ろう材4′をNl板5に接触させ
て七ソトシ、窒素雰囲気の炉中で400°Cにてリード
ピン3′をろう付けした結果、全てのリードピン3′が
第4図の様に一様なメニスカスを形成してNl板5にろ
う接されていて、いずれのリードピン3も90度3回の
折曲げ試験でもNii板から(4)
外れたり、割れを生じたりするものは全く無かった。However, A LJ-S n 20 manufactured as above
Lead pin 3' with % brazing filler metal 4'! 10001 of the carbon jig 6 set on the Nl plate 5-A as shown in Figure A3.
A u - S n 20% brazing filler metal 4' in each dark hole 7
The solder metal 4' was brought into contact with the Nl plate 5, and the lead pins 3' were brazed at 400°C in a nitrogen atmosphere furnace for seven minutes. As a result, all the lead pins 3' were As shown in Fig. 4, a uniform meniscus is formed and the lead pins 3 are soldered to the Ni plate 5, and even in three 90 degree bending tests, none of the lead pins 3 detached from the Ni plate (4) or cracked. There was absolutely nothing to do.
尚、上記実施例ではAu−Sn合金のろう材付リードピ
ンを製造する場合について説明したが、これに限るもの
ではなく、A u −A I合金、その他の合金等の難
加工性ろう材の場合に適用するものである。In the above embodiment, a case was explained in which a lead pin with a brazing material made of Au-Sn alloy was manufactured, but the invention is not limited to this, and it is also possible to manufacture a lead pin with a brazing material made of Au-Sn alloy and other alloys that are difficult to process. This applies to
辺上の説明で判るように本発明の難加工性ろう材付リー
ドピンの製造方法は、リードピン(又はリードフレーム
)に予めAu−Sn合金等の難加工性ろう材をろう付け
するので、リードピン取イ」け時のろう付は不良の発生
が飛躍的に改善できる。As can be seen from the above explanation, the method for manufacturing lead pins with a difficult-to-work brazing material of the present invention involves brazing the lead pin (or lead frame) with a difficult-to-work brazing material such as an Au-Sn alloy in advance, so it is easy to attach the lead pin. During brazing, the occurrence of defects can be dramatically reduced.
また予めセラミックとリードピンのろう付は温度よ幻も
低温で融点より高い温度で、ろう材の溶融を確かめ、不
良なものは選別することが出来るので、不純物や成分の
偏析によるろう何時の溶は残りや流れ不良を心配する必
要が全く無い。In addition, when brazing the ceramic and lead pin in advance, the temperature is much lower than the melting point, and it is possible to check the melting of the filler metal and screen out defective ones, so that melting during the soldering due to segregation of impurities and components can be avoided. There is no need to worry about residue or poor flow.
ざらに難加工性ろう材もその単体元素では加工性が良い
ので、単体元素のクラ・ノド材を予め一定の寸法、体積
の固片にした後、加熱溶融して球状(5)
化するので、材料加工も容易であるばかりでな(、リー
トピンに取付けられるろう材の体積は一定となっ”ζ、
ろう付けの信頼性の高い難加工性ろう材イづリードピン
を得ることができる等の優れた効果がある。Even the brazing filler metal, which is difficult to work with, has good workability when it comes to its single elements. Therefore, after making solid pieces of single elements of a certain size and volume in advance, they are heated and melted to form a spherical shape (5). Not only is the material processing easy (but the volume of the filler metal attached to the Riet pin is constant"ζ,
It has excellent effects such as being able to obtain a lead pin with a difficult-to-process brazing material that has high brazing reliability.
第1図は本発明の難加工性ろう材(=Jリードピンの製
造方法に於いて、リードピンにろう材をろう付けする状
態を示す図、第2図は本発明の製造方法により得られた
難加工性ろう材付リードピンを示す図、第3図は第2図
の難加工性ろう材付り−ドビンをNl板に溶接する状態
を示す図、第4図はA u −S n 20%をNi板
上にろう付けした状態と、その接合強度試験の為の折り
曲げ試験方法を示す図である。
1−−−−−一カーボン治具、2−−−−−一孔、3−
−−−一−リードピン、3 ゛−−−ろう材付リードピ
ン、4.−−−−− A t+−3n 20%合金合金
5−−−− N i板、6−−−−−カーボン冶具、7
−−−−−一孔。
出願人 田中貴金属工業株式会社
(6)
第4図Fig. 1 is a diagram showing a state in which a brazing filler metal is brazed to a lead pin in the manufacturing method of the difficult-to-process brazing material (=J lead pin) of the present invention, and Fig. 2 is a diagram showing the difficult-to-process brazing material obtained by the manufacturing method of the present invention. A diagram showing a lead pin with workable brazing material, Figure 3 is a diagram showing a state in which the hard-to-workable brazing material of Figure 2 is welded to an Nl plate, and Figure 4 is a diagram showing a state in which the lead pin with a brazing material that is difficult to work is welded to an Nl plate. It is a diagram showing a state where it is brazed on a Ni plate and a bending test method for testing its bonding strength.
---1-Lead pin, 3 ゛---Lead pin with brazing material, 4. ------- At+-3n 20% alloy alloy 5------ Ni plate, 6---Carbon jig, 7
----- One hole. Applicant Tanaka Kikinzoku Kogyo Co., Ltd. (6) Figure 4
Claims (1)
金を用いたクラツド材を作り、次に所要の寸法又は体積
迄加工した後加熱溶融して合金となし、然る後合金の溶
融点より高い温度でリードピンに溶融して取付けること
を特徴とする難加工性ろう材付リードピンの製造方法。A clad material is made using a single element of VFT workable material or an alloy with relatively good workability, and then processed to the required size or volume, heated and melted to form an alloy, and then A method for producing a lead pin with a hard-to-process brazing material, which is characterized by melting and attaching the lead pin to the lead pin at high temperature.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22125183A JPS60113449A (en) | 1983-11-24 | 1983-11-24 | Manufacture of lead pin with difficultly processed solder |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22125183A JPS60113449A (en) | 1983-11-24 | 1983-11-24 | Manufacture of lead pin with difficultly processed solder |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60113449A true JPS60113449A (en) | 1985-06-19 |
JPH0550142B2 JPH0550142B2 (en) | 1993-07-28 |
Family
ID=16763838
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22125183A Granted JPS60113449A (en) | 1983-11-24 | 1983-11-24 | Manufacture of lead pin with difficultly processed solder |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60113449A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63265456A (en) * | 1986-12-24 | 1988-11-01 | Tanaka Kikinzoku Kogyo Kk | Manufacture of brazing lead pin and junction thereof |
JPH02177554A (en) * | 1988-12-28 | 1990-07-10 | Tokuriki Honten Co Ltd | Method and apparatus for producing lead pin provided with solder |
KR100499321B1 (en) * | 2002-04-26 | 2005-07-04 | 정일조 | Spot welding apparatus for ear ring pin |
CN107813090A (en) * | 2016-09-13 | 2018-03-20 | 富鼎电子科技(嘉善)有限公司 | A kind of probe preparation method and the welding fixture for preparing the probe |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5823466A (en) * | 1981-08-04 | 1983-02-12 | Tanaka Kikinzoku Kogyo Kk | Lead pin for integrated circuit device |
JPS5835093A (en) * | 1981-08-25 | 1983-03-01 | Tanaka Kikinzoku Kogyo Kk | Composite brazing material |
-
1983
- 1983-11-24 JP JP22125183A patent/JPS60113449A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5823466A (en) * | 1981-08-04 | 1983-02-12 | Tanaka Kikinzoku Kogyo Kk | Lead pin for integrated circuit device |
JPS5835093A (en) * | 1981-08-25 | 1983-03-01 | Tanaka Kikinzoku Kogyo Kk | Composite brazing material |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63265456A (en) * | 1986-12-24 | 1988-11-01 | Tanaka Kikinzoku Kogyo Kk | Manufacture of brazing lead pin and junction thereof |
JPH02177554A (en) * | 1988-12-28 | 1990-07-10 | Tokuriki Honten Co Ltd | Method and apparatus for producing lead pin provided with solder |
KR100499321B1 (en) * | 2002-04-26 | 2005-07-04 | 정일조 | Spot welding apparatus for ear ring pin |
CN107813090A (en) * | 2016-09-13 | 2018-03-20 | 富鼎电子科技(嘉善)有限公司 | A kind of probe preparation method and the welding fixture for preparing the probe |
CN107813090B (en) * | 2016-09-13 | 2021-08-31 | 富鼎电子科技(嘉善)有限公司 | Probe preparation method and welding jig for preparing probe |
Also Published As
Publication number | Publication date |
---|---|
JPH0550142B2 (en) | 1993-07-28 |
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