JPS5835093A - Composite brazing material - Google Patents

Composite brazing material

Info

Publication number
JPS5835093A
JPS5835093A JP13285881A JP13285881A JPS5835093A JP S5835093 A JPS5835093 A JP S5835093A JP 13285881 A JP13285881 A JP 13285881A JP 13285881 A JP13285881 A JP 13285881A JP S5835093 A JPS5835093 A JP S5835093A
Authority
JP
Japan
Prior art keywords
metal
core
alloy
melting point
brazing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13285881A
Other languages
Japanese (ja)
Inventor
Kozo Kashiwagi
孝三 柏木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Priority to JP13285881A priority Critical patent/JPS5835093A/en
Publication of JPS5835093A publication Critical patent/JPS5835093A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0227Rods, wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)

Abstract

PURPOSE:To obtain a brazing material which can easily be made into a wire or plate even when plural metal elements lowering workability are contained, by mixing a metal or alloy, which has a melting point lower than that the external circumferential material of a high-melting-point metal or alloy so that the melting point decreases gradually toward the core. CONSTITUTION:For example, a cylinder made of is used as an external circumferential material, and a core material uses tin; and the core material of tin is intruded into the cylinder of copper and then extrusion and wire drawing are performed. When a metal or alloy having a melting point lower than that of the external circumferential material is used, the core material is never melted even when the external circumferential material is melted by external heat during brazing operation. Further, when the core material is heated up to the melting temperature, the external circumferential material is melted more than necessary to flow out to even parts other than a part to be brazed. For this purpose, the melting point is decreased gradually toward the core.

Description

【発明の詳細な説明】 本発明は加工性の悪いろう材の改良に関するものである
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to the improvement of brazing filler metals with poor workability.

一般にろう材に於いては、ろう流れ、ろう壁強度を改善
する目的で、8n、P等を添加したろう材が用いられる
が、これ等の金属元素を多量に添加した場合材料が脆く
なり、従って加工性に乏しく、線材或いは板材と成す事
が困難でありた。更には添加する元素によりては、被ろ
う接材料の種類がろう付性、ろう壁強度の点から限定さ
れてしまうという欠点があった。
Generally, brazing filler metals containing 8n, phosphorus, etc. are used to improve the flow of the filler and the strength of the filler wall, but if large amounts of these metal elements are added, the material becomes brittle. Therefore, it has poor workability and is difficult to form into wire or plate material. Furthermore, depending on the added elements, the types of materials to be soldered are limited in terms of brazing properties and strength of the solder wall.

本発明はこの様な実情に鑑みて成されたものであり、合
金材料と成した場合加工性に乏しくなる様な金属元素を
多量に含有させても容易に線材或いは板材と成す事が出
来、更には被ろう接材料の種類も限定されないろう材を
提供せんとするものである。
The present invention was made in view of these circumstances, and even if it contains a large amount of metal elements that would have poor workability if made into an alloy material, it can be easily made into a wire or plate material. Furthermore, it is an object of the present invention to provide a brazing material that is not limited in the type of soldering material to be covered with it.

以下本発明より成るろう材について説明すると先ず外周
材に融点の高い金属又は合金材料を配し芯に近づく租順
次外周材よシ融点の低い金属又は合金材料を配し、少な
くとも2層以上の複合ろう材と成すものである。尚この
複合ろう材の形状は一状或いは板状でも良(、線状材料
の場合最終芯材となる金属又は合金材料の線径は複合ろ
う材令体の総線径に関係なく3m以下である事が望まし
く、又板状材料の場合に於いても、最終芯材となる金属
又は合金材料の厚は、複合ろう材全体の総板1vに関係
なく3■以下である事が望ましいものである。
The brazing filler metal of the present invention will be explained below. First, a metal or alloy material with a high melting point is placed on the outer circumferential material, and a metal or alloy material with a low melting point is arranged on the outer circumferential material in parallel order approaching the core, and a composite material of at least two or more layers is arranged. It is made of brazing filler metal. The shape of this composite brazing material may be a single shape or a plate (in the case of a wire material, the wire diameter of the metal or alloy material that becomes the final core material must be 3 m or less, regardless of the total wire diameter of the composite brazing material). Even in the case of plate-shaped materials, it is desirable that the thickness of the metal or alloy material that becomes the final core material be 3 mm or less, regardless of the total plate 1v of the entire composite brazing material. be.

ここで、外周材及び芯材となる金属又は合金材料は、被
ろう接材群の種類及び必要とするろう接強度等の点から
任意に選定すれば良く、この際外周材の方がその融点が
高くなる様配慮すれば良いものである、又その構成を2
層以上何層にするかという漬についても同様であり、溶
融した時点でのろう付特性より考慮し決定すれば良い。
Here, the metal or alloy material that becomes the outer circumferential material and the core material may be arbitrarily selected from the viewpoints of the type of soldering material group to be covered and the required brazing strength, etc. In this case, the outer circumferential material has a higher melting point. It is only necessary to take care to make the structure high.
The same applies to the number of layers to be used, and the decision can be made in consideration of the brazing characteristics at the time of melting.

尚外周材に融点の高い金属又は合金材料を配し芯に近づ
くにつれて順次外周材よりも融点の低い金属又は合金材
料を配した構成とするのは、当該複合ろう材をろう付作
業に用いた場合、外周材に芯材よりも融点の低い金属又
は合金材料を用いると外部よりの加熱にて外周材が溶融
した状態でも芯材は溶融せず、芯材が溶融する温度にま
で加熱温度を上昇させると、先に溶融した外周材は必要
以上に溶融してしまうことになり、ろう付しようとする
部分以外にも流れ出してしまうことになる。
In addition, the structure in which a metal or alloy material with a high melting point is arranged on the outer circumferential material and a metal or alloy material with a lower melting point than the outer circumferential material is arranged in order as it approaches the core is because the composite brazing material is used for brazing work. In this case, if a metal or alloy material with a lower melting point than the core material is used for the outer material, the core material will not melt even if the outer material is melted by external heating, and the heating temperature will not be increased to the temperature at which the core material melts. If it is raised, the peripheral material that was melted first will melt more than necessary, and it will flow out to areas other than the parts to be brazed.

従って、外周材を融点の高い金属又は合金材料とし、芯
材t−順次外周材よシも融点の低い金属又は合金材料と
する事が必要となるものである。次に当該複合ろう材を
線材或いは板材と成した場合、−材に於いては最終芯材
となる金属又は合金材料の線径を3w以下とし、同様に
板材に於いても最終芯材となる金属又は合金材料の板厚
を総板厚に関係なく3w以下とするのけ、これ等の寸法
が各々3M以上では、ろう付作業を行なう際に、外部よ
りの加熱により外周材より先に芯材が浴は出し流れ出し
てしまうからである。ところが3u以下では、表面張力
及び毛細管現象等により外周材より先に芯材が溶融状態
となっても流れ出す事がなく、外周材が溶融し流れ出し
た時点で芯材も流れ出し、ろう付時に所望する成分組成
のろう材となる。従って最終芯材となる金属又は合金材
料の7法は各々3wa以下である事が好ましいものであ
る。
Therefore, it is necessary to make the outer circumferential material a metal or alloy material with a high melting point, and to make the core material t and the outer circumferential material sequentially also metals or alloy materials with a low melting point. Next, when the composite brazing material is made into a wire rod or plate material, the wire diameter of the metal or alloy material that becomes the final core material in the - material is 3W or less, and similarly in the case of the plate material, it becomes the final core material. Although the plate thickness of the metal or alloy material is 3W or less regardless of the total plate thickness, if each of these dimensions is 3M or more, the core may be heated before the outer material due to external heating during brazing work. This is because the wood will drain out of the bath and flow out. However, at 3u or less, even if the core material melts before the outer material due to surface tension and capillary phenomenon, it will not flow out, and when the outer material melts and begins to flow, the core material will also flow out, resulting in the desired state during brazing. It becomes a brazing filler metal with a composition of ingredients. Therefore, it is preferable that the metal or alloy material used as the final core material has a weight of 3 wa or less in each of the seven methods.

この様にして得られた複合ろう材は、例え合金材料と成
した場合VcFi加工性に乏しくなり線材或いは板材と
成す事が出来ない様な金属元素を使用する場合でも、他
の金属元素と合金化せず単体の11使用すれば良く、従
って容易に加工する事が出来、線材、板材と成す事が出
来るものである。
The composite brazing filler metal obtained in this way can be alloyed with other metal elements, even when using a metal element that would have poor VcFi processability if formed into an alloy material and cannot be formed into a wire or plate material. It suffices to use a single piece 11 without changing it, and therefore it can be easily processed and can be made into wire rods or plate materials.

次に本発明を更に明瞭ならしむるべく、その具体的な実
施例について説明する。
Next, in order to further clarify the present invention, specific examples thereof will be described.

〔実施例〕〔Example〕

Cuより成る円筒を外周材とし、芯材fanとしCuの
円筒にanの芯材管挿入した後押出し伸線加工を施し、
総線径2 / m 、芯材のSnの径を054 勧とし
、浴融した時の成分組成がCu −30′W10 Sn
となる様なCuと8nの複合ろう材を製造した。
A cylinder made of Cu was used as the outer circumferential material, and a core material of the fan was inserted into the Cu cylinder, followed by extrusion and wire drawing.
The total wire diameter is 2/m, the diameter of Sn in the core material is 054 mm, and the component composition when melted in a bath is Cu-30'W10 Sn.
A composite brazing filler metal of Cu and 8N was manufactured as follows.

この様にして得られた複合ろう材を用いて、C2H2+
 02ガスにより、黄銅同志をトーチろう付にてろう付
加工を行なり之。この際同時にJI8″Z3194Cろ
う付継手の引張り及びせん断試験片)K規定する4号試
験片を用い、同様にJI8Z3192(ろう付継手のせ
ん断試験)に基づきせん断試験を行なった所、そのせん
断強度は約29KF/−であった。
Using the composite brazing filler metal obtained in this way, C2H2+
Using 02 gas, the brass pieces were torch-brazed. At the same time, a shear test was also conducted based on JI8Z3192 (shear test for brazed joints) using a No. 4 test piece specified by JI8''Z3194C brazed joint tensile and shear test piece) K, and the shear strength was It was about 29KF/-.

次に上述し念本発明より成るC u −30λ8n複合
ろう材0.1f’に用いて、JI8Z3191(硬ろう
の広がり試験)に基づき広がり試験を行なった所その広
が9性は7,2〜8、I CWIであった。
Next, using the Cu-30λ8n composite brazing filler metal 0.1f' made of the present invention as mentioned above, a spreading test was conducted based on JI8Z3191 (hard solder spreading test), and the spreadability was 7.2 to 7.2. 8. It was I CWI.

これはJI8  AgろうのBAg−1と略同等の広が
り性を有するものである。
This has approximately the same spreadability as BAg-1 of JI8 Ag wax.

比較例として溶解方法によりCu−30vloS”合金
を製造し、2/saの線材を得ようとしたが、材料が脆
く線材と成すことが出来なかった。
As a comparative example, a Cu-30vloS'' alloy was manufactured by a melting method in an attempt to obtain a wire rod of 2/sa, but the material was too brittle to form into a wire rod.

以上詳細に説明した通り、本発明よシ成る複合ろう材は
、他の金属元素と合金化した場合には加工性に乏しくな
る様な金属元素管用いた場合にも単体金属として用いる
事が出来る為、容易に加工する事が出来、線材又は板材
と成す事が出来るものである。更に被ろう接材群の材質
によシ外周材及び芯材の金属又は合金材料を選定すれば
良く、被ろう接材群の材質によりろう材の使用が制限さ
れる蔓はない。
As explained in detail above, the composite brazing filler metal of the present invention can be used as a single metal even when using metal element tubes that would have poor workability when alloyed with other metal elements. , which can be easily processed and made into wire or plate material. Furthermore, the metal or alloy material of the outer circumferential material and the core material may be selected depending on the material of the covering brazing material group, and there is no restriction on the use of the brazing material depending on the material of the covering brazing material group.

更に本発明より成る複合ろう材は、外周材が溶融するま
では外周材の溶融温度より高い温度で加熱する必要があ
るが、外周材が溶融を開始した時点以降は、外周材と芯
材とで自動的に合金化されることになり、加熱温度は外
周材の溶融温度より低い温度で加熱すれば良く、従って
比較的低融点のろう材として用いる事も、外周材と芯材
との組合せにより可能となるもので、゛この様な低MA
ろう材として用いる事に依)省熱エネルギー、ろう付作
業時間の短縮及び加熱時の被ろう接材料の熱による強度
劣化等が防止出来る他、硬ろう材、軟ろう材を用いてス
テップろう付を行なう際のステップろう材として用いる
事も出来るものである。
Furthermore, the composite brazing material of the present invention needs to be heated at a temperature higher than the melting temperature of the outer circumferential material until the outer circumferential material melts, but after the outer circumferential material starts melting, the outer circumferential material and the core material are heated. Therefore, the heating temperature need only be lower than the melting temperature of the outer material, so it can be used as a brazing material with a relatively low melting point, and the combination of the outer material and the core material. This is made possible by ``Such a low MA
By using it as a brazing material, it is possible to save heat energy, shorten brazing work time, and prevent strength deterioration of the material to be soldered due to heat during heating. It can also be used as a step brazing material when performing.

出願人  田中貴金属工業株式会社Applicant: Tanaka Kikinzoku Kogyo Co., Ltd.

Claims (2)

【特許請求の範囲】[Claims] (1)融点の高い金属又は合金材料を外筒材とし、芯に
近づく程順次外周材よりも低融点の金属又は合金材料を
配し、少なくとも2層以上の金輌或いは合金材料より構
成された4Kを%像とする複合ろう材。
(1) A metal or alloy material with a high melting point is used as the outer cylinder material, and metals or alloy materials with a lower melting point than the outer peripheral material are arranged in order as they get closer to the core, and are composed of at least two layers of gold or alloy materials. Composite brazing material with 4K as a percentage image.
(2)前記(1)に記載の複合ろう材に於いて、その形
状が線状又は板状である場合に、最終芯材となる金属又
は合金材料の寸法が線状材に於いては直径3w以下、板
状材に於いては厚が3wa以下である事を特徴とする複
合ろう材。
(2) In the composite brazing material described in (1) above, if the shape is linear or plate-like, the dimensions of the metal or alloy material that will become the final core material are the diameter in the case of a linear material. A composite brazing material characterized by having a thickness of 3w or less, and a thickness of 3wa or less in the case of a plate material.
JP13285881A 1981-08-25 1981-08-25 Composite brazing material Pending JPS5835093A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13285881A JPS5835093A (en) 1981-08-25 1981-08-25 Composite brazing material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13285881A JPS5835093A (en) 1981-08-25 1981-08-25 Composite brazing material

Publications (1)

Publication Number Publication Date
JPS5835093A true JPS5835093A (en) 1983-03-01

Family

ID=15091169

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13285881A Pending JPS5835093A (en) 1981-08-25 1981-08-25 Composite brazing material

Country Status (1)

Country Link
JP (1) JPS5835093A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60113449A (en) * 1983-11-24 1985-06-19 Tanaka Kikinzoku Kogyo Kk Manufacture of lead pin with difficultly processed solder

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53122653A (en) * 1977-04-01 1978-10-26 Hitachi Cable Ltd Phosphorcopper solder and method of fabricating the same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53122653A (en) * 1977-04-01 1978-10-26 Hitachi Cable Ltd Phosphorcopper solder and method of fabricating the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60113449A (en) * 1983-11-24 1985-06-19 Tanaka Kikinzoku Kogyo Kk Manufacture of lead pin with difficultly processed solder
JPH0550142B2 (en) * 1983-11-24 1993-07-28 Tanaka Precious Metal Ind

Similar Documents

Publication Publication Date Title
Zoran Miric et al. Lead‐free alloys
KR880001363A (en) Low toxicity corrosion resistant solder
US20070178007A1 (en) Lead-free solder, solder joint product and electronic component
US4684052A (en) Method of brazing carbide using copper-zinc-manganese-nickel alloys
JPH0318497A (en) Solder with low melting point
JPH05508113A (en) Solder for oxide layer forming metals and alloys
CN108161271A (en) A kind of SnPbBiSb systems low temperature enhancing solder and preparation method thereof
JP3091098B2 (en) Solder alloy for heat exchanger
US4771537A (en) Method of joining metallic components
JPH02101132A (en) Low melting point solder
KR960029492A (en) Manufacturing method of reflow plating member, reflow plating member obtained by the method
AU581323B2 (en) Copper-zinc-manganese-nickel alloys
JPH06182582A (en) Aluminum alloy brazing filler metal for brazing heat exchanger and aluminum alloy brazing sheet for heat exchanger
JPS5835093A (en) Composite brazing material
JPH06182581A (en) Aluminum alloy brazing filler metal for brazing heat exchanger and aluminum alloy brazing sheet for heat exchanger
US2431611A (en) Composite metal solder
AT165091B (en)
US2554233A (en) Brazing alloys
US3355284A (en) Heat-treatable creep-resistant solder
JPH0422595A (en) Cream solder
JPH0150518B2 (en)
JPH08174276A (en) Composite solder material and its manufacture
JPH03114691A (en) Composite brazing filler metal
US3600164A (en) Heat treatable creep resistant solder
JP2002299381A (en) Solder plating ball and method for manufacturing semiconductor connecting structure using the same