CN106067776B - Paste contactless spraying colloid system and method in quartz-crystal resonator production in surface - Google Patents
Paste contactless spraying colloid system and method in quartz-crystal resonator production in surface Download PDFInfo
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- CN106067776B CN106067776B CN201610528991.XA CN201610528991A CN106067776B CN 106067776 B CN106067776 B CN 106067776B CN 201610528991 A CN201610528991 A CN 201610528991A CN 106067776 B CN106067776 B CN 106067776B
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- whole plate
- glue
- pedestal
- individual base
- pedestal whole
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- 238000005507 spraying Methods 0.000 title claims abstract description 137
- 238000000034 method Methods 0.000 title claims abstract description 39
- 239000013078 crystal Substances 0.000 title claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 239000000084 colloidal system Substances 0.000 title abstract description 16
- 239000003292 glue Substances 0.000 claims abstract description 243
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 208
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 17
- 239000007921 spray Substances 0.000 claims description 101
- 238000002347 injection Methods 0.000 claims description 34
- 239000007924 injection Substances 0.000 claims description 34
- 238000012937 correction Methods 0.000 claims description 14
- 239000000178 monomer Substances 0.000 claims description 7
- 239000011159 matrix material Substances 0.000 description 16
- 239000010453 quartz Substances 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 8
- 239000000919 ceramic Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000003672 processing method Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 241001310793 Podium Species 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- -1 upper piece Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The invention belongs to contactless spraying colloid system and methods in electronic component field more particularly to surface patch quartz-crystal resonator production.The spraying colloid system of the present invention includes pedestal whole plate, chip, spraying colloid system, wherein pedestal whole plate and the chip being mounted in pedestal whole plate are respectively positioned on the lower section of nozzle in spraying colloid system.The glue spraying method of the present invention is that multiple individual bases are formed in pedestal whole plate, and the auxiliary electrode of left and right platform and the chip being attached on individual base to individual base carries out glue spraying using contactless mode.The present invention processes whole plate using spray-bonding craft, is moved without Z axis necessary to traditional syringe needle gluing process.Glue spraying efficiency improves 3 times or more than dispensing efficiency.
Description
Technical field
The invention belongs to contactless sprays in electronic component field more particularly to surface patch quartz-crystal resonator production
Colloid system and method.
Background technology
Quartz-crystal resonator is also known as quartz crystal, is commonly called as crystal oscillator, is made using the piezoelectric effect of quartz crystal
Resonant element, be used together with Resistor-Capacitor Unit with semiconductor devices, quartz oscillator can be constituted.
Quartz wafer, hereinafter referred to as chip, it can be square, rectangle or circle etc., in its two corresponding surfaces
Upper coating silver layer as electrode, surface patch quartz-crystal resonator be by conducting resinl by quartz wafer electrode and pedestal into
Row electrical connection, by conducting resinl, quartz wafer is fixed on pedestal, and the auxiliary electrode on quartz wafer also by conducting resinl into
Row coating.
But currently, surface mounting quartz crystal resonator uses always contact gluing process.Specifically using：Profit
The conducting resinl in dispensing needle tubing is released with air pressure；The suction of single pedestal is subjected to dispensing on the platform of sustained height；Dispensing is set
It is standby to install calibration platform and laser ranging system additional, ensure that dispensing needle tubing installation site is consistent and syringe needle dispensing is highly consistent
Property.
Whether all there are many deficiencies for the whole plate processing of contact gluing process or surface patch quartz-crystal resonator.
Contact gluing process there are the problem of：
1, degree highly sensitive to dispensing is high, and syringe needle is excessively high apart from dispensing platform, glue point plastic emitting point, and glue point is less than normal；Syringe needle away from
Too low from dispensing platform, glue point is spread out, and glue point is bigger than normal；It is bad to influence product electrical parameter, can seriously lead to product failure.
2, contact glue amount for dispensing glue control determines by air pressure and time, and when dispensing needs the air pressure of stabilization.
3, base cavity edge and pedestal dispensing platform if glue point is close to cavity edge, can collide syringe needle apart from small.
4, contact dispensing, dispensing needle tubing, syringe needle are controlled by cylinder or motor, and the dispensing time is mainly that Z-direction is transported up and down
The dynamic time, syringe needle, which moves up and down, causes glue spraying efficiency too low.
There are problems for the whole plate processing of surface patch quartz-crystal resonator：
1, pedestal whole plate is sintered by ceramic big plate, and angularity technical specification is to constitute single pedestal maximum of whole plate
Value is 0.05mm；Whole plate maximum value is 0.35mm；The difference in height of each pedestal dispensing platform is more than 0.05mm in whole plate.
2, the whole plate tooling for loading single pedestal, angularity technical specification maximum value is 0.05mm, in addition single base
The angularity of seat, the difference in height of each pedestal dispensing platform is more than 0.05mm in whole plate.
By discussed above it is found that if only with conventional contact gluing process point pedestal whole plate or the list being loaded in tooling
Pedestal can not ensure the glue point diameter on platform, and individual pedestals are even without glue point.
Invention content
In view of the deficiencies of the prior art, contactless glue spraying in patch quartz-crystal resonator production in surface provided by the invention
System and method solves the problems, such as that conventional contact dispensing is bad in pedestal whole plate dispensing, is sprayed by the movement of pedestal
Glue ensures to be coated with the conduction that glue point diameter is consistent, appearance is qualified on each pedestal or so dispensing platform without adjusting dispensing height
Glue, with fixed wafer and pedestal, glue spraying efficiency is higher than efficiency for dispensing glue.
In order to solve the above technical problems, the present invention provides contactless glue spraying system in the patch quartz-crystal resonator production of surface
System, is characterized in that：Including pedestal whole plate 1, chip 4, spraying colloid system, wherein pedestal whole plate 1 and to be mounted on pedestal whole
Chip 4 on plate 1 is respectively positioned on the lower section of nozzle 7 in spraying colloid system.
Further, pedestal whole plate 1 is the big plate of ceramics, and the structure list by matrix arrangement connection is provided on ceramic big plate
Member, each structural unit are an independent individual base 1-1.
Further, pedestal whole plate 1 is whole plate tooling, and whole plate tooling is equipped with the vacancy by matrix arrangement, each vacancy
There are one individual base 1-1 for interior placement.
Further, further include for each individual base position in detection pedestal whole plate and individual base glue spraying state
Vision system I, the vision system II for detecting chip normotopia.
The present invention also provides contactless glue spraying method in the patch quartz-crystal resonator production of surface, special character exists
In forming multiple individual bases in pedestal whole plate, left and right platform to individual base and the chip being attached on individual base
Auxiliary electrode glue spraying is carried out using contactless mode.
On the basis of glue spraying method and technology scheme provided by the invention, the first specific processing method includes following step
Suddenly：
S1, the lower glue of spray：Pedestal whole plate is moved at injection valve and sprays lower glue, conducting resinl is injected in pedestal by glue spraying mode
In whole plate on the left and right platform of an individual base；
S2, upper piece：Suction nozzle draws chip, and carrying out wafer position angle by the electric rotating machine and vision system of suction nozzle rectifys
Just；Pedestal whole plate is placed on to have sprayed in the individual base of lower glue；
S3, glue is sprayed：Pedestal whole plate is returned and sprays gluing at injection valve, it is whole that conducting resinl by glue spraying mode is injected in pedestal
In plate in step S2 on the chip auxiliary electrode of individual base；
S4, according to step S1 to step S3 spraying methods, complete remaining monomer in pedestal whole plate by preset sequence
The glue spraying of pedestal.
On the basis of glue spraying method and technology scheme provided by the invention, second of specific processing method includes following step
Suddenly：
S1, the lower glue of spray sequentially is completed according to spray lower glue step to each individual base in pedestal whole plate respectively：
Pedestal whole plate is moved at injection valve and sprays lower glue, conducting resinl is injected in pedestal whole plate each by glue spraying mode
On the left and right platform of individual base；
S2, upper piece sequentially is completed to each individual base in pedestal whole plate respectively：
Suction nozzle draws chip successively, and wafer position angle correction is carried out by the electric rotating machine and vision system of suction nozzle；It puts
It sets in the case where pedestal whole plate has been sprayed in each individual base of glue；
S3, each individual base in pedestal whole plate is sequentially completed to spray glue respectively：
Pedestal whole plate is returned at injection valve, conducting resinl by glue spraying mode be injected in step S2 in pedestal whole plate complete it is every
On the chip auxiliary electrode of a individual base.
On the basis of glue spraying method and technology scheme provided by the invention, the third specific processing method includes following step
Suddenly：
S1, the lower glue of spray sequentially is completed according to spray lower glue step to the multiple individual bases selected in pedestal whole plate respectively：
Pedestal whole plate is moved at injection valve and sprays lower glue, for the multiple individual bases selected in pedestal whole plate,
Conducting resinl is sequentially injected in multiple individual bases by glue spraying mode on the left and right platform of each individual base；
S2, upper piece sequentially are completed to the multiple individual bases selected in pedestal whole plate respectively：
For the multiple individual bases selected in pedestal whole plate, suction nozzle sequentially draws chip, passes through the electric rotating of suction nozzle
Machine and vision system carry out wafer position angle correction, are sequentially placed on multiple individual bases that pedestal whole plate has sprayed lower glue
It is interior；
S3, respectively the multiple individual bases selected in pedestal whole plate are sequentially completed to spray glue：
For the multiple individual bases selected in pedestal whole plate, pedestal whole plate is returned at injection valve, conducting resinl is by spray
Glue mode is sequentially injected on the chip auxiliary electrode for multiple individual bases that step S2 is completed in pedestal whole plate.
On the basis of glue spraying method and technology scheme provided by the invention, the 4th kind of specific processing method includes following step
Suddenly：
S1, the lower glue of spray sequentially is completed according to spray lower glue step to the individual base for being located at a line in pedestal whole plate：
S11, the lower glue of spray：Pedestal whole plate is moved at injection valve and sprays lower glue, conducting resinl is injected in base by glue spraying mode
With on the left and right platform of a line individual base in seat whole plate；
S12, upper piece：Suction nozzle draws chip, and carrying out wafer position angle by the electric rotating machine and vision system 1 of suction nozzle rectifys
Just；Pedestal whole plate is placed on to have sprayed in same a line individual base of lower glue；
S13, glue is sprayed：Pedestal whole plate is returned at injection valve, conducting resinl is injected in pedestal whole plate by glue spraying mode and is walked
On the chip auxiliary electrode for same a line individual base that rapid S12 is completed；
S2, entire glue spraying process is sequentially completed to each individual base on pedestal whole plate remaining row according to the step of S1.
On the basis of glue spraying method and technology scheme provided by the invention, the 5th kind of specific processing method includes following step
Suddenly：
S1, the lower glue of spray sequentially is completed according to spray lower glue step to the individual base for being located at same row in pedestal whole plate：
S11, the lower glue of spray：Pedestal whole plate is moved at injection valve and sprays lower glue, conducting resinl is injected in base by glue spraying mode
In seat whole plate on the left and right platform of same row individual base；
S12, upper piece：Suction nozzle draws chip, and carrying out wafer position angle by the electric rotating machine and vision system 1 of suction nozzle rectifys
Just；Pedestal whole plate is placed on to have sprayed in the same row individual base of lower glue；
S13, glue is sprayed：Pedestal whole plate is returned at injection valve, conducting resinl is injected in pedestal whole plate by glue spraying mode and is walked
On the chip auxiliary electrode for the same row individual base that rapid S12 is completed；
S2, according to the step of S1, to pedestal whole plate, remaining each individual base arranged sequentially completes entire glue spraying process.
Compared with prior art, the present invention it is beneficial in that：The present invention is for surface patch quartz-crystal resonator
Whole plate is processed.Since each individual base dispensing podium level relative error in whole plate is big, using contactless spray-bonding craft
Conventional contact gluing process is substituted, solves the problems, such as that traditional gluing process processing whole plate pedestal glue point diameter consistency is poor.
Whole plate is processed using spray-bonding craft, is moved without Z axis necessary to traditional syringe needle gluing process.Glue spraying efficiency is carried than dispensing efficiency
High 3 times or more.
The present invention utilizes contactless glue spraying, the production technology of the surface patch quartz-crystal resonator of fixed wafer and pedestal
Easy to operate, cost performance is much better than traditional contact spot gluing equipment, is mainly reflected in following several points：
1, using contactless glue spraying, solve the problems, such as that conventional contact dispensing is bad in pedestal whole plate dispensing.
2, due in spray-bonding craft, without adjusting dispensing height, therefore the operative skill of employee is required low, is easy to grasp
Make.
3, glue spraying process saves conventional contact dispensing needle head and moves up and down the time, improves the efficiency of gluing.
4, glue spraying directly is carried out to pedestal whole plate, relative to tradition to the dispensing one by one of single pedestal, glue spraying equipment volume becomes
Small, cost performance is much better than traditional contact spot gluing equipment.
Description of the drawings
Fig. 1 is pedestal whole plate schematic diagram one of the present invention；
Fig. 2 is pedestal whole plate schematic diagram two of the present invention；
Fig. 3 is individual base schematic diagram of the present invention；
Fig. 4 is status diagram after individual base glue spraying of the present invention,
Fig. 5 is the structural schematic diagram of spraying colloid system of the present invention.
Description of symbols：1, pedestal whole plate, 1-1, individual base, 2, left platform, 3, right platform, 4, chip, 5, auxiliary electrode, 6,
Conducting resinl, 7, nozzle.
Specific implementation mode
1 to attached drawing 5 referring to the drawings, the specific implementation mode of the present invention is provided, for being done furtherly to the present invention
It is bright.
Glue-spraying device in the present invention includes pedestal whole plate 1, chip 4, spraying colloid system, wherein pedestal whole plate 1 and attachment
Chip 4 in pedestal whole plate 1 is respectively positioned on the lower section of nozzle 7 in spraying colloid system.
About the pedestal whole plate for pasting quartz-crystal resonator for surface, pedestal whole plate includes two kinds of shapes in the present invention
Formula：1, by being processed into the structural unit by matrix arrangement connection on ceramic big plate, each structural unit is as an independence
Individual base, the big plate of ceramics being consequently formed is as pedestal whole plate of the invention；2, it is piled up in a whole plate by individual base
Pedestal whole plate in tooling as the present invention.
In spray-bonding craft, two sets of vision systems are provided with, vision system I is used for wafer position angle correction, vision system
The II that unites is used for identification and correction to pedestal whole plate, can also be by the way that a set of vision system is arranged simultaneously to chip and pedestal whole plate
It is identified and corrects, illustrate specific spray-bonding craft using two sets of vision systems in the present invention.
The spray-bonding craft of individual base of the present invention to being connected by the arrangement of M*N matrixes in pedestal whole plate illustrates, M, N's
Initial value is 1, and M, N are non-zero natural number, and M is that the maximum value of line number and M are the line number of matrix, and N is columns and the maximum of N
Value is matrix column number, i.e. 1≤M≤line number, 1≤N≤columns use a for each individual base in pedestal whole plateMNTable
It reaches, aMNIt is the individual base positioned at pedestal whole plate M row Nth columns.
Under spray when glue, the left and right platform of each individual base in pedestal whole plate is sequentially located at immediately below nozzle, is being sprayed
When gluing, the chip auxiliary electrode above each individual base is located at immediately below nozzle, and chip is quartz crystal in the present invention
Resonator.Spraying colloid system is usual means in the prior art, the present invention not description to spraying colloid system structure.In the present invention
In, it can also be when spraying glue, the left and right platform of chip auxiliary electrode and next individual base above current monolithic pedestal
It is sequentially located at immediately below nozzle.Chip when in use, is moved to vision system by vision system I, vision system II in the present invention
It unites immediately below I, for wafer position angle correction, pedestal whole plate to be moved to immediately below vision system II, is used for pedestal
Identification, correction and the glue spraying state-detection of whole plate.
Embodiment 1
In the present embodiment, select the individual base for being located at the 1st row the 1st row in pedestal whole plate complete the lower glue of spray, upper piece, spray
After the process of gluing, then same process is completed to remaining whole individual base in pedestal whole plate, final pedestal whole plate is completed
Glue spraying process.
Before the progress of entire spray-bonding craft, following preparation process is first carried out：
Step 1, the pedestal whole plate for not carrying out glue spraying is placed on pedestal whole plate carry in cage etc. it is to be extracted；
Step 2, chip be placed on chip carry in cage etc. it is to be extracted；
Step 3 is injected the elargol stirred in glue spraying valve, confirms whether glue spraying valve can normally spit glue；
Step 4, the height that chip is put according to wafer position adjustment, glue spraying time and glue spraying are adjusted according to glue point size position
Position；
Step 5 draws chip, vision system I identifications and angle correction, certified products dislocation waiting pedestal whole plate position；
Simultaneously, pedestal whole plate is moved to each individual base position in vision system II identification whole plates for step 6 and step 5.
After stage to be prepared, glue spraying is carried out to pedestal whole plate, has specifically included following steps：
S1, the lower glue of spray：Pedestal whole plate is moved at injection valve and sprays lower glue, conducting resinl is injected in pedestal by glue spraying mode
It is located at the individual base a of the 1st row the 1st row in whole plate11Left and right platform on；
S2, upper piece：Suction nozzle carries from chip and draws chip in cage, is carried out by the electric rotating machine and vision system I of suction nozzle brilliant
Piece position angle is corrected；Meanwhile pedestal whole plate is moved into vision system II and identifies glue spraying state, after glue spraying qualification, suction nozzle is inhaled
The chip taken is placed on the individual base a that lower glue has been sprayed positioned at the 1st row the 1st of pedestal whole plate row11It is interior；
S3, glue is sprayed：Pedestal whole plate is returned and sprays gluing at injection valve, it is whole that conducting resinl by glue spraying mode is injected in pedestal
Individual base a on plate12Left and right platform and placed the individual base a of chip11Chip auxiliary electrode on；
S4, according to step S1 to step S3 spraying methods, complete remaining monomer in pedestal whole plate by preset sequence
The glue spraying of pedestal.
Preset sequence is in step S4 in the present embodiment, one by one to the individual base in pedestal whole plate
Complete spray technology, first to current monolithic pedestal execute the lower glue of spray, upper piece, later, to next monomer during spraying glue
Pedestal executes the lower glue of spray and current monolithic pedestal sprays glue.
It uses a matrix to indicate, specially：
S41, individual base a is chosen in step slMNAs current injection target, to individual base aMNComplete step S1
Spray lower glue, step S2 upper piece, later in step s3 to individual base aMNGlue, individual base a are sprayed in completionM, N+1It completes under spray
Glue；
S42, it is repeated in step S1 to S3, alternate cycles, until N values are matrix column number, at this time to individual base
aM, N+1Complete step S1 sprays lower glue, step S2 upper piece, individual base aM, N+1It is right in step s3 for the last one position of the row
Individual base aM, N+1Glue is sprayed in completion, to individual base aM+1, NComplete the lower glue of spray；The monomer base of lower glue is sprayed in step S3 at this time
Seat aM+1, NMiddle M values are M+1, and N values correct to matrix column number successively since 1；
When S43, each current N values are matrix column, after completing step S1 to S2 to current monolithic pedestal, current M takes
Value is automatic to be executed plus 1, N values correct to matrix column number successively since 1, is repeated in step S41 to S43, alternate cycles, directly
When being more than line number to M values, the course of injection in entire pedestal whole plate is completed.
Glue spraying mode in step sl specifically refers to carry out glue spraying substitution conventional contact by contactless mode
Point.Dispensing needle tubing, dispensing needle head and the laser ranging system that will be used in conventional contact gluing process in the present invention
It is substituted by spraying colloid system, the composition of spraying colloid system mainly has：1, it is filled using multiple-level stack formula piezoelectric ceramics fine motion device as control
The glue spraying valve set；2, nozzle base；3, striker；4, the anti-overflow washer of pan feeding；5, set screw and fixed ring.
Striker 0.25ms can complete a complete cycle, and then reach ultramicron conducting resinl and be ejected into each of pedestal whole plate
On individual base or so platform, since glue amount is consistent, the diameter of glue point influenced by glue spraying height it is minimum, so consistency is good；1 second
The sprayable 1000Hz of clock, and the ability with transient acceleration, to reach the shock of ultraspeed, to ensure that glue point profile
Consistency and adhesive strength；Injecting time much smaller than whole plate by program pulse control do X, Y motion time, and without move up and down when
Between, therefore contactless glue spraying efficiency is far above contact dispensing efficiency.
Embodiment 2
The spraying process of the present embodiment is similar to embodiment 1, the glue spraying of work and glue spraying valve that the stage to be prepared is done
Position, spray-bonding craft are consistent with embodiment 1, are only spraying sequentially different from.
In the present embodiment, the lower glue of step S1 sprays is first carried out to each individual base in pedestal whole plate, later to each
Individual base carries out step S2 upper piece again, and finally carrying out step S3 to each individual base sprays glue, specially：
S1, the lower glue of spray sequentially is completed according to spray lower glue step to each individual base in pedestal whole plate respectively：
Pedestal whole plate is moved at injection valve and sprays lower glue, conducting resinl is injected in pedestal whole plate each by glue spraying mode
On the left and right platform of individual base；
S2, upper piece sequentially is completed to each individual base in pedestal whole plate respectively：
Suction nozzle draws chip successively, and wafer position angle correction is carried out by the electric rotating machine and vision system of suction nozzle；It puts
It sets in the case where pedestal whole plate has been sprayed in each individual base of glue；
S3, each individual base in pedestal whole plate is sequentially completed to spray glue respectively：
Pedestal whole plate is returned at injection valve, conducting resinl by glue spraying mode be injected in step S2 in pedestal whole plate complete it is every
On the chip auxiliary electrode of a individual base.
In the present embodiment, the action in each step is to the individual base in pedestal whole plate according to scheduled suitable
Sequence sequentially carries out.The lower glue of spray, upper piece, the sequence all same of individual base is chosen when spraying glue, it is pre- with the lower glue explanation of step S1 sprays
The sequence first set.
Spraying the lower preset sequence of glue in the present embodiment is, to one by one complete of the individual base in pedestal whole plate
At the lower adhesive process of injection, use a matrix to indicate, specially：
1, individual base a is chosen in step slMNAs current injection target, to individual base aMNComplete step S1 sprays
Lower glue, later M take current value, N to add 1 automatically, to individual base aM, N+1The lower glue of spray is executed, until N values are matrix column number, this
When M rows individual base complete the lower glue of spray；
2,1 is added automatically to current M values, at this point, M is M+1, N values correct to matrix column number successively since 1, to list
Body pedestal aM+1, NComplete the lower glue of spray；
3, when current N values are matrix column every time, the lower glue of spray, current M values are completed to the individual base of current M rows
It is automatic to execute plus 1, N values correct to matrix column number successively since 1, it is repeated in step 1 to 3, alternate cycles, until M takes
When value is more than line number, glue process under the spray in entire pedestal whole plate is completed.
To in pedestal whole plate patch, spray the sequence of glue and the sequence consensus of the lower glue of spray, can also use different
Sequentially, but have to regular, and these rules belong to programming Control, and the present embodiment will not enumerate, and only pass through this
The sequence that embodiment provides does illustrative explanation.
Embodiment 3
The spraying process of the present embodiment is similar to embodiment 1, the glue spraying of work and glue spraying valve that the stage to be prepared is done
Position, spray-bonding craft are consistent with embodiment 1, are only spraying sequentially different from.
In the present embodiment, multiple individual bases in pedestal whole plate are selected, these multiple individual bases can be whole in pedestal
On plate be in region division, can also the scattered distribution in pedestal whole plate, but in region having using realize control, therefore
It is illustrated by the way of in region division.
The lower glue of step S1 sprays is first carried out to multiple individual bases of current selection area in pedestal whole plate, later to currently selecting
The multiple individual bases for determining region carry out step S2 upper piece again, finally carry out step to multiple individual bases in current selected region
S3 sprays glue, specially：
S1, spray sequentially is completed according to spray lower glue step to multiple individual bases of current selection area in pedestal whole plate respectively
Lower glue：
Pedestal whole plate is moved at injection valve and sprays lower glue, for the multiple individual bases selected in pedestal whole plate,
Conducting resinl is sequentially injected in multiple individual bases by glue spraying mode on the left and right platform of each individual base；
S2, upper piece sequentially are completed to multiple individual bases of current selection area in pedestal whole plate respectively：
For the multiple individual bases selected in pedestal whole plate, suction nozzle sequentially draws chip, passes through the electric rotating of suction nozzle
Machine and vision system carry out wafer position angle correction, are sequentially placed on multiple individual bases that pedestal whole plate has sprayed lower glue
It is interior；
S3, respectively multiple individual bases of current selection area in pedestal whole plate are sequentially completed to spray glue：
For the multiple individual bases selected in pedestal whole plate, pedestal whole plate is returned at injection valve, conducting resinl is by spray
Glue mode is sequentially injected on the chip auxiliary electrode for multiple individual bases that step S2 is completed in pedestal whole plate.
Later, next selection area is shifted to, the entire glue spraying that step S1 completes current selected region to step S2 is repeated
Process replaces successively, until whole individual bases in pedestal whole plate all complete glue spraying process.
In the present embodiment, under the spray of multiple individual bases in current selected region glue, upper piece, choose when spraying glue it is single
Cahn-Ingold-Prelog sequence rule in the sequence similar embodiment 2 of body pedestal, in the present embodiment the value of M, N in current selected region into
Row, detailed operation is referring to embodiment 2.
It closes the switching of different zones in this present embodiment, that is, after the entire glue spraying process for completing a region, shifts to down
When one region, and switched by the value of M, N, the time point of switching is the last one monomer base of current region
Seat is completed to spray glue, and first individual base in next region prepares the lower glue of spray, and specific transfer sequence is referring in embodiment 1
Glue is sprayed in one individual base completion, and next individual base prepares the rule of the lower glue of spray.
Embodiment 4
The spraying process of the present embodiment is similar to embodiment 1, the glue spraying of work and glue spraying valve that the stage to be prepared is done
Position, spray-bonding craft are consistent with embodiment 1, are only spraying sequentially different from.
In the present embodiment, all individual bases for selecting certain a line in pedestal whole plate, for each list on current line
Body pedestal, such as the lower glue of step S1 sprays is first carried out to each individual base in pedestal whole plate M row Nth columns, later to each
Individual base carries out step S2 upper piece again, and finally carrying out step S3 to each individual base sprays glue, specially：
S1, the lower glue of spray sequentially is completed according to spray lower glue step to each individual base of M row Nth columns in pedestal whole plate：
S11, the lower glue of spray：Pedestal whole plate is moved at injection valve and sprays lower glue, conducting resinl is injected in base by glue spraying mode
In seat whole plate on the left and right platform of each individual base of M row Nth columns；
S12, upper piece：Suction nozzle draws chip, and carrying out wafer position angle by the electric rotating machine and vision system 1 of suction nozzle rectifys
Just；Pedestal whole plate is placed on to have sprayed in each individual base of M row Nth columns of lower glue；
S13, glue is sprayed：Pedestal whole plate is returned at injection valve, conducting resinl is injected in pedestal whole plate by glue spraying mode and is walked
On the chip auxiliary electrode for each individual base of M row Nth columns that rapid S12 is completed；
S2, entire glue spraying mistake is sequentially completed to each individual base on remaining row in pedestal whole plate according to the step of S1
Journey.
Close in this present embodiment for glue under the spray of each individual base of M row Nth columns, upper piece, spray glue when choose
Cahn-Ingold-Prelog sequence rule in the sequence similar embodiment 2 of individual base, in the present embodiment no longer in detail narration, it is detailed operation referring to
Embodiment 2.
It closes in this present embodiment for the switching between not going together, i.e., switches to M+1 row Nth columns from M row Nth columns
Rule, in reference implementation example 1 upper individual base completion spray glue, next individual base prepares the rule of the lower glue of spray.It
Afterwards for the operation rules reference implementation example 2 of M+1 row Nth columns.
Embodiment 5
The spraying process of the present embodiment is similar to embodiment 1, the glue spraying of work and glue spraying valve that the stage to be prepared is done
Position, spray-bonding craft are consistent with embodiment 1, are only spraying sequentially different from.
In the present embodiment, for spraying sequence be similar to embodiment 4, by embodiment first to all monomers of every row
Pedestal carries out spraying process and replaces with first all individual bases progress spraying process to each column.
All individual bases of a certain row in selected pedestal whole plate, for when each individual base on forefront, for example (,) it is right
Each individual base in pedestal whole plate M row Nth columns first carries out the lower glue of step S1 sprays, is carried out again to each individual base later
Step S2 upper piece finally carries out step S3 to each individual base and sprays glue, specially：
S1, the lower glue of spray sequentially is completed according to spray lower glue step to the individual base for being located at same row in pedestal whole plate：
S11, the lower glue of spray：Pedestal whole plate is moved at injection valve and sprays lower glue, conducting resinl is injected in base by glue spraying mode
In seat whole plate on the left and right platform of same row individual base；
S12, upper piece：Suction nozzle draws chip, and carrying out wafer position angle by the electric rotating machine and vision system 1 of suction nozzle rectifys
Just；Pedestal whole plate is placed on to have sprayed in the same row individual base of lower glue；
S13, glue is sprayed：Pedestal whole plate is returned at injection valve, conducting resinl is injected in pedestal whole plate by glue spraying mode and is walked
On the chip auxiliary electrode for the same row individual base that rapid S12 is completed；
S2, according to the step of S1, to pedestal whole plate, remaining each individual base arranged sequentially completes entire glue spraying process.
Close in this present embodiment for glue under the spray of each individual base of M row Nth columns, upper piece, spray glue when choose
Cahn-Ingold-Prelog sequence rule in the sequence similar embodiment 2 of individual base, in the present embodiment no longer in detail narration, it is detailed operation referring to
Embodiment 2.
It closes in this present embodiment for the switching between different lines, i.e., switches to what M rows N+1 was arranged from M row Nth columns
Rule, in reference implementation example 1 upper individual base completion spray glue, next individual base prepares the rule of the lower glue of spray.It
Afterwards for the operation rules reference implementation example 2 of M rows N+1 row.
Embodiment 1 is similar to for the spraying process used in the different spraying sequences in the present invention, and is sprayed suitable
Sequence be all realized by program according to artificial rule, such as by oblique line, angle, the center of circle around etc. modes, in the present invention
Can not possibly be exhaustive, only illustrated come more entire sprayings by above example.In addition to the pedestal used in above example is whole
Plate, entire spraying process of the invention can be applied in multiple individual base codes and enter in whole plate tooling, then be placed into pedestal and carry
Wait for that glue spraying, entire spraying process are also identical in cage, only the form of pedestal whole plate changes, but single in pedestal whole plate
Body pedestal is also in matrix arrangement, and specific spraying sequence and process are referring to the embodiment of the present invention.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case of without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Profit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent requirements of the claims
Variation is included within the present invention.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment includes
One independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should incite somebody to action
As a whole, the technical solutions in the various embodiments may also be suitably combined for specification, and forming those skilled in the art can
With the other embodiment of understanding.
Claims (5)
1. contactless glue spraying method in quartz-crystal resonator production is pasted on surface, it is characterised in that：It is formed in pedestal whole plate
Multiple individual bases, the auxiliary electrode of left and right platform and the chip being attached on individual base to individual base is using contactless
Mode carries out glue spraying；Include following steps：
S1, the lower glue of spray：Pedestal whole plate is moved at injection valve and sprays lower glue, conducting resinl is injected in pedestal whole plate by glue spraying mode
In an individual base left and right platform on；
S2, upper piece：Suction nozzle draws chip, and wafer position angle correction is carried out by the electric rotating machine and vision system of suction nozzle；It puts
It sets in the case where pedestal whole plate has been sprayed in the individual base of glue；
S3, glue is sprayed：Pedestal whole plate is returned and sprays gluing at injection valve, conducting resinl is injected in by glue spraying mode in pedestal whole plate
In step S2 on the chip auxiliary electrode of individual base；
S4, according to step S1 to step S3 spraying methods, complete remaining individual base in pedestal whole plate by preset sequence
Glue spraying.
2. contactless glue spraying method in quartz-crystal resonator production is pasted on surface, it is characterised in that：It is formed in pedestal whole plate
Multiple individual bases, the auxiliary electrode of left and right platform and the chip being attached on individual base to individual base is using contactless
Mode carries out glue spraying；Include following steps：
S1, the lower glue of spray sequentially is completed according to spray lower glue step to each individual base in pedestal whole plate respectively：
Pedestal whole plate is moved at injection valve and sprays lower glue, conducting resinl is injected in each monomer in pedestal whole plate by glue spraying mode
On the left and right platform of pedestal；
S2, upper piece sequentially is completed to each individual base in pedestal whole plate respectively：
Suction nozzle draws chip successively, and wafer position angle correction is carried out by the electric rotating machine and vision system of suction nozzle；It is placed on
Pedestal whole plate has been sprayed in each individual base of lower glue；
S3, each individual base in pedestal whole plate is sequentially completed to spray glue respectively：
Pedestal whole plate is returned at injection valve, conducting resinl is injected in each list that step S2 is completed in pedestal whole plate by glue spraying mode
On the chip auxiliary electrode of body pedestal.
3. contactless glue spraying method in quartz-crystal resonator production is pasted on surface, it is characterised in that：It is formed in pedestal whole plate
Multiple individual bases, the auxiliary electrode of left and right platform and the chip being attached on individual base to individual base is using contactless
Mode carries out glue spraying；Include following steps：
S1, the lower glue of spray sequentially is completed according to spray lower glue step to the multiple individual bases selected in pedestal whole plate respectively：
Pedestal whole plate is moved at injection valve and sprays lower glue, it is conductive for the multiple individual bases selected in pedestal whole plate
Glue is sequentially injected in multiple individual bases by glue spraying mode on the left and right platform of each individual base；
S2, upper piece sequentially are completed to the multiple individual bases selected in pedestal whole plate respectively：
For the multiple individual bases selected in pedestal whole plate, suction nozzle sequentially draws chip, by the electric rotating machine of suction nozzle and
Vision system carries out wafer position angle correction, is sequentially placed on pedestal whole plate and has sprayed in multiple individual bases of lower glue；
S3, respectively the multiple individual bases selected in pedestal whole plate are sequentially completed to spray glue：
For the multiple individual bases selected in pedestal whole plate, pedestal whole plate is returned at injection valve, conducting resinl presses glue spraying side
Formula is sequentially injected on the chip auxiliary electrode for multiple individual bases that step S2 is completed in pedestal whole plate.
4. contactless glue spraying method in quartz-crystal resonator production is pasted on surface, it is characterised in that：It is formed in pedestal whole plate
Multiple individual bases, the auxiliary electrode of left and right platform and the chip being attached on individual base to individual base is using contactless
Mode carries out glue spraying；Include following steps：
S1, the lower glue of spray sequentially is completed according to spray lower glue step to each individual base for being located at a line in pedestal whole plate：
S11, the lower glue of spray：Pedestal whole plate is moved at injection valve and sprays lower glue, it is whole that conducting resinl by glue spraying mode is injected in pedestal
With on the left and right platform of a line individual base in plate；
S12, upper piece：Suction nozzle draws chip, and wafer position angle correction is carried out by the electric rotating machine and vision system 1 of suction nozzle；
Pedestal whole plate is placed on to have sprayed in same a line individual base of lower glue；
S13, glue is sprayed：Pedestal whole plate is returned at injection valve, conducting resinl is injected in step S12 in pedestal whole plate by glue spraying mode
On the chip auxiliary electrode for the same a line individual base completed；
S2, entire glue spraying process is sequentially completed to each individual base on pedestal whole plate remaining row according to the step of S1.
5. contactless glue spraying method in quartz-crystal resonator production is pasted on surface, it is characterised in that：It is formed in pedestal whole plate
Multiple individual bases, the auxiliary electrode of left and right platform and the chip being attached on individual base to individual base is using contactless
Mode carries out glue spraying；Include following steps：
S1, the lower glue of spray sequentially is completed according to spray lower glue step to the individual base for being located at same row in pedestal whole plate：
S11, the lower glue of spray：Pedestal whole plate is moved at injection valve and sprays lower glue, it is whole that conducting resinl by glue spraying mode is injected in pedestal
In plate on the left and right platform of same row individual base；
S12, upper piece：Suction nozzle draws chip, and wafer position angle correction is carried out by the electric rotating machine and vision system 1 of suction nozzle；
Pedestal whole plate is placed on to have sprayed in the same row individual base of lower glue；
S13, glue is sprayed：Pedestal whole plate is returned at injection valve, conducting resinl is injected in step S12 in pedestal whole plate by glue spraying mode
On the chip auxiliary electrode of the same row individual base of completion；
S2, according to the step of S1, to pedestal whole plate, remaining each individual base arranged sequentially completes entire glue spraying process.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610528991.XA CN106067776B (en) | 2016-07-06 | 2016-07-06 | Paste contactless spraying colloid system and method in quartz-crystal resonator production in surface |
| PCT/CN2017/091024 WO2018006754A1 (en) | 2016-07-06 | 2017-06-30 | Contactless adhesive spray system and method utilized in producing surface-mount quartz crystal oscillator |
| TW106122608A TWI674749B (en) | 2016-07-06 | 2017-07-05 | Processes for surface mount quartz crystal resonator non-contact spray adhesive system and method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610528991.XA CN106067776B (en) | 2016-07-06 | 2016-07-06 | Paste contactless spraying colloid system and method in quartz-crystal resonator production in surface |
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| Publication Number | Publication Date |
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| CN106067776A CN106067776A (en) | 2016-11-02 |
| CN106067776B true CN106067776B (en) | 2018-10-02 |
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| Country | Link |
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| CN (1) | CN106067776B (en) |
| TW (1) | TWI674749B (en) |
| WO (1) | WO2018006754A1 (en) |
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| CN106067776B (en) * | 2016-07-06 | 2018-10-02 | 烟台明德亨电子科技有限公司 | Paste contactless spraying colloid system and method in quartz-crystal resonator production in surface |
| CN111112018A (en) * | 2019-12-10 | 2020-05-08 | 廊坊中电熊猫晶体科技有限公司 | Direct-insertion type quartz crystal resonator dispensing device and using method thereof |
| CN111294005A (en) * | 2020-03-17 | 2020-06-16 | 四川明德亨电子科技有限公司 | Resonant chip fixing and dispensing method of quartz crystal resonator |
| CN115921243B (en) * | 2022-12-30 | 2024-03-12 | 烟台明德亨电子科技有限公司 | Sizing method for crystal oscillator produced by whole plate |
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| JPH10303671A (en) * | 1997-04-28 | 1998-11-13 | Toyota Motor Corp | Manufacture of crystal vibrator |
| JP2003318699A (en) * | 2002-04-23 | 2003-11-07 | Piedekku Gijutsu Kenkyusho:Kk | Quartz unit and manufacturing method thereof |
| CN100499097C (en) * | 2006-08-21 | 2009-06-10 | 南茂科技股份有限公司 | High-frequency integrated circuit packaging construction for improving connectivity of embedded projection and manufacturing method thereof |
| US7608986B2 (en) * | 2006-10-02 | 2009-10-27 | Seiko Epson Corporation | Quartz crystal resonator |
| JP4502219B2 (en) * | 2006-10-10 | 2010-07-14 | 日本電波工業株式会社 | Manufacturing method of tuning fork type crystal resonator element |
| JP2010044037A (en) * | 2008-08-08 | 2010-02-25 | Top Engineering Co Ltd | Position detection apparatus and method for detecting position of nozzle orifice and optical point of laser displacement sensor of paste dispenser |
| CN202218201U (en) * | 2011-08-02 | 2012-05-09 | 台晶(宁波)电子有限公司 | Low temperature ceramic entire plate-type flat substrate pedestal used for quartz crystal resonator |
| CN102615018B (en) * | 2012-04-11 | 2015-05-27 | 吉林大学 | Piezoelectric wafer control type non-contact glue dispensing device |
| CN103824754A (en) * | 2014-03-15 | 2014-05-28 | 深圳市鹰眼在线电子科技有限公司 | Intelligent laminating machine for quartz crystal oscillator |
| CN104209233A (en) * | 2014-08-18 | 2014-12-17 | 台晶(宁波)电子有限公司 | Chip carrying dispensing mechanism for production of quartz crystal resonator |
| CN105305995B (en) * | 2015-11-05 | 2016-11-30 | 烟台明德亨电子科技有限公司 | A kind of SMD quartz crystal resonator and imposite encapsulation process technique thereof |
| CN106067776B (en) * | 2016-07-06 | 2018-10-02 | 烟台明德亨电子科技有限公司 | Paste contactless spraying colloid system and method in quartz-crystal resonator production in surface |
| CN205754236U (en) * | 2016-07-06 | 2016-11-30 | 烟台明德亨电子科技有限公司 | Contactless spraying colloid system in the patch quartz-crystal resonator production of surface |
-
2016
- 2016-07-06 CN CN201610528991.XA patent/CN106067776B/en active Active
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2017
- 2017-06-30 WO PCT/CN2017/091024 patent/WO2018006754A1/en active Application Filing
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| WO2018006754A1 (en) | 2018-01-11 |
| TW201803265A (en) | 2018-01-16 |
| CN106067776A (en) | 2016-11-02 |
| TWI674749B (en) | 2019-10-11 |
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Effective date of registration: 20181212 Address after: 646300 No. 3, Lan'an Road, Naxi District, Luzhou City, Sichuan Province Patentee after: Sichuan Mingdeheng Electronic Technology Co., Ltd. Address before: 264006 No. 6 Heilongjiang Road, Yantai Economic and Technological Development Zone, Shandong Province Patentee before: YANTAI DYNAMIC ELECTRONICS CO., LTD. |