CN102615018B - Piezoelectric wafer control type non-contact glue dispensing device - Google Patents
Piezoelectric wafer control type non-contact glue dispensing device Download PDFInfo
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- CN102615018B CN102615018B CN201210116547.9A CN201210116547A CN102615018B CN 102615018 B CN102615018 B CN 102615018B CN 201210116547 A CN201210116547 A CN 201210116547A CN 102615018 B CN102615018 B CN 102615018B
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- glue
- striker
- piezoelectric chip
- displacement
- diaphragm spring
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
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Abstract
The invention provides a novel piezoelectric wafer control type non-contact glue dispensing device with the advantages that the structure is simple, the maintenance is convenient, and the cost is low. The micro vibration displacement of a piezoelectric wafer is amplified through a displacement amplification mechanism, a firing pin is driven to vertically move, and the glue liquid spraying is realized. The novel piezoelectric wafer control type non-contact glue dispensing device adopts the following technical scheme that the displacement amplification mechanism consists of the piezoelectric wafer, a diaphragm spring, a mass block, a vibration rod and the firing pin, when the voltage frequency exerted on the piezoelectric wafer approaches to or is identical to the inherent frequency of the displacement amplification mechanism, the displacement amplification mechanism reaches the resonance state, the output displacement and the speed of the firing pin reach the maximum values, the glue liquid is driven to be sprayed out from a spray nozzle, and the automatic distribution of the glue liquid is realized. The novel piezoelectric wafer control type non-contact glue dispensing device can be used for the fields of precise chemicals, medicine quantitative distribution, biomedicine and the like, is particularly applied to the technical field of high-viscosity glue dispensing in semiconductor encapsulation and is used for the chip fixation, the surface mounting and the bottom filling in the electronic encapsulation, the fluorescent powder coating in a liquid crystal display flat plate and the like.
Description
Technical field
The present invention relates to a kind of piezoelectric chip control type noncontact point glue equipment, belong to microelectronics Packaging field.
Background technology
Fluid dispensing technology is a key technology in microelectronics Packaging, and it can formation of structure point, line, surface (coating) and various figure, is widely used in chip and fixes, encapsulates back-off and chip coating etc.This technology is accurately distributed fluid in a controlled manner, the fluid of desirable amount (solder flux, conducting resinl, epoxy resin and adhesive etc.) can be transferred to the correct position of workpiece (chip, electronic component etc.), to realize the room machine of components and parts or electric connection, this technical requirement point colloid system good operation performance, some glue speed is high and the glue pointed out some uniformity is good and precision is high.
Traditional dispensing technology is contact point glue, comprise metering tubular type point glue, piston type point glue and time/pressure-type point glue.This contact-type dispensing technology relies on Glue dripping head to guide glue and plate contact, and time delay a period of time makes glue infiltrate panel, and then Glue dripping head moves upward, and glue relies on the stickiness power between panel to be separated with Glue dripping head, thus on panel, form glue point.The maximum feature of this dispensing technology needs to configure high-precision displacement transducer, and to control the height that Glue dripping head declines and lifts, costly, and some glue speed is restricted accessory system.In addition, the comparison of coherence of glue point is poor.
In the development of microelectric technique, integrated circuit more and more presents complicated and microminiaturized, semiconductor package reload request has less size, more lead-in wire, closeer intraconnections etc., also more and more higher to the requirement of dispensing technology, dispensing technology is put glue by contact point glue to contactless (injection) gradually and is changed.Injecting type point glue makes glue be subject to High Pressure in some way, be ejected on panel with certain speed after obtaining enough large kinetic energy thus, spray glue process mid-point glue head without the displacement of Z-direction, greatly accelerate the speed of a glue, and the uniformity that glue drips is good.
Contactless glue is mainly divided into mechanical type spraying point glue and piezo-stack type spray site glue.
The main power source of mechanical type spraying point glue is compressed air.The compressed air of a pulse acts on piston head, Compress Spring forms certain displacement, drive striker raised, then glue is full of the space of striker raised, after the compressed air acted on piston releases, under the effect of returning spring power, the downward rapid movement of striker impacts nozzle valve seat, make glue spray formation glue fast to drip, DJ-2100, DJ-2200, DJ-9000 series Glue dripping head of Nordson Corp of the U.S. all adopts spray site glue in this way.This injection apparatus preferably resolves some problems of contact point glue, but causes the uniformity of glue point not to be also very desirable due to the compressibility of air, and operating frequency is lower, generally at 1 50Hz ~ 200Hz.
Piezo-stack type spray site glue adopts lever amplification principle or hydraulic pressure amplification principle to be amplified by the micro-displacement of piezoelectric stack, then drives striker to coordinate with nozzle valve seat the injection realizing glue.The mode of this employing piezoelectric stack spray site glue not only achieves noncontact jetting point glue, also solving air power source spray site glue dots consistency is not very desirable problem, and injection frequency is the highest can reach 700Hz, substantially increases jet velocity.But piezoelectric stack is expensive, the price of piezo-stack type ejecting adhesive dispenser, far away higher than mechanical type spraying point glue equipment, greatly limit the application of piezo-stack type ejecting adhesive dispenser.
Described on end, although mechanical type spraying point glue equipment cost is lower, need to improve in glue point uniformity, some glue speed etc.; Although and the aspects such as piezo-stack type ejecting adhesive dispenser point glue precision, some glue speed, glue point uniformity meet the development of hyundai electronics packaging industry, its cost should be reduced further.
Summary of the invention
The present invention proposes a kind of piezoelectric chip control type noncontact point glue equipment, the problems such as bad and some glue speed is slow with the glue point uniformity solving contact point glue equipment and mechanical type spraying point glue equipment, reach the some glue effect of piezo-stack type ejecting adhesive dispenser, and effectively reduce the cost of piezoelectric type spray site glue.
For reaching the above object, the present invention by the following technical solutions:
Due to inverse piezoelectric effect, piezoelectric chip produces micro-strain under the effect of voltage, due to displacement very little (10 μm), can not be used for Direct driver high viscosity glue, the present invention utilizes displacement amplifying mechanism the displacement of piezoelectric chip to be amplified, thus high viscosity glue can be driven, realize spray site glue.
A kind of piezoelectric chip control type noncontact point glue equipment, comprise piezoelectric chip displacement amplifying mechanism and auxiliary part thereof, it is characterized in that: piezoelectric chip displacement amplifying mechanism comprises end cap, piezoelectric chip, substrate, locknut, vibration-sensing rod, diaphragm spring I, diaphragm spring II, mass and striker; Auxiliary part comprises cover plate, adjusting nut, cavity, sealing plate, sealing ring, sealing ring, nozzle base, glue tube connector, fluid reservoir etc.
Piezoelectric chip control type noncontact point glue equipment of the present invention, piezoelectric chip is as power source, and voltage acts on the two ends of piezoelectric chip, and due to inverse piezoelectric effect, piezoelectric chip bends and produces small elongation displacement; When act on the electric voltage frequency on piezoelectric chip with displacement amplifying mechanism intrinsic frequency close to or identical time, the micro-displacement of piezoelectric chip amplifies by displacement amplifying mechanism, drive striker sharp downward movement, the glue at nozzle place flows in nozzle, when striker impact is to nozzle base, block the glue of flowing, in nozzle, form huge local pressure, the gelatin jet under the effect of local pressure in nozzle out forms glue and drips simultaneously.Change the direction acting on voltage on piezoelectric chip, piezoelectric chip bounces back, and by displacement amplifying mechanism by striker raised, prepares the circulation entering next cycle.
Piezoelectric chip of the present invention bonds to substrate two sides, and substrate is fixedly connected with vibration-sensing rod nut, is fixedly connected with end cover bolt above; Vibration-sensing rod and diaphragm spring I are connected by locknut, and diaphragm spring I is fixed on mass; Diaphragm spring II is connected by locknut and striker, and diaphragm spring II is fixed on mass; End cap is fixing on the cover board by adjusting nut, and can regulate the upper-lower height of displacement amplifying mechanism, can control the gap of striker and nozzle base thus.
When not having glue to spray, striker and nozzle base leave small―gap suture, and glue rests on nozzle place under capillary effect, now piezoelectric chip effect low level; When piezoelectric chip effect high level, the micro-displacement of piezoelectric chip amplifies by the displacement amplifying mechanism of piezoelectric chip, diaphragm spring, mass and striker composition, and striker sharp downward movement laminating nozzle base, blocks the flowing of glue, glue in nozzle sprays fast, forms glue and drips.
In the present invention, the size of glue pressure is regulated by pressure compressed-air actuated in fluid reservoir, when should ensure there is gap between striker and nozzle base, glue is not revealed, after ensureing striker raised again, glue adds to vacancy timely, and the spray site glue in lower cycle is carried out smoothly.
The invention has the advantages that and propose a kind of piezoelectric chip control type noncontact point glue equipment, the multiple uses such as the some glue of High-Sr granite in the quantitative conveying of liquid, rationed and microelectronics Packaging can be realized.The present invention has the advantages that structure is simple, be easy to control, has both achieved function and the performance of piezo-stack type ejecting adhesive dispenser, and has greatly reduced cost again.
Accompanying drawing explanation
Fig. 1 is piezoelectric chip control type noncontact point glue equipment structural representation.
Fig. 2 is the schematic diagram of piezoelectric chip flexural vibrations.
Fig. 3 is the structural representation of piezoelectric chip control type noncontact point glue equipment displacement amplifying mechanism.
A kind of embodiment: as shown in Fig. 3 (a), piezoelectric chip (16) adopts double wafer structure (also can adopt single-chip structure), mass (9) is composed in series displacement amplifying mechanism with two diaphragm springs, and schematic diagram is as shown in Fig. 3 (b).M
1, m
2, m
3and m
4the quality of end cap (15), vibration-sensing rod (18), mass (9) and striker (6) respectively; k
1, k
2and k
3the rigidity of piezoelectric chip (16), diaphragm spring I and diaphragm spring II respectively; In output displacement, the output displacement y of striker (6)
4maximum.
A kind of embodiment: the displacement amplifying mechanism that mass (9) is composed in series with two diaphragm springs is together in series again, 2 or more, the displacement of output can be amplified further, Fig. 3 (d) is the structural representation be together in series by 2 displacement amplifying mechanisms with vibration-sensing rod (18), and its schematic diagram is as shown in Fig. 3 (e).Same Fig. 3 (b) is compared, due to mass and the diaphragm spring of having connected, and the displacement y of striker (6)
6be greater than y
4.The increase of striker (6) displacement can spray the higher glue of viscosity.
A kind of embodiment: as shown in Fig. 3 (f), the spring mass enlarger that connecting rod (25), diaphragm spring II I (26), mass (27), vibration-sensing rod (28), diaphragm spring I V (29) and end cap (30) form is positioned at above piezoelectric chip (16), and connecting rod (25) is fixed on cover plate (12) by screw thread.When the intrinsic frequency acting on the electric voltage frequency on piezoelectric chip and this spring mass displacement amplifying mechanism close to or identical time, output displacement and the speed of striker (6) reach maximum, reach the object of spraying glue.
Above-mentioned three kinds of embodiments spring diaphragm used is the circle shape spring diaphragm as shown in Fig. 3 (c), spring diaphragm can also use rectangular sheet form, as shown in Fig. 3 (g), use the schematic diagram of the displacement amplifying mechanism of rectangular springs diaphragm as shown in Fig. 3 (h).The two ends of rectangular springs diaphragm are separately fixed on mass (9) and cavity (3), are uniformly distributed along mass center, arrange the number of spring diaphragm according to the requirement of frequency of utilization.
Fig. 4 is that the micrometric displacement of piezoelectric chip carries out through flexible hinge the structural representation that displacement equations drives striker distribution glue again after displacement amplifying mechanism amplifies.
Fig. 5 is that displacement amplifying mechanism horizontal positioned drives striker to distribute the structural representation of glue.
Fig. 6 is striker when moving downward, the flow schematic diagram of glue in distribution cavity.
Fig. 7 is striker when moving upward, the flow schematic diagram of glue in distribution cavity.
Detailed description of the invention
Embodiment 1:
Shown in Figure 1, a kind of piezoelectric chip control type of the present invention noncontact point glue equipment piezoelectric chip displacement amplifying mechanism as shown in Figure 3 and auxiliary part composition thereof.Piezoelectric chip displacement amplifying mechanism is made up of piezoelectric chip (16), substrate (17), end cap (15), vibration-sensing rod (18), locknut (7), diaphragm spring I (10), mass (9), diaphragm spring II (8), striker (6).Piezoelectric chip (16) is bonding with substrate (17), and substrate (17) is fixedly connected with end cap (15); The two ends of vibration-sensing rod (18) are fixedly connected with diaphragm spring I (10) respectively at piezoelectric chip (16); Diaphragm spring I (10) is fixedly connected with mass (9); Striker (6) is connected with diaphragm spring II (8), and diaphragm spring II (8) is fixed on mass (9).Nozzle base (1) is fixed on cavity (3) by bolt (2), realizes the injection of glue with the head fits closure or openness of striker (6).
Glue in fluid reservoir (19) enters into the distribution cavity of cavity (3) under compressed-air actuated effect by glue tube connector (21), compressed-air actuated force value should remain on suitable scope, when should ensure that striker does not contact with nozzle base, glue can not be revealed from nozzle, after striker raised, glue adds to the injection that white space enters next cycle again rapidly.
The frequency acting on the voltage on piezoelectric chip should be close or equal with the intrinsic frequency of piezoelectric chip displacement amplifying mechanism, now the micro-displacement (10 μm) of piezoelectric chip is just amplified (0.3mm ~ 0.5mm) to greatest extent, the displacement of striker could meet the needs of gelatin jet, realizes the injection of glue.
When piezoelectric chip applies high level, striker (6) moves downward rapidly, as shown in Figure 3, the glue at nozzle place flows in nozzle, glue above nozzle then upwards flows, and blocks the flowing of glue after striker (6) head and nozzle fit tightly, and the momentum transformation of striker (6) is the momentum of glue in nozzle, glue in nozzle ejects fast, forms glue and drips; When piezoelectric chip applies low level, striker (6) will move upward, as shown in Figure 4, glue in cavity (3) in distribution cavity flows to nozzle place, fill up the vacuum area stayed after striker moves upward, under the capillary effect of glue, now glue can not leak out from nozzle; When piezoelectric chip applies high level again, glue will be sprayed again formation glue and drip, so move in circles, glue is continuous form ejection of dripping with glue just.
Piezoelectric chip displacement amplifying mechanism is fixed on cover plate (12) by adjusting nut (14), cover plate (12) is fixedly connected with cavity (3), adjusting nut (14) can regulate the upper and lower displacement of displacement amplifying mechanism, to reach the object of the spacing regulating striker (6) and nozzle base (3).Different distances coordinates the suitable voltage be applied on piezoelectric chip, and can spray the glue of different viscosities, the glue forming different size drips.
Embodiment 2:
Shown in Figure 4, the micro-displacement of piezoelectric chip amplifies by the displacement amplifying mechanism that piezoelectric chip (16), substrate (17), vibration-sensing rod (18), diaphragm spring II (10), mass (9), diaphragm spring I (8) and connecting rod (31) form, and connecting rod (31) is connected with flexible hinge (32).One end of flexible hinge (32) is fixed on cavity (3), the other end is fixedly connected with striker (6), by flexible hinge (32) lever amplification effect, when displacement amplifying mechanism moves downward, the displacement of striker (6) is amplified further, the larger glue of viscosity can be driven to realize automation distribute, realize the injection of glue.
Embodiment 3:
Shown in Figure 5, the displacement amplifying mechanism horizontal positioned that piezoelectric chip (16), substrate (17), vibration-sensing rod (18), diaphragm spring II (10), mass (9), diaphragm spring I (8) and connecting rod (33) form, connecting rod (33) is fixedly connected with shifter lever (34), the mid portion of shifter lever (34) is hinged on cavity (3), at the other end, shifter lever (34) is fixedly connected with striker (6).The micrometric displacement of piezoelectric chip (16) passes through shifter lever (34) after displacement amplifying mechanism amplifies, it is the displacement on striker (6) vertical direction by the displacive transformation in horizontal direction, thus drive glue automation to distribute, realize the injection of glue.
Claims (3)
1. a piezoelectric chip control type noncontact point glue equipment, it is characterized in that: piezoelectric chip (16), substrate (17), vibration-sensing rod (18), diaphragm spring I (10), diaphragm spring II (8), mass (9) and striker (6) composition displacement amplifying mechanism, the intrinsic frequency being applied to the electric voltage frequency on piezoelectric chip (16) and displacement amplifying mechanism close to or identical time, output displacement and the output speed of striker (6) all reach maximum, under the driving of striker (6), glue (22) ejects from nozzle (24), formation glue drips, piezoelectric chip (16) bonds to the upper rear locknut (7) that passes through of substrate (17) and is connected with vibration-sensing rod (18), substrate is fixedly connected with end cap (15), vibration-sensing rod (18) is fixedly connected with by locknut (7) with diaphragm spring I (10), and diaphragm spring I (10) is connected with mass (9) bolt (11), striker (6) is fixedly connected with by locknut (7) with diaphragm spring II (8), diaphragm spring II (8) is fixedly connected with mass (9) with bolt (11), end cap (15) is connected with cover plate (12) adjusting nut (14), and can regulate the gap of striker (6) and nozzle base (1) by adjusting nut (14).
2. a kind of piezoelectric chip control type noncontact point glue equipment according to claim 1, it is characterized in that: piezoelectric chip is single-chip or twin lamella, mass is one or more composition cascaded structures, and a mass is fixed 2 diaphragm springs, diaphragm spring is circular or rectangular sheet.
3. a kind of piezoelectric chip control type noncontact point glue equipment according to claim 1, is characterized in that: when piezoelectric chip (16) applies low level, striker (6) head and nozzle base (1) have minim gap; When piezoelectric chip (16) applies high level, striker (6) head and nozzle base (1) are fitted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210116547.9A CN102615018B (en) | 2012-04-11 | 2012-04-11 | Piezoelectric wafer control type non-contact glue dispensing device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210116547.9A CN102615018B (en) | 2012-04-11 | 2012-04-11 | Piezoelectric wafer control type non-contact glue dispensing device |
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| CN102615018A CN102615018A (en) | 2012-08-01 |
| CN102615018B true CN102615018B (en) | 2015-05-27 |
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| CN201210116547.9A Expired - Fee Related CN102615018B (en) | 2012-04-11 | 2012-04-11 | Piezoelectric wafer control type non-contact glue dispensing device |
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| CN103084299B (en) * | 2013-02-22 | 2015-02-04 | 厦门大学 | Piezoelectric on-off valve type jetting dispensing head |
| CN103111402B (en) * | 2013-03-08 | 2015-05-27 | 厦门大学 | Jet type glue supply head |
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| CN104511405A (en) * | 2013-09-29 | 2015-04-15 | 上海三维精密模具制造有限公司 | Non-contact coating method |
| CN104722446B (en) * | 2015-04-23 | 2016-09-28 | 吉林大学 | A kind of self-interacting type electro-hydraulic coupling ejecting adhesive dispenser |
| CN105289934B (en) * | 2015-12-10 | 2017-09-15 | 河南理工大学 | Piezo jet formula accurate quantification point glue equipment and its dispensing method |
| CN105499072B (en) * | 2016-01-20 | 2018-06-22 | 中南大学 | Piezoelectric Ceramic glue dispensing valve |
| CN106042375A (en) * | 2016-05-27 | 2016-10-26 | 中北大学 | Digital jet sprayer for additive manufacturing |
| CN106067776B (en) * | 2016-07-06 | 2018-10-02 | 烟台明德亨电子科技有限公司 | Paste contactless spraying colloid system and method in quartz-crystal resonator production in surface |
| CN106423734B (en) * | 2016-10-26 | 2022-05-10 | 广东工业大学 | Spraying and glue dispensing device and technology |
| CN106583166A (en) * | 2017-01-22 | 2017-04-26 | 山东大学 | Piezoelectrically-driven jet type dispensing device |
| CN109652902A (en) * | 2018-12-21 | 2019-04-19 | 西安工程大学 | A kind of injection valve and its application method for air-jet loom |
| CN110181142A (en) * | 2019-06-12 | 2019-08-30 | 长春师范大学 | A kind of Piezoelectric Driving printing injector |
| CN110793619B (en) * | 2019-10-29 | 2022-04-29 | 歌尔股份有限公司 | Detection method and device for piezoelectric glue spraying system |
| CN111294005A (en) * | 2020-03-17 | 2020-06-16 | 四川明德亨电子科技有限公司 | Resonant chip fixing and dispensing method of quartz crystal resonator |
| CN112317222A (en) * | 2020-10-27 | 2021-02-05 | 浙江大学 | Droplet generator with feedback control function and feedback control method thereof |
| CN112635696B (en) * | 2020-12-22 | 2023-05-02 | 合肥维信诺科技有限公司 | Packaging device and packaging method thereof |
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