CN102615018B - Piezoelectric wafer control type non-contact glue dispensing device - Google Patents
Piezoelectric wafer control type non-contact glue dispensing device Download PDFInfo
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- CN102615018B CN102615018B CN201210116547.9A CN201210116547A CN102615018B CN 102615018 B CN102615018 B CN 102615018B CN 201210116547 A CN201210116547 A CN 201210116547A CN 102615018 B CN102615018 B CN 102615018B
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- 239000003292 glue Substances 0.000 title claims abstract description 76
- 238000006073 displacement reaction Methods 0.000 claims abstract description 58
- 230000007246 mechanism Effects 0.000 claims abstract description 32
- 239000000758 substrate Substances 0.000 claims description 8
- 241000446313 Lamella Species 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 230000003321 amplification Effects 0.000 abstract description 23
- 238000003199 nucleic acid amplification method Methods 0.000 abstract description 23
- 238000005516 engineering process Methods 0.000 abstract description 11
- 230000005540 biological transmission Effects 0.000 abstract description 9
- 238000002347 injection Methods 0.000 abstract description 8
- 239000007924 injection Substances 0.000 abstract description 8
- 239000012530 fluid Substances 0.000 abstract description 5
- 238000004806 packaging method and process Methods 0.000 abstract description 5
- 239000011248 coating agent Substances 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract 1
- 239000003814 drug Substances 0.000 abstract 1
- 229940079593 drug Drugs 0.000 abstract 1
- 239000004973 liquid crystal related substance Substances 0.000 abstract 1
- 238000012423 maintenance Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 11
- 239000007788 liquid Substances 0.000 description 7
- 230000009471 action Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000004377 microelectronic Methods 0.000 description 4
- 239000007921 spray Substances 0.000 description 4
- 238000005507 spraying Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000010304 firing Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
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- Coating Apparatus (AREA)
Abstract
本发明提出一种结构简单、维护方便、成本低廉的新型压电晶片控制型非接触点胶装置，压电晶片的微小振动位移通过位移放大机构进行放大，驱动撞针上下运动实现胶液的喷射。本发明采用如下技术方案：压电晶片同膜片弹簧、质量块、传振杆和撞针组成位移放大机构，当施加在压电晶片上的电压频率与位移放大机构的固有频率接近或相同时，位移放大机构达到共振状态，撞针的输出位移和速度达到最大，驱动胶液从喷嘴中喷出，实现胶液的自动分配。这种新型压电晶片控制型非接触点胶装置可应用于精量化学、药物定量分配、生物医学等领域，特别适用于半导体封装中高黏度流体点胶技术领域，用于电子封装中芯片固定、表面贴装、底部填充和液晶显示平板中荧光粉涂覆等。
The present invention proposes a novel piezoelectric chip-controlled non-contact glue dispensing device with simple structure, convenient maintenance and low cost. The micro-vibration displacement of the piezoelectric chip is amplified by a displacement amplification mechanism, and the striker is driven to move up and down to realize glue injection. The present invention adopts the following technical scheme: the piezoelectric wafer forms a displacement amplification mechanism with the diaphragm spring, mass block, vibration transmission rod and striker, when the voltage frequency applied to the piezoelectric wafer is close to or the same as the natural frequency of the displacement amplification mechanism, The displacement amplification mechanism reaches the resonance state, the output displacement and speed of the striker reach the maximum, and the glue is driven to be ejected from the nozzle to realize the automatic distribution of the glue. This new type of piezoelectric chip-controlled non-contact dispensing device can be used in precision chemistry, quantitative distribution of drugs, biomedicine and other fields. It is especially suitable for high-viscosity fluid dispensing technology in semiconductor packaging. It is used for chip fixing, Surface mount, underfill and phosphor coating in liquid crystal display panels, etc.
Description
技术领域 technical field
本发明涉及一种压电晶片控制型非接触点胶装置，属于微电子封装领域。The invention relates to a piezoelectric wafer-controlled non-contact dispensing device, which belongs to the field of microelectronic packaging.
背景技术 Background technique
流体点胶技术是微电子封装中的一项关键技术，它可以构造形成点、线、面(涂敷)及各种图形，大量应用于芯片固定、封装倒扣和芯片涂敷等。这项技术以受控的方式对流体进行精确分配，可将理想大小的流体(焊剂、导电胶、环氧树脂和粘合剂等)转移到工件(芯片、电子元件等)的合适位置，以实现元器件之间机械或电气的连接，该技术要求点胶系统操作性能好、点胶速度高且点出的胶点一致性好和精度高。Fluid dispensing technology is a key technology in microelectronic packaging. It can be structured to form points, lines, surfaces (coating) and various graphics, and is widely used in chip fixing, package flipping and chip coating. This technology precisely dispenses fluids in a controlled manner, transferring ideally sized fluids (flux, conductive glue, epoxies, adhesives, etc.) To realize the mechanical or electrical connection between components, this technology requires the dispensing system to have good operating performance, high dispensing speed, good consistency and high precision of the dispensing glue points.
传统的点胶技术为接触式点胶，包括计量管式点胶、活塞式点胶和时间/压力型点胶。这种接触型点胶技术依靠点胶头引导胶液与面板接触，延时一段时间使胶液浸润面板，然后点胶头向上运动，胶液依靠和面板之间的黏性力与点胶头分离，从而在面板上形成胶点。这项点胶技术最大的特点是需要配置高精度的位移传感器，以控制点胶头下降和抬起的高度，辅助系统比较昂贵，且点胶速度受到了限制。另外，胶点的一致性比较差。The traditional dispensing technology is contact dispensing, including metering tube dispensing, piston dispensing and time/pressure dispensing. This kind of contact dispensing technology relies on the dispensing head to guide the glue to contact the panel, delay for a period of time to make the glue infiltrate the panel, and then move the dispensing head upwards, the glue depends on the viscous force between the panel and the dispensing head Separation, forming a dot of glue on the panel. The biggest feature of this dispensing technology is that it needs to be equipped with a high-precision displacement sensor to control the height of the dispensing head’s descent and elevation, the auxiliary system is relatively expensive, and the dispensing speed is limited. In addition, the consistency of glue dots is relatively poor.
在微电子技术的发展中，集成电路越来越呈现出复杂化和微型化，半导体封装要求具有更小的尺寸、更多的引线、更密的内连线等，对点胶技术的要求也越来越高，点胶技术逐渐由接触式点胶向非接触式(喷射)点胶转变。喷射式点胶以一定的方式使胶液受到高压作用，由此获得足够大的动能后以一定的速度喷射到面板上，喷射胶液过程中点胶头无Z轴方向的位移，大大加快了点胶的速度，且胶滴的一致性好。In the development of microelectronics technology, integrated circuits are becoming more and more complicated and miniaturized. Semiconductor packaging requires smaller sizes, more leads, and denser interconnections. The requirements for dispensing technology are also Higher and higher, the dispensing technology is gradually changing from contact dispensing to non-contact (jet) dispensing. Jet dispensing makes the glue liquid subjected to high pressure in a certain way, thus obtaining enough kinetic energy and spraying it onto the panel at a certain speed. During the glue spraying process, the dispensing head has no displacement in the Z-axis direction, which greatly speeds up the process. The speed of dispensing, and the consistency of the glue drop is good.
非接触式点胶主要分为机械式喷射点胶和压电叠堆式喷射点胶。Non-contact dispensing is mainly divided into mechanical jet dispensing and piezoelectric stack jet dispensing.
机械式喷射点胶的主要动力源是压缩空气。一个脉冲的压缩空气作用在活塞头上，压缩弹簧形成一定的位移，带动撞针抬起，然后胶液充满撞针抬起的空间，作用在活塞上的压缩空气泄掉后，在回复弹簧力的作用下，撞针向下快速运动冲击到喷嘴阀座，使胶液快速喷出形成胶滴，美国诺信公司的DJ-2100、DJ-2200、DJ-9000系列点胶头均是采用这种方式喷射点胶的。这种喷射装置较好的解决了接触式点胶的一些问题，但是由于空气的可压缩性致使胶点的一致性还不是很理想，并且工作频率比较低，一般在1 50Hz～200Hz。The primary power source for mechanical jet dispensing is compressed air. A pulse of compressed air acts on the piston head, and the compression spring forms a certain displacement, which drives the firing pin to lift up, and then the glue fills the space where the firing pin lifts up. After the compressed air acting on the piston is released, the force of the spring is restored. Next, the striker quickly moves downward and hits the valve seat of the nozzle, so that the glue is sprayed out quickly to form glue droplets. The DJ-2100, DJ-2200, and DJ-9000 series of dispensing heads of Nordson Corporation of the United States all use this method to spray dispensing. This kind of injection device solves some problems of contact dispensing better, but the consistency of the glue point is not very ideal due to the compressibility of the air, and the working frequency is relatively low, generally between 1 50Hz and 200Hz.
压电叠堆式喷射点胶采用杠杆放大原理或液压放大原理将压电叠堆的微小位移进行放大，然后驱动撞针与喷嘴阀座配合实现胶液的喷射。这种采用压电叠堆喷射点胶的方式不仅实现了非接触式喷射点胶，还解决了空气动力源喷射点胶胶滴一致性不是很理想的问题，并且喷射频率最高可以达到700Hz，大大提高了喷射速度。但是压电叠堆价格昂贵，压电叠堆式喷射点胶装置的价格远远高于机械式喷射点胶装置，大大限制了压电叠堆式喷射点胶装置的应用。Piezoelectric stack jet dispensing adopts the principle of lever amplification or hydraulic amplification to amplify the small displacement of the piezoelectric stack, and then drives the striker to cooperate with the nozzle valve seat to realize the injection of glue. This method of piezoelectric stack jet dispensing not only realizes non-contact jet dispensing, but also solves the problem of unsatisfactory consistency of aerodynamic source jet dispensing glue droplets, and the jetting frequency can reach up to 700Hz, greatly Increased spray speed. However, the piezoelectric stack is expensive, and the price of the piezoelectric stack jet dispensing device is much higher than that of the mechanical jet dispensing device, which greatly limits the application of the piezoelectric stack jet dispensing device.
终上所述，机械式喷射点胶装置虽然成本较低，但是在胶点一致性、点胶速度等方面还有待提高；而压电叠堆式喷射点胶装置虽然点胶精度、点胶速度、胶点一致性等方面满足了现代电子封装业的发展，但是应进一步降低其成本。As mentioned above, although the cost of the mechanical jet dispensing device is low, it still needs to be improved in terms of glue dot consistency and dispensing speed; , Glue point consistency and other aspects meet the development of modern electronic packaging industry, but the cost should be further reduced.
发明内容 Contents of the invention
本发明提出一种压电晶片控制型非接触点胶装置，以解决接触式点胶装置和机械式喷射点胶装置的胶点一致性不好和点胶速度慢等问题，达到压电叠堆式喷射点胶装置的点胶效果，并且有效的降低压电式喷射点胶的成本。The present invention proposes a piezoelectric chip-controlled non-contact dispensing device to solve the problems of poor glue dot consistency and slow dispensing speed of the contact dispensing device and mechanical jet dispensing device, and achieve piezoelectric stacking The dispensing effect of the piezoelectric jet dispensing device, and effectively reduce the cost of piezoelectric jet dispensing.
为达到以上的目的，本发明采用以下技术方案：To achieve the above object, the present invention adopts the following technical solutions:
由于逆压电效应，压电晶片在电压的作用下产生微小变形，由于位移很小(10μm)，不能用来直接驱动高粘度胶液，本发明利用位移放大机构将压电晶片的位移进行放大，从而可以驱动高粘度胶液，实现喷射点胶。Due to the inverse piezoelectric effect, the piezoelectric chip produces a small deformation under the action of the voltage. Since the displacement is very small (10 μm), it cannot be used to directly drive the high-viscosity glue. The invention uses a displacement amplification mechanism to amplify the displacement of the piezoelectric chip , so that high-viscosity glue can be driven to realize jet dispensing.
一种压电晶片控制型非接触点胶装置，包括压电晶片位移放大机构及其辅助构件，其特征在于：压电晶片位移放大机构包括端盖、压电晶片、基板、紧定螺母、传振杆、膜片弹簧I、膜片弹簧II、质量块和撞针；辅助构件包括盖板、调节螺母、腔体、密封板、密封环、密封圈、喷嘴底座、胶液连接管、储液罐等。A piezoelectric wafer controlled non-contact glue dispensing device, comprising a piezoelectric wafer displacement amplifying mechanism and its auxiliary components, characterized in that the piezoelectric wafer displacement amplifying mechanism includes an end cover, a piezoelectric wafer, a base plate, a set nut, a transmission Vibrating rod, diaphragm spring I, diaphragm spring II, mass block and striker; auxiliary components include cover plate, adjusting nut, cavity, sealing plate, sealing ring, sealing ring, nozzle base, glue connecting pipe, liquid storage tank wait.
本发明压电晶片控制型非接触点胶装置，压电晶片作为动力源，电压作用在压电晶片的两端，由于逆压电效应，压电晶片弯曲产生微小的伸长位移；当作用在压电晶片上的电压频率同位移放大机构的固有频率接近或相同时，位移放大机构将压电晶片的微小位移放大，驱动撞针快速向下运动，喷嘴处的胶液向喷嘴中流动，当撞针撞击到喷嘴底座时，截断流动的胶液，同时在喷嘴中形成巨大的局部压力，在局部压力的作用下喷嘴中的胶液喷射出来形成胶滴。改变作用在压电晶片上电压的方向，压电晶片回缩，通过位移放大机构将撞针抬起，准备进入下一周期的循环。The piezoelectric chip control type non-contact dispensing device of the present invention uses the piezoelectric chip as the power source, and the voltage acts on both ends of the piezoelectric chip. Due to the inverse piezoelectric effect, the piezoelectric chip bends to produce a small elongation displacement; when acting on When the voltage frequency on the piezoelectric chip is close to or the same as the natural frequency of the displacement amplification mechanism, the displacement amplification mechanism will amplify the small displacement of the piezoelectric chip, driving the striker to move downward quickly, and the glue at the nozzle will flow into the nozzle. When the striker When it hits the nozzle base, the flowing glue is cut off, and at the same time, a huge partial pressure is formed in the nozzle. Under the action of the partial pressure, the glue in the nozzle is ejected to form glue droplets. Change the direction of the voltage acting on the piezoelectric wafer, the piezoelectric wafer retracts, lifts the striker through the displacement amplification mechanism, and prepares to enter the next cycle.
本发明所述压电晶片粘接到基板两面，基板与传振杆用螺母固定连接，与上面的端盖用螺栓固定连接；传振杆与膜片弹簧I通过紧定螺母固连，膜片弹簧I固定在质量块上；膜片弹簧II通过紧定螺母与撞针固连，膜片弹簧II固定在质量块上；端盖通过调节螺母固定在盖板上，并且可以调节位移放大机构的上下高度，由此可以控制撞针与喷嘴底座的间隙。The piezoelectric chip of the present invention is bonded to both sides of the substrate, the substrate is fixedly connected with the vibration transmission rod with nuts, and is fixedly connected with the upper end cover with bolts; The spring I is fixed on the mass block; the diaphragm spring II is fixedly connected with the striker through the set nut, and the diaphragm spring II is fixed on the mass block; the end cover is fixed on the cover plate through the adjusting nut, and the displacement amplification mechanism can be adjusted up and down. Height, which can control the gap between the striker and the nozzle base.
在没有胶液喷出时，撞针与喷嘴底座留有小间隙，胶液在表面张力的作用下停留在喷嘴处，此时压电晶片作用低电平；当压电晶片作用高电平时，压电晶片、膜片弹簧、质量块和撞针组成的位移放大机构将压电晶片的微小位移放大，撞针快速向下运动贴合喷嘴底座，截断胶液的流动，喷嘴中的胶液快速喷出，形成胶滴。When no glue is sprayed out, there is a small gap between the striker and the nozzle base, and the glue stays at the nozzle under the action of surface tension. At this time, the piezoelectric chip acts at a low level; when the piezoelectric chip acts at a high level, the piezoelectric chip The displacement amplification mechanism composed of electric chip, diaphragm spring, mass block and striker amplifies the small displacement of the piezoelectric chip, and the striker quickly moves downward to fit the nozzle base, cutting off the flow of glue, and the glue in the nozzle is quickly ejected, Gel droplets are formed.
本发明中胶液压力的大小由储液罐中压缩空气的压力来调节，既要保证撞针与喷嘴底座之间有间隙时胶液不泄露，又要保证撞针抬起后胶液及时的补充到空缺处，使下周期的喷射点胶顺利进行。In the present invention, the pressure of the glue is adjusted by the pressure of the compressed air in the liquid storage tank. It is necessary to ensure that the glue does not leak when there is a gap between the striker and the nozzle base, and to ensure that the glue is replenished in time after the striker is lifted. The vacancy, so that the jet dispensing of the next cycle can be carried out smoothly.
本发明的优点在于提出了一种压电晶片控制型非接触点胶装置，可实现液体的定量输送、定量分配、以及微电子封装中高黏度流体的点胶等多种用途。本发明具有结构简单、易于控制的特点，既实现了压电叠堆式喷射点胶装置的功能和性能，又极大的降低了成本。The advantage of the present invention is that it proposes a piezoelectric wafer-controlled non-contact dispensing device, which can realize quantitative delivery and distribution of liquids, and dispensing of high-viscosity fluids in microelectronic packaging. The invention has the characteristics of simple structure and easy control, not only realizes the function and performance of the piezoelectric stack type jet dispensing device, but also greatly reduces the cost.
附图说明 Description of drawings
图1是压电晶片控制型非接触点胶装置结构示意图。Figure 1 is a schematic diagram of the structure of a piezoelectric chip-controlled non-contact dispensing device.
图2是压电晶片弯曲振动的示意图。Fig. 2 is a schematic diagram of bending vibration of a piezoelectric wafer.
图3是压电晶片控制型非接触点胶装置位移放大机构的结构示意图。Fig. 3 is a structural schematic diagram of a displacement amplification mechanism of a piezoelectric wafer-controlled non-contact dispensing device.
一种实施方式：如图3(a)所示，压电晶片(16)采用双晶片结构(也可以采用单晶片结构)，质量块(9)同两个膜片弹簧串联组成位移放大机构，原理图如图3(b)所示。m1、m2、m3和m4分别是端盖(15)、传振杆(18)、质量块(9)和撞针(6)的质量；k1、k2和k3分别是压电晶片(16)、膜片弹簧I和膜片弹簧II的刚度；在输出位移中，撞针(6)的输出位移y4是最大的。A kind of embodiment: as shown in Fig. 3 (a), piezoelectric chip (16) adopts bimorph structure (also can adopt single crystal structure), mass block (9) forms displacement amplifying mechanism in series with two diaphragm springs, The schematic diagram is shown in Figure 3(b). m 1 , m 2 , m 3 and m 4 are the masses of the end cover (15), the vibration transmission rod (18), the mass block (9) and the striker (6) respectively; k 1 , k 2 and k 3 are the masses of the pressure The rigidity of electric chip (16), diaphragm spring I and diaphragm spring II; In output displacement, the output displacement y 4 of striker (6) is maximum.
一种实施方式：将质量块(9)同两个膜片弹簧串联组成的位移放大机构再串联起来，2个或更多个，可以进一步放大输出的位移，图3(d)是用传振杆(18)将2个位移放大机构串联起来的结构示意图，其原理图如图3(e)所示。同图3(b)相比较，由于串联了质量块和膜片弹簧，撞针(6)的位移y6是大于y4的。撞针(6)位移的增加可以喷射粘度更高的胶液。One embodiment: connect the mass block (9) in series with the displacement amplifying mechanism composed of two diaphragm springs, two or more, can further amplify the output displacement, Fig. 3(d) uses the vibration The structural diagram of the rod (18) connecting two displacement amplification mechanisms in series, and its principle diagram is shown in Figure 3(e). Compared with Fig. 3 (b), because the mass block and the diaphragm spring are connected in series, the displacement y 6 of the striker (6) is greater than y 4 . The increase of the displacement of the striker (6) can spray glue with higher viscosity.
一种实施方式：如图3(f)所示，连接杆(25)、膜片弹簧III(26)、质量块(27)、传振杆(28)、膜片弹簧IV(29)和端盖(30)组成的弹簧-质量放大机构位于压电晶片(16)的上面，连接杆(25)通过螺纹固定在盖板(12)上。当作用在压电晶片上的电压频率与该弹簧-质量位移放大机构的固有频率接近或相同时，撞针(6)的输出位移和速度达到最大，达到喷射胶液的目的。One embodiment: as shown in Figure 3(f), the connecting rod (25), diaphragm spring III (26), mass (27), vibration transmission rod (28), diaphragm spring IV (29) and end The spring-mass amplifying mechanism formed by the cover (30) is located on the top of the piezoelectric wafer (16), and the connecting rod (25) is fixed on the cover plate (12) by threads. When the voltage frequency acting on the piezoelectric chip is close to or identical to the natural frequency of the spring-mass displacement amplification mechanism, the output displacement and speed of the striker (6) reach the maximum, and the purpose of spraying glue is achieved.
上述三种实施方式所用的弹簧膜片是如图3(c)所示的圆环状弹簧膜片，弹簧膜片还可以使用长方片状形式的，如图3(g)所示，使用长方片状弹簧膜片的位移放大机构的示意图如图3(h)所示。长方片状弹簧膜片的两端分别固定在质量块(9)和腔体(3)上，沿质量块中心均匀分布，根据使用频率的要求布置弹簧膜片的个数。The used spring diaphragm of above-mentioned three kinds of embodiments is the annular spring diaphragm as shown in Figure 3 (c), and the spring diaphragm can also use the rectangular sheet form, as shown in Figure 3 (g), use The schematic diagram of the displacement amplification mechanism of the rectangular leaf spring diaphragm is shown in Fig. 3(h). The two ends of the rectangular sheet-shaped spring diaphragms are respectively fixed on the mass block (9) and the cavity (3), and are evenly distributed along the center of the mass block, and the number of spring diaphragms is arranged according to the requirements of the frequency of use.
图4是压电晶片的微位移经位移放大机构放大后再经过柔性铰链进行位移放大驱动撞针分配胶液的结构示意图。Fig. 4 is a structural schematic diagram of the micro-displacement of the piezoelectric chip being amplified by the displacement amplifying mechanism and then amplified by the flexible hinge to drive the striker to distribute the glue.
图5是位移放大机构水平放置驱动撞针分配胶液的结构示意图。Fig. 5 is a schematic diagram of the structure of the displacement amplifying mechanism placed horizontally to drive the striker to distribute the glue.
图6是撞针向下运动时，分配腔中胶液的流动示意图。Fig. 6 is a schematic diagram of the flow of glue in the dispensing chamber when the striker moves downward.
图7是撞针向上运动时，分配腔中胶液的流动示意图。Fig. 7 is a schematic diagram of the flow of glue in the dispensing chamber when the striker moves upwards.
具体实施方式 Detailed ways
实施方式1：Implementation mode 1:
参见图1所示，本发明一种压电晶片控制型非接触点胶装置由图3所示的压电晶片位移放大机构及其辅助构件组成。压电晶片位移放大机构由压电晶片(16)、基板(17)、端盖(15)、传振杆(18)、紧定螺母(7)、膜片弹簧I(10)、质量块(9)、膜片弹簧II(8)、撞针(6)构成。压电晶片(16)与基板(17)粘接，基板(17)与端盖(15)固定连接；传振杆(18)的两端分别于压电晶片(16)和膜片弹簧I(10)固定连接；膜片弹簧I(10)与质量块(9)固定连接；撞针(6)与膜片弹簧II(8)连接，膜片弹簧II(8)固定在质量块(9)。喷嘴底座(1)通过螺栓(2)固定在腔体(3)上，与撞针(6)的头部配合开启或闭合实现胶液的喷射。Referring to FIG. 1 , a piezoelectric chip-controlled non-contact dispensing device of the present invention is composed of a piezoelectric chip displacement amplification mechanism and its auxiliary components shown in FIG. 3 . The piezoelectric chip displacement amplifying mechanism is made of piezoelectric chip (16), substrate (17), end cover (15), transmission vibration rod (18), set nut (7), diaphragm spring 1 (10), mass block ( 9), diaphragm spring II (8), striker (6) form. The piezoelectric wafer (16) is bonded to the base plate (17), and the base plate (17) is fixedly connected to the end cover (15); the two ends of the vibration transmission rod (18) are respectively connected to the piezoelectric wafer (16) and the diaphragm spring 1 ( 10) Fixed connection; the diaphragm spring I (10) is fixedly connected to the mass block (9); the striker (6) is connected to the diaphragm spring II (8), and the diaphragm spring II (8) is fixed to the mass block (9). The nozzle base (1) is fixed on the cavity (3) by bolts (2), and cooperates with the head of the striker (6) to open or close to realize the injection of glue.
储液罐(19)中的胶液在压缩空气的作用下通过胶液连接管(21)进入到腔体(3)中的分配腔中，压缩空气的压力值应保持在合适的范围，既要保证撞针与喷嘴底座不接触时胶液不会从喷嘴泄露，撞针抬起后，胶液又要迅速的补充到空白区域进入下一周期的喷射。The glue in the liquid storage tank (19) enters into the dispensing cavity in the cavity (3) through the glue connecting pipe (21) under the action of compressed air, and the pressure value of the compressed air should be kept in an appropriate range, both It is necessary to ensure that the glue will not leak from the nozzle when the striker is not in contact with the nozzle base. After the striker is lifted, the glue must be quickly replenished to the blank area to enter the next cycle of spraying.
作用在压电晶片上的电压的频率应与压电晶片位移放大机构的固有频率接近或相等，此时压电晶片的微小位移(10μm)才被最大限度的放大(0.3mm～0.5mm)，撞针的位移才能满足胶液喷射的需要，实现胶液的喷射。The frequency of the voltage acting on the piezoelectric wafer should be close to or equal to the natural frequency of the displacement amplification mechanism of the piezoelectric wafer. At this time, the tiny displacement (10μm) of the piezoelectric wafer is amplified to the maximum (0.3mm～0.5mm). The displacement of the striker can meet the needs of the glue injection, and realize the injection of the glue.
当压电晶片施加高电平时，撞针(6)迅速的向下运动，如图3所示，喷嘴处的胶液向喷嘴中流动，喷嘴上面的胶液则向上流动，撞针(6)头部与喷嘴紧密贴合后截断胶液的流动，撞针(6)的动量转化为喷嘴中胶液的动量，喷嘴中的胶液快速的喷射出来，形成胶滴；当压电晶片施加低电平时，撞针(6)要向上运动，如图4所示，腔体(3)中分配腔中的胶液向喷嘴处流动，填补撞针向上运动后留下的真空区域，在胶液表面张力的作用下，此时胶液不会从喷嘴泄露出去；当压电晶片再次施加高电平时，就会将胶液再次喷出形成胶滴，如此循环往复，胶液就不断的以胶滴的形式喷出。When the piezoelectric wafer is applied with a high level, the striker (6) moves downward rapidly, as shown in Figure 3, the glue at the nozzle flows into the nozzle, and the glue above the nozzle flows upward, and the striker (6) head After being tightly fitted with the nozzle, the flow of the glue is cut off, the momentum of the striker (6) is converted into the momentum of the glue in the nozzle, and the glue in the nozzle is ejected quickly to form glue droplets; when the piezoelectric chip is applied with a low level, The striker (6) should move upwards, as shown in Figure 4, the glue in the distribution chamber in the cavity (3) flows to the nozzle to fill the vacuum area left after the striker moves upwards, under the action of the surface tension of the glue At this time, the glue will not leak out from the nozzle; when the piezoelectric chip is applied with a high level again, the glue will be sprayed out again to form glue droplets, and the glue will be continuously sprayed out in the form of glue droplets in this cycle. .
压电晶片位移放大机构通过调节螺母(14)固定在盖板(12)上，盖板(12)与腔体(3)固定连接，调节螺母(14)可以调节位移放大机构的上下位移，以达到调节撞针(6)与喷嘴底座(3)之间距离的目的。不同的距离配合施加在压电晶片上的合适电压，可以喷射不同粘度的胶液，形成不同大小的胶滴。The piezoelectric chip displacement amplification mechanism is fixed on the cover plate (12) through the adjustment nut (14), and the cover plate (12) is fixedly connected with the cavity (3), and the adjustment nut (14) can adjust the up and down displacement of the displacement amplification mechanism, so as to The purpose of adjusting the distance between the striker (6) and the nozzle base (3) is achieved. Different distances and appropriate voltages applied to the piezoelectric chip can spray glue with different viscosities to form glue droplets of different sizes.
实施方式2：Implementation mode 2:
参见图4所示，压电晶片(16)、基板(17)、传振杆(18)、膜片弹簧II(10)、质量块(9)、膜片弹簧I(8)和连接杆(31)组成的位移放大机构将压电晶片的微小位移放大，连接杆(31)与柔性铰链(32)相连接。柔性铰链(32)的一端固定在腔体(3)上，另一端与撞针(6)固定连接，通过柔性铰链(32)杠杆放大作用，当位移放大机构向下运动时，撞针(6)的位移被进一步放大，可以驱动粘度更大的胶液实现自动化分配，实现胶液的喷射。Referring to shown in Fig. 4, piezoelectric wafer (16), substrate (17), transmission rod (18), diaphragm spring II (10), mass block (9), diaphragm spring I (8) and connecting rod ( 31) The displacement amplifying mechanism composed of the piezoelectric chip amplifies the tiny displacement, and the connecting rod (31) is connected with the flexible hinge (32). One end of the flexible hinge (32) is fixed on the cavity (3), and the other end is fixedly connected with the striker (6). Through the lever amplification of the flexible hinge (32), when the displacement amplification mechanism moves downward, the striker (6) The displacement is further amplified, which can drive the more viscous glue to realize automatic distribution and realize the injection of glue.
实施方式3：Implementation mode 3:
参见图5所示，压电晶片(16)、基板(17)、传振杆(18)、膜片弹簧II(10)、质量块(9)、膜片弹簧I(8)和连接杆(33)组成的位移放大机构水平放置，连接杆(33)与转换杠杆(34)固定连接，转换杠杆(34)的中间部分铰接在腔体(3)上，在另一端，转换杠杆(34)与撞针(6)固定连接。压电晶片(16)的微位移经位移放大机构放大后通过转换杠杆(34)，将水平方向上的位移转变为撞针(6)竖直方向上的位移，从而驱动胶液自动化分配，实现胶液的喷射。Referring to shown in Fig. 5, piezoelectric chip (16), substrate (17), transmission rod (18), diaphragm spring II (10), mass block (9), diaphragm spring I (8) and connecting rod ( 33) The displacement amplification mechanism formed is placed horizontally, the connecting rod (33) is fixedly connected with the conversion lever (34), the middle part of the conversion lever (34) is hinged on the cavity (3), at the other end, the conversion lever (34) It is fixedly connected with the striker (6). The micro-displacement of the piezoelectric chip (16) is amplified by the displacement amplifying mechanism, and then through the conversion lever (34), the displacement in the horizontal direction is converted into the displacement in the vertical direction of the striker (6), thereby driving the automatic distribution of the glue liquid and realizing the glue liquid injection.
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| CN104511405A (en) * | 2013-09-29 | 2015-04-15 | 上海三维精密模具制造有限公司 | Non-contact coating method |
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