CN111112018A - Direct-insertion type quartz crystal resonator dispensing device and using method thereof - Google Patents
Direct-insertion type quartz crystal resonator dispensing device and using method thereof Download PDFInfo
- Publication number
- CN111112018A CN111112018A CN201911260441.4A CN201911260441A CN111112018A CN 111112018 A CN111112018 A CN 111112018A CN 201911260441 A CN201911260441 A CN 201911260441A CN 111112018 A CN111112018 A CN 111112018A
- Authority
- CN
- China
- Prior art keywords
- glue
- tray
- crystal resonator
- quartz crystal
- dispensing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010453 quartz Substances 0.000 title claims abstract description 33
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 33
- 239000013078 crystal Substances 0.000 title claims abstract description 26
- 238000000034 method Methods 0.000 title claims abstract description 14
- 238000003780 insertion Methods 0.000 title description 3
- 239000003292 glue Substances 0.000 claims abstract description 44
- 239000002253 acid Substances 0.000 claims abstract description 6
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 4
- 238000004140 cleaning Methods 0.000 claims abstract description 4
- 239000000853 adhesive Substances 0.000 claims description 12
- 230000001070 adhesive effect Effects 0.000 claims description 12
- 239000002585 base Substances 0.000 claims description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 229910001069 Ti alloy Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 238000005406 washing Methods 0.000 claims description 6
- 239000003344 environmental pollutant Substances 0.000 claims description 5
- 231100000719 pollutant Toxicity 0.000 claims description 5
- 239000010936 titanium Substances 0.000 claims description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- 239000003513 alkali Substances 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 239000001257 hydrogen Substances 0.000 claims description 3
- 229910052739 hydrogen Inorganic materials 0.000 claims description 3
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims 3
- 229910052742 iron Inorganic materials 0.000 claims 1
- 229910052720 vanadium Inorganic materials 0.000 claims 1
- 238000005554 pickling Methods 0.000 abstract description 2
- 238000007599 discharging Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 abstract 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
- B05B15/50—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter
- B05B15/55—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter using cleaning fluids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
Abstract
The invention relates to a direct-insert type quartz crystal resonator glue dispensing device and a use method thereof, and the structure of the direct-insert type quartz crystal resonator glue dispensing device comprises a glue dispensing tray, a support base, a support, a lead and a spring piece; a plurality of slotted holes are formed in the dispensing tray; the support is fixedly arranged on the support base, and the two spring pieces are symmetrically fixed on the support. The lower end of the spring piece is connected with a lead which passes through the support, the support underframe and the slotted hole of the spot gluing tray. After the dispensing operation is finished, the whole dispensing device can be moved into a high-temperature furnace for curing and cleaning. The advantages are that: the precision of the dispensing tray after repeated high-temperature baking and acid pickling can be kept in a high-precision range, the situations of poor glue points and carrying positions, inconsistent glue points, partial carrying and the like caused by tray deformation and insufficient station precision are reduced, the precision and consistency of glue discharging, glue applying and carrying of quartz wafers are ensured, the impact resistance reliability and consistency of the performance of the quartz crystal resonator are obviously improved, the processing requirement is not harsh, and the dispensing tray is easy to popularize.
Description
Technical Field
The invention relates to a direct-insert type quartz crystal resonator glue dispensing device and a using method thereof, belonging to the technical field of component manufacturing.
Background
In the manufacturing process of the in-line quartz crystal resonator, the quartz wafer and the external base or support are required to be connected by conductive adhesive to realize the fixation and electrical connection of the quartz wafer, and the process is called glue dispensing. The conductive adhesive is formed by mixing flake silver powder, an organic adhesive and a solvent. During processing, firstly, the conductive adhesive is coated on an external base or a support, then a quartz wafer is placed, then the upper layer of conductive adhesive is coated, and a workpiece needs to be placed in a high-temperature furnace to be cured. The mounting precision and consistency of the glue dropping point, the glue applying point and the quartz crystal wafer directly determine the shock resistance reliability and consistency of the performance of the quartz crystal resonator.
The machining precision of the glue dispenser commonly used in the industry at present depends on the precision of the tray carrying the external base or support. In practice, it is found that the tray made of aluminum and subjected to corrosion processing, which is commonly adopted in the industry, can achieve the purposes, but due to the characteristics of poor hardness, easy deformation, easy abrasion and the like of aluminum materials, the precision of a glue dispensing position and a wafer carrying position cannot be guaranteed, the aluminum materials cannot resist acid washing and alkali washing, conductive glue or other dirt adhered to the surface of the tray cannot be cleaned in an acid or alkali mode, pollutants in the processing process cannot be effectively controlled, and adverse effects on the stability and the impact resistance reliability of a quartz crystal resonator or the whole service life cycle of the quartz crystal resonator can be accompanied.
Disclosure of Invention
The invention provides a direct-insertion type quartz crystal resonator dispensing device and a using method thereof, aiming at solving the defects in the prior art, designing a dispensing tray which is light, high in strength, high temperature resistant, not easy to deform and acid and alkali resistant to clean and providing a high-precision processing mode, so that the dispensing tray can bear long-term high-temperature heating without deformation, adhered conductive adhesive and other pollutants can be washed away by acid washing, and high precision is kept.
The technical solution of the invention is as follows:
a direct-insert type quartz crystal resonator dispensing device structurally comprises a dispensing tray, a support base, a support, a lead and a spring piece; a plurality of slotted holes are formed in the dispensing tray; the support is fixedly arranged on the support base, and the two spring pieces are symmetrically fixed on the support. The lower end of the spring piece is connected with a lead which passes through the support, the support underframe and the slotted hole of the spot gluing tray.
The dispensing tray is made of TC4 titanium alloy material, wherein the TC4 titanium alloy comprises the chemical components of TC4 and the balance of titanium (Ti), iron (Fe) is less than or equal to 0.30, carbon (C) is less than or equal to 0.10, nitrogen (N) is less than or equal to 0.05, hydrogen (H) is less than or equal to 0.015, oxygen (O) is less than or equal to 0.20, aluminum (Al) is 5.5-6.8, and vanadium (V) is 3.5-4.5; the density of the powder was 4.5g/cm3。
The dispensing tray is processed by a numerical control machine tool, and the processing precision can reach +/-0.03 mm.
A use method of a direct-insert type quartz crystal resonator glue dispensing device comprises the following steps:
1) stacking a quartz wafer to be processed in a coating mask, and placing the coating mask on a wafer supply tray of a dispenser; the bracket to be processed is stacked on the dispensing tray, and the dispensing tray is placed at the supply position of the dispenser bracket and fixed by a positioning pin;
2) opening the dispenser and automatically dispensing the lower part of the bracket;
3) the glue dispenser automatically sucks the wafer, the wafer is placed on the support, and two ends of the wafer are pressed on the glue dropping points;
4) the glue dispenser automatically dispenses glue on the wafer;
5) moving the whole dispensing tray into a high-temperature furnace to carry out curing treatment on the conductive adhesive, wherein the curing temperature is 160 ℃;
6) and cleaning the residual conductive adhesive or other pollutants between the slotted holes on the dispensing tray by using a washing solution.
The invention has the beneficial effects that:
1) the shock resistance reliability of the product is ensured, so that the problem that the frequency drift is large or the vibration is stopped when the product manufactured by the tray by using the traditional method is used under the above condition is solved;
2) on the basis of not increasing workload and cost, high precision can still be maintained after high-temperature pickling and other procedures;
3) the rejection rate of the products is reduced, and the frequency stability of quartz crystal components is ensured.
Drawings
FIG. 1 is a schematic view of a dispensing tray of a direct-insert quartz crystal resonator dispensing device;
FIG. 2 is a schematic view of a bracket of an in-line quartz crystal resonator glue dispensing device;
FIG. 3 is a schematic view showing the placement of a bracket and a tray of an in-line quartz crystal resonator dispensing device;
fig. 4 is a schematic view of a finished product after dispensing.
Detailed Description
The technical solution of the present invention is further explained with reference to the accompanying drawings.
Referring to the attached figure 3, the direct-insert type quartz crystal resonator glue dispensing device structurally comprises a glue dispensing tray, a support base, a support, a lead and a spring piece; as shown in the attached figure 1, a plurality of slotted holes are arranged on the dispensing tray; as shown in fig. 2, the bracket is fixedly installed on the bracket base, and the two spring pieces are symmetrically fixed on the bracket. The lower end of the spring piece is connected with a lead which passes through the support, the support underframe and the slotted hole of the spot gluing tray.
The dispensing tray is made of TC4 titanium alloy material, wherein the TC4 titanium alloy comprises the chemical components of TC4 and the balance of titanium (Ti), iron (Fe) is less than or equal to 0.30, carbon (C) is less than or equal to 0.10, nitrogen (N) is less than or equal to 0.05, hydrogen (H) is less than or equal to 0.015, oxygen (O) is less than or equal to 0.20, aluminum (Al) is 5.5-6.8, and vanadium (V) is 3.5-4.5; the density of the powder was 4.5g/cm3。
The dispensing tray is processed by a numerical control machine tool, and the processing precision can reach +/-0.03 mm.
With reference to fig. 4, the using steps of the present invention are:
1) stacking a quartz wafer to be processed in a coating mask, and placing the coating mask on a wafer supply tray of a dispenser; the bracket to be processed is stacked on the dispensing tray, and the dispensing tray is placed at the supply position of the dispenser bracket and fixed by a positioning pin;
2) opening the dispenser and automatically dispensing the lower part of the bracket;
3) the glue dispenser automatically sucks the wafer, the wafer is placed on the support, and two ends of the wafer are pressed on the glue dropping points;
4) the glue dispenser automatically dispenses glue on the wafer;
5) moving the whole dispensing tray into a high-temperature furnace to carry out curing treatment on the conductive adhesive, wherein the curing temperature is 160 ℃;
6) and (4) cleaning the residual conductive adhesive or other pollutants between the slotted holes on the dispensing tray by using concentrated hydrochloric acid.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (7)
1. A glue dispensing device for a direct-insert quartz crystal resonator is characterized by comprising a glue dispensing tray, a bracket base, a bracket, a lead and a spring piece; a plurality of slotted holes are formed in the dispensing tray; the bracket is fixedly arranged on the bracket base, and the two spring pieces are symmetrically fixed on the bracket; the lower end of the spring piece is connected with a lead which passes through the support, the support underframe and the slotted hole of the spot gluing tray.
2. The in-line quartz crystal resonator glue dispensing device according to claim 1, wherein the glue dispensing tray is made of a TC4 titanium alloy material; the chemical components of the TC4 titanium alloy are TC4 with the balance of titanium, less than or equal to 0.30 of iron, less than or equal to 0.10 of carbon, less than or equal to 0.05 of nitrogen, less than or equal to 0.015 of hydrogen, less than or equal to 0.20 of oxygen, 5.5-6.8 of aluminum and 3.5-4.5 of vanadium; the density of the powder was 4.5g/cm3。
3. The in-line quartz crystal resonator glue dispensing device according to claim 2, wherein the glue dispensing tray is machined by a numerically controlled machine with a deviation of less than 0.03 mm.
4. A use method of a direct-insert type quartz crystal resonator glue dispensing device comprises the following steps:
1) stacking a quartz wafer to be processed in a coating mask, and placing the coating mask on a dispensing machine wafer supply tray; the bracket to be processed is stacked on the dispensing tray, and the dispensing tray is placed at the supply position of the dispenser bracket and fixed by a positioning pin;
2) opening a dispenser to dispense glue under the bracket;
3) the glue dispenser automatically sucks the wafer, the wafer is placed on the support, and two ends of the wafer are pressed on the glue dropping points;
4) the glue dispenser automatically dispenses glue on the wafer;
5) moving the whole dispensing tray into a high-temperature furnace to cure the conductive adhesive, wherein the curing temperature is 160-200 ℃;
6) and cleaning the residual conductive adhesive or other pollutants between the slotted holes on the dispensing tray by using a washing solution.
5. The use method of the in-line quartz crystal resonator glue dispensing device according to claim 4, wherein the glue dispenser can be a manual glue dispenser or a full-automatic glue dispenser.
6. The use method of an in-line quartz crystal resonator glue dispensing device according to claim 4, wherein in step (1), a plurality of supports can be simultaneously mounted on the same glue dispensing tray.
7. The use method of the in-line quartz crystal resonator dispensing device according to claim 4, wherein the washing liquid in the step (6) is acid liquid or alkali liquid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911260441.4A CN111112018A (en) | 2019-12-10 | 2019-12-10 | Direct-insertion type quartz crystal resonator dispensing device and using method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911260441.4A CN111112018A (en) | 2019-12-10 | 2019-12-10 | Direct-insertion type quartz crystal resonator dispensing device and using method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111112018A true CN111112018A (en) | 2020-05-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911260441.4A Pending CN111112018A (en) | 2019-12-10 | 2019-12-10 | Direct-insertion type quartz crystal resonator dispensing device and using method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111112018A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112702039A (en) * | 2020-12-29 | 2021-04-23 | 北京无线电计量测试研究所 | Crystal oscillator on-shelf dispensing process method and processor |
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Application publication date: 20200508 |
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