CN106067776A - Contactless spraying colloid system and method in the patch quartz-crystal resonator production of surface - Google Patents
Contactless spraying colloid system and method in the patch quartz-crystal resonator production of surface Download PDFInfo
- Publication number
- CN106067776A CN106067776A CN201610528991.XA CN201610528991A CN106067776A CN 106067776 A CN106067776 A CN 106067776A CN 201610528991 A CN201610528991 A CN 201610528991A CN 106067776 A CN106067776 A CN 106067776A
- Authority
- CN
- China
- Prior art keywords
- pedestal
- imposite
- glue
- individual base
- spray
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005507 spraying Methods 0.000 title claims abstract description 144
- 238000000034 method Methods 0.000 title claims abstract description 30
- 239000013078 crystal Substances 0.000 title claims abstract description 29
- 239000000084 colloidal system Substances 0.000 title claims abstract description 21
- 238000004519 manufacturing process Methods 0.000 title description 5
- 239000003292 glue Substances 0.000 claims abstract description 266
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 205
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 16
- 239000007921 spray Substances 0.000 claims description 103
- 238000002347 injection Methods 0.000 claims description 47
- 239000007924 injection Substances 0.000 claims description 47
- 230000000007 visual effect Effects 0.000 claims description 29
- 239000011159 matrix material Substances 0.000 claims description 19
- 238000012937 correction Methods 0.000 claims description 12
- 239000000178 monomer Substances 0.000 claims description 7
- 238000010276 construction Methods 0.000 claims description 4
- 238000001514 detection method Methods 0.000 claims description 2
- 238000000576 coating method Methods 0.000 description 11
- 239000010453 quartz Substances 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 8
- 238000003672 processing method Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 241001310793 Podium Species 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004989 laser desorption mass spectroscopy Methods 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 201000007094 prostatitis Diseases 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- -1 upper slice Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The invention belongs to electronic devices and components field, particularly relate to contactless spraying colloid system and method during surface patch quartz-crystal resonator produces.The spraying colloid system of the present invention includes pedestal imposite, wafer, spraying colloid system, and wherein, pedestal imposite and the wafer being mounted on pedestal imposite are respectively positioned on the lower section of nozzle in spraying colloid system.The glue spraying method of the present invention is to form multiple individual base on pedestal imposite, uses contactless mode to carry out glue spraying on the left and right platform of individual base and the auxiliary electrode of wafer that is attached on individual base.The present invention uses spray-bonding craft to process imposite, it is not necessary to Z axis motion necessary to tradition syringe needle gluing process.Glue spraying efficiency improves more than 3 times than some glue efficiency.
Description
Technical field
The invention belongs to electronic devices and components field, particularly relate to contactless spray during surface patch quartz-crystal resonator produces
Colloid system and method.
Background technology
Quartz-crystal resonator is also called quartz crystal, is commonly called as crystal oscillator, is to utilize the piezoelectric effect of quartz crystal to make
Resonant element, be used together with semiconductor device and Resistor-Capacitor Unit, just may make up quartz oscillator.
Quartz wafer, hereinafter referred to as wafer, it can be square, rectangle or circle etc., at its two corresponding surfaces
Upper coating silver layer is as electrode, and surface patch quartz-crystal resonator is the electrode on quartz wafer and pedestal to be entered by conducting resinl
Row electrical connection, by conducting resinl, quartz wafer is fixed on pedestal, and the auxiliary electrode on quartz wafer enters also by conducting resinl
Row coating.
But at present, surface mounting quartz crystal resonator has been used up contact gluing process.Specifically use: profit
With air pressure, the conducting resinl in a plastic pin pipe is released；Single pedestal is inhaled on the platform of sustained height, carries out a glue；Point glue sets
Standby must install calibration platform and laser ranging system additional, it is ensured that some plastic pin pipe installation site one syringe needle point glue of making peace is highly consistent
Property.
Whether the imposite processing of contact gluing process or surface patch quartz-crystal resonator all exists a lot of not enough.
The problem that contact gluing process exists:
1, degree height extremely sensitive to a glue, syringe needle range points glue platform is too high, and glue point plastic emitting point, glue point is less than normal；Syringe needle away from
Too low from a glue platform, glue point is spread out, and glue point is bigger than normal；Affect product electrical quantity bad, seriously can cause product failure.
2, contact glue for dispensing glue amount controls to be determined by air pressure and time, needs stable air pressure during point glue.
3, base cavity edge and pedestal point glue platform are apart from little, if glue point is near cavity edge, can collide syringe needle.
4, contact point glue, some plastic pin pipe, syringe needle are mainly Z-direction are transported up and down by cylinder or motor control, some glue times
The dynamic time, syringe needle moves up and down and causes glue spraying efficiency too low.
The imposite processing existing problems of surface patch quartz-crystal resonator:
1, pedestal imposite is to be formed by pottery big plate sintering, and angularity technical specification is single the pedestal maximum constituting imposite
Value is 0.05mm；Imposite maximum is 0.35mm；On imposite, the difference in height of each pedestal point glue platform is more than 0.05mm.
2, for loading the imposite frock of single pedestal, angularity technical specification maximum is 0.05mm, adds single base
The angularity of seat, on imposite, the difference in height of each pedestal point glue platform is more than 0.05mm.
From discussed above, if with conventional contact gluing process point pedestal imposite or be loaded in frock single only
Pedestal, it is impossible to ensure the glue spot diameter on platform, the most glue-free point of indivedual pedestals.
Summary of the invention
For the deficiencies in the prior art, contactless glue spraying in the surface patch quartz-crystal resonator production that the present invention provides
System and method, is solved conventional contact point glue in the bad problem of pedestal imposite point glue, is sprayed by the movement of pedestal
Glue, it is not necessary to adjust some glue height, it is ensured that be coated with the conduction that glue spot diameter is consistent, outward appearance is qualified on each pedestal left-right dots glue platform
Glue, with fixed wafer and pedestal, glue spraying efficiency is higher than efficiency for dispensing glue.
For solving above-mentioned technical problem, the present invention provides contactless glue spraying system in the patch quartz-crystal resonator production of surface
System, it is characterized in that and includes pedestal imposite 1, wafer 4, spraying colloid system, wherein, pedestal imposite 1 and to be mounted on pedestal whole
Wafer 4 on plate 1 is respectively positioned on the lower section of nozzle 7 in spraying colloid system.
Further, pedestal imposite 1 is the big plate of pottery, is provided with the structure list connected by matrix arrangement on the big plate of pottery
Unit, each construction unit is an independent individual base 1-1.
Further, pedestal imposite 1 is imposite frock, and imposite frock is provided with the room by matrix arrangement, each room
Inside it is placed with an individual base 1-1.
Further, each individual base position and individual base glue spraying state in detecting pedestal imposite are also included
Visual system I, for detecting the visual system II of wafer normotopia.
The present invention also provides for contactless glue spraying method during surface patch quartz-crystal resonator produces, and its special character exists
In, pedestal imposite forms multiple individual base, to the left and right platform of individual base and the wafer that is attached on individual base
Auxiliary electrode use contactless mode carry out glue spraying.
On the basis of the glue spraying method and technology scheme that the present invention provides, the first concrete processing method includes following step
Rapid:
S1, the lower glue of spray: pedestal imposite moves to injection valve the lower glue of injection, and conducting resinl is injected in pedestal by glue spraying mode
In imposite on the left and right platform of an individual base；
S2, upper slice: suction nozzle draws wafer, carries out wafer position angle by the electric rotating machine of suction nozzle and visual system and rectifys
Just；It is placed in the individual base that pedestal imposite has sprayed lower glue；
S3, spray glue: being returned by pedestal imposite and spray gluing at injection valve, it is whole that conducting resinl is injected in pedestal by glue spraying mode
In plate in step S2 on the wafer auxiliary electrode of individual base；
S4, according to step S1 to step S3 spraying method, complete remaining monomer on pedestal imposite by order set in advance
The glue spraying of pedestal.
On the basis of the glue spraying method and technology scheme that the present invention provides, the concrete processing method of the second includes following step
Rapid:
S1, respectively each individual base on pedestal imposite is sequentially completed to spray lower glue according to the lower glue step of spray:
Pedestal imposite moves to injection valve the lower glue of injection, and conducting resinl is injected in pedestal imposite each by glue spraying mode
On the left and right platform of individual base；
S2, respectively each individual base on pedestal imposite is sequentially completed upper slice:
Suction nozzle draws wafer successively, and electric rotating machine and visual system by suction nozzle carry out wafer position angle correction；Put
Put under pedestal imposite sprays in each individual base of glue；
S3, respectively each individual base on pedestal imposite sequentially completes to spray glue:
Pedestal imposite is returned at injection valve, conducting resinl by glue spraying mode be injected in that step S2 in pedestal imposite completes every
On the wafer auxiliary electrode of individual individual base.
On the basis of the glue spraying method and technology scheme that the present invention provides, the third concrete processing method includes following step
Rapid:
S1, respectively multiple individual base selected on pedestal imposite are sequentially completed to spray lower glue according to the lower glue step of spray:
Pedestal imposite is moved to injection valve the lower glue of injection, for multiple individual base selected in pedestal imposite,
Conducting resinl is sequentially injected on the left and right platform of each individual base in multiple individual base by glue spraying mode；
S2, respectively multiple individual base selected on pedestal imposite are sequentially completed upper slice:
For multiple individual base selected in pedestal imposite, suction nozzle sequentially draws wafer, by the electric rotating of suction nozzle
Machine and visual system carry out wafer position angle correction, are sequentially placed on pedestal imposite and have sprayed multiple individual base of lower glue
In；
S3, respectively multiple individual base selected on pedestal imposite sequentially complete to spray glue:
For multiple individual base selected in pedestal imposite, being returned by pedestal imposite at injection valve, conducting resinl is by spray
Glue mode is sequentially injected on the wafer auxiliary electrode of multiple individual base that step S2 in pedestal imposite completes.
On the basis of the glue spraying method and technology scheme that the present invention provides, the 4th kind of concrete processing method includes following step
Rapid:
S1, sequentially complete to spray lower glue according to the lower glue step of spray to pedestal imposite is positioned at the individual base of same a line:
S11, the lower glue of spray: pedestal imposite moves to injection valve the lower glue of injection, and conducting resinl is injected in base by glue spraying mode
With on the left and right platform of a line individual base in seat imposite；
S12, upper slice: suction nozzle draws wafer, carries out wafer position angle by the electric rotating machine of suction nozzle and visual system 1 and rectifys
Just；It is placed in same a line individual base that pedestal imposite has sprayed lower glue；
S13, spraying glue: returned by pedestal imposite at injection valve, conducting resinl walks in being injected in pedestal imposite by glue spraying mode
On the wafer auxiliary electrode of same a line individual base that rapid S12 completes；
S2, according to the step of S1, each individual base in pedestal imposite remaining row is sequentially completed whole glue spraying process.
On the basis of the glue spraying method and technology scheme that the present invention provides, the 5th kind of concrete processing method includes following step
Rapid:
S1, sequentially complete to spray lower glue according to the lower glue step of spray to pedestal imposite is positioned at the individual base of same string:
S11, the lower glue of spray: pedestal imposite moves to injection valve the lower glue of injection, and conducting resinl is injected in base by glue spraying mode
In seat imposite on the left and right platform of same list susceptor body；
S12, upper slice: suction nozzle draws wafer, carries out wafer position angle by the electric rotating machine of suction nozzle and visual system 1 and rectifys
Just；It is placed in the same list susceptor body that pedestal imposite has sprayed lower glue；
S13, spraying glue: returned by pedestal imposite at injection valve, conducting resinl walks in being injected in pedestal imposite by glue spraying mode
On the wafer auxiliary electrode of the same list susceptor body that rapid S12 completes；
S2, according to S1 step to pedestal imposite remaining row on each individual base sequentially complete whole glue spraying process.
Compared with prior art, it has the beneficial effect that the present invention is for surface patch quartz-crystal resonator to the present invention
Imposite is processed.Owing to each individual base point glue podium level relative error in imposite is big, use contactless spray-bonding craft
Substitute conventional contact gluing process, the problem solving conventional point adhesive process processing imposite pedestal glue spot diameter concordance difference.
Use spray-bonding craft processing imposite, it is not necessary to Z axis motion necessary to tradition syringe needle gluing process.Glue spraying efficiency carries than a glue efficiency
High more than 3 times.
The present invention utilizes the production technology of the surface patch quartz-crystal resonator of contactless glue spraying, fixed wafer and pedestal
Simple to operate, cost performance is much better than traditional contact spot gluing equipment, be mainly reflected in following some:
1, utilize contactless glue spraying, solve conventional contact point glue in the bad problem of pedestal imposite point glue.
2, due in spray-bonding craft, it is not necessary to adjust some glue height, therefore the operant skill of employee is required low, it is easy to behaviour
Make.
3, glue spraying process saves the conventional contact dispensing needle head up and down motion time, improves the efficiency of gluing.
4, directly pedestal imposite being carried out glue spraying, relative to tradition, single pedestal is put glue one by one, glue spraying equipment volume becomes
Little, cost performance is much better than traditional contact spot gluing equipment.
Accompanying drawing explanation
Fig. 1 is pedestal imposite schematic diagram one of the present invention；
Fig. 2 is pedestal imposite schematic diagram two of the present invention；
Fig. 3 is individual base schematic diagram of the present invention；
Fig. 4 is view after individual base glue spraying of the present invention,
Fig. 5 is the structural representation of spraying colloid system of the present invention.
Description of symbols: 1, pedestal imposite, 1-1, individual base, 2, left platform, 3, right platform, 4, wafer, 5, auxiliary electrode, 6,
Conducting resinl, 7, nozzle.
Detailed description of the invention
1 to accompanying drawing 5 referring to the drawings, provide the detailed description of the invention of the present invention, are used for being the present invention furtherly
Bright.
Glue-spraying device in the present invention includes pedestal imposite 1, wafer 4, spraying colloid system, wherein, pedestal imposite 1 and attachment
Wafer 4 on pedestal imposite 1 is respectively positioned on the lower section of nozzle 7 in spraying colloid system.
About the pedestal imposite for surface patch quartz-crystal resonator, pedestal imposite includes two kinds of shapes in the present invention
Formula: 1, by being processed into the construction unit connected by matrix arrangement on the big plate of pottery, each construction unit is as an independence
Individual base, the big plate of pottery being consequently formed is as the pedestal imposite of the present invention；2, piled up at an imposite by individual base
As the pedestal imposite of the present invention in frock.
In spray-bonding craft, being provided with two set visual systemes, visual system I is for wafer position angle correction, vision system
System II is used for the identification to pedestal imposite and rectification, it is also possible to by arranging a set of visual system simultaneously to wafer and pedestal imposite
It is identified and corrects, utilizing two set visual systemes to illustrate concrete spray-bonding craft in the present invention.
The spray-bonding craft of the present invention individual base to connecting by the arrangement of M*N matrix on pedestal imposite illustrates, M, N's
Initial value is 1, and M, N are non-zero natural number, and M is the line number that maximum is matrix of line number and M, and N is the maximum of columns and N
Value is matrix column number, i.e. 1≤M≤line number, and 1≤N≤columns uses a for each individual base on pedestal impositeMNTable
Reach, aMNIt is in the individual base of pedestal imposite M row Nth column.
Under spray during glue, the left and right platform of each individual base in pedestal imposite is sequentially located at immediately below nozzle, in spray
During gluing, the wafer auxiliary electrode above each individual base is positioned at immediately below nozzle, and wafer is quartz crystal in the present invention
Resonator.Spraying colloid system is usual means of the prior art, the present invention not description to spraying colloid system structure.In the present invention
In, it is also possible to when spraying glue, the wafer auxiliary electrode above current monolithic pedestal and the left and right platform of next individual base
It is sequentially located at immediately below nozzle.Wafer in use, is moved to vision system by visual system I, visual system II in the present invention
Immediately below system I, for wafer position angle correction, pedestal imposite is moved to visual system II, for pedestal
The identification of imposite, rectification and glue spraying state-detection.
Embodiment 1
In the present embodiment, select the individual base being positioned at the 1st row the 1st row on pedestal imposite complete to spray lower glue, upper slice, spray
After the process of gluing, whole individual base remaining on pedestal imposite being completed same process, final pedestal imposite completes
Glue spraying process.
Before whole spray-bonding craft is carried out, first carry out following preparation process:
Step 1, the pedestal imposite not carrying out glue spraying is placed on pedestal imposite carries in cage etc. to be extracted；
Step 2, wafer are placed on wafer and carry in cage etc. to be extracted；
Step 3, the elargol that stirs is injected in glue spraying valve, confirm whether glue spraying valve can normally tell glue；
Step 4, adjust according to wafer position and put the height of wafer, according to glue point size position adjustment glue spraying time and glue spraying
Position；
Step 5, absorption wafer, visual system I identifies and angle correction, and certified products dislocation waits pedestal imposite position；
Simultaneously, pedestal imposite moves to visual system II and identifies each individual base position in imposite for step 6 and step 5.
After stage to be prepared, pedestal imposite is carried out glue spraying, specifically includes following steps:
S1, the lower glue of spray: pedestal imposite moves to injection valve the lower glue of injection, and conducting resinl is injected in pedestal by glue spraying mode
Imposite is positioned at the individual base a of the 1st row the 1st row11Left and right platform on；
S2, upper slice: suction nozzle carries in cage absorption wafer from wafer, and electric rotating machine and visual system I by suction nozzle carry out crystalline substance
Sheet position angle is corrected；Meanwhile, pedestal imposite is moved to visual system II and identifies glue spraying state, after glue spraying is qualified, suction nozzle is inhaled
The wafer taken is held in place pedestal imposite the 1st row the 1st row and has sprayed the individual base a of lower glue11In；
S3, spray glue: being returned by pedestal imposite and spray gluing at injection valve, it is whole that conducting resinl is injected in pedestal by glue spraying mode
Individual base a on plate12Left and right platform and placed the individual base a of wafer11Wafer auxiliary electrode on；
S4, according to step S1 to step S3 spraying method, complete remaining monomer on pedestal imposite by order set in advance
The glue spraying of pedestal.
In step S4, order set in advance is in the present embodiment, to the individual base on pedestal imposite one by one
Complete spray technology, first current monolithic pedestal is performed the lower glue of spray, upper slice, afterwards, to next monomer during spraying glue
Pedestal performs the lower glue of spray and current monolithic pedestal sprays glue.
Use a matrix to represent, particularly as follows:
S41, choose individual base a in step slMNAs currently spraying target, to individual base aMNComplete step S1
Spray lower glue, step S2 upper slice, the most in step s3 to individual base aMNComplete to spray glue, individual base aM, N+1Complete under spray
Glue；
S42, being repeated in step S1 to S3, alternate cycles, until N value is matrix column number, now to individual base
aM, N+1Complete the spray of step S1 lower glue, step S2 upper slice, individual base aM, N+1For last position of this row, the most right
Individual base aM, N+1Complete to spray glue, to individual base aM+1, NComplete to spray lower glue；The now monomer base of the lower glue of spray in step S3
Seat aM+1, NMiddle M value is that M+1, N value starts to correct to matrix column number successively from 1；
When S43, the most current N value are matrix column, after current monolithic pedestal is completed step S1 to S2, current M takes
Value automatically performs to add 1, and N value corrects to matrix column number successively from 1 beginning, is repeated in step S41 to S43, alternate cycles, directly
To M value more than line number time, complete the course of injection on whole pedestal imposite.
Glue spraying mode in step sl specifically refers to carry out glue spraying by the way of contactless and replaces conventional contact
Point.Point plastic pin pipe, dispensing needle head and the LDMS that will use in conventional contact gluing process in the present invention
Being substituted by spraying colloid system, the composition of spraying colloid system mainly has: 1, utilize multiple-level stack formula piezoelectric ceramics fine motion device as controlling dress
The glue spraying valve put；2, nozzle base；3, striker；4, the anti-overflow packing ring of pan feeding；5, set screw and retainer ring.
Striker 0.25ms can complete a complete cycle, and then reach ultramicron conducting resinl and be ejected into each of pedestal imposite
On the platform of individual base left and right, owing to glue amount is consistent, the diameter of glue point is affected minimum by glue spraying height, so concordance is good；1 second
The sprayable 1000Hz of clock, and there is the ability of transient acceleration, to reach the shock of ultraspeed, thus ensure that glue dot profile
Concordance and adhesive strength；Injecting time is controlled to do X, Y motion time by program pulse much smaller than imposite, and during without moving up and down
Between, the most contactless glue spraying efficiency is far above contact point glue efficiency.
Embodiment 2
The spraying coating process of the present embodiment is similar to embodiment 1, the work that the stage to be prepared is done, and the glue spraying of glue spraying valve
Position, spray-bonding craft are all the most consistent with embodiment 1, only spray the most otherwise varied.
In the present embodiment, each individual base on pedestal imposite is first carried out the lower glue of step S1 spray, afterwards to each
Individual base carries out step S2 upper slice again, finally each individual base is carried out step S3 and sprays glue, particularly as follows:
S1, respectively each individual base on pedestal imposite is sequentially completed to spray lower glue according to the lower glue step of spray:
Pedestal imposite moves to injection valve the lower glue of injection, and conducting resinl is injected in pedestal imposite each by glue spraying mode
On the left and right platform of individual base；
S2, respectively each individual base on pedestal imposite is sequentially completed upper slice:
Suction nozzle draws wafer successively, and electric rotating machine and visual system by suction nozzle carry out wafer position angle correction；Put
Put under pedestal imposite sprays in each individual base of glue；
S3, respectively each individual base on pedestal imposite sequentially completes to spray glue:
Pedestal imposite is returned at injection valve, conducting resinl by glue spraying mode be injected in that step S2 in pedestal imposite completes every
On the wafer auxiliary electrode of individual individual base.
In the present embodiment, the action in each step is according to predetermined suitable to the individual base on pedestal imposite
Sequence, is sequentially carried out.The lower glue of spray, upper slice, the order of choosing individual base when spraying glue the most identical, pre-with step S1 spray lower glue explanation
The order first set.
The lower glue order set in advance of spray is in the present embodiment, to one by one complete of the individual base on pedestal imposite
Become the lower adhesive process of injection, use a matrix to represent, particularly as follows:
1, individual base a is chosen in step slMNAs currently spraying target, to individual base aMNComplete the spray of step S1
Lower glue, M takes currency afterwards, and N adds 1 automatically, to individual base aM, N+1Perform the lower glue of spray, until N value is matrix column number, this
Time M row individual base all complete to spray lower glue；
2, automatically adding 1 to current M value, now, M is that M+1, N value starts to correct to matrix column number successively, to list from 1
Susceptor body aM+1, NComplete to spray lower glue；
3, when the most current N value is matrix column, the individual base of current M row is completed to spray lower glue, current M value
Automatically performing to add 1, N value starts to correct to matrix column number successively from 1, is repeated in step 1 to 3, and alternate cycles takes until M
When value is more than line number, complete glue process under the spray on whole pedestal imposite.
To the paster on pedestal imposite, spray the order of glue all and the sequence consensus of the lower glue of spray, it would however also be possible to employ different
Sequentially, but must be regular, and these rules belong to programming Control, the present embodiment will not enumerate, only by this
The order that embodiment provides does the most exemplary explanation.
Embodiment 3
The spraying coating process of the present embodiment is similar to embodiment 1, the work that the stage to be prepared is done, and the glue spraying of glue spraying valve
Position, spray-bonding craft are all the most consistent with embodiment 1, only spray the most otherwise varied.
In the present embodiment, multiple individual base on selected pedestal imposite, these multiple individual base can be whole at pedestal
Divide in region on plate, it is also possible to scattered distribution on pedestal imposite, but for there being utilization to realize controlling, therefore in region
The mode divided in region is used to illustrate.
Multiple individual base of selection area current on pedestal imposite are first carried out the lower glue of step S1 spray, afterwards to current choosing
The multiple individual base determining region carry out step S2 upper slice again, finally multiple individual base in current selected region are carried out step
S3 sprays glue, particularly as follows:
S1, respectively multiple individual base of selection area current on pedestal imposite are sequentially completed spray according to the lower glue step of spray
Lower glue:
Pedestal imposite is moved to injection valve the lower glue of injection, for multiple individual base selected in pedestal imposite,
Conducting resinl is sequentially injected on the left and right platform of each individual base in multiple individual base by glue spraying mode；
S2, respectively multiple individual base of selection area current on pedestal imposite are sequentially completed upper slice:
For multiple individual base selected in pedestal imposite, suction nozzle sequentially draws wafer, by the electric rotating of suction nozzle
Machine and visual system carry out wafer position angle correction, are sequentially placed on pedestal imposite and have sprayed multiple individual base of lower glue
In；
S3, respectively multiple individual base to selection area current on pedestal imposite sequentially complete to spray glue:
For multiple individual base selected in pedestal imposite, being returned by pedestal imposite at injection valve, conducting resinl is by spray
Glue mode is sequentially injected on the wafer auxiliary electrode of multiple individual base that step S2 in pedestal imposite completes.
Afterwards, shift to next selection area, repeat step S1 to step S2 and complete the whole glue spraying in current selected region
Process, replaces successively, until the whole individual base on pedestal imposite all complete glue spraying process.
In the present embodiment, under the spray of multiple individual base in current selected region glue, upper slice, choose list when spraying glue
Cahn-Ingold-Prelog sequence rule in the order similar embodiment 2 of susceptor body, the value of M, N is all entered in current selected region in the present embodiment
OK, detailed operation sees embodiment 2.
About the switching of zones of different in the present embodiment, after i.e. completing the whole glue spraying process in a region, shift to down
The when of one region, being also that the value by M, N switches, the time point of switching is last monomer base of current region
Seat completes to spray glue, and first individual base in next region prepares the lower glue of spray, and concrete transfer sequence sees in embodiment 1
One individual base completes to spray glue, and next individual base prepares the rule of the lower glue of spray.
Embodiment 4
The spraying coating process of the present embodiment is similar to embodiment 1, the work that the stage to be prepared is done, and the glue spraying of glue spraying valve
Position, spray-bonding craft are all the most consistent with embodiment 1, only spray the most otherwise varied.
In the present embodiment, all individual base of certain a line on selected pedestal imposite, for each list on current line
Susceptor body, such as, first carry out the lower glue of step S1 spray, afterwards to each to each individual base in pedestal imposite M row Nth column
Individual base carries out step S2 upper slice again, finally each individual base is carried out step S3 and sprays glue, particularly as follows:
S1, each individual base of M row Nth column in pedestal imposite is sequentially completed to spray lower glue according to the lower glue step of spray:
S11, the lower glue of spray: pedestal imposite moves to injection valve the lower glue of injection, and conducting resinl is injected in base by glue spraying mode
In seat imposite on the left and right platform of the M each individual base of row Nth column；
S12, upper slice: suction nozzle draws wafer, carries out wafer position angle by the electric rotating machine of suction nozzle and visual system 1 and rectifys
Just；It is placed in the M each individual base of row Nth column that pedestal imposite has sprayed lower glue；
S13, spraying glue: returned by pedestal imposite at injection valve, conducting resinl walks in being injected in pedestal imposite by glue spraying mode
On the wafer auxiliary electrode of the M each individual base of row Nth column that rapid S12 completes；
S2, according to the step of S1, each individual base in the remaining row on pedestal imposite is sequentially completed whole glue spraying mistake
Journey.
About in the present embodiment for glue under the spray of each individual base of M row Nth column, upper slice, spray glue time choose
Cahn-Ingold-Prelog sequence rule in the order similar embodiment 2 of individual base, describes the most in detail, and detailed operation sees
Embodiment 2.
About in the present embodiment for the switching between different rows, i.e. switch to M+1 row Nth column from M row Nth column
Rule, in reference example 1, a upper individual base completes to spray glue, and next individual base prepares the rule of the lower glue of spray.It
After for the operation rules reference example 2 of M+1 row Nth column.
Embodiment 5
The spraying coating process of the present embodiment is similar to embodiment 1, the work that the stage to be prepared is done, and the glue spraying of glue spraying valve
Position, spray-bonding craft are all the most consistent with embodiment 1, only spray the most otherwise varied.
In the present embodiment, embodiment 4 is similar to for spraying order, by embodiment first to often row all monomers
Pedestal carries out spraying coating process and replaces with and first all individual base of each column are carried out spraying coating process.
On selected pedestal imposite, all individual base of certain string, for when each individual base on prostatitis, the most right
Each individual base in pedestal imposite M row Nth column first carries out the lower glue of step S1 spray, carries out each individual base more afterwards
Step S2 upper slice, finally carries out step S3 to each individual base and sprays glue, particularly as follows:
S1, sequentially complete to spray lower glue according to the lower glue step of spray to pedestal imposite is positioned at the individual base of same string:
S11, the lower glue of spray: pedestal imposite moves to injection valve the lower glue of injection, and conducting resinl is injected in base by glue spraying mode
In seat imposite on the left and right platform of same list susceptor body；
S12, upper slice: suction nozzle draws wafer, carries out wafer position angle by the electric rotating machine of suction nozzle and visual system 1 and rectifys
Just；It is placed in the same list susceptor body that pedestal imposite has sprayed lower glue；
S13, spraying glue: returned by pedestal imposite at injection valve, conducting resinl walks in being injected in pedestal imposite by glue spraying mode
On the wafer auxiliary electrode of the same list susceptor body that rapid S12 completes；
S2, according to S1 step to pedestal imposite remaining row on each individual base sequentially complete whole glue spraying process.
About in the present embodiment for glue under the spray of each individual base of M row Nth column, upper slice, spray glue time choose
Cahn-Ingold-Prelog sequence rule in the order similar embodiment 2 of individual base, describes the most in detail, and detailed operation sees
Embodiment 2.
About in the present embodiment for the switching between different lines, i.e. switch to M row N+1 row from M row Nth column
Rule, in reference example 1, a upper individual base completes to spray glue, and next individual base prepares the rule of the lower glue of spray.It
After for M row N+1 row operation rules reference example 2.
Spraying coating process for using in the different spraying order in the present invention is similar to embodiment 1, and sprays suitable
Sequence is all to be realized by program according to artificial rule, such as presses the modes such as oblique line, angle, center of circle cincture, in the present invention
Can not be exhaustive, only carry out how whole spraying by above example and illustrate.Pedestal except using in above example is whole
Plate, the whole spraying coating process of the present invention, it is also possible to apply and enter in imposite frock at multiple individual base codes, then be placed into pedestal and carry
Treating in cage that glue spraying, whole spraying coating process are also identical, simply the form of pedestal imposite changes, but single on pedestal imposite
Susceptor body is also in matrix arrangement, and concrete spraying order and process see embodiments of the invention.
It is obvious to a person skilled in the art that the invention is not restricted to the details of above-mentioned one exemplary embodiment, Er Qie
In the case of the spirit or essential attributes of the present invention, it is possible to realize the present invention in other specific forms.Therefore, no matter
From the point of view of which point, all should regard embodiment as exemplary, and be nonrestrictive, the scope of the present invention is by appended power
Profit requires rather than described above limits, it is intended that all by fall in the implication of equivalency and scope of claim
Change is included in the present invention.
Although moreover, it will be appreciated that this specification is been described by according to embodiment, but the most each embodiment comprises
One independent technical scheme, this narrating mode of description is only the most for clarity sake, and those skilled in the art should be by
Description is as an entirety, and the technical scheme in each embodiment can also be through appropriately combined, and forming those skilled in the art can
With other embodiments understood.
Claims (10)
1. surface patch quartz-crystal resonator produce in contactless spraying colloid system, it is characterised in that: include pedestal imposite (1),
Wafer (4), spraying colloid system, wherein, pedestal imposite (1) and the wafer (4) being mounted on pedestal imposite (1) are respectively positioned on glue spraying system
The lower section of nozzle (7) in system.
2. contactless spraying colloid system during surface as claimed in claim 1 patch quartz-crystal resonator produces, it is characterised in that:
Pedestal imposite (1) is the big plate of pottery, is provided with the construction unit connected by matrix arrangement, each structure on the big plate of pottery
Unit is an independent individual base (1-1).
3. contactless spraying colloid system during surface as claimed in claim 2 patch quartz-crystal resonator produces, it is characterised in that:
Pedestal imposite (1) is imposite frock, and imposite frock is provided with the room by matrix arrangement, is placed with one in each room
Individual base (1-1).
4. contactless spraying colloid system during patch quartz-crystal resonator in surface produces as claimed in claim 2 or claim 3, its feature exists
In: also include in detecting pedestal imposite each individual base position and the visual system I of individual base glue spraying state, for
The visual system II of detection wafer normotopia.
5. contactless glue spraying method during patch quartz-crystal resonator in surface produces, it is characterised in that: formed on pedestal imposite
Multiple individual base, use contactless to the left and right platform of individual base and the auxiliary electrode of wafer that is attached on individual base
Mode carries out glue spraying.
6. contactless glue spraying method during surface as claimed in claim 5 patch quartz-crystal resonator produces, it is characterised in that
Include following steps:
S1, the lower glue of spray: pedestal imposite moves to injection valve the lower glue of injection, and conducting resinl is injected in pedestal imposite by glue spraying mode
In an individual base left and right platform on；
S2, upper slice: suction nozzle draw wafer, electric rotating machine and visual system by suction nozzle carry out wafer position angle correction；Put
Put under pedestal imposite sprays in the individual base of glue；
S3, spray glue: being returned by pedestal imposite and spray gluing at injection valve, conducting resinl is injected in pedestal imposite by glue spraying mode
In step S2 on the wafer auxiliary electrode of individual base；
S4, according to step S1 to step S3 spraying method, complete remaining individual base on pedestal imposite by order set in advance
Glue spraying.
7. contactless glue spraying method during surface as claimed in claim 5 patch quartz-crystal resonator produces, it is characterised in that:
Include following steps:
S1, respectively each individual base on pedestal imposite is sequentially completed to spray lower glue according to the lower glue step of spray:
Pedestal imposite moves to injection valve the lower glue of injection, and conducting resinl is injected in each monomer in pedestal imposite by glue spraying mode
On the left and right platform of pedestal；
S2, respectively each individual base on pedestal imposite is sequentially completed upper slice:
Suction nozzle draws wafer successively, and electric rotating machine and visual system by suction nozzle carry out wafer position angle correction；It is placed on
Pedestal imposite has sprayed in each individual base of lower glue；
S3, respectively each individual base on pedestal imposite sequentially completes to spray glue:
Being returned at injection valve by pedestal imposite, conducting resinl is injected in, by glue spraying mode, each list that step S2 in pedestal imposite completes
On the wafer auxiliary electrode of susceptor body.
8. contactless glue spraying method during surface as claimed in claim 5 patch quartz-crystal resonator produces, it is characterised in that:
Include following steps:
S1, respectively multiple individual base selected on pedestal imposite are sequentially completed to spray lower glue according to the lower glue step of spray:
Pedestal imposite is moved to injection valve the lower glue of injection, for multiple individual base selected in pedestal imposite, conduction
Glue is sequentially injected on the left and right platform of each individual base in multiple individual base by glue spraying mode；
S2, respectively multiple individual base selected on pedestal imposite are sequentially completed upper slice:
For multiple individual base selected in pedestal imposite, suction nozzle sequentially draws wafer, by the electric rotating machine of suction nozzle and
Visual system carries out wafer position angle correction, is sequentially placed in multiple individual base that pedestal imposite has sprayed lower glue；
S3, respectively multiple individual base selected on pedestal imposite sequentially complete to spray glue:
For multiple individual base selected in pedestal imposite, being returned by pedestal imposite at injection valve, glue spraying side pressed by conducting resinl
Formula is sequentially injected on the wafer auxiliary electrode of multiple individual base that step S2 in pedestal imposite completes.
9. contactless glue spraying method during surface as claimed in claim 5 patch quartz-crystal resonator produces, it is characterised in that:
Include following steps:
S1, sequentially complete to spray lower glue according to the lower glue step of spray to pedestal imposite is positioned at each individual base of same a line:
S11, the lower glue of spray: pedestal imposite moves to injection valve the lower glue of injection, and it is whole that conducting resinl is injected in pedestal by glue spraying mode
With on the left and right platform of a line individual base in plate；
S12, upper slice: suction nozzle draw wafer, electric rotating machine and visual system 1 by suction nozzle carry out wafer position angle correction；
It is placed in same a line individual base that pedestal imposite has sprayed lower glue；
S13, spraying glue: returned by pedestal imposite at injection valve, conducting resinl is injected in step S12 in pedestal imposite by glue spraying mode
On the wafer auxiliary electrode of the same a line individual base completed；
S2, according to the step of S1, each individual base in pedestal imposite remaining row is sequentially completed whole glue spraying process.
10. contactless glue spraying method during surface as claimed in claim 5 patch quartz-crystal resonator produces, its feature exists
In: include following steps:
S1, sequentially complete to spray lower glue according to the lower glue step of spray to pedestal imposite is positioned at the individual base of same string:
S11, the lower glue of spray: pedestal imposite moves to injection valve the lower glue of injection, and it is whole that conducting resinl is injected in pedestal by glue spraying mode
In plate on the left and right platform of same list susceptor body；
S12, upper slice: suction nozzle draw wafer, electric rotating machine and visual system 1 by suction nozzle carry out wafer position angle correction；
It is placed in the same list susceptor body that pedestal imposite has sprayed lower glue；
S13, spraying glue: returned by pedestal imposite at injection valve, conducting resinl is injected in step S12 in pedestal imposite by glue spraying mode
On the wafer auxiliary electrode of the same list susceptor body completed；
S2, according to S1 step to pedestal imposite remaining row on each individual base sequentially complete whole glue spraying process.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610528991.XA CN106067776B (en) | 2016-07-06 | 2016-07-06 | Paste contactless spraying colloid system and method in quartz-crystal resonator production in surface |
| PCT/CN2017/091024 WO2018006754A1 (en) | 2016-07-06 | 2017-06-30 | Contactless adhesive spray system and method utilized in producing surface-mount quartz crystal oscillator |
| TW106122608A TWI674749B (en) | 2016-07-06 | 2017-07-05 | Processes for surface mount quartz crystal resonator non-contact spray adhesive system and method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610528991.XA CN106067776B (en) | 2016-07-06 | 2016-07-06 | Paste contactless spraying colloid system and method in quartz-crystal resonator production in surface |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106067776A true CN106067776A (en) | 2016-11-02 |
| CN106067776B CN106067776B (en) | 2018-10-02 |
Family
ID=57206490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610528991.XA Active CN106067776B (en) | 2016-07-06 | 2016-07-06 | Paste contactless spraying colloid system and method in quartz-crystal resonator production in surface |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN106067776B (en) |
| TW (1) | TWI674749B (en) |
| WO (1) | WO2018006754A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018006754A1 (en) * | 2016-07-06 | 2018-01-11 | 烟台明德亨电子科技有限公司 | Contactless adhesive spray system and method utilized in producing surface-mount quartz crystal oscillator |
| CN111112018A (en) * | 2019-12-10 | 2020-05-08 | 廊坊中电熊猫晶体科技有限公司 | Direct-insertion type quartz crystal resonator dispensing device and using method thereof |
| CN115921243A (en) * | 2022-12-30 | 2023-04-07 | 烟台明德亨电子科技有限公司 | Glue applying method for crystal oscillator produced by whole board |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111294005A (en) * | 2020-03-17 | 2020-06-16 | 四川明德亨电子科技有限公司 | Resonant chip fixing and dispensing method of quartz crystal resonator |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101131977A (en) * | 2006-08-21 | 2008-02-27 | 南茂科技股份有限公司 | High-frequency integrated circuit packaging construction for improving connectivity of embedded projection and manufacturing method thereof |
| US20080088384A1 (en) * | 2006-10-10 | 2008-04-17 | Ryoichi Ichikawa | Manufacturing method of tuning-fork type quartz crystal resonator |
| US7536768B2 (en) * | 2002-04-23 | 2009-05-26 | Piedek Technical Laboratory | Method for manufacturing quartz crystal unit, quartz crystal oscillator and electronic apparatus |
| CN101444773A (en) * | 2008-08-08 | 2009-06-03 | 塔工程有限公司 | Position detection equipment and method for detecting jet hole of coater and light spot of laser displacement sensor |
| CN102615018A (en) * | 2012-04-11 | 2012-08-01 | 吉林大学 | Piezoelectric wafer control type non-contact glue dispensing device |
| CN103824754A (en) * | 2014-03-15 | 2014-05-28 | 深圳市鹰眼在线电子科技有限公司 | Intelligent laminating machine for quartz crystal oscillator |
| CN105305995A (en) * | 2015-11-05 | 2016-02-03 | 烟台大明电子科技有限公司 | Novel SMD (Surface Mount Device) quartz crystal resonator and complete board encapsulation machining process thereof |
| CN205754236U (en) * | 2016-07-06 | 2016-11-30 | 烟台明德亨电子科技有限公司 | Contactless spraying colloid system in the patch quartz-crystal resonator production of surface |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10303671A (en) * | 1997-04-28 | 1998-11-13 | Toyota Motor Corp | Manufacture of crystal vibrator |
| US7608986B2 (en) * | 2006-10-02 | 2009-10-27 | Seiko Epson Corporation | Quartz crystal resonator |
| CN202218201U (en) * | 2011-08-02 | 2012-05-09 | 台晶(宁波)电子有限公司 | Low temperature ceramic entire plate-type flat substrate pedestal used for quartz crystal resonator |
| CN104209233A (en) * | 2014-08-18 | 2014-12-17 | 台晶(宁波)电子有限公司 | Chip carrying dispensing mechanism for production of quartz crystal resonator |
| CN106067776B (en) * | 2016-07-06 | 2018-10-02 | 烟台明德亨电子科技有限公司 | Paste contactless spraying colloid system and method in quartz-crystal resonator production in surface |
-
2016
- 2016-07-06 CN CN201610528991.XA patent/CN106067776B/en active Active
-
2017
- 2017-06-30 WO PCT/CN2017/091024 patent/WO2018006754A1/en active Application Filing
- 2017-07-05 TW TW106122608A patent/TWI674749B/en active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7536768B2 (en) * | 2002-04-23 | 2009-05-26 | Piedek Technical Laboratory | Method for manufacturing quartz crystal unit, quartz crystal oscillator and electronic apparatus |
| US7944131B2 (en) * | 2002-04-23 | 2011-05-17 | Piedek Technical Laboratory | Quartz crystal unit, quartz crystal oscillator and manufacturing method of the same |
| CN101131977A (en) * | 2006-08-21 | 2008-02-27 | 南茂科技股份有限公司 | High-frequency integrated circuit packaging construction for improving connectivity of embedded projection and manufacturing method thereof |
| US20080088384A1 (en) * | 2006-10-10 | 2008-04-17 | Ryoichi Ichikawa | Manufacturing method of tuning-fork type quartz crystal resonator |
| CN101444773A (en) * | 2008-08-08 | 2009-06-03 | 塔工程有限公司 | Position detection equipment and method for detecting jet hole of coater and light spot of laser displacement sensor |
| CN102615018A (en) * | 2012-04-11 | 2012-08-01 | 吉林大学 | Piezoelectric wafer control type non-contact glue dispensing device |
| CN103824754A (en) * | 2014-03-15 | 2014-05-28 | 深圳市鹰眼在线电子科技有限公司 | Intelligent laminating machine for quartz crystal oscillator |
| CN105305995A (en) * | 2015-11-05 | 2016-02-03 | 烟台大明电子科技有限公司 | Novel SMD (Surface Mount Device) quartz crystal resonator and complete board encapsulation machining process thereof |
| CN205754236U (en) * | 2016-07-06 | 2016-11-30 | 烟台明德亨电子科技有限公司 | Contactless spraying colloid system in the patch quartz-crystal resonator production of surface |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018006754A1 (en) * | 2016-07-06 | 2018-01-11 | 烟台明德亨电子科技有限公司 | Contactless adhesive spray system and method utilized in producing surface-mount quartz crystal oscillator |
| CN111112018A (en) * | 2019-12-10 | 2020-05-08 | 廊坊中电熊猫晶体科技有限公司 | Direct-insertion type quartz crystal resonator dispensing device and using method thereof |
| CN115921243A (en) * | 2022-12-30 | 2023-04-07 | 烟台明德亨电子科技有限公司 | Glue applying method for crystal oscillator produced by whole board |
| CN115921243B (en) * | 2022-12-30 | 2024-03-12 | 烟台明德亨电子科技有限公司 | Sizing method for crystal oscillator produced by whole plate |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI674749B (en) | 2019-10-11 |
| CN106067776B (en) | 2018-10-02 |
| TW201803265A (en) | 2018-01-16 |
| WO2018006754A1 (en) | 2018-01-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106067776A (en) | Contactless spraying colloid system and method in the patch quartz-crystal resonator production of surface | |
| JP6538649B2 (en) | Coating apparatus and coating method | |
| US7815965B2 (en) | Industrial microdeposition system including masking to reduce the impact of droplet alignment and droplet volume tolerances and errors | |
| US20070116861A1 (en) | Method and apparatus of forming pattern of display panel | |
| CN104041205B (en) | Electronic element installation device and electronic component mounting method | |
| JP2006093108A (en) | Phosphor spraying system for optical display | |
| CN103357556B (en) | Method and system for obliquely dispensing adhesive | |
| US7445307B2 (en) | Droplet jetting apparatus and display device manufacturing method | |
| CN202841835U (en) | Component mounting machine | |
| CN205754236U (en) | Contactless spraying colloid system in the patch quartz-crystal resonator production of surface | |
| CN102834910B (en) | Component transfer device and method | |
| TW201043341A (en) | Method for dispensing paste and substrate having paste pattern formed thereon by the method | |
| KR20190069538A (en) | Coating method, coating device and light emitting element | |
| CN101713924A (en) | A device for treating substrate and a method of cardinal plate loading | |
| WO2000029128A1 (en) | Method of forming paste | |
| JP7291117B2 (en) | Injector with energy output device and control method thereof | |
| JP2021501047A (en) | Systems and methods for closed-loop fluid velocity control of injection | |
| CN206966028U (en) | A kind of injection glue dispensing valve at a high speed | |
| JP2002239445A (en) | Coating apparatus and coating method | |
| CN104041206B (en) | Electronic element transferring device and electronic component moving delivery method | |
| JP2003178677A (en) | Phosphor filling device for plasma display panel | |
| CN110355016A (en) | Wafer scale distributor | |
| JP2016084877A (en) | Solenoid valve, coating device and coating method | |
| CN103706541A (en) | Coating method for frame sealing glue | |
| CN108602088A (en) | Device for draining fluid and fluid discharging method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20181212 Address after: 646300 No. 3, Lan'an Road, Naxi District, Luzhou City, Sichuan Province Patentee after: Sichuan Mingdeheng Electronic Technology Co.,Ltd. Address before: 264006 No. 6 Heilongjiang Road, Yantai Economic and Technological Development Zone, Shandong Province Patentee before: MDH TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20240929 Address after: 264006 No. 6 Heilongjiang Road, Yantai Economic and Technological Development Zone, Shandong Province Patentee after: MDH TECHNOLOGY Co.,Ltd. Country or region after: China Address before: 646300 No. 3, Lan'an Road, Naxi District, Luzhou City, Sichuan Province Patentee before: Sichuan Mingdeheng Electronic Technology Co.,Ltd. Country or region before: China |