CN101713924A - A device for treating substrate and a method of cardinal plate loading - Google Patents
A device for treating substrate and a method of cardinal plate loading Download PDFInfo
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- CN101713924A CN101713924A CN200910178723A CN200910178723A CN101713924A CN 101713924 A CN101713924 A CN 101713924A CN 200910178723 A CN200910178723 A CN 200910178723A CN 200910178723 A CN200910178723 A CN 200910178723A CN 101713924 A CN101713924 A CN 101713924A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Coating Apparatus (AREA)
Abstract
The invention provides a device for treating substrate and a method of cardinal plate loading. In the device for treating substrate, a hoisting pin that can lift from an object stage loads a disposed cardinal plate, therefore production time is shortened, and production efficiency is improved. The device for treating substrate (1) comprises the following components: a object stage (3), which loads the cardinal plate (K); a hoisting pin (41), which is set to be capable of lift through a through hole (33) from the object stage and can support the cardinal plate with its frontend; a pin drive control part (43, 10) which drives and controls the hoisting pin, and loads the cardinal plate that supplied to a move in position (P2) above the object stage to the object stage, wherein, the pin drive control part drives and controls as following: supports the cardinal plate on the move in position with frontend of the hoisting pin by listing the hoisting pin, and load the cardinal plate on the object stage by lowering the hoisting pin after it is remained in aposition higher than the move in position.
Description
Technical field
The substrate-placing method that the present invention relates on objective table, to keep substrate and carry out substrate board treatment and this substrate board treatment of predetermined process with respect to the substrate of this maintenance.Particularly relate to by being set to carry out from the lifting pin that objective table carries out lifting action the substrate-placing method of substrate board treatment and this substrate board treatment of mounting substrate on objective table.As substrate, can enumerate for example glass substrate or semiconductor wafer.
Background technology
As on objective table, keeping substrate and carrying out the example of the substrate board treatment of predetermined process with respect to the processed substrate of this maintenance, the gap nozzle coater is arranged, and wherein said gap nozzle coater is a kind of of the device that uses in the manufacturing of liquid crystal panel.The gap nozzle coater constitutes the surface applied photoresist liquid (with reference to patent documentation 1) at glass substrate in order to form color filter or TFT at glass substrate.
The summary of the processing action of existing gap nozzle coater 100 is described with reference to Figure 10.In addition, in the structure important document of the gap nozzle coater 100 shown in Figure 10, about the structure important document identical, additional same numeral with the gap nozzle coater 1 of following one embodiment of the present invention.Shown in Figure 10 (A), existing gap nozzle coater 100 has absorption objective table 3, promotes pin 41A, die lip 60 and control device 10A etc., and transmits glass substrate K by the substrate conveyer robot 9 with mechanical hand 93.
Existing gap nozzle coater 100 is in the original state of Figure 10 (A).That is, promoting pin 41A is the state that buries in the below of absorption objective table 3, and mechanical hand 93 is under the state of supporting glass substrate K makes a concession position P1.Below, describe according to the order of each step.Among the figure, hollow arrow is represented the direction of action of mechanical hand 93, and the thick arrow of black represents to promote the direction of action of pin 41A.
(glass substrate receiving step)
From the state of Figure 10 (A), at first substrate conveyer robot 9 along continuous straight runs drive machines hands 93 are supplied with (with reference to Figure 10 (B)) with glass substrate K to moving into position P2a.Moving into position P2a is the top position of absorption objective table 3.Next, control device 10A makes lifting pin 41A rise to assigned position (with reference to Figure 10 (C)).Next, substrate conveyer robot 9 descends the mechanical hand 93 of supporting glass substrate K, and makes the back side and the leading section butt (with reference to Figure 10 (D)) that promotes pin 41A of glass substrate K.
Glass substrate K with promote pin 41A butt after mechanical hand 93 also continues decline, leave moment of predetermined distance D at glass substrate K and mechanical hand 93, substrate conveyer robot 9 makes the decline of mechanical hand 93 stop (with reference to Figure 10 (E)).Next, substrate conveyer robot 9 along continuous straight runs drive machines hands 93 make it move (with reference to Figure 10 (F)) to making a concession position P1.Next, control device 10A descends the lifting pin 41A of supporting glass substrate K, and after glass substrate K being positioned on the absorption objective table 3, carry out the location of glass substrate K as required, then glass substrate K vacuum suction is being adsorbed objective table 3 (with reference to Figure 10 (G)).After absorption finishes, begin coating (with reference to Figure 10 (H)) by mobile die lip 60.
(glass substrate transfer step)
After coating finished, the transmission of glass substrate K was carried out with the reverse order of above-mentioned glass substrate receiving step basically.Promptly, carry out in the following order, remove vacuum suction that absorption remains on the glass substrate K of absorption objective table 3, enter the rising of moving into position P2a, mechanical hand 93, the decline that promotes pin 41A and supporting, the yielding of the glass substrate K that undertaken by mechanical hand 93 by the supporting rising, the mechanical hand 93 that promote the glass substrate K that pin 41A carries out.
Patent documentation 1: TOHKEMY 2008-55322 communique
In existing gap nozzle coater 100, when promoting pin 41A and glass substrate K is positioned on the absorption objective table 3, mechanical hand 93 descends and the decline rate of the mechanical hand 93 of glass substrate K during with the leading section butt that promotes pin 41A is set at very slow value.Its reason be in order to prevent since the back side of glass substrate K during with the leading section butt that promotes pin 41A impact and produce cut or crackle at glass substrate K.And, mechanical hand 93 common Heavy Weights, the high speed difficulty of its rising or falling speed in confined spaces.
But along with the purposes of liquid crystal panel enlarges and popularizes, the requirement that the production of liquid crystal panel enlarges increases.Therefore, the productive temp time of shortening gap nozzle coater becomes important problem.This problem is not the distinctive problem of gap nozzle coater certainly.For example, also be applicable to exposure device, cleaning device, drying device and the testing fixture that in the manufacturing of liquid crystal panel, uses.And then, even beyond liquid crystal panel, be applicable to roughly that also the substrate board treatment that utilizes substrate transmission robot to carry out the substrate transmission is all, therefore wish to solve this situation.
Summary of the invention
The present invention is in view of such problem, and its purpose is, by being set to and can carrying out can shortening the productive temp time the substrate board treatment of mounting substrate on objective table from the lifting pin that objective table carries out lifting action, thereby can enhance productivity.
Above-mentioned purpose realizes by following the present invention.In addition, reaching in the hurdle of " summary of the invention " the additional label of each structure important document at " claims " is expression and the label of the corresponding relation of the concrete mechanism of embodiment record described later.
The invention of technical scheme 1 is a kind of substrate board treatment 1, and it has: objective table 3, its mounting substrate K; Promote pin 41, it is set to carry out from the through hole 33 that is formed at objective table 3 lifting action and the enough leading section supporting substrates K of energy; Pin drive control part 43,10, its drive controlling promotes pin 41, the substrate K that moves into position P2 with the top that will be fed into objective table 3 is positioned on the objective table 3, described substrate board treatment 1 is characterised in that, pin drive control part 43, the 10 following drive controlling of carrying out: be positioned at the substrate K that moves into position P2 by making 41 risings of lifting pin use the leading section that promotes pin 41 to support, remaining in than after moving into the high position P3 of position P2, promote pin 41 declines by making, substrate K is positioned on the objective table 3.
According to the invention of technical scheme 1, be positioned at the substrate K that moves into position P2 by making 41 risings of lifting pin use the leading section of lifting pin 41 to support, remaining on than after moving into the high position of position P2, make to promote and sell 41 declines.Therefore, as to the mechanism that moves into position P supplying substrate K, when for example using mechanical hand 93, mechanical hand 93 only moves horizontally and gets final product, and need not to make mechanical hand 93 to descend.Therefore, reduce the action step of substrate conveyer robot 9, like this, can shorten the productive temp time, thereby can enhance productivity.
In the invention of technical scheme 2, promote the buffer gear 44 that pin 41 has the impact that when absorbing its leading section and substrate K butt substrate K is produced.
According to the invention of technical scheme 2, since buffer gear 44 performance buffer action when promoting pin 41 with substrate K butt, the impact that therefore relax, absorptive substrate K is subjected to from the leading section that promotes pin 41.Therefore, substrate K be can be suppressed at and cut or crackle produced.
In addition, the invention of technical scheme 3 is a kind of substrate-placing methods, in substrate board treatment 1, the substrate K that moves into position P2 supply that is fed into the top of objective table 3 is positioned on the objective table 3, wherein, described substrate board treatment 1 has: objective table 3, its mounting substrate K; Promote pin 41, it is set to carry out from the through hole 33 that is formed at described objective table 3 lifting action and the enough leading section supporting substrates K of energy, described substrate-placing method is characterised in that, by being risen, described lifting pin 41 use the leading section supporting that promotes pin 41 to be positioned at the substrate K that moves into position P2, remain in than described move into the high position P3 of position P2 after, promote pin 41 and descend and substrate K is positioned on the objective table 3 by making.
The invention effect
According to the present invention, by being set to and carrying out to shorten the productive temp time the substrate board treatment of the processed substrate of mounting on objective table from the lifting pin that objective table carries out lifting action, thereby can enhance productivity.
Description of drawings
Fig. 1 is the stereoscopic figure of the gap nozzle coater that the present invention relates to.
Fig. 2 is the stereoscopic figure of absorption objective table and centering unit.
Fig. 3 is the structure skeleton diagram that promotes the pin unit.
Fig. 4 is the main pseudosection that the details of buffer gear is shown.
Fig. 5 is the side part sectioned view of die lip.
Fig. 6 is the stereoscopic figure of cleaning unit.
Fig. 7 is the process flow diagram of the coating action of the gap nozzle coater that the present invention relates to.
Fig. 8 be by the time sequence the figure of the coating action of the gap nozzle coater that the present invention relates to is shown.
Fig. 9 is the figure that the effect of buffer gear is shown.
Figure 10 be by the time sequence the figure of the coating action of existing gap nozzle coater is shown.
[symbol description]
1 gap nozzle coater (substrate board treatment)
3 absorption objective tables (objective table)
10 control device (pin drive control part)
33 promote pin-and-hole (through hole)
41 promote pin
43 frame drive part (pin drive control part)
44 buffer gears
K glass substrate (substrate)
P2 moves into the position
P3 substrate position of readiness (than moving into high position, position)
Embodiment
Below, with reference to the description of drawings embodiments of the present invention.Fig. 1 is the stereoscopic figure of gap nozzle coater 1, Fig. 2 is the stereoscopic figure of absorption objective table 3 and centering unit 5, Fig. 3 is the structure skeleton diagram that promotes pin unit 4, Fig. 4 is the detailed main pseudosection that buffer gear 44 is shown, Fig. 5 is the side part sectioned view of die lip 60, Fig. 6 is the stereoscopic figure of cleaning unit 8, and Fig. 9 is the figure that the effect of buffer gear 44 is shown.In Fig. 9, A illustrates the not state during butt of the leading section that promotes pin 41 and glass substrate K, B illustrates the state after the leading section that promotes pin 41 and the glass substrate K butt, and C illustrates the state of selling 41 leading section and glass substrate K butt and supporting this glass substrate K that promotes.Three of orthogonal coordinate system is X, Y, Z in each figure, and the XY plane is a surface level, and the Z direction is a vertical direction.And, needs further with the sensing of XY all directions difference for about when describing, the symbol of be in advance additional "+" or "-".
As shown in Figure 1, gap nozzle coater 1 of the present invention has board 2, adsorbs objective table 3, promotes and sell unit 4, centering unit 5, coating element 6, coating liquid supply unit 7, cleaning unit 8 and control device 10 etc., and constitutes the surface that the photoresist liquid 20 that will be used for color filter formation is coated in glass substrate K.And, transmit glass substrate K to absorption objective table 3 and undertaken by substrate conveyer robot 9 with mechanical hand 93.
Board 2 works as the pedestal of the main structure portion (for example adsorbing objective table 3 or coating element 6) of supporting gap nozzle coater 1, and is made of stone material.As stone material is to guarantee sufficient rigidity or plane precision and temperature variant distortion is suppressed to be Min..Particularly preferred stone material is a grouan.
As shown in Figure 2, absorption objective table 3 has the mounting surface 31 of the glass substrate K of the coating object that can mounting becomes photoresist liquid 20.Absorption objective table 3 is made of the stone material identical with board 2.Be equipped with a plurality of vacuum suction hole 32 and a plurality of lifting pin-and-hole 33 in mounting surface 31.Vacuum suction hole 32 is that a plurality of decentralized configuration are for overlooking cancellate minute aperture on mounting surface 31, though diagram is omitted, the vacuum generation mechanism by vacuum pump etc. produces negative pressure in minute aperture.Promote pin-and-hole 33 with the state that leaves predetermined distance with vacuum suction hole 32 on mounting surface 31 a plurality of decentralized configuration for overlooking clathrate.Each promotes pin-and-hole 33 and following lifting pin 41 is exposed submerge.
Promoting pin unit 4 is to accept to apply the glass substrate K of object and the position of transmitting the glass substrate K that has applied.As shown in Figure 3, promote pin unit 4 and have many lifting pins 41, pin framework 42 and frame drive part 43 etc.In such lifting pin unit 4, carry out lifting by 43 pairs of pins of frame drive part framework 42 and drive, can make lifting pin 41 carry out lifting action from the lifting pin-and-hole 33 that is formed on absorption objective table 3.
Promote pin 41 and be the pin parts that can support this glass substrate K by its leading section and glass substrate K butt.Its details is as described below.
As described below about promoting pin 41.As shown in Figure 4, promote pin 41 and have pin upper end 41S and pin base portion 41H.
Pin upper end 41S can insert the logical position that promotes pin-and-hole 33.Pin upper end 41S be that its leading section is pointed than the rugosity of the thin size of internal diameter of lifting pin-and-hole 33.And, be formed with the external thread 41a that is used for pin base portion 41H connection in its underpart.
Volute spring 25 is installed in the root side by large-diameter portion 231 in the minor diameter part 232 at coupling link 23 under the state that is contained in spring receiving cartridge 24.Specifically, volute spring 25 is set to, its upper end and large-diameter portion 231 butts and its bottom and top packing ring 28 butts, and be the state that shrinks than natural length.Therefore, because to large-diameter portion 231 application of force and to the top packing ring 28 downward application of forces upwards, so between spring receiving cartridge 24 and top packing ring 28, be formed with gap L.Thus, with glass substrate K butt and coupling link 23 when descending, volute spring 25 contractions can be brought into play buffer action at the leading section that promotes pin 41.
That is, if promote the leading section and the glass substrate K butt of pin 41, then along with the state of coupling link 23 from Fig. 9 (A) descends, volute spring 25 shrinks.The cylinder collar 26, lower washer 29 and bolt 27 descend with coupling link 23 at this moment.That is, because lower washer 29 is installed on above-mentioned minor diameter part 232 integratedly by bolt 27, so the cylinder collar 26 and lower washer 29 descend with minor diameter part 232.Therefore, become following state, that is, the cylinder collar 26 leaves top packing ring 28 and lower washer 29 is left pin framework 42 (Fig. 9 (B)).
In addition, be provided with the sensor 45 of the supporting that is used to detect glass substrate K at the lower position that promotes pin 41.As shown in Figure 4, sensor 45 comprises microswitch, and is installed in the bottom of pin framework 42 via carriage 452, and wherein said microswitch is by pushing the switch portion 451 of connecting and having output connection signal SG1.This installation site is positioned at the below of bolt 27, has the distance shorter than the distance of above-mentioned gap L apart from bolt 27.
Promptly, behind the leading section and glass substrate K butt that promote pin 41, if the cylinder collar 26, lower washer 29 and bolt 27 are along with the state of coupling link 23 from Fig. 9 (B) further descends and descend, then shown in Fig. 9 (C), make switch portion 451 output connection signal SG1 by bolt 27 press switching parts 451.This connection signal SG1 enters control device 10 described later.In addition, such sensor 45 can promote pin 41 and be provided with singly with respect to each, but also can be provided with to detect the supporting of glass substrate K by a lifting pin 41 with respect to a specific part.And at this moment, volute spring 25 further shrinks from the state of Fig. 9 (B), and the gap L of spring receiving cartridge 24 and top packing ring 28 disappears.Thus, spring receiving cartridge 24 and top packing ring 28 butts.Its result, the load of glass substrate K is by 42 supportings of pin framework.
In addition, the mechanism in the supporting that is used for detecting glass substrate K except that the sensor 45 of the type of connecting is pushed in above-mentioned passing through, can use for example transmission-type optoelectronic switch, reflection-type optoelectronic switch, non-contacting sensor, magnetic switch etc.When using above-mentioned transmission-type optoelectronic switch, be provided for the transmitted light of transmission-type optoelectronic switch is carried out the block (shadow shield) of shading in for example position of bolt 27, when promoting pin 41 and descend owing to supporting glass substrate K, by being set, the transmission-type optoelectronic switch, can detect the supporting of glass substrate K so that above-mentioned block carries out shading to the transmitted light of transmission-type optoelectronic switch.
In addition, buffer gear 44 can be regulated the power of buffer action, thus, even also can apply suitable buffer action for the glass substrate K that varies in weight.Specifically, by fastening, the length that changes gap L of lax second nut 22, lax spring receiving cartridge 24 and coupling link 23, come the intensity of the application of force of adjustable screw spring 25.
In addition, as shown in Figure 2, the centering unit 5 that is arranged on absorption objective table 3 has insertion parts 51 and drive unit 52.Insertion parts 51 is arranged on the Y direction both sides of absorption objective table 3 in the mode that becomes pair of right and left.The liner 53 of the Y direction both sides end face that is used to push glass substrate K is installed in each insertion parts 51.In liner 53, the gap of Z direction that predetermined altitude is adjusted into the mounting surface 31 of adsorbing objective table 3 is 0.1mm～0.3mm.Drive unit 52 is made of the cylinder of for example phase mutually synchronization and the motion of edge ± Y direction, and actuator portion separately and 51 connections of each insertion parts.
As shown in Figure 1, coating element 6 has the wideer interval of width that separates than absorption objective table 3 to be erect two movable column sections 66 of setting relatively and is erected at these two die lips (Jin Kou) 60 between the movable column sections 66, and is the door type shape body that is set to across absorption objective table 3.Can drive two movable column sections 66 along directions X by linear motor 67X.Linear motor 67X is parallel to each other along directions X and is configured in base station 2.Can drive die lip 60 along the Z direction by linear motor 67Z.Linear motor 67Z is configured in two movable column sections 66 respectively along the Z direction.
As shown in Figure 1, coating liquid supply unit 7 has coating liquid storage tank 71, coating liquid discharge pump 72 and retaining valve 73,74.
Coating liquid storage tank 71 is to be used for the groove of photoresist liquid 20 that temporary transient storage becomes the ormal weight (for example, can be coated on the amount of many pieces of glass substrate K) of coating liquid, and via retaining valve 73 with apply liquid discharge pump 72 and carry out pipe arrangement and be connected.
Coating liquid discharge pump 72 carries out pipe arrangement via retaining valve 74 with die lip 60 and is connected.In the wafer that relates in glass substrate that uses in the manufacturing of the flat-panel monitor that is similar to LCD or plasma display or the semiconductor manufacturing etc. smooth and the device that the substrate sheet mode applies, the film thickness distribution that requires the coating direction evenly and can form the coated film that does not contain bubble or impurity.Therefore, the 72 preferred pulsation of coating liquid discharge pump are small and debug time when supplying with beginning is short and solvent resistance is good and in pump, do not produce liquid aggegation or foaming, be rich in the material of impermeability and permanance, for example preferably injection (piston) pump or bag pump etc.Special because syringe pump is by the direct mode of liquid in the output of piston, so response and constant flow rate characteristics are good.On the other hand, because syringe pump is the mode of liquid in the output indirectly, therefore can prevent entrained air.
As shown in Figure 6, cleaning unit 8 has scraper plate 81, scraper plate drive unit 82 and soiling solution acceptance division 83 etc.Scraper plate 81 as material, is the blocks that has to the roughly similar V font groove of the profile of ejiction opening 63 sides of the slit-shaped of die lip 60 with elastic bodys such as synthetic rubber.Portion has cleaning fluid injection nozzle 81a and dry with gas injection nozzle 81b within it.Though diagram is omitted, cleaning fluid injection nozzle 81a carries out pipe arrangement via operation valve with the cleaning fluid storage tank of having filled cleaning fluid and is connected.Drying is carried out pipe arrangement with the drying of having filled desiccant pressure gas with gas storage tanks via operation valve with gas injection nozzle 81b and is connected.Scraper plate drive unit 82 is to make the scraper plate 81 can be along ± structure that the Y direction moves, for example comprises driving side pulley, slave end pulley, is erected at the endless belt of these two pulleys and is used for rotary servo motor that the driving side pulley is rotated driving etc.Soiling solution acceptance division 83 is by being length direction with the Y direction and having than bigger the rectangular of area (area of observing from the Z direction) that overlook of die lip 60 and have the wall vessel to constitute.In addition, also can be with cleaning the apparatus for initializing that the state that soaks that action is set up in parallel the ejiction opening 63 that is used to make slit-shaped etc. returns steady state.
That is, if by substrate conveyer robot 9 glass substrate K is moved into position P2 (with reference to Fig. 8 (B)), then control device 10 drive controlling frame drive part 43 make glass substrate K rise to substrate position of readiness P3, and stop at this position.Specifically, the above-mentioned storage arrangement in the control device 10 is stored the altitude information than the substrate position of readiness P3 (with reference to Fig. 8 (C)) that moves into the high position of position P2 (with reference to Fig. 8 (B)) of glass substrate K in advance.If glass substrate K remains on substrate position of readiness P3 (with reference to Fig. 8 (C)), then control device 10 will keep the substrate of the signal of end to keep end signal to substrate conveyer robot 9 outputs as this.And if control device 10 is made a concession end signal from the hand that substrate conveyer robot 9 receives the signal of mechanical hand 93 yieldings, then drive controlling frame drive part 43 is so that remain on glass substrate K lifting pin 41 declines of substrate position of readiness P3.This moment drive controlling proceed to glass substrate K be positioned in absorption objective table 3 mounting surface 31 till.In addition, in the moment of supporting glass substrate K, from sensor 45 output connection signal SG1, still, if when not exporting this connection signal SG1, control device 10 is judged as by the supporting that promotes the pin 41 glass substrate K that carry out and has some problem and the output error signal.
As shown in Figure 1, substrate conveyer robot 9 has motor 91, arm 92 and mechanical hand 93.Mechanical hand 93 be can supporting glass substrate K fork, constitute by the driving of motor 91 and move freely along XYZ θ all directions, and can be configured in following yielding position P1 selectively and move into position P2 by moving horizontally via arm 92.That is, making a concession position P1 is the foreign side of absorption objective table 3, is the position of not having total zone at absorption objective table 3 and mechanical hand 93 when the Z direction is observed.And, to move into directly over the position P2 absorption objective table 3, the height of the mechanical hand 93 of this moment is consistent with the height of making a concession position P1.In addition, the control of mechanical hand 93 is undertaken by the control device that the substrate conveyer robot 9 different with control device 10 self has.
Next, move with reference to the coating of Fig. 7,8,9 explanation gap nozzle coaters 1.Fig. 7 is the process flow diagram of the coating action of gap nozzle coater 1, Fig. 8 be time series the figure of the coating action of gap nozzle coater is shown, in Fig. 8, hollow arrow is represented the direction of action of mechanical hand 93, and the thick arrow of black represents to promote the direction of action of pin 41.
As shown in Figure 7, the coating of gap nozzle coater 1 action is carried out through glass substrate receiving step S1, centering step S2, applying step S3, scraping step S4, glass substrate transfer step S5.In Fig. 8, illustrate that gap nozzle coater 1 is in the situation of ensuing original state.That is, promoting pin 41 is the state that is embedded in the below of mounting surface 31, and mechanical hand 93 is positioned under the state of supporting glass substrate K makes a concession position P1 (with reference to Fig. 8 (A)).And die lip 60 is positioned at makes a concession height H 1 and position of readiness Q1 (with reference to Fig. 5).
(glass substrate receiving step S1)
Glass substrate receives following the carrying out of action.At first substrate conveyer robot 9 along continuous straight runs drive the mechanical hand 93 of supporting glass substrate K, make mechanical hand 93 move (with reference to Fig. 8 (B)) from making a concession position P1 to moving into position P2.From making a concession position P1 when moving into position P2 and move glass substrate K, mechanical hand 93 only moves horizontally.
Next, to pin framework 42 driving of rising, the lifting pin 41 of the below that is imbedded in mounting surface 31 is risen by control device 10 drive controlling frame drive part 43.Thus, the leading section that promotes pin 41 from mounting surface 31 outstanding and with the back side butt that is in the glass substrate K that moves into position P2.After this, promote further rising of pin 41 by making, the volute spring 25 of buffer gear 44 shrinks, and shown in Fig. 9 (B), to promoting the upwards application of force of pin 41.That is buffer gear 44 performance buffer action when leading section that promotes pin 41 and glass substrate K butt.
When promoting pin 41 supporting glass substrate K, shown in Fig. 9 (C), switch portion 451 is connected.And the connection signal SG1 of each switch portion 451 produces.After this, promote pin 41, glass substrate K is remained on substrate position of readiness P3 (with reference to Fig. 8 (C)) by its leading section supporting glass substrate K and rising.So, the supporting of glass substrate K is shifted to promoting pin 41 from mechanical hand 93.
If glass substrate K is remained on substrate position of readiness P3, then control device 10 keeps end signal to substrate conveyer robot 9 output substrates.Keep end signal according to this substrate, substrate conveyer robot 9 along continuous straight runs drive the mechanical hand 93 that breaks away from glass substrate K, and move it yielding position P1 (with reference to Fig. 8 (D)).If substrate conveyer robot 9 is made a concession position P1, then substrate conveyer robot 9 is made a concession end signal to control device 10 output hands.
Next, control device 10 is made a concession end signal based on above-mentioned hand,, makes thus to promote pin 41 declines to pin framework 42 drivings that descend by drive controlling frame drive part 43.Promote pin 41 supporting glass substrate K and decline, stop in the position that buries fully under mounting surface 31.Glass substrate K mounting is in mounting surface 31 (with reference to Fig. 8 (E)) thus.
Like this, according to glass substrate receiving step S1, in the glass substrate K mounting that will move into position P2 by mechanical hand 93 during in mounting surface 31, following some with different in the past, that is, the mechanical hand 93 of supporting glass substrate K is descended, and promote that pin 41 rises and with its leading section supporting glass substrate K by making, after making glass substrate K remain on, make to promote pin 41 declines than the substrate position of readiness P3 that moves into P2 high position, position.Thereby mechanical hand 93 only moves horizontally and gets final product, and does not need to make mechanical hand 93 to descend.Therefore, the action step of substrate conveyer robot 9 is few, like this, can realize the productive temp reductionization of time, and can enhance productivity.And, substrate conveyer robot 9 is different with the control device of gap nozzle coater 1, but the exchange of the control data that the transmission of the glass substrate K between the amount that the action step of substrate conveyer robot 9 reduces, the mechanical hand 93 between two control device and the lifting pin 41 relates to gets final product less, also can realize the productive temp reductionization of time from this point.And, since buffer gear 44 performance buffer action when promoting pin 41 with glass substrate K butt, the impact that therefore relax, heat absorbing glass substrate K is subjected to from the leading section that promotes pin 41.Therefore, glass substrate K be can be suppressed at and cut or crackle produced.
(centering step S2)
Following the carrying out of centering action.In centering unit 5, by driving insertion parts 51 by drive unit 52 (with reference to Fig. 2), and from the glass substrate K of Y direction sandwich mounting on mounting surface 31.Thus, glass substrate K becomes equally spaced position respectively from the Y direction two ends of absorption objective table 3, and make the directions X center line of glass substrate K and the directions X center line of mounting surface 31 (by the center of Y direction width along the parallel center line of directions X) consistent, carry out what is called centering.After this, drive unit 52 makes insertion parts 51 return original position.
(applying step S3)
Following the carrying out of coating action.After centering finishes, at first, produce vacuum in the vacuum suction hole 32 of absorption objective table 3 and press, glass substrate K vacuum suction is remained on the mounting surface 31.Next, by driving linear motor 67X, make die lip 60 move (with reference to Fig. 5) to coating starting position Q2 from position of readiness Q1.Next, by driving linear motor 67Z, die lip 60 is moved to coating height H 2 from making a concession height H 1.
Next, coating liquid discharge pump 72 is carried photoresist liquid 20 to die lip 60, and photoresist liquid 20 is oozed out from the ejiction opening 63 of slit-shaped.At this moment, between the surface of the ejiction opening 63 of slit-shaped and glass substrate K, be formed with film attachment (bead) 20B (with reference to Fig. 5) that joins with these both sides.Under this state, make die lip 60 edge+directions Xs move (with reference to Fig. 8 (F)) by driving linear motor 67X.Be accompanied by moving of die lip 60, be coated with photoresist liquid 20 to+directions X on the surface of glass substrate K.If die lip 60 arrives coating end position Q3, then apply liquid discharge pump 72 and stop to supply with photoresist liquid 20, linear motor 67X stops to move of die lip 60 by stopping to drive movable column sections 61.Next, drive linear motor 67Z, die lip 60 is risen to make a concession height H 1.Next, edge-directions X inversion driving linear motor 67X locates to stop above cleaning unit 8 at the ejiction opening 63 of the slit-shaped of die lip 60.
(scraping step S4)
Following the carrying out of scraping action.At first, drive linear motor 67Z, the V font groove (with reference to Fig. 6) of the ejiction opening 63 of the slit-shaped of die lip 60 and scraper plate 81 is carried out the noncontact configuration.Next, cleaning fluid injection nozzle 81a jet cleaning liquid.In the time of jet cleaning liquid, scraper plate drive unit 82 edge+Y directions drive scraper plate 81.Thus, clean the ejiction opening 63 of slit-shaped.If the end of scraper plate 81 arrival+Y directions, then scraper plate drive unit 82 stops to drive scraper plate 81.The injection of cleaning fluid meanwhile also stops.After this, scraper plate drive unit 82 edge-Y direction inversion driving scraper plates 81.This moment is dry with gas injection nozzle 81b jet drying gas, and the ejiction opening 63 of the slit-shaped of cleaning is carried out drying.If the end of scraper plate 81 arrival-Y directions, then scraper plate drive unit 82 stops to drive scraper plate 81.Meanwhile stop dry injection with gas.
(glass substrate transfer step S5)
Glass substrate transmits following the carrying out of action.At first, destroy the vacuum pressure that produces in the vacuum suction hole 32 of absorption objective table 3.Next, by control device 10 drive controlling frame drive part 43 to pin framework 42 driving of rising, make thus promote pin 41 from absorption objective table 3 outstanding and with glass substrate K butt.After this, make lifting pin 41 under the state of supporting glass substrate K, rise to substrate position of readiness P3.Identical during at this moment also with reception glass substrate K, when promoting pin 41, bring into play buffer action with glass substrate K butt.Thus, glass substrate K be can be suppressed at and cut or crackle produced.Next, substrate conveyer robot 9 along continuous straight runs drive and are in the mechanical hand 93 of making a concession position P1, move it and move into position P2.Next, by control device 10 drive controlling frame drive part 43, the lifting pin 41 of supporting glass substrate K is descended.By glass substrate K is descended, mechanical hand 93 accesses the glass substrate K that coating finishes.Next, substrate conveyer robot 9 along continuous straight runs drive and are moving into the mechanical hand 93 that position P2 accesses glass substrate K, transmit to the drying under reduced pressure operation as subsequent processing.
In addition, in the above-described embodiment, as the original state of gap nozzle coater 1, show lifting pin 41 and bury in the situation of the below of mounting surface 31, but also can make lifting pin 41 be projected into specified altitude in advance, and with the rising starting position of this specified altitude as lifting pin 41.Promptly, making the glass substrate K that moves into position P2 is specified altitude with promoting pin 41 hands-off height, for example promoting the leading section of pin 41 position low than the glass substrate K that moves into position P2, and makes this specified altitude sell 41 rising starting position for promoting.Thus, in glass substrate receiving step S1,, therefore can shorten making glass substrate K rise to the needed time of substrate position of readiness P3 because the climb that makes glass substrate K rise to the needed lifting pin 41 of substrate position of readiness P3 shortens.
More than, be illustrated about embodiments of the present invention, still above-mentioned disclosed embodiment is nothing but illustration, and scope of the present invention is not limited to this embodiment.Scope of the present invention publicity by claims record, and further comprise the meaning that the scope with claims is equal to and the whole changes in the scope.That is, whole or a part of structure of gap nozzle coater 1, shape, size, material, number etc. can be carried out various changes according to purport of the present invention.And, in the present embodiment, substrate board treatment as the gap nozzle coater, still in addition, also can be applicable to for example exposure device, cleaning device, drying device and testing fixture etc.
Claims (3)
1. substrate board treatment has:
Objective table (3), its mounting substrate (K);
Promote pin (41), it is set to carry out from the through hole (33) that is formed at objective table (3) lifting action and energy enough leading section supporting substrates (K);
Pin drive control part (43,10), its drive controlling promotes pin (41), is positioned on the objective table (3) with the substrate of moving into position (P2) (K) of the top that will be fed into objective table (3),
Described substrate board treatment (1) is characterised in that,
The following drive controlling of carrying out of pin drive control part (43,10): be positioned at the substrate (K) of moving into position (P2) by making lifting pin (41) rising use the leading section of lifting pin (41) to support, remaining in than after moving into high position (P3), position (P2), promote pin (41) decline by making, substrate (K) is positioned on the objective table (3).
2. substrate board treatment according to claim 1 is characterized in that,
Promote the buffer gear (44) that pin (41) has the impact that when absorbing its leading section and substrate (K) butt substrate (K) is produced.
3. substrate-placing method, in substrate board treatment (1), the substrate of moving into position (P2) (K) that will be fed into the top of objective table (3) is positioned on the objective table (3), wherein, described substrate board treatment (1) has: objective table (3), its mounting substrate (K); Promote pin (41), it is set to carry out from the through hole (33) that is formed at described objective table (3) lifting action and energy enough leading section supporting substrates (K),
Described substrate-placing method is characterised in that,
By being risen, described lifting pin (41) use the leading section supporting that promotes pin (41) to be positioned at the substrate (K) of moving into position (P2), remain in than described move into high position (P3), position (P2) after, promote pin (41) and descend and substrate (K) is positioned on the objective table (3) by making.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008-256300 | 2008-10-01 | ||
| JP2008256300A JP2010087343A (en) | 2008-10-01 | 2008-10-01 | Substrate processing device and substrate placing method |
Publications (2)
| Publication Number | Publication Date |
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| CN101713924A true CN101713924A (en) | 2010-05-26 |
| CN101713924B CN101713924B (en) | 2012-09-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN200910178723XA Active CN101713924B (en) | 2008-10-01 | 2009-09-28 | A device for treating substrate and a method of cardinal plate loading |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2010087343A (en) |
| KR (1) | KR20100037534A (en) |
| CN (1) | CN101713924B (en) |
| TW (1) | TWI465793B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103056067A (en) * | 2011-10-21 | 2013-04-24 | 东京毅力科创株式会社 | Coating processing device |
| CN106298622A (en) * | 2015-05-28 | 2017-01-04 | 沈阳芯源微电子设备有限公司 | A kind of device carrying warpage wafer and bearing method thereof |
| CN106994431A (en) * | 2015-12-16 | 2017-08-01 | 株式会社斯库林集团 | Base plate keeping device, apparatus for coating, substrate keeping method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI407268B (en) * | 2010-07-28 | 2013-09-01 | Au Optronics Corp | Work table |
| KR102379944B1 (en) | 2014-03-31 | 2022-03-29 | 니끼 쇼꾸바이 카세이 가부시키가이샤 | Coating liquid for forming transparent coating and method for producing said coating liquid, organic resin-dispersed sol, and substrate with transparent coating and method for producing said substrate |
| JP6308967B2 (en) * | 2015-03-27 | 2018-04-11 | 東京エレクトロン株式会社 | Heat treatment apparatus, abnormality detection method in heat treatment, and readable computer storage medium |
| TWI825613B (en) * | 2022-03-08 | 2023-12-11 | 權亞石材股份有限公司 | granite fork |
| TWI812568B (en) * | 2022-12-29 | 2023-08-11 | 卓金星 | Test device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP3082624B2 (en) * | 1994-12-28 | 2000-08-28 | 住友金属工業株式会社 | How to use electrostatic chuck |
| JP2001319957A (en) * | 2000-05-02 | 2001-11-16 | Tokyo Electron Ltd | Substrate transfer and device therefor |
| JP4288694B2 (en) * | 2001-12-20 | 2009-07-01 | 株式会社ニコン | Substrate holding apparatus, exposure apparatus, and device manufacturing method |
| JP2004083182A (en) * | 2002-08-26 | 2004-03-18 | Sharp Corp | Base board transporting device and manufacturing method for liquid crystal display device |
| JP4164654B2 (en) * | 2002-12-06 | 2008-10-15 | リコープリンティングシステムズ株式会社 | Printing device |
| JP2005310989A (en) * | 2004-04-20 | 2005-11-04 | Hitachi High-Tech Electronics Engineering Co Ltd | Method and device for delivering substrate and photomask |
| JP4906375B2 (en) * | 2006-03-20 | 2012-03-28 | 東京応化工業株式会社 | Substrate support member |
| JP4901323B2 (en) * | 2006-06-20 | 2012-03-21 | 東京応化工業株式会社 | Substrate processing equipment |
| JP2008041896A (en) * | 2006-08-04 | 2008-02-21 | Tokyo Electron Ltd | Substrate sensing mechanism, and substrate processor using same |
-
2008
- 2008-10-01 JP JP2008256300A patent/JP2010087343A/en active Pending
-
2009
- 2009-07-29 TW TW098125462A patent/TWI465793B/en active
- 2009-08-27 KR KR1020090079717A patent/KR20100037534A/en not_active Application Discontinuation
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103056067A (en) * | 2011-10-21 | 2013-04-24 | 东京毅力科创株式会社 | Coating processing device |
| CN106298622A (en) * | 2015-05-28 | 2017-01-04 | 沈阳芯源微电子设备有限公司 | A kind of device carrying warpage wafer and bearing method thereof |
| CN106298622B (en) * | 2015-05-28 | 2019-03-15 | 沈阳芯源微电子设备有限公司 | A kind of device and its bearing method carrying warpage wafer |
| CN106994431A (en) * | 2015-12-16 | 2017-08-01 | 株式会社斯库林集团 | Base plate keeping device, apparatus for coating, substrate keeping method |
| CN106994431B (en) * | 2015-12-16 | 2019-06-04 | 株式会社斯库林集团 | Base plate keeping device, apparatus for coating, substrate keeping method |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20100037534A (en) | 2010-04-09 |
| TWI465793B (en) | 2014-12-21 |
| JP2010087343A (en) | 2010-04-15 |
| CN101713924B (en) | 2012-09-26 |
| TW201015147A (en) | 2010-04-16 |
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