TW201043341A - Method for dispensing paste and substrate having paste pattern formed thereon by the method - Google Patents
Method for dispensing paste and substrate having paste pattern formed thereon by the method Download PDFInfo
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- TW201043341A TW201043341A TW098141306A TW98141306A TW201043341A TW 201043341 A TW201043341 A TW 201043341A TW 098141306 A TW098141306 A TW 098141306A TW 98141306 A TW98141306 A TW 98141306A TW 201043341 A TW201043341 A TW 201043341A
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1341—Filling or closing of cells
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
- B05C5/0212—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
- B05C5/0216—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles by relative movement of article and outlet according to a predetermined path
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133354—Arrangements for aligning or assembling substrates
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1341—Filling or closing of cells
- G02F1/13415—Drop filling process
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Liquid Crystal (AREA)
- Coating Apparatus (AREA)
Abstract
Description
201043341 、發明說明: 【發明所屬之技術領域】 本發明一般關於塗佈膠於基板之方法以及具有藉此方 法形成之膠圖案之基板。 【先前技術】 一般而言’液晶顯示器(LCDs)為平面板顯示器(FPD)的 一種類型’且與電漿顯示面板(PDPs)或場發射顯示器(FEDs) 一同成為下一世代顯示裝置的焦點,例如行動電話或電腦之 顯示幕、電視或類似者,因為具有比使用陰極射線管(CRTs) 之顯示器還要好的可視性、低平均功率消耗、以及低加熱值。 液晶顯示器由上基板、下基板、以及夾置於上基板及下 基板之間的液晶層所構成,其中液晶層可湘液晶浸注方法 及液晶滴落方法所形成。 0 液晶浸注方法的執行是在真空腔室,利用密封材料將上 基板及下基板接合在-起,絲舰m孔於其間 ί ’接合的基板放置於液晶槽中,並且解除腔室中的真空^ 態,而由於接合基板間的内冑空間與接合基板週遭的壓^, 使液晶可透過液晶注人孔注人接合基板之間的内部空間。 液f曰滴落方法的執行是將液晶滴落於上基板或下从 上,然後將上基板及下基板接合在一起。因為不像 要在 = 孔的步驟,也不要在勃夂、六n 八則心成液日日〉主入 在執仃液晶注入後封閉液晶注入孔的額外 201043341 =所以近來使職晶滴落方法,藉此降低形成液晶層所 耗的時間,以及避免浪費昂責的液晶。 . &晶滴落方法中最重要的因素是在上基板及下基板之 、曰’形成具有預定液晶量的液晶層。於液晶滴落方法中,將 2晶滴落於其上的基板與具有封閉膠圖案之塗膠基板接 «於此’封_圖案之區域變成形成具有預定液晶量之液 晶層重要的因素。 Ο ,於液晶滴落方法中,塗膠機用於塗佈膠在基板上,藉此 f成膠圖案於其上。此類塗膠機包含基板裝設於其上的平 台、具有透過喷嘴排出膠之頭單元,以及支撐頭單元之頭支 撐件,藉此當基板及喷嘴相對於彼此移動時,形成預定形狀 、, 之膠圖案於基板上。 同時’傳統的塗膠機以線性方式從排出勝的起點到排出 膠的終點連續地塗佈膠。 〇 於線性膠塗佈程序中,為了避免塗佈過多的膠而在基板 上膠圖案開始的位置有非常大的直徑,即首先塗膠之處,如 圖1所示’當噴嘴620向下及水平移動而接近基板s時,在 . 噴嘴尚未到達與基板S相隔預定間隔的位置時就開始透過 噴嘴620排出膠,且增加排出的膠量直到喷嘴620到達與基 * 板S相隔預定間隔。 類似地’為了避免過度塗佈膠而在基板上膠圖案終止的 位置具有非常大的直控,如圖2所示,當喷嘴620向上及水 4 201043341 平移動而遠離基板s時, 停止排出膠。 減少透過噴嘴620排出 的膠量最後201043341, EMBODIMENT OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention generally relates to a method of applying a glue to a substrate and a substrate having a glue pattern formed by the method. [Prior Art] In general, 'liquid crystal displays (LCDs) are a type of flat panel display (FPD)' and together with plasma display panels (PDPs) or field emission displays (FEDs) become the focus of next generation display devices. For example, a mobile phone or a computer display screen, television or the like has better visibility, lower average power consumption, and lower heating value than displays using cathode ray tubes (CRTs). The liquid crystal display comprises an upper substrate, a lower substrate, and a liquid crystal layer sandwiched between the upper substrate and the lower substrate, wherein the liquid crystal layer is formed by a liquid crystal infusion method and a liquid crystal dropping method. 0 The liquid crystal infusion method is performed in a vacuum chamber, and the upper substrate and the lower substrate are joined together by a sealing material, and the substrate in which the wire mesh m is interposed is placed in the liquid crystal cell, and the chamber is released. In the vacuum state, the liquid crystal can pass through the liquid crystal injection hole to inject the internal space between the substrates by the inner space between the bonding substrates and the bonding of the bonding substrate. The liquid drop method is performed by dropping the liquid crystal on the upper substrate or the lower substrate, and then joining the upper substrate and the lower substrate together. Because it is not in the step of = hole, do not in the burgundy, six n eight heart liquid into the day > the main in the liquid crystal injection hole after the liquid crystal injection hole is closed 201043341 = so recently the method of the job drop Thereby, the time taken to form the liquid crystal layer is reduced, and the waste of the liquid crystal is avoided. The most important factor in the crystal drop method is that a liquid crystal layer having a predetermined liquid crystal amount is formed on the upper substrate and the lower substrate. In the liquid crystal dropping method, the area on which the substrate on which the two crystals are dropped is bonded to the rubberized substrate having the sealant pattern becomes a factor which is important for forming a liquid crystal layer having a predetermined liquid crystal amount. Ο In the liquid crystal dropping method, a glue applicator is used to apply a glue on a substrate, whereby a glue pattern is formed thereon. The glue applicator includes a platform on which the substrate is mounted, a head unit having a glue discharge through the nozzle, and a head support of the support head unit, thereby forming a predetermined shape when the substrate and the nozzle move relative to each other, The glue pattern is on the substrate. At the same time, the conventional glue applicator continuously applies the glue in a linear manner from the starting point of the discharge to the end point of the discharge glue. In the linear glue coating process, in order to avoid coating too much glue, there is a very large diameter at the position where the glue pattern starts on the substrate, that is, where the glue is first applied, as shown in FIG. 1 'When the nozzle 620 is downward and When moving horizontally to approach the substrate s, the glue is discharged through the nozzle 620 when the nozzle has not reached a position spaced apart from the substrate S by a predetermined interval, and the amount of discharged glue is increased until the nozzle 620 reaches a predetermined interval from the base plate S. Similarly, in order to avoid excessive coating of glue, there is a very large direct control at the position where the glue pattern is terminated on the substrate. As shown in FIG. 2, when the nozzle 620 is moved upward and the water 4 201043341 moves flat away from the substrate s, the discharge of the glue is stopped. . Reducing the amount of glue discharged through the nozzle 620
因此塗膠機的線性塗佈方法需 第二要求轉D2,其中當開始邮 沿塗佈方向移動增加排出的量時 D1,而當喰喈a L « 而要有第一要求距離 到最後故止射味t 塗佈方向移_少排出的膠量 _炎終止排㈣,需要有第二要求距離D2。 程序=難在於,在基板上塗佈膠的 貫&又複雜’尤其疋當形成膝圖案 I 交點之膠_ρ祕寬,_處理得均 求距離D1 Γ需有要求距離D1及D2。然後,若設定要 寬nqD2發生錯糾,魏會發生麵職P的線 寬而可k成膝圖案p之封閉區變成缺陷的。 門开財法所·的,在上基板及下基板 二定液晶量之液晶層是非常重要的,而形成此類 2層疋依據膠圖案的封_而定。純,僅_線性塗佈 :之膠塗佈方法具有例如產生有缺陷的卵案封閉區的 題而很難形成具有預定液晶量之液晶層,可能降低產品 的品質。 【發明内容】 θ因此,本發明有鑑於上述先前技術發生的問題,本發明 提供一種膠塗佈方法’其中以點塗佈方式塗佈膠滴到基板上 而开乂成膠圖案,藉此避免缺陷,例如膠圖案線寬短路及故 5 201043341 障’以及確保卵案之賴區具有預定 量的液 曰曰 細㈣板,膠圖 你古Ϊ了達到上述目的’根據本發明之—方面提供一種膠塗 包含以下步驟:裝設基板於平台上;將喷嘴定位成 、目隔預定距離;以及當改變基板及喷嘴間之相對位置 Ο X點塗佈方式’依預定間隔從喷嘴滴落賴至基板,藉 此形成膠圖案。 w 於此執行形成膠圖案步驟的方式為:於改變滴落的膠 &之尺寸捋,或改變滴落相同尺寸之膠滴的數目時,滴落膠Therefore, the linear coating method of the glue applicator requires a second requirement to turn to D2, where D1 is increased when the postal coating direction is moved to increase the amount of discharge, and when 喰喈a L « and the first required distance is reached to the end The scent t is applied in the direction of the coating _ the amount of glue discharged _ the end of the arsenic (4), and the second required distance D2 is required. Procedure = The difficulty is that the coating of the glue on the substrate is complicated. In particular, when the knee pattern I is formed, the glue _ρ secret width is formed, and the distance D1 is required to be obtained. The required distances D1 and D2 are required. Then, if the error is set to be wide nqD2, Wei will have a line width of the face P and the closed area of the knee pattern p becomes defective. It is very important to have a liquid crystal layer of a liquid crystal on the upper substrate and the lower substrate, and the formation of such a two-layer 疋 depends on the seal of the adhesive pattern. The pure, only linear coating method has a problem of, for example, producing a defective egg-like closed region and it is difficult to form a liquid crystal layer having a predetermined liquid crystal amount, which may degrade the quality of the product. SUMMARY OF THE INVENTION Therefore, the present invention has been made in view of the problems of the prior art described above, and the present invention provides a glue coating method in which a glue coating is applied to a substrate by dot coating to form a glue pattern, thereby avoiding Defects, such as the glue pattern line width short circuit and the 5 201043341 barrier and ensuring that the egg case has a predetermined amount of liquid helium fine (four) plate, the glue map you have achieved the above purpose - according to the invention - provides a The glue coating comprises the steps of: mounting the substrate on the platform; positioning the nozzle to be separated by a predetermined distance; and changing the relative position between the substrate and the nozzle Ο X-point coating mode 'dropping from the nozzle to the substrate at predetermined intervals Thereby forming a glue pattern. w The step of forming the glue pattern step is as follows: when changing the size of the dripped glue & or changing the number of drops of the same size, the drip glue
再者’執行形成膠圖案步驟的方式為:於沿膠圖案線之 縱向調節滴落數量時,滴落膠滴。 再者’執行形成膠圖案步驟的方式為:於膠圖案之線 ,滴落至少一列的膠滴。 办再+者’執行形成膠圖案步驟的方式為:於膠圖案之線 見滴落複數列的膠滴’其中沿界定膠圖案之内線之列滴落 、膠滴之數量’不同於沿界定膠圖案之外線之列滴落的膠滴 之數量。 於此’沿界定膠圖案之内線之列滴落的膠滴之直徑,為 6 201043341 欲形成之膠圖案之線寬的1/2或更少。 本方法更包含以下步驟:當改變基板及喷嘴之相對位置 時,以線性塗佈方式’自喷嘴連續排出膠到基板,藉此形成 • 膠圖案。 〇Further, the step of performing the step of forming the glue pattern is such that the droplets are dropped when the number of drops is adjusted in the longitudinal direction of the line of the glue pattern. Further, the step of performing the step of forming the glue pattern is as follows: at least one column of the glue drops are dropped on the line of the glue pattern. The method of performing the step of forming the glue pattern is as follows: in the line of the glue pattern, see the drop of the plurality of glue drops in the line of the inner line of the defined rubber pattern, and the number of the glue drops is different from the glue defined along the edge. The number of drops of glue dripping outside the pattern. Here, the diameter of the glue droplet dropped along the inner line defining the rubber pattern is 1/2 or less of the line width of the rubber pattern to be formed. The method further comprises the step of continuously discharging the glue from the nozzle to the substrate in a linear coating manner when the relative positions of the substrate and the nozzle are changed, thereby forming a glue pattern. 〇
G 根據本發明另-方面’提供1具有·膠塗佈方法形 成之膠圖案之基板’膠塗佈方法包含當改變基板及喷嘴之相 對位置時’賴塗佈方式依預定間_喷雜滴到基板 之步驟。 彼此不同。 於此,膠圖案之内線及/或外線為具有預定節距之波 形’其中沿内線或外線之波形的節距,沿著賴案線之縱向 為不相同,以及沿内線之波形的節距與沿外線之波形的節距 2 :在:圖案之直線段内,沿膠圖案之内線連接波形 i 一直線’以及在膠圖案之曲線段内,沿膠圖 案之内線連接波形之峰點的線,為具有預定曲率之曲線。 心如ί所述’根據本翻之·佈方法,㈣塗佈方式塗 應。 保膠__區含有預定量液晶之效 【實施方式】 現將參考伴隨圖式 例。可能ΜΥh m a斤 例,坪細顯示本發明較佳實施 此—㈣參考符號用於圖式說日种以表示及相同 7 201043341 或類似的部分。 首先 語。 參考圓3至圖5 ’定義用於贿本發明架構之用 於圖3中’形成於基板s之膠圖案p大約 :線他==圖案p的線L表示界定膠圖案P形狀 二L 表示線[的寬度,膝圖案p的線 Ο 〇 壤寬方L矣不/…線乙沿著延伸的方向,以及膠圖案p的 ====方向。再一 矣干預寬度其中膠圖案p之内線L1 矣二、P之内部形狀的線,以及膠圖案p之外線 痄wl二膠圖案P外部形狀的線。因此,膠圖案p的寬 p又的封閉f 及外線L2間的間隔所決定。再者,朦圖案 的封閉£ A表示由内線u界定的區域。卵案p的中線 P之線圖案P之寬度W中心的線,且平行於勝圖案 的縱向°於膠圖案P的整個形狀中,線L的直線段 一、7F、” L以線性形式延伸的區段,以及線^的曲線段肚 表不以具有預定曲率之曲線形式延伸的線段。 於圖t膠圖案p的截面積a示於 垂直方向切割時得到的膠面積。 圃案線 塗佈到終點EP,以形成朦圖案 P的連接點CP表示起點SP與 於圖5中,膠從起點sp P於基板S上’其中膠圖案 終點EP碰到的點。 201043341 現參考圖6及圖7說明根據本發明之塗膠機。 裝設基ξ s m機基框1〇、固定於基框10且供 一對線性運動莫4丨杜、叹於平台30之γ軸方向相對側的 ΟG According to another aspect of the present invention, a substrate coating method for providing a gel pattern formed by a gel coating method includes: when changing the relative positions of the substrate and the nozzle, the coating method is performed by a predetermined amount. The steps of the substrate. Different from each other. Here, the inner line and/or the outer line of the glue pattern is a waveform having a predetermined pitch, wherein the pitch of the waveform along the inner or outer line is different along the longitudinal direction of the line, and the pitch of the waveform along the inner line is The pitch 2 of the waveform along the outer line: in the straight line segment of the pattern, the waveform i is connected along the inner line of the glue pattern and the line connecting the peaks of the waveform along the inner line of the glue pattern in the curved section of the glue pattern is A curve having a predetermined curvature. The heart is as described in the 'By the cloth method, (4) the coating method. The protective __ area contains a predetermined amount of liquid crystal. [Embodiment] Reference will now be made to the accompanying drawings. It is possible to exemplify the preferred embodiment of the present invention. The reference symbols are used in the drawings to indicate the same as the same 7 201043341 or the like. First language. Reference circle 3 to FIG. 5 'defines the glue pattern p formed in the substrate s in FIG. 3 for the structure of the invention. The line L representing the line == pattern p indicates the shape of the glue pattern P and the shape of the L line. [The width, the line of the knee pattern p 〇 宽 宽 wide L 矣 not / ... line B along the direction of extension, and the direction of the rubber pattern p ====. Further, the line of the inner shape of the inner line L1 、2, P of the glue pattern p, and the line of the outer shape of the line 痄wl two-ply pattern P outside the glue pattern p are intervened. Therefore, the width p of the glue pattern p is determined by the interval between the closed f and the outer line L2. Furthermore, the closure of the 朦 pattern £ A represents the area defined by the inner line u. The line of the center line P of the egg p is the line W of the width W, and parallel to the longitudinal direction of the winning pattern. In the entire shape of the glue pattern P, the straight line of the line L, 7F, "L extends in a linear form. The section of the curve, and the curved section of the line ^ does not extend in the form of a curve having a predetermined curvature. The sectional area a of the glue pattern p in Fig. 2 shows the area of the glue obtained when cutting in the vertical direction. The connection point CP to the end point EP to form the 朦 pattern P represents the starting point SP and the point at which the glue hits the starting point sp P on the substrate S where the glue pattern end point EP meets. 201043341 Reference is now made to Figs. 6 and 7 The glue applicator according to the present invention is described. The base frame of the sm machine is mounted on the base frame 10 and is provided for a pair of linear motions, and the squats on the opposite sides of the y-axis direction of the platform 30.
動# 之騎的蝴未顯示)。 基框10可包含第一驅動器(未顯示),其前 υ袖方 側H30於基框10上,而頭支樓件5〇可包含在相對 其沿雜運動導料4。之縱向驅動頭 御,㈣形^=^=_多個頭支 。。於圖7中’頭單元6G可包含填充膠之注射器61、與注 射器61相通以排出膠之喷嘴62、設置鄰近於喷嘴泣以量 測噴嘴62及基板S間之間隙距離之雷射距離感測器纪、驅 動喷嘴62及雷射距離感測器63於γ轴方向之γ轴驅動器 64、以及驅動喷嘴62及雷射距離感測器纪於冗軸方向之z 軸驅動器65。 ° 雷射距離感測器63包含雷射發射元件631及雷射接收 元件632,其與雷射發射元件631相隔預定距離,:接收由 基板S反射的雷射,並傳送對應反射雷射的谓測位置之電訊 號到控制器,藉此量測基板S及喷嘴62間之間隙資料。 9 201043341 再者,頭單元60可包含面積偵測感測器66,用於量測 塗佈於基板S上之膠圖案p之截面積A1。面積偵測感測器 66連續地發射雷射到基板s以及掃描膠圖案p,來量測膠圖 案P之截面積A1。膠圖案p之截面積A1的資料用於決定 膠圖案P中缺在的存在。 現參考圖8至圖13說明根據本發明第一實施例,利用 塗膠機形成膠圖案之膠塗佈方法。 〇 ❹ 如圖8及圖9所示,膠塗佈方法包含裝設基板s於平台 30上,將喷嘴62定位成與基板S相隔預定距離,以及當^ 變基板S及喷嘴62間之相對位置時,以點塗佈方式,依預 定間隔在膠圖案P之線L的縱向,從喷嘴62滴落膠滴pD 至基板S,藉此形成膠圖案P。 為了滴落膠滴PD’可提供用於控制從噴嘴62排出膠之 壓力控制裝置’以及可提供例如壓電感測器之開/關裝置於 喷嘴62。 ' 像這樣’利用點塗佈方法透過喷嘴62滴落的膠滴pd, 由於自身的黏性及表面張力’可與已經滴落於基板s上之其 他膠滴PD結合,藉此形成連續膠圖案p於基板s上。 同時,滴落的膠滴PD間之間隔G可對應於與外圍接觸 之相鄰膠滴PD間的距離如圖1〇所示,對應於在外圍重最 之相鄰膠滴PD間的距離如圖n所示,或對應於彼此相2 小間隙I之相鄰膠滴PD間的距離如圖12所示。 201043341 然而,間隔G不限於上述如圖10至圖12提供的間隔, 也可根據設計因素如基板S與嘴嘴62間之距離、膠滴pD 碰撞基板S的碰撞力、膠滴PD的黏性及表面張力、若基板 S接合在一起時’接合基板S間的接合力或距離、或類似^, 而設定為其他的值。 如圖13所示,利用根據本發明第一實施例之膠塗佈方 法形成於基板s之膠圖案p,可為具有内線L1及外線L2 之波形,其沿膠圖案P之線L縱向具有預定尺寸之節距ρτ。 於此’膠圖案Ρ之内線L1或外線L2之個別節距ΡΤ,沿膠 圖案P之線L縱向可為固定的。再者,膠圖案p之内線u 或外線L2之個別波形可基於膠圖案P的中線cl為彼此對 稱的。 不像習知線性塗佈方法需要第一及第二要求距離D1及 D2 ’執行根據本發明第一實施例之膠塗佈方法,而使膠滴 PD以點塗佈方式透過喷嘴62滴落到基板s上,具有避免習 Ο 知線性塗佈方法可能發生讓膠圖案ρ之線寬w變成缺陷的 效應’並確保膠圖案P之封閉區A中的液晶量對應預定液 晶量。 於後,參考圖14至圖19說明根據第二實施例之膠塗佈 方法’其中類似的參考符號用於表示與第一實施例類似的部 - 分’而省略其細節。 如圖14及圖15所示,執行根據第二實施例之膠塗佈方 法’使得在膠圖案P之區段改變膠滴PD的量時,滴落膠滴 11 201043341 PD到基板S上,藉此形成膠圖案p於基板s上。The jump of the ## ride is not shown). The base frame 10 can include a first actuator (not shown) with a front side of the sleeve side H30 on the base frame 10, and a head support member 5A can be included in the opposite movement guide 4. The longitudinal drive head, (four) shape ^ = ^ = _ multiple head support. . In FIG. 7, the head unit 6G may include a syringe 61 filled with glue, a nozzle 62 communicating with the syringe 61 to discharge the glue, and a laser distance sensing disposed adjacent to the nozzle to measure the gap distance between the nozzle 62 and the substrate S. The y-axis driver 64 in the γ-axis direction of the device, the driving nozzle 62 and the laser distance sensor 63, and the z-axis driver 65 that drives the nozzle 62 and the laser distance sensor in the redundant axis direction. The laser distance sensor 63 includes a laser emitting element 631 and a laser receiving element 632 spaced apart from the laser emitting element 631 by a predetermined distance: receiving a laser reflected by the substrate S and transmitting a corresponding reflected laser The position of the electrical signal is measured to the controller, thereby measuring the gap between the substrate S and the nozzle 62. 9 201043341 Furthermore, the head unit 60 may include an area detecting sensor 66 for measuring the sectional area A1 of the glue pattern p applied on the substrate S. The area detecting sensor 66 continuously emits a laser to the substrate s and the scanning glue pattern p to measure the sectional area A1 of the adhesive pattern P. The data of the cross-sectional area A1 of the glue pattern p is used to determine the absence of the glue pattern P. A glue coating method for forming a glue pattern by a glue applicator according to a first embodiment of the present invention will now be described with reference to Figs. As shown in FIGS. 8 and 9, the glue coating method includes mounting the substrate s on the stage 30, positioning the nozzle 62 at a predetermined distance from the substrate S, and the relative position between the substrate S and the nozzle 62. At this time, in the longitudinal direction of the line L of the glue pattern P at a predetermined interval, the glue drops pD are dropped from the nozzle 62 to the substrate S, thereby forming the glue pattern P. In order to drip the glue drops PD', a pressure control means for controlling the discharge of the glue from the nozzle 62 can be provided, and an opening/closing means such as a pressure sensor can be provided to the nozzle 62. The glue pd which is dropped through the nozzle 62 by the dot coating method can be combined with other glue drops PD which have been dropped on the substrate s due to its own viscosity and surface tension, thereby forming a continuous rubber pattern. p on the substrate s. Meanwhile, the interval G between the dropped glue drops PD may correspond to the distance between the adjacent glue drops PD contacting the periphery as shown in FIG. 1A, corresponding to the distance between the adjacent glue drops PD at the periphery. The distance between adjacent glue drops PD shown in Fig. n or corresponding to each other with a small gap I is as shown in Fig. 12. 201043341 However, the interval G is not limited to the interval as shown in FIGS. 10 to 12 described above, and may be based on design factors such as the distance between the substrate S and the nozzle 62, the collision force of the glue pD colliding with the substrate S, and the viscosity of the glue PD PD. And the surface tension, if the substrate S is joined together, 'the bonding force or distance between the bonding substrates S, or the like, is set to other values. As shown in FIG. 13, the glue pattern p formed on the substrate s by the glue coating method according to the first embodiment of the present invention may be a waveform having an inner line L1 and an outer line L2, which has a predetermined longitudinal direction along the line L of the glue pattern P. The pitch of the dimensions ρτ. The individual pitch ΡΤ of the inner line L1 or the outer line L2 of the glue pattern ΡΤ can be fixed longitudinally along the line L of the glue pattern P. Further, the individual waveforms of the inner line u or the outer line L2 of the glue pattern p may be symmetrical with each other based on the center line cl of the glue pattern P. Unlike the conventional linear coating method, which requires the first and second required distances D1 and D2' to perform the glue application method according to the first embodiment of the present invention, the glue droplet PD is dropped through the nozzle 62 in a dot coating manner. On the substrate s, it is possible to avoid the effect that the linear coating method may cause the line width w of the glue pattern ρ to become a defect' and ensure that the amount of liquid crystal in the closed region A of the paste pattern P corresponds to a predetermined liquid crystal amount. Hereinafter, a glue coating method according to the second embodiment will be described with reference to Figs. 14 to 19, wherein like reference numerals are used to refer to the like parts of the first embodiment, and the details thereof are omitted. As shown in FIG. 14 and FIG. 15, the glue application method according to the second embodiment is performed such that when the amount of the glue drops PD is changed in the section of the glue pattern P, the glue drops 11 201043341 PD are dropped onto the substrate S, This forms a glue pattern p on the substrate s.
亦即’如圖14所示,為了在特定區段更精確地調節膠 圖案P之線寬W ’可沿著膠圖案p之線L縱向控制滴落的 膠滴量時’滴落膠滴(PD : PD1及ρ〇2)。舉例而言,在膠圖 案=起點SP及終點EP相遇之連接點cp滴落的膠滴pD2 的量’可比滴落在連接點cp外之區段的膠滴pm的量還 小。於此案例,具有較小量之相鄰膠滴pD2間的間隔G2可 比具有較大量之相鄰膠滴PD1間之間隔G1還小。 *像适樣’沿著膠圖案!>之線L縱向調節滴落的膠滴量時 滴落膠滴PD ’可更精確地調節膠圖案P之線寬W尺寸。然 ,’本發明不p〖於上述架構,也可根據設計條件建構成使滴 落在膠圖案P之連接點CP的膝滴PD量比滴落在連接點CP 外之膠滴PD量還大,以及使具有較小量之相鄰膠滴PD2間 的間隔G2可比具有較大量之相鄰膠滴PD1間之間隔G1還That is, as shown in FIG. 14, in order to more precisely adjust the line width W' of the glue pattern P in a specific section, the amount of dripping glue can be controlled longitudinally along the line L of the glue pattern p. PD : PD1 and ρ〇2). For example, the amount of the glue drops pD2 dropped at the joint point cp at which the glue pattern = the start point SP and the end point EP meet may be smaller than the amount of the glue droplet pm dropped in the section outside the joint point cp. In this case, the interval G2 between the adjacent droplets pD2 having a smaller amount may be smaller than the interval G1 between the adjacent droplets PD1 having a larger amount. *Like the appropriate kind ‘ along the glue pattern! When the line L of the > longitudinally adjusts the amount of dripping drops, the drip drop PD' can more precisely adjust the line width W size of the glue pattern P. However, the present invention is not constructed according to the above-mentioned structure, and may be constructed according to design conditions so that the amount of PD droplets dripping at the connection point CP of the glue pattern P is larger than the amount of glue PD dropping outside the connection point CP. And the spacing G2 between the adjacent droplets PD2 having a smaller amount can be made more than the interval G1 between the adjacent droplets PD1 having a larger amount
於另一範例,如圖15所示,為了沿曲線段RL及直線 段更精確地調節膠圖案P之個別線寬W❸尺寸,滴落於 曲線段虹及直線段SL的個別膠滴PD可滴落有不同量。 舉例而言,滴落在曲線段RL之膠滴PD2的量可比滴落 f直線段SL之膠滴pm的量還小。於此案例,滴落在曲線 段RL之相鄰膠滴pD2間的間隔G2可比滴落在 之相鄰膠滴的間隔還小。 、!又 12 201043341 然而’本發明不限於上述架構,也可根據設計條件建構 成使滴落在曲線段RL之膠滴PD2的量可比滴落在直線段 SL之膝滴PD1的量還大。再者,滴落在曲線段RL之相鄰 膠滴PD2間關隔G2可比滴落在直線段%之相鄰膠滴 PD1的間隔還寬。 如圖16及圖17所示,根據第二實施例之膠塗佈方法, 膠圖案P之線寬W在不同區段可具有不同的尺寸。舉例而 言,膠圖案P之線寬W在連接點CP以外的區段可為寬度 W1,在連接點CP則為W2。再者,膠圖案p之内線L1或 外線L2之個別波形的節距ρτ,在膠圖案p不同的區段可以 不同。舉例而言,在膠圖案P之連接點cp、曲線段虹、及 直線段SL,膠圖案p之内線li或外線L2之個別波形的節 距PT、PT1、及PT2可分別具有不同的尺寸。雖然圖16顯 示在膠圖案P之連接點CP的線寬W2及節距PT2,比除了 連接點cp外的其他區段的線寬W1及節距PT1還小,但是 本發明不限於此,連接點CP的線寬W及節距PT,可以比 Ο 除了連接點cp外的其他區段還寬。類似地,雖然圖π顯 示在膠圖案P之曲線段RL的線寬W2及PT2比直線段SL 的線寬W1及PT1還小,但是本發明不限於此,在曲線段 RL的線寬W及/或PT可以比直線段SL還寬。 同時’如圖16及圖17所示’沿膠圖案p之直線段sl • 中的内線L1的波形峰點PP繪示的線L3,較佳變成直線, 而沿膠圖案P之曲線段RL中的内線]^的波形峰點pp繪示 的線L4,較佳變成具有預定曲率的曲線,以得到膠圖案p 對應預定液晶量的封閉區A。 13 201043341 像這樣,可藉由控制滴落的膠滴p 線寬w及/或節距PT,而在膠圖 3 = 寸。膠滴PD滴落量的控制的執行,可利具有不门的^ 滴落的朦滴PD尺寸之方法,如圖 變從喷嘴 ..8所不,或控制在相同 位置滴洛具有相同尺寸之膠滴數之方法,如圖19所示。 由於滴綠控制方法僅需要控制喷嘴62的位置,而 控制膠滴PD的尺寸,所以具有容許以較 圖案P之線寬W及/或節距PT的效應。 '膠In another example, as shown in FIG. 15, in order to more precisely adjust the individual line width W❸ size of the glue pattern P along the curved section RL and the straight line segment, the individual glue drops PD falling on the curved section rainbow and the straight line segment SL may be dripped. There are different amounts. For example, the amount of the glue drop PD2 dripping in the curved line segment RL may be smaller than the amount of the glue drop pm of the drop line straight line SL. In this case, the interval G2 between adjacent glue drops pD2 of the curve segment RL may be smaller than the interval between adjacent glue drops. ,! Further, 12 201043341 However, the present invention is not limited to the above-described structure, and may be constructed according to design conditions such that the amount of the glue droplet PD2 dripping on the curved segment RL may be larger than the amount of the drop PD1 dripping on the straight line segment SL. Further, the gap G2 between the adjacent droplets PD2 dropped in the curved line RL may be wider than the interval between the adjacent droplets PD1 of the straight line segment %. As shown in Figs. 16 and 17, according to the glue applying method of the second embodiment, the line width W of the glue pattern P may have different sizes in different sections. For example, the line width W of the glue pattern P may be a width W1 in a section other than the connection point CP, and W2 in the connection point CP. Further, the pitch ρτ of the individual waveforms of the inner line L1 or the outer line L2 of the glue pattern p may be different in the section in which the glue pattern p is different. For example, at the connection point cp of the glue pattern P, the curved segment rainbow, and the straight line segment SL, the pitches PT, PT1, and PT2 of the individual waveforms of the inner line li or the outer line L2 of the glue pattern p may have different sizes, respectively. Although FIG. 16 shows that the line width W2 and the pitch PT2 at the connection point CP of the glue pattern P are smaller than the line width W1 and the pitch PT1 of the other sections except the connection point cp, the present invention is not limited thereto, and the connection is not limited thereto. The line width W and the pitch PT of the point CP can be wider than the other sections except the connection point cp. Similarly, although the graph π shows that the line widths W2 and PT2 of the curved section RL of the glue pattern P are smaller than the line widths W1 and PT1 of the straight line segment SL, the present invention is not limited thereto, and the line width W of the curved section RL and / or PT can be wider than the straight line SL. At the same time, as shown in FIG. 16 and FIG. 17, the line L3 of the waveform peak point PP of the inner line L1 in the straight line segment sl of the glue pattern p is preferably a straight line, and the curve segment RL along the glue pattern P The line L4 of the waveform peak point pp of the inner line is preferably a curve having a predetermined curvature to obtain a closed area A in which the glue pattern p corresponds to a predetermined liquid crystal amount. 13 201043341 In this way, by controlling the drip drop p line width w and / or pitch PT, in the rubber map 3 = inch. The execution of the control of the drop amount of the glue drop PD can be used to control the drop size of the drip drop PD size, as shown in the figure from the nozzle No. 8 or not, or controlled at the same position, the drop size has the same size The method of the number of glue drops is shown in FIG. Since the drip control method only needs to control the position of the nozzle 62 and control the size of the glue droplet PD, it has an effect of allowing the line width W and/or the pitch PT of the pattern P to be. 'gum
根據第二實施例之膠塗佈方法,膠圖案ρ的線寬界及/ 或膠圖案Ρ之内線L1或外線L2之個別波形的節距ρτ,在 不同區段的尺寸不同,例如在膠圖案ρ之連接點cp、曲線 段RL、或直線段SL,藉此以更精確的方式控制膠圖案p含 有預定液晶量之封閉區A。 μ 於後,參考圖20至圖28,說明根據第三實施例之膠塗 佈方法,其中類似的參考符號用以表示與第一及第二實施例 之類似部分’而省略其詳細說明。 如圖20至圖22所示,執行根據第三實施例之膠塗佈方 法’而於膠圖案Ρ之寬度方向,滴落複數列的膠滴PD於基 板S上,藉此形成膠圖案ρ於基板S上。 雖然圖20至圖22顯示在膠圖案Ρ之寬度方向滴落兩列 的膠滴PD ’但是本發明不限於此,在膠圖案Ρ之寬度方向 可滴落兩列或更多列的膠滴PD。 14 201043341 同時’為了得到滴落多列的膠滴PD,可架構成使喷嘴 62或基板S移動於膠圖案Ρ的寬度方向。 Ο ο 沿膠圖案Ρ之線L的縱向及寬度方向滴落膠滴pD的方 法’可用以下兩個方式實行。第一,如圖20所示,沿膠圖 案Ρ之線的縱向及寬度方向滴落多列的膠滴PD,而使水平 及垂直滴落的相鄰膠滴PD的滴落中心DP間緣示的個別 線,平行於膠圖案P之線L之縱向及寬度方向。第二,如圖 21所示,沿膠圖案線的縱向及寬度方向滴落多列的膠滴 PD ’而使水平滴洛的相鄰膠滴PD的滴落中心dp間缘示的 線’平行於膠圖案P之線L之縱向,而垂直滴落的相鄰膠滴 PD的滴落中心DP間繪示的線,是以預定角度相對於膠圖 案P之線L的寬度方向傾斜。如圖23所示,於利用圖2〇 之滴落方法得到膠圖案P中,沿膠圖案ρ之内線u及外線 的個別波形’以卵案P的中線CL為基準彼此對稱。然而, 如圖24所示,於利用圖21之滴落方法得到膠圖案ρ中沿 膠圖案P之内線L1及外線的侧波形,基於卵案p的中 線CL為彼此研稱的。此_落方法可根據設計條件修改。 根據第三實施例之膠塗佈方法,由於沿膠圖案ρ之寬产 方向滴落複數列的膠滴PD,相較於沿膠圖案p之 二 滴落單-列膠滴PD的習知方法,降低了膠滴pD的滴又落量, 姚調節沿膠圖案p之内線u及外線u之波形 的即 因而更精確地控制膠圖案P的封閉區A。 2時’如圖22所示,沿膠圖案ρ之寬度 列的膠滴PD時,可佑攄夂别曰 同洛设數 了依據各列滴洛不同罝尺寸之膠滴PD。 15 201043341 形成具有預定液晶量之液晶層時,膠圖案ρ的 Α變成重要的因子。然後,由於膠圖案ρ的封閉區α = 内線U來界定,所以較佳使沿内線!之波形3 。因此,沿膠圖案P之寬度方向滴落複數列膠滴 二,中’滴落成線而具有沿内㈣之列之膠滴= ^洛1 ’較佳比滴落成線而具有沿 [2According to the glue application method of the second embodiment, the line width of the glue pattern ρ and/or the pitch ρτ of the individual waveforms of the inner line L1 or the outer line L2 of the glue pattern 不同 are different in different sections, for example, in a rubber pattern. The connection point cp of ρ, the curved line segment RL, or the straight line segment SL, thereby controlling the closed region A of the glue pattern p containing a predetermined liquid crystal amount in a more precise manner. Hereinafter, a method of applying a glue according to a third embodiment will be described with reference to Figs. 20 to 28, wherein like reference numerals are used to indicate like parts of the first and second embodiments, and a detailed description thereof will be omitted. As shown in FIG. 20 to FIG. 22, the glue coating method according to the third embodiment is performed, and in the width direction of the glue pattern ,, a plurality of droplets PD of the plurality of columns are dropped on the substrate S, thereby forming a glue pattern ρ. On the substrate S. Although FIGS. 20 to 22 show that two rows of the glue drops PD' are dropped in the width direction of the glue pattern 但是, the present invention is not limited thereto, and two or more columns of glue drops PD may be dropped in the width direction of the glue pattern Ρ. . 14 201043341 At the same time, in order to obtain the droplets PD of the plurality of rows, the frame 62 or the substrate S is moved in the width direction of the glue pattern 。. ο ο The method of dropping the glue drop pD in the longitudinal direction and the width direction of the line L of the glue pattern can be carried out in the following two ways. First, as shown in FIG. 20, a plurality of rows of glue drops PD are dropped in the longitudinal direction and the width direction of the line of the glue pattern, and the center of the drop DP of the adjacent glue drops PD which are horizontally and vertically dropped is shown. The individual lines are parallel to the longitudinal and width directions of the line L of the glue pattern P. Second, as shown in FIG. 21, a plurality of rows of glue drops PD' are dropped along the longitudinal direction and the width direction of the glue pattern line, so that the line 'parallel' shown by the edge of the drop center dp of the adjacent drop PD of the horizontal drop In the longitudinal direction of the line L of the glue pattern P, the line drawn between the dripping centers DP of the adjacent drops PD vertically dropped is inclined at a predetermined angle with respect to the width direction of the line L of the glue pattern P. As shown in Fig. 23, in the glue pattern P obtained by the dropping method of Fig. 2, the individual waveforms ' along the inner line u and the outer line along the glue pattern ρ are symmetrical with each other based on the center line CL of the egg case P. However, as shown in Fig. 24, the side waveforms along the inner line L1 and the outer line of the glue pattern P in the glue pattern ρ are obtained by the dropping method of Fig. 21, and the center line CL based on the egg case p is referred to as each other. This _ drop method can be modified according to design conditions. According to the glue application method of the third embodiment, since the plurality of droplets PD are dropped in the wide direction of the glue pattern ρ, a conventional method of dropping the single-column droplets PD along the two of the glue patterns p The drop amount of the glue drop pD is reduced, and Yao adjusts the waveform of the inner line u and the outer line u along the glue pattern p to thereby more precisely control the closed area A of the glue pattern P. At 2 o', as shown in Fig. 22, when the glue drops PD along the width of the glue pattern ρ, it is possible to designate the glue drops PD according to the different sizes of each column. 15 201043341 When a liquid crystal layer having a predetermined liquid crystal amount is formed, the enthalpy of the glue pattern ρ becomes an important factor. Then, since the closed region α = the inner line U of the glue pattern ρ is defined, it is preferable to make the waveform 3 along the inner line! Therefore, a plurality of colloidal droplets 2 are dropped in the width direction of the rubber pattern P, and the droplets which are dropped into a line and have a row along the inner (four) = ^ Luo 1 ' are preferably smaller than the drops and have a line along the [2
Df量還小。於此案例中,如圖25所示,;; Ο 〇 之之波形的節距PT4可比沿膠圖案P之外線U 2形的⑽PT3還窄。再者,相較於沿賴案p 落單列膠滴PD之方法,沿膠圖案P之_ U “ Π距m 一可較小。同時,沿膠圖案P之内線u滴落= ) 之直徑,為欲形成之膠圖案P之線寬W的1/2或更 少’較佳為1/4或更少。 4尺 本發明不限於上述方法,也可使用祕成線而具 t,L2之列之勝滴pm _落#, 之列之膠滴PD4的滴落量還小之方法。如前所 二滴落的膠滴PD量可利用控制從喷嘴62滴落之膝滴犯 且女Γ方絲鋪(參見圖18)’或_控繼落在相同位置 一有相同尺寸之膠滴PD數之方法來控制(參見圖19)。 心=圖26所示之方式沿卵案p之寬度方向滴落複數 J的膠滴PD,在方向㈤上沿膠圖案p之線L之縱向及寬 1方向父替地滴落黟滴PD,即成鑛齒圖案,或如圖27及 $絲斤示在方向(92及93)上沿踢圖案p之線L的縱向,然 <回到縱向’連續地滴落膠滴PD, 方向與已滴落的膠滴_目隔預定距離。累的寬义 16 201043341 如圖27所示,可沿膠圖案p之外線L2 ’然後沿膠圖案 P之内線L1 ’滴落膠滴PD。然而,由於内線L1是決定膠 圖案P之封閉區A的重要因子,較佳沿形成内線L1之列滴 落膠滴PD,藉此決定内線L1為參考線,然後沿形成膠圖案 之外線L2的列滴落。具體而言’若沿膠圖案P之内線L1 滴落之膠滴PD4的量,比沿膠圖案P之外線L2滴落之膠滴 PD3的量還小’如圖22所示,則較佳首先沿膠圖案P之内 線L1滴落膠滴PD,因為沿内線L1之膠滴PD先決定内線 U,然後導引沿外線L2滴落膠滴pd。 〇 於後,將參考圖29至圖32說明根據第四實施例之膠塗 佈方法,其中類似參考符號表示與第一至第三實施例之類似 部分,而省略其詳細說明。 如圖29及圖30所示’執行根據第四實施例之膠塗佈方 法’而使膠滴PD以線性塗佈方式(PL)滴落在基板s上,藉 此當基板S及喷嘴62間之相對位置改變時,透過喷嘴62連 〇 續地排出膠,並結合點塗佈方式,藉此形成膠圖案p於基板 上0 舉例而言,如圖29所示’膠圖案P可形成為使得在連 接點CP以點塗佈方式滴落膠滴,而在連接點外的位 置以線性塗佈方式PL塗佈谬。於此案例,如圖Μ所示,在 膠圖案P之連接點CP的内線u或外線L2 =之_。因此,在膠圖案。之線寬w通常;=2 二膠==二’以點塗佈方式塗佈膠,藉此 '、之線見务生缺陷’在其他位置以線性塗佈方 17 201043341 式PL塗佈膠,藉此降低形成膠圖案卩的時間。同時,本發 明不限於上述方式,而可採用其他方式,其中連接點cp實 施線性塗佈方式,且在其他部分實施點塗佈方式,藉此形成 膠圖案P。 Ο ❹ 於另一範例中’如圖30所示,膠圖案p可形成於基板 S上,而使得在谬圖案之直線段SL以線性塗佈方式扎塗佈 膠以及在膠圖案P之曲線段虹以點塗佈方式滴落膠滴 PD。於此案例中,如圖η所示,在曲線段此之膠圖案p 的内線L1或外線L2,形成為具有預定節距ρτ的波形。同 時,本發明不限於此,而可採用其他方法’其中在直線段 SL實施點塗佈方式,以及在曲線段虹實施線性塗佈方法。 像這樣’結合點塗佈方法及線性塗佈方法,使得卵案ρ在 短時間形成,且利用點塗佈方法形成的膠圖案ρ降低 圖案Ρ之線寬W常發生缺關部分的缺陷發生^ ^ ^另-範例中,如圖33及圖34所示,若__ ρ 列的膠,則膠可以下述方式塗佈於基板S上, 列以點塗佈方式實施,而在其他列以線性塗佈 方式實施’藉此形成膠圖案ρ。 怖 如圖33所不,為了精確地控制 形成膠圖案P之内線L1之列可利用二== 成膠圖案P之外線L2之列可利用綠柯 、:而形 案例中,如圖34所示,膠圖案p之内線u 。於此 定節距PT之波形,而膠圖案p 蝻β二為具有預 式。然而,本發明不限於此,'% 2可形成為線性形 匕而可採用其他方法,可藉由將 201043341 形成賴案P之内線L1之列_線性塗佈方式塗佈而形 成膠圖案P之外線L2之列可_點塗佈方式塗佈,其中膠 圖案P之外線L2可域為具有預定節距ρτ之波形,而膠 圖案Ρ之内線L1可形成為線性形式。 如前所述,㈣本㈣之膠_方法,使得以點塗 佈方式塗佈膠滴Π)到基板上,藉此形成膠圖案ρ,而避免 缺陷’例如膠圖案Ρ之線寬W短路及故障,以及確保膠圖 案Ρ之封閉區Α具有預定量的液晶。 雖然已針對例示目的說明本發明較佳實施例,但是熟此 技藝者應理解在不悖離本發騎时請專城圍之精神與 範下,可有各種修改、添加、及替換。 【圖式簡單說明】 本發明上述及其他的目的、雜、以及優點結合伴隨 圖式與詳細說明將更易了解,其中: 圖1為顯示根據習知膠塗佈方法開始塗佈膠於基板之 連續狀態圖; 圖2為顯讀據習知膠塗佈方法終止塗佈膠於基板之 連續狀態圖; 圖3為顯7F形成於基板上之卵案之平面圖; 圖4為沿圖3之IV-IV線之截面圖; 圖5為顯示塗佈方向範例之示意圖,其中膠沿此方向塗 佈以形成膠圖案於基板上; 圖6為顯示根據本發明之塗膠機之透視圖; 19 201043341 圖7為顯示圖6之塗賴之頭單元之透視圖; 圖8乃圓 、 、 及圖9為顯示利用本發明第一實施例之膠塗佈方 、以點塗佈枝從雜機n聽膠制基板之示 意圖; 圖10至圖12為根據第一實施例之膠塗佈方法,沿膠圖 …'之縱向觸滴落間隔時滴落膠滴之狀態示意圖;The amount of Df is still small. In this case, as shown in Fig. 25, the pitch PT4 of the waveform of Ο 可 may be narrower than the (10) PT3 of the line U 2 shape along the glue pattern P. Furthermore, compared to the method of dropping a single drop of PD along the substrate p, the Π U " Π distance m along the glue pattern P may be smaller. Meanwhile, the diameter along the inner line u of the glue pattern P drops =), 1/2 or less of the line width W of the rubber pattern P to be formed is preferably 1/4 or less. 4 feet The present invention is not limited to the above method, and a secret line may be used instead of t, L2 The column of the victory drops pm _ falling #, the drop of the drop of PD4 is still small. As the previous drop of the amount of drip PD can be controlled by the drop from the nozzle 62 to the knee and the son-in-law The square wire shop (see Fig. 18)' or _ control is controlled by the method of dropping the PD number of the same size at the same position (see Fig. 19). Heart = the manner shown in Fig. 26 along the width of the egg case p Drop the PD of the complex number J in the direction, and in the direction (5), the longitudinal direction of the line L of the glue pattern p and the width 1 direction of the parent drop the PD, that is, the ore pattern, or as shown in Fig. 27 and Shown in the direction (92 and 93) along the longitudinal direction of the line L of the kick pattern p, then <back to the longitudinal direction' continuously drops the drop PD, the direction is separated from the dripped drop by a predetermined distance. Kuanyi 16 201043341 As shown in Figure 27, along The line L2' outside the pattern p is then dropped along the inner line L1' of the glue pattern P. However, since the inner line L1 is an important factor determining the closed area A of the glue pattern P, it is preferable to form the glue along the line L1. Dropping PD, thereby determining the inner line L1 as a reference line, and then dropping along the column forming the outer line L2 of the glue pattern. Specifically, 'if the amount of the glue drop PD4 dripping along the inner line L1 of the glue pattern P, the ratio of the glue pattern The amount of the droplets PD3 dropped by the line L2 outside P is still small. As shown in Fig. 22, it is preferable to first drop the droplet PD along the inner line L1 of the glue pattern P, because the glue PD along the inner line L1 first determines the inner line U. Then, the glue droplets pd are dripped along the outer line L2. Hereinafter, the glue coating method according to the fourth embodiment will be described with reference to FIGS. 29 to 32, wherein like reference numerals denote the same as the first to third embodiments. The detailed description is omitted, and the detailed description thereof is omitted. As shown in FIG. 29 and FIG. 30, 'the execution of the glue coating method according to the fourth embodiment' causes the droplet PD to drip on the substrate s in a linear coating manner (PL). Thereby, when the relative position between the substrate S and the nozzle 62 is changed, the glue is continuously discharged through the nozzle 62. In combination with the dot coating method, the glue pattern p is formed on the substrate. For example, as shown in FIG. 29, the glue pattern P can be formed such that the glue droplets are dropped by the dot coating method at the connection point CP, and the connection is made. The position outside the dot is coated with ruthenium in a linear coating manner. In this case, as shown in Fig. ,, the inner line u or the outer line L2 of the connection point CP of the glue pattern P is _. Therefore, in the line of the glue pattern. Wide w usually; = 2 di-glue == two's coating the glue in a point coating manner, whereby the 'line of the defect> is applied at other locations by a linear coating method 17 201043341 Reduce the time to form the glue pattern 卩. Meanwhile, the present invention is not limited to the above, and other methods may be employed in which the connection point cp is subjected to a linear coating method, and a dot coating method is performed in other portions, thereby forming a glue pattern P.另一 于 In another example, as shown in FIG. 30, a glue pattern p may be formed on the substrate S such that the straight line SL of the 谬 pattern is applied in a linear coating manner and the curved portion of the glue pattern P The rainbow drops the droplet PD in a spot coating manner. In this case, as shown in Fig. 7, the inner line L1 or the outer line L2 of the glue pattern p in the curved section is formed into a waveform having a predetermined pitch ρτ. Meanwhile, the present invention is not limited thereto, and other methods may be employed, in which a dot coating method is performed in the straight line segment SL, and a linear coating method is performed in the curved portion rainbow. Such a 'bonding point coating method and a linear coating method make the egg ρ formed in a short time, and the glue pattern ρ formed by the dot coating method reduces the line width W of the pattern 常 often occurs in the defect portion of the missing portion ^ ^ ^ another - in the example, as shown in Fig. 33 and Fig. 34, if the glue of __ ρ column, the glue can be applied to the substrate S in the following manner, the column is implemented by spot coating, and in other columns The linear coating method is carried out 'by this to form a glue pattern ρ. As shown in Fig. 33, in order to accurately control the column of the inner line L1 forming the glue pattern P, the line of the outer line L2 of the glue pattern P can be utilized to utilize the green line, in the case of the shape, as shown in Fig. 34. , the inner line u of the glue pattern p. Here, the waveform of the pitch PT is fixed, and the glue pattern p 蝻β2 has a pre-form. However, the present invention is not limited thereto, and '% 2 may be formed into a linear shape and other methods may be employed, and the glue pattern P may be formed by coating the line of the inner line L1 of the 201043341 to the linear coating method. The outer line L2 can be applied in a dot coating manner, wherein the outer line L2 of the glue pattern P can be in a waveform having a predetermined pitch ρτ, and the inner line L1 of the rubber pattern can be formed in a linear form. As described above, (4) the glue of the (4) method is such that the glue drip is applied to the substrate by a dot coating method, thereby forming a glue pattern ρ, thereby avoiding defects such as a line width W of the glue pattern 短路 and The failure, as well as ensuring that the closed area of the glue pattern has a predetermined amount of liquid crystal. Although the preferred embodiment of the present invention has been described in connection with the exemplary embodiments, those skilled in the art will understand that various modifications, additions, and substitutions may be made without departing from the spirit of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, aspects, and advantages of the present invention will become more apparent from the accompanying drawings and the detailed description. Figure 2 is a plan view showing the continuous state of the coating glue on the substrate according to the conventional coating method; Figure 3 is a plan view of the egg formed on the substrate; Figure 4 is the IV- along Figure 3 Figure 5 is a schematic view showing an example of a coating direction in which a glue is applied to form a glue pattern on a substrate; Figure 6 is a perspective view showing a glue applicator according to the present invention; 19 201043341 7 is a perspective view showing the head unit of FIG. 6; FIG. 8 is a circle, and FIG. 9 is a view showing the application of the glue coating side of the first embodiment of the present invention, and the point coating branch is used to listen to the glue from the machine n. FIG. 10 to FIG. 12 are schematic diagrams showing the state of the glue coating method according to the first embodiment, in which the glue drops are dropped along the longitudinal contact of the rubber sheet...
圖13為顯示根據第一實施例之膠塗佈方法形成於基板 上之部分膠圖案之放大圖; ,14及圖15為顯示利用本發明第二實施例之膠塗佈方 法’ A膠圖案線之縱向調節滴落間隔時滴落膠滴之狀態示意 圃, 圖16及圖17為顯示根據第二實施例之塗佈方法形成於 基板上之部分膠圖案之放大圖; ,18及圖19為根據第二實施例之塗佈法,分別顯示兩 種調節膠圖案線寬之方法之示意圖,其藉由調節膠滴尺寸及 所滴落之相同尺寸膠滴之數目; 圖2〇至圖22為顯示根據本發明第三實施例之塗佈方 法’於膠圖案線寬方向滴落複數列膠滴範例之示意圖; 圖23至圖25為顯示根據第三實施例之塗佈方法形成於 基板上之部分膠圖案之放大圖; 圖26至圖28為顯示根據第三實施例之塗佈方法於膠圖 案線寬方向及縱向滴落膠滴之例示方法示意圖; 圖29及圖30為顯示根據第四實施例之塗佈方法形成膠 圖案之例示方法之示意圖,其中結合點塗佈方式及線性塗佈 方式; 20 201043341 圖31至圖32為顯示根據第四實施例之塗佈方法形成於 基板上之部分膠圖案之放大圖; 圖33為顯示根據第四實施例之另—膠塗佈方法範 不意圖;以及 一塗佈方法形成於基 圖34為顯示根據第四實施例之另 板上之部分膠圖案之放大圖。 【主要元件符號說明】 Ο 10基框 30平台 40線性運動導引件 50頭支撐件 59第二驅動器 60頭單元 61注射器 62喷嘴 〇 620喷嘴 63雷射距離感測器 631雷射發射元件 632雷射接收元件 64 Y軸驅動器 65 Z軸驅動器 66面積偵測感測器 70 X軸驅動器 91方向 201043341 92方向 93方向 A封閉區 A1截面積 CL中線 CP連接點 D1第一要求距離 D2第二要求距離 O DP滴落中心 EP終點 G間隔 . G1間隔 G2間隔 I間隙 L膠圖案線 L1内線 ◎ L2外線 L3線 L4線 P膠圖案 PD膠滴 PD1膠滴 PD2膠滴 PD3膠滴 22 201043341 PD4膠滴 PL線性塗佈方式 PP波形峰點 PT節距 PT1節距 PT2節距 RL曲線段 S基板 O SL直線段 SP起點 W線寬 W1寬度 W2寬度Figure 13 is an enlarged view showing a part of the glue pattern formed on the substrate by the glue application method according to the first embodiment; and 14 and Figure 15 are diagrams showing the "A glue pattern line" using the second embodiment of the present invention. FIG. 16 and FIG. 17 are enlarged views showing a part of the glue pattern formed on the substrate according to the coating method according to the second embodiment; FIG. 16 and FIG. 19 are enlarged views of the state in which the droplets are dropped in the longitudinal direction of the drip interval; According to the coating method of the second embodiment, two schematic diagrams of the method for adjusting the line width of the glue pattern are respectively displayed by adjusting the droplet size and the number of the same size droplets dropped; FIG. 2A to FIG. A schematic view showing a coating method according to a third embodiment of the present invention in which a plurality of droplets are dropped in a line width direction of a glue pattern; and FIGS. 23 to 25 are diagrams showing a coating method according to a third embodiment formed on a substrate. FIG. 26 to FIG. 28 are schematic diagrams showing an exemplary method of dropping a droplet on a line width direction and a longitudinal direction of a glue pattern according to a third embodiment; FIG. 29 and FIG. Coating method of the examples A schematic diagram of an exemplary method of forming a glue pattern, wherein a bonding point coating method and a linear coating method are used; 20 201043341 FIGS. 31 to 32 are enlarged views showing a part of the rubber pattern formed on the substrate by the coating method according to the fourth embodiment. Fig. 33 is a view showing a different method of applying a glue according to a fourth embodiment; and a coating method is formed on the base line 34 to show an enlarged view of a part of the glue pattern on the other board according to the fourth embodiment. [Main component symbol description] Ο 10 base frame 30 platform 40 linear motion guide 50 head support 59 second driver 60 head unit 61 syringe 62 nozzle 〇 620 nozzle 63 laser distance sensor 631 laser emission element 632 Lei Shooting receiving component 64 Y-axis driver 65 Z-axis driver 66 area detecting sensor 70 X-axis driver 91 direction 201043341 92 direction 93 direction A closed area A1 cross-sectional area CL midline CP connection point D1 first required distance D2 second requirement Distance O DP drop center EP end point G interval. G1 interval G2 interval I gap L glue pattern line L1 inner line ◎ L2 outer line L3 line L4 line P glue pattern PD glue drop PD1 glue drop PD2 glue drop PD3 glue drop 22 201043341 PD4 glue drop PL linear coating method PP waveform peak point PT pitch PT1 pitch PT2 pitch RL curve segment S substrate O SL straight segment SP starting point W line width W1 width W2 width
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CN114798315A (en) * | 2017-05-25 | 2022-07-29 | 武藏工业株式会社 | Liquid material application device and liquid material application method |
CN108906409B (en) * | 2018-08-23 | 2020-12-22 | 业成科技(成都)有限公司 | Coating device, coating method and bonding method |
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CN109799633B (en) * | 2019-03-21 | 2020-09-01 | 深圳市华星光电技术有限公司 | Conductive adhesive dripping system and conductive adhesive dripping method |
CN110091657A (en) * | 2019-05-27 | 2019-08-06 | 黄其明 | A kind of repeatable mounting painting and calligraphy works draw the edge bonding method and painting and calligraphy pieces of core |
CN112547424A (en) * | 2020-12-03 | 2021-03-26 | 厦门特盈自动化科技股份有限公司 | Full-automatic five-axis dispensing machine |
CN112547423A (en) * | 2020-12-03 | 2021-03-26 | 厦门特盈自动化科技股份有限公司 | Full-automatic micron-sized dispenser |
CN112916311B (en) * | 2021-01-19 | 2022-05-27 | 西安应用光学研究所 | Elastic glue coating device and method for optical window |
KR102674351B1 (en) * | 2022-06-20 | 2024-06-13 | 한국기계연구원 | Hybrid dispensing system and hybrid dispensing method using the same |
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JP4105469B2 (en) * | 2002-04-05 | 2008-06-25 | 芝浦メカトロニクス株式会社 | Adhesive coating apparatus, liquid crystal display panel, liquid crystal display panel manufacturing apparatus and manufacturing method, and substrate bonding apparatus |
JP4690031B2 (en) * | 2004-12-24 | 2011-06-01 | 株式会社アルバック | Spacer forming method and apparatus |
JP2007033589A (en) * | 2005-07-25 | 2007-02-08 | Sony Corp | Manufacturing method for display device, and coating apparatus |
KR100673298B1 (en) * | 2006-05-25 | 2007-01-24 | 주식회사 탑 엔지니어링 | Apparatus and method for generating dispensing pattern data for a paste dispenser |
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2009
- 2009-06-05 KR KR1020090050137A patent/KR20100131314A/en not_active Application Discontinuation
- 2009-12-03 CN CN2009102500542A patent/CN101907805A/en active Pending
- 2009-12-03 TW TW098141306A patent/TWI617361B/en not_active IP Right Cessation
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2010
- 2010-05-28 JP JP2010122671A patent/JP2010279944A/en active Pending
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JP2010279944A (en) | 2010-12-16 |
CN101907805A (en) | 2010-12-08 |
KR20100131314A (en) | 2010-12-15 |
TWI617361B (en) | 2018-03-11 |
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