TW201043341A - Method for dispensing paste and substrate having paste pattern formed thereon by the method - Google Patents

Abstract

A paste application method is provided, wherein the paste is applied in a dot application manner on a substrate, having the effect of ensuring that a quantity of liquid crystal contained in a closed area of a paste pattern corresponds to a predetermined quantity of liquid crystals.

Description

201043341, EMBODIMENT OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention generally relates to a method of applying a glue to a substrate and a substrate having a glue pattern formed by the method. [Prior Art] In general, 'liquid crystal displays (LCDs) are a type of flat panel display (FPD)' and together with plasma display panels (PDPs) or field emission displays (FEDs) become the focus of next generation display devices. For example, a mobile phone or a computer display screen, television or the like has better visibility, lower average power consumption, and lower heating value than displays using cathode ray tubes (CRTs). The liquid crystal display comprises an upper substrate, a lower substrate, and a liquid crystal layer sandwiched between the upper substrate and the lower substrate, wherein the liquid crystal layer is formed by a liquid crystal infusion method and a liquid crystal dropping method. 0 The liquid crystal infusion method is performed in a vacuum chamber, and the upper substrate and the lower substrate are joined together by a sealing material, and the substrate in which the wire mesh m is interposed is placed in the liquid crystal cell, and the chamber is released. In the vacuum state, the liquid crystal can pass through the liquid crystal injection hole to inject the internal space between the substrates by the inner space between the bonding substrates and the bonding of the bonding substrate. The liquid drop method is performed by dropping the liquid crystal on the upper substrate or the lower substrate, and then joining the upper substrate and the lower substrate together. Because it is not in the step of = hole, do not in the burgundy, six n eight heart liquid into the day > the main in the liquid crystal injection hole after the liquid crystal injection hole is closed 201043341 = so recently the method of the job drop Thereby, the time taken to form the liquid crystal layer is reduced, and the waste of the liquid crystal is avoided. The most important factor in the crystal drop method is that a liquid crystal layer having a predetermined liquid crystal amount is formed on the upper substrate and the lower substrate. In the liquid crystal dropping method, the area on which the substrate on which the two crystals are dropped is bonded to the rubberized substrate having the sealant pattern becomes a factor which is important for forming a liquid crystal layer having a predetermined liquid crystal amount. Ο In the liquid crystal dropping method, a glue applicator is used to apply a glue on a substrate, whereby a glue pattern is formed thereon. The glue applicator includes a platform on which the substrate is mounted, a head unit having a glue discharge through the nozzle, and a head support of the support head unit, thereby forming a predetermined shape when the substrate and the nozzle move relative to each other, The glue pattern is on the substrate. At the same time, the conventional glue applicator continuously applies the glue in a linear manner from the starting point of the discharge to the end point of the discharge glue. In the linear glue coating process, in order to avoid coating too much glue, there is a very large diameter at the position where the glue pattern starts on the substrate, that is, where the glue is first applied, as shown in FIG. 1 'When the nozzle 620 is downward and When moving horizontally to approach the substrate s, the glue is discharged through the nozzle 620 when the nozzle has not reached a position spaced apart from the substrate S by a predetermined interval, and the amount of discharged glue is increased until the nozzle 620 reaches a predetermined interval from the base plate S. Similarly, in order to avoid excessive coating of glue, there is a very large direct control at the position where the glue pattern is terminated on the substrate. As shown in FIG. 2, when the nozzle 620 is moved upward and the water 4 201043341 moves flat away from the substrate s, the discharge of the glue is stopped. . Reducing the amount of glue discharged through the nozzle 620

Therefore, the linear coating method of the glue applicator requires a second requirement to turn to D2, where D1 is increased when the postal coating direction is moved to increase the amount of discharge, and when 喰喈a L « and the first required distance is reached to the end The scent t is applied in the direction of the coating _ the amount of glue discharged _ the end of the arsenic (4), and the second required distance D2 is required. Procedure = The difficulty is that the coating of the glue on the substrate is complicated. In particular, when the knee pattern I is formed, the glue _ρ secret width is formed, and the distance D1 is required to be obtained. The required distances D1 and D2 are required. Then, if the error is set to be wide nqD2, Wei will have a line width of the face P and the closed area of the knee pattern p becomes defective. It is very important to have a liquid crystal layer of a liquid crystal on the upper substrate and the lower substrate, and the formation of such a two-layer 疋 depends on the seal of the adhesive pattern. The pure, only linear coating method has a problem of, for example, producing a defective egg-like closed region and it is difficult to form a liquid crystal layer having a predetermined liquid crystal amount, which may degrade the quality of the product. SUMMARY OF THE INVENTION Therefore, the present invention has been made in view of the problems of the prior art described above, and the present invention provides a glue coating method in which a glue coating is applied to a substrate by dot coating to form a glue pattern, thereby avoiding Defects, such as the glue pattern line width short circuit and the 5 201043341 barrier and ensuring that the egg case has a predetermined amount of liquid helium fine (four) plate, the glue map you have achieved the above purpose - according to the invention - provides a The glue coating comprises the steps of: mounting the substrate on the platform; positioning the nozzle to be separated by a predetermined distance; and changing the relative position between the substrate and the nozzle Ο X-point coating mode 'dropping from the nozzle to the substrate at predetermined intervals Thereby forming a glue pattern. w The step of forming the glue pattern step is as follows: when changing the size of the dripped glue & or changing the number of drops of the same size, the drip glue

Further, the step of performing the step of forming the glue pattern is such that the droplets are dropped when the number of drops is adjusted in the longitudinal direction of the line of the glue pattern. Further, the step of performing the step of forming the glue pattern is as follows: at least one column of the glue drops are dropped on the line of the glue pattern. The method of performing the step of forming the glue pattern is as follows: in the line of the glue pattern, see the drop of the plurality of glue drops in the line of the inner line of the defined rubber pattern, and the number of the glue drops is different from the glue defined along the edge. The number of drops of glue dripping outside the pattern. Here, the diameter of the glue droplet dropped along the inner line defining the rubber pattern is 1/2 or less of the line width of the rubber pattern to be formed. The method further comprises the step of continuously discharging the glue from the nozzle to the substrate in a linear coating manner when the relative positions of the substrate and the nozzle are changed, thereby forming a glue pattern. 〇

G According to another aspect of the present invention, a substrate coating method for providing a gel pattern formed by a gel coating method includes: when changing the relative positions of the substrate and the nozzle, the coating method is performed by a predetermined amount. The steps of the substrate. Different from each other. Here, the inner line and/or the outer line of the glue pattern is a waveform having a predetermined pitch, wherein the pitch of the waveform along the inner or outer line is different along the longitudinal direction of the line, and the pitch of the waveform along the inner line is The pitch 2 of the waveform along the outer line: in the straight line segment of the pattern, the waveform i is connected along the inner line of the glue pattern and the line connecting the peaks of the waveform along the inner line of the glue pattern in the curved section of the glue pattern is A curve having a predetermined curvature. The heart is as described in the 'By the cloth method, (4) the coating method. The protective __ area contains a predetermined amount of liquid crystal. [Embodiment] Reference will now be made to the accompanying drawings. It is possible to exemplify the preferred embodiment of the present invention. The reference symbols are used in the drawings to indicate the same as the same 7 201043341 or the like. First language. Reference circle 3 to FIG. 5 'defines the glue pattern p formed in the substrate s in FIG. 3 for the structure of the invention. The line L representing the line == pattern p indicates the shape of the glue pattern P and the shape of the L line. [The width, the line of the knee pattern p 〇 宽 宽 wide L 矣 not / ... line B along the direction of extension, and the direction of the rubber pattern p ====. Further, the line of the inner shape of the inner line L1 、2, P of the glue pattern p, and the line of the outer shape of the line 痄wl two-ply pattern P outside the glue pattern p are intervened. Therefore, the width p of the glue pattern p is determined by the interval between the closed f and the outer line L2. Furthermore, the closure of the 朦 pattern £ A represents the area defined by the inner line u. The line of the center line P of the egg p is the line W of the width W, and parallel to the longitudinal direction of the winning pattern. In the entire shape of the glue pattern P, the straight line of the line L, 7F, "L extends in a linear form. The section of the curve, and the curved section of the line ^ does not extend in the form of a curve having a predetermined curvature. The sectional area a of the glue pattern p in Fig. 2 shows the area of the glue obtained when cutting in the vertical direction. The connection point CP to the end point EP to form the 朦 pattern P represents the starting point SP and the point at which the glue hits the starting point sp P on the substrate S where the glue pattern end point EP meets. 201043341 Reference is now made to Figs. 6 and 7 The glue applicator according to the present invention is described. The base frame of the sm machine is mounted on the base frame 10 and is provided for a pair of linear motions, and the squats on the opposite sides of the y-axis direction of the platform 30.

The jump of the ## ride is not shown). The base frame 10 can include a first actuator (not shown) with a front side of the sleeve side H30 on the base frame 10, and a head support member 5A can be included in the opposite movement guide 4. The longitudinal drive head, (four) shape ^ = ^ = _ multiple head support. . In FIG. 7, the head unit 6G may include a syringe 61 filled with glue, a nozzle 62 communicating with the syringe 61 to discharge the glue, and a laser distance sensing disposed adjacent to the nozzle to measure the gap distance between the nozzle 62 and the substrate S. The y-axis driver 64 in the γ-axis direction of the device, the driving nozzle 62 and the laser distance sensor 63, and the z-axis driver 65 that drives the nozzle 62 and the laser distance sensor in the redundant axis direction. The laser distance sensor 63 includes a laser emitting element 631 and a laser receiving element 632 spaced apart from the laser emitting element 631 by a predetermined distance: receiving a laser reflected by the substrate S and transmitting a corresponding reflected laser The position of the electrical signal is measured to the controller, thereby measuring the gap between the substrate S and the nozzle 62. 9 201043341 Furthermore, the head unit 60 may include an area detecting sensor 66 for measuring the sectional area A1 of the glue pattern p applied on the substrate S. The area detecting sensor 66 continuously emits a laser to the substrate s and the scanning glue pattern p to measure the sectional area A1 of the adhesive pattern P. The data of the cross-sectional area A1 of the glue pattern p is used to determine the absence of the glue pattern P. A glue coating method for forming a glue pattern by a glue applicator according to a first embodiment of the present invention will now be described with reference to Figs. As shown in FIGS. 8 and 9, the glue coating method includes mounting the substrate s on the stage 30, positioning the nozzle 62 at a predetermined distance from the substrate S, and the relative position between the substrate S and the nozzle 62. At this time, in the longitudinal direction of the line L of the glue pattern P at a predetermined interval, the glue drops pD are dropped from the nozzle 62 to the substrate S, thereby forming the glue pattern P. In order to drip the glue drops PD', a pressure control means for controlling the discharge of the glue from the nozzle 62 can be provided, and an opening/closing means such as a pressure sensor can be provided to the nozzle 62. The glue pd which is dropped through the nozzle 62 by the dot coating method can be combined with other glue drops PD which have been dropped on the substrate s due to its own viscosity and surface tension, thereby forming a continuous rubber pattern. p on the substrate s. Meanwhile, the interval G between the dropped glue drops PD may correspond to the distance between the adjacent glue drops PD contacting the periphery as shown in FIG. 1A, corresponding to the distance between the adjacent glue drops PD at the periphery. The distance between adjacent glue drops PD shown in Fig. n or corresponding to each other with a small gap I is as shown in Fig. 12. 201043341 However, the interval G is not limited to the interval as shown in FIGS. 10 to 12 described above, and may be based on design factors such as the distance between the substrate S and the nozzle 62, the collision force of the glue pD colliding with the substrate S, and the viscosity of the glue PD PD. And the surface tension, if the substrate S is joined together, 'the bonding force or distance between the bonding substrates S, or the like, is set to other values. As shown in FIG. 13, the glue pattern p formed on the substrate s by the glue coating method according to the first embodiment of the present invention may be a waveform having an inner line L1 and an outer line L2, which has a predetermined longitudinal direction along the line L of the glue pattern P. The pitch of the dimensions ρτ. The individual pitch ΡΤ of the inner line L1 or the outer line L2 of the glue pattern ΡΤ can be fixed longitudinally along the line L of the glue pattern P. Further, the individual waveforms of the inner line u or the outer line L2 of the glue pattern p may be symmetrical with each other based on the center line cl of the glue pattern P. Unlike the conventional linear coating method, which requires the first and second required distances D1 and D2' to perform the glue application method according to the first embodiment of the present invention, the glue droplet PD is dropped through the nozzle 62 in a dot coating manner. On the substrate s, it is possible to avoid the effect that the linear coating method may cause the line width w of the glue pattern ρ to become a defect' and ensure that the amount of liquid crystal in the closed region A of the paste pattern P corresponds to a predetermined liquid crystal amount. Hereinafter, a glue coating method according to the second embodiment will be described with reference to Figs. 14 to 19, wherein like reference numerals are used to refer to the like parts of the first embodiment, and the details thereof are omitted. As shown in FIG. 14 and FIG. 15, the glue application method according to the second embodiment is performed such that when the amount of the glue drops PD is changed in the section of the glue pattern P, the glue drops 11 201043341 PD are dropped onto the substrate S, This forms a glue pattern p on the substrate s.

That is, as shown in FIG. 14, in order to more precisely adjust the line width W' of the glue pattern P in a specific section, the amount of dripping glue can be controlled longitudinally along the line L of the glue pattern p. PD : PD1 and ρ〇2). For example, the amount of the glue drops pD2 dropped at the joint point cp at which the glue pattern = the start point SP and the end point EP meet may be smaller than the amount of the glue droplet pm dropped in the section outside the joint point cp. In this case, the interval G2 between the adjacent droplets pD2 having a smaller amount may be smaller than the interval G1 between the adjacent droplets PD1 having a larger amount. *Like the appropriate kind ‘ along the glue pattern! When the line L of the > longitudinally adjusts the amount of dripping drops, the drip drop PD' can more precisely adjust the line width W size of the glue pattern P. However, the present invention is not constructed according to the above-mentioned structure, and may be constructed according to design conditions so that the amount of PD droplets dripping at the connection point CP of the glue pattern P is larger than the amount of glue PD dropping outside the connection point CP. And the spacing G2 between the adjacent droplets PD2 having a smaller amount can be made more than the interval G1 between the adjacent droplets PD1 having a larger amount

In another example, as shown in FIG. 15, in order to more precisely adjust the individual line width W❸ size of the glue pattern P along the curved section RL and the straight line segment, the individual glue drops PD falling on the curved section rainbow and the straight line segment SL may be dripped. There are different amounts. For example, the amount of the glue drop PD2 dripping in the curved line segment RL may be smaller than the amount of the glue drop pm of the drop line straight line SL. In this case, the interval G2 between adjacent glue drops pD2 of the curve segment RL may be smaller than the interval between adjacent glue drops. ,! Further, 12 201043341 However, the present invention is not limited to the above-described structure, and may be constructed according to design conditions such that the amount of the glue droplet PD2 dripping on the curved segment RL may be larger than the amount of the drop PD1 dripping on the straight line segment SL. Further, the gap G2 between the adjacent droplets PD2 dropped in the curved line RL may be wider than the interval between the adjacent droplets PD1 of the straight line segment %. As shown in Figs. 16 and 17, according to the glue applying method of the second embodiment, the line width W of the glue pattern P may have different sizes in different sections. For example, the line width W of the glue pattern P may be a width W1 in a section other than the connection point CP, and W2 in the connection point CP. Further, the pitch ρτ of the individual waveforms of the inner line L1 or the outer line L2 of the glue pattern p may be different in the section in which the glue pattern p is different. For example, at the connection point cp of the glue pattern P, the curved segment rainbow, and the straight line segment SL, the pitches PT, PT1, and PT2 of the individual waveforms of the inner line li or the outer line L2 of the glue pattern p may have different sizes, respectively. Although FIG. 16 shows that the line width W2 and the pitch PT2 at the connection point CP of the glue pattern P are smaller than the line width W1 and the pitch PT1 of the other sections except the connection point cp, the present invention is not limited thereto, and the connection is not limited thereto. The line width W and the pitch PT of the point CP can be wider than the other sections except the connection point cp. Similarly, although the graph π shows that the line widths W2 and PT2 of the curved section RL of the glue pattern P are smaller than the line widths W1 and PT1 of the straight line segment SL, the present invention is not limited thereto, and the line width W of the curved section RL and / or PT can be wider than the straight line SL. At the same time, as shown in FIG. 16 and FIG. 17, the line L3 of the waveform peak point PP of the inner line L1 in the straight line segment sl of the glue pattern p is preferably a straight line, and the curve segment RL along the glue pattern P The line L4 of the waveform peak point pp of the inner line is preferably a curve having a predetermined curvature to obtain a closed area A in which the glue pattern p corresponds to a predetermined liquid crystal amount. 13 201043341 In this way, by controlling the drip drop p line width w and / or pitch PT, in the rubber map 3 = inch. The execution of the control of the drop amount of the glue drop PD can be used to control the drop size of the drip drop PD size, as shown in the figure from the nozzle No. 8 or not, or controlled at the same position, the drop size has the same size The method of the number of glue drops is shown in FIG. Since the drip control method only needs to control the position of the nozzle 62 and control the size of the glue droplet PD, it has an effect of allowing the line width W and/or the pitch PT of the pattern P to be. 'gum

According to the glue application method of the second embodiment, the line width of the glue pattern ρ and/or the pitch ρτ of the individual waveforms of the inner line L1 or the outer line L2 of the glue pattern 不同 are different in different sections, for example, in a rubber pattern. The connection point cp of ρ, the curved line segment RL, or the straight line segment SL, thereby controlling the closed region A of the glue pattern p containing a predetermined liquid crystal amount in a more precise manner. Hereinafter, a method of applying a glue according to a third embodiment will be described with reference to Figs. 20 to 28, wherein like reference numerals are used to indicate like parts of the first and second embodiments, and a detailed description thereof will be omitted. As shown in FIG. 20 to FIG. 22, the glue coating method according to the third embodiment is performed, and in the width direction of the glue pattern ,, a plurality of droplets PD of the plurality of columns are dropped on the substrate S, thereby forming a glue pattern ρ. On the substrate S. Although FIGS. 20 to 22 show that two rows of the glue drops PD' are dropped in the width direction of the glue pattern 但是, the present invention is not limited thereto, and two or more columns of glue drops PD may be dropped in the width direction of the glue pattern Ρ. . 14 201043341 At the same time, in order to obtain the droplets PD of the plurality of rows, the frame 62 or the substrate S is moved in the width direction of the glue pattern 。. ο ο The method of dropping the glue drop pD in the longitudinal direction and the width direction of the line L of the glue pattern can be carried out in the following two ways. First, as shown in FIG. 20, a plurality of rows of glue drops PD are dropped in the longitudinal direction and the width direction of the line of the glue pattern, and the center of the drop DP of the adjacent glue drops PD which are horizontally and vertically dropped is shown. The individual lines are parallel to the longitudinal and width directions of the line L of the glue pattern P. Second, as shown in FIG. 21, a plurality of rows of glue drops PD' are dropped along the longitudinal direction and the width direction of the glue pattern line, so that the line 'parallel' shown by the edge of the drop center dp of the adjacent drop PD of the horizontal drop In the longitudinal direction of the line L of the glue pattern P, the line drawn between the dripping centers DP of the adjacent drops PD vertically dropped is inclined at a predetermined angle with respect to the width direction of the line L of the glue pattern P. As shown in Fig. 23, in the glue pattern P obtained by the dropping method of Fig. 2, the individual waveforms ' along the inner line u and the outer line along the glue pattern ρ are symmetrical with each other based on the center line CL of the egg case P. However, as shown in Fig. 24, the side waveforms along the inner line L1 and the outer line of the glue pattern P in the glue pattern ρ are obtained by the dropping method of Fig. 21, and the center line CL based on the egg case p is referred to as each other. This _ drop method can be modified according to design conditions. According to the glue application method of the third embodiment, since the plurality of droplets PD are dropped in the wide direction of the glue pattern ρ, a conventional method of dropping the single-column droplets PD along the two of the glue patterns p The drop amount of the glue drop pD is reduced, and Yao adjusts the waveform of the inner line u and the outer line u along the glue pattern p to thereby more precisely control the closed area A of the glue pattern P. At 2 o', as shown in Fig. 22, when the glue drops PD along the width of the glue pattern ρ, it is possible to designate the glue drops PD according to the different sizes of each column. 15 201043341 When a liquid crystal layer having a predetermined liquid crystal amount is formed, the enthalpy of the glue pattern ρ becomes an important factor. Then, since the closed region α = the inner line U of the glue pattern ρ is defined, it is preferable to make the waveform 3 along the inner line! Therefore, a plurality of colloidal droplets 2 are dropped in the width direction of the rubber pattern P, and the droplets which are dropped into a line and have a row along the inner (four) = ^ Luo 1 ' are preferably smaller than the drops and have a line along the [2

The amount of Df is still small. In this case, as shown in Fig. 25, the pitch PT4 of the waveform of Ο 可 may be narrower than the (10) PT3 of the line U 2 shape along the glue pattern P. Furthermore, compared to the method of dropping a single drop of PD along the substrate p, the Π U " Π distance m along the glue pattern P may be smaller. Meanwhile, the diameter along the inner line u of the glue pattern P drops =), 1/2 or less of the line width W of the rubber pattern P to be formed is preferably 1/4 or less. 4 feet The present invention is not limited to the above method, and a secret line may be used instead of t, L2 The column of the victory drops pm _ falling #, the drop of the drop of PD4 is still small. As the previous drop of the amount of drip PD can be controlled by the drop from the nozzle 62 to the knee and the son-in-law The square wire shop (see Fig. 18)' or _ control is controlled by the method of dropping the PD number of the same size at the same position (see Fig. 19). Heart = the manner shown in Fig. 26 along the width of the egg case p Drop the PD of the complex number J in the direction, and in the direction (5), the longitudinal direction of the line L of the glue pattern p and the width 1 direction of the parent drop the PD, that is, the ore pattern, or as shown in Fig. 27 and Shown in the direction (92 and 93) along the longitudinal direction of the line L of the kick pattern p, then <back to the longitudinal direction' continuously drops the drop PD, the direction is separated from the dripped drop by a predetermined distance. Kuanyi 16 201043341 As shown in Figure 27, along The line L2' outside the pattern p is then dropped along the inner line L1' of the glue pattern P. However, since the inner line L1 is an important factor determining the closed area A of the glue pattern P, it is preferable to form the glue along the line L1. Dropping PD, thereby determining the inner line L1 as a reference line, and then dropping along the column forming the outer line L2 of the glue pattern. Specifically, 'if the amount of the glue drop PD4 dripping along the inner line L1 of the glue pattern P, the ratio of the glue pattern The amount of the droplets PD3 dropped by the line L2 outside P is still small. As shown in Fig. 22, it is preferable to first drop the droplet PD along the inner line L1 of the glue pattern P, because the glue PD along the inner line L1 first determines the inner line U. Then, the glue droplets pd are dripped along the outer line L2. Hereinafter, the glue coating method according to the fourth embodiment will be described with reference to FIGS. 29 to 32, wherein like reference numerals denote the same as the first to third embodiments. The detailed description is omitted, and the detailed description thereof is omitted. As shown in FIG. 29 and FIG. 30, 'the execution of the glue coating method according to the fourth embodiment' causes the droplet PD to drip on the substrate s in a linear coating manner (PL). Thereby, when the relative position between the substrate S and the nozzle 62 is changed, the glue is continuously discharged through the nozzle 62. In combination with the dot coating method, the glue pattern p is formed on the substrate. For example, as shown in FIG. 29, the glue pattern P can be formed such that the glue droplets are dropped by the dot coating method at the connection point CP, and the connection is made. The position outside the dot is coated with ruthenium in a linear coating manner. In this case, as shown in Fig. ,, the inner line u or the outer line L2 of the connection point CP of the glue pattern P is _. Therefore, in the line of the glue pattern. Wide w usually; = 2 di-glue == two's coating the glue in a point coating manner, whereby the 'line of the defect> is applied at other locations by a linear coating method 17 201043341 Reduce the time to form the glue pattern 卩. Meanwhile, the present invention is not limited to the above, and other methods may be employed in which the connection point cp is subjected to a linear coating method, and a dot coating method is performed in other portions, thereby forming a glue pattern P.另一 于 In another example, as shown in FIG. 30, a glue pattern p may be formed on the substrate S such that the straight line SL of the 谬 pattern is applied in a linear coating manner and the curved portion of the glue pattern P The rainbow drops the droplet PD in a spot coating manner. In this case, as shown in Fig. 7, the inner line L1 or the outer line L2 of the glue pattern p in the curved section is formed into a waveform having a predetermined pitch ρτ. Meanwhile, the present invention is not limited thereto, and other methods may be employed, in which a dot coating method is performed in the straight line segment SL, and a linear coating method is performed in the curved portion rainbow. Such a 'bonding point coating method and a linear coating method make the egg ρ formed in a short time, and the glue pattern ρ formed by the dot coating method reduces the line width W of the pattern 常 often occurs in the defect portion of the missing portion ^ ^ ^ another - in the example, as shown in Fig. 33 and Fig. 34, if the glue of __ ρ column, the glue can be applied to the substrate S in the following manner, the column is implemented by spot coating, and in other columns The linear coating method is carried out 'by this to form a glue pattern ρ. As shown in Fig. 33, in order to accurately control the column of the inner line L1 forming the glue pattern P, the line of the outer line L2 of the glue pattern P can be utilized to utilize the green line, in the case of the shape, as shown in Fig. 34. , the inner line u of the glue pattern p. Here, the waveform of the pitch PT is fixed, and the glue pattern p 蝻β2 has a pre-form. However, the present invention is not limited thereto, and '% 2 may be formed into a linear shape and other methods may be employed, and the glue pattern P may be formed by coating the line of the inner line L1 of the 201043341 to the linear coating method. The outer line L2 can be applied in a dot coating manner, wherein the outer line L2 of the glue pattern P can be in a waveform having a predetermined pitch ρτ, and the inner line L1 of the rubber pattern can be formed in a linear form. As described above, (4) the glue of the (4) method is such that the glue drip is applied to the substrate by a dot coating method, thereby forming a glue pattern ρ, thereby avoiding defects such as a line width W of the glue pattern 短路 and The failure, as well as ensuring that the closed area of the glue pattern has a predetermined amount of liquid crystal. Although the preferred embodiment of the present invention has been described in connection with the exemplary embodiments, those skilled in the art will understand that various modifications, additions, and substitutions may be made without departing from the spirit of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, aspects, and advantages of the present invention will become more apparent from the accompanying drawings and the detailed description. Figure 2 is a plan view showing the continuous state of the coating glue on the substrate according to the conventional coating method; Figure 3 is a plan view of the egg formed on the substrate; Figure 4 is the IV- along Figure 3 Figure 5 is a schematic view showing an example of a coating direction in which a glue is applied to form a glue pattern on a substrate; Figure 6 is a perspective view showing a glue applicator according to the present invention; 19 201043341 7 is a perspective view showing the head unit of FIG. 6; FIG. 8 is a circle, and FIG. 9 is a view showing the application of the glue coating side of the first embodiment of the present invention, and the point coating branch is used to listen to the glue from the machine n. FIG. 10 to FIG. 12 are schematic diagrams showing the state of the glue coating method according to the first embodiment, in which the glue drops are dropped along the longitudinal contact of the rubber sheet...

Figure 13 is an enlarged view showing a part of the glue pattern formed on the substrate by the glue application method according to the first embodiment; and 14 and Figure 15 are diagrams showing the "A glue pattern line" using the second embodiment of the present invention. FIG. 16 and FIG. 17 are enlarged views showing a part of the glue pattern formed on the substrate according to the coating method according to the second embodiment; FIG. 16 and FIG. 19 are enlarged views of the state in which the droplets are dropped in the longitudinal direction of the drip interval; According to the coating method of the second embodiment, two schematic diagrams of the method for adjusting the line width of the glue pattern are respectively displayed by adjusting the droplet size and the number of the same size droplets dropped; FIG. 2A to FIG. A schematic view showing a coating method according to a third embodiment of the present invention in which a plurality of droplets are dropped in a line width direction of a glue pattern; and FIGS. 23 to 25 are diagrams showing a coating method according to a third embodiment formed on a substrate. FIG. 26 to FIG. 28 are schematic diagrams showing an exemplary method of dropping a droplet on a line width direction and a longitudinal direction of a glue pattern according to a third embodiment; FIG. 29 and FIG. Coating method of the examples A schematic diagram of an exemplary method of forming a glue pattern, wherein a bonding point coating method and a linear coating method are used; 20 201043341 FIGS. 31 to 32 are enlarged views showing a part of the rubber pattern formed on the substrate by the coating method according to the fourth embodiment. Fig. 33 is a view showing a different method of applying a glue according to a fourth embodiment; and a coating method is formed on the base line 34 to show an enlarged view of a part of the glue pattern on the other board according to the fourth embodiment. [Main component symbol description] Ο 10 base frame 30 platform 40 linear motion guide 50 head support 59 second driver 60 head unit 61 syringe 62 nozzle 〇 620 nozzle 63 laser distance sensor 631 laser emission element 632 Lei Shooting receiving component 64 Y-axis driver 65 Z-axis driver 66 area detecting sensor 70 X-axis driver 91 direction 201043341 92 direction 93 direction A closed area A1 cross-sectional area CL midline CP connection point D1 first required distance D2 second requirement Distance O DP drop center EP end point G interval. G1 interval G2 interval I gap L glue pattern line L1 inner line ◎ L2 outer line L3 line L4 line P glue pattern PD glue drop PD1 glue drop PD2 glue drop PD3 glue drop 22 201043341 PD4 glue drop PL linear coating method PP waveform peak point PT pitch PT1 pitch PT2 pitch RL curve segment S substrate O SL straight segment SP starting point W line width W1 width W2 width

Claims (1)

201043341 VII. Applicable Patent Range: The L-type coating method includes the following steps: (a) mounting a substrate on a platform; the patterning glue H is positioned to be spaced apart from the i-substrate by a predetermined distance; When the relative position of the substrate and the financial chamber is opposite to each other, the droplet is dripped from the nozzle to the silk plate at a predetermined interval, thereby forming a method of picking up the rag, wherein the _ '', When the size of the glue drops is dropped, the glue drops are dropped. The glue drops. When the number of drops of the glue drops of the same size is changed, the glue coating according to any one of the three items is performed by dropping. a method in which, in the case of the amount of dripping, dripping in a longitudinal direction of one of the lines of the glue pattern, the method of performing the step to the glue (4) described in the item 3, wherein the drop is performed; In the case of the line width, dripping at least - the glue coating method according to item 5, wherein the step of performing the step is to define the glue line along the line width of the glue line = ί, and the inside line The number of drops of the droplets in one of the columns, different 24 201043341 in the outer line along one of the defined rubber patterns 7. The method of coating the glue according to claim 5, wherein the diameter of one of the drops dripping along the inner line defining the pattern of the glue is intended to be formed. The glue coating method according to any one of claims 1-3 to 3, further comprising the step (d), when the substrate is changed and the When the relative positions of the nozzles are in a linear coating manner, the glue is continuously ejected from the nozzles to the substrate, thereby forming the glue pattern. 〇9. A substrate comprising a rubber pattern. The glue pattern is coated by a glue coating method. Forming, the method comprises the steps of dropping the glue droplets from the nozzle to the substrate at a predetermined interval in a one-step coating manner when changing the relative positions of the substrate and a nozzle. 10. As stated in claim 9 a substrate, wherein an inner line and/or an outer line of the glue pattern has a waveform of a predetermined pitch, such as the substrate of claim 1, wherein the wave along the inner line or the outer line _pitch ' along the egg - the line - longitudinal The substrate according to claim 10, wherein the (five) distance of the locus along the inner line and the pitch of the waveform along the outer line are different from each other. The substrate of any one of clauses 10 to 12, wherein a line ' connecting the peak points of the waveform along the inner line of the glue pattern is a straight line in the straight line of the glue pattern. 25 201043341 14. The substrate of any one of the items 10 to 12, wherein in a curved section of the glue pattern, a line connecting the peak points of the waveform along the inner line of the glue pattern is a curve having a predetermined curvature . 26