TWI449576B - Method for controlling dispenser apparatus - Google Patents

Description

Method for controlling a dispenser device

The present invention relates to a method for controlling a dispenser device, and more particularly to a method for controlling a dispenser capable of reducing processing time for forming a plurality of patterns on a substrate.

Cathode ray tubes (CRT) have been used as prior art display devices. However, CRTs are limited in size and weight. In recent years, flat panel displays (FPDs) such as liquid crystal display devices (LCDs), plasma display panels (PDPs), and organic light-emitting devices (OLEDs) have been widely used as display devices. FPD has the advantages of light weight, slim configuration and low power consumption.

To manufacture this type of FPD, a pair of flat substrates are joined to each other. For example, in the case of an LCD, a lower substrate including a plurality of thin film transistors and pixel electrodes and an upper substrate including a color filter and a common electrode are fabricated. Next, a plurality of metal patterns are disposed along an edge region of one or both of the upper substrate and the lower substrate to electrically connect the upper substrate to the lower substrate. The plurality of patterns may be spaced apart from one another along the circumference of the edge.

A dispenser apparatus for applying a metal paste onto one or both of an upper substrate and a lower substrate to form the plurality of patterns includes a platform on which the substrate is mounted, including for discharging a raw material a dispenser of a nozzle (for example, a metal paste applied to a substrate mounted on the stage), a sensor for measuring a gap between the substrate and the nozzle, a driving portion for lifting the dispenser, The transfer portion of the dispenser is moved horizontally, and the control portion for controlling the operation of the dispenser.

First, a sensor is used to measure the gap between the substrate and the nozzle to form the plurality of patterns on the substrate using prior art dispenser devices. Next, the dispenser is raised or lowered to adjust the gap between the substrate and the nozzle. That is, the gap between the substrate and the nozzle is adjusted to discharge the raw material onto the substrate from the nozzle. Thereafter, the dispenser is moved while discharging the raw material from the nozzle to form a pattern having a desired length. When forming a pattern having a desired length, the discharge of the raw material from the nozzle is stopped and the dispenser is lifted by about 2 cm to about 5 cm. Next, the dispenser is moved to a position where the next pattern will be formed. When the dispenser reaches a position where the next pattern will be formed, a sensor is used to measure the gap between the substrate and the nozzle, and the dispenser is lowered, thereby adjusting the gap between the substrate and the nozzle. Thereafter, the dispenser is moved while discharging the raw material from the nozzle to form a pattern having a desired length. Next, the process described above is repeated several times to form the plurality of patterns on the substrate.

Referring to the configuration of the prior art dispenser apparatus as described above, in order to form the plurality of patterns, the dispenser needs to be raised or lowered each time a pattern is formed to adjust the gap between the substrate and the nozzle. Since the gap between the substrate and the nozzle is adjusted several times while the plurality of patterns are formed on the substrate, the processing time is increased. Therefore, such methods may be difficult to avoid the disadvantage of low productivity.

The present invention provides a method for controlling a dispenser apparatus in which the dispenser is horizontally moved to discharge a raw material onto a substrate, thereby reducing processing time for forming a plurality of patterns.

According to an exemplary embodiment, a method for controlling a dispenser device is provided The method, the dispenser apparatus includes a syringe storing a raw material, a nozzle discharging the raw material onto the substrate, a valve controlling communication between the injector and the nozzle, and adapted to form each other on the substrate a plurality of spaced apart pattern dispensers, the method comprising: moving the dispenser horizontally to discharge the raw material onto the substrate, thereby forming the plurality of patterns, wherein the substrate and the nozzle are when the raw material is discharged onto the substrate The gap between them is equal to the gap between the substrate and the nozzle when the raw material is not discharged onto the substrate.

The horizontal movement of the dispenser may include maintaining a gap between the substrate and the nozzle when discharging the raw material onto the substrate without repeatedly performing a process in which, when a plurality of patterns spaced apart from each other are formed on the substrate, The dispenser is raised or lowered several times to adjust the gap between the substrate and the nozzle.

The method may further include applying a discharge start signal of the raw material to the dispenser before discharging the raw material onto the substrate to form a pattern.

The method may further include applying a discharge end signal of the raw material to the dispenser before the end of the patterning on the substrate.

In the case where the actual position at which the patterning is started is referred to as a pattern formation start point, the discharge start signal of the raw material may be applied to the dispenser when the dispenser is located at a position before the pattern formation start point.

The discharge start signal application point can be adjusted by the moving speed of the dispenser, the pressure addition time in the syringe, and the operating time of the valve.

The discharge start signal application point can be calculated as a distance value by the following equation: "discharge start signal application point = moving speed of the dispenser x pressure addition time in the syringe x operation time of the valve".

The discharge start signal application point may be located at a position apart from the calculated value before the pattern formation point.

When the pattern on the substrate is divided into the first region, the second region, and the third region from the start of pattern formation, the pressure added to the first region of the syringe to form the pattern may be adjusted to be added to The syringe is formed to form from about 30% to about 80% of the pressure of the second zone.

The first region of the pattern may belong to a range of about 0.5 mm from the beginning of the pattern formation.

In the case where the actual position at which the end of the pattern is formed on the substrate is referred to as a pattern formation end point, the discharge end signal of the raw material may be applied to the dispenser when the dispenser is located at a position before the pattern formation end point.

The discharge end signal application point can be calculated as a distance value by the following equation: "Emission end signal application point S2 = pressure added to the syringe x length change per pressure".

The discharge end signal application point may be located at a position apart from the calculated value before the pattern formation end point.

The above and other objects, features and advantages of the present invention will become more <RTIgt;

Hereinafter, specific embodiments will be described in detail with reference to the accompanying drawings. However, the invention may be embodied in different forms and should not be construed as being limited to the embodiments set forth herein. Rather, the embodiments are provided so that this disclosure will be thorough and complete, and the scope of the invention Technical staff. In the figures, like reference numerals refer to like elements throughout.

FIG. 1 is a schematic diagram of a dispenser device, in accordance with an exemplary embodiment. 2 is a cross-sectional view of a dispenser in accordance with an exemplary embodiment. 3 is a cross-sectional view for explaining a discharge start signal application point, in which discharge for discharging raw materials from a dispenser is applied to the discharge start signal application point when the dispenser is horizontally moved by a method according to an exemplary embodiment Start signal. 4 is a cross-sectional view for explaining a discharge end signal application point, in which emission of a raw material discharged from a dispenser is applied to the discharge end signal application point when the dispenser is horizontally moved by a method according to an exemplary embodiment End signal. FIG. 5 is a cross-sectional view for explaining horizontal movement of a dispenser according to an exemplary embodiment.

Referring to FIGS. 1 and 2, a dispenser apparatus according to an exemplary embodiment includes: a platform 100 on which a substrate 10 is mounted; a dispenser 200 including a nozzle 210 for discharging a raw material onto a substrate 10 mounted on the platform 100 a sensor 240 for measuring a gap between the substrate 10 and the nozzle 210; a driving portion 250 for lifting the dispenser 200; a conveying portion 300 for horizontally moving the dispenser 200; and for controlling the dispenser 200 The control portion 400 of the operation.

The substrate 10 according to an exemplary embodiment may be one of an upper substrate and a lower substrate for a liquid crystal display device (LCD). Although not shown, for example, a color filter and a common electrode may be disposed on the upper substrate, and a plurality of thin film transistors and one pixel electrode may be disposed on the lower substrate. When the upper substrate and the lower substrate are bonded to each other to manufacture an LCD, A plurality of patterns formed of a metal paste may be disposed on one of the upper substrate and the lower substrate to electrically connect the upper substrate to the lower substrate. According to an exemplary embodiment, a silver (Ag) paste is used as a raw material, and an Ag paste is stored in a syringe and coated on the substrate 10.

The dispenser 200 is moved in the X-axis or Y-axis direction by the transfer portion 300 to apply a raw material along the circumference of the edge region of the substrate 10, thereby forming the plurality of patterns 11. The transfer portion 300 uses a motor and a track to move the platform 100 and the dispenser 200. Alternatively, various other units may be used to move platform 100 and dispenser 200. Although the dispenser 200 is horizontally moved in the X-axis or Y-axis direction in the present exemplary embodiment, the present invention is not limited thereto. For example, the platform 100 can be moved in the X-axis or Y-axis direction to apply the raw material onto the substrate 10. Alternatively, both the platform 100 and the dispenser 200 can be moved in the X-axis or Y-axis direction to coat the raw materials. Otherwise, the platform can be moved in one side and the dispenser 200 can be moved up on the other side to coat the raw materials.

The dispenser 200 includes: a syringe 220 storing a raw material (for example, an Ag paste); a main body portion 230 to which the syringe 220 is fixedly mounted; a nozzle for discharging a raw material stored in the syringe 220 onto the substrate 10; and measuring the distribution A sensor 240 of the gap between the nozzle 210 of the device 200 and the substrate 10. Although not shown, a valve (eg, a solenoid valve) for controlling communication between the syringe 220 and the nozzle 210 may be disposed between the syringe 220 and the nozzle 210. Therefore, when pressure is added to the syringe 220 storing the raw material and the syringe 220 is communicated with the nozzle 210 using a valve, the raw material is supplied into the syringe 220. Then, the raw material is discharged from the nozzle 210 material.

According to an exemplary embodiment, while the plurality of patterns 11 are formed, the dispenser 200 does not rise and fall several times to adjust the gap between the substrate 10 and the nozzles 210, which is different from the prior art. That is, as shown in FIG. 5, during formation of the plurality of patterns 11, the dispenser 200 is moved horizontally without lifting and lowering the dispenser 200 several times while the substrate 10 maintains a predetermined gap with the dispenser 200. That is, the dispenser 200 is horizontally moved so that the gap between the substrate 10 and the nozzle 210 when discharging the raw material is equal to the gap between the substrate 10 and the nozzle when the raw material is not discharged. The horizontal movement of the dispenser 200 will be described in detail below.

The sensor 240 measures the gap between the substrate 10 and the nozzle 210. Although not shown, the sensor 240 includes a light emitting portion (not shown) that emits light onto the substrate 10 for measuring a distance and a light receiving portion (not shown) that receives light emitted from the light emitting portion. The light emitting portion and the light receiving portion may be integrally formed in one body and spaced apart from each other by a predetermined distance. The drive portion 250 is configured to lift the dispenser 200 based on measurements from the sensor 240 to adjust the gap between the substrate and the nozzle 210 to about 40 [mu]m.

According to an exemplary embodiment, the dispenser 200 may only be lifted once to adjust the gap between the substrate 10 and the nozzle 210. The gap between the substrate 10 and the nozzle 210 can be adjusted before the pattern 11 is formed on the substrate 10. Thereafter, the dispenser 200 can be moved continuously and horizontally to form the plurality of patterns 11 without lifting or lowering the dispenser 200. In addition, the sensor 240 may continuously measure the gap between the substrate 10 and the nozzle 210 while moving the dispenser 200 horizontally to form the plurality of patterns 11 on the substrate 10.

The control portion 400 controls the operation of the dispenser 200 to avoid generating a defective pattern. For this purpose, the control portion 400 stores a point (pattern formation start point P1) of the substrate 10 where the formation of the pattern 11 is to start and a point at which the formation of the pattern 11 is to end (pattern formation end point P2). Moreover, the control portion 400 calculates the discharge start signal application point S1 and the discharge end signal application point S2. When the moving dispenser 200 is positioned at the discharge start signal application point S1, a discharge start signal for discharging the raw material is applied to the dispenser 200. Moreover, when the moving dispenser 200 is positioned at the discharge end signal application point S2, the discharge end signal for ending the discharge of the raw material is applied to the dispenser 200. The pattern formation start point P1, the pattern formation end point P2, the discharge start signal application point S1, and the discharge end signal application point S2 will be described in detail below.

Hereinafter, a method for forming the plurality of patterns 11 on the substrate 10 while continuously and horizontally moving the dispenser 200 will be described with reference to FIGS. 1 through 5.

First, the substrate 10 is placed on the platform 100 of the dispenser device, and the sensor 240 is used to measure the gap between the substrate 10 and the nozzle 210. The substrate 10 can be one of an upper substrate and a lower substrate of the LED panel. The sensor 240 measures the gap between the substrate 10 and the nozzle 210, and the driving portion 250 raises the dispenser 200 based on the measured value of the sensor 240 to adjust the gap between the substrate 10 and the nozzle 210 to about 40 μm. The dispenser 200 can be lifted only once to adjust the gap between the substrate 10 and the nozzle 210. Further, the gap between the substrate 10 and the nozzle 210 can be adjusted before the pattern 11 is formed on the substrate 10.

Next, the dispenser 200 is horizontally moved using the transfer portion 300. The dispenser 200 can be horizontally moved toward a position at which the pattern 11 is initially formed on the substrate 10 (i.e., the pattern forming start point P1). While the dispenser 200 is horizontally moved toward the pattern forming start point P1, the control portion 400 calculates the discharge start signal application point S1. Thereafter, as shown in FIG. 3, when the dispenser 200 is located at a position higher than the discharge start signal application point S1, the control portion 400 applies a discharge start signal for discharging the raw material to the dispenser 200. Therefore, the pattern 11 can be formed at a desired position while the dispenser 200 is continuously and horizontally moved. Here, as shown in FIG. 3, the discharge start signal application point S1 may be disposed at a position apart from the pattern formation start point P1 by a predetermined distance. The discharge start signal application point S1 is changed in accordance with the moving speed of the dispenser 200, the time for adding sufficient pressure in the syringe 220, and the operating time of the valve. Generally, it takes a predetermined period of time after the control portion 400 applies the discharge start signal to the dispenser 200 until the raw material is discharged from the nozzle 210 of the dispenser 200. That is, a predetermined time is required to add sufficient pressure to the syringe 220 storing the raw material so that the raw material can be supplied to the nozzle 210. A predetermined time is also required to operate the valve such that the syringe 220 can communicate with the nozzle 210. Therefore, even if the control portion 400 supplies the dispenser 200 with a command signal for discharging the raw material, the raw material is not immediately discharged from the dispenser 200. In addition, the discharge start signal application point S1 may depend on the moving speed of the dispenser 200 because the pattern 11 is formed on the substrate 10 while moving the dispenser 200 horizontally. The above relationship can be expressed as the following equation: "discharge start signal application point S1 = moving speed of the dispenser 200 × operating time of the valve × The pressure in the syringe 220 adds time. According to an exemplary embodiment, the discharge start signal application point S1 is calculated using the following equation: (discharge start signal application point S1 = moving speed of the dispenser × operating time of the valve × inside the syringe The pressure addition signal application point S1 is calculated as a distance unit. The discharge start signal application point S1 is set to a position of the calculated value before the pattern formation start point P1. For example, when the calculated value When it is about 1 mm, a discharge start signal is applied at a position of about 1 mm before the pattern formation start point P1. Therefore, when the moving dispenser 200 is positioned at the discharge start signal application point S1, the control portion 400 is directed to the dispenser. 200 applies an emission start signal for discharging raw materials, as shown in FIG.

When a discharge start signal for discharging the raw material is applied to the dispenser 200, pressure is initially applied to the syringe 220. Next, the valve disposed between the syringe 220 and the nozzle 210 starts operating to connect the syringe 220 and the nozzle 210 to each other. During execution of the process described above, the dispenser 200 reaches the patterning start point P1. When the dispenser 200 is located at a position higher than the pattern forming start point P1, the raw material in the syringe 220 is discharged from the nozzle 210. That is, the raw material is started to be applied to form the pattern 11 at the point (ie, the pattern formation start point P1). As the dispenser 200 is continuously and horizontally moved in the process advancing direction, the raw material discharged from the nozzle 210 is applied onto the substrate 10 to form the pattern 11.

In the case where the first pattern 11 (ie, the initial pattern 11) is formed on the substrate 10, the discharge start signal may be applied to the dispenser 200 after the dispenser 200 is located at the pattern formation start point P1. That is, when starting from the nozzle 210 When the raw material is discharged to form the first pattern 11, the dispenser 200 has not moved. Therefore, the dispenser 200 can be horizontally moved after the dispenser 200 is positioned at the pattern formation start point P, the discharge start signal is applied to the dispenser 200, and the raw material is discharged from the nozzle 210. Therefore, it is preferable to apply the discharge start signal for forming the next pattern 11 when the dispenser 200 reaches the discharge start signal application point S1 because the dispenser 200 is horizontally moved to form after the initial pattern 11 is formed on the substrate 10. The next pattern 11.

Moreover, if the pattern 11 to be formed on the substrate 10 is divided into a first region, a second region, and a third region (as shown in FIGS. 3 and 4), it may be added to the syringe 220 to form a pattern. The pressure in the first zone of 11 is adjusted to be from about 30% to about 80% of the pressure added to the syringe to form the second zone. Therefore, the thickness of the first zone can be adjusted such that it does not cause thicknesses thicker than the second zone and the third zone by creating a block of raw material in the first zone of the pattern 11. For example, when the pressure added to the syringe 220 to form the first zone is equal to the pressure added to the syringe to form the second zone, the raw material may be lumped concentrated in the first zone. This is because the raw material remaining in the nozzle 210 is discharged together with the raw material newly supplied from the syringe 220 to the nozzle 210 at the same time. Accordingly, the pressure added to the first region of the pattern 220 to form the pattern 11 can be adjusted to be about 30% to about 80% of the pressure applied to the syringe to form the second zone. Therefore, the thickness of the first region can be prevented from being thicker than the thickness of the second region due to the raw material block in the first region of the pattern 11. According to an exemplary embodiment, the first zone may belong to a range covering the starting point P1 of the pattern formation by about 0.5 mm.

In order, continuously in the direction toward the pattern forming end point P2 and While moving the dispenser 200 horizontally, the second and third regions of the pattern 11 are formed. The control section 400 calculates the discharge end signal application point S2. Thereafter, as shown in FIG. 4, when the dispenser 200 is located at a position higher than the discharge end signal application point S2, the control portion 400 applies the discharge end signal of the raw material to the dispenser 200. This case prevents the coating of the raw material after passing through the pattern forming end point P2 when the plurality of patterns 11 are formed on the substrate 10 while moving the dispenser 200 horizontally (as described in the exemplary embodiment) . Generally, it takes a predetermined period of time after the discharge end signal is applied to the dispenser 200 until the supply of raw material from the syringe 220 to the nozzle 210 is actually stopped. That is, although the discharge end signal is applied to the dispenser 200, the discharge of the raw material from the nozzle (due to the raw material remaining in the nozzle 210) is not immediately stopped. Therefore, the discharge end signal application point S2 may be determined depending on the length of the raw material discharged from the nozzle 210 after the discharge end signal is applied to the dispenser 200. Moreover, the discharge end signal application point S2 may be changed according to the pressure added to the syringe 220 of the dispenser 200 before the discharge end signal is applied to the dispenser 200. This can be expressed as the following equation: "Emission end signal application point S2 = pressure added to the syringe x length change per pressure". Here, the change in length per pressure indicates the length of the raw material applied from the nozzle 210 onto the substrate 10 after the discharge end signal of the raw material is applied to the dispenser 200. Moreover, the length of each pressure changes depending on the moving speed of the visual dispenser 200 and the viscosity of the raw material. Therefore, according to an exemplary embodiment, the change in length per pressure is calculated based on the moving speed of the dispenser 200 and the raw materials used in the actual process. Next, the calculated data is applied to the following equation to obtain an emission end signal. Application point S2: (discharge end signal application point S2 = pressure added to the syringe x length change per pressure).

Table 1 illustrates the length of the raw material applied from the nozzle to the substrate according to the pressure change after the discharge end signal is applied.

Referring to Table 1, as the pressure within the syringe 220 increases, the length of the raw material applied to the substrate 10 after the application of the discharge end signal is increased. For example, in a state where a pressure of about 100 kPa is added to the syringe 220, the pressure is stopped after the raw material is applied onto the substrate 10. Even after the pressure is stopped from being added to the syringe 220, the raw material is kept discharged from the nozzle 210 to apply the raw material to the substrate 10 for a length of about 1 mm. As the pressure within the syringe 220 increases, the length of the raw material applied to the substrate 10 increases after the discharge end signal is applied.

As described above, the data can be applied to the following equation to calculate the discharge end signal application point S2: (the discharge end signal application point S2 = added to The pressure in the syringe x the length of each pressure changes). The discharge end signal application point S2 is calculated as a distance unit. For example, when the pressure applied to the syringe 220 is about 100 Kpa, the length of each pressure changes to about 1 mm, as shown in Table 1. Applying this case to the equation, the discharge end signal application point S2 is expressed as the following equation: S2 = 100 Kpa × (1 mm / 100 Kpa). Therefore, the calculated value is about 1 mm. When the horizontally moving dispenser 200 is located at a position of about 1 mm before the pattern formation end point P2, the discharge end signal of the raw material is applied to the dispenser 200, as shown in FIG.

When the discharge end signal of the raw material is applied to the dispenser 200, the addition of pressure to the syringe 220 is stopped. Moreover, the valve disposed between the syringe 220 and the nozzle 210 begins to operate to block communication between the syringe 220 and the nozzle 210. Therefore, the raw material remaining in the nozzle 210 is applied onto the substrate 10 after passing through the discharge end signal application point S2. During the progress of the process described above, the dispenser 200 reaches the patterning end point P2. As described above, the discharge end signal is applied before the dispenser 200 reaches the pattern formation end point P2 to effectively prevent the discharge of the raw material after passing through the pattern formation end point P2. Therefore, it is possible to prevent the raw material from being applied onto the substrate 10 after passing through the pattern forming end point P2.

Thereafter, the dispenser 200 can be continuously and horizontally moved to form the next pattern 11 without stopping. The plurality of patterns 11 are formed on the substrate 10 by repeatedly performing the processes described above.

Although the plurality of patterns are formed in the present exemplary embodiment to electrically connect the upper substrate and the lower substrate of the LCD to each other, the present invention is not limited to this. For example, the plurality of patterns formed on a substrate can be applied to various fields. Moreover, although the metal paste is used as a raw material for electrically connecting the upper substrate and the lower substrate to each other in the present embodiment, the present invention is not limited thereto. For example, various materials can be used as raw materials.

As described above, in an exemplary embodiment, the dispenser is moved horizontally to discharge the raw material onto the substrate, thereby forming the plurality of patterns on the substrate. In addition, the gap between the substrate and the nozzle when the raw material is discharged onto the substrate is equal to the gap between the substrate and the nozzle when the raw material is not discharged onto the substrate. Since the plurality of patterns can be formed on the substrate without repeatedly raising or lowering the dispenser to adjust the gap between the substrate and the nozzle, the entire processing time can be reduced.

When the dispenser is located at a position before the start of pattern formation, a discharge start signal of the raw material is applied to the dispenser. Therefore, the pattern can be formed at the desired position. Moreover, the pressure of the first zone added to the syringe to form the pattern can be adjusted to be from about 30% to about 80% of the pressure added to the syringe to form the second zone. Therefore, it is possible to prevent the raw materials from being concentrated in the first region in a block.

In addition, when the dispenser is located at a position before the end of the pattern formation, the discharge end signal of the raw material is applied to the dispenser. Therefore, it is possible to prevent the raw material from being applied onto the substrate after passing through the pattern forming end point.

Although the organic light-emitting device and the method of manufacturing the same have been described with reference to specific embodiments, it is not limited thereto. Accordingly, it will be apparent to those skilled in the art that various modifications and changes of the invention may be made without departing from the spirit and scope of the invention.

While the present invention has been described in its preferred embodiments, the present invention is not intended to limit the invention, and the present invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application.

10‧‧‧Substrate

11‧‧‧ pattern

100‧‧‧ platform

200‧‧‧Distributor

210‧‧‧Nozzles

220‧‧‧Syringe

230‧‧‧ body part

240‧‧‧ sensor

250‧‧‧ Drive section

300‧‧‧Transfer section

400‧‧‧Control section

FIG. 1 is a schematic diagram of a dispenser device, in accordance with an exemplary embodiment.

2 is a cross-sectional view of a dispenser in accordance with an exemplary embodiment.

3 is a cross-sectional view for explaining a discharge start signal application point, in which discharge for discharging raw materials from a dispenser is applied to the discharge start signal application point when the dispenser is horizontally moved by a method according to an exemplary embodiment Start signal.

4 is a cross-sectional view for explaining a discharge end signal application point, in which emission of a raw material discharged from a dispenser is applied to the discharge end signal application point when the dispenser is horizontally moved by a method according to an exemplary embodiment End signal.

FIG. 5 is a cross-sectional view for explaining horizontal movement of a dispenser according to an exemplary embodiment.

10‧‧‧Substrate

11‧‧‧ pattern

200‧‧‧Distributor

Claims (12)

A method for controlling a dispenser device, the dispenser device comprising a syringe storing a raw material, a nozzle for discharging the raw material onto a substrate, a valve for controlling communication between the syringe and the nozzle, and adapted A dispenser for forming a plurality of patterns spaced apart from each other on the substrate, the method comprising: horizontally moving the dispenser to discharge the raw material onto the substrate, thereby forming the plurality of patterns a gap between the substrate and the nozzle when the raw material is discharged onto the substrate is equal to a gap between the substrate and the nozzle when the raw material is not discharged onto the substrate, Wherein, a region between the pattern formation start point at which the formation of each pattern is started on the substrate and the pattern formation end point at which the pattern is formed is formed, from the start of the pattern formation to the end of the pattern formation The direction of the dots is divided into a first zone, a second zone, and a third zone, and a pressure added to the syringe to form a pattern in the first zone is adjusted to be added to the Syringe to form a pattern of pressure in said second region is 30% to 80%. The method of claim 1, wherein during the horizontal movement of the dispenser, between the substrate and the nozzle when the raw material is discharged onto the substrate during the process The gap is maintained without repeatedly adjusting the gap by raising or lowering the dispenser. The method of claim 1, further comprising A discharge start signal of the raw material is applied to the dispenser before discharging the raw material onto the substrate to form the pattern. The method of claim 1, further comprising applying a discharge end signal of the raw material to the dispenser when the dispenser is located at a position before the pattern formation end point of each pattern . The method of claim 1, wherein the discharge start signal of the raw material is applied to the dispenser when the dispenser is located at a position before the pattern formation start point. The method of claim 5, wherein the discharge start signal application point is adjusted by a moving speed of the dispenser, a pressure addition time in the syringe, and an operation time of the valve. The method of claim 6, wherein the discharge start signal application point is calculated by the following equation: "discharge start signal application point = moving speed of the dispenser x pressure in the syringe plus time x valve Operating time". The method of claim 7, wherein the emission start signal application point is located at a position apart from the calculated value before the pattern formation start point, and is spaced apart from the pattern formation start point by the The value calculated by the "emission start signal application point = moving speed of the dispenser x pressure addition time in the syringe x operating time of the valve" of the equation. The method of claim 1, wherein the first region of the pattern belongs to a range covering about 0.5 mm from the beginning of the pattern formation. The method of claim 1, wherein the discharge end signal of the raw material is applied to the dispenser when the dispenser is located at a position before the end of the pattern formation. The method of claim 10, wherein the discharge end signal application point is calculated as a distance value by the following equation: "discharge end signal application point S2 = pressure added to the syringe x per pressure The length changes." The method of claim 11, wherein the discharge end signal application point is located at a position apart from the calculated value before the pattern formation end point.