201114503 六、發明說明： 【發明所屬之技術領域】 本發明是有關於-種用於控制分配器設備的方法，且 更確切地說，涉及一種用於控制如下分配器的方法，所述 分配器能夠減少在基板上形成多個圖案的處理時間。 【先前技術】 陰極射線官（CRT)已用作現有技術顯示裝置^然而， CRT具有體積大且4量重的限制。近年來，例如液晶顯示 裝置(LCD )、電漿顯不面板(PDP)和有機發光裝置（〇LED) 的平板顯示器（FPD)廣泛用作顯示裝置。FpD具有重量 輕、構形纖細和功率消耗低的優點。 八 里 為了製造此種類型的FPD，將一對平坦基板彼此接 舉例來說’在LCD的情況下，製造包括多個薄膜晶體 管和像素電㈣下部基板與包括彩色濾光片和共用電極的 士部基板。接著，沿著上部基板和下部基板中的一者或兩 者的邊緣區域而設置多個金屬圖案，以將 到下部基板。所述多個圖案可沿著邊緣的圓周彼此間隔開。 -種用於將金屬膏(paste)塗覆到上部基板和下部基板 1的-者或兩者上以形成所述多個圖案的分配器設備包括 安裝有所述基板的平臺、包括用於排放源材料（例如，塗 ，到安裝於所述平*上的絲上的金Jf)时嘴的分配 器用於測量基板與喷嘴之間的間隙的感測器、用於提升 ，配器的驅動料、胁水平地移動分配器的傳送㈣伽) 部分，和用於控制分配器的操作的控制部分。 201114503 首先，使用感測器來測量基板盥喑 Ϊ用現有技術分配器設備在基板上形成所述;： 考，分配n上升或下降以難基_=圖案。接 調整基板财欽_間_從喷嘴B排^=板 上。此後，在從喷嘴排放源材料的同時移到基板 成具有所要長度的圖案。當形成具有所要長心形 停止，嘴排放源材料且將分配器提升約fcm:’BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for controlling a dispenser device, and more particularly to a method for controlling a dispenser, the dispenser The processing time for forming a plurality of patterns on the substrate can be reduced. [Prior Art] A cathode ray officer (CRT) has been used as a prior art display device. However, the CRT has a large volume and a limit of 4 weights. In recent years, flat panel displays (FPDs) such as liquid crystal display devices (LCDs), plasma display panels (PDPs), and organic light-emitting devices (〇LEDs) have been widely used as display devices. FpD has the advantages of light weight, slim configuration and low power consumption. In order to manufacture this type of FPD, a pair of flat substrates are connected to each other. For example, in the case of an LCD, a plurality of thin film transistors and a pixel electric (four) lower substrate and a portion including a color filter and a common electrode are fabricated. Substrate. Next, a plurality of metal patterns are provided along the edge regions of one or both of the upper substrate and the lower substrate to be transferred to the lower substrate. The plurality of patterns may be spaced apart from one another along the circumference of the edge. a dispenser device for applying a metal paste to the upper substrate and the lower substrate 1 or both to form the plurality of patterns, comprising a platform on which the substrate is mounted, including for discharging a source material (for example, a gold Jf applied to a wire mounted on the flat surface), a dispenser for the nozzle for measuring a gap between the substrate and the nozzle, a lift for the lifter, a drive material for the dispenser, The threat moves the transfer (four) gamma portion of the dispenser horizontally and the control portion for controlling the operation of the dispenser. 201114503 First, a sensor is used to measure the substrate. The prior art dispenser device is used to form the substrate on the substrate;: test, assign n to rise or fall to a hard-to-base pattern. Connect the adjustment substrate _ _ _ from the nozzle B row ^ = board. Thereafter, the substrate is moved to a pattern having a desired length while discharging the source material from the nozzle. When formed with a desired long heart shape stop, the mouth drains the source material and lifts the dispenser about fcm:’
二器移動到將形成下一個圖案的位置。當 一個圖案的位置時’使用感測器來測 里土板/、喷嘴之間的嶋’ ^降低分配器，藉此調整基 =嘴=間的間隙。此後，在從喷嘴排放源材料的同ς移 動分配器’以形成具有所要長度的圖案^接著，將上 描述的過程重複若干次，以在基板上形成所述多個圖案。斤 參考如上文所描述的現有技術分配器設備的配置 了形成所述多個圖案，分配器需要在每次形成圖案時上 或下降以調整基板與喷嘴之間的間隙。因為當在基板上形 成所述多個圖案的同時將基板與喷嘴之間的間隙調整了若 干··人，所以增加處理時間。因此，此類方法可能很難避 低生產率的缺點。 【發明内容】 本發明提供一種用於控制分配器設備的方法，其中水 平地移動所述分配器以將源材料排放到基板上，藉此減少 形成多個圖案的處理時間。 根據示範性實施例，提供一種用於控制分配器設備的 201114503 方法’所述分配器設備包括存儲源材料的注射器 (syringe)、將源材料排放到基板上的喷嘴、控制注射器與 喷嘴之間的連通的閥門(valve)，和經調適以在所述基板上 形成彼此間隔開的多個圖案的分配器，所述方法包括：水 平地移動为配器以將源材料排放到基板上，藉此形成所述 夕個圖案，其中在將源材料排放到基板上時的基板與喷嘴 之間的間隙等於未將源材料排放到基板上時的基板與喷嘴 之間的間隙。 ' 所述分配器的水平移動可包括在將源材料排放到基板 上時維持基板與喷嘴之間的間隙，而無需重複地執行以下 過程：其中，當在基板上形成彼此間隔開的多個圖案時， :配器上升或下降若干次以調整基板與喷嘴之間的間隙。 所述方法可進一步包括將源材料排放到基板上以形成 圖案之前，向分配器施加源材料的排放開始信號。 所述方法可進一步包括在基板上形成圖案結束之前， 向分配器施加源材料的排放結束信號。 在開始形成圖案的實際位置被稱作圖案形成開始點的 情況下，可在分配器位於所述圖案形成開始點之前的位置 處時，向分配器施加源材料的排放開始信號。 所述排放開始信號施加點可通過分配器的移動速度、 注射器内的壓力加添時間和閥門的操作時間來調整。 所述排放開始信號施加點可通過以下等式而計算為距 離值：“減_錢施加點=純n的移域注射 器内的壓力加添時間X閥門的操作時間”。 201114503 所述排放開始信號施加點可位於圖案形成點之前的相 距所計算的值的位置處。 當從圖案形成開始點起將基板上的圖案劃分成第_ 區、第二區和第三區時，可將加添到注射器中以形成所述 圖案的第一區的壓力調整為加添到注射器中以形成所述第 二區的壓力的約30%到約80%。 所述圖案的第一區可屬於覆蓋距圖案形成開始點約 0.5 mm的範圍。The second device moves to a position where the next pattern will be formed. When the position of a pattern is used, 'the sensor is used to measure the 里 、 、 、 、 ^ ^ ^ ^ ^ ^ ^ ^ ^ 降低 降低 降低 降低 降低 降低 降低 降低 降低 降低 降低 降低 降低 降低 降低Thereafter, the dispenser is moved at the same level as the source material is discharged from the nozzle to form a pattern having a desired length. Next, the above described process is repeated several times to form the plurality of patterns on the substrate. Referring to the configuration of the prior art dispenser apparatus as described above, the plurality of patterns are formed, and the dispenser needs to be lowered or lowered each time the pattern is formed to adjust the gap between the substrate and the nozzle. Since the gap between the substrate and the nozzle is adjusted to a certain amount while forming the plurality of patterns on the substrate, the processing time is increased. Therefore, such methods may be difficult to avoid the disadvantages of productivity. SUMMARY OF THE INVENTION The present invention provides a method for controlling a dispenser apparatus in which the dispenser is horizontally moved to discharge source material onto a substrate, thereby reducing processing time for forming a plurality of patterns. According to an exemplary embodiment, there is provided a 201114503 method for controlling a dispenser device. The dispenser device includes a syringe that stores source material, a nozzle that discharges source material onto the substrate, and controls between the injector and the nozzle. a communicating valve, and a dispenser adapted to form a plurality of patterns spaced apart from each other on the substrate, the method comprising: moving horizontally as a dispenser to discharge source material onto the substrate, thereby forming The evening pattern, wherein a gap between the substrate and the nozzle when the source material is discharged onto the substrate is equal to a gap between the substrate and the nozzle when the source material is not discharged onto the substrate. The horizontal movement of the dispenser may include maintaining a gap between the substrate and the nozzle when discharging the source material onto the substrate without repeatedly performing a process in which a plurality of patterns spaced apart from each other are formed on the substrate When: the adapter is raised or lowered several times to adjust the gap between the substrate and the nozzle. The method can further include applying a discharge start signal of the source material to the dispenser prior to discharging the source material onto the substrate to form a pattern. The method can further include applying a discharge end signal of the source material to the dispenser before the end of the patterning on the substrate. In the case where the actual position at which the patterning is started is referred to as a pattern formation start point, the discharge start signal of the source material can be applied to the dispenser when the dispenser is located at a position before the pattern formation start point. The discharge start signal application point can be adjusted by the moving speed of the dispenser, the pressure addition time in the syringe, and the operating time of the valve. The discharge start signal application point can be calculated as the distance value by the following equation: "minus_money application point = pressure in the shifting syringe of pure n plus time X valve operation time". The discharge start signal application point of 201114503 may be located at a position spaced apart from the calculated value before the pattern formation point. When the pattern on the substrate is divided into the _th region, the second region, and the third region from the start of the pattern formation, the pressure added to the first region of the pattern to form the pattern may be adjusted to be added to The syringe is formed to form from about 30% to about 80% of the pressure of the second zone. The first region of the pattern may belong to a range of about 0.5 mm from the beginning of the pattern formation.
在基板上形成所述圖案結束的實際位置被稱作圖案形 成結束點的情況下，可在分配器位於所述圖案形成結束點 之刖的位置處時，向分配器施加源材料的排放結束信號。 所述排放結束信號施加點可通過以下等式而計算為距 離值：“排放結束信號施加點S2 =加添到注射器中的壓 力X每壓力的長度改變”。 土 所述排放結束信號施加點可位於所述圖案形成結束點 之前的相距所計算的值的位置處。 為讓本發明之上述和其他目的、特徵和優點能更明顯 易懂，下文特舉較佳實施例，並配合所附圖式，作詳細說 明如下。 ' 【實施方式】 在下文中，將參看附圖詳細地描述特定實施例。然而， 本發明可以;式綠現且减被_ =的實施例。而是，提供這些實施例以使得 透徹且完整的，且將本發_翻完全傳達給所屬領域的 201114503 ，術人員。在諸圖巾’ 4目似參考數字貫穿全文指代相似元 件。 、圖1為㈣示範性實施例的分配器設備的示意圖。圖 2為根據示紐實關的分㈣的截面圖。圖3為用於解 ，排放開始信號施加點的截面圖，其中在通過根據示範性 實施例的方法水平地移動分g&||時，向所述排放開始信號 施加點施加用於從分配器排放源材料的排放開始信號。圖 4為用於解釋排放結束信號施加點喊面圖，其中在通過 根j不範性實_的方法水平地移動分配料，向所述排 放，，信號施加點施加用於從分配^排放㈣料的排放結 束L號_ 5為用於解釋根據示範性實施例的分配器的水 平移動的截面圖。 參看圖1和圖2 ’根據示範性實施例的分配器設備包 括·安裝有基板10的平臺1〇〇 ;分配器2〇〇，其包括用於 將源材料排放到安裝於平臺1〇〇上的基板1〇上的喷嘴 210,用於測量基板10與喷嘴21〇之間的間隙的感測器 240，用於提升分配器2〇〇的驅動部分25〇 ;用於水平地移 動分配器200的傳送部分300 ;和用於控制分配器2〇〇的 操作的控制部分400。 根據示範性實施例的基板1〇可為用於液晶顯示裝置 (LCD)的上部基板和下部基板中的一者。雖然未展示， 但（例如）彩色濾光片（filter)和共用電極可設置在上部基 板上，且多個薄膜晶體管和一個像素電極可設置在下部基 板上。當將上部基板與下部基板彼此接合以製造LCD時， 201114503 可在上部基板和下部基板中的一者上設置由金屬膏形成的 多個圖案，以將上部基板電連接到下部基板。根據示範性 實施例，銀（Ag)膏用作源材料，Ag膏是存儲於注射器 内且塗覆到基板10上。 、 ° 用傳送部分300在X-軸或軸方向上移動分配器 以k著基板10的邊緣區的圓周塗覆源材料，藉此形 成戶^述多個圖案11。傳送部分300使用馬達和軌道來移動 平臺100和分配器200。或者，可使用其他多種單元來移 動平臺100和分配器200。雖然在本示範性實施例中是在 X-軸或Y·财向上水平地祕分配器細，但本發明不限 於此。舉例來說，可在X·軸或γ_軸方向上移動 以將源材料塗覆到基板10上。或者，可在χ_轴或γ_抽方 向上移動平臺100與分配器細兩者以塗覆源材料。 侧向上移動分配器 分配器200包括：存儲著源材料（例如 射器220;固定地裝設有注射器22〇的主^脸/ ^於注射器2财峨料排放縣= ^ 雖然未展示，但用於控制注射器22〇 的連通的閥門（例如，電磁閥）可射二 嘴加之間。因此，當將壓力加添到 、ί 使用閥門使注射器220與噴嘴210連通時' 將 /原材料供應到注射_中。接著，從嘴嘴_放源i 9 201114503 料。 根據示範性實施例，在形成所述多個圖案u的同時， 分配器並*上升和下降若干次關整基板1()與喷嘴 210之__，此做法不同于現有技術。即，如圖5中 所展示，在形成所述多個圖案u期間，水平地移動分配器 200而並不是將分㈣提升和下降若干次，同時基板 10與分配器200保持預定間隙。即，水平地移動分配器 200，以使得排放源材料時的基板1〇與喷嘴21〇之間的間 隙等於未排放源材料時的基板1〇與噴嘴之間的間隙。下文 將詳細描述分配器200的水平移動。 感測器240測量基板1〇與喷嘴21〇之間的間隙。雖然 未展示’但感測器240包括向基板1〇上發射光以用於測量 距離的發光部分（未展示）和接收自所述發光部分發射的 光的光接收部分（未展示）。發光部分與光接收部分可一 體地形成於一個主體中且彼此以預定距離間隔開。驅動部 分250經配置以基於來自感測器24〇的測量值來提升分配 器200 ’以將基板與喷嘴210之間的間隙調整到約4〇 μιη。 根據示範性實施例，可僅提升分配器2〇〇 一次，以調 整基板10與喷嘴210之間的間隙。可在基板上形成圖 案11之前調整基板10與喷嘴21〇之間的間隙。此後，可 連續地且水平地移動分配器200以形成所述多個圖案u， 而並不提升或下降分配器200。另外，感測器24〇可在水 平地移動分配器200以在基板1〇上形成所述多個圖案η 的同時連續地測量基板10與喷嘴210之間的間隙。 201114503 々控制部分400控制分配器2〇〇的操作以避免產生有缺 陷的圖案。為此目的，控制部分棚存儲基板10的將開始 形成圖案11的點（圖案形成開始點pl)和圖案n的形成 將、、束的(圖案形成結束點μ )。而且，控制部分4〇〇 :十^•排放開始彳§號施加點S1和排放結束信號施加點S2。 ^移動中之分配器2〇〇定位於排放開始信號施加點si處 叶，向分配器200施加用於排放源材料的排放開始信號。 而且’±當移動中之分配器2〇〇定位於排放結束信號施加點 • S2處時，向分配器200施加用於結束排放源材料的排放結 束#號。下文將詳細描述圖案形成開始點ρι、圖案形成結 束點P2、排放開始信號施加點S1和排放結束信號施加點 S2 ° 在下文中，將參看圖1到圖5描述用於在連續地且水 平地移動分配器200的同時在基板1〇上形成所述多個圖案 11的方法。 ^ 首先’將基板10安置於分配器設備的平臺上，且 φ 使用感測器240來測量基板10與噴嘴210之間的間隙。基 板10可為LED面板的上部基板和下部基板中的一者。威 測器240測量基板10與喷嘴210之間的間隙，且驅動部分 250基於感測器240的測量值來提升分配器2〇〇以將基板 10與喷嘴210之間的間隙調整到約40 μ„^可僅提升分配 器200 —次，以調整基板10與喷嘴21〇之間的間隙。此外， 可在基板10上形成圖案11之前調整基板1〇與喷嘴210 之間的間隙。 11 201114503 接著，使用傳送部分300水平地移動分配器2〇〇。可 朝向在基板10上開始形成圖案U的位置（即，圖案形成 開始點P1)水平地移動分配器2〇〇。在朝向圖案形成開始 點P1水平地移動分配器200的同時，控制部分400計算In the case where the actual position at which the end of the pattern is formed on the substrate is referred to as a pattern formation end point, the discharge end signal of the source material may be applied to the dispenser when the dispenser is located at a position other than the end of the pattern formation end point. . The discharge end signal application point can be calculated as the distance value by the following equation: "Emission end signal application point S2 = pressure X added to the syringe changes per length of the pressure". The soil discharge end signal application point may be located at a position apart from the calculated value before the pattern formation end point. The above and other objects, features and advantages of the present invention will become more <RTIgt; [Embodiment] Hereinafter, specific embodiments will be described in detail with reference to the accompanying drawings. However, the present invention can be used to formulate green and subtract the embodiment of _ =. Rather, these embodiments are provided so that they are thorough and complete, and the present invention is fully conveyed to the skilled artisan. The reference numerals in the figures are referred to throughout the text as similar elements. 1 is a schematic view of a dispenser device of a (four) exemplary embodiment. Figure 2 is a cross-sectional view of the sub-section (4) according to the indication. 3 is a cross-sectional view for explaining a discharge start signal application point, wherein when the division g&|| is horizontally moved by a method according to an exemplary embodiment, a discharge start signal application point is applied to the dispenser The emission start signal of the source material. Figure 4 is a cross-sectional view for explaining the discharge end signal application point, wherein the distribution material is horizontally moved by the method of the root j, and to the discharge, the signal application point is applied for the discharge from the distribution (4) The discharge end of the material L No. 5 is a sectional view for explaining the horizontal movement of the dispenser according to the exemplary embodiment. Referring to Figures 1 and 2, a dispenser apparatus according to an exemplary embodiment includes a platform 1 on which a substrate 10 is mounted, and a dispenser 2 that includes means for discharging source material to a platform 1 a nozzle 210 on the substrate 1 , a sensor 240 for measuring a gap between the substrate 10 and the nozzle 21 , for lifting the driving portion 25 分配器 of the dispenser 2 〇; for moving the dispenser 200 horizontally Transfer portion 300; and control portion 400 for controlling the operation of the dispenser 2''. The substrate 1 according to an exemplary embodiment may be one of an upper substrate and a lower substrate for a liquid crystal display device (LCD). Although not shown, for example, a color filter and a common electrode may be disposed on the upper substrate, and a plurality of thin film transistors and one pixel electrode may be disposed on the lower substrate. When the upper substrate and the lower substrate are bonded to each other to manufacture an LCD, 201114503 may provide a plurality of patterns formed of a metal paste on one of the upper substrate and the lower substrate to electrically connect the upper substrate to the lower substrate. According to an exemplary embodiment, a silver (Ag) paste is used as a source material, and an Ag paste is stored in a syringe and coated on the substrate 10. And moving the dispenser in the X-axis or the axial direction by the conveying portion 300 to apply the source material to the circumference of the edge portion of the substrate 10, thereby forming a plurality of patterns 11 for the household. The transfer portion 300 uses the motor and the track to move the platform 100 and the dispenser 200. Alternatively, a variety of other units can be used to move platform 100 and dispenser 200. Although in the present exemplary embodiment, the dispenser is fine in the X-axis or the Y-axis, the present invention is not limited thereto. For example, it is possible to move in the X·axis or γ_ axis direction to apply the source material onto the substrate 10. Alternatively, both the platform 100 and the dispenser can be moved in the χ_axis or γ_ pumping direction to coat the source material. Moving the dispenser dispenser 200 laterally includes: storing the source material (eg, the emitter 220; the main face of the syringe 22 固定 fixedly mounted / ^ in the syringe 2 排放 discharge county = ^ although not shown, but used A valve (e.g., a solenoid valve) that controls the communication of the syringe 22A can be injected between the two nozzles. Therefore, when pressure is added to, ί is used to connect the syringe 220 to the nozzle 210, the raw material is supplied to the injection_ Then, from the nozzle _ source i 9 201114503. According to an exemplary embodiment, while forming the plurality of patterns u, the dispenser and * rise and fall several times to close the substrate 1 () and the nozzle 210 __, this is different from the prior art. That is, as shown in FIG. 5, during the formation of the plurality of patterns u, the dispenser 200 is moved horizontally instead of lifting and lowering the sub-fours simultaneously, while the substrate 10 maintains a predetermined gap with the dispenser 200. That is, the dispenser 200 is moved horizontally such that the gap between the substrate 1〇 and the nozzle 21〇 when the source material is discharged is equal to the gap between the substrate 1〇 and the nozzle when the source material is not discharged. Clearance. Below The horizontal movement of the dispenser 200 is described in detail. The sensor 240 measures the gap between the substrate 1〇 and the nozzle 21〇. Although not shown, the sensor 240 includes a light that emits light onto the substrate 1 for measuring the distance. a portion (not shown) and a light receiving portion (not shown) that receives light emitted from the light emitting portion. The light emitting portion and the light receiving portion may be integrally formed in one body and spaced apart from each other by a predetermined distance. It is configured to raise the dispenser 200' based on the measured value from the sensor 24A to adjust the gap between the substrate and the nozzle 210 to about 4 μm. According to an exemplary embodiment, only the dispenser 2 may be lifted. Second, to adjust the gap between the substrate 10 and the nozzle 210. The gap between the substrate 10 and the nozzle 21A can be adjusted before the pattern 11 is formed on the substrate. Thereafter, the dispenser 200 can be continuously and horizontally moved to form the a plurality of patterns u without lifting or lowering the dispenser 200. In addition, the sensor 24A can move the dispenser 200 horizontally to form the plurality of patterns η on the substrate 1 连续 continuously while continuously The gap between the substrate 10 and the nozzle 210 is measured. 201114503 The control portion 400 controls the operation of the dispenser 2〇〇 to avoid the formation of a defective pattern. For this purpose, the point at which the portion of the shed storage substrate 10 will begin to form the pattern 11 is controlled. (pattern formation start point pl) and formation of pattern n, (bundle formation end point μ). Moreover, control section 4: 10: discharge start point 彳 § application point S1 and discharge end signal application point S2. The moving distributor 2 is positioned at the leaf at the discharge start signal application point si, and applies a discharge start signal for discharging the source material to the distributor 200. And '± when the moving distributor 2 is positioned At the discharge end signal application point • S2, the discharge end # number for ending the discharge source material is applied to the dispenser 200. The pattern forming start point ρ1, the pattern forming end point P2, the discharge start signal application point S1, and the discharge end signal application point S2 ° will be described in detail hereinafter, and will be described with reference to FIGS. 1 to 5 for continuous and horizontal movement. A method of forming the plurality of patterns 11 on the substrate 1 at the same time as the dispenser 200. ^ First, the substrate 10 is placed on the platform of the dispenser device, and φ uses the sensor 240 to measure the gap between the substrate 10 and the nozzle 210. The substrate 10 can be one of an upper substrate and a lower substrate of the LED panel. The detector 240 measures the gap between the substrate 10 and the nozzle 210, and the driving portion 250 raises the dispenser 2 based on the measured value of the sensor 240 to adjust the gap between the substrate 10 and the nozzle 210 to about 40 μ. The gap between the substrate 10 and the nozzle 21A can be adjusted only by raising the dispenser 200. Further, the gap between the substrate 1 and the nozzle 210 can be adjusted before the pattern 11 is formed on the substrate 10. 11 201114503 The dispenser 2 is horizontally moved using the transfer portion 300. The dispenser 2 can be horizontally moved toward a position at which the formation of the pattern U is started on the substrate 10 (i.e., the pattern formation start point P1). While P1 moves the dispenser 200 horizontally, the control portion 400 calculates
排放開始信號施加點S1。此後，如圖3中所展示，當分酉ί 益200位於高於排放開始信號施加點S1的位置處時，指 制部分400向分配器200施加用於排放源材料的排放開把 k號。因此，可在連續地且水平地移動分配器2〇〇的同時 在所要位置處形成圖案U。此處，如圖3中所展示，排潑 開始信號施加點S1可設置于圖案形成開始點ρι之前的相 距預定距離的位置處。排放開始信號施加點S1是根據分 配器200的移動速度、用於在注射器22〇内加添足夠壓力 的時間和閥門的操作時間而改變。通常，在控制部分4〇( 向分配器200施加排放開始信號之後直到從分配 喷嘴2H)排放源材料為止，需要一段預定時間。即，需^ 預定時間峽在存儲著源_敝射_ 22G 0加添足夠壓 力，以使得可將源材料供應到喷嘴21〇。亦需要預定時間 以操作閥門，以使得注射器220可與喷嘴21〇連通。因此0， 即使控制部分働向分配器供應用於排放源材料的命 令信號，也並不立即從分配器200排放源材料。另外， 放開始信號施加點S1可視分配器200的移動速度而定 此是因為圖案11是在水平地移動分配器2 〇 〇的同時形$ 基板10上。可將上述關係表達為以下等式：“排放^始 號施加點S1 =分配器200的移動速度x閥門的操作#時: 12 201114503 注射器^20内的壓力加添時間”。根據示範性實施例 用以下等式計算排放開始信號施加點S1 :(排放 施加點S1 =分配器的移動速度X閥門的操作時間 内的壓力加添時間）。將排放開始信號施加點S1計瞀^ 距離單位1賊開始信號施加點S1設定為在 ^ ，始點P1之前的相距計算的值的位置。舉例來說了當 算的值為約lmm時，在圖案形成開始點P1之前的相^約 1 的位置處施加排放開始信號。因此，當移動中之义 配器200定位於排放開始信號施加點S1處時，控制部二 4〇〇向分配器200施加用於排放源材料的排放刀 如圖3中所展示。 唬’ 當向分配器200施加用於排放源材料的排放開始俨號 時，開始向注射器220中加添壓力。接著，設置於注^ 220與喷嘴210之間的闊門開始操作以使注射器22〇盘喷 嘴210彼此連通。在上文所描述的過程的執行期間^配 器200到達圖案形成開始點pi。當分配器2〇〇位於高於圖 案形成開始點P1的位置處時，從噴嘴21〇排放注射器2如 内的源材料。即，在所要點（即’圖案形成開始點⑴處 開始塗覆源材料以形成圖案11。隨著在過程前進方向上連 續地且水平地移動分配器200，將從噴嘴21〇排放的源 料塗覆到基板10上以形成圖案11。 在於基板10上形成第一圖案U (即，初始圖案u) 的情況下，可在分配器2G0位於圖案形成開始點ρι處之 後向分配器200施加排放開始信號。即，當開始從喷嘴21〇 13 201114503 排放源材料以形成第一圖案n時，分配器2〇〇尚未移動。 因此，可在使分配器2〇〇位於圖案形成開始點p處、向分 配器200施加排放開始信號且從噴嘴21〇排放源材料之 後’水平地移動分配器200。因此，可優選在分配器2〇〇 到達排放開始錢絲點S1辆加減開始信號以用於 形成下-侧案1卜此是因為在基板1G上形成初始圖案 11之後，分配器200水平地移動以形成下一個圖案u。 而且，如果將待形成於基板10上的圖案11劃分成第 -區、第二區和第三區（如圖3和圖4中所展示），那麼 可將加添到注射器22G中以形成圖案u的第—區的塵力調 整為加添到注射器中以形成第二區的壓力的約3〇%到約 80%。因此’可調整第—區的厚度，以使得其並不因在圖 案11的第一區中產生源材料塊而致使厚于第二區和第三 區的厚度。舉例來說，當加添到注射器22〇中以形成第一 區的壓力等於加添到注射器中以形成第二區的壓力時，源 材料可成塊地(lumped)集中于第一區中。此是因為：保留 在喷嘴210中的源材料與新近從注射器22〇供應到喷嘴 210中的源材料是同時一起被排放的。因此，可將加添到 注射器22G中以形成圖案11的第-區的壓力調整為加添到 注射器中以形成第二區的壓力的約罵到約8()%。因此， 可防止第―區的厚度歸因於在lit 11的第-區中的源材 料塊而導致厚于第二區的厚.度。根據示紐實施例，第一 區可屬於覆蓋距圖案形成開始點P1 _.5nlm的範圍。 按順序，在朝向圖案形成結束點P2的方向連續地且 201114503 水平地移動分配器200的同時’形成圖案u的第二區和第 三區。控制部分400計算排放結束信號施加點幻。此後， 如圖4中所展示’當分配器2〇〇位於高於排放結束信號施 加點S2的位置處時，控制部分4〇〇向分配器2〇〇施加°源 放絲錢。崎祕止：當在水平地移動分配、 器20^的同時在基板1〇上形成所述多個圖案丨丨（如在示 範性實施例中所描述）時，在穿過圖案形成結束點打之 後塗覆源材料。通常，在向分配器200施加排放結束传號 之後直到從注射器220到噴嘴210的源材料供應實際^ 止為止’需要一段預定時間。即，雖然向分配器200施加 排放結束信號，但並不立即停止從喷嘴排放源材料（歸因 於保留在噴嘴210中的源材料）。因此，排放結束信號施 ^點S2可視在向分配器2〇〇施加排放結束信號之後仍從 ^嘴別排放源材料的長度而定。而且，排放結束信號施 、口點S2可根據在向分配器2〇〇編口排放結束信號之前加 添到分配器200的注射器220中的壓力而改變。此可表達 • $以下等式：“排放結束信號施加點S2 =加添到注射器 I的壓力X每壓力的長度改變”。此處，每壓力的長度改 變表示在向分配器200施加源材料的排放結束信號之後將 源材料從喷嘴21G塗覆到基板10上的長度。而且，每壓力 a長度改憂可視分配器2〇〇的移動速度和源材料的黏度而 二。因此，根據示範性實施例，基於分配器2〇〇的移動速 八矛用於實際過程中的源材料來計算每壓力。 接著，將計算的數據應用於以下等式以獲得排^束^號 15 201114503 施加點S2:(排放結束信號施加點S2=加添到注射器中 的壓力X每壓力的長度改變）。 表1說明在施加排放結束信號之後根據壓力改變而將 源材料從喷嘴塗覆到基板上的長度。 【表1】 注射器内的壓 力（Kpa) 每壓力的長度改變 (mm) 100 1 200 2 300 3 400 4 500 5 參看表1，隨著注射器220内的壓力增加，在施加排 放結束彳5號之後將源材料塗覆到基板10上的長度增加。舉 例來說，在將約100 Kpa的壓力加添到注射器220中的狀 態下，在將源材料塗覆到基板1〇上之後，停止加添壓力。 甚至在停止將壓力加添到注射器22〇中之後，也保持從喷 嘴210排放^材料，以將源材料塗覆到基板1〇上達約丨mm 的長度。P近著注射器220内的壓力增加，在施加排放結束 信號之後將源材料塗覆到基板10上的長度增加。 如上文所描述，可將數據應用於以下等式以計算排放 結束信號施加點S2 :(排放結束信號施加點S2 =加添到 201114503 注射器中的壓力χ每壓力的長度改變）。將排放m虎 施加點S2計算為距離單位。舉例來說，當加^注^ 220中的廢力為約1()〇 Kpa時，每壓力的長度改變為約 1mm，如表1巾所料。將此情況制於所述等式，那麼 將排放結束#號施加點S2表達為以下等式：S2= 1〇〇Kpa x (Imm/lOOKpa)。因此，計算值為約lmm。當水平移 動中之分配器20(M立於圖案形成結束點p2之前的相距約丄The discharge start signal applies a point S1. Thereafter, as shown in Fig. 3, when the branching weight 200 is located at a position higher than the discharge start signal application point S1, the finger portion 400 applies the discharge opening k number for discharging the source material to the dispenser 200. Therefore, the pattern U can be formed at a desired position while continuously and horizontally moving the dispenser 2''. Here, as shown in Fig. 3, the discharge start signal application point S1 may be disposed at a position spaced apart by a predetermined distance before the pattern formation start point ρι. The discharge start signal application point S1 is changed in accordance with the moving speed of the dispenser 200, the time for adding sufficient pressure in the syringe 22, and the operating time of the valve. Usually, it takes a predetermined period of time to discharge the source material after the control portion 4 (after the discharge start signal is applied to the dispenser 200 until the dispensing nozzle 2H). That is, the predetermined time gorge is added with sufficient pressure to store the source _ _ _ 22G 0 so that the source material can be supplied to the nozzle 21 〇. A predetermined time is also required to operate the valve such that the syringe 220 can be in communication with the nozzle 21. Therefore, even if the control section supplies a command signal for discharging the source material to the dispenser, the source material is not immediately discharged from the dispenser 200. Further, the start signal application point S1 is visually determined by the moving speed of the dispenser 200 because the pattern 11 is formed on the substrate 10 while moving the dispenser 2 水平 horizontally. The above relationship can be expressed as the following equation: "Draining point application point S1 = moving speed of the dispenser 200 x operation of the valve #: 12 201114503 Pressure adding time in the injector ^20". According to an exemplary embodiment, the discharge start signal application point S1 is calculated by the following equation: (discharge application point S1 = moving speed of the dispenser X pressure addition time in the operation time of the valve). The discharge start signal application point S1 is calculated. The distance unit 1 thief start signal application point S1 is set to the position of the value calculated by the distance before the start point P1. For example, when the calculated value is about 1 mm, a discharge start signal is applied at a position of about 1 before the pattern formation start point P1. Therefore, when the moving adapter 200 is positioned at the discharge start signal application point S1, the control portion applies a discharge knife for discharging the source material to the dispenser 200 as shown in Fig. 3.唬' When the discharge start nickname for the discharge source material is applied to the dispenser 200, pressure is applied to the syringe 220. Next, the wide door provided between the injection 220 and the nozzle 210 starts to operate to cause the syringes 22 to communicate with each other. The adapter 200 reaches the patterning start point pi during execution of the process described above. When the dispenser 2 is located at a position higher than the pattern forming start point P1, the source material such as the inside of the syringe 2 is discharged from the nozzle 21. That is, the source material is applied to form the pattern 11 at the point (ie, the 'pattern formation start point (1).) As the dispenser 200 is continuously and horizontally moved in the process advancing direction, the source material discharged from the nozzle 21 is discharged. It is applied onto the substrate 10 to form the pattern 11. In the case where the first pattern U (i.e., the initial pattern u) is formed on the substrate 10, the discharge can be applied to the dispenser 200 after the dispenser 2G0 is located at the pattern forming start point ρι The start signal. That is, when the source material is discharged from the nozzle 21〇13 201114503 to form the first pattern n, the dispenser 2〇〇 has not moved. Therefore, the dispenser 2 can be placed at the pattern forming start point p, The discharge start signal is applied to the dispenser 200 and the dispenser 200 is moved horizontally after the source material is discharged from the nozzle 21 因此. Therefore, it may be preferable to reach the discharge start cashier point S1 addition and subtraction start signal at the distributor 2〇〇 for formation. The lower-side case 1 is because after the initial pattern 11 is formed on the substrate 1G, the dispenser 200 is horizontally moved to form the next pattern u. Moreover, if the pattern 11 to be formed on the substrate 10 is to be formed Divided into the first zone, the second zone and the third zone (as shown in Figures 3 and 4), then the dust force added to the syringe 22G to form the first zone of the pattern u can be adjusted to be added to the syringe Medium to form about 3% to about 80% of the pressure of the second zone. Therefore, the thickness of the first region can be adjusted such that it is not thicker due to the generation of the source material block in the first region of the pattern 11. The thickness of the second zone and the third zone. For example, when the pressure applied to the syringe 22A to form the first zone is equal to the pressure added to the syringe to form the second zone, the source material may be in bulk The lumped is concentrated in the first zone. This is because the source material remaining in the nozzle 210 is simultaneously discharged together with the source material newly supplied from the syringe 22 to the nozzle 210. Therefore, it can be added to The pressure in the syringe 22G to form the first region of the pattern 11 is adjusted to be about 8 to about 8 ()% of the pressure applied to the syringe to form the second region. Therefore, the thickness of the first region can be prevented from being attributed to The source material block in the first region of lit 11 results in a thicker than the second region. For example, the first region may belong to a range covering the pattern formation start point P1 _.5nlm. In order, the patterning of the pattern 200 is performed while continuously moving the dispenser 200 horizontally toward the pattern forming end point P2 and 201114503. The second zone and the third zone. The control section 400 calculates the discharge end signal application point illusion. Thereafter, as shown in Fig. 4, when the distributor 2 is located at a position higher than the discharge end signal application point S2, the control section 4〇〇 Applying the source to the dispenser 2〇〇. The crunch is: when the dispenser 20 is moved horizontally, the plurality of patterns are formed on the substrate 1 (as in the exemplary When described in the examples, the source material is applied after hitting the end of the pattern formation. Generally, a predetermined period of time is required after the application of the discharge end mark to the dispenser 200 until the supply of the source material from the syringe 220 to the nozzle 210 is actually performed. That is, although the discharge end signal is applied to the dispenser 200, the discharge of the source material from the nozzle (due to the source material remaining in the nozzle 210) is not immediately stopped. Therefore, the discharge end signal application point S2 can be determined from the length of the discharge source material after the discharge end signal is applied to the distributor 2A. Moreover, the discharge end signal application point S2 can be changed in accordance with the pressure added to the syringe 220 of the dispenser 200 before the discharge end signal to the dispenser 2 is dispensed. This can be expressed as follows: $ The following equation: "Emission end signal application point S2 = pressure X added to the syringe I changes per length of the pressure". Here, the change in length per pressure indicates the length of application of the source material from the nozzle 21G to the substrate 10 after the discharge end signal of the source material is applied to the dispenser 200. Moreover, the change in the length of each pressure a can be seen by the speed of movement of the dispenser 2 and the viscosity of the source material. Therefore, according to an exemplary embodiment, each pressure is calculated based on the source material in the actual process based on the moving speed of the dispenser 2〇〇. Next, the calculated data is applied to the following equation to obtain the beam number 15 201114503 Application point S2: (the discharge end signal application point S2 = the pressure X added to the syringe changes per length of the pressure). Table 1 illustrates the length of the source material applied from the nozzle to the substrate according to the pressure change after the discharge end signal is applied. [Table 1] Pressure in the syringe (Kpa) Change in length per pressure (mm) 100 1 200 2 300 3 400 4 500 5 Referring to Table 1, as the pressure inside the syringe 220 increases, after the end of the application of the 彳5 The length of the source material applied to the substrate 10 is increased. For example, in a state where a pressure of about 100 Kpa is added to the syringe 220, the application of the pressure is stopped after the source material is applied to the substrate 1 . Even after the pressure is stopped from being added to the syringe 22, the material is discharged from the nozzle 210 to apply the source material to the substrate 1 to a length of about 丨mm. The pressure in P near the injector 220 increases, and the length of the source material applied to the substrate 10 increases after the discharge end signal is applied. As described above, the data can be applied to the following equation to calculate the discharge end signal application point S2: (the discharge end signal application point S2 = the pressure added to the 201114503 injector χ the change in length per pressure). The discharge point S2 is calculated as the distance unit. For example, when the waste force in the filler 220 is about 1 () 〇 Kpa, the length of each pressure is changed to about 1 mm, as shown in Table 1. When this is made to the equation, the discharge end # application point S2 is expressed as the following equation: S2 = 1 〇〇 Kpa x (Imm / lOOKpa). Therefore, the calculated value is about 1 mm. When the dispenser 20 in the horizontal movement is at a distance of about 图案 before the pattern forming end point p2
mm的位置處時’向分㈣_施加源材料的排放結束信 號’如圖3中所展示。 §向分配器200施加源材料的排放結束信號時，停止 將塵力加添到注射|§ 220中。而且，設置於注射器220與 喷嘴210之間的閥門開始操作以阻斷注射器22〇與喷嘴 210之間的連通。因此，在穿過排放結束信號施加點幻之 後，將保留在喷嘴210中的源材料塗覆到基板1〇上。在上 文所描述的過程進展期間，分配器2〇〇到達圖案形成結束 點P2。如上文所描述，通過在分配器2〇〇到達圖案形成結 束點P2之前施加該排放結束信號，以有效地防止在穿過 圖案形成結束點P2之後排放源材料。因此，可防止在穿 過圖案形成結束點P2之後將源材料塗覆到基板1〇上。 此後’分配器200可連續地且水平地移動以形成下一 個圖案11 ’而無需停止。通過重複地執行上文所描述的過 程’在基板10上形成所述多個圖案U。 雖然在本示範性實施例中形成所述多個圖案以將 LCD的上部基板與下部基板彼此電連接，但本發明不限於 17 201114503 例來說，形成於基板上的所述多個®案可適用於各 頁域。而且，雖然在本實施例中將金屬膏用作用以將上 u土盘與下。卩基板彼此電連接的源材料，但本發明不限於 此。舉例來說，可將各種材料用作源材料。 、 器以所描述，在示範性實施例中，水平地移動分配 =將源㈣排放到基板上，藉此在基板上形成所述多個 的二ί外：使源材料排放到基板上時的基板與喷嘴之間 的二將源材料排放到基板上時的基板與嗔嘴之間 土 Β ,'。因為可在基板上形成所述多個圖案而盔 =配Γ升或下降以調整基板與嘴嘴之間的間隙，所以 了減少整個處理時間。 ，分配n位於_形朗始點之前的位置處時，向分 開的排放開始信號。因此，可在所要位置處 第^成圖案:而且，可將加添到注射器中以形成圖案的 的約力調整為加關崎器巾以形成第二區的塵力 -區中/到約80%。因此，可防止源材料成塊地集中于第 ^外’當分配器位於圖案形成結束點之前的位置處 t向分配器施加源材料的排放結束信號。因此，可防止 在穿過圖案形成結束點之後將源材料塗覆到基板上。 雖然已參考特定實施例來描述有機發光裝置和其製造 理解:此:因此，所屬領域技術人員將容易 丄:==::==r精神 201114503 限定發已以較佳實施例揭露如上’然其並非用以 和二“丄壬可熟f此技藝者’在不脫離本發明之精神 和耗圍内，當可作些許之更動與潤飾，因此本發明之伴： 範圍當視_之_料觀_界定者解。之保邊 【圖式簡單說明】 圖1為根據示範性實施例的>配器設備的示意圖。 圖2為根據示範性實施例的分配器的截面圖。 圖3為用於解釋排放開始信號施加點的截面圖，其中 在通過根據示範性實施例的方法水平地移動分配器時，向 所述排放開始信號施加點施加用於從分配器排放源材料的 排放開始信號》 圖4為用於解釋排放結束信號施加點的截面圖，其中 在通過根據示範性實施例的方法水平地移動分配器時，向 所述排放結束信號施加點施加用於從分配器排放源材料的 排放結束信號。 圖5為用於解釋根據示範性實施例的分配器的水平移 $ 動的截面圖。 【主要元件符號說明】 10 ： 基板 11 ： 圖案 100 :平台 200 :分配器 210 :喷嘴 220 :注射器 201114503 230 :主體部份 240 :感測器 250 :驅動部分 300 :傳送部分 400 :控制部份At the position of mm, the 'toward minute (four)_the discharge end signal of the applied source material' is as shown in FIG. When the discharge end signal of the source material is applied to the dispenser 200, the addition of the dust force to the injection|§ 220 is stopped. Moreover, the valve disposed between the syringe 220 and the nozzle 210 begins to operate to block communication between the syringe 22 and the nozzle 210. Therefore, the source material remaining in the nozzle 210 is applied to the substrate 1 after the point of illusion is applied through the discharge end signal. During the progress of the process described above, the distributor 2〇〇 reaches the pattern forming end point P2. As described above, the discharge end signal is applied before the dispenser 2 〇〇 reaches the pattern forming end point P2 to effectively prevent the source material from being discharged after passing through the pattern forming end point P2. Therefore, it is possible to prevent the source material from being applied onto the substrate 1 after passing through the pattern forming end point P2. Thereafter, the dispenser 200 can be moved continuously and horizontally to form the next pattern 11' without stopping. The plurality of patterns U are formed on the substrate 10 by repeatedly performing the process described above. Although the plurality of patterns are formed in the present exemplary embodiment to electrically connect the upper substrate and the lower substrate of the LCD to each other, the present invention is not limited to 17 201114503. The plurality of cases formed on the substrate may be Applicable to each page domain. Moreover, although in the present embodiment, a metal paste is used for the upper and lower soil disks. The source material in which the substrates are electrically connected to each other, but the present invention is not limited thereto. For example, various materials can be used as the source material. As described, in an exemplary embodiment, the horizontal distribution is shifted = the source (four) is discharged onto the substrate, thereby forming the plurality of layers on the substrate: when the source material is discharged onto the substrate The second between the substrate and the nozzle discharges the source material between the substrate and the grout when the source material is discharged onto the substrate. Since the plurality of patterns can be formed on the substrate and the helmet is equipped with a rise or fall to adjust the gap between the substrate and the nozzle, the entire processing time is reduced. When the distribution n is located at a position before the start point of the _ shape, the discharge start signal is issued to the separation. Therefore, the pattern can be formed at the desired position: and, the force added to the syringe to form a pattern can be adjusted to add the Kanazawa towel to form the dust-zone of the second zone/to about 80 %. Therefore, it is possible to prevent the source material from being concentrated in the block outer portion. The discharge end signal of the source material is applied to the dispenser at a position before the dispenser is located at the end point of the pattern formation. Therefore, it is possible to prevent the source material from being applied onto the substrate after passing through the pattern forming end point. Although the organic light-emitting device and its manufacturing understanding have been described with reference to specific embodiments: this: therefore, those skilled in the art will readily appreciate: ==::==r Spirit 201114503 Qualification has been disclosed in the preferred embodiment as above It is not intended to be used in conjunction with the spirit of the present invention, and may be modified and retouched, so that the present invention is accompanied by: BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic diagram of a dispenser device according to an exemplary embodiment. Fig. 2 is a cross-sectional view of a dispenser according to an exemplary embodiment. A cross-sectional view explaining a discharge start signal application point, wherein when the dispenser is horizontally moved by the method according to an exemplary embodiment, a discharge start signal for discharging the source material from the dispenser is applied to the discharge start signal application point 4 is a cross-sectional view for explaining a discharge end signal application point, wherein when the dispenser is horizontally moved by the method according to an exemplary embodiment, the discharge end signal application point is applied for distribution from the distribution The discharge end signal of the discharge source material. Fig. 5 is a cross-sectional view for explaining the horizontal shift of the dispenser according to an exemplary embodiment. [Main element symbol description] 10: Substrate 11: Pattern 100: Platform 200: Dispenser 210: Nozzle 220: Syringe 201114503 230: Main body portion 240: Sensor 250: Drive portion 300: Transfer portion 400: Control portion