JP2011014887A - Repair method for paste pattern, and substrate having paste pattern repaired by the method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a repair method for a paste pattern in which the line width of the paste pattern is kept constant in a repair section of the paste pattern where a defect occurs by applying paste by a dot coating system by an amount corresponding to the repair section.SOLUTION: The repair method for the paste pattern is implemented by the dot coating system which drips a paste droplet on the repair section, thereby obtaining the effect that the internal area of the paste pattern into which an accurate amount of liquid crystal is injected can be secured by keeping the line width of the paste pattern constant.

Description

  The present invention relates to a method of repairing a paste pattern in which a defect has occurred, and a substrate having a paste pattern repaired by applying the method.

  A liquid crystal display (LCD), which is one of flat panel displays (FPDs), has better visibility than a cathode ray tube (CRT), and average power consumption and heat generation when the screen size is the same. Because of its small amount, it has recently attracted attention as a next-generation display device such as a mobile phone, a computer monitor, and a television together with a plasma display panel (PDP) and a field emission display (FED).

  Such a liquid crystal display device includes a liquid crystal display panel, and includes a plurality of substrates including a first substrate and a second substrate, and a liquid crystal layer interposed between the substrates. The method of forming the liquid crystal layer between the first substrate and the second substrate can be divided into a liquid crystal dipping injection method and a liquid crystal dropping method.

  In the liquid crystal dipping injection method, a first substrate and a second substrate are bonded together with a sealing material in a vacuum chamber so that a liquid crystal injection port is formed, and the bonded first substrate and second substrate are containers in which liquid crystal is received. When the vacuum in the chamber is released after being positioned inside, the liquid crystal flows between the first substrate and the second substrate through the liquid crystal inlet due to the pressure difference between the space between the first substrate and the second substrate and the external space. Injected method.

  The liquid crystal dropping method is a method in which the liquid crystal is dropped on the first substrate or the second substrate and then the first substrate and the second substrate are bonded together. Unlike the liquid crystal dipping injection method, the liquid crystal is injected before the liquid crystal is injected. No additional steps are required to form the inlet or close the liquid crystal injection port after injecting liquid crystal, reducing the time required to form the liquid crystal layer and wasting expensive liquid crystal This is a method that has recently been applied in that it can be prevented.

  The most important factor in the liquid crystal dropping method is to form a liquid crystal layer having a fixed amount of liquid crystal between the first substrate and the second substrate. The liquid crystal dropping method proceeds by a process of bonding the substrate on which the liquid crystal is dropped and the substrate on which the paste is applied so that a closed paste pattern is formed. In forming the layer, the internal area of the paste pattern is an important factor.

  In the liquid crystal dropping method, a paste dispenser that is a device for applying a paste on a substrate is used to form a paste pattern on the substrate. Such a paste dispenser is composed of a stage on which a substrate is mounted, a head unit to which a nozzle for discharging paste is attached, and a head support base on which the head unit is supported. A paste pattern having a predetermined shape is formed on the substrate while changing the relative position.

  On the other hand, the conventional paste dispenser applies the paste by a linear application method in which the paste is continuously discharged from the start of the discharge of the paste until the end of the discharge of the paste.

  In the paste application process by the linear application method, in order to prevent the paste having an excessively large diameter from being applied at the position where the paste pattern starts on the substrate, that is, the position on the substrate where the paste is first applied, As shown in FIG. 1, when the discharge of paste is started, the nozzle 620 is moved toward the substrate S in the downward direction and the application direction, that is, the nozzle 620 is positioned at a predetermined interval from the substrate S. Before starting, the discharge of paste is started from the nozzle 620, and the discharge amount of paste is gradually increased until the nozzle 620 is positioned at a predetermined interval from the substrate S.

  Similarly, in order to prevent the paste having an excessively large diameter from being applied at the position where the paste pattern is finished on the substrate, that is, the position where the paste is finally applied, as shown in FIG. When ending the discharge, a method of ending the discharge of the paste while gradually decreasing the amount of the paste discharged while moving the nozzle 620 from the substrate S in the upward direction and the application direction is adopted.

  Therefore, in the linear application method of the paste dispenser, when the paste application is started, the necessary distance D1 necessary for gradually increasing the discharge amount of the paste while moving the nozzle 620 in the downward direction and the application direction is set. When it is necessary to finish the application of the paste, the necessary distance D2 is required to gradually reduce the discharge amount of the paste while moving the nozzle 620 in the upward direction and the application direction.

  As described above, the conventional paste application method requires the respective required distances D1 and D2, so that the process of applying the paste on the substrate is complicated. In particular, when the paste pattern P is formed, the ejection starts. There is an inconvenience that it is difficult to uniformly process the line width of the paste pattern P at the portion where the point and the discharge end point are in contact. If an error occurs in the setting of the necessary distances D1 and D2 due to such a problem, a defect in the line width of the paste pattern P occurs, so that a defect in the internal area of the paste pattern P occurs. was there.

  On the other hand, in the process of applying a paste on a substrate using a paste dispenser, a paste pattern defect may occur in which the paste pattern line is broken or the line width of the paste pattern is below a reference value. Conventionally, in order to repair a repair section where such a paste pattern defect has occurred, a re-coating step of applying the paste again to the repair section has been performed.

  However, in the conventional case, only the linear application method as described above is applied as it is in the process of re-applying the paste to the repair section. Then, the necessary distances as described above from the data regarding the start point and end point of the repair section are applied. Since the paste should be re-applied to the repair section after D1 and D2 are set in advance, there is a problem that the repair process is very complicated. In particular, such a problem occurs that a large portion occurs in a curved portion where a paste pattern line is formed in a curved shape and a connecting portion where a discharge start point and a discharge end point are in contact with each other when the paste pattern is formed. Therefore, if an error occurs in the process of setting the required distances D1 and D2 from the data related to the repair section, the paste is reapplied on the appropriately applied paste, and as a result, the line width of the paste pattern is increased. This may increase the internal area of the paste pattern.

  On the other hand, since a certain amount of paste is reapplied by a linear application method even in a repair section having a paste pattern defect whose paste pattern line width is below the reference value, the paste has already been applied to a certain line width. In this state, a certain amount of paste is further applied, causing a problem that the line width of the paste pattern after repair is increased to a reference value or more, which also causes a defective internal area of the paste pattern. is what happened.

  As described above, in the liquid crystal dropping method, it is very important to form a liquid crystal layer having a fixed amount of liquid crystal between the first substrate and the second substrate, and the formation of the liquid crystal layer having the fixed amount of liquid crystal is a paste pattern. However, the paste pattern repair method using only the linear coating method forms a liquid crystal layer having a fixed liquid crystal amount resulting in a defective internal area of the paste pattern. It has the disadvantage that it makes it difficult, resulting in a fatal problem such as a decrease in product quality.

  The present invention is for solving the above-described problems of the prior art, and an object of the present invention is to form a dotted amount of paste corresponding to a repair section with respect to a repair section where a paste pattern defect has occurred. An object of the present invention is to provide a method for repairing a paste pattern that can maintain the line width of the paste pattern constant in a repair section by applying by a coating method.

  Another object of the present invention is to provide a substrate having a paste pattern repaired by a paste pattern repair method using a dot coating method.

  In order to achieve the above-described object, the paste pattern repair method according to the present invention includes a step of measuring whether or not a paste pattern formed on a substrate is defective, and a section where a defect occurs when the paste pattern defect is measured. Is set in the repair section, and the step of dropping the paste droplets in the set repair section by the dot coating method is sequentially performed.

  Here, in the step of dropping the paste droplets, the amount of the paste droplets dropped in the longitudinal direction of the paste pattern line and / or the line width direction of the paste pattern so as to correspond to the paste amount existing in the repair section. Is preferably adjusted.

  At this time, the drop amount of the paste droplets is adjusted in the process of changing the size of the dropped paste droplets or in the process of changing the number of times of dropping the same size paste droplets.

  In addition, in the step of dropping the paste droplet, the paste droplet dropped in the longitudinal direction of the paste pattern line and / or the line width direction of the paste pattern so as to correspond to the position of the paste existing in the repair section. It is preferable to adjust the dropping position.

  Meanwhile, the step of dropping the paste droplets is performed by dropping the paste droplets in one or more rows in the line width direction of the paste pattern, and the paste droplets are dropped in a plurality of rows in the line width direction of the paste pattern. If so, drop amount of paste droplets dropped along the rows forming the inner line of the paste pattern in multiple rows and drop amount of paste droplets dropped along the rows forming the outer line of the paste pattern Is different.

  In such a case, it is preferable that the diameter of the paste droplet dropped along the line forming the inner line of the paste pattern is ½ or less of the line width of the paste pattern to be formed.

  On the other hand, the paste pattern repair method according to the present invention is parallel to the linear coating method in which the paste is applied by continuously discharging the paste to the dot coating method.

  In addition, the substrate having the paste pattern repaired by the paste pattern repair method according to the present invention includes a step of measuring whether or not the paste pattern formed on the substrate is defective, and a defect when the paste pattern defect is measured. There is a paste pattern repaired by a paste pattern repairing method in which a stage in which the generated section is set as a repair section and a stage in which paste droplets are dropped onto the set repair section by a dot coating method.

  Here, the inner line and / or the outer line of the paste pattern are formed in a wave shape having a predetermined pitch, and the wave shape pitch of the inner line or the outer line of the paste pattern is along the longitudinal direction of the line of the paste pattern. The wave shape pitch of the inner line of the paste pattern is different from the wave shape pitch of the outer line of the paste pattern.

  In the repair method of the paste pattern according to the present invention, an amount of paste corresponding to the repair section is applied by a dot application method, and the line width of the paste pattern is maintained constant in the repair section to correspond to a fixed amount of liquid crystal. There is an effect that the internal area of the paste pattern can be secured.

It is the state figure which showed sequentially the state which starts application | coating of a paste on a board | substrate by the conventional paste application | coating method. It is the state figure which showed the state where the application | coating of a paste is complete | finished on a board | substrate by the conventional paste application | coating method sequentially. It is the top view which showed the paste pattern formed on the board | substrate. It is sectional drawing which showed the IV-IV line | wire of FIG. It is the schematic which showed an example of the direction which paste application | coating advances in order to form a paste pattern on a board | substrate. It is the perspective view which showed the paste dispenser which concerns on this invention. It is the perspective view which showed the head unit of the paste dispenser of FIG. 3 is a flowchart sequentially illustrating a paste pattern repair method according to a first embodiment of the present invention; 1 is a schematic diagram illustrating a paste pattern repair method according to a first embodiment of the present invention, in which paste droplets are dropped from a nozzle of a paste dispenser into a repair section by a dot coating method. FIG. 3 is a schematic diagram illustrating an example in which a paste droplet size is adjusted and dropped in accordance with the amount of paste existing in a repair section in the paste pattern repair method according to the first embodiment of the present invention. In the paste pattern repair method according to the first embodiment of the present invention, in order to adjust the line width of the paste pattern to be constant, the method of adjusting the size of the paste droplet and the dropping of paste droplets of the same size It is the schematic which showed the method of adjusting the frequency | count. In the paste pattern repair method according to the first embodiment of the present invention, in order to adjust the line width of the paste pattern to be constant, the method of adjusting the size of the paste droplet and the dropping of paste droplets of the same size It is the schematic which showed the method of adjusting the frequency | count. It is the enlarged view which showed a part of paste pattern repaired with the repair method of the paste pattern which concerns on 1st Example of this invention. FIG. 6 is a schematic diagram illustrating an example of adjusting a paste droplet dropping position so as to correspond to a paste position existing in a repair section, illustrating a paste pattern repair method according to a second embodiment of the present invention; is there. It is the enlarged view which showed a part of paste pattern repaired with the repair method of the paste pattern which concerns on 2nd Example of this invention. FIG. 10 is a schematic diagram illustrating a paste pattern repair method according to a third embodiment of the present invention, in which paste droplets are dropped in a plurality of rows in the line width direction of the paste pattern. FIG. 10 is a schematic diagram illustrating a paste pattern repair method according to a third embodiment of the present invention, in which paste droplets are dropped in a plurality of rows in the line width direction of the paste pattern. It is the enlarged view which showed a part of paste pattern repaired with the repair method of the paste pattern which concerns on the 3rd Example of this invention. It is the enlarged view which showed a part of paste pattern repaired with the repair method of the paste pattern which concerns on the 3rd Example of this invention. It is the schematic which showed the example of the method of dripping a paste droplet in the longitudinal direction and line width direction of the line of a paste pattern in the repair method of the paste pattern which concerns on 3rd Example of this invention. It is the schematic which showed the example of the method of dripping a paste droplet in the longitudinal direction and line width direction of the line of a paste pattern in the repair method of the paste pattern which concerns on 3rd Example of this invention. It is the schematic which showed the example of the method of dripping a paste droplet in the longitudinal direction and line width direction of the line of a paste pattern in the repair method of the paste pattern which concerns on 3rd Example of this invention. FIG. 10 is a schematic diagram illustrating an example of repairing a paste pattern in parallel with a dot coating method and a linear coating method, showing a paste pattern repair method according to a fourth embodiment of the present invention; It is the enlarged view which showed a part of paste pattern repaired with the repair method of the paste pattern which concerns on the 4th Example of this invention. It is the schematic which showed the other example of the repair method of the paste pattern which concerns on the 4th Example of this invention. It is the enlarged view which showed a part of paste pattern repaired with the other example of the repair method of the paste pattern which concerns on the 4th Example of this invention.

  Hereinafter, a preferred embodiment of a method for repairing a paste pattern according to the present invention and a substrate having a paste pattern repaired by the method will be described with reference to the accompanying drawings.

  As described above, the liquid crystal display device includes a liquid crystal display panel, and the liquid crystal display panel includes a first substrate, a second substrate, and a liquid crystal layer interposed between the substrates. That is, the liquid crystal display panel prepares a first substrate and a second substrate, applies paste to at least one of the substrates, drops liquid crystal onto at least one of the substrates, and then bonds the substrates together. Manufactured by a process. Here, one of the first substrate and the second substrate is a thin film transistor array substrate, and the other is a color filter substrate.

  The present invention relates to a method of repairing a paste pattern when a paste pattern defect occurs on a substrate coated with a paste in the manufacture of a liquid crystal display panel, and a substrate having a paste pattern repaired by the method. Before describing the preferred embodiment of the present invention, the terms used to describe the present invention will be defined with reference to FIGS.

  As shown in FIG. 3, since the paste pattern P formed on the substrate S has a closed substantially square shape (of course, other shapes are possible), lines having the shape of the paste pattern P are formed. The line L of the paste pattern P is defined, and the width of the line L is defined as the line width W of the paste pattern P. The direction in which the line L of the paste pattern P extends is defined as the longitudinal direction of the line L of the paste pattern P, and the direction in which the line width W of the paste pattern P is determined is defined as the line width direction of the paste pattern P. Further, since the paste pattern P is formed so as to maintain a predetermined line width W, a line that determines the inner shape of the paste pattern P is defined as an inner line L1 of the paste pattern P, and the outer shape of the paste pattern P is defined as The line to be determined is defined as the outer line L2 of the paste pattern P. Accordingly, the line width W of the paste pattern P is determined by the distance between the inner line L1 and the outer line L2. The area determined by the inner line L1 is defined as the internal area A of the paste pattern P. A line passing through the center of the line width W of the paste pattern P and parallel to the longitudinal direction of the line L of the paste pattern P is defined as a center line CL of the paste pattern P. Further, in the overall shape of the paste pattern P, a section where the line L of the paste pattern P is formed in a straight line shape is defined as a straight line portion SL, and the line L of the paste pattern P is formed in a curved shape having a predetermined curvature. Is defined as a curve portion RL. Further, as shown in FIG. 4, when the line L of the paste pattern P is vertically cut, an area occupied by the paste is defined as a cross-sectional area A1 of the paste pattern P. Further, as shown in FIG. 5, in order to form the paste pattern P on the substrate S, the application of the paste starts from the application start point SP, proceeds to a predetermined shape, and ends at the application end point EP. Therefore, a part where the application start point SP and the application end point EP are in contact with each other is defined as a connecting portion CP of the paste pattern P.

  Hereinafter, the paste dispenser according to the present invention will be described with reference to FIGS. 6 and 7.

  As shown in FIG. 6, the paste dispenser according to the present invention is provided in the Y direction along the base frame 10, the stage 30 fixed to the base frame 10 on which the substrate S is seated, and on both sides of the stage 30. A pair of LM guides 40, a head support 50 provided to be supported by the pair of LM guides 40 and extending in the X-axis direction, a plurality of head units 60 provided on the head support 50, The head unit 60 is provided on the head support base 50 and the head unit 60 is horizontally moved in the X-axis direction, and a control unit (not shown) that controls operations of the head unit 60 and the X-axis drive unit 70. , Including.

  The base frame 10 includes a first driving device (not shown) that moves the stage 30 in the front-rear direction (Y-axis direction) of the base frame 10. The head support base 50 includes the head support base 50 LM. A second driving device 59 that moves along the guide 40 is provided. A plurality of head supports 50 may be provided in order to improve the efficiency of the process of forming the paste pattern P when the substrate S is formed in a large area.

  As shown in FIG. 7, the head unit 60 includes a syringe 61 that is filled with a paste, a nozzle 62 that communicates with the syringe 61 and discharges the paste, and is disposed adjacent to the nozzle 62 so that the nozzle 62 and the substrate are disposed. Laser displacement sensor 63 for measuring gap data between S, Y-axis drive unit 64 for moving nozzle 62 and laser displacement sensor 63 in the Y-axis direction, and Z for moving nozzle 62 and laser displacement sensor 63 in the Z-axis direction A shaft drive unit 65.

  The laser displacement sensor 63 includes a light emitting unit 631 that emits a laser, and a light receiving unit 632 that receives a laser beam reflected from the substrate S and spaced from the light emitting unit 631 at a predetermined interval. The electrical signal corresponding to the imaging position of the laser emitted from and reflected by the substrate S is output to the control unit to measure the gap data between the substrate S and the nozzle 62.

  The head unit 60 is provided with a cross-sectional area sensor 66 that measures the cross-sectional area A1 of the paste pattern P applied to the substrate. Such a cross-sectional area sensor 66 measures the cross-sectional area A1 of the paste pattern P by continuously emitting laser to the substrate S and scanning the paste pattern P. Data relating to the cross-sectional area A1 of the paste pattern P measured by the cross-sectional area sensor 66 is used to determine whether or not the paste pattern P is defective.

  Hereinafter, referring to FIGS. 8 to 13, according to the first embodiment of the present invention for repairing a repair section where a paste pattern defect has occurred using a paste dispenser configured as described above. The paste pattern repair method will be described.

  As shown in FIG. 8, the repair method of the paste pattern according to the first embodiment of the present invention includes a step (S10) of measuring whether or not the paste pattern P formed on the substrate is defective, When the defect is measured, a step of setting a section where the defect has occurred as a repair section (S20) and a step of dropping a paste droplet into the set repair section by a dot coating method (S30) are sequentially performed. Configured.

  First, in the step of measuring whether or not the paste pattern P is defective (S10), the cross-sectional area A1 of the paste pattern P formed by scanning the entire surface of the substrate S with a laser sensor is measured, or the paste pattern P is measured with a camera. The process proceeds in the process of taking a picture and determining whether or not the paste pattern P is disconnected. In order to measure the cross-sectional area A1 of the paste pattern P, the cross-sectional area sensor 66 described above can be used.

  Next, when a defect of the paste pattern P is measured by performing the above-described process, a section where the paste pattern defect has occurred is set as a repair section (S20).

  Next, a repair is performed on the repair section by the dot application method (S30). As shown in FIG. 9, the paste pattern repair method applies the paste droplet PD to the repair section by the dot application method. This is done by the dropping process. In order to drop such paste droplet PD, a configuration including means for adjusting the pressure of the paste discharged from the nozzle 62 is applied, and a configuration including opening / closing means such as a piezoelectric element is also applied to the nozzle 62. .

  As described above, the paste droplet PD dropped by the dot application method in the repair section is applied to the other paste droplet PD or the substrate S already dropped on the substrate S by its own viscosity and surface tension. As a result, a continuous paste pattern P is formed on the substrate S.

  On the other hand, the dropping interval of the paste droplets PD can be a dropping interval such that the outer circumferences of the plurality of paste droplets PD are in contact with each other, and the dropping interval where the plurality of paste droplets PD overlap each other is also possible. A dropping interval in which the paste droplets PD are separated from each other by a predetermined width is also possible. Such a drop interval of the paste droplet PD includes the distance between the substrate S and the nozzle 62, the magnitude of the force that the paste droplet PD collides with the substrate S, the viscosity or surface tension of the paste droplet PD, the substrate Various settings are made according to design requirements such as a bonding force when S is bonded or a distance between the substrates S to be bonded.

  On the other hand, since there is a paste having a predetermined amount in the repair section, as shown in FIG. 10, the repair method of the paste pattern P is performed so that the paste pattern P corresponds to the paste amount existing in the repair section. It is preferable that the amount of the paste droplet PD be adjusted in the longitudinal direction of the line L and / or the line width direction of the paste pattern P. That is, instead of dropping a small amount of paste droplet PD4 in a portion where the paste is present in the repair section, a paste pattern is obtained by dropping a large amount of paste droplet PD4 in a portion where there is no paste, that is, a broken portion. The line width W of P can be kept constant. As shown in FIG. 11, the adjustment of the dropping amount of the paste droplet PD can be performed by applying a method of changing the size of the dropped paste droplet PD as shown in FIG. In addition, a method of adjusting the number of times the paste droplet PD having the same size is dropped at the same position can be applied. Since the method of adjusting the number of drops of the paste droplet PD of the same size at the same position does not require the size adjustment of the paste droplet PD and only the position adjustment of the nozzle 62 is required, the line width W of the paste pattern P There is an effect that adjustment can be carried out more easily.

  As shown in FIG. 13, in the paste pattern P repaired by the paste pattern repair method according to the first embodiment of the present invention, the inner line L1 or the outer line L2 of the paste pattern P in the repair section is a paste. A wave shape having a predetermined pitch PT is formed along the longitudinal direction of the line L of the pattern P. At this time, the pitch PT of each wave shape that the inner line L1 or the outer line L2 of the paste pattern P has in the repair section is constant along the longitudinal direction of the line L of the paste pattern P. In addition, each wave shape of the inner line L1 or the outer line L2 of the paste pattern P in the repair section is symmetric with respect to the center line CL of the paste pattern P.

  Since the paste pattern repairing method according to the first embodiment of the present invention as described above is performed by the dot coating method in which the paste droplet PD is dropped from the nozzle 62 into the repair section, what is the conventional linear coating method? Unlikely, the required distances D1 and D2 are not required, and it is possible to prevent the defect of the line width W of the paste pattern P that occurs when only the conventional linear coating method is applied. There is an effect that the internal area A of the paste pattern P corresponding to can be secured.

  In addition, the paste pattern repair method according to the first embodiment of the present invention can be applied to the longitudinal direction of the line L of the paste pattern P and / or the line width of the paste pattern P so as to correspond to the paste amount existing in the repair section. The line width W of the paste pattern P can be kept constant by adjusting the amount of paste droplet PD dropped in the direction.

  Hereinafter, a paste pattern repair method according to a second embodiment of the present invention will be described with reference to FIGS. The same parts as those described in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  As shown in FIG. 14, in the paste pattern repair method according to the second embodiment of the present invention, the longitudinal direction of the paste pattern line and / or the paste so as to correspond to the position of the paste existing in the repair section. Repair is performed by adjusting the dropping position of the paste droplet PD in the line width direction of the pattern.

  That is, when the line width W of the paste pattern P is formed below the reference value, a certain amount of paste already exists in the repair section. Thus, the position of the paste existing in the repair section is the line L of the paste pattern P. In the longitudinal direction and / or the line width direction of the paste pattern P. Accordingly, the paste droplet PD drops so as to correspond to the position of the paste irregularly present in the repair section, that is, to the portion where the paste does not exist in the repair section where the line width W of the paste pattern P is defective. As described above, the repair for making the line width W of the paste pattern P constant is performed by adjusting the dropping position.

  On the other hand, a method of adjusting the dropping position of the paste droplet PD according to the position of the paste existing in the repair section and a method of adjusting the dropping amount of the paste droplet PD according to the size of the space where the paste does not exist in the repair section are paralleled. The That is, when there is a space where no paste exists in the repair section, a small amount of paste droplet PD4 is dropped at a position where the size of the space where the paste does not exist is relatively small, A large amount of paste droplet PD3 can be dropped at a position where the size is relatively large. Thus, the dropping amount and / or dropping position of the paste droplet PD can be adjusted based on the space where the paste does not exist in the repair section. In such a case, as described above, as a method of adjusting the dropping amount of the paste droplet PD, as described above, a method of adjusting the size of the dropped paste droplet PD (see FIG. 11) or a paste having the same size. A method (see FIG. 12) of applying the droplet PD while adjusting the number of times of dropping is applied.

  As shown in FIG. 15, the paste pattern P repaired by the paste pattern repair method according to the second embodiment of the present invention includes each wave included in the inner line L1 and the outer line L2 of the paste pattern P in the repair section. The shape is not symmetric with respect to the center line CL of the paste pattern P, and the pitches PT3 and PT4 of the wave shapes of the inner line L1 or the outer line L2 of the paste pattern P are along the longitudinal direction of the line L of the paste pattern P. May not be constant.

  In the paste pattern repair method according to the second embodiment of the present invention as described above, the longitudinal direction of the line L of the paste pattern P and / or the paste pattern P corresponds to the position and / or amount of the paste existing in the repair section. Since the paste pattern can be repaired by adjusting the dropping position and / or the dropping amount of the paste droplet PD in the line width direction of the paste pattern P, the line width W of the paste pattern P after repair is further increased. As a result, the internal area A of the paste pattern P corresponding to a predetermined amount of liquid crystal can be more accurately ensured.

  Hereinafter, a paste pattern repair method according to a third embodiment of the present invention will be described with reference to FIGS. The same parts as those described in the first and second embodiments are denoted by the same reference numerals, and the description thereof is omitted.

  As shown in FIGS. 16 and 17, the paste pattern repair method according to the third embodiment of the present invention is a method of dropping paste droplets PD in a plurality of rows in the line width direction of the paste pattern P in the repair section. Can be repaired. In such a case, since a paste having a predetermined amount may exist in the repair section, the longitudinal direction of the line L of the paste pattern P and / or the amount and / or amount of the paste existing in the repair section Or it is preferable that it is a system which adjusts the dropping position and / or dropping amount of paste droplet PD in the line width direction of paste pattern P.

  In order to apply the method of dropping the paste droplets PD in two or more rows in the line width direction of the paste pattern P in the repair section, the nozzle 62 or the substrate S can be moved in the line width direction of the paste pattern P. To do.

  When the paste droplets PD are dropped in a plurality of rows in the line width direction of the paste pattern P, as shown in FIG. 16, it is possible to drop the paste droplets PD in the same drop amount in each row. As shown in FIG. 17, the paste droplets PD can be dropped into the respective rows with different drop amounts. The paste pattern P formed by the dropping method of the paste droplet PD shown in FIG. 16 has the wave shapes of the inner line L1 and the outer line L2 of the paste pattern P of the paste pattern P as shown in FIG. The paste pattern P which is symmetric with respect to the center line CL or formed by the dropping method of the paste droplet PD shown in FIG. 17 is an inner line L1 and an outer line of the paste pattern P as shown in FIG. Each wave shape of L2 is asymmetric with respect to the center line CL of the paste pattern P. Such a dripping method is appropriately selected depending on design conditions.

  On the other hand, as shown in FIG. 17, in the case where the paste droplet PD is dropped on each column in the line width direction of the paste pattern P with a different drop amount, the wave shape of the inner line L1 of the paste pattern P In order to reduce the pitch PT4, it is dropped on the column forming the inner line L1 of the paste pattern P compared to the dropping amount of the paste droplet PD3 dropped on the column forming the outer line L2 of the paste pattern P in the plurality of columns. It is preferable to reduce the dropping amount of the paste droplet PD4. In such a case, as shown in FIG. 19, the wave-shaped pitch PT4 of the inner line L1 of the paste pattern P can be formed narrower than the wave-shaped pitch PT3 of the outer line L2. Further, compared to the case where the paste droplets PD are dropped in one line in the line width direction of the paste pattern P, the wave-shaped pitch PT4 of the inner line L1 of the paste pattern P can be further reduced. As a result, the internal area A of the paste pattern P can be adjusted more precisely. On the other hand, the diameter of the paste droplet PD4 dropped along the inner line L1 of the paste pattern P is preferably ½ or less of the line width W of the paste pattern P to be formed, and is ¼ or less. More preferably.

  However, the present invention is not limited to the above-described method, and the amount of the paste droplet PD3 dropped on the row forming the outer line L2 of the paste pattern P in the plurality of rows is set on the inner side of the paste pattern P depending on the design conditions. A method is applied in which the amount is smaller than the amount of paste droplets PD4 that are dropped onto the row forming the line L1. On the other hand, as a method for adjusting the dropping amount of the dropped paste droplet PD, as described above, the method of adjusting the size of the dropped paste droplet PD (see FIG. 11) or a paste liquid of the same size is used. A method of dropping the droplet PD while adjusting the number of times of dropping (see FIG. 12) is applied.

  As a method of dropping the paste droplets PD in a plurality of rows in the line width direction of the paste pattern P in the repair section, as shown in FIG. 20, the paste droplets PD are dropped in the longitudinal direction of the line L of the paste pattern P. It is possible to apply a method 91 that alternately performs the dropping of the paste droplet PD in the line width direction of the paste pattern P, that is, in a zigzag shape, as shown in FIGS. The paste droplet PD is dropped in the longitudinal direction of the line L of the paste pattern P, and the longitudinal direction of the line L of the paste pattern P is again maintained while maintaining a predetermined interval from the dropped paste droplet PD in the line width direction of the paste pattern P. Various methods such as methods 92 and 93 for dropping the paste droplet PD on the surface can be applied.

  In the method of dropping the paste droplet PD in the repair section presented in FIGS. 21 and 22, first, as shown in FIG. 21, the paste droplet PD along the column forming the outer line L2 of the paste pattern P. A method of dropping the paste droplet PD along the row forming the inner line L1 of the paste pattern P can be applied. However, since the inner line L1 of the paste pattern P is an important factor for determining the inner area A of the paste pattern P, the paste droplet PD is first dropped along the column forming the inner line L1 of the paste pattern P. Then, after determining the inner line L1 of the paste pattern P as one reference, it is preferable to form the paste droplet PD along the column forming the outer line L2 of the paste pattern P. In particular, as shown in FIG. 22, the drop amount of the paste droplet PD4 dropped along the column forming the inner line L1 of the paste pattern P drops along the column forming the outer line L2 of the paste pattern P. When the amount of the paste droplet PD3 to be dropped is small, the paste droplet PD dropped along the column forming the inner line L1 of the paste pattern P preferentially uses the inner line L1 of the paste pattern P. Not only to determine, but also to guide the drop of the paste droplet PD along the column forming the outer line L2 of the paste pattern P, so that the column forming the inner line L1 of the paste pattern P preferentially It is preferable to drop the paste droplet PD along the line.

  According to the paste pattern repair method according to the third embodiment of the present invention as described above, the paste droplets PD are dropped in a plurality of rows in the line width direction of the paste pattern P. Compared to the method of dropping the paste droplets PD in a line in the direction, the size of the paste droplets PD dropped at a time is small (the amount of paste droplets PD dropped is small), or the inner line L1 or the outside of the paste pattern P It is possible to finely adjust the pitch PT of each wave shape included in the line L2, and as a result, it is possible to adjust the internal area A of the paste pattern P more precisely.

  Hereinafter, a paste pattern repair method according to a fourth embodiment of the present invention will be described with reference to FIGS. The same parts as those described in the first to third embodiments are denoted by the same reference numerals, and the description thereof is omitted.

  As shown in FIG. 23, the paste pattern repairing method according to the fourth embodiment of the present invention is not only a dot coating method in which paste droplets PD are dropped on the substrate, but also the relative relationship between the substrate S and the nozzle 62. While changing the position, the linear coating method PL in which the paste is continuously discharged from the nozzle 62 can be repaired in parallel.

  For example, as shown in FIG. 23, when the disconnection is relatively long in the repair section, the paste pattern PL is formed by applying the linear coating method in most of the disconnection portions, but the start point and end point of the repair section In the vicinity of, paste droplets PD can be dropped by applying a dot coating method. Thus, the time required for forming the paste pattern P can be shortened by making the linear coating method parallel to the dot coating method. In this case, repair is first performed on the broken part of the repair section by the linear application method, and repair is performed on the remaining part by the point application method, or a point shape is formed near the start point or end point of the repair section. Repair was performed with the application method and repair was performed with the linear application method for the disconnected part, or repair was performed with the dot application method from the vicinity of the start point of the repair section, and repair was performed with the linear application method at the disconnected part. The order of repair by the dot application method and the repair by the linear application method can be changed depending on circumstances, such as performing repair by the dot application method near the end point of the rear repair section.

  As shown in FIG. 24, the paste pattern P repaired by such a method is a wave in which the inner line L1 or the outer line L2 of the paste pattern P has a predetermined pitch PT in a part of the repair section of the paste pattern P. It is formed into a shape.

  As another example, as shown in FIG. 25, when the paste is applied to a plurality of rows in the line width direction of the paste pattern P, one of the plurality of rows drops the paste droplet PD by the dot coating method. In addition, the other columns of the plurality of columns can be repaired by a method of applying paste by a linear application method.

  Here, in order to improve the accuracy of the internal area A of the paste pattern P, the column forming the inner line L1 of the paste pattern P is applied with the dot coating method to form the outer line L2 of the paste pattern P. The row applies a linear application method. In such a case, as shown in FIG. 26, the inner line L1 of the paste pattern P is formed in a wave shape having a predetermined pitch PT, and the outer line L2 of the paste pattern P is formed in a straight line. However, the present invention is not limited to the above, and the linear application method is applied to the column forming the inner line L1 of the paste pattern P, and the dot pattern is applied to the column forming the outer line L2 of the paste pattern P. An application method can also be applied. In this case, the outer line L2 of the paste pattern P is formed in a wave shape having a predetermined pitch PT, and the inner line L1 of the paste pattern P is formed in a straight line.

  On the other hand, in the case of the dot application method, the paste droplet PD is disposed in the longitudinal direction of the paste pattern line and / or in the line width direction of the paste pattern so as to correspond to the position and / or amount of the paste existing in the repair section. It is preferable that the dropping position and / or the dropping amount be adjusted.

  The paste pattern repair method according to the fourth embodiment of the present invention as described above can use the advantages of the dot coating method by paralleling the dot coating method and the linear coating method. In the repair section, there is an effect that the time required for performing the repair can be shortened.

  As described above, since the paste pattern repair method according to the present invention is performed by the dot coating method of dropping the paste droplet PD into the repair section, when the repair is performed by applying only the linear coating method as in the prior art. It is possible to prevent a problem that the line width W of the generated paste pattern P after repair increases beyond the reference value, and it is possible to cope with the liquid crystal amount determined by repairing the paste pattern P so that the line width W is constant. There is an effect that the internal area A of the paste pattern P to be secured can be secured.

  The technical ideas described in the embodiments of the present invention can be implemented independently and can be implemented in combination with each other. In addition, the present invention has been described based on the embodiments described in the drawings and the detailed description of the invention. However, this is only an example and a person having ordinary knowledge in the technical field to which the present invention belongs. Various modifications and other equivalent embodiments are then possible. Therefore, the technical protection scope of the present invention should be determined by the appended claims.

S: Substrate P: Paste pattern PD: Paste droplet

Claims (15)

(A) measuring the defect possibility of the paste pattern formed on the substrate;
(B) When the defect of the paste pattern is measured in the step (a), a stage in which the defect occurs is set as a repair section;
(C) dropping the paste droplets by the dot coating method in the repair section set in the step (b) above;
A paste pattern repairing method characterized by sequentially performing steps.   In the step (c), the drop amount of the paste droplet is adjusted in the longitudinal direction of the paste pattern line and / or the line width direction of the paste pattern so as to correspond to the paste amount existing in the repair section. The method for repairing a paste pattern according to claim 1.   3. The paste pattern repair method according to claim 2, wherein the amount of paste droplets dropped is adjusted in a process of changing the size of the dropped paste droplets.   3. The paste pattern repair method according to claim 2, wherein the amount of paste droplets dropped is adjusted in a process of changing the number of paste droplets having the same size.   In the step (c), the dropping position of the paste droplet to be dropped is set in the longitudinal direction of the paste pattern line and / or in the line width direction of the paste pattern so as to correspond to the position of the paste existing in the repair section. The paste pattern repair method according to claim 1, wherein adjustment is performed.   The method of claim 1, wherein the step (c) includes dropping the paste droplets in one or more rows in the line width direction of the paste pattern. In step (c), paste droplets are dropped in a plurality of rows in the line width direction of the paste pattern,
What is the drop amount of the paste droplets dropped along the row forming the inner line of the paste pattern and the drop amount of the paste droplets dropped along the row forming the outer line of the paste pattern among the plurality of rows? The paste pattern repair method according to claim 6, wherein the paste patterns are different.   The paste according to claim 6, wherein a diameter of the paste droplet dropped along a line forming an inner line of the paste pattern is ½ or less of a line width of the paste pattern to be formed. Pattern repair method. (D) The paste pattern repairing method according to claim 1, further comprising the step of applying the paste by continuously discharging the paste by a linear coating method to a part of the repair section. Providing a first substrate and a second substrate;
A paste is applied to at least one of the first substrate and the second substrate, and the paste pattern is repaired using the paste pattern repair method according to claim 1. Stages,
Dropping liquid crystal on at least one of the first substrate and the second substrate;
Bonding the first substrate and the second substrate to each other;
A method of manufacturing a liquid crystal display panel, characterized in that the steps are sequentially performed.   A step of measuring whether or not the paste pattern formed on the substrate is defective, a step of setting a section where the defect occurs when the defect of the paste pattern is measured, and a dot coating method in the set repair section A substrate having a paste pattern repaired by a paste pattern repair method that sequentially performs the step of dropping paste droplets by the step of:   The substrate having a paste pattern according to claim 11, wherein the inner line and / or the outer line of the paste pattern is formed in a wave shape having a predetermined pitch in the repaired section.   The paste pattern according to claim 12, wherein in the repaired repaired section, the pitch of the wave shape of the inner line or the outer line of the paste pattern is different from each other along the longitudinal direction of the line of the paste pattern. Having a substrate.   The paste pattern according to claim 12, wherein the wave pattern pitch of the inner line of the paste pattern and the wave shape pitch of the outer line of the paste pattern are different from each other in the repaired repair section. Having a substrate. Including a first substrate and a second substrate;
At least one of the first substrate and the second substrate is a substrate having a paste pattern according to any one of claims 11 to 14,
Liquid crystal is dropped on at least one of the first substrate and the second substrate,
A liquid crystal display panel manufactured by bonding the first substrate and the second substrate to each other.

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