201119751 六、發明說明： 【發明所屬之技術領域】 本發明關於控制塗膠機之方法。 【先前技術】 一般而言，平面板顯示器(FPDs)是比傳統使用陰極射線 管的電視或監視器還輕薄的視訊顯示器。已開發使用的平面 板顯示器範例為液晶顯示器(LCDs)、電漿顯示面板(PDPs)、 場發射顯示器(FEDs)、以及有機發光二極體(OLEDs)。 在眾多平面板顯示器中，液晶顯示器為基於影像資訊個 別供應資料訊號到矩陣配置的液晶胞的顯示器，因此控制液 晶胞的透射率，而顯示所需影像。由於液晶顯示器具有的優 點在於薄、輕、且功率消耗與操作電壓又低，所以液晶顯示 器已廣為使用。一般製造用於液晶顯示器之液晶面板的方法 將說明如下。 首先，彩色濾光片與共用電極形成於上基板上，而薄膜 電晶體(TFT)及晝素電極形成於相對於上基板的下基板上。 接著，配向膜塗佈於基板上，配向膜摩擦提供待形成於配向 膜間的液晶層中之液晶分子預傾角及配向方向。 再者，為了維持基板間的預定間隙，以避免液晶洩漏並 密封基板間的間隙，塗佈預定圖案的膠於至少一基板，以形 成膠圖.案。之後，形成液晶層於基板之間。以此方式，製造 了液晶面板。 201119751 上。面板#中，塗膠機用以形成膠圖案於基板 抑一、0a供裝設基板之平台、配備排出膠之噴嘴之頭 早疋、以及支撐頭單元之頭支撐件。 、 膠圖機在改變各喷嘴與基減之相對位置時，形成 即，在藉由上下移動各頭單元之喷嘴於 動喷嘴喷嘴與基糊—致關_，塗軸水平移 上，因而形成膠圖案。 、以膠於基板 如此-來，當基板載送到平台以形成谬圖案於基板上 時’必須齡相躲喷嘴鮮基餘置的 旋轉或水平移動基板來執行。 汁匕紅序藉由 同時’當複數頭單元安裝於頭支樓件時’頭單元的嘴嘴 f頭支撐件的縱長額(x轴方向)可能不是錄設置，或頭 早7G之喷制關隙可能不是均勻的。#填充膠的注射器更 換新的時，或塗膠機已長時間操作時，可能發生這些問題。 為了解決這些問題’根據相關先前技術，從頭單元的個 別，嘴塗佈膠到測試基板或塗佈膠到額外提供於平台的校 正空間，以及彼此比較塗佈膠的複數部分的χ軸及γ軸位 置^決^嘴在頭支料的縱長方向是否設置成直線，而 後校正頭單元之個別喷嘴的位置。 然而，由於執行校正頭單元之個別噴嘴位置的程序沒有 考慮噴嘴與基㈣關係’所以需要辦的程縣對準各喷 鳴與基板，因此降低了生產效率。 、 201119751 嘴1縣前技術’為7量測及調整頭單元之個別噴 如τ处μ行了塗佈膠朗試基板朗額外提供於平台之 ‘額二2序然而’使用測試基板或平台的校正空間引 翻外的成本，而降低產品的生產力。 【發明内容】 一因此’本發明有鑑於上述先前技術發生的問題本發明 St提供控制塗膠機之方法’其能相對於基板精確 的^置。期位置，以及能精確地對準複數群元之喷嘴間 再者，本發明另一目的在於提供控制 ==:單元之喷嘴，以及相對於用於生產二ί 額外校正空_平台，並改善產品的生產力。供 為了達成上述目的，本發明提供一種控制塗膠機之方 Ϊ考解元：*具料嘴⑽⑽狀上形成有 OB 土板以及安裴成面對基板之影像捕捉單元，頭 = 裝置座標系統移動於x軸 朦，。Λ軸 純含：⑷自噴嘴讀出孔排出 二塗佈膠到基板；（b)移動頭單元，而使塗佈到基板之膠 、心與影像捕捉單元之影像捕捉中心對準；移動頭單元 土捕捉單元位移到參考標記，以及利用影像捕捉單元 旦、，1考標記之影像；以及(d)基於步驟(e)所捕捉的影像， =測》考標記之中心與影像捕捉單元之影像捕捉中心之 置0 201119751 此方法可更包含：當步驟(d)所量測之參考標記之中心與 影像捕捉單元之影像捕捉中心彼此不對準時，相對於基板^ 整喷嘴之位置。 、土 ° 調整喷嘴之位置可包含：⑴基於步称(d)所量測的參考 ^記之中心與影像捕捉中心的位置，量測參考標記之中心與 影，捉中心間之X軸間隙與Y軸間隙；以及(2)基於步^ =置測之X ϋ嶋及/或γ侧隙，移動喷嘴於χ轴方向 /或Y軸方向。 再者，頭單元可由頭支撐件支撐而移動於X軸方向， 置可包含移觸單元於x _，轉 嘴嘴^ 單元可包含γ轴驅動單元，以移動 •^古f者;了達成上述目的’本發明提供一種控制塗膠機 成有參考；頭單元，其具有喷嘴以排出膠到其上形 於X /及Υ财定的χγ裝置座鮮、統移動 孔排出腰，方向，此方法包含：⑻自喷嘴之排出 考標記的φ,、、ΐϊ膠到基板’ 單元，而使基板之參 頭ΐ二二”影像捕捉單元之影像捕捉中心對準；(C)移動 影ί 2:3膠=像；以及⑼基於步驟⑹所捕捉的 置。 、夕中〜/、影像捕捉單元之影像捕捉中心之位 201119751 此方法可更包含：當步驟(d)所量測之膠之中心與影像捕 捉單元之影像捕捉中心彼此不對準時，相對於基板調整喷嘴 之位置。 調整喷嘴之位置可包含：（1)基於步驟(d)所量測的膠之 中心與影像捕捉中心的位置，量測膠之中心與影像捕捉中心 間之X軸間隙與γ軸間隙，以及(2)基於步驟〇)所量測的χ 軸間隙及/或Υ軸間隙，移動喷嘴於χ軸方向及/或γ轴方 向0 再者，頭單元可由頭支撐件支撐而移動於χ軸方向， 以及調整喷嘴的位置可包含移動頭單元於χ軸方向，而移 動喷嘴於X軸方向。頭單元可包含¥軸驅動單元，以移動 喷，於Υ軸方向’以及調整喷嘴的位置可包含藉由γ轴驅 動單元移動喷嘴於γ轴方向。 Λ八假設基板在用作為沿著切割基板之參考的切割線内的 1刀為有效部分，以及基板在切割線外的部分為無效部分， 則塗佈谬可包含塗佈糊基板之無效部分。 再者’塗佈膠可包含以十字或點形狀，塗佈膠到基板。 #&由=述說明可知’根據本發明控制塗膠機之方法是有優 斜於其^可參照基板的參考標記調整喷嘴驗置，而能相 J數ϊϊ地調整喷嘴的位置，以及能精確地對準提供於 稷數頭早兀之噴嘴間的位置。 再者’根據本發明控制塗膠機之方法是有優勢的，因為 201119751 ，佈踢觸於生產實際產品之基板的無效部分以及利 ，無效部分之膠來調整喷嘴的位置，而不需要使用測試基 板或在平台額外提供校正空間，並改善產品的生產力。 【實施方式】 塗膠考伴&圖式說日嫌據本發日錄佳實施例控制 如圖1及圖2所不’根據本發明之塗膠機包含框架叩、 口 20、一對支撐移動導引件3〇、頭支撐件恥、頭單元5〇、 制單τ〇(未顯示）。平台2〇裝設於框架ι〇上’而基板 ^於平台2〇上。支標移動導引件30安裝於平台2〇的 貝1 ’而延伸於Υ軸方向。頭支樓件40安裝於平台2〇上 ’而使頭支撐件40的兩端由該對支樓移動導引件3〇所支 轴方向。頭單元5〇安裝於頭支撐件4〇，而 =於X軸方向’且頭單元5G包含排出膠之喷嘴53以及 雷射位移感 54。控鮮元控娜塗佈操作。 動„„於^架1G上可安裝雜平台2G於X軸方向之X軸移 22^二，移，台2〇於Y轴方向之Y軸移動單元 10，X軸移動-移f單元22之Υ轴導引件221安裝於框架 早7021之X軸導引件211安装於¥轴導引件 由安置於X軸導引件211。此架構容許平台20 引俾211 ώ V 2U導引及移動於X轴方向，並容許X軸導 導引件221導引及移動，使得平台20移動 框牟10 έ同首時本發明*限於Y車由導引件221安裝於 及Χ轴導引件211安裝於Υ轴導引件221之架構， 201119751 而可具有X軸導引件211安裝於框架1〇及γ軸導引件22ι 安裝於X轴導將211之_。#然，本發明之塗膠機可架 構成，藉由應用X軸移動單元21及又轴導引件211，戋γ 軸移動單元22及Y轴導引件221，而使平台2〇僅移動於乂 軸及Y軸其中一個方向。 支樓移動單元41安裝於頭支樓件4〇的兩端，而連接 撐移動導引件3〇。支禮移動導弓W %及支樓移動單元41 的互動’容許頭支擇件4〇移動於各支樓移動導弓丨件如之縱 ，方向’即Y轴方向。因此，頭單元知可藉由頭支樓件仞 的Y軸移動而移動於γ軸方向。 頭移動導引件42可安裝於頭支標件4〇而 ^ ’以及頭移動單元51可裝設於頭單元5Q頭g ==引ί42。藉由頭移動導引件42及= 二谷許頭單元5〇移動於糊一 署应ΐίΓ來，頭單元5〇可根據Χ軸及Υ軸界定的XY F 置座標移動於X軸方向及/或丫抽方向。 的χγ裝 嘴^膠之，2。喷 成鄰近噴嘴53 ’以量測 其、位移感心54放置 動單元55移動喷嘴心㈣及基板3間之_:。丫軸驅 Z軸驅動單元雷射位移制以4於Y轴方向。 方向。 動噴驚53及雷職移感測H 54於z軸 201119751 雷射位移感測器54包含發射雷射光之發射部541，以 及與發射部541相距預定距離且用於接收自基板5反射之雷 f光之接收部542。雷射位移感測器54輸出電訊號到控制 單元，而量測基板S及喷嘴53之間隙，其中電訊號對應於 自發射部541發射且由基板S反射之雷射光之影像形成位置 而產生。 Y軸驅動單元55由控制單元所控制，因而調整喷嘴53 於Y軸方向的位置。 再者，截面積感測器57可安裝於頭單元5〇 ,以量測塗 佈於基板S之膠圖案P之截面積。截面積感測器57連續地 發射雷射光到基板S並掃描膠圖案p，因而量測膠圖案p之 截面積。截面積感測器57所量測的膠圖案p之截面積資料， 用於決定膠圖案是否為缺陷的。 再者，影像捕捉單元58可安裝於頭單元5〇，而鄰近 嘴53並面對基板s。當喷嘴53藉由頭支樓件4Q的γ抽移 動及頭單元50 & X轴移動而移動時，影像捕捉單元$ 於量測喷嘴53目前的位置。 之後，於如上述架構之塗膠機十，將說明移動頭 50之喷嘴53咖定位置時使喷嘴53與基板s對準的程序。 如圖3麻，㈣標記M軸於祕生產實際產 基板S上，制作為對準平台2G上之基板s的參考 為導引喷嘴53到基板s之塗佈起始位置之參考、以用 為劃刻或洲基板S的㈣朗決定相關賴位置的參^201119751 VI. Description of the Invention: [Technical Field to Which the Invention Is Ascribed] The present invention relates to a method of controlling a coating machine. [Prior Art] In general, flat panel displays (FPDs) are video displays that are thinner than conventional television or monitors that use cathode ray tubes. Examples of flat panel displays that have been developed for use are liquid crystal displays (LCDs), plasma display panels (PDPs), field emission displays (FEDs), and organic light emitting diodes (OLEDs). In many flat panel displays, the liquid crystal display is a display that supplies data signals to the matrix cells of the matrix based on the image information, thereby controlling the transmittance of the liquid cell and displaying the desired image. Since liquid crystal displays have advantages of being thin, light, and low in power consumption and operating voltage, liquid crystal displays have been widely used. A method of generally manufacturing a liquid crystal panel for a liquid crystal display will be described below. First, a color filter and a common electrode are formed on the upper substrate, and a thin film transistor (TFT) and a halogen electrode are formed on the lower substrate with respect to the upper substrate. Next, an alignment film is coated on the substrate, and the alignment film rubs to provide a liquid crystal molecule pretilt angle and an alignment direction to be formed in the liquid crystal layer between the alignment films. Further, in order to maintain a predetermined gap between the substrates to prevent liquid crystal leakage and to seal a gap between the substrates, a predetermined pattern of glue is applied to at least one of the substrates to form a glue pattern. Thereafter, a liquid crystal layer is formed between the substrates. In this way, a liquid crystal panel was fabricated. On 201119751. In panel #, the glue applicator is used to form a glue pattern on the substrate, a platform for mounting the substrate, a head for the nozzle with the discharge glue, and a head support for the support head unit. When the glue machine changes the relative position of each nozzle and the base reduction, it is formed, that is, by moving the nozzles of the head units up and down to the nozzle nozzle and the base paste, the coating shaft is horizontally moved, thereby forming a glue. pattern. In order to glue the substrate to the substrate, when the substrate is carried on the substrate to form a ruthenium pattern on the substrate, it is necessary to rotate or horizontally move the substrate. The juice blush sequence may not be recorded by the simultaneous length of the mouthpiece of the head unit when the plurality of head units are mounted on the head support (x-axis direction), or the head is sprayed 7G early. The closing gap may not be uniform. These problems may occur when the #filler syringe is replaced with a new one, or when the applicator has been in operation for a long time. In order to solve these problems, according to the related prior art, the individual from the head unit, the nozzle coating glue to the test substrate or the coating glue to the correction space additionally provided to the platform, and the x-axis and the γ-axis of the plurality of portions of the coating glue are compared with each other. The position of the nozzle is set to a straight line in the longitudinal direction of the head material, and then the position of the individual nozzles of the head unit is corrected. However, since the procedure for performing the individual nozzle positions of the correction head unit does not take into account the relationship between the nozzle and the base (4), it is necessary to align the respective nozzles with the substrate, thereby reducing the production efficiency. , 201119751 Mouth 1 county before the technology 'for the 7-measurement and adjustment head unit of the individual spray such as τ at the line of the coating rubber test substrate lang additional provided on the platform of the 'Europe 2 2 order however' using the test substrate or platform Correcting space costs outside the product and reducing product productivity. SUMMARY OF THE INVENTION The present invention has been made in view of the problems of the prior art described above. The present invention provides a method of controlling a glue applicator which can be accurately positioned relative to a substrate. The position of the period, and the nozzles that can accurately align the complex group elements. Another object of the present invention is to provide a nozzle for controlling the ==: unit, and to improve the product with respect to the additional correction air _ platform for production Productivity. In order to achieve the above object, the present invention provides a method for controlling a glue applicator: * an image capture unit having an OB earth plate formed on the nozzle (10) (10) and an ampule facing the substrate, head = device coordinate system Move on the x-axis,. The Λ shaft contains: (4) discharging the two coating glue from the nozzle reading hole to the substrate; (b) moving the head unit to align the glue and the core applied to the substrate with the image capturing center of the image capturing unit; The soil capture unit is displaced to the reference mark, and the image captured by the image capture unit, 1 test mark; and (d) the image captured based on step (e), the image of the test mark and the image capture unit Center setting 0 201119751 This method may further include: when the center of the reference mark measured in step (d) and the image capturing center of the image capturing unit are not aligned with each other, the position of the nozzle is fixed with respect to the substrate. Adjusting the position of the nozzle can include: (1) based on the position of the reference and the center of the image capturing center measured by the step (d), measuring the center and shadow of the reference mark, and capturing the X-axis gap between the centers Y-axis gap; and (2) moving the nozzle in the x-axis direction or the Y-axis direction based on the step X = the measured X ϋ嶋 and / or γ side gap. Furthermore, the head unit may be supported by the head support and moved in the X-axis direction, and may include a shifting unit at x _, and the rotary nozzle unit may include a γ-axis driving unit to move the above-mentioned OBJECTS OF THE INVENTION The present invention provides a control gluing machine with a reference; a head unit having a nozzle for discharging glue onto the X-ray and the χγ device of the X-ray and the 移动γ device, and moving the hole to discharge the waist, the direction, the method Including: (8) φ,, and ΐϊ 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 对准 对准 对准 对准 对准 对准 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 Glue=image; and (9) based on the capture of step (6), 夕中~/, image capture unit of the image capture unit. 201119751 This method can further include: the center and image of the glue measured in step (d) When the image capturing centers of the capturing unit are not aligned with each other, the position of the nozzles is adjusted relative to the substrate. Adjusting the position of the nozzles may include: (1) measuring the position of the center of the glue and the image capturing center based on the step (d), measuring the glue Center and image capture The X-axis gap and the γ-axis gap between the two, and (2) the χ-axis gap and/or the Υ-axis gap measured based on the step 〇), moving the nozzle in the x-axis direction and/or the γ-axis direction. The head support can be supported by the head support to move in the direction of the x-axis, and the position of the adjustment nozzle can include moving the head unit in the x-axis direction and moving the nozzle in the X-axis direction. The head unit can include a ¥ shaft drive unit to move the spray, The axial direction 'and the position of the adjustment nozzle may include moving the nozzle in the γ-axis direction by the γ-axis driving unit. Λ8 It is assumed that the substrate is an effective part of the cutting line used as a reference along the cutting substrate, and the substrate is The portion outside the cutting line is an ineffective portion, and the coating crucible may include an ineffective portion of the coating paste substrate. Further, the coating glue may include coating the glue to the substrate in a cross or dot shape. #& It can be seen that the method for controlling the glue applicator according to the present invention is to adjust the nozzle inspection by referring to the reference mark of the reference substrate, and to adjust the position of the nozzle in a sizable manner, and to accurately align the nozzle. Several early The position between the mouths. Furthermore, the method of controlling the applicator according to the present invention is advantageous because, in 201119751, the cloth kicks the ineffective portion of the substrate for producing the actual product and the glue of the ineffective portion to adjust the position of the nozzle. There is no need to use the test substrate or provide additional correction space on the platform, and improve the productivity of the product. [Embodiment] Glue test and <pattern said that the day is based on the best example of this day, as shown in Figure 1 and Figure 2 The glue applicator according to the present invention comprises a frame weir, a mouth 20, a pair of supporting moving guides 3〇, a head support shame, a head unit 5〇, a single sheet τ〇 (not shown). It is disposed on the frame ' and the substrate is mounted on the platform 2. The support moving guide 30 is mounted on the platform 2' and extends in the x-axis direction. The head support member 40 is mounted on the platform 2' such that both ends of the head support member 40 are supported by the pair of branch moving guides 3'. The head unit 5A is mounted to the head support 4A, and = in the X-axis direction' and the head unit 5G includes a nozzle 53 for discharging glue and a laser displacement feeling 54. Control the fresh element control coating operation. The X-axis movement of the miscellaneous platform 2G in the X-axis direction is 22^2, the movement is 2, the Y-axis movement unit 10 in the Y-axis direction, and the X-axis movement-shifting unit 22 The X-axis guide 211 to which the cymbal guide 221 is attached to the frame early 7021 is mounted to the X-axis guide 211. This architecture allows the platform 20 to guide and move the 211 ώ V 2U in the X-axis direction, and allows the X-axis guide 221 to guide and move, so that the platform 20 moves the frame 牟 10 έ when the same invention * is limited to Y The vehicle is mounted on the frame 221 and the y-axis guide 211 is mounted on the frame guide 221, and the X-axis guide 211 is mounted on the frame 1 〇 and the γ-axis guide 22 ι. The X-axis guide will be 211. #然, the gluing machine of the present invention can be constructed by using the X-axis moving unit 21 and the shaft guiding member 211, the 戋 γ-axis moving unit 22 and the Y-axis guiding member 221, so that the platform 2 〇 only moves One of the directions of the 乂 axis and the Y axis. The branch moving unit 41 is attached to both ends of the head stand member 4''''''''''''' The movement of the bow guide W% and the branch moving unit 41 allows the head support member 4 to move in each of the branches to move the guide bow member in the longitudinal direction, the direction 'that is the Y-axis direction. Therefore, the head unit can be moved in the γ-axis direction by the Y-axis movement of the head support member 仞. The head moving guide 42 can be mounted to the head support member 4'' and the head moving unit 51 can be mounted to the head unit 5Q head g == 42 42. The head unit 5〇 can be moved in the X-axis direction according to the XY F coordinates defined by the x-axis and the x-axis by moving the head moving guide 42 and the second-segment head unit 5〇. Or pick up the direction. The χγ mouthpiece ^ glue, 2 Sprayed adjacent to the nozzle 53' to measure it, the displacement sensation 54 is placed, and the moving unit 55 moves the nozzle core (4) and the substrate 3 between _:.丫Axis drive The Z-axis drive unit has a laser displacement of 4 in the Y-axis direction. direction. The squirting stunner 53 and the stalking sensing H 54 are in the z-axis 201119751. The laser displacement sensor 54 includes a transmitting portion 541 that emits laser light, and a ray that is spaced apart from the transmitting portion 541 by a predetermined distance and is received for reflection from the substrate 5. f light receiving unit 542. The laser displacement sensor 54 outputs an electrical signal to the control unit to measure the gap between the substrate S and the nozzle 53, wherein the electrical signal is generated corresponding to the image forming position of the laser light emitted from the transmitting portion 541 and reflected by the substrate S. The Y-axis drive unit 55 is controlled by the control unit, thereby adjusting the position of the nozzle 53 in the Y-axis direction. Further, the cross-sectional area sensor 57 can be mounted on the head unit 5A to measure the cross-sectional area of the glue pattern P applied to the substrate S. The cross-sectional area sensor 57 continuously emits laser light to the substrate S and scans the glue pattern p, thereby measuring the cross-sectional area of the glue pattern p. The cross-sectional area data of the glue pattern p measured by the cross-sectional area sensor 57 is used to determine whether the glue pattern is defective. Further, the image capturing unit 58 can be mounted to the head unit 5A while adjacent to the mouth 53 and facing the substrate s. When the nozzle 53 is moved by the gamma pumping movement of the head support member 4Q and the head unit 50 & X axis movement, the image capturing unit $ measures the current position of the nozzle 53. Thereafter, in the gluing machine 10 of the above construction, a procedure for aligning the nozzle 53 with the substrate s when the nozzle 53 of the moving head 50 is set in position will be described. As shown in Fig. 3, (4) marking the M axis on the actual production substrate S, the reference of the substrate s on the alignment platform 2G is the reference of the coating nozzle 53 to the coating start position of the substrate s, The scribe or the base plate S (4) lang determines the relevant position of the position ^
Ui 201119751 本發明k供利用基板S上所示的參考標記μ，精破調整 頭單元50之喷嘴53的位置以及對準噴嘴53與基板s之方 法。 再者，如圖3所示，在基板s上畫條實際或虛擬切割線 LC。因此，基板S可分成呈現在切割線内實際用於產品 的部分，以及呈現在切割線LC外不用於產品而於切割後摒 棄的部分。 根據本發明，假設基板S在用作為沿著切割基板s之參 考的切割線LC内的部分為有效部分SE，以及基板s在用 作為沿著切割基板S之參考的切割線LC外的部分為無效部 分SI，暫時塗佈膠到基板S之無效部分SI，並且利用塗佈 到無效部分SI的膠，精確地調整頭單元5〇之噴嘴53的位 置以及使基板s與喷嘴53彼此對準。 參考圖4至圖8說明根據本發明第一實施例控制塗膠機 之方法。 如圖4所示，當基板S載送到平台2〇時，頭單元5〇移 動，而使噴嘴53的排出孔位在基板S的無效部分SI上。於 此，可在控制單元的控制下，藉由驅動頭移動單元51使頭 單元50移動於X軸方向，以及可在驅動支撐移動單元4ι 時，藉由移動頭支撐件40於Y軸方向而使頭單元5〇移動 於Y轴方向。 如此一來，於步驟S11，當頭單元50移動而使噴嘴53 的排出孔位在基板s的無效部分si時，控制單元自喷嘴53 201119751Ui 201119751 The present invention k utilizes the reference mark μ shown on the substrate S to finely break the position of the nozzle 53 of the adjustment head unit 50 and the method of aligning the nozzle 53 with the substrate s. Furthermore, as shown in FIG. 3, an actual or virtual cut line LC is drawn on the substrate s. Therefore, the substrate S can be divided into a portion which is actually used for the product in the cutting line, and a portion which is not used for the product outside the cutting line LC but is discarded after cutting. According to the present invention, it is assumed that the portion of the substrate S used in the cutting line LC as a reference along the cutting substrate s is the effective portion SE, and the portion of the substrate s outside the cutting line LC serving as the reference along the cutting substrate S is The invalid portion SI temporarily coats the glue to the ineffective portion SI of the substrate S, and precisely adjusts the position of the nozzle 53 of the head unit 5 and the substrate 53 and the nozzles 53 with each other by the glue applied to the ineffective portion SI. A method of controlling a glue applicator according to a first embodiment of the present invention will be described with reference to Figs. As shown in Fig. 4, when the substrate S is carried to the stage 2, the head unit 5 is moved, and the discharge hole of the nozzle 53 is placed on the ineffective portion SI of the substrate S. Here, the head unit 50 can be moved in the X-axis direction by the driving head moving unit 51 under the control of the control unit, and can be moved in the Y-axis direction by moving the head supporting member 40 while driving the supporting moving unit 4ι. The head unit 5〇 is moved in the Y-axis direction. In this way, in step S11, when the head unit 50 is moved to position the discharge hole of the nozzle 53 at the inactive portion si of the substrate s, the control unit is from the nozzle 53 201119751
X ，出膠，並塗侔暫時膠PT到基板s的無效 喷嘴53的對準。暫時膠ρτ可形成 /進仃 袖及Υ轴長度之十字形狀。 ‘、’、…狀或，、有預定 再者，如圖5所示，於步驟S12，頭單元5 元FT㈣像敵h CC直接對準塗佈於益效 部分SI之膠PT的中心PTC。 …、双 如圖6及圖7所示’於步驟S13，頭單元 裝置座標线在\财献/或丫財 =像捕捉單元58到基板s的參考標記: 衫像捕捉單元58捕捉參考標記M的影像。 】用 當決定了喷嘴53的精確位置以及基板s與喷嘴 影雜捉單元58的x軸方向移動距 mi I 離dy決定成，使影像捕捉單 =的敝巾心cc直接解基板s之參考標記M的中心 亦即，如圖6所示，若決定了喷嘴53的精確位 ==噴嘴53彼此精確地對準，而當影像捕捉單元 二^向移動距離DX及於γ軸方向移動距離d 考 = 變成精確又直接對準影像捕捉單元 ^，在塗膠機長時間使用後，或注射器力及 捕二?新的時候’喷嘴53的位置可能改變。藉此，在影像 早凡58於X軸方向移動距離欣及於γ轴方向移動距 12 201119751 離DY之案例中，如圖7所示，參考標記μ的中心]vie可 能不直接對準影像捕捉單元58的捕捉中心CC。 因^ ’於步驟S14，控制單元基於捕捉的參考標記M的 1，=!參考標記Μ的中心MC的位置以及影像捕捉單 =58的捕捉中心cc的位置，因而決定參考標記m的中心 與影像捕捉單元58賴捉巾心cc是碰此對準。X, the glue is dispensed, and the alignment of the inactive nozzle 53 of the temporary glue PT to the substrate s is applied. The temporary glue ρτ can form/into the cross shape of the sleeve and the length of the boring shaft. Further, as shown in Fig. 5, in step S12, the head unit 5 FT(4) is directly aligned with the center PTC of the glue PT applied to the benefit portion SI. ..., as shown in FIG. 6 and FIG. 7 'in step S13, the head unit device coordinate line is in the \ 财 / / 丫 = = image capture unit 58 to the substrate s reference mark: the shirt image capture unit 58 captures the reference mark M Image. The decision is made to determine the precise position of the nozzle 53 and the movement distance mii of the substrate s and the nozzle capture unit 58 in the x-axis, so that the image capture unit = the scouring center cc directly decomposes the reference mark of the substrate s The center of M, that is, as shown in Fig. 6, if it is determined that the precise position of the nozzle 53 == the nozzles 53 are precisely aligned with each other, and when the image capturing unit moves the distance DX and the distance d in the γ-axis direction = Becomes accurate and directly aimed at the image capture unit ^, the position of the nozzle 53 may change after the applicator has been used for a long time, or when the syringe force and the catch are new. Therefore, in the case where the image is moved in the X-axis direction and moved in the γ-axis direction, the distance from the γ-axis is 12 201119751. In the case of DY, as shown in Fig. 7, the center of the reference mark μ may not be directly aligned with the image capture. The capture center CC of unit 58. In step S14, the control unit determines the center of the reference mark m and the image based on the position of the center MC of the captured reference mark M, the position of the center of the reference mark Μ, and the position of the capture center cc of the image capture sheet=58. The capture unit 58 is in contact with the cc.
捕捉Ϊ參記M的巾*MC直接鮮祕捕捉單元58的 it 喷嘴53的位置是精準的以及基板S 板:之有效部㈣中的塗佈起始位-排出膠，因而形成預定膠圖案於基板S上。 58的參4標=的中心MC不對準影像捕捉單元 捕捉單元58㈣招由# P右參考標記M的中心MC與影像 有間隙，則於步驟IT"之間在X轴方向及域Y軸方向 步驟Sl5，相對於基板S調整喷嘴53的位置。 藉由記2的中心MC與捕捉中心CC的位置， 軸間隙ck及/或γ軸:c』捉中心CC之間的X 間隙办及/或γ軸=d y欲以及接著基於所量測的X軸 轴方向，而調整喷嘴二=動噴嘴53於乂 — ，可藉 _ 53於Y轴方向，噴嘴53可^^^再者乂為了移動噴嘴 J稽田徒供於頭早兀5〇之γ軸驅 13 m 201119751 動單元55的操作而移動於γ轴方向。 如此-來，料53於Χ財⑽或γ財 參考標記Μ之中心MC與捕捉中心cc間之χ轴間^移動I /或Υ軸間隙dy之後，可再次執行以下步驟：步驟幻、= ^塗佈於基板s之無效部分SI之勝ρτ的中^ ρτ 像 ，單元58之捕捉中心CC、步驟S13，移動頭單元、= 離DX及/或DY而利用影像捕捉單元％來捕捉參 的影像、以及步驟S14，基於參考標記Μ的捕捉影像，、來量 測參考標記Μ的中心MC與影像捕捉單元％的捕捉t 的位置，而決定參考標記M的巾^ Mc與影像捕捉 58的捕捉中心CC是否彼此對準。 再者，若參考標記M的中心Mc對準影像捕捉單元58 的捕捉中心CC，則於步驟S16，喷嘴53定位在基板s的有 效，分SE中的塗佈起始位置，且自喷嘴53排出膠，而形成 預定膠圖案於基板s。然而’若參考標記M的中心MC仍 然不對準影像捕捉單元58的捕捉中心CC，則於步驟S15， 調整噴嘴53於X軸方向及/或γ軸方向之位置。透過此程 序，可相對於基板S精確地調整喷嘴53的位置。 之後’參考圖9至圖11說明根據本發明第二實施例控 制塗膠機之方法。本發明第一實施例及第二實施例共同的元 件將使用相同的參考符號，且於此省略詳細說明。 ^如圖9及圖1〇所示，於根據本發明第二實施例控制塗 膠機之方法中’首先於步驟S21，移動頭單元50而塗佈暫 時膠PT到基板s的無效部分SI，以進行噴嘴53的對準。 201119751 於此’暫_ FT可塗佈成十字形狀。 58二:驟S22，頭單元5〇移動而使影像捕捉單元 的直接對準基板SJ1所示的參考標言㈣ 在於步驟S23，頭單元50根據χγ裳置座標系統 向及/或Υ軸方向移動預定距離DX及DY，因而 58到塗佈於基板s之無效部分沿= 、】用衫像捕捉單元58捕捉膠ρτ的影像。 置以第-實施例，#決定了喷嘴53的精確位 58的與喷嘴％彼此精讀地對準時，影像捕捉單元 的1轴方向移動距離DX及/或γ轴方向移動距離DY決 ΐ心PTcf像捕捉單元58的捕捉中心CC直接對準膠ΡΤ的 換新機長時間使用後，或注射器52及/或噴嘴53更 Ϊ新^候，喷嘴53驗置可歧變。藉此，在影像捕捉 料向移動距離DX及於γ軸方向移動距離 對準与像Jr如圖丨。所示，膠PT的中心㈣可能不直接 卞早〜像捕捉早元58的捕捉中心CC。 量測=τ ί ί驟S24，控制單元基於捕捉的膠Ρτ的影像， 中C軸置㈣祕雛單元58的捕捉 元5δ關扣士置，因而決定膠PT的中心PTC與影像捕捉單 兀58的捕捉十心CC是否彼此對準。 早 J5 201119751 若膠PT的中心PTC直接對準影像捕捉單元58 中=CC，則決定嘴嘴53的位置是精準的以及基板嘴 53是彼此精破地對準。因此，於步驟伽 放置於基板s之有效部分SE中的塗佈起始位置：自：3 排出膠，因而形成預定膠圖案於基板§上。 _ :而二膠的中心PTC不對準影像捕捉單元58的 捕捉中心cc ’亦即若膠Ρτ的中心PTC與影像捕捉單元％ 的捕捉中心CC之間在X轴方向及/戍γ細 於步驟S25，相對於基板S調整噴嘴53的彳3 基於膠pt的中心PTC與捕捉中心、cc的位 =Te緻+心ee之_糊隙= ，移動喷嘴53於X軸方向及/γ軸方向，而調i 喷嘴53的位置。 為^^喷嘴53於x軸方向，頭單元5〇可藉由頭移 動早70 51的#作而移動於X軸方向。再者，為了移動喷嘴 53，Y軸方向，喷嘴53可藉由提供於頭單元刈之丫 動單元55的操作而移動於Υ軸方向。 如此一來，噴嘴53於χ軸方向及/或γ軸方向移動了 二的中心PTC與捕捉中心CC間之Χ軸間隙dX及/或Υ 抽間隙dy之後’可再次執行以下步驟·步驟S22，對準基 板^所示之參考標記乂的中心【與影像捕捉單元％之^ 捉中心CC、步驟S23，移動頭單元50距離敗及域D 利用影像敵單元58來捕捉膠PT的影像、以及步驟S24， 201119751 巧膠η的捕捉影像，來量測膠 的晰心cc的位置，而決定膠ρτ的二： …以像捕捉早元58的捕捉中心cc是否彼此對準。 捉中再ΪΓ’若® PT的令心PTC對準影像捕捉單元58的捕 捉^ CC，則於步驟S26，將嗔嘴5 佈起始位置，且"嘴53排二= 疋膝圖案於基板s。然而，若膠p 影像捕捉單元％的捕捉中心cc ^ PTC仍然不對準 53於X轴方向及/或γ軸中方向^位:於^奶，調整喷嘴 於基板S精確地調整喷嘴幻的^立置置。透過此程序，可相對 成的之方法可基於基板S上形 f的參考“己Μ ’來調整噴嘴53的位置因 基板s精確地調整噴嘴53的位置。 σ ' 再者’於安裝複數頭單元兄於 中，若提供於個別頭單元5〇的所 40的案例 利用基板S之參考標記Μ來解 ^據上述方法 調整頭單元50之喷嘴53間的5夕卜的步驟來 於頭單元5〇之噴嘴幻間的相對位置。可精確地調整提供 亦即，頭單元50之嘖嘴q Α 由調整頭單元5〇之嘴嘴Μ I 財向的間隙可藉 般的維持，以及頭單元5〇之方向的位置而如所需 之喷嘴53於Y軸方向之位置、可猎由調整頭單元50 準成列。於調整頭單元5〇之個別月二^ ^由方向精確地對 使用基板s上的-個參考桿二噴嘴位置案例中，可 己以然而，也可使用對應頭單 201119751 兀5〇之個別噴嘴53的複數個參考標記。 錢根控制塗膠機之方法係基於基板s的參考標 對準喷in 的位置’而料姆於絲s精確地 間的相對位置置’也能精確地調整頭單元5〇之喷嘴53 於生發明控制塗膠機之方法係塗佈膠ρτ到用 η之基板s的無效部分si，並使用塗佈於益 ^ SI_PT_整喷嘴52的位置’而不需要使用測 $板或額外提供於平台2G的校正空間，因此改善產品生 實施本發㈣施騎狀技術精神可社地或彼此結合地 【圖式簡單說明】 上敍其他的目的、概、錢伽，結合 圖式與砰細說明將更易了解，其中： 圖1為顯示根據本發明之塗膠機之透視圖； 圖2為顯示圖丨之頭單元之透視圖； ，3至圖7為依序顯示根據本發明第—實施例控制塗膠 機之方法中對準喷嘴與基板之程序的示意圖； 圖8為顯示根據本發明第一實施例控制塗膠機之方法 之流程圖； 塗 圖9及圖1〇為依序顯示根據本發明第二實施例控制 201119751 膠機之方法中對準喷嘴與基板之程序的示意圖；以及 圖11為顯示根據本發明第二實施例控制塗膠機之方法 之流程圖。 【主要元件符號說明】 10框架 21 X軸移動單元 3〇支樓移動導引件 41支撐移動單元 50頭單元 52注射器 54雷射位移感測器 56 Z軸驅動單元 58影像捕捉單元 221 Y軸導引件 542接收部 DX距離 DY距離 LC切割線 MC參考標記中心 PT暫時膠 S基板 SI無效部分 S11,S12，S13，S14，S15, 20平台 22 Y軸移動單元 4〇頭支撐件 42頭移動導引件 51頭移動單元 53噴嘴 55 Y抽驅動單元 57截面積感測器 211 X轴導引件 541發射部 CC影像捕捉中心 dx間隙 dy間隙 Μ參考標記 Ρ膠圖案 PTC膠中心 SE有效部分 S16步驟 m 19Capture the position of the nozzle of the * 记 M MC MC MC MC MC MC MC MC MC MC MC MC MC MC MC MC MC MC MC MC MC MC MC MC MC MC MC MC MC MC MC MC MC MC MC MC MC MC MC MC MC MC MC MC MC MC On the substrate S. The center MC of 58 is not aligned with the image capturing unit capturing unit 58. (4) The gap between the center MC of the #P right reference mark M and the image is in the X-axis direction and the Y-axis direction step in the step IT" Sl5, adjusts the position of the nozzle 53 with respect to the substrate S. By recording the position of the center MC of the 2 and the capture center CC, the axis gap ck and/or the γ axis: c" captures the X gap between the center CC and/or the γ axis = dy and then based on the measured X axis The direction of the axis, and the adjustment of the nozzle 2 = the moving nozzle 53 in the 乂 -, can be _ 53 in the Y-axis direction, the nozzle 53 can be ^ ^ ^ 乂 再 移动 移动 移动 移动 移动 移动 移动 移动 移动 移动 移动 移动 移动 移动 移动 移动 移动 移动Drive 13 m 201119751 The movement of the moving unit 55 moves in the γ-axis direction. So, after the material 53 is moved between the center MC of the Χ ( (10) or γ 参考 reference mark 与 and the capture center cc ^ moving the I / or the Υ axis gap dy, the following steps can be performed again: Step Magic, = ^ The image of the target ρτ applied to the invalid portion SI of the substrate s, the capture center CC of the unit 58, the step S13, the moving head unit, = DX and/or DY, and the image capturing unit % is used to capture the image of the reference And step S14, based on the captured image of the reference mark ,, to measure the position of the center MC of the reference mark 与 and the capture t of the image capturing unit %, and determine the capture center of the reference mark M and the capture center of the image capture 58 Whether the CCs are aligned with each other. Furthermore, if the center Mc of the reference mark M is aligned with the capture center CC of the image capturing unit 58, then in step S16, the nozzle 53 is positioned at the effective start of the substrate s, the coating start position in the SE, and is discharged from the nozzle 53. Glue, forming a predetermined glue pattern on the substrate s. However, if the center MC of the reference mark M is still not aligned with the capture center CC of the image capturing unit 58, the position of the nozzle 53 in the X-axis direction and/or the γ-axis direction is adjusted in step S15. Through this procedure, the position of the nozzle 53 can be precisely adjusted with respect to the substrate S. Next, a method of controlling the applicator according to the second embodiment of the present invention will be described with reference to Figs. 9 to 11 . The elements common to the first embodiment and the second embodiment of the present invention will be given the same reference numerals, and detailed descriptions thereof will be omitted herein. As shown in FIG. 9 and FIG. 1B, in the method of controlling the applicator according to the second embodiment of the present invention, first, in step S21, the head unit 50 is moved to apply the temporary glue PT to the invalid portion SI of the substrate s, The alignment of the nozzles 53 is performed. 201119751 Here, the FT can be coated into a cross shape. 58: Step S22, the head unit 5〇 moves so that the reference heading (4) shown by the direct alignment substrate SJ1 of the image capturing unit is in step S23, and the head unit 50 moves in the direction of the χ 裳 座 coordinate system in the direction of the 及 / and/or the Υ axis. The distances DX and DY are predetermined, and thus the image applied to the ineffective portion of the substrate s is captured by the shirt image capturing unit 58 at the ineffective portion of the substrate s. In the first embodiment, #determines that the precise position 58 of the nozzle 53 and the nozzle % are precisely aligned with each other, the image capturing unit moves in the 1-axis direction by the distance DX and/or the γ-axis direction moves by the distance DY. The capture center CC of the capture unit 58 is directly aligned with the plastic refilling machine for a long time, or the syringe 52 and/or the nozzle 53 are more renewed, and the nozzle 53 is set to be disproportionate. Thereby, the image capturing material is moved to the moving distance DX and the distance in the γ-axis direction is aligned with the image Jr as shown in FIG. As shown, the center of the glue PT (four) may not be directly early ~ like capturing the capture center CC of the early element 58. Measurement = τ ί 骤 S24, the control unit is based on the captured image of the capsule τ, and the C-axis (4) capture element 5 δ 关 士 , , , , , , , , , , , , , , , , 决定 决定 决定 决定 决定 决定 决定The capture of the ten heart CC is aligned with each other. Early J5 201119751 If the center PTC of the glue PT is directly aligned with the image capture unit 58 = CC, it is determined that the position of the nozzle 53 is accurate and the substrate nozzles 53 are precisely aligned with each other. Therefore, at the coating start position in the effective portion SE of the substrate s in the step gamma: the glue is discharged from: 3, thereby forming a predetermined glue pattern on the substrate §. _ : The center PTC of the second glue is not aligned with the capture center cc ' of the image capturing unit 58, that is, if the center PTC of the glue τ and the capture center CC of the image capturing unit % are in the X-axis direction and /戍γ is finer than step S25 Adjusting the 彳3 of the nozzle 53 with respect to the substrate S. Based on the center PTC of the glue pt and the capture center, the position of cc=Te+the heart ee_gap gap=, the moving nozzle 53 is in the X-axis direction and the /γ-axis direction, and Adjust the position of the nozzle 53. In the x-axis direction of the nozzle 53, the head unit 5〇 can be moved in the X-axis direction by the movement of the head 70 early. Further, in order to move the nozzle 53, the Y-axis direction, the nozzle 53 can be moved in the z-axis direction by the operation of the tilting unit 55 provided in the head unit. In this manner, after the nozzle 53 is moved in the y-axis direction and/or the γ-axis direction by the y-axis gap dX between the center PTC and the capturing center CC and/or the squeezing gap dy, the following step S22 can be performed again. Aligning the center of the reference mark 所示 shown in the substrate ^ with the image capture unit % capture center CC, step S23, moving the head unit 50 away from the domain D using the image enemy unit 58 to capture the image of the glue PT, and steps S24, 201119751 Capture images of the glue η to measure the position of the glue cc of the glue, and determine the two of the glue ρτ: ... to capture whether the capture centers cc of the early elements 58 are aligned with each other. When the PTC of the PT's PT is aligned with the capture CC of the image capturing unit 58, then in step S26, the mouth 5 is placed at the starting position, and the mouth 53 rows 2 = knee-length pattern on the substrate s. However, if the capture center cc ^ PTC of the glue p image capture unit % is still misaligned 53 in the X-axis direction and / or the γ-axis direction position: in the milk, adjust the nozzle on the substrate S to precisely adjust the nozzle illusion Set. Through this procedure, a relative method can be used to adjust the position of the nozzle 53 based on the reference "hex" of the shape f on the substrate S. The position of the nozzle 53 is precisely adjusted by the substrate s. σ ' Again' in the installation of the complex head unit In the case of the 40th case of the individual head unit 5, the reference mark 基板 of the substrate S is used to solve the step of adjusting the gap between the nozzles 53 of the head unit 50 according to the above method. The relative position of the nozzle illusion can be precisely adjusted, that is, the nozzle of the head unit 50 Α can be maintained by the adjustment of the gap of the nozzle Μ I of the head unit 5, and the head unit 5 〇 The position of the direction, such as the position of the desired nozzle 53 in the Y-axis direction, can be calibrated by the adjustment head unit 50. The individual adjustments of the head unit 5 are made by the direction of the substrate s accurately. In the case of a reference rod two nozzle position, however, a plurality of reference marks corresponding to the individual nozzles 53 of the head sheets 201119751 兀5〇 can also be used. The method of controlling the glue applicator by Qiangen is based on the reference of the substrate s The target is aligned with the position of the spray in' s precisely relative position setting ' can also accurately adjust the nozzle unit 53 of the head unit 5 in the process of the invention of the control of the glue applicator coating the glue ρτ to the invalid portion si of the substrate s with η, and using the coating Yu Yi ^ SI_PT_ the position of the whole nozzle 52 ' does not need to use the measured $ board or additional correction space provided on the platform 2G, so improve the product to implement the hair (4) the technical spirit of the riding can be socially or in combination with each other BRIEF DESCRIPTION OF THE DRAWINGS Other objects, advantages, and advantages of the present invention will become more apparent from the following description, in which: Figure 1 is a perspective view showing the applicator according to the present invention; FIG. 8 is a schematic view showing a procedure for aligning a nozzle and a substrate in a method of controlling a glue applicator according to a first embodiment of the present invention; FIG. 8 is a view showing a first embodiment of the present invention; A flow chart of a method for controlling a glue applicator; Figure 9 and Figure 1 are a schematic view showing a procedure for aligning a nozzle and a substrate in a method of controlling a 201119751 melter according to a second embodiment of the present invention; and Figure 11 is a view According to the invention Flow chart of the method for controlling the glue applicator of the second embodiment. [Description of main component symbols] 10 frame 21 X-axis moving unit 3 〇 branch moving guide 41 supporting mobile unit 50 head unit 52 syringe 54 laser displacement sensor 56 Z-axis driving unit 58 image capturing unit 221 Y-axis guiding member 542 receiving portion DX distance DY distance LC cutting line MC reference mark center PT temporary glue S substrate SI invalid portion S11, S12, S13, S14, S15, 20 platform 22 Y-axis moving unit 4 head support 42 head moving guide 51 head moving unit 53 nozzle 55 Y pumping unit 57 cross-sectional area sensor 211 X-axis guide 541 transmitting unit CC image capturing center dx gap dy gap Μ Reference mark silicone pattern PTC glue center SE effective part S16 step m 19