JP2011249195A - Printer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To form a light emission layer of an organic EL panel of a printer with a solution discharge head over the entire surface without any projection.SOLUTION: Substrate position measurement means and nozzle hole position measurement means are used when organic light emitting material ink is discharged continuously onto a substrate from the solution discharge head to coat the substrate in stripes,and further the coating is carried out in a state in which the substrate and a nozzle hole are positioned after the position of the substrate position measurement means is corrected using the nozzle hole position measurement means, thereby accurately coating a coating object part of the substrate in stripes without any projection.

Description

  The present invention relates to a printing apparatus for forming a functional film typified by a light emitting layer in an organic EL display using a coating technique.

  In recent years, with increasing demand for thin, low power consumption, and lightweight displays, a technique for manufacturing a functional film of a display by a low-cost coating method has attracted attention. For example, there has been proposed a method of transferring an organic light emitting material ink by a relief printing method into a groove section separated by a partition formed on a substrate. However, the relief printing method has a problem that the printing position accuracy cannot be ensured in the peripheral portion of the display due to expansion and contraction of the plate. On the other hand, a method has been proposed in which a solution discharge head is mounted on a stage that can be positioned with high accuracy, and the tip of the nozzle is applied close to the groove between the partition walls (for example, Patent Document 1). reference).

  This will be described with reference to FIGS.

  FIG. 16 is a diagram showing a method of applying the conventional organic light emitting material ink described above, and FIG. 17 is a diagram showing a method of aligning the substrate and the head of the conventional droplet discharge device.

  In FIG. 16, 140 is a surface plate, 134 is a Y-axis stage disposed at the center of the top surface of the surface plate 140, 135a and 135b are guide rails disposed on both outer sides in the short direction of the Y-axis stage 134, Reference numeral 134 is reciprocally movable in the Y-axis direction by a first movable part (not shown), and an X-axis stage 133 is configured with high accuracy in the first movable part. That is, the Y-axis stage 134 can reciprocate the X-axis stage 133 in the sub-scanning direction, and can also position the X-axis stage 133 with high accuracy. Note that a substantially U-shaped guide member that covers the guide rails 135a and 135b from above and is slidable along the rails 135a and 135b is provided on the lower surface of the X-axis stage 133. Accordingly, the X-axis stage 133 that is moved in the sub-scanning direction by the first movable portion is reliably guided by the guide rails 135a and 135b.

  The X-axis stage 133 includes a second movable part (not shown) that can reciprocate in the X-axis direction (main scanning direction). The second movable part has a θ-axis stage 132 that can rotate about the Z-axis. Is fixed. A chuck 131 is fixed on the upper surface of the θ stage 132. Further, the chuck 131 is connected to a pump (not shown) via a tube. When the pump sucks air, the substrate 120 is attracted and held on the chuck 131.

  With the above configuration, the glass substrate 120 can be positioned with high accuracy in the main scanning direction and the sub-scanning direction, and angle correction about the Z axis is also possible. A head alignment camera 101 is attached to the second movable part of the X-axis stage 133. Therefore, when the second movable unit itself moves in the main scanning direction, the imaging position of the head alignment camera 101 moves in the same direction. On the other hand, even if the θ-axis stage 132 rotates around the Z-axis, it does not move accordingly.

  Furthermore, on the surface plate 140, support columns 142a and 142b are fixed to face each other in the main scanning direction. Block-shaped bridges 141a and 141b extending toward the other column are fixed to the upper ends of the columns 142a and 142b. The end surfaces of both bridges 141a and 141b face each other with the head stage 130 in between. Yes. The head stage 130 includes a third movable part (not shown) that can rotate around the Z axis, and the head 110 is fixed to the third movable part. Further, the bridges 141 a and 141 b are connected to each other by a stay 103 for reinforcement, and a substrate alignment camera 102 is attached to the stay 103. With the above configuration, the angle of the head 110 around the Z axis can be corrected.

  An alignment procedure of the droplet discharge device shown in FIG. 16 will be described with reference to FIG.

  FIG. 17 is an enlarged view schematically showing a relative relationship among the head 110, the glass substrate 120, the head alignment camera 101, and the substrate alignment camera 102 shown in FIG. Here, head alignment marks 111 a and 111 b are provided on the bottom surface (face surface) of the head 110. In addition, substrate alignment marks 121 a and 121 b are provided on the upper surface of the glass substrate 120.

  When performing alignment, first, the head alignment camera 101 is moved below the head alignment mark 111a, and the position of the head alignment mark 111a is read. Similarly, the head alignment camera 101 is moved under the head alignment mark 111b, and the position of the head alignment mark 111b is read. Next, the inclination of the head 110 is calculated from the positions of the head alignment marks 111a and 111b, and the head 110 is rotated by that angle to correct the inclination. After the correction, the positions of the head alignment marks 111a and 111b are read again, and the inclination and the position of the head 110 of the correction degree are stored. Thereafter, the substrate alignment mark 121a is moved under the substrate alignment camera 102, and the position of the substrate alignment mark 121a is read. At the same time, the substrate alignment mark 121b is moved below the substrate alignment camera 102 to read the position of the substrate alignment mark 121b.

  Next, the tilt of the glass substrate 120 is calculated from the positions of the substrate alignment marks 121a and 121b, and the tilt is corrected by rotating the glass substrate 120 by the angle. After the correction, the positions of the substrate alignment marks 121a and 121b are read again, and the tilt and position of the glass substrate 120 are stored. Finally, the relative positional relationship between the head 110 and the glass substrate 120 after correction is grasped, and the drawing start position is determined.

  As described above, the drawing accuracy is improved by providing the droplet discharge device having the stage capable of highly accurate positioning and executing alignment before starting drawing.

Japanese Patent Laying-Open No. 2005-114506 (second page, FIG. 1)

  However, when the functional material solution is applied to a large-area substrate such as an organic EL display by the above-described method, the following problems occur.

  That is, the expansion and contraction of the support 142, the bridge 141, and the stay 103 that support the substrate alignment camera 102 due to thermal expansion, and the relative position between the second movable portion of the X-axis stage 133 to which the head alignment camera 101 is attached and the chuck 131. Due to fluctuations due to thermal expansion, the substrate and the head cannot be accurately aligned even though a stage capable of highly accurate positioning is used.

  As a result, there arises a problem that the functional material solution cannot be applied to a necessary position on the substrate.

  The present invention solves the above-described conventional problems. When a functional material solution is applied using a droplet discharge head, accurate application can be performed over the entire surface of a substrate even on a large-area substrate. It is an object to provide a simple printing apparatus.

  In order to achieve the above object, in the printing apparatus of the present invention, a solution discharge head that discharges a functional material solution from a nozzle hole toward a substrate and a holding unit that holds the substrate are arranged to face each other. Substrate position measurement for measuring the position of the substrate in a printing apparatus that discharges the functional material solution from the solution discharge head toward the substrate while relatively moving the solution discharge head and the substrate held by the holding unit. And a nozzle hole position measuring means for measuring the position of the nozzle hole, the nozzle hole position measuring means further comprising a reference mark serving as a reference for measuring the position of the nozzle hole, and the position of the substrate position measuring means Can be calibrated with the reference mark.

  More preferably, the material of the holding means is made of stone, and the nozzle hole position measuring means is fastened to the holding means. More preferably, a camera having an image recognition function is used for the substrate position measuring means and the nozzle hole position measuring means, and a mark formed on a glass plate is used as the reference mark, and the nozzle is set based on the mark. It is desirable to measure the position and perform position calibration of the substrate position measuring means based on the mark position.

  More preferably, the mark has a shape in which a round hole is formed in the center of the cross. More preferably, the position calibration processing of the substrate position measuring means using the reference position mark provided in the nozzle reference position measuring means may be performed immediately before printing.

  According to the printing apparatus of the present invention, even when a functional material solution is applied only to a necessary place on a large area substrate such as an organic EL display, it is possible to reliably apply only the necessary place accurately. .

The figure which shows the printing apparatus of embodiment of this invention The enlarged view of the stage part of the printing apparatus of embodiment of this invention The figure which shows the reference mark board | substrate of the printing apparatus of embodiment of this invention. The figure explaining the position calibration method of the board | substrate alignment camera of the printing apparatus of embodiment of this invention The figure which shows the camera image at the time of position calibration of the board | substrate alignment camera of the printing apparatus of embodiment of this invention The figure which shows the structure of the nozzle alignment camera of the printing apparatus of embodiment of this invention. The figure which shows the camera image of the nozzle alignment camera of the printing apparatus of embodiment of this invention The figure which shows the nozzle alignment method of the printing apparatus of embodiment of this invention The figure which shows the board | substrate alignment method of the printing apparatus of embodiment of this invention The figure which shows the camera image at the time of board | substrate alignment of the printing apparatus of embodiment of this invention The figure which shows the structure of the organic electroluminescent display created in embodiment of this invention The figure which shows arrangement | positioning of the partition of the organic electroluminescent display created in embodiment of this invention The figure which shows the formation step of the light emitting layer of the organic electroluminescent display created in embodiment of this invention The figure which showed the ink discharge head which has multiple nozzles of the printing apparatus of embodiment of this invention facing up and down The figure which shows a mode that the light emitting layer of an organic electroluminescent display is apply | coated using the ink discharge head which has multiple nozzles of the printing apparatus of embodiment of this invention. The figure which shows the structure of the conventional droplet discharge device The figure which shows the alignment method of the board | substrate and head of the conventional droplet discharge apparatus

(Embodiment)
Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  In the present embodiment, an effort is made to form a light emitting layer of an organic EL display using an organic light emitting material ink in which an organic light emitting material is dissolved in a solvent as a functional material solution.

  First, the structure of the organic EL display manufactured in this embodiment will be described.

  FIG. 11 is a diagram showing the structure of an organic EL display produced in the embodiment of the present invention.

  FIG. 11A is a plan view of the organic EL display, and FIG. 11B is a cross-sectional view taken along line AA in FIG.

  In FIG. 11, 1 is a substrate, and 2 is a first electrode formed on the substrate. In this embodiment, a glass plate having a thickness of 0.7 mm is used as the substrate 1 and ITO is used as a material for the first electrode 2 and is patterned by a photolithography method. 3 is a partition formed on the first electrode 2, 4 is a red (R) organic light emitting layer formed in a groove formed by the partition 3, 5 is a green (G) organic light emitting layer, and 6 is a blue (B) organic The thickness of the light emitting layer was about 70 nm. As a material of the partition wall 3, patterning was performed by a photolithography method using a photosensitive resin material which exhibited liquid repellency with respect to the organic light emitting material ink after patterning and contained fluorine so that the contact angle was 50 deg or more. . Reference numeral 7 denotes a second electrode formed on the organic light emitting layers 4, 5 and 6. Al was used as a material for the second electrode, and patterning was performed by a vacuum deposition method through a mask.

  Next, a method for forming an organic light emitting layer of the organic EL display according to the present embodiment will be described with reference to FIGS.

  FIG. 12 is a diagram showing the arrangement of the partition walls of the organic EL display fabricated in this embodiment, and FIG. 13 is a diagram showing the formation stage of the light emitting layer fabricated in this embodiment.

  In the present embodiment, the partition walls 3 are formed on the substrate 1 as shown in FIG. The partition wall width was 40 μm, the groove width between the partition walls was 60 μm, and the partition wall height was 1 μm. Reference numeral 11 denotes a substrate alignment mark formed at the same time as the partition wall 3 and is arranged at four corners of the substrate.

  First, red (R) organic light emitting material ink is applied to the grooves between the partition walls and dried to form the red (R) organic light emitting layer 4 in FIG. 13A, and then green (G) organic light emitting material ink is formed. Is applied and dried to form the green (G) organic light-emitting layer 5 of FIG. Next, the blue (B) organic light emitting material ink was applied and dried to form the blue (B) organic light emitting layer 6 of FIG.

  Next, a method for applying the organic light emitting material ink will be described with reference to FIGS. 1 to 5, 7, 14, and 15.

  FIG. 1 is a diagram showing a printing apparatus according to the present embodiment, and FIG. 2 is an enlarged view of a stage portion of the printing apparatus according to the embodiment of the present invention. FIG. 3 is a diagram illustrating a reference mark substrate of the printing apparatus according to the present embodiment, and FIG. 4 is a diagram illustrating a position calibration method of the substrate alignment camera of the printing apparatus according to the present embodiment.

  FIG. 5 is a diagram illustrating a camera image at the time of substrate alignment position calibration of the printing apparatus according to the present embodiment. FIG. 7 is a diagram illustrating a camera image of the nozzle alignment camera of the printing apparatus according to the present embodiment. It is. Further, FIG. 14 is a diagram showing the ink ejection head having a plurality of nozzles of the printing apparatus of the present embodiment in an upside down direction, and FIG. 15 shows the light emission of the organic EL display in the printing apparatus of the present embodiment. It is a figure which shows a mode that a layer is apply | coated using the ink discharge head which has multiple nozzles.

  1, 2, 3, and 14, 10 is a surface plate, 22 is a Y-axis guide (1) attached on the surface plate 10, and 23 is a Y-axis guide attached on the surface plate 10. (2) and 21 are Y-axis stages which can slide along the Y-axis guide (1) and the Y-axis guide (2). 28 Y-axis linear motors (1) and 29 Y-axis linear motors (2 ), And a Y-axis position measuring means (not shown) and a Y-axis control means.

  20 is an X-axis guide configured on the Y-axis stage 21, 24 is an X-axis stage slidable along the X-axis guide 20, and includes 25 X-axis linear motors and X-axis position measuring means (not shown). The position can be determined by the X-axis control means. Reference numeral 26 denotes a θ stage mounted on the X axis stage and rotatable around the Z axis so that it can be positioned by a rotational position measuring means (not shown) and a θ axis control means.

  27 is a substrate chuck mounted on the θ stage 26, 1 is a substrate sucked and held by the substrate chuck 27, 40 is a nozzle alignment unit, and the nozzle alignment unit 40 is a nozzle alignment support unit fixed to the substrate chuck 27. The reference mark substrate 43 is mounted on a plate 47 and includes a nozzle alignment camera 41, a reference mark substrate 43 supported by a reference mark holder 44, and a mirror 45 supported by a mirror holder 46. Were produced by forming a cross-shaped chromium pattern with a round window at the center on the upper surface of a parallel flat glass substrate by a photolithography method.

  Coaxial illumination (not shown) is attached to the nozzle alignment camera 41, and the reference mark 42 formed on the reference mark substrate 43 is observed through the reference mark substrate 43 after the optical axis is bent 90 degrees upward by the mirror 45. It is configured to be able to. The nozzle alignment camera 41 is connected to an image recognition unit (not shown). The substrate chuck 27 was manufactured using a stone having a small coefficient of thermal expansion and a large heat capacity. In this way, since the temperature change of the substrate and the substrate chuck due to the evaporation heat of the organic light emitting material ink applied to the substrate can be suppressed, the thermal expansion of the substrate itself can be suppressed, and further the thermal expansion of the substrate chuck can be suppressed. The positional deviation of the alignment camera can be suppressed. By doing so, positional deviation can be suppressed even when coating is performed on a large-area substrate.

  34 is a substrate alignment camera support frame fixed on the surface plate 10, 30 is a substrate alignment camera (1) attached to the substrate alignment camera support frame 34, and 31 is a substrate alignment camera (30) attached in the same manner as 30 ( 2) and 32 are substrate alignment cameras (3) attached in the same manner as 30, and 33 is a substrate alignment camera (4) attached in the same manner as 30. The four alignment cameras are located above the four substrate alignment marks 11. Has been placed.

  An image recognition device (not shown) is connected to each of the substrate alignment cameras (1), (2), (3), and (4). 56 is a Z-axis support frame fixed on the surface plate 10, 51 is a Z-axis base attached to the Z-axis support frame, 52 is a Z-axis guide attached on the Z-axis base 51, and 55 is a Z-axis guide. The Z-axis stage is slidably supported by 52 and is configured to be positioned by a Z-axis drive motor 54 and control means (not shown).

  Reference numeral 85 denotes an ink discharge head having a plurality of nozzles. As shown in FIG. 14, a nozzle plate 82 having a plurality of nozzle holes 80 is attached below the manifold 81, and an ink supply pipe 83 is connected to the upper part on the opposite side. The organic light emitting material ink can be discharged from the nozzle hole 80 by supplying the organic light emitting material ink from the ink supply pipe 83 with an ink supply pump (not shown). The plurality of nozzle holes had a hole diameter of 30 μm and a pitch between the holes of 300 μm. Further, the movement of the X axis stage, the Y axis stage, the θ axis stage, the Z axis stage, the image recognition means (not shown) for the nozzle alignment camera, the image recognition means (not shown) for the substrate alignment camera, and the ink supply pump are controlled. It is constituted by main control means.

  Next, the operation of the printing apparatus of the present embodiment configured as described above will be described.

  First, the substrate 1 on which the stripe-shaped partition walls 3 and the substrate alignment marks 11 are formed is suction-fixed on the substrate chuck 27. Next, the position calibration operation of the substrate alignment camera is performed. In the position calibration operation of the substrate alignment camera, as shown in FIG. 4A, the reference mark 42 is first moved by moving the X-axis stage 24 and the Y-axis stage 21 with the θ-axis stage positioned at the origin. The alignment camera (1) 30 is moved below. In this state, the center position of the reference mark in the screen is measured by an image recognition means (not shown) connected to the substrate alignment camera (1).

  FIG. 5A shows an image of the substrate alignment camera (1) 30 at that time. In FIG. 5 (a), the X-direction coordinate of the one-dot chain line 61 is the reference position in the X direction, the Y-direction coordinate of the one-dot chain line 60 is the reference position in the Y direction, and the intersection 62 of the one-dot chain lines 60 and 61 is the substrate alignment target position. is there.

  Next, the X-axis stage 24 is moved in the plus direction by the X-direction pitch Xp of the substrate alignment mark 11, and the reference mark 42 is moved below the substrate alignment camera (2) 31. In this state, the center position of the reference mark in the screen is measured by an image recognition means (not shown) connected to the substrate alignment camera (2). FIG. 5B shows an image of the substrate alignment camera (2) 31 at that time. 5B, similarly to FIG. 5A, the X direction coordinate of the one-dot chain line of 61 is the reference position in the X direction, the Y direction coordinate of the one-dot chain line of 60 is the reference position in the Y direction, and the one-dot chain lines 60 and 61 Is the substrate alignment target position.

  Further, the X-axis stage 24 is moved in the minus direction by the X-direction pitch Xp of the substrate alignment mark 11, and the Y-axis stage 21 is moved in the minus direction by the Y-direction pitch Yp of the substrate alignment mark 11 to bring the reference mark 42 into the substrate alignment. The camera (3) 32 is moved below. In this state, the center position of the reference mark in the screen is measured by an image recognition means (not shown) connected to the substrate alignment camera (3). FIG. 5C shows an image of the substrate alignment camera (3) 32 at that time. 5C, similarly to FIG. 5A, the X direction coordinate of the one-dot chain line 61 is the reference position in the X direction, the Y direction coordinate of the one-dot chain line of 60 is the reference position in the Y direction, and the one-dot chain lines 60 and 61 The intersection 62 is the substrate alignment target position. Further, the X-axis stage 24 is moved in the plus direction by the X-direction pitch Xp of the substrate alignment mark 11 to move the reference mark 42 below the substrate alignment camera (4) 33.

  In this state, the center position of the reference mark in the screen is measured by an image recognition means (not shown) connected to the substrate alignment camera (4). An image of the substrate alignment camera (4) 33 at that time is shown in FIG. 5D, as in FIG. 5A, the X direction coordinate of the one-dot chain line of 61 is the reference position in the X direction, the Y direction coordinate of the one-dot chain line of 60 is the reference position in the Y direction, and the one-dot chain lines 60 and 61 The intersection 62 is the substrate alignment target position.

  Next, the nozzle alignment operation will be described with reference to FIGS.

  FIG. 6 is a diagram illustrating a configuration of a nozzle alignment camera of the printing apparatus according to the present embodiment, and FIG. 8 is a diagram illustrating a nozzle alignment method of the printing apparatus according to the embodiment of the present invention.

  As shown in FIG. 8A, a plurality of reference marks 42 formed on the reference mark substrate 43 are moved by moving the X-axis stage 24 and the Y-axis stage 21 with the θ-axis stage 26 positioned at the origin. Positioning is performed under the nozzle hole at the end of the nozzle hole 80 provided in the nozzle plate 82 attached to the lower surface of the ink discharge head 85 having nozzles, the Z-axis stage is lowered and the lower surface of the nozzle plate The upper surface of the reference mark substrate is opposed with a minute gap. An image of the nozzle alignment camera at that time is shown in FIG.

  As shown in FIG. 7A, the nozzle hole 80 is observed in the screen through the reference mark 42 and a circular window at the center of the reference mark. The observed image is processed by an image recognizing unit (not shown) to detect a positional deviation between the center of the round hole of the reference mark 42 and the center of the nozzle hole 80, and the X-axis stage 24 and the Y-axis stage 21 are slightly changed. As shown in FIG. 7B, the center of the round window and the center of the nozzle hole are adjusted so as to coincide with each other, and the X-axis stage coordinate and the Y-axis stage coordinate at that time are coordinated with the nozzle alignment stage coordinates ( Store as 1). Similarly, as shown in FIG. 8B, positioning is performed under the nozzle hole on the opposite end in the nozzle hole 80, and the X-axis stage when the center of the round window coincides with the center of the nozzle hole. The coordinates and Y-axis stage coordinates are stored as nozzle alignment stage coordinates (2).

  Next, the substrate alignment operation will be described with reference to FIGS.

  FIG. 9 is a diagram illustrating a substrate alignment method of the printing apparatus according to the present embodiment, and FIG. 10 is a diagram illustrating a camera image at the time of substrate alignment of the printing apparatus according to the present embodiment.

  As shown in FIG. 9, the X-axis stage 24 and the Y-axis stage 21 are moved so that the substrate alignment marks 11 formed at the four corners on the substrate 1 are replaced with the substrate alignment camera (1) 30 and the substrate alignment camera (2) 31. Then, the substrate alignment camera (3) 32 and the substrate alignment camera (4) 33 are positioned below. An image of each alignment camera in this state is shown in FIG. In this state, the position of the substrate alignment mark in each camera image is measured by an image recognition device (not shown) connected to the substrate alignment camera, and the deviation from the substrate alignment target position 62 in each camera image is calculated. The axis stage 24, the Y-axis stage 21, and the θ-axis stage 26 are slightly moved so that the deviation between the center of the substrate alignment mark 11 and the substrate alignment target position 62 is minimized as shown in FIG. adjust.

  As described above, the position of the substrate alignment camera is calibrated using the reference mark, the nozzle is aligned using the same reference mark, the substrate is aligned, and the nozzle alignment stage coordinates stored during nozzle alignment ( 1) and nozzle alignment stage coordinates (2), nozzle plate 80 nozzle hole 80 placement data, substrate alignment mark 11 placement data on the substrate 1 and partition wall 3 placement data based on the nozzle center by the main control means. The application position is calculated so that the position of the center of the groove of the partition coincides with that of the partition wall, and organic light emission is performed by scanning the substrate while operating an ink supply pump (not shown) from an ink discharge head having a plurality of nozzles as shown in FIG. Apply material ink accurately without climbing on the partition walls I was able to.

  In this embodiment, a glass plate having a size of 370 mm × 470 mm and a plate thickness of 0.7 mm is used as the base material, a liquid-repellent partition material is used as the partition wall, the partition wall width is 40 μm, and the groove width between the partition walls Was 60 μm, and the height of the partition wall was 1 μm. Regarding the nozzle plate, the hole diameter of the solution discharge nozzle was 30 μm, the pitch was 300 μm, and the number of holes was 1300 holes. An organic light emitting material ink having a viscosity of 100 mPa · s was used.

  In the present embodiment, the solution discharge nozzle is simply formed by making a hole in a plane. However, the present invention is not limited to this shape, and a protruding nozzle may be used.

  The organic EL display manufacturing apparatus of the present invention can be applied not only to the formation of a light emitting layer of an organic EL display having a fine pixel pitch, but also to the case where an intermediate layer or the like is formed in a groove of a partition wall.

DESCRIPTION OF SYMBOLS 1 Substrate 10 Surface plate 11 Substrate alignment mark 14 Organic luminescent material ink 20 X-axis guide 21 Y-axis stage 22 Y-axis guide (1)
23 Y-axis guide (2)
24 X-axis stage 25 X-axis linear motor 26 θ-axis stage 27 Substrate chuck 28 Y-axis linear motor (1)
29 Y-axis linear motor (2)
30 Substrate alignment camera (1)
31 Substrate alignment camera (2)
32 Substrate alignment camera (3)
33 Substrate alignment camera (4)
34 Substrate alignment camera support frame 40 Nozzle alignment unit 41 Nozzle alignment camera 42 Reference mark 43 Reference mark substrate 44 Reference mark substrate holder 45 Mirror 46 Mirror holder 47 Nozzle alignment support plate 51 Z-axis base 52 Z-axis guide 53 Ball screw 54 Z-axis Drive motor 55 Z-axis stage 56 Z-axis support frame 80 Nozzle hole 81 Manifold 82 Nozzle plate 83 Ink supply pipe 85 Ink discharge head having a plurality of nozzles

Claims (5)

In a printing apparatus comprising: a discharge head that has a nozzle hole and discharges a functional material solution from the nozzle hole; and a holding unit that is disposed opposite to the discharge head and holds a substrate.
The apparatus further comprises moving means that allows the ejection head and the holding means to move relative to each other, substrate position measuring means that measures the position of the substrate, and nozzle hole position measuring means that measures the position of the nozzle hole. ,
The printing apparatus, wherein the nozzle hole position measuring unit has a reference mark serving as a reference for measuring the position of the nozzle hole, and the position of the substrate position measuring unit is calibrated with the reference mark. The material of the holding means is made of stone,
The printing apparatus according to claim 1, wherein the nozzle hole position measuring unit is fastened to the holding unit. The substrate position measuring means and the nozzle hole position measuring means are equipped with a camera having an image recognition function, and a mark formed on the substrate is used as a reference mark.
The printing apparatus according to claim 1, wherein a nozzle position is measured based on the mark, and position calibration of the substrate position measuring unit is performed based on the mark position. The printing apparatus according to claim 1, wherein the reference mark has a shape in which a round hole is formed in a center of a cross. The printing apparatus according to claim 1, wherein a position calibration process of the substrate position measurement unit using the reference position mark is performed immediately before printing.

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