JP2006258845A - Pattern forming device and head correcting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a pattern forming device or the like of which the operating ratio can be improved by reducing a time required for position adjustment of a head therein. <P>SOLUTION: In a pattern forming device 1, a suction table 3 supporting a substrate 13 is provided with a camera 7, and a processing part 2 is provided with a camera 21. The pattern forming device 1 detects a position or the like of a head 29 of the processing part 2 by the camera 7 and detects an impact position or the like of ink on the substrate 13 by the camera 21. The pattern forming device 1 uses picked-up images of cameras 7 and 12 to calculate correction data 53 for correcting the position of the head 29 and the position of the substrate 13. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a pattern forming apparatus for forming a pattern such as a color filter. Specifically, the present invention relates to a pattern forming apparatus that can correct the position of a head or the like.

  Conventionally, there are various methods such as a dyeing method, a pigment dispersion method, an electrodeposition method, and a printing method as a method for forming a color filter pattern used for a liquid crystal display, organic EL (organic Electroluminescence), etc. on a substrate.

In addition, there has been proposed a pattern forming apparatus that forms a colored layer pattern by ejecting ink of three colors of R (red), G (green), and B (blue) onto a substrate by an ink jet method (for example, [Patents] Reference 1]).
According to this ink jet method, pattern formation of three colors of R (red), G (green), and B (blue) can be performed in a single process, and the manufacturing process can be simplified, thereby reducing cost and yield. The improvement etc. can be aimed at.

  In addition, there has been proposed an inkjet head unit that includes a plurality of inkjet heads and is provided with a position adjustment mechanism that can adjust the interval between the inkjet heads, thereby reducing the time required for alignment of the inkjet heads (for example, [[ (See Patent Document 2]).

JP 2002-361852 A JP 2001-330720 A

  However, in the conventional technique, it is difficult to quickly obtain the correction amount related to the position adjustment, and it takes a considerable time to adjust the position of the head, and there is a problem that the production efficiency is deteriorated.

  The present invention has been made in view of the above-described problems, and reduces the time required for head position adjustment in the pattern forming apparatus and makes it possible to improve the operating rate of the pattern forming apparatus. The purpose is to provide.

  In order to achieve the above-described object, the first invention is a pattern forming apparatus that forms a pattern on the substrate by performing processing with a head that is movable relative to the substrate, and can image the head. A pattern forming apparatus comprising at least one of a first imaging device and a second imaging device capable of imaging the substrate.

  In the pattern forming apparatus of the first invention, when a predetermined pattern can be formed, at least one of the first imaging device or the second imaging device images and registers at least one reference portion of the head or the substrate. When forming the same pattern as the predetermined pattern, the correction data is calculated based on the difference between the imaging data by at least one of the first imaging device and the second imaging device and the registered imaging data, and the correction data Based on this, the position of the head, the position of the substrate, the processing timing, etc. can be corrected.

In the pattern forming apparatus of the first invention, at least one of the first imaging device and the second imaging device captures an image of at least one of the reference portions of the head or the substrate, and an arbitrary position on the captured image is designated. Then, correction data can be calculated based on the position of the reference part and the designated position on the captured image, and the position of the head, the position of the substrate, the processing timing, and the like can be corrected based on the correction data.
Note that not only the corrected position but also the position of the reference part before correction may be designated on the captured image.

The first imaging device is an imaging device that images a target object, and is, for example, a CCD camera (Charge Coupled Device). The first imaging device is preferably provided on a substrate support unit that supports the substrate. The substrate support unit is, for example, a suction table that sucks and supports a substrate.
The second imaging device is an imaging device that images a target object, and is, for example, a CCD camera (Charge Coupled Device). The second imaging device is preferably provided in a head support portion that supports the head. The head support portion is, for example, a slider that supports a processing portion provided with at least one head and moves along a slide rail in a predetermined direction (Y direction).

The reference portion of the head indicates an object to be imaged by the first imaging device, and is, for example, a nozzle hole of the head, a mark indicating the position of the head or the nozzle hole, or the like.
The reference portion of the substrate indicates an object to be imaged by the second imaging device, and is, for example, a landing position of ink ejected from the head.
The processing process is a process performed by the head on the substrate, for example, an ink application process or a laser irradiation process.

  In the first invention, the pattern forming apparatus calculates the correction data by detecting the position of the head or the landing position on the substrate by the first imaging apparatus or the second imaging apparatus, and based on the correction data, Since the position of the substrate, the processing timing, and the like are corrected, the time required for adjusting the position of the head or the substrate can be reduced. As a result, production costs can be reduced and production efficiency can be improved.

2nd invention is a board | substrate support part which is a board | substrate support part which supports a board | substrate, Comprising: The 1st imaging device which can image an upper target object is provided.
It is desirable for the first imaging device to detect the position of the head that can move relative to the substrate.

  The second invention is an invention relating to the substrate support in the pattern forming apparatus of the first invention.

According to a third aspect of the present invention, there is provided a head support unit that supports a head that performs processing, and includes a second imaging device that can image a lower object.
It is desirable for the second imaging device to detect the landing position of the ejected matter from the head on the substrate that can move relative to the head.

  A third invention is an invention relating to the head support portion in the pattern forming apparatus of the first invention.

  According to a fourth aspect of the present invention, there is provided a correction method for a head that is movable relative to a substrate and performs a predetermined process, and when a predetermined pattern can be formed, the first imaging device uses the reference portion of the head. When forming a pattern identical to the predetermined pattern with at least one of a first registration step for imaging and registering, and a second registration step for imaging and registering a reference portion of the substrate with a second imaging device, A first correction data calculating step for calculating correction data based on a difference between the imaging data by the first imaging device and the imaging data registered by the first registration step; the imaging data by the second imaging device and the second registration step; At least one of a second correction data calculation step for calculating correction data based on a difference from the imaging data registered by the correction data, and the correction data Based on the position of the head, the position of the substrate, a head correction method characterized by comprising a correction step of correcting at least one of the processing timing.

  According to a fifth aspect of the present invention, there is provided a correction method for a head that is movable relative to a substrate and performs a predetermined process, wherein the first imaging device captures an image of a reference portion of the head, and an arbitrary image on the captured image. At least one of a first position designating step for designating a position of the image, an image of a reference part of the substrate by the second imaging device, and designating an arbitrary position on the captured image; A third correction data calculation step for calculating correction data based on the position of the reference portion and the designated position in the head; and at least one of the position of the head, the position of the substrate, and the processing timing based on the correction data And a correction step for correcting the head.

  4th invention and 5th invention are the invention regarding the correction method of the head in the pattern formation apparatus of 1st invention.

  ADVANTAGE OF THE INVENTION According to this invention, the pattern formation apparatus etc. which make it possible to reduce the time required for the position adjustment of the head in a pattern formation apparatus and to improve the operation rate of a pattern formation apparatus can be provided.

  DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of a pattern forming apparatus and the like according to the present invention will be described in detail with reference to the accompanying drawings. In the following description and the accompanying drawings, the same reference numerals are given to components having substantially the same functional configuration, and redundant description will be omitted.

First, the configuration of the pattern forming apparatus 1 according to the embodiment of the present invention will be described with reference to FIG.
Hereinafter, description will be made assuming that the pattern forming apparatus 1 performs pattern formation mainly by an ink jet method. Note that the technique shown in this embodiment can be applied not only to the ink jet system but also to the case where pattern formation is performed by laser irradiation.

FIG. 1 is a schematic perspective view of the pattern forming apparatus 1.
The θ axis indicates the vertical rotation axis, and the θ direction indicates the rotation direction. The Y axis indicates the patterning pitch direction, the X axis indicates the patterning direction, and the θ axis, the Y axis, and the X axis are perpendicular to each other.

  A pattern forming apparatus 1 shown in FIG. 1 includes a processing unit 2, a suction table 3, an X direction moving stage 5, a θ direction moving stage 9, an alignment camera 11, and the like.

  The pattern forming apparatus 1 is an apparatus that manufactures a color filter by an inkjet method. The pattern forming apparatus 1 discharges ink containing three color pigments of R (red), G (green), and B (blue) onto a light-transmitting substrate by an inkjet method, and cures and colors each ink. A pixel portion is formed, and a color filter pattern is formed on the substrate.

The processing unit 2 is configured by arranging at least one head 29 on a base 25.
The head 29 is a device that performs processing such as ink application and laser irradiation on the substrate 13, and is, for example, an inkjet head or a laser irradiation head. The processing unit 2 is provided in the gantry 21 via a Y-direction moving mechanism 15 (slider 17, slide rail 19 and the like), a rotating mechanism 23 and the like. The processing unit 2 forms a pattern by ejecting ink or the like from the head 29 or irradiating the substrate 13 with a laser.

The processing unit 2 is movable in the Y direction by the Y direction moving mechanism 15. By the position control by the Y-direction moving mechanism 15, the position of the processing unit 2 in the Y direction can be adjusted. Further, the processing unit 2 can be rotated in the θ direction by the rotation mechanism 23. Position control in the θ direction of the processing unit 2 can be performed by position control by the rotation mechanism 23.
Details of the processing unit 2 will be described later.

As the Y-direction moving mechanism 15, a general purpose one can be used, and for example, a linear motor, a slide mechanism, or the like can be used. Further, as the rotation mechanism 23, a direct drive motor or the like can be used.
Further, a vertical movement mechanism may be provided in the θ-axis vertical rotation axis direction. In addition, precision length measuring means such as a linear scale is arranged on the slide rail, and the motor that drives linear movement is feedback controlled.

  The suction table 3 is a table that sucks and fixes a substrate 13 (glass substrate, film substrate, or the like) that is a target for forming a color filter pattern. The adsorption of the substrate is performed, for example, by reducing the pressure and vacuum of the air between the adsorption table and the substrate. In this case, the suction table is provided with a small hole (not shown) for sucking air, and at the time of suction, air is sucked by a vacuum pump (not shown) or the like through the hole.

  The X direction moving stage 5 is a linear moving stage and is supported so as to be movable in a predetermined axial direction by a controllable motor such as a step motor, a servo motor, or a linear motor. The X-direction moving stage 5 moves the suction table 3 in the X direction based on the control amount output from the control unit 41. Further, for linear movement of the X-direction moving stage 5, precision length measuring means such as a linear scale is arranged at the time of the slide rail, and is controlled by feedback to the motor.

  Regarding the Y direction, a Y-direction moving stage (not shown) having the same mechanism as the X-direction moving stage 5 may be provided on the suction table 3 side, or as shown in FIG. A Y-direction moving mechanism 15 may be provided on the side.

  The θ-direction moving stage 9 is a rotating stage and is rotatably supported on a predetermined rotating shaft by a controllable motor such as a step motor, a servo motor, a direct drive motor, or the like. The θ-direction moving stage 9 rotates the suction table 3 based on the control amount output from the control unit 41.

The camera 7 is an imaging device that is provided on the suction table 3 and that can image an upper object. The camera 7 images a predetermined portion of the processing unit 2 and detects the position of the nozzle hole 31 of the head 29 and the like.
The camera 21 is an image pickup apparatus that is provided on the slider 17 that supports the processing unit 2 and can pick up an image of an object below. The camera 21 images a predetermined portion of the substrate 21 in order to detect the landing position of ink or the like on the substrate 13.
The camera 7 and the camera 21 are image processing cameras such as a CCD camera (Charge Coupled Device), for example. The camera 7 and the camera 21 can detect the position of the target, a predetermined part of the target, and the like by photographing the target and performing image processing on the acquired image data.

The alignment camera 11 detects a predetermined angle (an alignment mark (not shown) or the like formed on the substrate) on the substrate 13 in order to detect the θ-direction angle and XY coordinates of the substrate 13 that is attracted and fixed to the adsorption table 3. A camera for imaging. The captured image of the alignment camera 11 is input to the control unit 41 of the pattern forming apparatus 1.
The alignment camera 11 is fixedly supported on a frame (not shown) of the pattern forming apparatus 1.

  The control unit 41 is a device that controls operations of various devices constituting the pattern forming apparatus 1 and performs arithmetic processing, and is a computer, for example. The control unit 41 includes a CPU 43, a memory 45, a storage unit 47, and the like.

The CPU 43 is a processor that performs arithmetic processing, operation control, and the like, and calls a program stored in the storage unit 47, ROM, recording medium, or the like to the memory 45 and executes it.
The memory 45 is a ROM, a RAM, or the like, and holds various types of information permanently or temporarily.
The storage unit 47 is a storage device such as a memory or a hard disk, and holds specification data 49, registration data 51, correction data 53, and the like.

The specification data 49 includes standard settings and initial settings regarding the pattern pitch of the substrate to be manufactured, the mounting position of the head unit 27, the rotation angle, the position coordinates of the reference nozzle hole 33, the timing of ink ejection, the operation of various devices, and the like. It is the data shown.
The registration data 51 is registration data such as a captured image of the head 29 by the camera 7 and a captured image of the substrate 13 by the camera 21. The registration data 51 is obtained by registering a captured image when pattern formation conforming to the specification data 49 is performed.
The correction data 53 is data indicating a correction amount relating to the position of the head 29, the position of the substrate 13, the ink ejection timing, and the like.

The control unit 41 performs a process of extracting the θ direction angle and the XY coordinates of the substrate 13 based on the captured image of the alignment camera 11. The control unit 41 compares the extracted data with predetermined data, calculates a deviation between them, and calculates a control amount so as to reduce the deviation. The controller 41 outputs control amounts to the X-direction moving stage 5, the θ-direction moving stage 9, the Y-direction moving stage, etc., and controls the position of each stage. As described above, the control unit 41 controls the substrate 13 to have a predetermined θ-direction angle and a predetermined XY coordinate based on the captured image of the alignment camera 11.
Further, the control unit 41 corrects the position of the head 29 and the position of the substrate 13 at the time of pattern formation based on the captured images of the camera 7 and the camera 21. The details of the correction process will be described later.

  As described above, the pattern forming apparatus 1 uses the X direction moving stage 5, the θ direction moving stage 9, the Y direction moving stage, the Y direction moving mechanism 15 and the like so that the predetermined XY coordinates and the predetermined θ direction angle are obtained. Positioning and position correction of the substrate 13 and the head 29 are performed.

Next, the configuration of the processing unit 2 of the pattern forming apparatus 1 will be described with reference to FIG.
FIG. 2 is a view of the processing unit 2 as viewed from below.

The processing unit 2 shown in FIG. 2 is configured by attaching at least one head unit 27 to a base 25 of a plate member.
The head unit 27 is configured by arranging at least one head 29 on a plate-like member.
The head 29 is a head such as an inkjet head or a laser irradiation head, and has at least one nozzle hole 31 for ejecting ink or the like. In the case of a laser irradiation head, the nozzle hole 31 corresponds to a laser emission port.

  The head unit 27 may be provided for each single color (R, G, B). Further, the number and arrangement of the heads 29 provided in each head unit 27 are not particularly limited, and one head 29 may be provided in one head unit 27.

Each head 29 is provided with an adjustment mechanism (not shown) that can move in the nozzle row direction (W direction).
Hereinafter, the relative positional relationship between the heads 29 attached to the head unit 27 and the nozzle holes 31 will be described as having a predetermined accuracy.

The base 25 is a base member to which at least one head unit 27 is attached. The base 25 is provided with at least one slide rail 35 according to the number of head units 27 to be attached.
A slide bush (not shown) that is movable along the slide rail 35 is provided on the head unit 27 side. The base 25 and the head unit 27 are attached via a slide rail 35 and a slide bush. The head unit 27 is movable in the W direction along the slide rail 35 by a drive device such as a linear motor (not shown).

  The linear scale 37 is provided on the base 25 side. A linear scale head (not shown) is provided on the head unit 27 side. The memory of the linear scale 37 can be read by the linear scale head, and the position of the head unit 27 relative to the base 25, the amount of movement, etc. can be measured.

  Next, the operation of the pattern forming apparatus 1 according to the first embodiment of the present invention will be described with reference to FIGS.

3 to 6 are flowcharts showing the operation of the pattern forming apparatus 1.
FIG. 3 is a flowchart showing the processing from the specification data 49 to the creation of the registration data 51.
FIG. 4 is a flowchart showing a process for forming a pattern based on the registration data 51.
FIG. 5 is a flowchart showing details of the correction process A (FIG. 3: step 305) performed in the process shown in FIG.
FIG. 6 is a flowchart showing details of the correction process B (FIG. 4: step 402) performed in the process shown in FIG.

The control unit 41 of the pattern forming apparatus 1 reads the specification data 49 from the storage unit 47 and holds it in the memory 45 (step 301).
The controller 41 adjusts the position of the head 29 based on the image captured by the head 29 by the camera 7 (step 302).
In step 302, the nozzle hole pitch is acquired based on the image captured by the head 29 by the camera 7. In addition, although it does not specifically limit regarding acquisition of the pitch between nozzle holes, you may measure the distance between adjacent nozzle holes, and the distance between two predetermined nozzle holes (total pitch of nozzle holes etc.). You can also ask for it.
When the pitch between the nozzle holes does not match the pattern pitch of the specification data 49, the position of the head 29 is adjusted by rotating the base 25 in the θ direction by the rotation mechanism 23 to match the pitch.
The control unit 41 performs processing on the substrate 13 by the processing unit 2 to form a pattern (step 303).

  When the formed pattern does not conform to the specification data 49 (No in Step 304), the position of the head 29 and the position of the substrate 13 are corrected (Step 305), and the processing from Step 303 is repeated again. Details of the correction process A (step 305) will be described later.

  When the formed pattern conforms to the specification data 49 (Yes in Step 304), the captured image of the head 29 by the camera 7 and the captured image of the substrate 13 by the camera 21 are registered in the storage unit 47 as registration data 51 (Step 306). ). Regarding the registration data 51, various data calculated by performing image processing on the captured image instead of the captured image or together with the captured image may be held.

  Even if correction data A (step 305) is used to form a proper pattern and the registration data 51 is acquired, the head unit 27 can be replaced by inserting / removing the slide rail 35 of the base 25. It is difficult to maintain accuracy when pattern formation is continued for a certain period of time. For example, in the case of a color filter pattern, high accuracy on the order of microns is required. Therefore, even when the pattern forming apparatus 1 is operated to actually produce a pattern substrate, it is necessary to perform correction processing as will be described below with reference to FIGS.

The control unit 41 of the pattern forming apparatus 1 reads the registration data 51 from the storage unit 47 and holds it in the memory 45 (step 401).
The controller 41 corrects the position of the head 29 and the position of the substrate 13 (step 402). Details of the correction process B (step 402) will be described later.
The control unit 41 performs processing on the substrate 13 by the processing unit 2 to form a pattern (step 403).

Details of the correction process A (FIG. 3: step 305) will be described with reference to FIG.
The control unit 41 of the pattern forming apparatus 1 acquires a captured image of the head 29 (nozzle hole position, etc.) by the camera 7 (step 501), and acquires a captured image of the substrate 13 (ink landing position, etc.) by the camera 21. (Step 502). In the correction process A, it is desirable to use images captured by both the camera 7 and the camera 21, but only one of them may be used.

The operator of the pattern forming apparatus 1 designates a position on the captured image, and the control unit 41 holds the designated position (designated position 60) in the memory 45 (step 503).
In step 503, the operator designates a corrected position for the head 29 or the reference portion of the substrate 13 displayed on the captured image. The reference portion indicates a reference target in the head 29 or the substrate 13 and is, for example, a nozzle hole of the head 29 or an ink landing position on the substrate 13. The position designation can be input using various devices such as a pointing device.

The control unit 41 detects the position of the reference portion of the head 29 or the substrate 13. The control unit 41 determines the correction amount of the position of the head 29 and the position of the substrate 13 based on the position of the reference portion (reference portion position 58) of the head 29 or the substrate 13 and the position specified in step 503 (specified position 60). And the correction amount of the processing timing are calculated and stored in the storage unit 47 as correction data 53 (step 504).
The control unit 41 corrects the position of the head 29 and the position of the substrate 13 based on the correction amount indicated by the correction data 53 (step 505).

  The position before correction of the reference part (movement target point) has been described as being detected by performing image processing on the captured image. However, the position before correction is the same as the position specification after correction (step 503). Also, the image may be designated on the captured image.

Details of the correction process B (FIG. 4: step 402) will be described with reference to FIG.
The control unit 41 of the pattern forming apparatus 1 acquires the captured image of the head 29 (the position of the nozzle hole, etc.) with the camera 7 (step 601), and acquires the captured image of the substrate 13 (the landing position of the ink, etc.) with the camera 21. (Step 602). In the correction process B, it is desirable to use images captured by both the camera 7 and the camera 21, but only one of them may be used.

The control unit 41 determines the correction amount of the position of the head 29 and the correction amount of the position of the substrate 13 based on the difference between the captured image acquired in the processing of Step 601 and Step 602 and the captured image registered in the registration data 51. Then, the correction amount of the machining processing timing is calculated and stored in the storage unit 47 as the correction data 53 (step 603).
The control unit 41 corrects the position of the head 29 and the position of the substrate 13 based on the correction amount indicated by the correction data 53 (step 604).

Here, calculation of the correction amount based on the captured image by the camera 7 will be described with reference to FIGS. 7 and 8.
Hereinafter, calculation of the correction amount in the correction process B shown in FIG. 6 (FIG. 6: step 603) will be described.
The correction process A shown in FIG. 5 designates the corrected position with respect to the reference portion of the head 29 or the substrate 13, and the correction process B shown in FIG. 6 uses the registered data 51 as the corrected position. The correction amount calculation processing in both steps is the same. Therefore, the calculation of the correction amount in the correction process A shown in FIG. 5 can be similarly processed.

The control unit 41 of the pattern forming apparatus 1 detects the position coordinates of the reference nozzle hole 33 from the image 55 taken by the camera 7 (FIG. 6: step 601).
The control unit 41 calculates the correction data 53 (head unit correction amount 67, ejection start position deviation amount 69, etc.) from the detected nozzle hole position 57 detected by the camera 7 and the registered nozzle hole position 59 indicated by the registered data 51 (the head unit correction amount 67, the discharge start position deviation amount 69, etc.). FIG. 6: Step 603).

FIG. 7 is an explanatory diagram for calculating correction data (when the head unit 27 is movable in one axis direction).
The captured image 55 is an image obtained by capturing the vicinity of the reference nozzle hole 33 with the camera 7.
The detection nozzle hole position 57 is a coordinate position at which the reference nozzle hole 33 is detected by the camera 7.
The registered nozzle hole position 59 is a coordinate position of the reference nozzle hole 33 registered in the registered data 51.
As shown in FIG. 7, a pitch deviation amount 31 (Y direction deviation amount) and a coating direction deviation amount 63 (X direction deviation amount) occur between the detection nozzle hole position 57 and the registered nozzle hole position 59. Yes.

The control unit 41 of the pattern forming apparatus 1 corrects the coordinate position on the extension line in the nozzle row direction (W direction) from the detection nozzle hole position 57 and the coordinate position in the Y direction of the registered nozzle hole position 59 is corrected. Calculated as hole position 65.
The control unit 41 calculates the distance from the detected nozzle hole position 57 to the corrected nozzle hole position 65 as the head unit correction amount 67, and calculates the distance from the registered nozzle hole position 59 to the corrected nozzle hole position 65 as the discharge start position deviation. Calculated as quantity 69.

  Specifically, the correction data can be calculated as follows: head unit correction amount 67 = pitch deviation amount 31 / cos θ, ejection start position deviation amount 69 = application direction deviation amount 63 + pitch deviation amount 31 × tan θ.

  The selection of the reference nozzle hole 33 is not particularly limited. For example, as shown in FIG. 2, the nozzle hole 31 at the extreme end of the head unit 27 can be used as the reference nozzle hole 33, and each head. For each unit 27, a predetermined nozzle hole 31 (for example, the tenth nozzle hole 31 from the left end) may be used as the reference nozzle hole 33.

The control unit 41 of the pattern forming apparatus 1 adjusts the mounting position of the head unit 27 and the position of the head 29 in the base 25 based on the head unit correction amount 67 of the correction data 53 and the ejection start position of the correction data 53. Based on the deviation amount 69 and the like, the ejection timing from the nozzle hole 31 is adjusted, and ink is ejected to form a pattern on the substrate (FIG. 3: step 303, FIG. 4: step 403).
The head unit 27 is moved by a driving device such as a linear motor (not shown), and the moving amount can be measured by a length measuring device such as a linear scale 37.

FIG. 8 is an explanatory diagram of calculation of correction data (when the head unit 27 is movable in two axial directions).
In the description of FIG. 7 described above, the head unit 27 has been described as being movable in one axis direction in the nozzle row direction (W direction), but may be movable in two axis directions.

As shown in FIG. 8, for example, when the base 25 is movable in two axial directions of the X direction and the Y direction, the control unit 41 of the pattern forming apparatus 1 corrects the coordinate position of the registered nozzle hole position 59. The nozzle hole position 65 may be calculated. In this case, a head unit correction amount (X direction) 71 and a head unit correction amount (Y direction) 73 may be calculated as the head unit correction amount 67.
Since the coordinate position of the corrected nozzle hole position 65 coincides with the coordinate position of the registered nozzle hole position 59, the discharge timing shift does not occur, and the discharge start position shift amount 69 is “0”. It is not necessary to calculate the discharge start position deviation amount 69, and it is not necessary to correct the discharge start timing.

7 and 8, the calculation of the correction amount based on the captured image by the camera 7 has been described, but the correction amount based on the captured image by the camera 21 can be calculated in the same manner. In the case of the camera 7, the correction amount is calculated by detecting the position of the nozzle hole 31 of the head 29, but in the case of the camera 21, if the correction amount is calculated by detecting the ink landing position on the substrate 13. Good.
The correction amount may be anything that corrects the relative positional relationship between the head 29 side and the substrate side 13. Therefore, not only the position on the head 29 side but also the position on the substrate 13 side may be corrected based on the image captured by the camera 7, or only the position on the substrate 13 side based on the image captured by the camera 21. Alternatively, the position on the head 29 side may be corrected.

7 and 8, the calculation of the correction amount in the correction process B shown in FIG. 6 (FIG. 6: Step 603) has been described. However, the calculation of the correction amount in the correction process A shown in FIG. it can.
In this case, the same processing may be performed assuming that the designated position 60 corresponds to the registered nozzle hole position 59 and the reference portion position 58 corresponds to the detection nozzle hole position 58.

  Through the above process, the pattern forming apparatus 1 according to the embodiment of the present invention corrects the position of the head 29, the position of the substrate 13, the ink discharge timing, and the like based on the images captured by the camera 7 and the camera 21.

When a corrected position is specified for the reference portion of the head 29 or the substrate 13 on the captured image, the pattern forming apparatus 1 calculates correction data based on the difference between the reference portion position and the specified position, and performs correction processing. Do.
In addition, the pattern forming apparatus acquires registration data 51 (images captured by the camera 7 and the camera 21) for forming a pattern that conforms to product specifications, and is based on the registration data 51 and the images captured by the camera 7 and the camera 21. Then, the pattern is sequentially formed on the substrate 13 while correcting the position of the head 29, the position of the substrate 13, the processing timing, and the like.

  As described above, the pattern forming apparatus 1 includes the camera 7 on the suction table 3 that supports the substrate 13 and the camera 21 on the processing unit 2. In the pattern forming apparatus 1, the camera 7 detects the position of the head 29 of the processing unit 2, and the camera 21 detects the ink landing position on the substrate 13. The pattern forming apparatus 1 calculates correction data 53 for correcting the position of the head 29, the position of the substrate 13, the processing timing, and the like using the captured images of the camera 7 and the camera 21.

When the position of the head 29 or the like is adjusted in order to acquire the registration data 51, or when the position of the head 29 or the like is adjusted based on the registration data 51, correction processing is performed based on the correction data 53.
Therefore, when forming a pattern for each product specification to obtain registration data, or when mass-producing a pattern substrate based on the registration data, it is possible to reduce the time required for position adjustment of the head, the substrate, and the like. As a result, production costs can be reduced and production efficiency can be improved.

In addition, although the inkjet head was demonstrated regarding the head 29, the head 29 is not restricted to an inkjet head, Various processing apparatuses, such as a laser irradiation head, can be applied.
Further, regarding the positional deviation of the head, the correction data is calculated by paying attention to the positional deviation of the reference nozzle hole, but is not limited thereto. Instead of the position of the nozzle hole, a predetermined mark (mark) may be attached to the head or the head unit or the like as the reference portion of the head, and correction data may be calculated based on the positional deviation amount of the predetermined mark. .

Further, the number of head units 27 provided on the base 25 is not limited, and may be one or plural. The head unit 27 may be provided for each single color (R, G, B). Further, there is no particular limitation on the number and arrangement of the heads 29 provided in each head unit 27.
FIG. 9 is a diagram illustrating an aspect of the base 25 and the head unit 27.
For example, as shown in FIG. 9, one head unit 27 may be provided in one base 25, and one head 29 may be provided in one head unit 27.

  As described above, according to the pattern forming apparatus and the like of the present invention, a camera that images a predetermined portion of the head is provided on the support portion of the substrate, and a camera that images a predetermined portion of the substrate on the support portion of the head And detecting the positional deviation of the head and the substrate with both cameras, calculating correction data from the positional deviation amount, and correcting the position of the head, the position of the substrate, the processing timing, etc. based on the correction data. To correct the positional deviation. Detection of the positional deviation between the head and the substrate can be performed by paying attention to the position of the nozzle hole and the landing position of the ejected ink or the like from the head.

  The preferred embodiments of the pattern forming apparatus and the like according to the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to such examples. It will be apparent to those skilled in the art that various changes or modifications can be conceived within the scope of the technical idea disclosed in the present application, and these are naturally within the technical scope of the present invention. Understood.

Schematic perspective view of the pattern forming apparatus 1 The figure which looked at processing part 2 from the lower part Flowchart showing the operation of the pattern forming apparatus 1 (processing from creation of the specification data 49 to the registration data 51) Flowchart showing the operation of the pattern forming apparatus 1 (processing for forming a pattern based on the registration data 51) Flow chart showing details of correction processing A Flow chart showing details of correction process B Explanatory drawing of calculation of correction data (when head unit 27 is movable in one axis direction) Explanatory drawing of calculation of correction data (when head unit 27 is movable in two axial directions) The figure which shows the one aspect | mode of the base 25 and the head unit 27

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ......... Pattern forming apparatus 2 ......... Processing part 3 ......... Suction table 5 ......... X direction moving stage 7 ...... Camera 9 ..... theta. Direction moving stage 11 ......... Alignment camera 13 ......... Board 15 ......... Y-axis moving mechanism 17 ......... Slider 19 ......... Slide rail 21 ......... Camera 23 ...... Rotating mechanism 25 ......... Base 27 ......... Head unit 29 ......... Head 31 ... ... Nozzle hole 33 ... Standard nozzle hole 35 ... Slide rail 37 ... Linear scale 41 ... Control unit 43 ... CPU
45 ......... Memory 47 ......... Storage section 49 ......... Specification data 51 ......... Registered data 53 ......... Correction data 55 ......... Imaged image 57 ......... Detection nozzle hole position 58 ......... Reference part position 59 ......... Registered nozzle hole position 60 ......... Specified position 61 ......... Pitch deviation amount 63 ......... Displacement direction deviation amount 65 ......... After-correction nozzle hole positions 67, 71, 73 ......... Head unit correction amount 69 ……… Displacement start position deviation

Claims (11)

A pattern forming apparatus that forms a pattern on the substrate by performing processing with a head that is movable relative to the substrate,
A first imaging device capable of imaging the head;
A pattern forming apparatus comprising at least one of a second imaging device capable of imaging the substrate. A first registration unit configured to image and register a reference portion of the head with the first imaging device when a predetermined pattern can be formed;
At least one of second registration means for imaging and registering a reference portion of the substrate by the second imaging device;
First correction data calculating means for calculating correction data based on a difference between imaging data obtained by the first imaging device and imaging data registered by the first registration means when forming the same pattern as the predetermined pattern;
At least one of second correction data calculation means for calculating correction data based on the difference between the imaging data obtained by the second imaging device and the imaging data registered by the second registration means;
Correction means for correcting at least one of the position of the head, the position of the substrate, and processing timing based on the correction data;
The pattern forming apparatus according to claim 1, further comprising: First position specifying means for picking up an image of a reference portion of the head with the first image pickup device and specifying an arbitrary position on the picked-up image;
At least one of second position designation means for imaging a reference portion of the substrate by the second imaging device and designating an arbitrary position on the captured image;
Third correction data calculating means for calculating correction data based on the position of the reference portion on the captured image and the designated position;
Correction means for correcting at least one of the position of the head, the position of the substrate, and processing timing based on the correction data;
The pattern forming apparatus according to claim 1, further comprising:   The pattern forming apparatus according to claim 1, wherein the first imaging device is provided on a substrate support unit that supports the substrate.   The pattern forming apparatus according to claim 1, wherein the second imaging device is provided in a head support portion that supports the head. A substrate support for supporting the substrate,
A substrate support section comprising a first imaging device capable of imaging an upper object.   The substrate support unit according to claim 6, wherein the first imaging device detects a position of a head that is movable relative to the substrate. A head support unit for supporting a head for processing,
A head support unit comprising a second imaging device capable of imaging a lower object.   The head support unit according to claim 8, wherein the second imaging device detects a landing position of an ejected matter from the head on a substrate movable relative to the head. A method of correcting a head that is movable relative to a substrate and performs a predetermined process,
A first registration step of imaging and registering a reference portion of the head with a first imaging device if a predetermined pattern can be formed;
At least one of a second registration step of imaging and registering a reference portion of the substrate with a second imaging device;
A first correction data calculation step for calculating correction data based on a difference between imaging data obtained by the first imaging device and imaging data registered by the first registration step when forming the same pattern as the predetermined pattern;
At least one of a second correction data calculation step for calculating correction data based on a difference between the imaging data obtained by the second imaging device and the imaging data registered in the second registration step;
A correction step of correcting at least one of the position of the head, the position of the substrate, and the processing timing based on the correction data;
A method of correcting a head, comprising: A method of correcting a head that is movable relative to a substrate and performs a predetermined process,
A first position designation step of imaging a reference portion of the head by the first imaging device and designating an arbitrary position on the captured image;
At least one of a second position designation step of imaging a reference portion of the substrate by the second imaging device and designating an arbitrary position on the captured image;
A third correction data calculating step for calculating correction data based on the position of the reference portion on the captured image and the designated position;
A correction step of correcting at least one of the position of the head, the position of the substrate, and the processing timing based on the correction data;
A method of correcting a head, comprising:

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