JP2006247500A - Pattern forming apparatus and pattern forming method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a pattern forming apparatus in which the yield is improved by high precisely and stably forming a pattern. <P>SOLUTION: In the pattern forming apparatus 1, each position of a black matrix (BM), a substrate side stage 3 and a head side stage 5 is measured, a corrected coating data 43 is formed by correcting a standard coating data 41 based on the measured position data, ink discharge timing (the start of discharge and the stoppage of the discharge) is controlled based on the corrected coating data 43 and the relative position between the substrate side stage 3 and the head side stage 5 is controlled. Further in the pattern forming apparatus 1, additional coating data 45 is formed by detecting the existence and the position of defects such as a white defect, a black defect or the occurrence of projecting part and additional coating is carried out on the defect position based on the additional coating data 45. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a pattern forming apparatus and a pattern forming method for forming a pattern such as a color filter in a display device. More specifically, the present invention relates to a pattern forming apparatus, a pattern forming method, and the like that can perform pattern alignment with high accuracy.

  Conventionally, as a method of forming a color filter pattern used for a liquid crystal display, PDP (Plasma Display Panel), organic EL (Organic ElectroLuminescence), etc. on a substrate, various methods such as a dyeing method, a pigment dispersion method, an electrodeposition method, a printing method, etc. There is a way.

In addition, there has been proposed a pattern forming apparatus that forms a colored layer pattern by ejecting ink of three colors of R (red), G (green), and B (blue) onto a substrate by an ink jet method (for example, [Patents] Reference 1]).
According to this ink jet method, pattern formation of three colors of R (red), G (green), and B (blue) can be performed in a single process, and the manufacturing process can be simplified, thereby reducing cost and yield. The improvement etc. can be aimed at.

Usually, when a colored layer (R, B, G) such as a color filter is applied by an ink jet method, a substrate on which a BM (black matrix) is formed is placed on a stage to perform alignment and set in advance. Application is performed by matching the relative position between the inkjet head and the stage based on the standard data.
Regarding the correction of the coating pattern, there has been proposed a pattern manufacturing apparatus that performs coating for each head in advance and thins out the ejected droplets for each hole so that the coating droplet amount per unit area is uniform (for example, [See Patent Document 2]. In addition, an ink jet method has been proposed in which the size of a droplet in flight is imaged offline and measured by a camera, and the ink ejection amount is corrected so that the droplet size is the same.

JP 2002-361852 A JP 2003-172814 A

However, a relative positional shift occurs due to a positional error at the time of BM formation, a deformation of the substrate, a straightness of a stage used for transporting the substrate, and the like. In recent years, the resolution of the display device has been increased and allowed for miniaturization. There is a problem that it is difficult to maintain the coating accuracy because the error is small. Also, the detection of coating defects such as white defects, black defects, and protrusions is performed by an off-line inspection machine, but from coating to inspection. Since there is a time lag, there is a problem that a material loss occurs such that a plurality of defective products are manufactured or even if a defect occurs immediately after the start of application, the entire surface is applied.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a pattern forming apparatus and the like that can perform pattern formation with high accuracy and stability and improve yield.

  In order to achieve the above-described object, the first invention comprises at least one head for performing processing on a substrate, a head side stage for moving the head, or a substrate side stage for moving the substrate. A pattern forming apparatus for forming a pattern thereon, a holding unit for holding standard data for predetermining a processing step, and a pre-process for measuring the position of a pre-process pattern on the substrate and holding it as pre-process pattern position data Based on the pattern position measuring means, the stage position measuring means for measuring the position of the stage and holding it as stage position data, and the correction data from the standard data based on the previous process pattern position data and the stage position data. Based on the correction data creating means and the correction data, the stage is moved, and the head is moved. A position correcting means for correcting the relative position between said substrate and a pattern forming apparatus characterized by comprising.

The processing processing indicates processing on the substrate, and is, for example, pattern formation processing by ink discharge, laser irradiation, or the like.
The head is a device that processes the substrate, and is, for example, an inkjet head, a laser irradiation device, or the like.
The pre-process pattern is a pattern already formed on the substrate to be processed, and is, for example, a BM or a colored layer.
The standard data is data indicating standard settings that predetermine processing steps. The standard data is used for recipe management and the like, and holds setting data relating to the position of the head side stage, the position of the substrate side stage, the timing of processing, and the like.
The correction data is data obtained by performing correction processing on the standard data.

In addition, the board | substrate used as a process target is not specifically limited, For example, a color filter board | substrate etc. can be made into a process target.
In addition, when the processing is color layer application by an ink jet method, standard application data and correction application data are created based on the standard data and correction data, respectively.

  The pattern forming apparatus according to the first aspect of the present invention holds standard data for predetermining processing steps, measures the position of the previous process pattern on the substrate and holds it as the previous process pattern position data, and stores the head side stage and the substrate side stage. The position is measured and held as stage position data, correction data is created from standard data based on the previous process pattern position data and stage position data, and the head side stage and the substrate side stage are moved based on the correction data. And correct the relative position between the head and the substrate.

Further, it is desirable that the pattern forming apparatus corrects the start time and end time of the processing based on the correction data.
In addition, it is desirable to maintain a history of correction data and update standard data based on the history.

In the first invention, the pattern forming apparatus measures the positions of the pre-process pattern (BM, etc.), the substrate side stage, and the head side stage in real time and feeds back while detecting immediately after coating on the same machine. Since the correction is made, the quality can be improved.
In addition, the pattern forming apparatus can create correction data in real time and perform processing immediately after the correction data, thereby reducing the number of defective products and materials.

  According to a second aspect of the present invention, there is provided a pattern formation for forming a pattern on the substrate, comprising at least one head for performing processing on the substrate and a head side stage for moving the head or a substrate side stage for moving the substrate. An apparatus for holding standard data for predetermining processing steps; color density distribution measuring means for measuring a color density distribution of a processed pattern on the substrate and holding it as color density distribution data; A stage position measuring means for measuring a position and holding it as stage position data; an additional data creating means for creating additional data from the standard data based on the color density distribution data and the stage position data; And an additional processing means for moving the stage and adding the processing process on the basis thereof. A pattern forming apparatus characterized.

  The pattern forming apparatus of the second invention holds standard data for predetermining the processing steps, measures the color density distribution of the processed pattern on the substrate, holds it as color density distribution data, and sets the head side stage and the substrate side stage. The position is measured and held as stage position data. Additional data is created from the standard data based on the color density distribution data and stage position data, and the head side stage and substrate side stage are moved based on the additional data. Add the processing.

In addition, the pattern forming apparatus may include a plurality of heads and perform processing by adding a processing head using a head different from the previous processing processing.
Further, it is desirable that the pattern forming apparatus retains a history of additional data and updates standard data based on the history.
In addition, when the processing is color layer application by an ink jet method, additional application data is created based on the additional data.

In the second invention, the pattern forming apparatus detects the presence and position of defects such as white defects, black defects, and protrusions by measuring the color density distribution and the stage position data, and adds and processes the defects. As a result, quality can be improved.
In addition, the pattern forming apparatus can create additional data in real time, and can perform additional processing immediately thereafter, so that the number of defective products and materials can be reduced.

  A third aspect of the invention is a pattern forming apparatus that includes a head that performs processing on a substrate and forms a pattern on the substrate, the holding unit that holds standard data that predetermines processing steps, and the processing After the processing, based on the difference between the measured processing position data and the standard processing data, the processing position data measuring means for measuring the processing position and holding it as processing position data A pattern forming apparatus comprising: a processing position correcting unit that corrects the position of the processing process.

The pattern forming apparatus according to the third aspect of the invention holds standard data for predetermining the processing steps, measures the position of the processing after the processing, stores the data as processing processing position data, and measures the measured processing position data. And the processing position of the standard data are corrected based on the difference between the processing position data of the standard data.
The processing position indicates, for example, a landing position after inkjet application.
In the third aspect of the invention, the pattern forming apparatus measures the landing position after inkjet application on the same machine and corrects the position, so that the head error is corrected, and the ink is ejected obliquely from the head. Even if the position is shifted as a whole, the application position accuracy can be improved by correcting the appearance after application.

  A fourth aspect of the invention is a pattern forming apparatus that includes a head that performs processing on a substrate and forms a pattern on the substrate, the holding unit that holds standard data that predetermines processing steps, and the processing After the processing, the processing size data measuring means for measuring the size of the processed portion and holding it as processing size data, the measured processing size data and the processing size data of the standard data A pattern forming apparatus comprising: a first processing amount correction unit that corrects the amount of processing based on a difference.

The pattern forming apparatus according to the fourth aspect of the invention holds standard data for predetermining the processing steps, measures the size of the processed part after processing, stores it as processing size data, and measures it. The amount of processing is corrected based on the difference between the processing size data and the processing size data of the standard data.
The size of the processed portion indicates, for example, the landing diameter of the ink discharged from the inkjet head.
The amount of processing is, for example, the amount of ink discharged from the inkjet head.

  In the fourth aspect of the invention, the pattern forming apparatus measures the landing diameter of the droplet after inkjet application and corrects it in real time, and controls the ejection amount for each hole of the inkjet head to be constant. It is possible to improve the quality by suppressing the generation of products.

  A fifth aspect of the present invention is a pattern forming apparatus that includes a head that performs processing on a substrate and forms a pattern on the substrate, the holding unit that holds standard data that defines processing steps in advance, and the head A discharge size measuring means for imaging the flying state of the discharge from the image, performing image processing, measuring the size of the discharge and holding the discharge as size data, the measured discharge size data and the standard data A pattern forming apparatus comprising: a second processing amount correction unit that corrects the amount of processing based on a difference from the discharged material size data.

The pattern forming apparatus according to the fifth aspect of the invention holds standard data for predetermining the processing steps, images the flying state of the discharge from the head, performs image processing, measures the size of the discharge, and sets the discharge size The amount of processing is corrected based on the difference between the measured discharge size data and the standard discharge data.
The ejected material from the head is, for example, ink ejected from an inkjet head.
The size of the ejected material is, for example, the size of ink droplets ejected from an inkjet head.

  In the fifth invention, the pattern forming apparatus captures the flying state of the ink or the like ejected from the inkjet head, measures the size of the droplet by image processing, and the ejection amount for each hole of the inkjet head is constant. Therefore, it is possible to prevent the generation of defective products and improve the quality.

According to a sixth aspect of the present invention, there is provided a pattern formation for forming a pattern on the substrate, comprising at least one head for processing the substrate and a head side stage for moving the head or a substrate side stage for moving the substrate A pattern forming method in the apparatus, which holds a standard data for predetermining a processing step, and a pre-process pattern position measurement step that measures the position of the pre-process pattern on the substrate and holds it as pre-process pattern position data And a stage position measuring step for measuring the position of the stage and holding it as stage position data, and a correction data creating step for creating correction data from the standard data based on the previous process pattern position data and the stage position data And moving the stage based on the correction data, A position correcting step of correcting the relative position between the serial board,
A pattern forming method comprising:

  The sixth invention relates to a pattern forming method in the pattern forming apparatus of the first invention.

  According to a seventh aspect of the present invention, there is provided a pattern formation for forming a pattern on the substrate, comprising at least one head for processing the substrate and a head side stage for moving the head or a substrate side stage for moving the substrate A pattern forming method in the apparatus, the holding step for holding standard data for predetermining processing steps, and the color density distribution measuring step for measuring the color density distribution of the processed pattern on the substrate and holding it as color density distribution data A stage position measuring step for measuring the position of the stage and holding it as stage position data; an additional data creating step for creating additional data from the standard data based on the color density distribution data and the stage position data; Based on the additional data, the stage is moved, and additional processing is performed by adding the processing. A pattern forming method characterized by comprising the steps, a.

  7th invention is the invention regarding the pattern formation method in the pattern formation apparatus of 2nd invention.

  An eighth invention is a pattern forming method in a pattern forming apparatus that includes a head for performing processing on a substrate and forms a pattern on the substrate, the holding step holding standard data that predetermines processing steps And a processing position data measurement step of measuring the processing position after the processing and holding the position as processing position data, and the processing position data of the measured processing position data and the standard data. And a processing position correction step of correcting the position of the processing based on the difference.

  The eighth invention relates to a pattern forming method in the pattern forming apparatus of the third invention.

  A ninth invention is a pattern forming method in a pattern forming apparatus which includes a head for processing a substrate and forms a pattern on the substrate, and holds a standard data which predetermines a processing step And a processing size data measuring step for measuring the size of the processed portion after the processing and holding it as processing size data, and processing the measured processing size data and the standard data. A pattern forming method comprising: a first processing amount correction step of correcting the amount of processing based on a difference from size data.

  The ninth invention relates to a pattern forming method in the pattern forming apparatus of the fourth invention.

  A tenth aspect of the invention is a pattern forming method in a pattern forming apparatus that includes a head that performs processing on a substrate and forms a pattern on the substrate, and holds a standard data that predetermines a processing step And a discharge size measurement step of imaging the flying state of the discharge from the head, performing image processing, measuring the size of the discharge and holding it as discharge size data, and the measured discharge size data And a second processing amount correction step for correcting the processing amount based on a difference between the standard data and the discharge size data of the standard data.

  A tenth invention is an invention relating to a pattern forming method in the pattern forming apparatus of the fifth invention.

  ADVANTAGE OF THE INVENTION According to this invention, the pattern formation apparatus etc. which perform pattern formation with high precision and stability, and can improve a yield can be provided.

  DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of a pattern forming apparatus and the like according to the present invention will be described in detail with reference to the accompanying drawings. In the following description and the accompanying drawings, the same reference numerals are given to components having substantially the same functional configuration, and redundant description will be omitted.

First, the configuration of the pattern forming apparatus 1 according to the first embodiment of the present invention will be described with reference to FIG.
FIG. 1 is a schematic configuration diagram of a pattern forming apparatus 1.
The θ axis indicates the vertical rotation axis, and the θ direction indicates the rotation direction. The Z axis indicates the vertical direction, the Y axis indicates the coating width direction, the X axis indicates the coating direction, and the Zθ axis, the Y axis, and the X axis are perpendicular to each other.

  1 includes a substrate side stage (X axis) 3-1, a substrate side stage (Y axis) 3-2, a substrate side stage (θ axis) 3-3, a head side stage 5, and a suction table. 6, a sensor 7, a head 13, an alignment camera 15, and the like.

  The pattern forming apparatus 1 is an apparatus that manufactures color filters and the like by an ink jet method. The pattern forming apparatus 1 discharges ink containing three color pigments of R (red), G (green), and B (blue) onto a light-transmitting substrate by an ink jet method, and dries and colors each ink. A pixel portion is formed and a pattern is formed on the substrate.

  The substrate stage (X axis) 3-1 is a linear movement stage, and is supported so as to be movable in a predetermined axial direction by a controllable motor such as a step motor or a servo motor. The substrate side stage (X axis) 3-1 moves the substrate side stage (Y axis) 3-2 in the X axis direction based on a control amount output by an alignment control unit (not shown).

  The substrate side stage (Y axis) 3-2 is a linear movement stage, and is supported so as to be movable in a predetermined axial direction by a controllable motor such as a step motor or a servo motor. The substrate side stage (Y axis) 3-2 moves the substrate side stage (θ axis) 3-3 in the Y axis direction based on a control amount output by an alignment control unit (not shown).

  The substrate side stage (θ-axis) 3-3 is a rotary stage and is rotatably supported on a predetermined rotary shaft by a controllable motor such as a step motor or a servo motor. The substrate side stage (θ-axis) 3-3 rotates the suction table 6 based on a control amount output from an alignment control unit (not shown).

  The sensor 7 is a device that detects the position of the substrate 11, the position of the pattern formed on the substrate 11, the color density of the colored layer formed on the substrate 11, white defects, black defects, defects such as protrusions, and the like. For example, an image processing camera, a laser displacement meter, a reflective sensor, a laser interferometer, or the like.

The head 13 is a device that forms a pattern by ejecting ink onto the substrate 11. The head 13 is positioned in the YZθ axis direction by the head side stage 5. A plurality of heads 13 can be provided. Further, the head needs at least a Zθ stage (may be manually operated) in order to determine the relative position. In addition, when there are a plurality of heads, it is necessary to adjust the relative position between the heads as necessary, so a Y stage is required for each head. However, a stage may be unnecessary when the unit is previously positioned and fixed and mechanically positioned by the coating apparatus.
The suction table 6 is a table that sucks and fixes the substrate 11 (glass substrate, film substrate, etc.).

The alignment camera 15-1 detects a θ-direction angle and XY coordinates of the substrate 11 that is sucked and fixed to the suction table 6, and a predetermined portion of the substrate 11 (an alignment mark (not shown) or the like formed on the substrate). It is a camera which images.
The alignment camera 15-2 is a camera that detects the θ-direction angle and XY coordinates of the head 13.
A plurality of alignment cameras 15 can be provided and fixedly supported by a frame (not shown) of the pattern forming apparatus 1.

An alignment control unit (not shown) performs a process of extracting the θ direction angle and XY coordinates of the substrate 11 based on the captured image. An alignment control unit (not shown) compares the extracted data with predetermined data to calculate their deviation, and calculates a control amount so as to reduce the deviation.
The alignment control unit (not shown) outputs control amounts to the substrate side stage (X axis) 3-1, the substrate side stage (Y axis) 3-2, and the substrate side stage (θ axis) 3-3. Then, the position of each stage is controlled. As described above, the alignment control unit (not shown) controls the substrate 11 to have a predetermined XY coordinate and a predetermined θ direction angle based on the captured image of the alignment camera 15.

FIG. 2 is a diagram illustrating a hardware configuration of the pattern forming apparatus 1.
As illustrated in FIG. 2, the pattern forming apparatus 1 includes a control unit 21, a control unit 27, a control unit 33, and an electronic computer 9. The control unit 21, the control unit 27, the control unit 33, and the electronic computer 9 are connected to each other and can send and receive signals, data, programs, and the like.

The control unit 21, the control unit 27, and the control unit 33 perform operation control of the substrate side stage 3, the head side stage 5, and the sensor 7, respectively.
The control unit 21, the control unit 27, and the control unit 33 each include a CPU, a memory, and the like. The CPU is a processor that performs arithmetic processing, operation control, and the like. The memory is a ROM, a RAM, or the like, and retains programs and data related to arithmetic processing, operation control, etc. permanently or temporarily.

The control unit 21 controls the operation of the substrate side stage 3 that transports the substrate 11 via the drive unit 23 and the measurement unit 25.
The drive unit 23 is a device that drives the substrate side stage 3, and is, for example, a linear motor, a servo motor, a ball screw, or the like.
The measuring unit 25 is a device that measures the amount of driving by the driving unit 23, and is, for example, a laser interferometer, a scale, an encoder, or the like.

The control unit 27 controls the operation of the head-side stage 5 that moves the head 13 via the drive unit 29 and the measurement unit 30, and controls the operation of the nozzles 14 provided in the head 13 via the nozzle drive unit 31.
The drive unit 29 is a device that drives the head-side stage 5 and is, for example, a linear motor, a servo motor, a ball screw, or the like.
The measurement unit 30 is a device that measures the amount of drive by the drive unit 29, and is, for example, a scale, an encoder, or the like.
The nozzle drive unit 31 is a device that drives the nozzle 14 provided in the head 13, and is, for example, a piezoelectric element (piezo element), an instantaneous heating device, or the like.

The electronic computer 9 is a device that controls operations of various devices constituting the pattern forming apparatus 1 and performs arithmetic processing, for example, a computer.
The electronic computer 9 includes a management unit 35, a storage unit 37, and the like.

The management unit 35 includes a CPU, a memory, and the like. The CPU is a processor that performs arithmetic processing, operation control, and the like. The memory is a ROM, a RAM, or the like, and retains programs and data related to arithmetic processing, operation control, etc. permanently or temporarily. The CPU calls a program stored in a storage unit, a ROM, or the like to the memory and executes it, and performs arithmetic processing, operation control, and the like.
The storage unit 39 is a storage device such as a hard disk, and holds standard data 37, an execution program, an OS, and the like. The standard data 37 is data indicating standard settings regarding the operation, positioning, processing timing, and the like of the pattern forming apparatus 1.

Next, the operation of the pattern forming apparatus 1 will be described with reference to FIG.
The pattern forming apparatus 1 controls each device under the control of the control unit 21, the control unit 27, the control unit 33, and the management unit 35, and executes the following steps.

FIG. 3 is a flowchart showing the operation of the pattern forming apparatus 1.
The pattern forming apparatus 1 measures the position of the BM on the substrate 11, the position of the substrate side stage 3, and the position of the head side stage 5 by the sensor 7, and communicates the detected position pulse, scale signal, address, etc. to each device. Alternatively, it is held as position data (step 301 to step 303).

The pattern forming apparatus 1 refers to the standard data 37 in the storage unit 39 and creates the standard application data 41 based on the standard setting indicated by the standard data 37 (step 304).
The pattern forming apparatus 1 performs the correction process on the standard application data 41 based on the position data of the substrate side stage 3, the position data of the head side stage 5, and the position data of the BM, and generates corrected application data 43 (step 305). ).

The pattern forming apparatus 1 controls ink discharge timing (discharge start, discharge end) based on the correction application data 43 (step 306).
The control unit 27 controls the ink ejection timing by causing the nozzle drive unit 31 to output a control signal (voltage, pulse, etc.) to the nozzle 14 based on the correction application data 43.

The pattern forming apparatus 1 controls the relative position between the substrate side stage 3 and the head side stage 5 based on the correction application data 43 (step 307).
The control unit 21 and the control unit 27 output control signals (voltage, pulse, etc.) from the driving unit 23 and the driving unit 29 to the substrate side stage 3 and the head side stage 5 based on the correction application data 43, and the substrate. The relative position between the side stage 3 and the head side stage 5 is controlled. Further, feedback control is performed according to the measurement values obtained by the measurement unit 25 and the measurement unit 30.

The pattern forming apparatus 1 updates the standard setting of the standard data 37 based on the history of the correction application data 43 (step 308).
When the application is continued (No in Step 309), the pattern forming apparatus 1 repeats the processing from Step 301.

  Through the above process, the pattern forming apparatus 1 measures the positions of the BM, the substrate side stage, and the head side stage, and performs correction processing on the standard application data based on the measured position data to create corrected application data. Based on the corrected application data, the ink ejection timing (ejection start, ejection end) is controlled, and the relative position between the substrate side stage and the head side stage is controlled.

As described above, in the first embodiment, the pattern forming apparatus measures the positions of the previous process pattern (BM, etc.), the substrate side stage, and the head side stage in real time, and detects them immediately after coating on the same machine. However, since the correction is performed by feedback, the quality can be improved.
Further, since the pattern forming apparatus can correct the application data in real time and perform application immediately after that, the number of defective products and materials can be reduced.
Further, since the standard data is updated based on the history of the correction application data, it is not necessary to repeat the same correction process, and the processing load on the pattern forming apparatus can be reduced.

Next, a pattern forming apparatus 1 according to a second embodiment will be described.
The operation of the pattern forming apparatus 1 in the additional coating process will be described with reference to FIG.
The pattern forming apparatus 1 controls each device under the control of the control unit 21, the control unit 27, the control unit 33, and the management unit 35, and executes the following steps.

FIG. 4 is a flowchart showing the operation of the pattern forming apparatus 1 in the additional coating process.
The pattern forming apparatus 1 can perform an additional coating process or the like on defects such as white defects, black defects, and protrusions in addition to or independently of the process shown in FIG.

The pattern forming apparatus 1 measures the position of the white spot on the substrate 11 by the sensor 7, and communicates the detected position pulse, scale signal, address, etc. to each apparatus or holds it as position data (step 401).
The white spot position can be detected by measuring the color density distribution on the substrate 11 with the sensor 7. Also, other defects can be detected in the same manner.
The pattern forming apparatus 1 refers to the standard application data 41 or the corrected application data 43, and creates additional application data 45 based on the white spot position data (step 402).
Based on the additional application data 45, the pattern forming apparatus 1 performs additional application on white spots on the substrate 11 (step 403).

FIG. 5 is a diagram showing an additional application process by one head 13.
FIG. 6 is a diagram showing an additional coating process using a plurality of heads 13-1, 13-2,.
As shown in FIG. 5, after the entire surface coating is once completed, additional coating may be performed with the same head 13 as the head 13 that first applied only the white spots, or the first coating is performed as shown in FIG. 6. The sensor 7 and the coating head 13-2 may be separately provided on the downstream side of the head 13-1, and additional coating may be performed.
In the former case, the timing of white spot detection may be performed substantially simultaneously during application, or only the white spot detection may be performed on the same stage after the application of one surface.

  Through the above process, the pattern forming apparatus 1 detects the presence and position of defects such as white defects, black defects, protrusions, etc. on the substrate, creates additional coating data, and based on the additional coating data, Perform additional application.

As described above, in the second embodiment, the pattern forming apparatus can improve the quality by performing the additional coating on the white spots on the machine. Further, since the additional application can be performed in the WET state, there is an advantage that the processing trace is not conspicuous compared with the case where the correction process is performed after drying.
Further, since the pattern forming apparatus can create additional application data in real time and perform application immediately afterwards, the number and materials of defective products can be reduced.

Next, the pattern formation apparatus 1 which concerns on 3rd Embodiment is demonstrated.
The operation of the pattern forming apparatus 1 according to the third embodiment will be described with reference to FIG.
The pattern forming apparatus 1 controls each device under the control of the control unit 21, the control unit 27, the control unit 33, and the management unit 35, and executes the following steps.

FIG. 7 is a flowchart showing the operation of the pattern forming apparatus 1.
The pattern forming apparatus 1 discharges ink from the head 13 to the substrate 11 (step 701).
The pattern forming apparatus 1 uses the sensor 7 to measure the landing position of the ejected ink (step 702).
The pattern forming apparatus 1 corrects the positions of the substrate 11 and the head 13 based on the difference between the measured landing position and the landing position held by the standard data 37 (step 703).

Through the above process, the pattern forming apparatus 1 measures the landing position of the ink after ink ejection, and performs position correction based on the difference between the measured data and the standard data.
As described above, in the third embodiment, the pattern forming apparatus measures the position of the landing after the inkjet application on the same machine and corrects the position. Therefore, the error of the inkjet head is corrected, and the ink is temporarily discharged from the head. Even if the ink is ejected obliquely or the position is displaced as a whole, the application position accuracy can be improved by correcting the appearance after the application.
The landing position measurement may be performed once when the head is switched, or may be performed when the lot of the substrate is changed, or correction data is created by accumulating data every time and sequentially. It may be changed.

Next, a pattern forming apparatus 1 according to a fourth embodiment will be described.
The operation of the pattern forming apparatus 1 according to the fourth embodiment will be described with reference to FIG.
The pattern forming apparatus 1 controls each device under the control of the control unit 21, the control unit 27, the control unit 33, and the management unit 35, and executes the following steps.

FIG. 8 is a flowchart showing the operation of the pattern forming apparatus 1.
The pattern forming apparatus 1 discharges ink from the head 13 to the substrate 11 (step 801).
The pattern forming apparatus 1 uses the sensor 7 to measure the size (landing diameter, etc.) of the landed portion of the ejected ink (step 802).
The pattern forming apparatus 1 corrects the ejection amount of ink from the head 13 based on the difference between the measured size of the landing portion and the size of the landing portion held in the standard data 37 (step 803).

Through the above process, the pattern forming apparatus 1 measures the size of the landing portion after ink ejection, and corrects the ink ejection amount based on the difference between the measured data and the standard data.
As described above, in the fourth embodiment, the pattern forming apparatus measures the landing diameter of the droplet after ink-jet application and corrects it in real time, and controls the discharge amount for each hole to be constant. Accordingly, it is possible to improve the quality by suppressing the generation of defective products.

Next, a pattern forming apparatus 1 according to a fifth embodiment will be described.
The operation of the pattern forming apparatus 1 according to the ninth embodiment will be described with reference to FIG.
The pattern forming apparatus 1 controls each device under the control of the control unit 21, the control unit 27, the control unit 33, and the management unit 35, and executes the following steps.

FIG. 9 is a flowchart showing the operation of the pattern forming apparatus 1.
The pattern forming apparatus 1 discharges ink from the head 13 to the substrate 11 (step 901).
The pattern forming apparatus 1 captures the flying state of the ejected ink by the sensor 7 such as an image processing camera (step 902).
The pattern forming apparatus 1 performs image processing on the captured image and measures the droplet size of the ejected ink (step 903).
The pattern forming apparatus 1 corrects the ink ejection amount from the head 13 based on the difference between the measured droplet size and the droplet size held in the standard data 37 (step 904).

Through the above process, the pattern forming apparatus 1 images the flying state of the ink, performs image processing, measures the ink droplet size, and discharges ink based on the difference between the measured data and the standard data. Correct the amount.
As described above, in the fifth embodiment, the pattern forming apparatus captures the flying state of the ink ejected from the inkjet head, measures the size of the droplet by image processing, and ejects the amount for each hole. Is controlled to be constant. Therefore, the quality can be improved by preventing the generation of defective products.
The above process may be performed once when the head is switched, or may be performed after the purge process. This is because the discharge amount may change after the purge process performed when the nozzle is clogged.

As described above, according to the embodiment of the present invention, the pattern forming apparatus 1 detects the state of the substrate in real time, controls the ejection timing of the inkjet, and the alignment feedback of the gantry Y axis equipped with the inkjet nozzle. By control, it is corrected to improve accuracy.
Further, the pattern forming apparatus 1 controls the ejection frequency by density detection so that the same density is obtained. In addition, the pattern forming apparatus 1 detects the position of the BM in real time, controls the discharge timing to match the start and end positions of the ink jet, and moves the stage on which the ink jet nozzle or the substrate is mounted to the left and right of the traveling direction. BM and inkjet landing position alignment is performed by controlling in the direction.
In addition, the pattern forming apparatus 1 is equipped with a device for detecting defects such as white defects, black defects, protrusions and the like, and detects immediately after coating and outputs an alarm to prevent a plurality of defective products from being manufactured. Even during the application, the application can be interrupted when a defect occurs.

Therefore, the pattern forming apparatus feeds back and corrects what is applied (droplet landing) during application while detecting immediately after application on the same machine, so that the quality can be improved. That is, the pattern forming apparatus improves the ink landing position accuracy, reduces the density unevenness, improves the quality, and improves the quality when the colored layer (R, G, B) of the color filter is manufactured by the inkjet method. It can also handle high-resolution products that could not be supported.
In addition, since the pattern forming apparatus can perform additional application in a wet state when performing additional application on a white spot or the like on the machine, the trace of processing is less conspicuous than when performing correction processing after drying. There is an advantage.
Further, since the pattern forming apparatus can correct the application data in real time, create additional application data, and perform application immediately afterwards, the number and materials of defective products can be reduced.

Further, since the pattern forming apparatus measures the position of landing after inkjet application on the same machine and corrects the position, it is possible to improve the application position accuracy.
In addition, the pattern forming device measures the droplet landing diameter after inkjet application and corrects it in real time, and controls the discharge amount for each hole to be constant. Can be improved.
The pattern forming apparatus captures the flying state of the ink ejected from the inkjet head, measures the droplet size by image processing, and controls the ejection amount for each hole to be constant. Therefore, the quality can be improved by preventing the generation of defective products.

Note that the arithmetic processing and the like may be performed by any of the control unit 21, the control unit 27, the control unit 33, and the management unit 35, and regarding the holding of various data, not only the storage unit 39 but also the control unit 21, It may be performed by the unit 27, the control unit 33, the management unit 35, or the like. Moreover, you may make it comprise the control part 21, the control part 27, the control part 33, the management part 35, etc. integrally.
Further, a program for performing the processing shown in FIGS. 3 and 4 may be distributed on a recording medium such as a CD-ROM, or the program may be transmitted / received via a communication line.
The substrate to be processed by the pattern forming apparatus 1 is not limited to the color filter substrate, and various thin plates and substrates can be targeted.
Moreover, the head as a processing apparatus of the pattern forming apparatus 1 is not limited to the ink jet head, and various processing apparatuses such as a laser irradiation head can be applied.

  The preferred embodiments of the pattern forming apparatus and the like according to the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to such examples. It will be apparent to those skilled in the art that various changes or modifications can be conceived within the scope of the technical idea disclosed in the present application, and these are naturally within the technical scope of the present invention. Understood.

Schematic perspective view of the pattern forming apparatus 1 The figure which shows the hardware constitutions of the pattern formation apparatus 1 Flow chart showing operation of pattern forming apparatus 1 (first embodiment) A flowchart showing the operation of the pattern forming apparatus 1 in the additional coating process (second embodiment). The figure which shows the additional application processing by one head Diagram showing additional coating process with multiple heads Flowchart showing the operation of the pattern forming apparatus 1 (third embodiment) Flowchart showing the operation of the pattern forming apparatus 1 (fourth embodiment) Flowchart showing operation of pattern forming apparatus 1 (fifth embodiment)

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ......... Pattern forming device 3 ......... Substrate side stage 5 ......... Head side stage 7 ......... Sensor 9 ......... Electronic computer 11 ......... Substrate 13 ......... Head 14 ......... Nozzle 15 ... ... Alignment camera 21, 27, 33 ......... Control part 23, 29 ......... Drive part 25, 30 ......... Measurement part 31 ......... Nozzle drive part 35 ......... Management part 37 ......... Standard data 39 ... …… Storage unit 41 ………… Standard application data 43 ………… Correction application data 45 ……… Addition application data

Claims (14)

A pattern forming apparatus comprising at least one head for processing a substrate and a head side stage for moving the head or a substrate side stage for moving the substrate, and forming a pattern on the substrate,
Holding means for holding standard data to predetermine processing steps;
A pre-process pattern position measuring means for measuring the position of the pre-process pattern on the substrate and holding it as pre-process pattern position data;
Stage position measuring means for measuring the position of the stage and holding it as stage position data;
Correction data creating means for creating correction data from the standard data based on the pre-process pattern position data and the stage position data;
Based on the correction data, a position correction unit that moves the stage and corrects a relative position between the head and the substrate;
A pattern forming apparatus comprising:   The pattern forming apparatus according to claim 1, further comprising a processing time correction unit that corrects a start time and a processing end time of the processing based on the correction data.   The pattern forming apparatus according to claim 1, further comprising a standard data updating unit configured to update the standard data based on a history of the correction data. A pattern forming apparatus comprising at least one head for processing a substrate and a head side stage for moving the head or a substrate side stage for moving the substrate, and forming a pattern on the substrate,
Holding means for holding standard data to predetermine processing steps;
Color density distribution measuring means for measuring the color density distribution of the processed pattern on the substrate and holding it as color density distribution data;
Stage position measuring means for measuring the position of the stage and holding it as stage position data;
Based on the color density distribution data and the stage position data, additional data creating means for creating additional data from the standard data;
Based on the additional data, additional stage means for moving the stage and adding the machining process;
A pattern forming apparatus comprising: A plurality of the heads;
The pattern forming apparatus according to claim 4, wherein the additional processing unit performs the processing by adding the processing using a head different from the previous processing.   The pattern forming apparatus according to claim 4, further comprising a standard data updating unit configured to update the standard data based on the history of the additional data. A pattern forming apparatus comprising a head for processing a substrate and forming a pattern on the substrate,
Holding means for holding standard data to predetermine processing steps;
After the processing, processing position data measuring means for measuring the position of the processing and holding as processing processing position data,
Processing position correction means for correcting the position of the processing based on the difference between the measured processing position data and the processing position data of the standard data;
A pattern forming apparatus comprising: A pattern forming apparatus comprising a head for processing a substrate and forming a pattern on the substrate,
Holding means for holding standard data to predetermine processing steps;
After the processing, processing size data measuring means for measuring the size of the portion that has been processed and holding as processing size data,
A pattern forming apparatus comprising: a first processing processing amount correction unit that corrects the amount of processing processing based on a difference between the measured processing processing size data and the processing processing size data of the standard data. A pattern forming apparatus comprising a head for processing a substrate and forming a pattern on the substrate,
Holding means for holding standard data to predetermine processing steps;
A discharge size measuring unit that captures an image of a flying state of the discharge from the head, performs image processing, measures the size of the discharge, and holds the discharge as size data;
2. A pattern forming apparatus, comprising: a second processing amount correction unit that corrects the amount of the processing based on a difference between the measured discharge size data and the discharge size data of the standard data. A pattern forming method in a pattern forming apparatus that includes at least one head that performs processing on a substrate and a head side stage that moves the head or a substrate side stage that moves the substrate, and forms a pattern on the substrate. There,
A holding step for holding standard data for predetermining the processing steps;
A pre-process pattern position measurement step for measuring the position of the pre-process pattern on the substrate and holding it as pre-process pattern position data;
A stage position measuring step of measuring the position of the stage and holding it as stage position data;
Based on the previous process pattern position data and the stage position data, a correction data creation process for creating correction data from the standard data;
A position correction step for moving the stage based on the correction data and correcting a relative position between the head and the substrate;
The pattern formation method characterized by comprising. A pattern forming method in a pattern forming apparatus that includes at least one head that performs processing on a substrate and a head side stage that moves the head or a substrate side stage that moves the substrate, and forms a pattern on the substrate. There,
A holding step for holding standard data for predetermining the processing steps;
A color density distribution measuring step of measuring the color density distribution of the processed pattern on the substrate and holding it as color density distribution data;
A stage position measuring step of measuring the position of the stage and holding it as stage position data;
Based on the color density distribution data and the stage position data, an additional data creation step of creating additional data from the standard data;
Based on the additional data, the stage is moved and an additional processing step is performed by adding the processing,
The pattern formation method characterized by comprising. A pattern forming method in a pattern forming apparatus comprising a head for processing a substrate and forming a pattern on the substrate,
A holding step for holding standard data for predetermining the processing steps;
After the processing, a processing position data measurement step of measuring the position of the processing and holding as processing position data,
A processing position correcting step for correcting the position of the processing based on the difference between the measured processing position data and the processing position data of the standard data;
The pattern formation method characterized by comprising. A pattern forming method in a pattern forming apparatus comprising a head for processing a substrate and forming a pattern on the substrate,
A holding step for holding standard data for predetermining the processing steps;
After the processing, a processing size data measurement step of measuring the size of the part that has been processed and holding it as processing size data,
A pattern forming method comprising: a first processing amount correction step for correcting the amount of processing based on a difference between the measured processing size data and the processing size data of the standard data. A pattern forming method in a pattern forming apparatus comprising a head for processing a substrate and forming a pattern on the substrate,
A holding step for holding standard data for predetermining the processing steps;
A discharge size measurement step of imaging the flying state of the discharge from the head, performing image processing, measuring the size of the discharge and holding it as discharge size data;
A pattern forming method comprising: a second processing amount correction step of correcting the amount of the processing based on a difference between the measured discharge size data and the discharge size data of the standard data.

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