JP5869927B2 - Coating apparatus and coating method - Google Patents

Description

  The present invention relates to a coating apparatus that applies and applies a coating liquid from a nozzle to a plurality of coating objects formed on a substrate.

  For example, a color filter is used in an image display device such as a liquid crystal television. As a method for manufacturing the color filter, a thin film of ink is applied to a plurality of fine pixel portions formed on glass. In general, a method of manufacturing by using a photolithography technique and leaving a necessary portion is used. On the other hand, as a manufacturing method with further improved productivity, for example, an ink jet method using an ink jet coating apparatus as shown in Patent Document 1 has been proposed.

  The coating apparatus shown in Patent Document 1 is a coating apparatus 90 as shown in FIG. 13, for example, and is provided in each head section 92 while scanning a carriage 91 provided with a plurality of head sections 92 in the direction of the arrow. Ink is ejected from a plurality of ejection nozzles 93 to form droplets 94 in the respective coating objects G provided in a matrix on the substrate. The head unit 92 has a mechanism for tilting, and the tilt angle of the head unit 92 is adjusted so that the interval between the discharge nozzles 93 in the arrangement direction of the coating target G corresponds to the size of the coating target G. By simultaneously discharging ink from a plurality of discharge nozzles 93 while maintaining the above, droplets are simultaneously formed on a plurality of application targets G.

  On the other hand, the image display device has recently been required to be lighter, thinner, and improved in impact resistance. In electronic paper, flexible liquid crystal display, etc., as a material for a substrate for obtaining a color filter, other than glass. There is a background that has been adopted. For example, in electronic paper, there is a substrate made of a resin, and a UV curable resin is provided on the substrate, and a process for forming a concave portion to be applied G is performed on the substrate.

JP 2002-273868 A

  However, in the coating apparatus described in the above-mentioned Patent Document 1, there is a possibility that the coating target G formed on the substrate cannot be normally coated. Specifically, the plurality of application targets G are designed to be arranged at equal intervals in one matrix, but when the substrate is a material that is easily affected by heat or pressure, such as a resin, The substrate may be deformed by heat, pressure or the like when forming the application target G. As a result, the arrangement of the application target G may be distorted, and the arrangement interval may be partially changed. In this case, since a deviation occurs between the actual position of the application target G and the design position, when ink is ejected toward the position of the design application target G, each ink is applied as shown in FIG. It does not land at a predetermined location such as the center of the target G, and may land between adjacent coating targets G and the coating target G to form droplets 94. Color mixing occurred and it was a defective product.

  However, even in the coating apparatus described in Patent Document 1, it is conceivable that a portion where the arrangement of the coating target G is distorted is separately coated to cope with the above problem. However, in this operation method, at locations where the arrangement of the application target G is distorted, the interval between the application targets G and the interval between the discharge nozzles 93 are different, and ink cannot be discharged to all the pixel portions 93 at the same time. It was inefficient. Specifically, the coating operation is first performed in the scanning direction, coating is performed only on the coating target G that can be ejected to the center, and the position of the carriage 91 is shifted in the direction orthogonal to the scanning direction by, for example, several microns. The coating operation is performed again in the scanning direction, and coating is performed only on the pixels that can be ejected to the center by shifting by several microns. By repeating this many times, it becomes possible to apply one row at a time, so that it was inefficient because it was impossible to apply ink continuously.

  The present invention has been made in view of the above-described problems of the prior art, and an object of the present invention is to provide a coating apparatus that can accurately discharge droplets on a substrate whose coating target is distorted. It is said.

  In order to solve the above-mentioned problems, a coating apparatus according to the present invention has discharge nozzles arranged in a straight line, and mounts a coating unit for discharging a coating liquid from the discharge nozzle to a coating target, and a part of the substrate. A plurality of holding units for holding and holding the substrate on the substrate mounting surface, each holding unit holding the substrate by holding the substrate, and the substrate holding unit Is a coating apparatus that performs a scanning operation in which the coating unit coats the coating target on the substrate while relatively moving the coating unit and the substrate holding unit in a specific scanning direction. The substrate holding unit has a plurality of gripping unit moving means for moving a part or all of the gripping units in a direction parallel to the substrate mounting surface, and the gripping unit does not grip the substrate. The substrate is pulled and deformed by moving the substrate to correct the arrangement of the application target on the substrate, and then the scan operation is performed. In the correction of the arrangement of the application target, one application of the scan operation is started. The direction of the line segment connecting the position of the application target applied by the predetermined discharge nozzle at the point and the position of the application target applied by the discharge nozzle at the application end point is parallel to the scanning direction of the application unit. It is characterized by doing so.

  According to the coating apparatus, in the correction of the arrangement of the application target, the position of the application target applied by the predetermined discharge nozzle at the application start point of one scan operation and the application target applied by the discharge nozzle at the application end point By making the direction of the line connecting the positions parallel to the scanning direction of the coating unit, it is possible to apply the coating target array or the coating target direction parallel to the scanning direction. It is possible to apply the coating liquid continuously to a predetermined position of the application target.

  Specifically, in the correction of the arrangement of the application targets, a set of opposite sides of a quadrilateral formed by the four alignment targets arranged on the substrate is in a state parallel to the scanning direction. The direction of a line segment connecting the position of the application target applied by a predetermined discharge nozzle at the application start point of the one-time scanning operation and the position of the application target applied by the discharge nozzle at the application end point is the application. It is preferable to be parallel to the scanning direction of the unit.

  In addition, it is preferable to further include a coating unit rotating unit that has a rotation axis in a direction orthogonal to the substrate placement surface and rotates the coating unit.

  By further including the coating unit rotating means in this way, it is possible to perform coating by aligning the arrangement interval of the discharge nozzles with the arrangement interval of the application target in the direction orthogonal to the scanning direction.

  The plurality of gripping unit moving means is a combination of a plurality of pairs of gripping unit moving means, and the paired gripping unit moving means respectively move the same gripping unit in the same direction. It is good to do so.

  By doing so, the substrate can be deformed in various directions with a small number of gripping unit moving means. That is, by making a difference in the distance of movement of the gripping unit by the pair of gripping unit moving means, the gripping unit can move in the rotational direction, and the substrate can be deformed not only in the linear direction but also in the rotational direction. Is possible. Further, as the installation interval of the gripping unit moving means to be paired is increased, the resolution of rotation of the gripping unit can be made finer and a precise rotation operation can be performed.

  In order to solve the above problems, the coating method of the present invention has a discharge nozzle arranged in a straight line, and has a coating unit for discharging a coating liquid from the discharge nozzle to a coating target, and a plurality of gripping units. Then, each of the gripping units grips a part of the substrate to relatively move the substrate holding unit that holds the substrate, the coating unit, and the substrate holding unit in a scanning direction that is one horizontal direction. A coating method for applying a coating liquid to the coating target on a substrate by a coating device including a driving device, wherein the substrate holding unit corrects the substrate, and the substrate corrected in the correction step On the other hand, the coating unit and the substrate holding unit move relative to each other in the scanning direction, and the coating unit applies a coating liquid to the coating target, and in the correction step The gripping unit pulls and deforms the substrate while gripping the substrate, thereby correcting a pair of opposite sides of a quadrilateral formed by four alignment objects arranged on the substrate to be parallel to the scanning direction. It is characterized by that.

  According to the coating method, in the correction step, a pair of opposite sides of the quadrilateral formed by the four alignment objects arranged on the substrate is scanned by the holding unit holding the substrate while pulling and deforming the substrate. By correcting to a state parallel to the direction, it is possible to apply the application object in parallel with the scanning direction in the same manner as described above. Therefore, the application liquid is continuously applied to a predetermined position of the application object aligned in the scanning direction. It is possible to apply.

  According to the coating apparatus and the coating method of the present invention, it is possible to accurately eject droplets even on a substrate in which the arrangement of coating objects is distorted.

It is the schematic of the coating device in one Embodiment of this invention. It is the schematic of the coating unit in this embodiment. It is the schematic of the board | substrate holding part in this embodiment. It is the schematic showing the arrangement | sequence of the coating object on a board | substrate. It is the schematic showing a part of correction process of the arrangement | sequence of an application target. It is the schematic showing a part of correction process of the arrangement | sequence of an application target. It is the schematic showing a part of correction process of the arrangement | sequence of an application target. It is the schematic showing the arrangement | sequence of the application | coating target after correcting. It is the schematic of the board | substrate holding part in other embodiment. It is a flowchart explaining the application | coating method. It is the schematic showing the arrangement | sequence of the application target in other embodiment. It is the schematic of the coating unit in other embodiment. It is the schematic which shows the conventional coating device. It is the schematic which shows the application | coating operation | movement by the conventional coating device.

  Embodiments according to the present invention will be described with reference to the drawings.

  A coating apparatus according to an embodiment of the present invention is shown in FIG. FIG. 1A is a top view of the coating apparatus 1, and FIG. 1B is a front view of the coating apparatus 1.

  The coating device 1 includes a feeding device 2, a winding device 3, a recognition unit 4, a coating unit 5, a substrate holding unit 6, and a substrate holding unit 7, and is fed from the feeding device 2 and wound by the winding device 3. With respect to the strip-shaped substrate W to be taken, the coating unit 21 having the coating unit 5 scans linearly on the substrate W fixed in the substrate holding unit 7 to discharge the coating liquid, thereby forming the substrate W on the substrate W. The coating liquid is applied to a plurality of coating objects G. Further, the arrangement of the application target G including distortion is recognized by the recognition unit 4 before application by the application unit 5, and the substrate holding unit 6 deforms the substrate W based on the result to correct the arrangement of the application target G. Then, application by the application unit 5 is performed in a state where the substrate holding unit 7 performs correction similar to this correction.

  In addition, the coating apparatus 1 includes a control unit 8 that includes a computer having a storage device that stores a computer program. The control unit 8 controls various calculations and operations of the drive mechanism of the coating apparatus 1. .

  In the following description, the direction in which the coating unit 21 scans during coating is the X-axis direction. A direction orthogonal to the X-axis direction on the horizontal plane is defined as a Y-axis direction, and a direction orthogonal to the X-axis direction and the Y-axis direction is defined as a Z-axis direction.

  On the substrate W, a plurality of coating objects G are formed side by side in each of the X-axis direction and the Y-axis direction, and each quadrangular coating region S is formed. In FIG. 1, the application target G is shown enlarged for easy explanation.

  The application target G consists of a recess, and the coating liquid is applied to the recess. In the present embodiment, the substrate W is made of resin, and the application target G is formed by an imprint method or the like. Moreover, this strip | belt-shaped board | substrate W is cut | judged for every application | coating area | region S in the process after the application | coating process by the coating device 1, and becomes a color filter, for example.

  The delivery device 2 has a mechanism that allows the cylindrical body around which the belt-like substrate W is wound to be removable, and the winding device 3 has a mechanism that allows the cylindrical body that winds up the substrate W to be removed. . By rotating these cylindrical bodies by a driving mechanism (not shown), the substrate W is sent out from the feeding device 2 to the winding device 3. In the meantime, the application liquid is applied to the substrate W by the application unit 5, and the substrate W on which the application processing of the application liquid has been completed is taken up by the winding device 3.

  The recognition unit 4 includes a camera 11 mounted on the camera gantry 12 and a driving device 13 that moves the camera 11 in the X-axis direction and the Y-axis direction.

  The camera 11 is a CCD camera, for example, and images the application target G of the substrate W and the alignment marks AM1 to AM4. The drive device 13 has a function of moving the camera gantry 12 in the X-axis direction and a function of moving the camera 11 along the camera gantry 12 in the Y-axis direction, and is configured by, for example, a linear guide and a motor. A substrate holding unit 6 described later is provided below the recognition unit 4, and in the state where the substrate holding unit 6 holds the substrate W, imaging of the coating target G and the alignment marks AM <b> 1 to AM <b> 4 is performed. Done.

  In addition, the recognition unit 4 includes a coordinate acquisition unit (not shown) that functions in association with the drive device 13 and the camera 11, and the coordinate acquisition unit has a function of processing an image captured by the camera 11, as well as driving. The position (coordinates) of the camera 11 moved by the device 13 in the X-axis direction and the Y-axis direction is controlled (managed). For this reason, based on the image acquired by the camera 11, the coordinate acquisition unit can acquire the coordinates of the coating target G and the alignment marks AM1 to AM4, and the substrate as described later based on the coordinate values. The arrangement of the application target G can be corrected by the holding unit 6. The function of the coordinate acquisition unit is exhibited when the computer program of the control unit 8 is executed.

  The coating unit 5 includes a coating unit 21, a coating gantry 23, and a coating driving device 24 that moves the coating unit 21 in the X-axis direction and the Y-axis direction. A rotation means 25 having a rotation axis is attached to the coating gantry 23 in a direction (Z-axis direction) orthogonal to a substrate mounting surface of a coating unit described later. The application unit 21 is attached to the rotation axis of the rotation means 25. Thus, the coating unit 21 can be rotated around the rotation axis.

  The application unit 21 is provided with a plurality of discharge nozzles 22 that discharge the application liquid to the application target G in a single direction at equal intervals. The arrangement direction of the nozzles 22 can be changed.

  By changing the arrangement direction of the discharge nozzles 22 in this way, the interval in the Y-axis direction of the discharge nozzles 22 and the interval in the Y-axis direction of the application target G can be made equal as shown in FIG. It is possible to pass each discharge nozzle 22 above a predetermined position such as the center of each application target G.

  And, during the application operation, when the application unit 21 scans in the X-axis direction, by discharging the application liquid when the respective discharge nozzles 22 approach the predetermined position of the application target G to be discharged, It is possible to form the droplet 26 at a predetermined position of each application target G. Note that the timing at which the discharge nozzle 22 approaches the predetermined position of each application target G is controlled by the control unit 8 managing the coordinates of each application target G and the position of each discharge nozzle 22. Can be calculated.

  1 has a function of moving the coating gantry 23 in the X-axis direction and a function of moving the coating unit 21 and the rotating means 25 in the Y-axis direction. For example, a linear guide and a motor are used. Composed. Thereby, during the coating operation, the coating unit 21 can be moved in the X-axis direction with respect to the substrate W, and the coating unit 21 is moved in the Y-axis direction in order to align the positions of the coating nozzle 22 and the coating target G. Can be moved.

  In addition, a substrate holding unit 7 described later is provided below the coating unit 5, and the coating liquid is applied from the coating unit 21 to the coating target G in a state where the substrate holding unit 7 holds the substrate W. Done.

  In the application unit 5, as with the recognition unit 4, a camera may be installed in the application gantry 23, and in this case, the camera is used for the substrate W held in the substrate holding unit 7. Thus, the application target G and the alignment marks AM1 to AM4 are imaged, and the substrate holding unit 7 corrects the arrangement of the application target G as appropriate according to the result.

  The application unit 5 controls the various operations for applying the application liquid G by discharging the application liquid from the discharge nozzle 22 of the application unit 21 to each application target G of the substrate W held by the substrate holding unit 7. It has. Further, the application operation control unit can control (manage) the positions (coordinates) of each discharge nozzle 22 in the X-axis direction and the Y-axis direction. The function of this application | coating operation control part is exhibited when the computer program of the said control part 8 is performed.

  In the application region S, since a plurality of rows of application objects G arranged in the Y-axis direction are arranged in the X-axis direction, the application operation control unit causes the application unit 21 to be placed on the substrate W by the driving device 24. On the other hand, the application liquid is continuously discharged from the plurality of discharge nozzles 22 while scanning once in the X-axis direction. Hereinafter, the operation of continuously discharging the coating liquid from the discharge nozzle 22 while the coating unit 21 is scanned in the X-axis direction is referred to as “scanning operation”.

  Here, when the number of arrangement of the coating objects G in the Y-axis direction is larger than the number of the discharge nozzles 22 of the coating unit 21, the coating liquid is applied to all the coating objects G in the Y-axis direction in one scanning operation. Can't do it. Therefore, the coating operation control unit performs a shift movement that moves the coating unit 21 in the Y-axis direction with respect to the substrate W every time the scanning operation for performing the coating operation on the coating target G in each column in the X-axis direction is completed. And has a function of executing the next scan operation. With this function, it is possible to apply the coating liquid to all the coating objects G in the coating area S by repeating the scanning operation.

  The substrate holding part 6 has a plurality of gripping units and gripping unit moving means for moving a part or all of these gripping units in a direction parallel to the substrate mounting surface of the gripping unit. The substrate W is held in a state of gripping W, and the gripping unit is moved by the gripping unit moving means, whereby the substrate W is pulled and deformed.

  The substrate holding part 6 in this embodiment is shown in FIG. 3A is a top view of the substrate holding unit 6, FIG. 3B is a front view, and FIG. 3C is a side view.

  In the present embodiment, as a plurality of gripping units, a rectangular flat plate-shaped central gripping unit 31 and a rectangular flat plate-shaped X1 provided in proximity to the central gripping unit 31 in positions facing each other in the X-axis direction. The gripping unit 33 and the X2 gripping unit 35, and the rectangular plate-like Y1 gripping unit 32 and the Y2 gripping unit 34 that are provided close to the center gripping unit 31 at positions facing each other in the Y-axis direction. ing. In the present embodiment, the central gripping unit 31 and the X1 gripping unit 33 are connected.

  The central gripping unit 31 is formed so as to face the substrate W and have an area of the substrate placement surface, which is a surface on which the substrate W is placed, substantially equal to the area of the application region S. Therefore, when the substrate W is placed on the substrate holding unit 6, the application region S is placed on the central gripping unit 31, and the Y1 gripping unit 32, the X1 gripping unit 33, the Y2 gripping unit 34, and the X2 gripping unit 35 are placed. Are placed in the vicinity of each side forming the application region S.

  Further, the central gripping unit 31, the Y1 gripping unit 32, the X1 gripping unit 33, the Y2 gripping unit 34, and the X2 gripping unit 35 are provided with suction portions. That is, a plurality of suction holes (not shown) are provided on the respective substrate mounting surfaces, and these suction holes are connected to a vacuum source (not shown) through a pipe. Therefore, by operating the vacuum source, a suction force is generated on each substrate placement surface, and the substrate W is moved to the central gripping unit 31, the Y1 gripping unit 32, the X1 gripping unit 33, the Y2 gripping unit 34, and the X2 gripping unit 35. It is adsorbed by and gripped. Further, the suction of the central gripping unit 31, the Y1 gripping unit 32, the X1 gripping unit 33, the Y2 gripping unit 34, and the X2 gripping unit 35 can be individually switched on and off by control of a valve (not shown). .

  Further, the upper surfaces of the central gripping unit 31, the Y1 gripping unit 32, the X1 gripping unit 33, the Y2 gripping unit 34, and the X2 gripping unit 35 are flush with each other so that the substrate W can be gripped flatly.

  Here, in the present embodiment, the gripping unit moving means 36 and the gripping unit moving means 37 are provided on the lower surface of the central gripping unit 31 so that the central gripping unit 31 can be moved in the X-axis direction. A gripping unit moving means 38 and a gripping unit moving means 39 are provided on the lower surface of the Y1 gripping unit 32 so that the Y1 gripping unit 32 can be moved in the Y-axis direction.

  The gripping unit moving means 36 and the gripping unit moving means 37 are constituted by, for example, a linear guide and a motor, and control the amount of movement in the X-axis direction of the central gripping unit 31 and the X1 gripping unit 33 connected to the central gripping unit 31, respectively. can do.

  The gripping unit moving means 36 and the gripping unit moving means 37 are provided with a bearing 40 having a rotation axis in the Z-axis direction between the gripping unit moving means 36 and the gripping unit moving means 37. The unit moving means 37 is allowed to rotate around the rotation axis of each bearing 40.

  A slider 41 is provided between the central gripping unit 31 and the gripping unit moving means 37 so that the object can be moved in the Y-axis direction. The central gripping unit 31 is connected to the gripping unit moving means 37. On the other hand, it is allowed to move in the Y-axis direction.

  Here, when the movement amounts by the gripping unit moving means 36 and the gripping unit moving means 37 are equal, the central gripping unit 31 and the X1 gripping unit 33 move only in the X-axis direction, but the gripping unit moving means 36 and the gripping unit moving means When the amount of movement by 37 is different, the central gripping unit 31 and the X1 gripping unit 33 are also accompanied by movement in the rotational direction with the Z axis as the rotation axis based on the difference in the amount of movement.

  Thus, a pair of gripping unit moving means (a gripping unit moving means 36 and a gripping unit moving means 37) for moving the same gripping unit (the central gripping unit 31) in the same direction (X-axis direction) is provided. Thus, the substrate W can be deformed in various directions with a small number of gripping unit moving means. Further, as the distance between the gripping unit moving means 36 and the gripping unit moving means 37 is increased, the resolution of rotation of the central gripping unit 31 and the X1 gripping unit 33 can be made finer, and a precise rotation operation can be performed. It becomes.

  Here, even when the central gripping unit 31 moves in the rotational direction, the bearing 40 is provided as described above, so that the central gripping unit 31, the gripping unit moving means 36, and the gripping unit moving means 37 There is no twisting load between them.

  Further, the line segment connecting the attachment position to the gripping unit moving means 36 and the attachment position to the gripping unit moving means 37 in the central gripping unit 31 is inclined as the central gripping unit 31 moves in the rotation direction. Therefore, while the distance between the gripping unit moving means 36 and the gripping unit moving means 37 is unchanged, the distance in the Y-axis direction between the mounting positions of the central gripping unit 31 is that the central gripping unit 31 moves in the rotational direction. Therefore it changes. On the other hand, as described above, one of the gripping unit moving means (the gripping unit moving means 37 in this embodiment) is provided with the slider 41, and the slider 41 acts as the central gripping unit 31 moves in the rotational direction. The coordinates of the mounting position in the Y-axis direction are allowed to change.

  The gripping unit moving unit 38 and the gripping unit moving unit 39 are configured by, for example, a linear guide and a motor, and can control the amount of movement of the Y1 gripping unit 32 in the Y-axis direction.

  The gripping unit moving means 38 and the gripping unit moving means 39 are provided with a bearing 40 having a rotation axis in the Z-axis direction between the gripping unit moving means 38 and the gripping unit moving means 39. The unit moving means 39 is allowed to rotate around the rotation axis of each bearing 40.

  A slider 41 is provided between the Y1 gripping unit 32 and the gripping unit moving means 39 so that the object can be moved in the X-axis direction. The Y1 gripping unit 32 is connected to the gripping unit moving means 39. On the other hand, it is allowed to move in the X-axis direction.

  Here, when the movement amounts by the gripping unit moving means 38 and the gripping unit moving means 39 are equal, the Y1 gripping unit 32 moves only in the Y-axis direction, but the movement amounts by the gripping unit moving means 38 and the gripping unit moving means 39 are the same. If they are different, the Y1 gripping unit 32 is also accompanied by movement in the rotation direction with the Z axis as the rotation axis based on the difference in the movement amount.

  Here, even when the Y1 gripping unit 32 moves in the rotational direction, the bearing 40 is provided as described above, so that the Y1 gripping unit 32, the gripping unit moving means 38, and the gripping unit moving means 39 There is no twisting load between them.

  In addition, a line segment connecting the attachment position of the Y1 gripping unit 32 to the gripping unit moving means 38 and the attachment position to the gripping unit moving means 39 is inclined as the Y1 gripping unit 32 moves in the rotation direction. Therefore, while the interval between the gripping unit moving means 38 and the gripping unit moving means 39 is unchanged, the distance in the X-axis direction between the mounting positions of the Y1 gripping unit 32 is that the Y1 gripping unit 32 moves in the rotation direction. Therefore it changes. On the other hand, as described above, one of the gripping unit moving means (the gripping unit moving means 39 in this embodiment) is provided with the slider 41, and the slider 41 acts as the Y1 gripping unit 32 moves in the rotational direction. The coordinates of the mounting position in the X-axis direction are allowed to change.

  By deforming the substrate W by such a substrate holding unit 6, it is possible to correct the arrangement of the application regions G on the substrate W. Then, the substrate holding unit 6 deforms the substrate W while confirming the coordinates of the alignment marks AM1 to AM4 by the recognition unit 4, thereby correcting the distortion-inclined coating region G array into an array suitable for coating. Is possible. For example, when the alignment marks AM1 to AM4 are designed by design so that the alignment mark AM1 and the alignment mark AM2 are aligned and the alignment mark AM3 and the alignment mark AM4 are parallel to the alignment of the application target G, as described later. The substrate W is deformed so that the line connecting the alignment mark AM1 and the alignment mark AM2 and the line connecting the alignment mark AM3 and the alignment mark AM4 are parallel to the scanning direction (X-axis direction) of the coating unit 21. Thereby, the arrangement | sequence of the application | coating target G can be made parallel to this scanning direction.

  The substrate holding unit 7 holds and pulls the substrate W to be deformed, and has the same configuration as the substrate holding unit 6. That is, FIG. 3 also shows the configuration of the substrate holding unit 7.

  Here, in the same manner as the substrate holding unit 6 performs the tensile deformation of the substrate W by the movement of the central gripping unit 31, the X1 gripping unit 33, and the Y1 gripping unit 32 while the substrate W is sucked and gripped, the substrate W Also in the holding unit 7, the central holding unit 31, the X1 holding unit 33, and the Y1 holding unit 32 move, so that the substrate W can be deformed similarly to the deformation of the substrate W performed by the substrate holding unit 6. That is, when the application unit 5 performs the application on the correction state of the arrangement of the application target G performed by the substrate holding unit 6 while confirming the coordinates of the alignment marks AM1 to AM4 by the recognition unit 4, the substrate holding unit 7 is used. By deforming the substrate W, the same correction state can be obtained.

  As in this embodiment, the recognition unit 4 and the substrate holding unit 6 are provided on the upstream side of the coating unit 5 and the substrate holding unit 7, so that the coating unit 5 performs a coating operation on the previous coating region S. While performing, the recognition part 4 grasps | ascertains the distortion of the arrangement | sequence of the application | coating target G of the following application | coating area | region S, and the deformation | transformation conditions (namely, the center holding | grip unit 31 and The amount of movement of the X1 gripping unit 33 and the Y1 gripping unit 32) can be confirmed. Therefore, when the application to the next application region S is performed, the arrangement of the application target G can be immediately corrected to an arrangement suitable for application, and only when the substrate holding unit 7 grips the substrate W, the application target G is detected. The tact can be shortened as compared with the case of grasping the distortion of the arrangement.

  Next, the process of correcting the arrangement of the application target G by the substrate holding unit 6 having the above configuration will be described with reference to FIGS.

  FIG. 4 shows the arrangement of the coating objects G on the substrate W. FIG. 4A shows an arrangement of the application target G in design. Here, for easy illustration, the application target G is shown larger than the actual one. The application objects G shown in this description are arranged in the X-axis direction and the Y-axis direction, and the application region S that is a set of these application objects G has two sets as shown by a chain line in FIG. The opposite sides are rectangles facing the X-axis direction and the Y-axis direction, respectively.

  However, the application target G actually provided on the substrate W such as a resin is distorted in arrangement due to the influence of heat, pressure, etc. when forming the application target G, and is partially arranged as shown in FIG. There is a possibility that the interval is changed. In this case, the quadrilateral formed by the application region S is no longer a rectangle.

  As described above, when the arrangement of the application target G is distorted and the position of the application target G in the Y-axis direction is shifted as shown by the distance l in FIG. 4B, the application unit 21 is moved in the X-axis direction in the scanning operation. When the application to the application object G is continuously performed while scanning, the application liquid cannot be discharged to the predetermined positions of all the application objects G. If the deviation is large, the application liquid is discharged at a position deviated from the application object G and may be mixed with the application liquid discharged to the adjacent application object.

  Therefore, in the present invention, the substrate holding unit 6 corrects the arrangement of the application objects G through the following process so that the application liquid can be discharged to predetermined positions of all the application objects G. The correction condition is determined by the coordinates of the alignment target arranged on the substrate W.

  In this embodiment, alignment marks AM1 to AM4 are provided in the vicinity of the four corners of the application region S as alignment targets. As for these alignment marks, the alignment mark AM1 and the alignment mark AM2 are designed and arranged in parallel with the arrangement direction of the application target G, and the alignment mark AM3 and the alignment mark AM4 are arranged in the arrangement of the alignment mark AM1 and the alignment mark AM2. Designed parallel to the direction.

  The alignment of the application target G is corrected by checking the coordinates of the alignment marks AM1 to AM4 from the image captured by the camera 11 of the recognition unit 4.

  Note that the application target G itself may be set as the alignment target, for example, the application target G at the four corners in the application region S is set as the alignment target without providing the alignment mark separately.

  In correcting the arrangement of the application target G, that is, the shape of the application region S, first, the angle between the side L1 that is a line segment connecting the alignment mark AM1 and the alignment mark AM2 shown in FIG.

  Specifically, in a state where the coating region S on the substrate W is located above the substrate holding unit 6, first, the central gripping unit 31, the Y1 gripping unit 32, the X1 gripping unit 33, the Y2 gripping unit 34, and X2 The suction of the gripping unit 35 is turned on, and the substrate W is fixed. Next, the image of alignment mark AM1 and alignment mark AM2 is acquired with the camera 11 of the recognition part 4, and the image acquisition part of the recognition part 4 calculates each coordinate from there.

Here, it is assumed that the coordinates of the alignment mark AM1 are (X1, Y1) and the coordinates of the alignment mark AM2 are (X2, Y2). At this time, the angle θ1 between the line segment connecting the alignment mark AM1 and the alignment mark AM2 and the X axis satisfies the following expression (1).
tan θ1 = (Y1−Y2) / (X1−X2) (1)

  Next, the direction of the side L1 is made parallel to the X-axis direction. Specifically, by driving the gripping unit moving means 36 (hereinafter referred to as the TX1 axis 36) and the gripping unit moving means 37 (hereinafter referred to as the TX2 axis 37), the equation (1) is expressed with respect to the X axis. The side L1 having the street angle θ1 is moved in the rotation direction so as to be parallel to the X-axis direction.

  At this time, the suction of the Y2 gripping unit 34 is turned off, and the fixing of the side L1 is released. In the present embodiment, the suction of gripping units other than the central gripping unit 31 is turned off, and the substrate W is gripped only by the central gripping unit 31. By doing so, the coating region S rotates while maintaining its shape.

  Note that when Y1 and Y2 are equal, the side L1 is already considered to be parallel to the X-axis direction, so this operation is not necessary.

Here, if the distance between the TX1 axis 36 and the TX2 axis 37 is dTX, the difference d1 between the movement amount of the TX1 axis 36 and the movement amount of the TX2 axis 37 necessary for rotating the coating region S by θ1. Is represented by the following equation (2).
d1 = dTX × tan θ1 (2)
By substituting equation (1) into equation (2), d1 can be obtained from the coordinates of alignment mark AM1 and alignment mark AM2 by the following equation (3).
d1 = dTX × {(Y1-Y2) / (X1-X2)} (3)

  FIG. 6 shows a state after the TX1 axis 36 and the TX2 axis 37 are moved with a difference in the amount of movement according to the value of d1 obtained by Expression (3). The Y coordinate of alignment mark AM1 and alignment mark AM2 are equal, and the direction of side L1 is parallel to the X axis. Thereby, the arrangement | sequence of the application | coating target G near edge | side L1 becomes parallel to an X-axis.

  Here, in order to give a difference of d1 to the movement amount between the TX1 axis 36 and the TX2 axis 37, only one TX axis may be moved, or both TX axes may be moved.

  In the above formula (2), when d1 is the same value, the greater the value of dTX, that is, the distance between the TX1 axis 36 and the TX2 axis 37, the smaller the value of the obtained angle θ1. That is, as described above, the resolution of the rotational movement obtained by the difference in the movement amount of the TX1 axis 36 and the TX2 axis 37 becomes fine. Here, for example, when the TX1 axis 36 and the TX2 axis 37 are provided at both ends in the Y-axis direction of the center gripping unit 31, respectively, dTX is large and the resolution of the rotational movement is small, so that precise rotation control is possible. Become. In this case, it may be possible to perform more precise rotation control than a normally used rotary stage.

  Next, an angle between the side L2 that is a line segment connecting the alignment mark AM3 and the alignment mark AM4 and the X axis is obtained.

  Specifically, first, the suction of the central gripping unit 31, the Y1 gripping unit 32, the X1 gripping unit 33, the Y2 gripping unit 34, and the X2 gripping unit 35 is all turned on, and the substrate W is fixed. Next, the image of alignment mark AM3 and alignment mark AM4 is acquired with the camera 11 of the recognition part 4, and the image acquisition part of the recognition part 4 calculates each coordinate from there.

  At this time, by adjusting the coordinates of the alignment mark AM1 and the alignment mark AM2 by the previous correction operation, the positions of the alignment mark AM3 and the alignment mark AM4 are also changed. If the amount of movement is large, the alignment mark AM3 and the alignment mark AM4 may deviate greatly from the position where the alignment mark AM3 and the alignment mark AM4 would exist if the substrate W is not deformed, and each alignment mark may deviate from the field of view of the camera 11.

  Therefore, in this embodiment, when the coordinates of the alignment mark AM1 and the alignment mark AM2 are acquired when the side L1 is corrected, the coordinates of the alignment mark AM3 and the alignment mark AM4 at that time are also acquired in advance. After correcting the side L1, the extent to which the coordinates of the alignment mark AM3 and alignment mark AM4 change due to the deformation of the substrate W based on the above equation (3) is calculated, and the change in the coordinates is taken into account. Then, the camera 11 is moved, and the alignment mark AM3 and alignment mark AM4 are acquired again. At this time, not only the alignment mark AM3 and the alignment mark AM4 but also the coordinates of the alignment mark AM1 and the alignment mark AM2 may be acquired to confirm that the direction of the side L1 is parallel to the X-axis direction. .

It is assumed that the coordinates of the alignment mark AM3 after correction of the side L1 obtained in this way are (X3, Y3) and the coordinates of the alignment mark AM4 are (X4, Y4). At this time, the angle θ2 between the line connecting the alignment mark AM3 and the alignment mark AM4 and the X axis satisfies the following expression (4).
tan θ2 = (Y3−Y4) / (X3−X4) (4)

  Next, the direction of the side L2 is made parallel to the X-axis direction. Specifically, by driving the gripping unit moving means 38 (hereinafter referred to as TY1 axis 38) and the gripping unit moving means 39 (hereinafter referred to as TY2 axis 39), the equation (4) is expressed with respect to the X axis. The side L2 having the street angle θ2 is moved in the rotation direction so as to be parallel to the X-axis direction.

  At this time, the suction of the Y2 gripping unit 34 is kept on and fixed so that the direction of the side L1 does not change. In this embodiment, only the suction of the Y1 gripping unit 32 and the Y2 gripping unit 34 is turned on, and the other suctions are turned off. By doing so, the direction of the side L2 and the shape of the application region S are corrected while the direction of the side L1 is fixed so as not to change.

  If Y3 and Y4 are equal, the side L2 is already considered to be parallel to the X-axis direction, so this operation is not necessary.

Here, assuming that the distance between the TY1 axis 38 and the TY2 axis 39 is dTY, the difference d2 between the movement amount of the TY1 axis 38 and the movement amount of the TY2 axis 39 necessary for rotating the side L2 by θ2 is Is expressed by the following equation (5).
d2 = dTY × tan θ2 (5)
By substituting equation (4) into equation (5), d2 can be obtained from the coordinates of alignment mark AM3 and alignment mark AM4 by the following equation (6).
d2 = dTY × {(Y3-Y4) / (X3-X4)} (6)

  Here, X3 which is the X coordinate of the alignment mark AM3 in FIG. 6 is larger than X4 which is the X coordinate of the alignment mark AM4, and the value of (X3−X4) in the equation (6) is positive. Therefore, if Y3, which is the Y coordinate of alignment mark AM3, is larger than Y4, which is the Y coordinate of alignment mark AM4, the value of d2 is positive. At this time, TY1 axis 38 is only d2 than TY2 axis 39. By moving in many positive directions of the Y axis, the Y coordinates of the alignment mark AM3 and the alignment mark AM4 become equal. Conversely, if Y3 is smaller than Y4, the value of d2 is negative. At this time, the TY2 axis 39 moves more in the positive direction of the Y axis than the TY1 axis 38 by (−d2). The Y coordinates of the alignment mark AM3 and the alignment mark AM4 are equal.

  Here, assuming that only one TY axis is moved in order to give a difference of d2 in the amount of movement between the TY1 axis 38 and the TY2 axis 39, the alignment mark AM3 and the alignment mark AM4 are not moved. Since the axis pivots about the axis of rotation, one alignment mark moves in the negative direction of the Y axis. At this time, the substrate W is bent and cannot be held flat. Therefore, it is necessary to shift and pull the TY1 axis 38 and the TY2 axis 39 in the positive direction of the Y axis so that neither the alignment mark AM3 nor the alignment mark AM4 moves in the negative direction of the Y axis.

  The distance by which the alignment mark moves in the negative direction of the Y axis by the pivot is obtained. Here, the X coordinate of the center of the TY1 axis 38 and the TY2 axis 39 is expressed as Xc, the X coordinate of the TY1 axis 38 is expressed as (Xc−dTY / 2), and the X coordinate of the TY2 axis 39 is expressed as (Xc + dTY / 2).

First, when Y3 <Y4, it pivots about the TY1 axis 38, and the alignment mark AM4 moves in the negative direction of the Y axis. The movement amount d2 ′ of the alignment mark AM4 in the Y-axis direction at this time is expressed by Expression (7) using the angle θ2 of Expression (4).
d2 ′ = {(Xc−dTY / 2) −X4} × tan θ2 (7)
The deflection of the substrate W can be prevented by shifting the TY1 axis 38 and the TY2 axis 39 in the positive direction of the Y axis by the distance d2 ′. Therefore, by moving the movement amount of the TY1 axis 38 in the positive direction of the Y axis as d2 ′ and the movement amount of the TY2 axis 39 as (d2 + d2 ′), the direction of the side L2 is set to the X axis without causing the substrate W to bend. Corrected to be parallel to The amount of movement can be calculated from the coordinates of the alignment mark AM3 and the alignment mark AM4 from the above equations (4) to (7).

Next, when Y3> Y4, it pivots about the TY2 axis 39, and the alignment mark AM3 moves in the negative direction of the Y axis. The amount of movement d2 ″ in the Y-axis direction of the alignment mark AM3 at this time is expressed by Expression (8) using the angle θ2 of Expression (4).
d2 ″ = {X3− (Xc + dTY / 2)} × tan θ2 (8)
The deflection of the substrate W can be prevented by shifting the TY1 axis 38 and the TY2 axis 39 in the positive direction of the Y axis by the distance d2 ″. Therefore, by moving the movement amount of the TY1 axis 38 in the positive direction of the Y axis as (d2 + d2 ″) and the movement amount of the TY2 axis 39 as d2 ″, the direction of the side L2 is changed without causing the substrate W to bend. Corrected to be parallel to the X axis. The amount of movement can be calculated from the coordinates of the alignment mark AM3 and the alignment mark AM4 from the above equations (4), (5), (6), and (8).

  FIG. 7 shows a state after the TY1 axis 38 and the TY2 axis 39 are moved by the above movement amount. As a result of correcting the directions of the side L1 and the side L2, the side L2 is also parallel to the X-axis direction following the side L1, and the shape of the quadrilateral and the application region S formed by connecting the alignment marks AM1 to AM4 is trapezoidal. It becomes a shape. And the arrangement | sequence of the application | coating target G not only near the above-mentioned edge | side L1 but the edge | side L2 becomes parallel to the X-axis. With this state, the correction by the substrate holder 6 is completed.

  FIG. 8 shows the arrangement of the application object G after correcting the shape of the application area S and the quadrilateral formed by the substrate holder 6 connecting the alignment marks AM1 to AM4 through the above process. The position of the application target G to be applied by the predetermined discharge nozzle 22 at the application start point of one scan operation by making the side L1 and the side L2 parallel to each other and the direction parallel to the X-axis direction. And the direction of the line segment connecting the position of the application target G applied by the discharge nozzle 22 at the application end point is parallel to the scanning direction of the application unit 21. That is, the application objects G are arranged in the scanning direction (X-axis direction), and the intervals in the Y-axis direction are also aligned.

  Accordingly, the substrate holding unit 7 also sets the substrate W in the same correction state as this correction state. Further, as shown in FIG. 2, the interval in the Y axis direction of the discharge nozzle 22 is the interval ΔY in the Y axis direction of the application target G. By adjusting the rotation angle of the coating unit 21 so as to be equal to, it becomes possible to discharge the coating liquid to predetermined positions of all the coating objects G in the scanning operation.

  On the other hand, as another method for equalizing the interval in the Y-axis direction of the application target G and the interval in the Y-axis direction of the discharge nozzle 22, the substrate W is further pulled only in the Y-axis direction without rotating the application unit 21. It may be modified so that the interval in the Y-axis direction of the application region G matches the interval in the Y-axis direction of the discharge nozzle 22. Specifically, with only the Y1 gripping unit 32 and the Y2 gripping unit 34 turned on, the TY1 shaft 38 and the TY2 shaft 39 are pulled in the positive direction of the Y axis by the same amount of movement, so that the interval between the application regions G is increased. You may make it expand and match | combine with the space | interval of the Y-axis direction of the discharge nozzle 22. FIG.

  When the substrate W is deformed by the substrate holder 7, it is not always necessary to confirm the coordinates of the alignment marks AM1 to AM4, and the correction conditions performed in the upstream substrate holder 6 are used as they are. W may be deformed. In addition, the substrate W is deformed by the substrate holding unit 7 using the correction conditions performed by the substrate holding unit 6, and the alignment marks AM1 to AM4 are obtained from an image of a camera (not shown) attached to the coating unit 5 in this state. The coordinates may be checked and correction fine adjustment may be performed.

  Here, in the correction according to the present embodiment, correction is performed so that only the directions of the side L1 and the side L2 are adjusted, and the other two sides, the side L3 and the side L4, are not modified. Therefore, as shown by ΔX shown in FIG. 8, the X coordinate between the application targets G remains shifted. However, this can be followed by adjusting the discharge timing of each discharge nozzle 22 and can be applied to a predetermined position of each application target G without slowing the scan operation speed or increasing the number of scan operations. can do. Although it takes time, the side L3 and the side L4 are further corrected, and the quadrilateral formed by connecting the alignment marks AM1 to AM4 and the shape of the application region S are changed to parallelograms or rectangles, and the X-axis direction The intervals between the coating objects G adjacent to each other may be made uniform.

  FIG. 9 shows a substrate holding unit 6 according to another embodiment. FIG. 9A is a top view of the substrate holding unit 6, FIG. 9B is a front view, and FIG. 9C is a side view. It is. In the substrate holding unit 6 shown in FIG. 3, the TX1 axis 36 and the TX2 axis 37 are provided, and the application region S is rotated when a difference is made between the movement amounts. You can replace it with If only the angles of the sides L1 and L2 are corrected and the angles of the sides L3 and L4 are not corrected, the X1 gripping unit 33 and the X2 gripping unit 35 on both sides of the central gripping unit 31 in the X-axis direction. However, it is not necessary to switch the suction on / off independently of the central gripping unit 31, and these may be integrated into the central gripping unit 31 alone.

  Even in the simplified configuration as shown in FIG. 9, the substrate W is rotated by the rotating unit 42 with the suction of the central gripping unit 31 turned on, the side L1 is parallel to the X-axis direction, and the gripping of Y2 is performed. By correcting the angle of the side L2 with the TY1 axis 38 and the TY2 axis 39 in a state where the suction of the unit 34 is turned on and the side L1 is fixed, the angles of the side L1 and the side L2 are set in the X-axis direction as described above. The application targets G can be arranged in the X-axis direction.

  Next, FIG. 10 shows an operation flow when coating is performed in the coating apparatus 1 according to the present invention.

  First, the substrate W is sent out by the delivery device 2 and taken up by the take-up device 3, whereby the coating region S is transferred above the substrate holding part 6 (step S1). Then, the substrate holder 6 grips the substrate W including the application region S (step S2). At this time, the suction of the central gripping unit 31, the Y1 gripping unit 32, the X1 gripping unit 33, the Y2 gripping unit 34, and the X2 gripping unit 35 is all on.

  Next, the coordinates of the alignment marks AM1 to AM4 are acquired (step S3). Specifically, the camera 11 of the recognition unit 4 moves to a position where each alignment mark will be present and takes an image. From the image, the coordinate acquisition unit acquires the coordinates of each alignment mark.

  Next, the angle of the side L1 is corrected based on the coordinates of the alignment mark AM1 and the alignment mark AM2 obtained in step S3 (step S4). At this time, the suction of the Y1 gripping unit 32, the X1 gripping unit 33, the Y2 gripping unit 34, and the X2 gripping unit 35 is turned off, and only the central gripping unit 31 is in a state of gripping and gripping the substrate W. Then, the TX1 axis 36 and the TX2 axis 37 move to rotate the application region S so that the direction of the side L1 is parallel to the X-axis direction (scanning direction).

  Next, the coordinates of the alignment marks AM1 to AM4 are acquired again (step S5). Specifically, the camera 11 of the recognizing unit 4 moves to the position where each alignment mark will be present after correction is performed in step S4, and takes an image. From the image, the coordinate acquisition unit acquires the coordinates of each alignment mark. At this time, the suction of the Y1 gripping unit 32, the X1 gripping unit 33, the Y2 gripping unit 34, and the X2 gripping unit 35 is turned on again, and all the gripping units are gripping and gripping the substrate W.

  Next, the angle of the side L2 is corrected based on the coordinates of the alignment mark AM3 and the alignment mark AM4 obtained in step S5 (step S6). At this time, the suction of the central gripping unit 31, the X1 gripping unit 33, and the X2 gripping unit 35 is turned off. The Y2 gripping unit 34 is in a state of gripping and gripping the substrate W, and the side L1 is fixed. Then, the TY1 axis 38 and the TY2 axis 39 move in a state where the portion of the side L2 is sucked and held by the Y1 holding unit 32, so that the direction of the side L2 becomes parallel to the X-axis direction (scanning direction).

  Through the processes from step S2 to step S6, the directions of the side L1 and the side L2 are parallel to the X-axis direction, and the intervals between the coating objects G in the Y-axis direction are aligned.

  Next, the coordinates of each application target G are confirmed (step S7), and the control unit 8 confirms the timing at which each discharge nozzle 22 of the application unit 21 discharges the application liquid during application. Confirmation of the coordinates of each application target G is performed based on an image captured by the camera 11 by the coordinate acquisition unit, as in the case of acquiring the coordinates of each alignment mark. At this time, all the images of the application target G may be captured and the coordinates may be acquired, respectively, but only the image of the application target G set as a representative, such as the four corners of the application region, is acquired to acquire the coordinates. It is desirable to estimate the coordinates of the application target G from the coordinates of the application target G set as a representative because the load of imaging and calculation can be reduced. At this time, the suction of all the gripping units is on.

  Next, after the suction of all the gripping units is turned off, the substrate W is sent out by the delivery device 2 and taken up by the take-up device 3, thereby transferring the coating region S above the substrate holding unit 7 (step S8). ). Then, all the suctions of the central holding unit 31 to the X2 holding unit 35 of the substrate holding unit 7 are turned on, and the substrate holding unit 7 holds the substrate W including the application region S (step S9).

  Next, in steps S4 and S6, the TX1 axis 36, TX2 of the substrate holder 7 is moved by the same amount of movement as the TX1 axis 36, TX2 axis 37, TY1 axis 38, and TY2 axis 39 of the substrate holder 6 are moved. By the movement of the shaft 37, the TY1 axis 38, and the TY2 axis 39, the same correction as that performed by the substrate holding unit 6 is performed in the substrate holding unit 7 (step S10).

  Next, the angle of the coating unit 21 is adjusted by the rotating means 25 so that the spacing in the Y-axis direction of the coating object G after the alignment correction and the spacing in the Y-axis direction of the discharge nozzle 22 are equal (step S11).

  Next, the coating unit 21 performs a coating operation on each coating target G (step S12). Specifically, the operation of continuously applying the application liquid to the application objects G arranged in the X-axis direction by a scanning operation is performed once or a plurality of times.

  As described above, after the application region is transferred in step S1, the application liquid is applied to the application target G having a distortion in the arrangement through the correction process from step S2 to step S10 and the application process from step S11 to step S12. Complete.

  With the above coating apparatus and coating method, it is possible to accurately eject droplets onto a substrate in which the arrangement of coating objects is distorted.

  In the above description, the application target G is assumed to be a recess, and an application apparatus that manufactures a color filter by applying ink to the recess is assumed. However, the application is not limited to the manufacture of a color filter. The present invention can also be applied to an apparatus for manufacturing a circuit pattern of an organic semiconductor such as a TFT by applying a liquid, or an apparatus for forming a capacitor, a resistor, a wiring, or the like on a substrate.

  Further, in the above description, the roll-shaped substrate W is fed based on the roll-to-roll coating device that feeds the roll-shaped substrate W by the feeding device 2 and winds it by the winding device 3. It is also possible to apply to a coating apparatus that performs coating on the substrate W. In this case, since the recognition unit 4 and the substrate holding unit 6 do not exist, the camera 11 is provided in the coating unit 5, and the alignment marks AM <b> 1 to AM <b> 1 are aligned in a state where the substrate holding unit 7 below the coating unit 5 holds the substrate W. The coordinates of the mark AM4 are acquired. Based on the result, a correction condition for making the side L1 and the side L2 parallel to the scanning direction is obtained, and the substrate holder 7 performs the correction.

  Further, even in a roll-to-roll coating apparatus, the recognition unit 4 and the substrate holding unit 6 may be omitted. However, as described above, by providing the recognition unit 4 and the substrate holding unit 6, the conditions for deformation of the substrate W can be obtained prior to the coating process in the coating unit 5, so that the tact can be shortened.

  In the above description, the application target G is described based on an example in which the application target G is gathered in a quadrilateral shape. However, as shown in FIGS. May not be a quadrilateral. If there is a set of alignment mark AM1 and alignment mark AM2 and a set of alignment mark AM3 and alignment mark AM4 arranged in parallel to the arrangement direction of application target G, as well as a set of application targets G as described above. The line segment connecting the alignment mark AM1 and the alignment mark AM2 and the line segment connecting the alignment mark AM3 and the alignment mark AM4 are corrected so as to be parallel to the X-axis direction. Since G is arranged in the X-axis direction, it is possible to apply by a scanning operation.

  Also, as shown in FIG. 11 (c), a set of alignment marks AM1 and AM2 arranged in parallel with the direction of the coating object G, even when the linear coating objects G are arranged in a line, and If there is a set of alignment mark AM3 and alignment mark AM4, the line segment connecting alignment mark AM1 and alignment mark AM2 and the line segment connecting alignment mark AM3 and alignment mark AM4 are parallel to the X-axis direction. Thus, the direction of the application target G becomes parallel to the X-axis direction (in this case, both ends of one application target G are predetermined discharge nozzles 22 at the application start point of one scanning operation). Corresponds to the application object G to be applied and the application object G to be applied by the discharge nozzle 22 at the application end point. Is parallel to the X-axis direction, so that the application target applied by the discharge nozzle 22 at the position of the application target G applied by the predetermined discharge nozzle 22 at the application start point of one scan operation and the application end point It can be said that the direction of the line connecting the positions of G is parallel to the scanning direction of the coating unit 21). When applying to such a coating target G, it is possible to use not only inkjet coating but also a method such as stripe coating for drawing a linear coating film.

  In the above description, only one row of discharge nozzles 22 is arranged at equal intervals in the application unit 21, but as shown in FIG. 12, the discharge units 22 are arranged linearly at equal intervals. There may be a plurality of columns. Even in this case, it is possible to discharge the coating liquid to predetermined positions of all the coating targets by matching the spacing d between the ejection nozzles 22 adjacent on the linear array with the spacing of the coating targets.

DESCRIPTION OF SYMBOLS 1 Application | coating apparatus 2 Sending-out apparatus 3 Winding apparatus 4 Recognition part 5 Application | coating part 6 Substrate holding part 7 Substrate holding part 8 Control part 11 Camera 12 Camera gantry 13 Drive apparatus 21 Application unit 22 Discharge nozzle 23 Application gantry 24 Drive apparatus 25 Rotating means 26 Droplet 31 Central gripping unit (gripping unit)
32 Y1 gripping unit (gripping unit)
33 X1 gripping unit (gripping unit)
34 Y2 gripping unit (gripping unit)
35 X2 gripping unit (grip unit)
36 Grasping unit moving means (TX1 axis)
37 Grasping unit moving means (TX2 axis)
38 Grasping unit moving means (TY1 axis)
39 Grasping unit moving means (TY2 axis)
40 Bearing 41 Slider 42 Rotating stage 90 Coating device 91 Carriage 92 Head part 93 Nozzle 94 Droplet AM1 to AM4 Alignment mark (alignment target)
G Application target L1 to L4 Side S Application area W Substrate

Claims (5)

An application unit that has discharge nozzles arranged in a straight line, and discharges the application liquid from the discharge nozzles to an application target;
A plurality of gripping units for placing and gripping the substrate on a substrate placement surface on which a part of the substrate is placed, each of the gripping units gripping the substrate, and holding a substrate;
With
In a state where the substrate is held by the substrate holding unit, the coating unit applies a coating operation to the coating target on the substrate while relatively moving the coating unit and the substrate holding unit in a specific scanning direction. A coating device for performing,
The substrate holding unit has a plurality of gripping unit moving means for moving a part or all of the gripping units in a direction parallel to the substrate placement surface,
After performing the correction of the arrangement of the application target on the substrate by pulling and deforming the substrate by moving the gripping unit while gripping the substrate, the scanning operation is performed,
In the correction of the arrangement of the application target, the position of the application target applied by the predetermined discharge nozzle at the application start point of one scan operation and the position of the application target applied by the discharge nozzle at the application end point A coating apparatus characterized in that a direction of a line segment connecting the two is parallel to the scanning direction of the coating unit.   In the correction of the arrangement of the coating objects, one set of opposite sides of the quadrilateral formed by the four alignment objects arranged on the substrate is in a state parallel to the scanning direction. The direction of a line segment connecting the position of the application target applied by the predetermined discharge nozzle at the application start point and the position of the application target applied by the discharge nozzle at the application end point is parallel to the scanning direction of the application unit. The coating apparatus according to claim 1, wherein:   The coating apparatus according to claim 1, further comprising a coating unit rotating unit that has a rotation axis in a direction orthogonal to the substrate mounting surface and rotates the coating unit.   The plurality of gripping unit moving means is a combination of a plurality of pairs of gripping unit moving means, and the paired gripping unit moving means moves the same gripping unit in the same direction. The coating apparatus according to claim 1, wherein the coating apparatus is characterized. An application unit that has discharge nozzles arranged in a straight line, and discharges the application liquid from the discharge nozzles to an application target;
A plurality of gripping units for placing and gripping the substrate on a substrate placement surface on which a part of the substrate is placed, each of the gripping units gripping the substrate, and holding a substrate;
With
In a state where the substrate is held by the substrate holding unit, the coating unit applies a coating operation to the coating target on the substrate while relatively moving the coating unit and the substrate holding unit in a specific scanning direction. A coating method in which a coating liquid is applied to the coating target on a substrate by a coating apparatus to be performed,
A correction step of correcting the arrangement of the application targets on the substrate by causing the substrate holding portion to deform the substrate;
An application process in which the application unit applies an application liquid to the application object by the scan operation on the substrate corrected in the correction process;
Have
In the correction step, a line segment connecting the position of the application target applied by the predetermined discharge nozzle at the application start point of one scan operation and the position of the application target applied by the discharge nozzle at the application end point. The coating method is characterized in that the direction is parallel to the scanning direction of the coating unit.

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