KR20140135249A

KR20140135249A - Coating device and coating method

Info

Publication number: KR20140135249A
Application number: KR1020147028896A
Authority: KR
Inventors: 사토시 도모에다; 겐신 혼다; 유키 기타
Original assignee: 토레이 엔지니어링 컴퍼니, 리미티드
Priority date: 2012-03-16
Filing date: 2013-03-08
Publication date: 2014-11-25
Also published as: KR101993026B1; JP5869927B2; WO2013137124A1; CN104245154A; JP2013193010A; CN104245154B

Abstract

Provided is a coating apparatus and a coating method capable of discharging a droplet with high precision with respect to a substrate on which an array of objects to be coated is distorted. Specifically, while the substrate holding unit 7 holds the substrate W, the coating unit 21 is moved relative to the substrate holding unit 7 while relatively moving the coating unit 21 and the substrate holding unit 7 in the specific scanning direction, (1) for performing a scanning operation to apply a coating liquid to an object (G) to be coated on a substrate (W), and the holding unit of the substrate holding unit (7) moves while grasping the substrate The arrangement of the objects G to be coated on the substrate W is corrected so that the scanning operation is performed and the arrangement of the objects G to be coated is corrected in a predetermined The direction of the line segment connecting the position of the application object G applied by the discharge nozzle 22 and the position of the application object G applied by the discharge nozzle 22 at the application end point Direction.

Description

[0001] COATING DEVICE AND COATING METHOD [0002]

The present invention relates to a coating apparatus which dispenses a coating liquid from a nozzle to a plurality of objects to be coated formed on the substrate and applies the coating liquid.

For example, a color filter is used for an image display device such as a liquid crystal TV. As a manufacturing method of the color filter, a thin film of the front surface of an ink is applied to a plurality of fine pixel portions formed on a glass, and a photolithography technique is used Thus, a method of manufacturing a semiconductor device with a required portion is common. On the other hand, as an example of a production method with further improved productivity, there has been proposed an ink-jet method by an ink-jet applying apparatus as described in Patent Document 1, for example.

The coating apparatus disclosed in Patent Document 1 is a coating apparatus 90 as shown in FIG. 13, for example, and is a coating apparatus 90 that scans a carriage 91 provided with a plurality of head portions 92 in the direction of the arrow, Ink is ejected from a plurality of ejection nozzles 93 provided on the substrate 92 to form droplets 94 in the respective application objects G provided in a matrix on the substrate. The inclination angle of the head portion 92 is set so that the distance between the discharge nozzles 93 in the arrangement direction of the objects G to be coated corresponds to the size of the object G to be coated, And droplets are simultaneously formed on a plurality of objects G to be coated simultaneously by ejecting the ink from the plurality of ejection nozzles 93 while keeping the inclination angle.

On the other hand, in recent years, the image display device has been required to be lightweight, thin, and improved in impact resistance. In the case of electronic paper, flexible liquid crystal display, or the like, as a material of a substrate for obtaining a color filter, . For example, in the electronic paper, there is a substrate made of a resin, and a UV curable resin is provided on the substrate, and a process of forming a concave portion to be a coating object G is performed on the substrate.

Japanese Patent Application Laid-Open No. 2002-273868

However, in the coating device described in Patent Document 1, there is a possibility that the application object G formed on the substrate can not be normally coated. Specifically, a plurality of objects G to be coated are designed to be arranged at equal intervals in one matrix. However, when the substrate is a material susceptible to heat or pressure such as resin, The substrate may be deformed due to heat or pressure at the time of formation, and as a result, the arrangement of the objects G to be coated may be distorted and the arrangement interval may be changed in some cases. In this case, since a deviation occurs between the actual position of the application target G and the design position, if the ink is ejected toward the position of the object G to be designed, as shown in Fig. 14, There is a possibility that the droplets 94 may be formed between the object G and the object G which are adjacent to each other without landing at a predetermined position such as the center of each object G, Color mixture occurred between the objects G, resulting in a defective product which can not be made into a product.

However, even in the coating apparatus described in Patent Document 1, it is conceivable to cope with the above-mentioned problem by separately applying the portions where the arrangement of the application object G is skewed. However, in this operating method, the gap between the application target G and the discharge nozzle 93 is different at the position where the arrangement of the application object G is skewed, and ink can be ejected all at once to all the pixel portions 93 , It was inefficient. Specifically, the coating operation is first performed toward the scanning direction to apply the coating to only the coating target G which can be discharged to the center, and then the position of the carriage 91 is moved in the direction orthogonal to the scanning direction, for example, The coating operation is performed again toward the scanning direction by shifting by several micrometers, and the coating is performed only on the pixel which can be discharged to the center by shifting by several micrometers. By repeating this several times, it is possible to apply only one column, so that the ink can not be continuously applied and it is inefficient.

SUMMARY OF THE INVENTION The present invention has been made in view of the problems of the prior art as described above, and an object of the present invention is to provide a coating apparatus capable of discharging droplets with high precision with respect to a substrate having an arrangement of a coating object.

In order to solve the above-described problems, the coating apparatus of the present invention comprises: a coating unit having a discharge nozzle arranged in a straight line and discharging a coating liquid from the discharge nozzle to a coating object; And a substrate holding section for holding the substrate by holding each of the holding units, wherein, in a state in which the substrate holding section is held by the holding section, And a substrate holding part for moving the substrate holding part relative to the substrate holding part in a specific scanning direction while the coating unit applies a coating liquid to the object to be coated on the substrate, And a plurality of gripping unit moving means for moving the gripping unit in a direction parallel to the substrate mounting surface, The gripping unit grips and deforms the substrate by pulling and deforming the substrate so as to correct the arrangement of the object to be coated on the substrate and performs the scanning operation, and in the calibration of the object to be coated, The direction of a line connecting the position of the application object coated with the predetermined discharge nozzle and the position of the object to be coated to be coated by the discharge nozzle at the start point is parallel to the scanning direction of the application unit So that it is possible to obtain a desired image.

According to the above-described coating apparatus, in the calibration of the arrangement of the object to be coated, at the position of the object to be coated, which is applied by the predetermined discharge nozzle at the start of the application of one scanning operation, The alignment of the object to be coated or the direction of the object to be coated can be applied in parallel with the scanning direction so that the alignment of the object to be coated at a predetermined position It is possible to continuously apply the coating liquid.

More specifically, in the calibration of the arrangement of the objects to be coated, by setting a state in which a set of four sides of a quadrangle formed by the four alignment objects arranged on the substrate is parallel to the scanning direction, The direction of the line connecting the position of the application object to be coated with the predetermined discharge nozzle and the position of the object to be coated to be applied by the discharge nozzle at the application end point is the same as the direction of the scanning direction of the application unit So that it becomes parallel.

The coating unit may further include coating unit rotating means having a rotating shaft in a direction perpendicular to the substrate mounting surface and rotating the coating unit.

By having the coating unit rotating means as described above, the arrangement intervals of the discharge nozzles can be matched and applied to the array intervals of the objects to be coated in the direction perpendicular to the scanning direction.

The plurality of gripping unit moving means may be a combination of a plurality of pairs of the gripping unit moving means and the pair of gripping unit moving means may move the same gripping unit in the same direction .

By doing so, it is possible to deform the substrate in various directions by a small number of gripping unit moving means. That is, by making the grasping unit move by the pair of grasping unit moving means different from each other, the grasping unit can move in the rotating direction, and it is possible to deform the substrate not only in the linear direction but also in the rotating direction. In addition, the greater the installation interval of the paired gripping unit moving means, the finer the resolution of the rotation of the gripping unit, and the more accurate rotation can be achieved.

According to another aspect of the present invention, there is provided a coating method comprising: a coating unit having discharge nozzles arranged in a straight line and discharging a coating liquid from a discharge nozzle to a coating object; A holding unit for holding the substrate by gripping a part of the substrate by the holding unit and a driving unit for relatively moving the coating unit and the substrate holding unit in a scanning direction in one horizontal direction A coating step of coating a coating liquid on the substrate to be coated on the substrate, the coating method comprising: a calibration step of calibrating the substrate holding part of the substrate holding part; Wherein the coating unit applies a coating liquid to the object to be coated while moving relative to the object, In the calibration step, the gripping unit grips the substrate and deforms by pulling the substrate, thereby correcting a state in which a set of four sides of a quadrangle formed by the four alignment objects arranged on the substrate is parallel to the scanning direction .

According to the coating method, in the calibration step, the holding unit grasps the substrate while pulling and deforming the substrate, whereby a state in which a set of four sides of the quadrangle formed by the four alignment objects arranged on the substrate becomes parallel to the scanning direction It is possible to apply the coating liquid successively to a predetermined position of the coating object arranged in the scanning direction because the coating object can be arranged in parallel with the scanning direction in the same manner as described above.

According to the coating device and coating method of the present invention, it is possible to discharge droplets with high precision even on a substrate having a crooked arrangement of an object to be coated.

1 is a schematic view of a coating apparatus according to an embodiment of the present invention.
2 is a schematic view of a coating unit according to the present embodiment.
3 is a schematic view of the substrate holding portion in the present embodiment.
4 is a schematic view showing an arrangement of an object to be coated on a substrate.
5 is a schematic view showing a part of the calibration process of the arrangement of the object to be coated.
6 is a schematic view showing a part of the calibration process of the arrangement of the object to be coated.
7 is a schematic view showing a part of the calibration process of the arrangement of the object to be coated.
8 is a schematic view showing the arrangement of an object to be coated after calibration.
9 is a schematic view of a substrate holding portion in another embodiment.
10 is a flow chart for explaining a coating method.
11 is a schematic view showing an arrangement of an object to be coated in another embodiment.
12 is a schematic view of a coating unit in another embodiment.
13 is a schematic view showing a conventional applicator.
14 is a schematic view showing an application operation by a conventional applicator.

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to the drawings.

Fig. 1 shows a coating apparatus according to an embodiment of the present invention. Fig. 1 (a) is a top view of the coating device 1, and Fig. 1 (b) is a front view of the coating device 1. Fig.

The coating device 1 has a delivery device 2, a winding device 3, a recognition part 4, a coating part 5, a substrate holding part 6 and a substrate holding part 7, Like substrate W sent out from the substrate holding section 7 and wound on the substrate holding section 7 by the take-up device 3 is placed on the substrate W fixed on the substrate holding section 7, The application liquid is applied to a plurality of objects G to be coated, which are formed on the substrate W, by discharging the coating liquid while scanning the liquid material 21 linearly. The arrangement of the application objects G including the skew is recognized by the recognition section 4 before application by the application section 5 and the substrate holding section 6 is mounted on the substrate W, And the application of the application object G is performed in the state in which the substrate holding portion 7 performs calibration similar to this calibration.

The coating device 1 is provided with a control section 8 including a computer having a storage device or the like for storing a computer program and the control section 8 performs various calculations, And the like are performed.

In the following description, the direction in which the coating unit 21 scans during coating is defined as the X-axis direction. The direction orthogonal to the X axis direction on the horizontal plane is the Y axis direction, and the direction orthogonal to the X axis direction and the Y axis direction is the Z axis direction.

On the substrate W, a plurality of application objects G are arranged in the X-axis direction and the Y-axis direction, respectively, to form the respective application areas S of the oblique shape. In Fig. 1, the object G to be coated is enlarged for ease of explanation.

The object G to be coated is a concave portion, and the coating liquid is applied to the concave portion. In the present embodiment, the substrate W is made of resin, and an object G to be coated is formed by an imprint method or the like. In addition, the strip-shaped substrate W is cut for each application region S in a subsequent process than the application process by the application device 1, and becomes, for example, a color filter.

The delivery device 2 has a mechanism in which a tubular body on which a strip-shaped substrate W is wound is detachable and the retractor 3 has a mechanism by which a tubular body on which the substrate W is wound can be detached. These cylinders are rotated by a drive mechanism (not shown), whereby the substrate W is sent out from the delivery device 2 to the winding device 3. The coating liquid is applied to the substrate W by the application portion 5 and the substrate W on which the coating liquid of the coating liquid has been completed is wound around the winding device 3. [

The recognition unit 4 has a camera 11 mounted on the camera gantry 12 and a drive unit 13 for moving the camera 11 in the X axis direction and the Y axis direction.

The camera 11 is, for example, a CCD camera, and picks up an object G to which the substrate W is to be applied and the alignment marks AM1 to AM4. The drive device 13 has a function of moving the camera gantry 12 in the X axis direction and a function of moving the camera 11 in the Y axis direction along the camera gantry 12, Motor or the like. A substrate holding section 6 to be described later is provided below the recognizing section 4. The substrate holding section 6 holds the substrate W and holds the objects G and The imaging of the alignment marks AM1 to AM4 is performed.

The recognition unit 4 is provided with a coordinate acquisition unit (not shown) which functions in association with the drive unit 13 and the camera 11. The coordinate acquisition unit acquires the coordinates of the image captured by the camera 11 (Coordinates) of the camera 11 moved by the driving device 13 in the X-axis direction and the Y-axis direction. Thus, based on the image acquired by the camera 11, the coordinate acquiring section can acquire the coordinates of the application object G and the alignment marks AM1 to AM4, and based on the coordinate values, The arrangement of the object G to be coated can be calibrated by the substrate holding portion 6 as well. The function of the coordinate acquisition unit is exercised by executing the computer program of the control unit 8. [

The application unit 5 has a coating drive unit 24 for moving the coating unit 21, the coating gantry 23 and the coating unit 21 in the X-axis direction and the Y-axis direction. The coating gantry 23 is provided with a rotating means 25 having a rotating shaft in a direction (Z-axis direction) perpendicular to the substrate mounting surface of a coating unit described later, 21 is mounted, and the coating unit 21 can rotate about the rotation axis.

The coating unit 21 is provided with a plurality of discharge nozzles 22 for discharging the coating liquid to the object G to be uniformly arranged in one direction and the coating unit 21 is rotated by the rotating means 25 It is possible to change the direction in which the discharge nozzles 22 are arranged.

By changing the arrangement direction of the discharge nozzles 22 as described above, it is possible to make the interval in the Y-axis direction of the discharge nozzles 22 equal to the interval in the Y-axis direction of the object G to be coated Therefore, it is possible to allow each of the discharge nozzles 22 to pass above a predetermined position such as the center of each of the objects G to be coated.

When the coating unit 21 scans in the X-axis direction during the coating operation, when each of the discharge nozzles 22 reaches above a predetermined position of the coating target G as a discharge target, the coating liquid is discharged It is possible to form the droplets 26 at predetermined positions of the respective objects G to be coated. The timings at which the discharge nozzles 22 reach above the predetermined positions of the respective application objects G are determined by the coordinates of the respective objects G to be coated and the positions of the respective discharge nozzles 22 with the control unit 8 ), And it is possible to calculate it.

1 has a function of moving the application gantry 23 in the X axis direction and a function of moving the application unit 21 and the rotation means 25 in the Y axis direction, A linear guide, a motor, and the like. This makes it possible to move the coating unit 21 in the X-axis direction with respect to the substrate W during the coating operation and to apply the coating unit 21 to the coating target 22 in order to align the coating target 22 with the coating target G. [ Can be moved in the Y-axis direction.

A substrate holding section 7 to be described later is provided below the application section 5. The substrate holding section 7 holds the substrate W and holds the substrate W from the application unit 21 The coating liquid is applied to the object G to be coated.

Also in the coating section 5, a camera may be provided in the coating gantry 23, for example, like the recognition section 4. In this case, the substrate held by the substrate holding section 7 W of the object to be coated G and the alignment mark AM1 to the alignment mark AM4 are picked up using the camera and the substrate holding portion 7 appropriately picks up the alignment of the object G Calibration is performed.

The application unit 5 is configured to apply the coating liquid from the discharge nozzles 22 of the coating unit 21 to each of the objects G to be coated of the substrate W held by the substrate holding portion 7 And an application operation control unit for controlling various operations. Further, the coating operation control section can control (manage) the positions (coordinates) of the respective discharge nozzles 22 in the X-axis direction and the Y-axis direction. The function of the coating operation control section is exercised by executing the computer program of the control section 8. [

A plurality of rows of the objects G to be coated, which are arranged in the Y-axis direction, are arrayed in the X-axis direction in the application region S, The coating liquid is continuously discharged from the plurality of discharge nozzles 22 while scanning the substrate W once with respect to the substrate W in the X-axis direction. Hereinafter, the operation of continuously discharging the coating liquid from the discharge nozzles 22 while scanning the coating unit 21 in the X-axis direction is referred to as " scanning operation ".

When the number of the objects G to be coated in the Y-axis direction is larger than the number of the ejection nozzles 22 of the coating unit 21, all the objects G to be coated in the Y- The application of the coating liquid can not be performed. Therefore, the coating operation control section moves the coating unit 21 in the Y-axis direction with respect to the substrate W every time the scanning operation for performing the coating operation is performed on the coating object G of each column in the X-axis direction Shift operation, and performs a next scan operation. With this function, it is possible to apply the coating liquid to all the objects G to be coated in the coating area S by repeating the scanning operation.

The substrate holding portion 6 has a plurality of gripping units and gripping unit moving means for moving a part or all of these gripping units in a direction parallel to the substrate mounting surface of the gripping unit, Holding the substrate W, and the holding unit is moved by the holding unit moving means so that the substrate W is pulled and deformed.

The substrate holding portion 6 in this embodiment is shown in Fig. Fig. 3 (a) is a top view of the substrate holding portion 6, Fig. 3 (b) is a front view, and Fig. 3 (c) is a side view.

In this embodiment, as a plurality of gripping units, a rectangular parallelepiped-shaped central holding unit 31 and a rectangular flat plate-shaped rectangular holding plate 31 provided close to a position facing each other in the X- The X1 holding unit 33 and the X2 holding unit 35 and the Y1 holding unit 32 of the rectangular flat plate shape provided close to the positions facing each other in the Y axis direction with respect to the center holding unit 31, Unit 34 as shown in Fig. Further, in the present embodiment, the central holding unit 31 and the X1 holding unit 33 are connected.

The center holding unit 31 is formed so as to face the substrate W so that the area of the substrate mounting surface which is the surface on which the substrate W is mounted is substantially equal to the area of the application region S. [ Therefore, when the substrate W is mounted on the substrate holding portion 6, the application region S is provided in the central holding unit 31, and the Y1 holding unit 32, the X1 holding unit 33, The X2 holding unit 34 and the X2 holding unit 35 are provided in the vicinity of each side forming the application region S. [

A suction unit is provided in the central holding unit 31, the Y1 holding unit 32, the X1 holding unit 33, the Y2 holding unit 34 and the X2 holding unit 35. That is, a plurality of suction holes (not shown) are formed on each of the substrate mounting surfaces, and these suction holes are connected to a vacuum source (not shown) through a pipe. Thus, by operating the vacuum source, suction force is generated on the respective substrate mounting surfaces, and the substrate W is transferred to the central holding unit 31, the Y1 holding unit 32, the X1 holding unit 33, the Y2 holding unit 34 And the X2 gripping unit 35, respectively. The suction of the central grasping unit 31, the Y1 grasping unit 32, the X1 grasping unit 33, the Y2 grasping unit 34, and the X2 grasping unit 35, / OFF can be switched individually.

The upper surface of the central grasping unit 31, the Y1 grasping unit 32, the X1 grasping unit 33, the Y2 grasping unit 34, and the X2 grasping unit 35, Are at the same height.

Here, in this embodiment, the gripping unit moving means 36 and the gripping unit moving means 37 are provided on the lower surface of the central gripping unit 31 so as to move the central gripping unit 31 in the X-axis direction And the gripping unit moving means 38 and the gripping unit moving means 39 are provided on the lower surface of the Y1 gripping unit 32 so that the Y1 gripping unit 32 can be moved in the Y axis direction.

The gripping unit moving means 36 and the gripping unit moving means 37 are constituted by a linear guide and a motor or the like and are respectively provided with a central gripping unit 31 and an X1 gripping unit 33 Can be controlled in the X-axis direction.

The grasping unit moving means 36 and the grasping unit moving means 37 are provided with a bearing 40 having a rotation axis in the Z axis direction with respect to the center grasping unit 31, The grasping unit moving means 36 and the grasping unit moving means 37 are allowed to rotate about the rotational axis of each of the bearings 40. [

A slider 41 capable of moving the installation in the Y axis direction is provided between the central holding unit 31 and the gripping unit moving means 37. The center holding unit 31 is provided with a holding unit moving means 37 in the Y-axis direction.

Here, when the amounts of movement by the gripping unit moving means 36 and the gripping unit moving means 37 are the same, the central holding unit 31 and the X1 holding unit 33 move only in the X-axis direction, The center grasping unit 31 and the X1 grasping unit 33 are moved in the rotational direction with the Z axis as the rotational axis on the basis of the difference in the movement amount when the movement amounts by the grasping unit moving means 36 and the gripping unit moving means 37 are different from each other .

In this way, a pair of gripping unit moving means (gripping unit moving means 36 and gripping unit moving means 37) for moving the same gripping unit (central gripping unit 31) in the same direction (X-axis direction) It is possible to deform the substrate W in various directions by a small number of gripping unit moving means. The larger the distance between the gripping unit moving means 36 and the gripping unit moving means 37 is, the finer the rotational resolution of the central holding unit 31 and the X1 gripping unit 33, .

Even when the center grasping unit 31 is moved in the rotating direction, since the bearing 40 is provided as described above, the center grasping unit 31, the grasping unit moving means 36, So that no torsional load is applied between them.

The line segment connecting the mounting position of the central holding unit 31 to the gripping unit moving means 36 and the mounting position of the gripping unit moving means 37 is such that the center holding unit 31 moves in the rotating direction Therefore, it tilts. The gap between the gripping unit moving means 36 and the gripping unit moving means 37 is unchanged while the gap between the both gripping positions in the Y-axis direction of the center gripping unit 31 is smaller than the gap between the gripping unit moving means 36 and the gripping unit moving means 37, Is changed as it moves in the rotation direction. On the other hand, as described above, the slider 41 is provided on one of the gripping unit moving means (gripping unit moving means 37 in this embodiment), and in accordance with the movement of the central gripping unit 31 in the rotational direction, (41) is operated to allow the coordinates of the mounting position to change in the Y-axis direction.

The gripping unit moving means 38 and the gripping unit moving means 39 are constituted by, for example, a linear guide, a motor and the like, and can control the amount of movement of the Y1 gripping unit 32 in the Y-axis direction.

The gripping unit moving means 38 and the gripping unit moving means 39 are provided with a bearing 40 having a rotation axis in the Z axis direction between the gripping unit moving means 38 and the gripping unit moving means 39. The Y1 gripping unit 32, Is allowed to rotate about the rotation axis of each of the bearings 40 with respect to the gripping unit moving means 38 and the gripping unit moving means 39. [

A slider 41 capable of moving the installation in the X axis direction is provided between the Y1 gripping unit 32 and the gripping unit moving means 39. The Y1 gripping unit 32 is a gripping unit moving means 39 in the X-axis direction.

Here, when the movement amounts by the gripping unit moving means 38 and the gripping unit moving means 39 are equal, the Y1 gripping unit 32 moves only in the Y-axis direction, but the gripping unit moving means 38 and gripping unit moving When the amount of movement by the means 39 is different, the Y1 gripping unit 32 also moves in the rotational direction with the Z axis as the rotation axis, based on the difference in the amount of movement.

Even when the Y1 gripping unit 32 is moved in the rotating direction, since the bearing 40 is provided as described above, the Y1 gripping unit 32, the gripping unit moving unit 38, So that no torsional load is applied between them.

The line segment connecting the mounting position of the Y1 gripping unit 32 to the gripping unit moving means 38 and the mounting position of the gripping unit moving means 39 is such that the Y1 gripping unit 32 moves in the rotating direction Therefore, it tilts. The gap between the gripping unit moving means 38 and the gripping unit moving means 39 is unchanged in the Y1 gripping unit 32 in the X axis direction, Is changed as it moves in the rotation direction. On the other hand, as described above, the slider 41 is provided on one of the gripping unit moving means (the gripping unit moving means 39 in this embodiment), and in accordance with the movement of the Y1 gripping unit 32 in the rotating direction, (41) is operated to allow the coordinates of the mounting position to change in the X-axis direction.

It is possible to correct the arrangement of the coated region G on the substrate W by deforming the substrate W by the substrate holding portion 6. [ The substrate holding portion 6 deforms the substrate W while confirming the coordinates of the alignment marks AM1 to AM4 by the recognizing portion 4 so that the arrangement of the skewed and tilted application regions G is applied It is possible to calibrate it with an arrangement suitable for For example, when the alignment marks AM1 to AM2 and the alignment mark AM3 and the alignment mark AM4 are designed so as to be parallel to the alignment of the application target G, Similarly, a line connecting the alignment mark AM1 and the alignment mark AM2 and a line segment connecting the alignment mark AM3 and the alignment mark AM4 are deformed so that the line segment connecting the alignment mark AM1 and the alignment mark AM2 is parallel to the scanning direction (X axis direction) The arrangement of the object G to be coated can be made parallel to this scanning direction.

The substrate holding portion 7 has the same structure as the substrate holding portion 6 by holding and deforming the substrate W by pulling. That is, Fig. 3 also shows the configuration of the substrate holding portion 7.

The center holding unit 31, the X1 holding unit 33 and the Y1 holding unit 32 move in the state where the substrate W is gripped by suction, The central holding unit 31 and the X1 holding unit 33 and the Y1 holding unit 32 are moved in the substrate holding unit 7 as well as the substrate W holding unit 6, It is possible to apply a deformation similar to the deformation to the substrate W. That is to say, the calibration state of the arrangement of the objects G to be coated by the substrate holding part 6 while confirming the coordinates of the alignment marks AM1 to AM4 by the recognition part 4 is determined by the application part 5 The substrate holding portion 7 can be brought into the same calibration state by deforming the substrate W. In this case,

The recognition portion 4 and the substrate holding portion 6 are provided on the upstream side of the application portion 5 and the substrate holding portion 7 as in this embodiment, It is possible to grasp the skew of the arrangement of the objects G to be coated in the next coating area S in the recognizing part 4 while performing the coating operation on the area S, (That is, the moving amounts of the central holding unit 31 and the X1 holding unit 33 and the Y1 holding unit 32) can be checked. The arrangement of the objects G to be coated can be immediately corrected to an arrangement suitable for coating when the substrate W is applied to the next coating area S, The tact can be shortened as compared with the case of grasping the skew of the arrangement of the objects G to be coated.

Next, the calibration process of the arrangement of the objects G to be coated by the substrate holding portion 6 having the above-described configuration will be described with reference to Figs. 4 to 7. Fig.

Fig. 4 shows the arrangement of the objects G to be coated on the substrate W. Fig. 4 (a) is an arrangement of objects G to be coated in design. Here, the object G to be coated is shown to be larger than the actual one so that the object G can be easily seen. The application object G shown in the present description is arranged in the X-axis direction and the Y-axis direction. The application region S which is a set of the objects G to be coated is the one shown by the chain line in Fig. 4 (a) As shown in the drawing, the two sets of the opposite sides are rectangular in the X-axis direction and the Y-axis direction, respectively.

However, the object G to be actually placed on the substrate W such as a resin is twisted due to the influence of heat, pressure, or the like when the object G is to be formed and as shown in Fig. 4B , There is a possibility that the spacing of the arrays is changed in some portions. In this case, the quadrangle formed by the application region S is no longer a rectangle.

When the arrangement of the objects G to be applied is distorted and a displacement occurs in the position in the Y-axis direction of the object G to be coated as indicated by the distance l in Fig. 4B, the coating unit 21 Is applied to the object G continuously while scanning in the X-axis direction, the coating liquid can not be discharged to a predetermined position of all the objects G to be coated. If this discrepancy is large, the coating liquid may be discharged at a position shifted from the object G to be mixed with the coating liquid discharged to the adjacent object to be coated.

Therefore, in the present invention, the substrate holding portion 6 performs the calibration of the arrangement of the objects G to be coated through the following process, so that the coating liquid can be discharged to a predetermined position of all the objects G to be coated. The conditions of the calibration are determined by the coordinates of the alignment object disposed on the substrate W. [

In this embodiment, the alignment marks AM1 to AM4 are provided in the vicinity of the four corners of the application region S as the alignment targets. These alignment marks are designed so that the alignment marks AM1 and AM2 are parallel to the arrangement direction of the objects G to be coated and the alignment marks AM3 and AM4 are arranged in the arrangement direction of the alignment marks AM1 and AM2 As shown in Fig.

The arrangement of the objects G to be coated is calibrated by confirming the coordinates of the alignment marks AM1 to AM4 from the image captured by the camera 11 of the recognition unit 4. [

The application target G itself may be an alignment target, for example, an object to be coated G at four corners in the coating area S is to be aligned, without forming an alignment mark separately.

In order to calibrate the arrangement of the objects G to be coated, that is, the shape of the application area S, first, the side L1, which connects the alignment mark AM1 and the alignment mark AM2 shown in Fig. 5, .

Specifically, in a state in which the coating region S on the substrate W is located above the substrate holding portion 6, the central holding unit 31, the Y1 holding unit 32, the X1 holding unit 6 33, the Y2 holding unit 34 and the X2 holding unit 35 are turned on to fix the substrate W. Next, an image of the alignment mark AM1 and the alignment mark AM2 is acquired by the camera 11 of the recognition unit 4, and the coordinates of each of the image acquisition units of the recognition unit 4 are calculated therefrom.

Here, it is assumed that the coordinates of the alignment mark AM1 are (X1, Y1) and the coordinates of the alignment mark AM2 is (X2, Y2). At this time, the angle? 1 between the line segment connecting the alignment mark AM1 and the alignment mark AM2 and the X axis satisfies the following expression (1).

Next, the direction of the side L1 is made parallel to the X-axis direction. More specifically, by driving the gripping unit moving means 36 (hereinafter referred to as TX1 axis 36) and the gripping unit moving means 37 (hereinafter referred to as TX2 axis 37) (1), the side L1 having the angle? 1 is moved in the rotation direction so as to be parallel to the X-axis direction.

At this time, the adsorption of the Y2 gripping unit 34 is turned off, and the fixing of the side L1 is released. In this embodiment, the adsorption of the holding units other than the center holding unit 31 is turned off, and the substrate W is gripped only by the center holding unit 31. [ By doing so, the coated region S rotates while maintaining its shape.

When Y1 and Y2 are equal to each other, this operation is unnecessary since the side L1 is already considered to be parallel to the X-axis direction.

If the distance between the TX1 axis 36 and the TX2 axis 37 is dTX, the difference between the movement amount of the TX1 axis 36 and the movement amount of the TX2 axis 37, which is necessary for rotating the application region S by? d1 is expressed by the following equation (2).

By substituting the equation (1) into the equation (2), d1 is obtained from the coordinates of the alignment mark AM1 and the alignment mark AM2 by the following equation (3).

FIG. 6 shows a state after the TX1 axis 36 and the TX2 axis 37 are moved with a difference in the movement amount according to the value of d1 obtained in the equation (3). The Y coordinates of the alignment mark AM1 and the alignment mark AM2 become equal and the direction of the side L1 becomes parallel to the X axis. As a result, the arrangement of the objects G to be coated in the vicinity of the side L1 becomes parallel to the X axis.

Here, in order to make the difference between the movement amounts of the TX1 axis 36 and the TX2 axis 37 to be d1, only one of the TX axes may be moved or both of the TX axes may be moved.

In the above equation (2), when d1 is the same value, the larger the value of dTX, that is, the greater the distance between the TX1 axis 36 and the TX2 axis 37, the smaller the value of the obtained angle? That is, as described above, the resolution of the rotational movement obtained by the difference between the movement amounts of the TX1 axis 36 and the TX2 axis 37 becomes finer. Here, for example, when the TX1 axis 36 and the TX2 axis 37 are provided at both ends of the center grasping unit 31 in the Y axis direction, dTX is large and the resolution of the rotational movement becomes finer, Control becomes possible. In this case, rotation control more precisely than a commonly used rotating stage may be possible.

Next, the angle between the side L 2, which is the line connecting the alignment mark AM 3 and the alignment mark AM 4, and the X axis is obtained.

Concretely, first, the adsorption of the central holding unit 31, the Y1 holding unit 32, the X1 holding unit 33, the Y2 holding unit 34 and the X2 holding unit 35 is all turned on, (W). Next, an image of the alignment mark AM3 and the alignment mark AM4 is acquired by the camera 11 of the recognition unit 4, and the coordinates of each of the image acquisition units of the recognition unit 4 are calculated therefrom.

At this time, by adjusting the coordinates of the alignment mark AM1 and the alignment mark AM2 by the above-described calibration operation, the positions of the alignment mark AM3 and the alignment mark AM4 are also changed. When this amount of movement is large, there is a fear that the alignment marks AM3 and AM4 are largely deviated from the position where the alignment marks AM3 and AM4 exist and the alignment marks deviate from the field of view of the camera 11 when the substrate W is not deformed.

Therefore, in this embodiment, when the coordinates of the alignment mark AM1 and the alignment mark AM2 are obtained when the side L1 is calibrated, the coordinates of the alignment mark AM3 and the alignment mark AM4 at that time are acquired in advance. After the side L1 is calibrated, it is calculated how much the coordinates of the alignment mark AM3 and the alignment mark AM4 are to be changed by the deformation of the substrate W based on the above formula (3) And the camera 11 is moved so that the coordinates of the alignment mark AM3 and the alignment mark AM4 are obtained again. At this time, the coordinates of the alignment mark AM1 and the alignment mark AM2 as well as the alignment mark AM3 and the alignment mark AM4 may be acquired, and it may be confirmed that the direction of the side L1 is parallel to the X-axis direction.

Assume that the coordinates of the alignment mark AM3 after correction of the side L1 are (X3, Y3) and the coordinates of the alignment mark AM4 are (X4, Y4). At this time, the angle? 2 between the line segment connecting the alignment mark AM3 and the alignment mark AM4 and the X axis satisfies the following expression (4).

Next, the direction of the side L2 is made parallel to the X-axis direction. More specifically, by driving the gripping unit moving means 38 (hereinafter referred to as TY1 axis 38) and the gripping unit moving means 39 (hereinafter referred to as TY2 axis 39) The side L2 having the angle [theta] 2 is moved in the rotating direction and is made parallel to the X-axis direction as shown in (4).

At this time, the attraction of the Y2 gripping unit 34 is kept in the ON state, and the direction of the side L1 is fixed so as not to change. In the present embodiment, only the adsorption of the Y1 gripping unit 32 and the Y2 gripping unit 34 is turned on, and the other adsorption is turned off. By doing so, the direction of the side L2 and the shape of the application region S are corrected while being fixed so that the direction of the side L1 is not changed.

Further, when Y3 and Y4 are equivalent, this operation is unnecessary since the side L2 is already considered to be parallel to the X-axis direction.

Here, if the interval between the TY1 axis 38 and the TY2 axis 39 is dTY, a difference d2 between the movement amount of the TY1 axis 38 and the movement amount of the TY2 axis 39 required to rotate the side L2 by? Is expressed by the following equation (5).

By substituting the equation (4) into the equation (5), d2 is obtained from the coordinates of the alignment mark AM3 and the alignment mark AM4 by the following equation (6).

6, the X coordinate X3 of the alignment mark AM3 is larger than the X coordinate X4 of the alignment mark AM4, and the value of (X3-X4) in the equation (6) is positive. Therefore, if the Y coordinate Y3 of the alignment mark AM3 is larger than the Y coordinate Y4 of the alignment mark AM4, the value of d2 is positive. At this time, the TY1 axis 38 is larger in value by d2 than the TY2 axis 39 By moving in the positive direction of the Y axis, the Y coordinates of the alignment mark AM3 and the alignment mark AM4 become equal. Conversely, when Y3 is smaller than Y4, the value of d2 is negative. At this time, the TY2 axis 39 is moved in the positive direction of the Y axis by the value of (-d2) , The Y coordinates of the alignment mark AM3 and the alignment mark AM4 become equal.

Assuming that only one TY axis is to be moved in order to make the difference between the movement amounts of the TY1 axis 38 and the TY2 axis 39 to be d2, the alignment mark AM3 and the alignment mark AM4 are set so that, The pivotal motion is performed with the TY axis as the center of rotation, so that one of the alignment marks moves in the negative direction of the Y axis. At this time, the substrate W is warped and can not be maintained flat. Therefore, it is necessary to shift the TY1 axis 38 and the TY2 axis 39 in the positive direction of the Y-axis by pulling them so that neither the alignment mark AM3 nor the alignment mark AM4 moves in the Y-axis negative direction.

The distance by which the alignment mark moves in the negative direction of the Y axis is obtained by the pivot movement. The X coordinate of the center of the TY1 axis 38 and the center of the TY2 axis 39 is Xc and the X coordinate of the TY1 axis 38 is (Xc-dTY / 2) and the X coordinate of the TY2 axis 39 is Xc + dTY / 2).

First, when Y3 < Y4, the alignment mark AM4 is pivotally moved about the TY1 axis 38, and the alignment mark AM4 moves in the negative direction of the Y axis. The movement amount d2 'of the alignment mark AM4 at this time in the Y-axis direction is expressed by equation (7) using the angle [theta] 2 in the above equation (4).

By shifting the TY1 axis 38 and the TY2 axis 39 in the positive direction of the Y axis by the distance d2 ', warping of the substrate W can be prevented. Therefore, by moving the movement amount of the TY1 axis 38 in the positive direction of the Y axis by d2 'and the movement amount of the TY2 axis 39 by (d2 + d2'), the direction of the side L2 And is adjusted so as to be parallel to the X axis. This movement amount can be calculated from the coordinates of the alignment mark AM3 and the alignment mark AM4 from the above-mentioned expressions (4) to (7).

Then, when Y3 > Y4, the alignment mark AM3 moves in the negative direction of the Y-axis by pivoting about the TY2 axis 39. [ The movement amount d2 '' of the alignment mark AM3 at this time in the Y-axis direction is expressed by the equation (8) using the angle [theta] 2 in the above equation (4).

The substrate W can be prevented from warping by shifting the TY1 axis 38 and the TY2 axis 39 in the positive direction of the Y axis by the distance d2 ". Therefore, by moving the movement amount of the TY1 axis 38 in the positive direction of the Y axis by (d2 + d2 '') and the movement amount of the TY2 axis 39 by d2 '', Axis is parallel to the X-axis. The movement amount can be calculated from the coordinates of the alignment mark AM3 and the alignment mark AM4 from the expressions (4), (5), (6) and (8).

FIG. 7 shows a state after the TY1 axis 38 and the TY2 axis 39 are moved by the above movement amount. As a result of correcting the directions of the sides L 1 and L 2, the side L and the side L 2 parallel to the X-axis direction, and the shape of the quadrangle and the area S formed by connecting the alignment marks AM 1 through AM 4, . The arrangement of the objects G to be coated in the vicinity of the side L2 as well as the vicinity of the side L1 is also parallel to the X axis. By this state, the calibration by the substrate holding portion 6 is completed.

8 shows the arrangement of the objects G to be coated after correcting the shape of the quadrangle and the application area S formed by connecting the alignment marks AM1 to AM4 by the substrate holding part 6 through the above process. The side L1 and the side L2 are parallel to each other and their directions are parallel to the X axis direction so that the position of the object G to be coated by the predetermined discharge nozzle 22 at the start of the application of one scanning operation And the direction of the line segment connecting the position of the application object G applied by the discharge nozzle 22 becomes parallel to the scanning direction of the application unit 21 at the application end point. That is, the objects G to be coated are arranged in the scanning direction (X-axis direction), and the interval in the Y-axis direction is also uniform.

2, the distance between the discharge nozzles 22 in the Y-axis direction is larger than the gap G between the object W to be coated (G Axis direction of the coating unit 21 by adjusting the rotation angle of the coating unit 21 so as to be equal to the interval? Y in the Y-axis direction of the coating unit 21 in the scanning direction.

On the other hand, as another method for making the interval of the dispensing object G in the Y-axis direction equal to the interval of the dispensing nozzle 22 in the Y-axis direction, the substrate W is moved in the Y- So that the gap in the Y axis direction of the application region G may be adjusted to the gap in the Y axis direction of the ejection nozzle 22. [ Specifically, the TY1 axis 38 and the TY2 axis 39 are pulled in the positive direction of the Y axis by the same amount of movement while only the Y1 gripping unit 32 and the Y2 gripping unit 34 are turned on, The intervals of the regions G may be widened to match the intervals of the discharge nozzles 22 in the Y-axis direction.

When the substrate W is deformed in the substrate holding portion 7, it is not always necessary to confirm the coordinates of the alignment marks AM1 to AM4, and the conditions of the calibration performed by the upstream substrate holding portion 6 are used as they are So that the substrate W may be deformed. The conditions for calibration performed by the substrate holding portion 6 are utilized to deform the substrate W in the substrate holding portion 7 and align the substrate W from the image of the camera The coordinates of the mark AM1 to the alignment mark AM4 may be checked to fine-tune the calibration.

Here, in the calibration according to the present embodiment, the calibration is performed so as to adjust only the directions of the sides L1 and L2, and the sides L3 and L4 of the other two sides are not touched at all. Therefore, as indicated by? X shown in Fig. 8, a deviation in the X-coordinate between the objects G to be coated occurs. This can be followed by adjusting the discharging timing of each of the discharging nozzles 22, and it is possible to reduce the speed of the scanning operation or increase the number of scanning operations by applying can do. The shape of the quadrangle and the application area S formed by connecting the alignment marks AM1 to AM4 is parallelogram or rectangle, and the shapes of the sides L3 and L4 are parallel to each other in the X-axis direction The spacing between the application objects G adjacent to each other may be uniform.

9 (a) is a top view of the substrate holding portion 6, Fig. 9 (b) is a front view, and Fig. 9 ) Is a side view. The substrate holding portion 6 shown in Fig. 3 is provided with the TX1 axis 36 and the TX2 axis 37 so that the application region S is rotated when the movement amount is made different. However, Stage 42 may be substituted. The X1 grasping unit 33 and the X2 grasping unit 33 located on both sides in the X-axis direction of the central grasping unit 31 are arranged so that only the angle between the sides L1 and L2 is corrected, and the angles of the sides L3 and L4 are not corrected. It is not necessary to switch the adsorption on / off state independently of the central holding unit 31, and the central holding unit 35 may be integrated into the central holding unit 31 alone.

9, the substrate W is rotated by the rotation unit 42 in a state in which the attraction of the central holding unit 31 is turned on so that the side L1 is parallel to the X-axis direction, and Y2 The angle between the side L1 and the side L2 is corrected to be X (X) by correcting the angle of the side L2 on the TY1 axis 38 and the TY2 axis 39 while the side L1 is fixed by turning on the adsorption of the gripping unit 34. [ Axis direction, and the object G to be coated can be arranged in the X-axis direction.

Next, Fig. 10 shows an operation flow when coating is performed in the coating device 1 of the present invention.

First, the substrate W is delivered by the delivery device 2 and is wound up by the winding device 3 to transfer the application area S above the substrate holding part 6 (step S1). Then, the substrate holding portion 6 grasps the substrate W including the application region S (step S2). At this time, the adsorption of the central holding unit 31, the Y1 holding unit 32, the X1 holding unit 33, the Y2 holding unit 34 and the X2 holding unit 35 is all on.

Next, the coordinates of the alignment marks AM1 to AM4 are acquired (step S3). Specifically, the camera 11 of the recognition unit 4 moves to a position where each alignment mark is present, and captures the image. From the image, the coordinate acquiring unit acquires the coordinates of each alignment mark.

Next, based on the coordinates of the alignment mark AM1 and the alignment mark AM2 obtained in step S3, the angle correction of the side L1 is performed (step S4). At this time, the adsorption of the Y1 holding unit 32, the X1 holding unit 33, the Y2 holding unit 34 and the X2 holding unit 35 is turned off and only the center holding unit 31 holds the substrate W It is in one state. The TX1 axis 36 and the TX2 axis 37 move so that the application region S is rotated so that the direction of the side L1 is parallel to the X axis direction (scanning direction).

Next, the coordinates of the alignment marks AM1 to AM4 are acquired again (step S5). Specifically, after the calibration is performed in step S4, the camera 11 of the recognition unit 4 moves to a position where each alignment mark is present, and captures the image. From the image, the coordinate acquiring unit acquires the coordinates of each alignment mark. At this time, the suction of the Y1 gripping unit 32, the X1 gripping unit 33, the Y2 gripping unit 34 and the X2 gripping unit 35 is again turned on so that all the gripping units grip the substrate W State.

Next, based on the coordinates of the alignment mark AM3 and the alignment mark AM4 obtained in step S5, the angle correction of the side L2 is performed (step S6). At this time, the adsorption of the center grasping unit 31, the X1 grasping unit 33, and the X2 grasping unit 35 is turned off. The Y2 gripping unit 34 is in a state of holding the substrate W by suction, and the side L1 is fixed. Then, the TY1 axis 38 and the TY2 axis 39 move in the state where the Y1 gripping unit 32 grips the portion on the side L2 so that the direction of the side L2 becomes parallel to the X axis direction (scanning direction) do.

By the steps from this step S2 to the step S6, the directions of the sides L1 and L2 become parallel to the X axis direction, and the spacing in the Y axis direction between the objects G to be coated becomes uniform.

Next, the coordinates of each application object G are checked (step S7), and the control unit 8 confirms the timing at which each of the discharge nozzles 22 of the application unit 21 discharges the application liquid at the time of application. As in the case of obtaining the coordinates of each alignment mark, the coordinate acquisition unit performs the confirmation of the coordinates of each application object G on the basis of the image captured by the camera 11. [ At this time, images of all the objects to be coated G may be picked up and each coordinate may be obtained. However, only the image of the object G to be coated, which is set as a representative, such as four corners of the coated area, It is preferable to take a method of estimating the coordinates of the object G from the coordinates of the object G set as the representative because the load of imaging and calculation can be reduced. At this time, the adsorption of all of the holding units is on.

Next, after the adsorption of all of the holding units is turned off, the substrate W is fed out by the feeding device 2 and is wound up by the winding device 3, (Step S8). The substrate W holding the substrate holding portion 7 and the X2 holding unit 35 are all turned on so that the substrate W including the coating region S is held by the substrate holding portion 7 (Step S9).

Subsequently, in steps S4 and S6, the substrate holding section 6 is moved at the same moving amount as the moving amount of the TX1 axis 36, the TX2 axis 37, the TY1 axis 38 and the TY2 axis 39 of the substrate holding section 6, The TX1 axis 36, the TX2 axis 37, the TY1 axis 38 and the TY2 axis 39 of the substrate holder 7 are moved to perform the same calibration as that performed by the substrate holding portion 6, (Step S10).

Next, the angle of the coating unit 21 is adjusted by the rotating means 25 so that the distance between the coating target G and the discharging nozzle 22 in the Y-axis direction becomes equal (Step S11).

Next, the coating unit 21 performs a coating operation on each of the objects G (step S12). Concretely, the coating liquid is continuously applied to the object G arranged in the X-axis direction by the scanning operation once or plural times.

Thus, after the application area is transferred in step S1, the application of the application liquid to the application object G having a skewed arrangement is completed through the calibration process from step S2 to step S10 and the application process from step S11 to step S12 do.

With the above-described coating device and coating method, droplets can be discharged with high accuracy with respect to a substrate on which an arrangement subject to coating is distorted.

The above description is based on the assumption that the application object G is a concave portion and the ink is applied to the concave portion to form a color filter. However, the present invention is not limited to the production of a color filter, The present invention is also applicable to an apparatus for forming circuit patterns of organic semiconductors such as TFTs by coating or a device for forming capacitors, resistors, wirings, etc. on a substrate.

In the above description, the roll-to-roll coating device is used, in which the roll-shaped substrate W is fed by the feeding device 2 and the coating process is performed while being wound by the winding device 3. However, It is also possible to apply the present invention to a coating apparatus that applies coating to a single substrate W. In this case, since the recognition section 4 and the substrate holding section 6 do not exist, the camera 11 is installed in the application section 5, and the substrate holding section 7 below the application section 5 is mounted on the substrate The coordinates of the alignment marks AM1 to AM4 are obtained in a state in which the wafer W is grasped. Based on the result, a calibration condition for making the sides L1 and L2 parallel to the scanning direction is obtained, and the substrate holding portion 7 performs the calibration.

In addition, even in the roll-to-roll coating apparatus, the recognition section 4 and the substrate holding section 6 may be omitted. As described above, by providing the recognition section 4 and the substrate holding section 6, the conditions for deformation of the substrate W can be obtained prior to the application process in the application section 5, can do.

Although the above description is based on the example in which the objects G to be coated are gathered in a square shape, as shown in Figs. 11 (a) and 11 (b) G) may not be a quadrangle. If there are a set of the alignment marks AM1 and AM2 and a set of alignment marks AM3 and AM4 arranged in parallel with the arrangement direction of the objects G to be coated, The line segment connecting the mark AM1 and the alignment mark AM2 and the line segment connecting the alignment mark AM3 and the alignment mark AM4 are corrected so as to be parallel to the X axis direction, so that the application target G is arranged in the X axis direction, It is possible to perform application by a scanning operation.

As shown in Fig. 11 (c), the alignment targets AM1 and alignment mark AM2 arranged parallel to the direction of the application target G, And a line segment connecting the alignment mark AM1 and the alignment mark AM2 and a line segment connecting the alignment mark AM3 and the alignment mark AM4 are corrected so as to be parallel to the X axis direction when there is a set of the alignment mark AM3 and the alignment mark AM4, G) are parallel to the X-axis direction (in this case, both ends of one object G to be coated are coated on the object to be coated (hereinafter referred to as " G and the coating end point correspond to the coating object G to which the discharge nozzle 22 is applied so that the direction of the coating object G is parallel to the X axis direction, The direction of the line segment connecting the position of the application target G applied by the predetermined discharge nozzle 22 and the position of the application target G applied by the discharge nozzle 22 at the application end point is Parallel to the scanning direction of the coating unit 21]. When coating is performed on such an object G to be coated, not only the ink-jet coating but also a stripe coating method for drawing a linear coating film can be used.

In the above description, only one row of the discharge nozzles 22 is arranged at equal intervals in the coating unit 21, but as shown in Fig. 12, the coating units 21 are arranged linearly at regular intervals Or may have a plurality of rows of discharge nozzles 22. Even in this case, it is possible to discharge the coating liquid to predetermined positions of all the objects to be coated by aligning the interval d of the adjacent discharge nozzles 22 on the linear array with the interval of the object to be coated.

1: Coating device
2:
3: winding device
4:
5:
6: substrate holder
7: substrate holder
8:
11: Camera
12: Camera gantry
13: Driving device
21: dispensing unit
22: Discharge nozzle
23: Gantry application
24:
25: rotating means
26: Droplet
31: Central holding unit (holding unit)
32: Y1 holding unit (holding unit)
33: X1 holding unit (holding unit)
34: Y2 gripping unit (gripping unit)
35: X2 holding unit (holding unit)
36: Holding unit moving means (TX1 axis)
37: Holding unit moving means (TX2 axis)
38: gripping unit moving means (TY1 axis)
39: Holding unit moving means (TY2 axis)
40: Bearings
41: Slider
42: rotating stage
90: dispensing device
91: Carriage
92: head portion
93: Nozzles
94: Droplet
AM1 to AM4: Alignment mark (alignment target)
G: Application target
L1 to L4:
S: application area
W: substrate

Claims

A coating unit having a discharge nozzle arranged in a straight line and discharging a coating liquid from the discharge nozzle to an object to be coated;
And a substrate holding portion for holding a substrate by holding a plurality of holding units each holding and holding a substrate on a substrate mounting surface on which a part of the substrate is mounted,
The coating unit applies a coating liquid to the object to be coated on the substrate while relatively moving the coating unit and the substrate holding part in a specific scanning direction in a state in which the substrate holding and holding part holds the substrate, Device,
The substrate holding portion has a plurality of holding unit moving means for moving a part or all of the holding units in a direction parallel to the substrate mounting surface,
The grasping unit pulls and deforms the substrate while gripping the substrate to deform the substrate, corrects the arrangement of the objects to be coated on the substrate, performs the scanning operation,
In the calibration of the arrangement of the object to be coated, the position of the object to be coated to be coated by the discharge nozzle at the position of the object to be coated and the dispensing end point to which the predetermined object is to be applied So that the direction of the connecting line is parallel to the scanning direction of the coating unit.

2. The method according to claim 1, wherein in the calibration of the arrangement of the object to be coated, a set of four sides of the quadrangle formed by the four alignment objects arranged on the substrate is in parallel with the scanning direction, The direction of the line connecting the position of the application object to be coated with the predetermined discharge nozzle and the position of the object to be coated to be applied by the discharge nozzle at the application end point is the same as the direction of the scanning direction of the application unit So as to be parallel to each other.

The application device according to claim 1 or 2, further comprising a coating unit rotating means having a rotation axis in a direction orthogonal to the substrate mounting surface, for rotating the coating unit.

The gripping apparatus according to any one of claims 1 to 3, wherein the plurality of gripping unit moving means are a combination of a plurality of pairs of the gripping unit moving means, And the gripping unit is moved in the same direction.

A coating unit having a discharge nozzle arranged in a straight line and discharging a coating liquid from the discharge nozzle to an object to be coated;
And a substrate holding portion for holding a substrate by holding a plurality of holding units each holding and holding a substrate on a substrate mounting surface on which a part of the substrate is mounted,
The coating unit applies a coating liquid to the object to be coated on the substrate while relatively moving the coating unit and the substrate holding part in a specific scanning direction in a state in which the substrate holding and holding part holds the substrate, A coating method for applying a coating liquid to an object to be coated on a substrate by an apparatus,
A calibration step of calibrating the arrangement of the object to be coated on the substrate by deforming the substrate holding part of the substrate holding part,
And a coating step of coating the coating liquid on the object to be coated by the coating unit by the scanning operation with respect to the substrate calibrated in the calibration step,
In the above-described calibration step, at a time point at which the application of the scan operation is performed, the position of the application object to be coated by the predetermined discharge nozzle and the position of the application object to be coated by the discharge nozzle So that the direction is parallel to the scanning direction of the coating unit.