CN113894009A - Control method of glue spreader - Google Patents
Control method of glue spreader Download PDFInfo
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- CN113894009A CN113894009A CN202111212971.9A CN202111212971A CN113894009A CN 113894009 A CN113894009 A CN 113894009A CN 202111212971 A CN202111212971 A CN 202111212971A CN 113894009 A CN113894009 A CN 113894009A
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- 239000003292 glue Substances 0.000 title claims abstract description 150
- 238000000034 method Methods 0.000 title claims abstract description 43
- 238000005507 spraying Methods 0.000 claims abstract description 125
- 239000000758 substrate Substances 0.000 claims abstract description 96
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 58
- 238000000576 coating method Methods 0.000 claims abstract description 26
- 239000011248 coating agent Substances 0.000 claims abstract description 25
- 230000008859 change Effects 0.000 claims abstract description 23
- 238000004026 adhesive bonding Methods 0.000 claims description 108
- 230000008569 process Effects 0.000 claims description 20
- 239000007921 spray Substances 0.000 claims description 17
- 230000001276 controlling effect Effects 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 230000002596 correlated effect Effects 0.000 claims description 8
- 230000000875 corresponding effect Effects 0.000 claims description 6
- 239000003638 chemical reducing agent Substances 0.000 claims description 3
- 238000003892 spreading Methods 0.000 abstract description 25
- 230000007480 spreading Effects 0.000 abstract description 25
- 238000003384 imaging method Methods 0.000 description 6
- 238000012937 correction Methods 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 230000014509 gene expression Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1015—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target
- B05C11/1018—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target responsive to distance of target
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1007—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material
- B05C11/1013—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material responsive to flow or pressure of liquid or other fluent material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Fluid Mechanics (AREA)
- Coating Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The invention discloses a control method of a glue spreader, which comprises the steps of moving a glue spreading nozzle to align the camera shooting center of a camera shooting unit on the nozzle with the center of a substrate, measuring the positions of the center of a reference mark and the camera shooting center of the camera shooting unit through an image shot by the camera shooting unit, measuring the height between the glue spreading nozzle and the central surface of the substrate by a laser range finder on the nozzle, calculating the height change rate between the glue spreading nozzle and the central surface far away from the substrate, measuring the spraying flow by a sensor arranged at the inlet of the glue spreading nozzle, selecting the types and the use doses of different photoresists, calculating the functional relation between the spraying time length and the spraying flow of the glue spreading nozzle according to the use doses of the photoresists, and recording the operation time point and the idle time point of the glue spreader. The invention has the advantages of ensuring that a uniform gap is formed between the substrate and the glue coating nozzle, ensuring the quality of the wafer and preventing the nozzle of the glue coating machine from being reworked due to poor glue coating in subsequent operation.
Description
Technical Field
The invention relates to the technical field of glue spreading machines, in particular to a control method of a glue spreading machine.
Background
The manufacture and packaging of semiconductors require a photolithography process, which comprises sequentially coating, exposing, developing, etc. with photoresist on a semiconductor wafer, transferring the designed pattern on the mask to the film layer on the surface of the substrate, coating photoresist solution on the surface of the substrate and heating the coated photoresist solution to form a photoresist film layer, then a specified pattern structure is formed in the photoresist layer on the surface of the substrate through an exposure and development process, in the photoresist coating process, a wafer is generally placed in a special coater and a spin coating method is adopted, the coater forms a sealant pattern on a substrate while changing the relative position between each nozzle and the substrate, the coater horizontally moves in the X-axis and Y-axis directions, and the nozzles are moved up and down in the Z-axis direction to maintain a uniform gap between the nozzles and the substrate.
The control method of the existing glue spreader adopts a laser probe to control the distance, but the precision of the laser probe is low, the height change rate between the nozzle of the glue spreader and the surface of the substrate is large, so that the uniform gap between the substrate and the nozzle cannot be ensured, a defective sealant pattern can be formed on the part with the large height change rate of the surface of the substrate, a plurality of glue bottles are arranged on the glue spreader, each glue bottle is controlled by flow through a sensor, when one sensor fails, a power pump can continuously spray glue, the quality of a wafer is influenced, and when the glue spreader is idle for a long time, the nozzle of the glue spreader can be solidified, so that the nozzle of the glue spreader can need to be reworked due to poor glue spreading in subsequent operation.
Disclosure of Invention
The invention aims to provide a control method of a glue spreader, so that a uniform gap is ensured between a substrate and a glue spreading nozzle, the quality of a wafer is ensured, and the nozzle of the glue spreader is prevented from being reworked due to poor glue spreading in subsequent operation.
A method of controlling a glue applicator comprising: step 1, moving a gluing nozzle to align the camera shooting center of a camera shooting unit on the nozzle with the center of a substrate; step 2, measuring the positions of the center of the reference mark and the shooting center of the shooting unit through the image shot by the shooting unit; step 3, measuring the height between the gluing nozzle and the central surface of the substrate by a laser range finder on the nozzle; step 4, calculating the height change rate from the gluing nozzle to the surface far away from the center of the substrate; step 5, measuring the spraying flow through a sensor arranged at the inlet of the gluing nozzle; step 6, selecting different photoresist types and using doses, and calculating according to the using doses of the photoresist to obtain a functional relation between the spraying time length and the spraying flow of the gluing nozzle; and 7, recording the running time point and the idle time point of the glue spreader, and sending work task information to the idle glue spreader.
The height change rate between the gluing nozzle and the surface far away from the center of the substrate is calculated, uniform gaps are guaranteed between the substrate and the gluing nozzle, the spraying flow rate is measured through a sensor arranged at the inlet of the gluing nozzle, uniform spraying of photoresist is achieved on the part with the large height change rate of the surface of the substrate, the quality of a wafer is guaranteed, the running time point and the idle time point of a gluing machine are recorded, the situation that the nozzle is blocked by the photoresist due to long-time idle of the gluing machine is avoided, and the situation that the nozzle of the gluing machine needs to be reworked due to poor gluing in subsequent operation is avoided.
Further, the laser range finder on the nozzle controls the change of the heights of the surfaces of the plurality of substrates measured by the driving unit by measuring the height of the surface of the substrate on the pedestal, calculates the height change rate of each substrate surface by using the height change of the substrate surface, measures the average value of the heights of the substrate surfaces, and sets the initial positions of the nozzle in the vertical direction and the horizontal direction of the glue coating operation on the substrate surface.
The driving unit drives the nozzles to measure and calculate the height change rate of the surface of each substrate, the average value of the surface height of each substrate is obtained, and the glue coating operation of the nozzles at the initial positions of the surfaces of the substrates is determined, so that the uniform gap between the substrates and the nozzles is kept relative to the height of the upper surfaces in the spraying range, and the uniform glue coating thickness is ensured.
Further, the glue spreader is provided with a moving unit which moves along the horizontal axis direction, the vertical axis direction and the vertical axis direction, the moving unit moves with the moving nozzle, the position of the nozzle is adjusted to move the nozzle along the moving unit direction through a driving unit, the nozzle is provided with an image pickup unit, the image pickup unit faces the substrate, a reference mark is formed on the substrate, the center of the reference mark of the substrate is aligned with the image pickup center of the image pickup unit, and the image pickup unit picks up an image of the substrate.
Further, a camera shooting unit of the gluing nozzle is aligned with the center of the substrate, the gluing nozzle is aligned with the center of the substrate through free movement in the horizontal direction, the moving unit drives the camera shooting unit to move to the mark position of the center of the substrate together, the camera shooting unit is used for shooting reference mark images, the shot images are used for measuring the positions of the center of the reference mark and the camera shooting center of the camera shooting unit, and the position of the moving nozzle is adjusted to the center of the reference mark and the camera shooting center.
The camera unit of the gluing nozzle enables the gluing nozzle to be aligned with the center of the substrate through free movement in the horizontal direction, so that the position of the nozzle can be accurately adjusted relative to the substrate, the process of testing the center of the substrate in each gluing process is omitted, extra space correction is not needed, and the production rate of products is improved.
Further, select the kind and the use dose of different photoresists, during the photoresist kind that will select is contained into and is glued the bottle, the spray tube is connected on gluing the bottle, and the base of spreading machine is used for bearing the weight of the wafer, and the spout of spray tube is located the top of base, and the power pump is connected on the spray tube, and the controller is connected with the power pump electricity, and the controller control power pump starts or stops to pump the photoresist to the wafer, and it is long when the control power pump starts corresponding injection according to the kind and the demand of photoresist.
Further, the relation between the spraying time and the flow is adjusted according to the spraying pressure, the working time of the power pump, the spraying pressure and the flow are in positive correlation, the working time and the spraying pressure are defined fields, the spraying flow of the photoresist is a value field, and a third value can be determined by determining any two values.
Further, the spraying time and the spraying time interval are manually set, the spraying time of the glue coating nozzle is 3 to 5 seconds, the spraying time interval is 0.3 to 0.5 second, in the spraying process of the glue coating nozzle, the spraying interval is 30 times, the spraying time and the spraying pressure are adjusted after each spraying interval, and the spraying time and the spraying pressure are positively correlated with the viscosity of the photoresist and the spraying.
During gluing operation, different types and dosages of the photoresist are selected, and gluing is performed after the functional relationship between each photoresist and the corresponding power pump is determined, so that the operation process is simplified, and the gluing nozzle can perform automatic gluing according to the functional relationship only by setting the dosage and spraying time of the required photoresist, thereby improving the gluing efficiency.
Further, a sensor at the inlet of the gluing nozzle measures the spraying flow, threshold values of different photoresist type spraying flow are measured through the sensor at the inlet, the threshold values of the spraying flow comprise a threshold value of glue inlet spraying flow and a threshold value of glue outlet spraying flow, the gluing work task of the driver is controlled according to the threshold values of the spraying flow, and the threshold value of the glue inlet spraying flow is larger than the threshold value of the glue outlet spraying flow.
The sensor measures the threshold values of different photoresist spraying flows at the inlet of the gluing nozzle, the threshold values of the spraying flows comprise the threshold values of the glue inlet spraying flows and the threshold values of the glue outlet spraying flows, the glue inlet spraying flows and the glue outlet spraying flows are monitored constantly in the gluing process, the glue outlet in the whole gluing process is guaranteed to be normal, the glue outlet control accuracy is provided, the gluing thickness is convenient to set, and the gluing quality is improved.
Furthermore, the spraying flow controls the glue outlet amount of the gluing nozzle, the glue outlet motor drives the glue outlet pump through the speed reducer, the glue outlet pump controls the gluing feeding speed of the gluing nozzle, the moving speed of the gluing nozzle is positively correlated with the gluing feeding speed, and the gluing thickness is positively correlated with the glue outlet amount of the gluing nozzle.
Further, recording the operating time point and the idle time point of the glue spreader, receiving the working information sent by the glue spreader, acquiring the working state of the glue spreader, reading the idle starting time point of the glue spreader, determining the idle time of the glue spreader according to the idle starting time point, sending a working instruction to the idle glue spreader, and enabling the glue spreader to start production operation after receiving the working instruction.
Recording the operating time point and the idle time point of the spreading machine, acquiring the working state of the spreading machine, sending a working instruction to the idle spreading machine, receiving the working instruction by the spreading machine to start production operation, avoiding the solidification of a glue head of the spreading machine, and improving the spraying quality.
The invention has the advantages that: the height change rate between the gluing nozzle and the surface far away from the center of the substrate is calculated, uniform gaps are guaranteed between the substrate and the gluing nozzle, the spraying flow rate is measured through a sensor arranged at the inlet of the gluing nozzle, uniform spraying of photoresist is achieved on the part with the large height change rate of the surface of the substrate, the quality of a wafer is guaranteed, the running time point and the idle time point of a gluing machine are recorded, the situation that the nozzle is blocked by the photoresist due to long-time idle of the gluing machine is avoided, and the situation that the nozzle of the gluing machine needs to be reworked due to poor gluing in subsequent operation is avoided.
Drawings
FIG. 1 is a schematic flow chart of a method of controlling a glue applicator.
FIG. 2 is a schematic control flow diagram of a glue nozzle of a glue applicator.
Detailed Description
Aiming at the defects in the prior art, the invention provides a control method of a glue spreader, so that a uniform gap is ensured between a substrate and a glue spreading nozzle, the quality of a wafer is ensured, and the nozzle of the glue spreader is prevented from being reworked due to poor glue spreading in subsequent operation.
In order to solve the technical problems, the invention adopts the following technical scheme:
as an embodiment, as shown in fig. 1, a method for controlling a glue dispenser includes the steps of: moving the gluing nozzle to align the camera shooting center of the camera shooting unit on the nozzle with the center of the substrate; measuring the positions of the center of the reference mark and the imaging center of the imaging unit through the image captured by the imaging unit; the laser range finder on the nozzle measures the height between the gluing nozzle and the central surface of the substrate; calculating the height change rate between the gluing nozzle and the surface far away from the center of the substrate; measuring the spraying flow through a sensor arranged at the inlet of the gluing nozzle; selecting the types and the use doses of different photoresists, and calculating according to the use doses of the photoresists to obtain a functional relation between the spraying time length and the spraying flow of the gluing nozzle; recording the running time point and the idle time point of the glue spreader, and sending work task information to the idle glue spreader.
Preferably, the uniform gap between the substrate and the gluing nozzle is ensured by calculating the height change rate between the gluing nozzle and the surface far away from the center of the substrate, the spraying flow is measured by a sensor arranged at the inlet of the gluing nozzle, the uniform spraying of the photoresist is realized on the part with the large height change rate of the surface of the substrate, the quality of the wafer is ensured, the running time point and the idle time point of the gluing machine are recorded, the blockage of the nozzle by the photoresist due to the long-time idle of the gluing machine is avoided, and the problem that the nozzle of the gluing machine needs to be reworked due to poor gluing in the subsequent operation is avoided.
Preferably, the laser distance meter on the nozzle controls the variation of the heights of the plurality of substrate surfaces measured by the driving unit by measuring the height of the substrate surface on the susceptor, calculates the height variation rate of each substrate surface using the height variation of the substrate surface, measures the average value of the heights of the substrate surfaces, and sets the initial positions of the nozzle in the vertical direction and the horizontal direction at which the glue coating operation is started on the substrate surface.
Preferably, the driving unit drives the nozzles to measure and calculate the height change rate of each substrate surface, an average value of the substrate surface height is obtained, and the initial position of the nozzles on the substrate surface is determined to start glue coating operation, so that the gap between the substrate and the nozzles is kept uniform relative to the upper surface height in the spraying range, and the uniformity of the glue coating thickness is ensured.
Preferably, the glue spreader is provided with a moving unit which moves in a horizontal axis direction, a vertical axis direction and a vertical axis direction, the moving unit moves together with the moving nozzle, the nozzle is moved in the moving unit direction by a driving unit in a position adjusted, the nozzle is provided with an imaging unit, the imaging unit faces the substrate, the reference mark is formed on the substrate, the center of the reference mark of the substrate is aligned with the imaging center of the imaging unit, and the imaging unit images the substrate.
Preferably, the camera shooting unit of the gluing nozzle is aligned with the center of the substrate, the gluing nozzle is aligned with the center of the substrate through free movement in the horizontal direction, the moving unit drives the camera shooting unit to move to the mark position of the center of the substrate together, the camera shooting unit is used for shooting a reference mark image, the shot image is used for measuring the positions of the center of the reference mark and the camera shooting center of the camera shooting unit, and the position of the moving nozzle is adjusted to the center of the reference mark and the camera shooting center.
Preferably, the camera unit of the gluing nozzle enables the gluing nozzle to be aligned with the center of the substrate through free movement in the horizontal direction, so that the position of the nozzle can be accurately adjusted relative to the substrate, the process of testing the center of the substrate in each gluing process is omitted, additional space correction is not needed, and the production rate of products is improved.
As an implementation mode, as shown in FIG. 2, different types and dosages of photoresist are selected, the selected photoresist types are put into a glue bottle, a spray pipe is connected to the glue bottle, a base of a glue spreader is used for bearing a wafer, a nozzle of the spray pipe is located above the base, a power pump is connected to the spray pipe, a controller is electrically connected with the power pump, the controller controls the power pump to start or stop pumping the photoresist to the wafer, the power pump is controlled to start corresponding spray duration according to the types and the required amount of the photoresist, the relation between the spray time and the flow is adjusted according to the spray pressure, the working time and the spray pressure of the power pump are in positive correlation with the flow, the working time and the spray pressure are defined fields, the spray flow of the photoresist is a value field, any two values can be determined to be a third value, and the spray time interval are manually set, the spraying time of the glue spreading nozzle is 3-5 seconds, the spraying time interval is 0.3-0.5 second, in the spraying process of the glue spreading nozzle, the spraying interval is 30 times, the spraying time and the spraying pressure are adjusted after each spraying interval, and the spraying time and the spraying pressure are in positive correlation with the viscosity of the photoresist and the spraying.
Preferably, during the gluing operation, different types and dosages of the photoresist are selected, and gluing is performed after the functional relationship between each photoresist and the corresponding power pump is determined, so that the operation process is simplified, and the gluing nozzle can perform automatic gluing according to the functional relationship only by setting the required dosage and spraying time of the photoresist, thereby improving the gluing efficiency.
Preferably, a sensor at the inlet of the gluing nozzle measures the spraying flow, threshold values of different photoresist types of spraying flow are measured through the sensor at the inlet, the threshold values of the spraying flow comprise a threshold value of glue inlet spraying flow and a threshold value of glue outlet spraying flow, the gluing work task of the driver is controlled according to the threshold values of the spraying flow, and the threshold value of the glue inlet spraying flow is larger than the threshold value of the glue outlet spraying flow.
Preferably, the sensor measures thresholds of different photoresist spraying flows at an inlet of the gluing nozzle, the thresholds of the spraying flows comprise a threshold of a glue inlet spraying flow and a threshold of a glue outlet spraying flow, the glue inlet spraying flow and the glue outlet spraying flow are monitored constantly in the gluing process, the glue outlet in the whole gluing process is guaranteed to be normal, the glue outlet control accuracy is provided, the gluing thickness is conveniently set, and the gluing quality is improved.
Preferably, the spraying flow controls the glue outlet amount of the glue spraying nozzle, the glue outlet motor drives the glue outlet pump through the speed reducer, the glue outlet pump controls the glue feeding speed of the glue spraying nozzle, the moving speed of the glue spraying nozzle is positively correlated with the glue feeding speed, and the glue spraying thickness is positively correlated with the glue outlet amount of the glue spraying nozzle.
Preferably, recording the running time point and the idle time point of the gumming machine, receiving the working information sent by the gumming machine, acquiring the working state of the gumming machine, reading the idle starting time point of the gumming machine, determining the idle time of the gumming machine according to the idle starting time point, sending a working instruction to the idle gumming machine, and receiving the working instruction by the gumming machine to start production operation.
Preferably, the operating time point and the idle time point of the gluing machine are recorded, the working state of the gluing machine is obtained, a working instruction is sent to the idle gluing machine, the gluing machine receives the working instruction to start production operation, solidification of a gluing head of the gluing machine can be avoided, and the spraying quality is improved.
The invention has the beneficial effects that: the height change rate from the glue coating nozzle to the surface far away from the center of the substrate is calculated, so that a uniform gap is ensured between the substrate and the glue coating nozzle, the spraying flow is measured by a sensor arranged at the inlet of the glue coating nozzle, the uniform spraying of the photoresist is realized on the part with the large height change rate of the surface of the substrate, the quality of a wafer is ensured, the running time point and the idle time point of a glue coating machine are recorded, the blockage of the nozzle by the photoresist due to the long-time idle of the glue coating machine is avoided, and the problem that the nozzle of the glue coating machine needs to be reworked due to poor glue coating in the subsequent operation is avoided; the driving unit drives the nozzles to measure and calculate the height change rate of the surface of each substrate, the average value of the surface height of each substrate is obtained, and the glue coating operation of the nozzles at the initial positions of the surfaces of the substrates is determined, so that the uniform gap between the substrates and the nozzles is kept relative to the height of the upper surfaces in the spraying range, and the uniform glue coating thickness is ensured.
The camera unit of the gluing nozzle enables the gluing nozzle to be aligned with the center of the substrate through free movement in the horizontal direction, so that the position of the nozzle can be accurately adjusted relative to the substrate, the process of testing the center of the substrate in each gluing process is omitted, extra space correction is not needed, and the production rate of products is improved; during gluing operation, different types and dosages of the photoresist are selected, and gluing is performed after the functional relationship between each photoresist and the corresponding power pump is determined, so that the operation process is simplified, and the gluing nozzle can perform automatic gluing according to the functional relationship only by setting the dosage and spraying time of the required photoresist, thereby improving the gluing efficiency.
The sensor measures threshold values of different photoresist spraying flows at an inlet of a gluing nozzle, the threshold values of the spraying flows comprise threshold values of glue inlet spraying flows and threshold values of glue outlet spraying flows, the glue inlet spraying flows and the glue outlet spraying flows are monitored constantly in the gluing process, the glue outlet in the whole gluing process is guaranteed to be normal, the glue outlet control accuracy is provided, the gluing thickness is convenient to set, and the gluing quality is improved; recording the operating time point and the idle time point of the spreading machine, acquiring the working state of the spreading machine, sending a working instruction to the idle spreading machine, receiving the working instruction by the spreading machine to start production operation, avoiding the solidification of a glue head of the spreading machine, and improving the spraying quality.
All patents and publications mentioned in the specification of the invention are indicative of the techniques disclosed in the art to which this invention pertains and are intended to be applicable. All patents and publications cited herein are hereby incorporated by reference to the same extent as if each individual publication was specifically and individually indicated to be incorporated by reference. The invention described herein may be practiced in the absence of any element or elements, limitation or limitations, which limitation or limitations is not specifically disclosed herein. For example, in each of the examples herein the terms "comprising", "consisting essentially of", and "consisting of" may be substituted for the remaining 2 terms of either. The terms and expressions which have been employed herein are used as terms of description and not of limitation, and there is no intention in the use of such terms and expressions of excluding any equivalents of the features shown and described, but it is recognized that various modifications and changes may be made within the scope of the invention and the claims which follow. It is to be understood that the embodiments described herein are preferred embodiments and features and that modifications and variations may be made by one skilled in the art in light of the teachings of this disclosure, and are to be considered within the purview and scope of this invention and the scope of the appended claims and their equivalents.
Claims (10)
1. A control method of a glue spreader is characterized by comprising the following steps: step 1, moving a gluing nozzle to align the camera shooting center of a camera shooting unit on the nozzle with the center of a substrate; step 2, measuring the positions of the center of the reference mark and the shooting center of the shooting unit through the image shot by the shooting unit; step 3, measuring the height between the gluing nozzle and the central surface of the substrate by a laser range finder on the nozzle; step 4, calculating the height change rate from the gluing nozzle to the surface far away from the center of the substrate; step 5, measuring the spraying flow through a sensor arranged at the inlet of the gluing nozzle; step 6, selecting different photoresist types and using doses, and calculating according to the using doses of the photoresist to obtain a functional relation between the spraying time length and the spraying flow of the gluing nozzle; and 7, recording the running time point and the idle time point of the glue spreader, and sending work task information to the idle glue spreader.
2. A method of controlling a glue applicator as claimed in claim 1, characterized in that: the laser range finder on the nozzle controls the change of the heights of the surfaces of the substrates measured by the driving unit by measuring the height of the surface of the substrate on the base, calculates the height change rate of each substrate surface by using the height change of the substrate surface, measures the average value of the heights of the substrate surfaces, and sets the initial positions of the nozzle in the vertical direction and the horizontal direction of the glue coating operation on the substrate surface.
3. A method of controlling a glue applicator as claimed in claim 1, characterized in that: the glue spreader is provided with a moving unit, the moving unit moves along the directions of a transverse shaft, a vertical shaft and a vertical shaft, the moving unit drives a moving nozzle to move together, the position of the nozzle is adjusted to move the nozzle along the direction of the moving unit through a driving unit, a camera shooting unit is arranged on the nozzle, the camera shooting unit faces a substrate, a reference mark is formed on the substrate, the center of the reference mark of the substrate is aligned with the camera shooting center of the camera shooting unit, and the camera shooting unit shoots an image of the substrate.
4. A method of controlling a glue applicator as claimed in claim 1, characterized in that: the camera shooting unit of the glue coating nozzle is aligned with the center of the substrate, the glue coating nozzle is aligned with the center of the substrate through free movement in the horizontal direction, the moving unit drives the camera shooting unit to move to the mark position of the center of the substrate together, the camera shooting unit is used for shooting reference mark images, the shot images are used for measuring the positions of the center of the reference mark and the camera shooting center of the camera shooting unit, and the position of the moving nozzle is adjusted to the center of the reference mark and the camera shooting center.
5. A method of controlling a glue applicator as claimed in claim 1, characterized in that: the automatic photoresist spraying device is characterized in that the types and the use dosages of different photoresists are selected, the selected photoresist types are contained in a photoresist bottle, a spray pipe is connected to the photoresist bottle, a base of the glue spreader is used for bearing a wafer, a nozzle of the spray pipe is located above the base, a power pump is connected to the spray pipe, a controller is electrically connected with the power pump, the controller controls the power pump to start or stop the photoresist pump to the wafer, and the power pump is controlled to start corresponding spraying time according to the types and the required amount of the photoresist.
6. A method of controlling a glue applicator as claimed in claim 1, characterized in that: the relation of the spraying time and the flow is adjusted according to the spraying pressure, the working time of the power pump, the spraying pressure and the flow are in positive correlation, the working time and the spraying pressure are defined domains, the spraying flow of the photoresist is a value domain, and a third value can be determined by determining any two values.
7. A method of controlling a glue applicator as claimed in claim 1, characterized in that: the spraying time and the spraying time interval are set manually, the spraying time of the gluing nozzle is 3-5 seconds, the spraying time interval is 0.3-0.5 seconds, in the spraying process of the gluing nozzle, the spraying interval is 30 times, the spraying time and the spraying pressure are adjusted after each spraying interval, and the spraying time and the spraying pressure are positively correlated with the viscosity of the photoresist and the spraying pressure.
8. A method of controlling a glue applicator as claimed in claim 1, characterized in that: the sensor at the inlet of the gluing nozzle is used for measuring the spraying flow, the sensor at the inlet is used for measuring the threshold values of the spraying flow of different photoresist types, the threshold values of the spraying flow comprise the threshold value of the glue inlet spraying flow and the threshold value of the glue outlet spraying flow, the gluing work task of the driver is controlled according to the threshold values of the spraying flow, and the threshold value of the glue inlet spraying flow is larger than the threshold value of the glue outlet spraying flow.
9. A method of controlling a glue applicator as claimed in claim 1, characterized in that: the spraying flow control gluing nozzle glue output amount, the glue output motor drives the glue output pump through the speed reducer, the glue output pump controls the gluing feed speed of the gluing nozzle, the moving speed of the gluing nozzle is positively correlated with the gluing feed speed, and the gluing thickness is positively correlated with the glue output amount of the gluing nozzle.
10. A method of controlling a glue applicator as claimed in claim 1, characterized in that: the method comprises the steps of recording the running time point and the idle time point of the glue spreader, receiving work information sent by the glue spreader, obtaining the working state of the glue spreader, reading the idle starting time point of the glue spreader, determining the idle time of the glue spreader according to the idle starting time point, sending a work instruction to the idle glue spreader, and enabling the glue spreader to receive the work instruction to start production operation.
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| CN202111212971.9A CN113894009A (en) | 2021-10-19 | 2021-10-19 | Control method of glue spreader |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111212971.9A CN113894009A (en) | 2021-10-19 | 2021-10-19 | Control method of glue spreader |
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| CN113894009A true CN113894009A (en) | 2022-01-07 |
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| CN202111212971.9A Pending CN113894009A (en) | 2021-10-19 | 2021-10-19 | Control method of glue spreader |
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| CN114442435A (en) * | 2022-01-24 | 2022-05-06 | 芯达半导体设备(苏州)有限公司 | Method for calculating thickness of photoresist spray type gluing film |
| CN114798349A (en) * | 2022-03-01 | 2022-07-29 | 刘鹏祥 | Method and system for automatically calibrating flow of spraying water-based adhesive |
| CN115445845A (en) * | 2022-08-30 | 2022-12-09 | 四川航天川南火工技术有限公司 | Flexible quantitative automatic gluing device and method for cables |
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Application publication date: 20220107 |