201119749 六、發明說明： 【發明所屬之技術領域】 本發明關於控制塗膠機之方法。 【先前技術】 一般而言，平面板顯示器(FPDs)是比傳統使用陰極射線 管的電視或監視器還輕薄的視訊顯示器。已開發使用的平面 板顯示器範例為液晶顯示器(LCDs)、電漿顯示面板(PDPs)、 場發射顯示器(FEDs)、以及有機發光二極體(〇LEDs)。 在眾多平面板顯示器中，液晶顯示器為基於影像資訊個 別供應資料訊號到矩陣配置的液晶胞的顯示器，因此控制液 晶胞的透射率，而顯示所需影像。由於液晶顯示器具有的優 點在於薄、輕、且功率消耗與操作電壓又低，所以液晶顯示 器已廣為使用。一般製造用於液晶顯示器之液晶面板的方法 將說明如下。 首先’彩色濾、光片與共用電極形成於上基板上，而薄膜 電晶體(TFT)及晝素電極形成於相對於上基板的下基板上。 接著，配向膜塗佈於基板上，配向膜摩擦提供待形成於配向 膜間的液晶層中之液晶分子預傾角及配向方向。 再者’為了維持基板間的預定間隙，以避免液晶洩漏並 密封基板間的間隙，塗佈預定圖案的膠於至少一個基板，以 形成膠圖案。之後，形成液晶層於基板之間。以此方式，製 造了液晶面板。 201119749 於製造液晶面板當中，塗膠機用以形成膠圖案於基板 ^。塗膠機包含供裝設基板之平台、配備排出膠之噴 單元、以及支撐頭單元之頭支撐件。 此類塗膠機在改變各喷嘴相對於基板間之位置時， 膠圖案於基板上。亦即’在藉由上下移動各頭單元之喷嘴於 z軸方向轉持喷嘴之排出孔與基板間—致關隙時，塗膠 機水平移動喷嘴及/或基板於x及γ軸方向，且自喷 膠於基板上，因而形成膠圖案。 $了量測基板與喷嘴間的間隙，頭單元配備有雷射位移 感測器。雷射位移感測器包含發射雷射光到基板之發射部， 以及接收自發射部發射且自基板上表面反射之雷射光之接 收邛。再者，為了於ζ軸方向上/下移動喷嘴，頭單元提供 有連接喷嘴之ζ軸驅動單元。因此，控制單元利用雷射位移 感測器所量測的基板射嘴間之間隙，來控制ζ軸驅動單 70 ’而調整喷嘴的垂直位置，因此使基板及喷嘴間的間隙保 持一致。 當基板裝設於平台上時，因為基板固有的特性或平台上 表面的形狀，而使得基板上表面的高度可能是不平的，且可 能於垂直方向變化。 ^基板上表面的高度在各個膠塗佈部分中可能有變化。可 能發生基板上表面的高度出現大變化的部分，即顯示基板上 表面之高度變化的梯度相當大的部分。 ’ 土 根據相關技術’利用雷射位移感測器量測基板與噴嘴間 201119749 的間隙’以及根據所量測的基板與料間關隙僅驅動z轴 驅動单疋，而上/下移動喷嘴。因此，習知方法的問題在於 不能軸驅動單元的動作，適當地㈣顯絲板上表 面之南度變化㈣度太大_分，以轉基板射嘴一 致間隙，研能在顯示基板上表面之高度變化的梯度太大的 部分上形成有缺陷的膠圖案。 【發明内容】 因此，本發明有鑑於上述先前技術發生的問題，本發明 =目，於提供控制塗賴之方法，其量測安置於平台之 度，並基於所量測的基板上表面的高度來調 整排出膠之喷嘴的垂直位置，而改善膠塗佈效能。 法，目的，本發明提供—種控制塗夥機之方 平二43頭早70 ’係具有喷嘴，用輯*膠到安置於 提^ίΐ 於垂直移動頭單元之第—驅動單元、以及 立地垂直移動喷嘴之第二驅動單元，此方 當控置於平台之基板之上表面之高度；以及⑼ 二動單元及第二驅動單元時，_步驟⑷所量測 土板之上表面之高度，塗佈膠於基板。 動單可包含設定雜佈部分，而分成個_動第一驅 驅動單-，別驅動部分’以及同時驅動第—驅動單元及第二 部分以步軸部分。設定驗佈部分而分成個別驅動 之古声驅動部分之步驟可包含：⑴利用基板之上表面 (2)Γ字i各塗佈部分中基板之上表面之高度變化；以及 ^步驟(1)所計算之基板之上表面之高度變化之梯度 201119749 分 絕對值小於預設參考值之塗佈部分，設定為個別驅動部分， 以及將顯示步驟(1)所計算之基板之上表面之高度變化之梯 度絕對值大於預設參考值之塗佈部分，設定為同步驅動部 步驟(b)可包含(1)計算步驟(a)所量測之基板之上表面之 高度之平均值；（2)利用步驟⑴所計算之基板之上表面之高 度之平均值’在基板開始佈操作之塗佈起始點，設定喷 嘴於垂直方向之初始位置；以及(3)於塗佈起始點之垂直方 向’將喷嘴定位於步驟(2)所設定的初始位置。 再者’為了達成上述目的，本發明提供一種控制塗膠 ^法，塗膠機具有噴嘴’以排出膠到安置於平台之基板 ’此方法包含：⑻量測安置於平台之基板之上表面之高 f/ff)計算步驟⑻所量測之基板之上表面之高度之平 】值’=利用步驟_計算之基板之上表面之高度之平均 土開始膠塗佈操作之塗佈起始點，設定喷嘴於垂直 定塗佈賴點之謝向，將喷嘴 板之位置時，位置，以及當調整喷嘴相對於基 表面欲塗佈膠之部分，量測基板之上 之上表面之^情基板之上表面之整個部分，量測基板 表面塗膠機之方法的優點在於’針對基板上 隙·心 201119749 佈膠的整個部分上使得基板與喷嘴間之間隙得以維持。 再者，控制塗膠機之方法的優點在於，量測安置於平台 之基板上表面的高度，計算基板上表面的高度的平均值，以 及利用基板上表面的高度平均值，設定喷嘴在塗佈起始點之 垂直方，之初始位置，而在塗佈膠的整個部分上使得相對於 上表面高度，基板與喷嘴間之間隙得以維持。 、 【實施方式】 實施例之塗 於後將參考伴隨®式說明根據本發明較佳 膠機以及控制塗膠機之方法。 卓二20 據本發明之塗膠機包含框架1(> 上—20、千口 30、一對支標移動導引件4〇 頭早兀60、以及控制單元（去 祝又枒什ου201119749 VI. Description of the Invention: [Technical Field to Which the Invention Is Ascribed] The present invention relates to a method of controlling a coating machine. [Prior Art] In general, flat panel displays (FPDs) are video displays that are thinner than conventional television or monitors that use cathode ray tubes. Examples of flat panel displays that have been developed are liquid crystal displays (LCDs), plasma display panels (PDPs), field emission displays (FEDs), and organic light emitting diodes (〇LEDs). In many flat panel displays, the liquid crystal display is a display that supplies data signals to the matrix cells of the matrix based on the image information, thereby controlling the transmittance of the liquid cell and displaying the desired image. Since liquid crystal displays have advantages of being thin, light, and low in power consumption and operating voltage, liquid crystal displays have been widely used. A method of generally manufacturing a liquid crystal panel for a liquid crystal display will be described below. First, the color filter, the light sheet and the common electrode are formed on the upper substrate, and the thin film transistor (TFT) and the halogen electrode are formed on the lower substrate with respect to the upper substrate. Next, an alignment film is coated on the substrate, and the alignment film rubs to provide a liquid crystal molecule pretilt angle and an alignment direction to be formed in the liquid crystal layer between the alignment films. Further, in order to maintain a predetermined gap between the substrates to prevent liquid crystal leakage and to seal a gap between the substrates, a predetermined pattern of glue is applied to at least one of the substrates to form a glue pattern. Thereafter, a liquid crystal layer is formed between the substrates. In this way, a liquid crystal panel was fabricated. 201119749 In the manufacture of liquid crystal panels, a glue applicator is used to form a glue pattern on the substrate ^. The applicator includes a platform for mounting the substrate, a spray unit equipped with the discharge glue, and a head support for the support head unit. When such a glue applicator changes the position of each nozzle relative to the substrate, the glue pattern is on the substrate. That is, when the nozzle is moved between the discharge hole of the nozzle and the substrate in the z-axis direction by moving the nozzles of the head units up and down, the glue applicator horizontally moves the nozzle and/or the substrate in the x and γ axis directions, and The glue is applied to the substrate, thereby forming a glue pattern. The gap between the substrate and the nozzle is measured, and the head unit is equipped with a laser displacement sensor. The laser displacement sensor includes a transmitting portion that emits laser light to the substrate, and a receiving portion that receives the laser light emitted from the emitting portion and reflected from the upper surface of the substrate. Further, in order to move the nozzle up/down in the x-axis direction, the head unit is provided with a spindle drive unit that connects the nozzles. Therefore, the control unit adjusts the vertical position of the nozzle by controlling the gap between the substrate nozzles measured by the laser displacement sensor to control the vertical position of the nozzle, thereby keeping the gap between the substrate and the nozzle uniform. When the substrate is mounted on the stage, the height of the upper surface of the substrate may be uneven due to the inherent characteristics of the substrate or the shape of the upper surface of the substrate, and may vary in the vertical direction. ^ The height of the upper surface of the substrate may vary in each of the glue coated portions. It is possible to cause a large change in the height of the upper surface of the substrate, i.e., a portion where the gradient of the height change of the surface on the substrate is relatively large. The soil is used to measure the gap between the substrate and the nozzle by the laser displacement sensor according to the related art, and to drive only the z-axis driving unit according to the measured substrate-to-material clearance, and to move the nozzle up/down. Therefore, the problem of the conventional method is that the action of the shaft driving unit cannot be performed, and the southward degree of the surface of the display board is appropriately (four) degree is too large_minute to rotate the substrate nozzle with a uniform gap, and the surface of the display substrate can be ground. A defective rubber pattern is formed on the portion where the height change gradient is too large. SUMMARY OF THE INVENTION Accordingly, the present invention has been made in view of the problems of the prior art described above, and the present invention provides a method for controlling coating, which measures the degree of placement on a platform and is based on the measured height of the upper surface of the substrate. To adjust the vertical position of the nozzle for discharging glue, and improve the coating performance of the glue. The invention provides a method for controlling a coating machine, the Fangping II, 43, and the early 70' series having nozzles, using the * glue to the first driving unit disposed in the vertical moving head unit, and the vertical vertical Moving the second driving unit of the nozzle, the side is controlled to be placed on the upper surface of the substrate of the platform; and (9) the second moving unit and the second driving unit, the height of the upper surface of the measuring board measured by the step (4) is coated The cloth is glued to the substrate. The move order may include setting the rag portion, and dividing into a _ first drive drive unit -, driving the portion 'and simultaneously driving the first drive unit and the second portion to the step portion. The step of setting the inspection portion to be divided into individual driving ancient sound driving portions may include: (1) utilizing the height change of the upper surface of the substrate in each of the coating portions of the upper surface of the substrate (2); and (step) (1) The calculated gradient of the height change of the surface above the substrate 201119749 is divided into the coating portion whose absolute value is smaller than the preset reference value, is set as the individual driving portion, and the gradient of the height change of the surface above the substrate calculated in the step (1) is displayed. The coating portion having an absolute value greater than the preset reference value, the step of setting the synchronous driving portion (b) may include (1) calculating an average value of the height of the surface above the substrate measured in the step (a); (2) using the step (1) The average value of the height of the upper surface of the calculated substrate 'sets the initial position of the nozzle in the vertical direction at the coating start point of the substrate starting operation; and (3) the vertical direction of the coating starting point' The nozzle is positioned at the initial position set in step (2). Furthermore, in order to achieve the above object, the present invention provides a method for controlling the application of a glue applicator having a nozzle 'to discharge glue to a substrate disposed on the platform'. The method comprises: (8) measuring the surface of the substrate disposed on the platform High f/ff) calculation of the height of the upper surface of the substrate measured in the step (8)] value==the average starting point of the surface of the substrate calculated by the step_the starting point of the coating operation of the glue coating operation, Setting the direction of the nozzle to the vertical coating point, the position of the nozzle plate, the position, and the portion of the surface on which the nozzle is to be coated with respect to the base surface, and measuring the upper surface of the substrate The advantage of the method of measuring the surface coating machine of the entire surface of the upper surface is that the gap between the substrate and the nozzle is maintained over the entire portion of the substrate. Furthermore, the method of controlling the applicator has the advantages of measuring the height of the upper surface of the substrate disposed on the platform, calculating the average value of the height of the upper surface of the substrate, and setting the nozzle to be coated by using the average value of the upper surface of the substrate. The vertical point of the starting point, the initial position, and the entire portion of the coating gel is such that the gap between the substrate and the nozzle is maintained relative to the height of the upper surface. [Embodiment] After the application of the embodiment, a preferred melter and a method of controlling the coater according to the present invention will be described with reference to the accompanying Formula. Zhuo 2 20 The glue applicator according to the present invention comprises a frame 1 (> upper-20, a thousand mouth 30, a pair of branch moving guides 4 兀 head early 60, and a control unit (to wish another υου)
而移動於X軸方向2G提供於框架II 而基板s安置於丄 3〇的兩側，而延伸於γ ^移動導引件40安裝於平会 m 士工財向。頑支撐件50安裝於平ζ 所支撐料讀轉導引_ 而移動於X軸方向，且頭翠碩：⑼安裝於頭支撐件5〇 及雷射位移感測器71。^；! 5G包含排出膠之噴嘴乃L 支撐件50可提供於—個控瓣塗佈操作。複料 移動於Y軸方向。複數頭單，而沿支樓移動導引件41 60可安裝於一個頭支撐件50, 如圖2所示，頭單元6 支樓構件6丨所支撐而移動撐糾61、由第一 乙軸方向（圖2的垂直方向）以 201119749 第二支撐構件62、以及由第二支撐構件62所支撐而移動於 Z軸方向的第三支撐構件63。 第二支撐構件62配備有雷射位移感測器71。此類雷射 位移感測器71包含發射雷射光之發射部，以及與發射部相 距預定距離且用於接收自基板S反射之雷射光之接收部。雷 射位移感測器71輸出電訊號到控制單元，而量測基板s及 喷嘴73之間隙，其中電訊號對應於自發射部發射且由基板 S反射之雷射光之影像形成位置而產生。 第二支撐構件63配備有填充膠的注射器72、鄰近雷射 位移感測器71且用於排出膠的喷嘴73、以及容許注射器72 及喷嘴73彼此相通的連通管74。 第一驅動單元81提供於第一支撐構件61與第二支撐構 件62之間而移動第一支樓構件62於Z軸方向。第二驅動 單元82提供於第二支撲構件62與第三支擇構件纪之間， 而^對於第二讀構件&獨立师動第三讀構件幻於冗 舉例而言，第一驅動單元81包含 第-驅動軸812，盆輕接第一她民、去絲馬達811及 62。當第-驅動馬達811與第三支撐構件 第一 作時，第二支撐構件62相對於 第支沒構件61個別地移動於Z轴方向。 再者，第一驅動單元82包含牢接 - 第二驅動馬達82卜二讀構件62的 植从α 你 祸接第一驅動馬達821盥第r:古擋 構件 的弟一,驅動軸822。當第-土 、— 田弟一軀動馬達821操作時， 201119749 轴 =支鄕件《相對科二支賴件62個職移動於z 二支標構件62。因此，♦ & ^馬達821牢接於第 元81的操作而移動於it62藉由第一驅動單 件纪與第二支撑構件Γ一第起向的第三支樓構The moving 2G in the X-axis direction is provided on the frame II and the substrate s is disposed on both sides of the 丄 3 ,, and the γ ^ moving guide 40 extending in the X-axis is installed in the squadron. The stub support member 50 is mounted on the support material read and turn guide _ while moving in the X-axis direction, and the head Cuishuo: (9) is mounted on the head support member 5 and the laser displacement sensor 71. ^;! 5G nozzle containing effluent is L. The support 50 can be provided for a flap application operation. The compound moves in the Y-axis direction. a plurality of headers, and the moving guides 41 60 along the branch can be mounted on a head support 50. As shown in FIG. 2, the head unit 6 is supported by the branch member 6丨 to move the support 61, by the first hinge The direction (the vertical direction of FIG. 2) is the 201119749 second support member 62 and the third support member 63 supported by the second support member 62 and moving in the Z-axis direction. The second support member 62 is equipped with a laser displacement sensor 71. Such a laser displacement sensor 71 includes a transmitting portion that emits laser light, and a receiving portion that is spaced apart from the transmitting portion by a predetermined distance and that receives laser light reflected from the substrate S. The laser displacement sensor 71 outputs an electrical signal to the control unit to measure the gap between the substrate s and the nozzle 73, wherein the electrical signal is generated corresponding to the image forming position of the laser light emitted from the transmitting portion and reflected by the substrate S. The second support member 63 is provided with a glue-filled syringe 72, a nozzle 73 adjacent to the laser displacement sensor 71 for discharging the glue, and a communication tube 74 allowing the syringe 72 and the nozzle 73 to communicate with each other. The first driving unit 81 is provided between the first support member 61 and the second support member 62 to move the first branch member 62 in the Z-axis direction. The second driving unit 82 is provided between the second slap member 62 and the third splicing member, and the second driving unit is independent of the second reading member. 81 includes a first drive shaft 812 that is lightly coupled to the first female, wire removal motors 811 and 62. When the first drive motor 811 and the third support member are first, the second support member 62 is individually moved in the Z-axis direction with respect to the first support member 61. Furthermore, the first drive unit 82 includes a second drive motor 82, a second drive member 62, a second drive member 821, a first drive motor 821, a r: ancient gear member, and a drive shaft 822. When the first earth, the Tiandi one body motor 821 is operated, the 201119749 axis = support member "relative to the two divisions 62 positions moved to the z two-standard member 62. Therefore, the ♦ & ^ motor 821 is fixed to the third branch structure of the first driving unit and the second supporting member by the first driving unit and the second supporting member.
三，63。此_接二含第==與J 二叙接播杜。δ步祸接構件641及第 祸按構件642。第—耦接構件64ι 久乐 上端延伸於γ轴方向。第二耗接構件6d茅《的 的下端朝第-耦接構件64 ^自第一駆動,822 接構件⑷下方。因此，轴方向，且在第一輕 件⑷自第二_構件64^#構件63藉由第一娜 移動:第:ί=2藉由第一驅動單元81的操作而向下Three, 63. This _ followed by two with the == and J two Syrian broadcast Du. The δ step contact member 641 and the catastrophic pressing member 642. The first coupling member 64i has an upper end extending in the γ-axis direction. The lower end of the second consumable member 6d is moved from the first to the first coupling member 64 from the first member, and the member 822 is below the member (4). Therefore, the axial direction, and the movement of the first light member (4) from the second member 64^# member 63 by the first ano: the: ί=2 is downward by the operation of the first driving unit 81
許第三支標構件63與第二支標構件62 ® ’但#喷嘴73與基板s上表面接« H 分離T’且第盖I二細冓件642與第一搞接構件641 板s卜矣向下移動。再者，當喷嘴73與基 =上|面，且第二输構件⑷與第一搞接構件641分 上= 2可藉由第—驅動單元81的操作而向 。於此，在弟三支撐構件63停止的狀態下，第二支 牙構件62可能向上移動，直到第二_構件⑽藉由第二 201119749 支撐構件62 的向上移動而與第一支撐構件641接 觸 感測基板8上碗觸時，雷射位移 器？！停止時^ 上或向下移動。當雷射位移感測 73域;fe s k 向上或向下移動4者，當噴嘴 71 ;上或4:觸::嘴:3 :止時，，位移感測器 動單元82在噴嘴73不盘田其:田驅動單兀81及第二驅 作時，雷射不與基板S上表面接觸的狀態下同時操 71可在喷嘴73停止雜態下向上或 2方向。，或雷射位移感測器71與喷嘴73可同時移動於相 同時’位置量測單元9〇提供於第二支撐構件幻與第三 標構件63之間’以量測第二支撐構件62與第三支撐構件 63之間於Ζ軸方向的相對位置。位置量測單元％可包含提 供於第二支撐構件62的參考部91，以及偵測參考部91於ζ ，方向的位置的制部92。此類位置量測單元9 〇利用參考 °p 91與感測部92間的互動，量測第二支標構件62與第三 支撐構件63之間於ζ軸方向的相對位置。 根據本發明範例的位置量測單元9〇中，參考部91可包 含具有尺規的量測儀器，而感測部92可包含補捉尺規影像 的相機。於此案例中，參考部91與感測部92間的相對位置 可基於相機所捕捉的尺規影像來量測。 根據本發明另一範例的位置量測單元90中，參考部91 可包含根據位置具有不同反射角的反射表面，而感測部92 可包含接收自反射表面反射之光的光接收感測器。於此案例 201119749 中，光接收❹接收自額外光源發射且自反射表面反射的 光，而量測參考部91與感測部92間的相對位置。 同時’根據本發明實施例，參考部91提供於第二支撐 構件62而感測部92提供於第三支樓構件ό3。然而，本發 的組態。亦即’參考部91可提供於第三支撐 構件63而感測部92可提供於第二支撐構件62。 置構件62與第三支樓構件63間的相對位 ^參考4 91與感測部92間的相對位置發生變化。假 Γ一 雷射轉制1171之間在z輛方向的間隙 =„器71與基板S之間的間 隙表不為參考符號L，而喷嘴73的排出孔與 間隙表示為參考符號G，滿足方程、 曰的 假設參考部W的特定位置為雯^ 。參考圖3， 雷射位銘片制m 為零 而嘴嘴73的排出孔與 to 了游動距雜H ai β 撕於第二切構件62向上移動 了移動距離H時，得到方程式，，Ν = Ν 動 73的排出孔與基板s之間_隙G ’ ^The third subscript member 63 and the second subscript member 62 ® 'but the nozzle 73 are connected to the upper surface of the substrate s «H is separated from T' and the first cover member 642 and the first engagement member 641 are s矣 Move down. Further, when the nozzle 73 and the base = upper surface, and the second transmission member (4) and the first engagement member 641 are divided by 2, the operation can be performed by the operation of the first driving unit 81. Here, in a state where the third support member 63 is stopped, the second dental member 62 may move upward until the second member (10) is in contact with the first support member 641 by the upward movement of the second 201119749 support member 62. When measuring the bowl on the substrate 8, touch the laser displacement device? ! When stopped, move up or down. When the laser displacement sensing 73 field; fe sk moves up or down 4, when the nozzle 71; or 4: touch:: mouth: 3: stop, the displacement sensor moving unit 82 does not disk at the nozzle 73 Tian Qi: When the field drive unit 81 and the second drive are made, the simultaneous operation 71 in the state where the laser is not in contact with the upper surface of the substrate S can stop the nozzle 73 in the up state or the 2 directions. , or the laser displacement sensor 71 and the nozzle 73 can be simultaneously moved at the same time, the position measuring unit 9 is provided between the second supporting member and the third target member 63 to measure the second supporting member 62 and The relative position between the third support members 63 in the z-axis direction. The position measuring unit % may include a reference portion 91 provided to the second support member 62, and a portion 92 for detecting the position of the reference portion 91 at the ζ direction. The position measuring unit 9 量 measures the relative position between the second sub-member 62 and the third support member 63 in the z-axis direction by the interaction between the reference °p 91 and the sensing portion 92. In the position measuring unit 9A according to an example of the present invention, the reference portion 91 may include a measuring instrument having a ruler, and the sensing portion 92 may include a camera that captures a ruler image. In this case, the relative position between the reference portion 91 and the sensing portion 92 can be measured based on the ruler image captured by the camera. In the position measuring unit 90 according to another example of the present invention, the reference portion 91 may include a reflective surface having different reflection angles depending on the position, and the sensing portion 92 may include a light receiving sensor that receives light reflected from the reflective surface. In this case 201119749, the light receiving unit receives the light emitted from the additional light source and reflected from the reflecting surface, and measures the relative position between the reference portion 91 and the sensing portion 92. Meanwhile, according to the embodiment of the present invention, the reference portion 91 is provided to the second support member 62 and the sensing portion 92 is provided to the third branch member ό3. However, the configuration of this is. That is, the reference portion 91 can be provided to the third support member 63 and the sensing portion 92 can be provided to the second support member 62. The relative position between the member 62 and the third branch member 63 is changed by the relative position between the reference 4 91 and the sensing portion 92. The gap between the laser-transformed 1171 in the z-direction direction = the gap between the device 71 and the substrate S is not referred to as the reference symbol L, and the discharge hole and the gap of the nozzle 73 are represented by the reference symbol G, satisfying the equation, The specific position of the hypothetical reference portion W is 雯^. Referring to Fig. 3, the laser position m is zero and the discharge hole of the nozzle 73 is torn away from the second cutting member 62. When the moving distance H is moved upward, the equation is obtained, Ν = the gap between the discharge hole of the 73 and the substrate s _ gap G ' ^
-Η)"。再者，若第三支撐構件 ^式G = WNO =移動了 _㈣時，得_式”Νί向 噴嘴73的排出孔與基板3之間的 ’ (ΝΟ + Η)，，。如此-來，在改 兩足方私式G = L- 間之相對位置的案例中，可===， 先量射^73與雷麻移_ n 71 _間隙。=：點0預 位置感測單元90量測的嗔嘴73相對於你者’利用 的位置，以及利用雷射位移_器71 4=立 ==71 器71與基板S之間的間隙，來量測喷二=:= 201119749 s之間的間隙G。 於後，將說明根據本發明控制塗膠機的方法。 ^圖4所示，當基板s放置於平台3()上時，因為基板 S固^特性或平台3()上表面的形狀，而使基板s上表面 间度並不—致’且於垂直方向變化。於此，當基板S安置 30時’基板S上表面的高度可能為平台3()之上表面 Πΐ表面的高度。選替地’基板3上表面的高度可能 為預疋參考點到基板S上表面的高度。 —2依據每個部分制基板s上表面的高度，如圖4所 3 ’ j s上表面的高度與高度變化可能隨著每個部分改 變。右在基板S的規則間隔的點A、B、c、D、及E，量測 的高度MU、及6’則可針對各部分量 ΐ ϋί 高度變化及顯示高度變化的梯度。舉例而 Λ土板s上表面的高度在沾部分從高度·到高度 及顧以其广部分之基板s上表面的高度變化等於b-a，以 基板S上表面之高度變化的梯度等於㈣/(B A)。再 度d，戶m板面的高度在CD部分從高度c增加到高 又 。卩分之基板s上表面的高度變化等於 顯，板S上表面之高度變化的梯度等_·=。 如此一來，量測在各規則間隔部分之_ s ⑽利崎量_高絲制在各料之n 咼度變化。參考圖4,可知上表面的 分是AB邱八Ξ l 表面尚度變化最小的部 刀基上表面高度變化最大的部分是CD =。再者’芩考圖4 ’可知在AB部分 度變化的梯度（由方程式(b•推A)表示)為最小， 201119749 部分基板s上表_高度變化的梯度(由方程式㈣心 表示)為最大。於此方式，可藉由比較各部分之基板s， 變化，而找到基板s上表面之高度變化的梯度為最 假設基板S或付73水平祕來塗佈料速 的，當相較於在基板S上表面有較小高度變化的部分 73的垂直移動在基板s上表面有較大高度變化的部分必 更快速地執行，錢基板S與噴嘴73社間_持一致:、 2明控制塗膠機之方法根據基板s上表面的高度變 化，來最佳化控制喷嘴73的垂直移動。 參考圖4及圖5說明根據本發明第-實施例控制塗膠機 之方法。於本發明第一實施例中，說明基於各部分中基板s 上表面的高度，來控制第一驅動單元81第 "· 而垂直移動喷嘴73的方法。 ^〇82 如圖5所示，於根據本㈣第—實關控缝膠機的方 忒中，首先，於步驟SU，量測安置於平台3〇之美 表面的高度。 土傲上 為了量測基板S上表面的高度，可使用裝設於頭 〇的雷射位移感測器7卜.除了雷射位移感測器71 其他機電裝置。 可在基板s的整個上表面量測基板s上表面的高度。選 土 ，可僅在基板s要實際塗佈膠的部分執行高度的量測， 13 201119749 即指噴嘴73移動排出膠的部分。 可將關於基板S上表面的高度的量測資料輸入控制單 元。因此，㈣單元_所4_基板s上表面的高度資料 來控制第一驅動單元81及第二驅動單元82。 當已量測了基板S上表面的高度時，控制單元基於所量 測的基板S上表面的高度資料，計算基板8上表面的高度變 化及各部分中高度變化的梯度。將個別部分的變化及梯度彼 此比較’而將這些部分劃分成顯示基板s上表面之高度&化 之梯度麟^於韻參考值之料(例如基板上表面具有 相對較小之高度變化的部分，如圖4的八3或3(：部分），以 及顯示基板S上表面之高度變化之梯度絕對值大於預設參 考值之部分(例如基板上表面具有相對較大之高度變化的部 分，如圖4的CD或DE部分）。關於此點，於步驟S12，將 顯示基板S上表面之高度變化之梯度絕對值小於預設參考 值之部分，設定為個別驅動部分(AB及Bc部分），其中僅個 別地驅動第一驅動單元81，而將顯示基板s上表面之高度 變化之梯度絕對值大於預設參考值之部分，設定為同步驅& 部分(AB及BC部分）’其中第一驅動單元81及第二驅動單 元82皆必須同時驅動。 *換言之，在基板S上表面之高度變化不大的部分，即使 僅藉由第一驅動單元81來調整喷嘴73的垂直位置，仍可使 基板S上表面與噴嘴73間的間隙維持一致，而設定為個別 驅動部分A且於其中僅個別地驅動第一驅動單元81。同時， 在基板S上表面之高度變化很大的部分，僅藉由第一驅動單 元81來調整喷嘴73的垂直位置，很難使基板s上表面與噴 m 14 201119749 嘴73間的間隙維持一致， 且於其中同時_，單 :上所述，當設定了個別驅動部分(A 步驅動部分(CD或DE部分），移動噴嘴73到美板^的塗^ =點SP ’之後開始排出膠。於步驟阳，當土喷嘴73移動 j水平方向時，在_驅動部分中僅驅 妓，而在同步驅動部分中同時驅動 ㈣早凡及第一驅動單元82來調整喷嘴73的垂直 位置，以及塗佈膠到基板 ，據本發㈣-實施例㈣塗膠機之方法量測安置於 矣之基板S上表面的高度，基於所量_基板 ^面的南度’將膠塗佈部分劃分成僅驅動第一驅動單元8i ΐ個別驅動部分以及同時驅動第—驅動單元81及第二驅動 =82的同步驅動部分，以及執行膠塗佈操作。因此，於 3本發明第-實施例控制塗膠機之方法中，在顯示基板§ „表面之*度變化的梯度太大，而不能僅藉由驅動第-驅動 早疋81來使基板S與噴嘴73間維持一致間隙的部分，同時 第-驅動單元81及第二驅動單元82,因此在整個膠塗 佈部分可維持基板S與喷嘴73 _間隙為一致。 於後’將參考圖6及圖7說明根據本發明第二實施例控 制塗膠機之方法。根據本發明第二實施例，設定喷嘴73在 塗佈起始點(膠塗佈操作開始的點)於垂直方向(z 軸方向）之 初始位置1P ’以適當地應付基板S上表面的高度變化很大 的部分。 201119749 如圖6所示’根據本發明第二實施例，首先，於步驟 ^ ’量測安置於平台30之基板s上表面的高度 。於此，可 土板S的整個上表面量測基板3上表面的高度。選替地， 可僅在基板S要實際塗佈膠的部分執行高度的量測。 …於驟S22，當已量測了基板8上表面的高度時，控制 單元计算基板S上表面的高度的平均值M。 再者，於步驟S23，利用基板s上表面的高度的平均值 Μ，將噴嘴73於垂直方向的初始位置Ιρ，設定在基板s上 開始塗佈操作之塗佈起始點SP。 於步驟24 ’喷嘴73位在設定於塗佈起始點sp之初始 位置IP，以及相對於基板S調整喷嘴73的位置時，塗佈膠 到基板S上。 如上所述，根據本發明第二實施例控制塗膠機之方法量 測安置於平台30上之基板S上表面的高度，計算基板s上 表面之高度的平均值M’以及利用計算的基板S上表面的高 度平均值M，來設定喷嘴73在塗佈起始點SP於垂直方向(Z 轴方向）的初始位置IP，因而在整個塗佈操作部分使基板S 與噴嘴73間的間隙維持一致，就此應付基板S上表面的高 度變化。 本發明實施例所述之技術精神可獨立地或彼此結合地 實施。亦即，根據本發明另一實施例，控制塗膠機的方法如 第二實施例一般設定喷嘴73於垂直方向(Z軸方向）的初始位 置IP，以及如第一實施例一般根據個別驅動部分或同步驅動 16 201119749 口P/7 ’來驅動第一驅動單元81及/或第二驅動單元 82，因而 調整嗔73於垂直方向的位置。 【圖式簡單說明】 本發明上述及其他的目的、特徵、以及優點，結合伴隨 圖式與詳細說明將更易了解，其中： 圖1為顯示根據本發明之塗膠機之透視圖； 圖2為顯示圖1之塗膠機之頭單元之示意圖； 圖3為顯示圖2之頭單元之位置量測單元之示意圖； 一圖4為顯示圖1之塗膠機中安置於平台之基板之上表面 高度變化範例之示意圖； 圖5為顯示根據本發明第一實施例控制塗膠機之方法 之流程圖； 圖6為顯示根據本發明第二實施例控制塗膠機之方法 之流程圖；以及 —圖7為根據本發明第二實施例控制塗膠機之方法中，根 據安置於平台之基板上表面高度，在基板之塗佈起始點 噴嘴初始位置之示意圖。 【主要元件符號說明】 10框架 20桌台 30平台 40支撐移動導引件 5〇頭支撐件 201119749 60頭單元 61第一支撐構件 62第二支撐構件 63第三支撐構件 64耦接器 71雷射位移感測器 72注射器 73喷嘴 74連通管 81第一驅動單元 82第二驅動單元 90位置量測單元 91參考部 92感測部 641第一耦接構件 642第二耦接構件 811第一驅動馬達 812第一驅動軸 821第二驅動馬達 822第二驅動轴 G喷嘴排出孔與基板間的間隙 Η距離 IP初始位置 L雷射位移感測器與基板間的間隙 Μ高度的平均值 Ν喷嘴排出孔與雷射位移感測器間的間隙 Ο零點 S基板 m 18 201119749 sp塗佈起始點 S11，S12，S13，S21，S22，S23，S24 步驟 19-Η)". Furthermore, if the third supporting member G = WNO = moved _ (four), the _ Ν " Ν 向 向 向 向 向 向 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴In the case of changing the relative position between the two-legged private G = L-, you can ===, first measure ^73 and thunder shift _ n 71 _ gap. =: point 0 pre-position sensing unit 90 Measure the position of the nozzle 73 relative to you, and use the laser displacement _ 71 4 = vertical == 71 between the 71 and the substrate S to measure the spray two =: = 201119749 s Gap G. Hereinafter, a method of controlling the applicator according to the present invention will be explained. ^ As shown in FIG. 4, when the substrate s is placed on the stage 3 (), the substrate S is fixed or the upper surface of the platform 3 () The shape of the upper surface of the substrate s does not change and changes in the vertical direction. Here, when the substrate S is disposed 30, the height of the upper surface of the substrate S may be the surface of the surface above the platform 3 () Height. Alternatively, the height of the upper surface of the substrate 3 may be the height from the reference point to the upper surface of the substrate S. 2 According to the height of the upper surface of each partial substrate s, as shown in Fig. 4, 3 ' j The height and height variations of the upper surface of s may vary with each part. Right at the regularly spaced points A, B, c, D, and E of the substrate S, the measured heights MU, and 6' may be for each part. ΐ ϋ Height change and display gradient of height change. For example, the height of the upper surface of the alumina board s varies from height to height and the height of the upper surface of the substrate s with a wide portion thereof equal to ba, to the substrate S The gradient of the height change of the upper surface is equal to (4) / (BA). Once again, the height of the surface of the board is increased from the height c to the height of the CD portion. The height change of the upper surface of the substrate s is equal to the display, on the board S The gradient of the height change of the surface, etc. _·=. In this way, the _ s (10) lisaki amount _ high wire made in each regular interval is measured in the n 咼 degree of each material. Referring to Fig. 4, the upper surface is divided. It is AB Qiu Yaohao. The part with the largest change in the surface of the blade with the smallest surface change is CD =. In addition, '芩图4' shows the gradient of the partial change in AB (by equation (b• push A) ))) is the minimum, 201119749 part of the substrate s on the table _ height gradient (by the side The program (4) is expressed as the largest. In this way, by comparing the substrate s of each part, the change, the gradient of the height change of the upper surface of the substrate s is found to be the most hypothetical substrate S or the 73-level secret coating speed. When the vertical movement of the portion 73 having a small height change on the upper surface of the substrate S has a large height change on the upper surface of the substrate s, the portion of the substrate s must be executed more quickly, and the money substrate S and the nozzle 73 are held together. Consistently, the method of controlling the applicator optimizes the vertical movement of the nozzle 73 according to the change in the height of the upper surface of the substrate s. A method of controlling a glue applicator according to a first embodiment of the present invention will be described with reference to Figs. 4 and 5. In the first embodiment of the present invention, a method of controlling the first driving unit 81 to vertically move the nozzle 73 based on the height of the upper surface of the substrate s in each portion will be described. ^〇82 As shown in Fig. 5, in the section of the (4) first-actual control sewing machine, first, in step SU, the height of the surface of the platform 3 is measured. In order to measure the height of the upper surface of the substrate S, a laser displacement sensor 7 mounted on the head cymbal can be used. In addition to the laser displacement sensor 71, other electromechanical devices. The height of the upper surface of the substrate s can be measured over the entire upper surface of the substrate s. In the soil selection, the height measurement can be performed only on the portion of the substrate s where the glue is actually applied, and 13 201119749 refers to the portion where the nozzle 73 moves the discharged glue. Measurement data on the height of the upper surface of the substrate S can be input to the control unit. Therefore, the first drive unit 81 and the second drive unit 82 are controlled by the height information of the upper surface of the unit _4_substrate s. When the height of the upper surface of the substrate S has been measured, the control unit calculates the height change of the upper surface of the substrate 8 and the gradient of the height variation in each portion based on the measured height data of the upper surface of the substrate S. The individual parts are changed and the gradients are compared with each other' and the parts are divided into the heights of the upper surface of the display substrate s and the gradients of the reference layer (for example, the upper surface of the substrate has a relatively small height variation) , as shown in FIG. 4, the eighth or third (: portion), and the portion of the display substrate S whose height change gradient absolute value is greater than a preset reference value (for example, a portion of the substrate having a relatively large height change, such as (CD or DE part of Fig. 4). In this regard, in step S12, the absolute value of the gradient of the height change of the upper surface of the display substrate S is smaller than the preset reference value, and is set as the individual driving parts (parts AB and Bc). The first driving unit 81 is driven only individually, and the absolute value of the gradient of the height change of the upper surface of the display substrate s is greater than the preset reference value, and is set as the synchronous drive & part (AB and BC part) Both the driving unit 81 and the second driving unit 82 must be driven at the same time. In other words, in the portion where the height of the upper surface of the substrate S does not change, even if the nozzle 73 is adjusted only by the first driving unit 81 In the vertical position, the gap between the upper surface of the substrate S and the nozzle 73 can be maintained to be uniform, and the individual driving portion A is set and the first driving unit 81 is driven only individually. Meanwhile, the height of the upper surface of the substrate S varies greatly. In the large part, only the vertical position of the nozzle 73 is adjusted by the first driving unit 81, and it is difficult to maintain the gap between the upper surface of the substrate s and the nozzle 73 of the sprayed m 14 201119749, and at the same time _, single: As described above, when the individual driving portion (the A-step driving portion (CD or DE portion) is set, the nozzle is moved after the nozzle 73 is moved to the coating point of the US board ^. In the step Yang, when the soil nozzle 73 moves j level In the direction, only the y-drive portion is driven, and in the synchronous drive portion, the fourth drive unit 82 is simultaneously driven to adjust the vertical position of the nozzle 73, and the glue is applied to the substrate, according to the present invention. The method of (4) coating machine measures the height of the upper surface of the substrate S disposed on the substrate, and divides the glue coating portion into only the first driving unit 8i and the individual driving portion based on the south degree of the amount of the substrate Drive the first - The synchronous driving portion of the moving unit 81 and the second driving=82, and performing the glue coating operation. Therefore, in the method of controlling the coating machine according to the third embodiment of the present invention, the surface of the display substrate § „ The gradient is too large, and it is not possible to maintain the portion of the gap between the substrate S and the nozzle 73 by merely driving the first driving 81, while the first driving unit 81 and the second driving unit 82, and thus the entire coating portion. The substrate S can be maintained in the same manner as the nozzle 73. The method of controlling the applicator according to the second embodiment of the present invention will be described with reference to Figs. 6 and 7. According to the second embodiment of the present invention, the setting nozzle 73 is coated. The cloth starting point (the point at which the glue coating operation starts) is at the initial position 1P' in the vertical direction (z-axis direction) to appropriately cope with the portion where the height of the upper surface of the substrate S greatly changes. 201119749 As shown in Fig. 6, according to the second embodiment of the present invention, first, the height of the upper surface of the substrate s disposed on the stage 30 is measured at step ^'. Here, the height of the upper surface of the substrate 3 is measured over the entire upper surface of the soil plate S. Alternatively, the height measurement can be performed only on the portion of the substrate S where the glue is actually applied. At step S22, when the height of the upper surface of the substrate 8 has been measured, the control unit calculates the average value M of the height of the upper surface of the substrate S. Further, in step S23, the initial position Ιρ of the nozzle 73 in the vertical direction is set by the average value 高度 of the height of the upper surface of the substrate s, and the coating start point SP of the coating operation is started on the substrate s. At step 24', the nozzle 73 is placed at the initial position IP set at the coating start point sp, and the position of the nozzle 73 is adjusted with respect to the substrate S, and the glue is applied onto the substrate S. As described above, the method of controlling the applicator according to the second embodiment of the present invention measures the height of the upper surface of the substrate S disposed on the stage 30, calculates the average value M' of the height of the upper surface of the substrate s, and uses the calculated substrate S. The height average value M of the upper surface is used to set the initial position IP of the nozzle 73 in the vertical direction (Z-axis direction) at the coating start point SP, so that the gap between the substrate S and the nozzle 73 is maintained throughout the coating operation portion. In this way, the height change of the upper surface of the substrate S is dealt with. The technical spirit described in the embodiments of the present invention can be implemented independently or in combination with each other. That is, according to another embodiment of the present invention, the method of controlling the applicator generally sets the initial position IP of the nozzle 73 in the vertical direction (Z-axis direction) as in the second embodiment, and generally according to the individual driving portion as in the first embodiment. Alternatively, the drive 16/201119749 port P/7' is driven to drive the first drive unit 81 and/or the second drive unit 82, thereby adjusting the position of the 嗔73 in the vertical direction. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features and advantages of the present invention will become more <RTIgt; FIG. 3 is a schematic view showing the position measuring unit of the head unit of FIG. 1; FIG. 4 is a view showing the top surface of the substrate disposed on the platform of the coating machine of FIG. Figure 5 is a flow chart showing a method of controlling a glue applicator according to a first embodiment of the present invention; Figure 6 is a flow chart showing a method of controlling a glue applicator according to a second embodiment of the present invention; Fig. 7 is a schematic view showing the initial position of the nozzle at the coating start point of the substrate according to the height of the upper surface of the substrate disposed on the platform according to the second embodiment of the present invention. [Main component symbol description] 10 frame 20 table 30 platform 40 support moving guide 5 head support 201119749 60 head unit 61 first support member 62 second support member 63 third support member 64 coupler 71 laser Displacement sensor 72 injector 73 nozzle 74 communication tube 81 first drive unit 82 second drive unit 90 position measurement unit 91 reference portion 92 sensing portion 641 first coupling member 642 second coupling member 811 first drive motor 812 first drive shaft 821 second drive motor 822 second drive shaft G nozzle discharge hole and substrate gap Η distance IP initial position L laser displacement sensor and substrate gap Μ height average Ν nozzle discharge hole Clearance between the laser displacement sensor and the zero point S substrate m 18 201119749 sp coating starting point S11, S12, S13, S21, S22, S23, S24 Step 19