JP3758892B2 - Defect correction method and defect correction apparatus - Google Patents

Defect correction method and defect correction apparatus Download PDF

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Publication number
JP3758892B2
JP3758892B2 JP12598499A JP12598499A JP3758892B2 JP 3758892 B2 JP3758892 B2 JP 3758892B2 JP 12598499 A JP12598499 A JP 12598499A JP 12598499 A JP12598499 A JP 12598499A JP 3758892 B2 JP3758892 B2 JP 3758892B2
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Japan
Prior art keywords
correction
needle
auxiliary member
correction liquid
application
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JP2000321996A (en
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茂夫 清水
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NTN Corp
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NTN Corp
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Description

【0001】
【発明の属する技術分野】
この発明は欠陥修正方法および欠陥修正装置に関し、特に、LCD(液晶ディスプレイ),PDP(プラズマディスプレイ),マスクなどの基板のパターン欠陥を修正するような欠陥修正方法および欠陥修正装置に関する。
【0002】
【従来の技術】
LCDやPDPにおけるマスクなどのパターンを作成する際に、エッチング過多や異物の混入により基板のパターンの断線や抜けなどの欠陥が発生することがある。そのような欠陥の修正は、たとえば特開平8−292442号公報に記載された装置により、欠陥箇所にペーストを塗布し、修正することによって行なわれている。
【0003】
【発明が解決しようとする課題】
図6は従来の塗布針部とペーストの状態を示す図である。従来のペースト塗布装置を用いて図6(a)に示すような塗布針21により、2〜3秒のような短い待機時間で塗布を行なえる粘度のペーストを使用した場合、焼成後の膜厚が0.1μm程度となる。ただし、塗布径:70μm,ペースト種類:超微粒子金ペースト,粘度:10000cps4%希釈,焼成時収縮率:約1/10の場合である。
【0004】
この条件で、電極の高さが高い基板(電極高さ2μm,幅70μm)の修正を行なうと、焼成時に電極とペーストとの間に亀裂が入ってしまう。
【0005】
これを解決するには、塗布膜厚を高くする必要がある。膜厚を高くする方法としては、ペーストの粘度を上げる方法があるが、従来のペースト塗布装置を用いた場合、図6(a)に示すような塗布針21に図6(b)に示すようにペースト22を付着させた後、図6(c)に示すように塗布面に塗布すると、図6(d)に示すように必要以上の量のペーストが塗布されてしまう。
【0006】
そこで、図6(b)に示すように塗布針21にペーストを付着させた後、一定時間その状態を保持すると塗布針21の表面張力によりペースト22が上方に引き上げられ、図6(e)に示すように、塗布針21の先端部分がペースト22から突き出た状態になる。この状態で図6(f)に示すように塗布針21を塗布面に当接すると、図6(g)に示すように塗布針21の先端部分に付着しているペーストが塗布されるので、良好な結果が得られる。
【0007】
しかし、この方法では、図6(e)に示すように塗布可能状態になるまでの待機時間が長くなったり、安定した塗布が困難になる場合がある。
【0008】
それゆえに、この発明の主たる目的は、修正液の塗布時間の短縮化を図ることが可能な欠陥修正方法および欠陥修正装置を提供することである。
【0009】
【課題を解決するための手段】
この発明に係る欠陥修正方法は、その先端の形状が平坦に形成された塗布を用いて基板上のパターンの欠陥部に修正液を塗布し、欠陥部を修正する欠陥修正方法において、塗布針の近傍でその針に沿ってその針の長さ方向に補助部材を相対移動可能に設け、塗布針の先端部と補助部材との間に修正液を供給して修正液溜まりを形成した後、補助部材を修正液溜まりとともに塗布針の基端側に相対移動させて修正液溜まりから塗布針の先端を露出させ、塗布針の先端に付着した修正液を欠陥部に塗布し、補助部材を修正液溜まりとともに塗布針の先端側に相対移動させて修正液溜まりを塗布針の先端に接触させるステップを繰り返すことにより、修正液を連続して塗布させるようにしたものである。
【0010】
好ましくは、塗布針と補助部材とが下降し、その補助部材が固定部材に当接することにより、塗布針の基端側に補助部材が相対移動する。
【0011】
また、この発明に係る欠陥修正装置は、基板上のパターンの欠陥部に修正液を塗布して修正する欠陥修正装置であって、板が載置され、水平方向に移動可能なXYテーブルと、XYテーブルに載置された基板上の欠陥部に修正液を塗布するための修正液塗布機構と、修正液塗布機構を上下方向に移動可能なZテーブルを備え、修正液塗布機構は、その先端に平坦部を有する塗布針と、塗布針の近傍でその針に沿って上下に相対移動可能に設けられた補助部材と、塗布針の先端部と補助部材との間に修正液を供給して修正液溜まりを形成する修正液供給手段と、補助部材を修正液溜まりとともに上側に相対移動させて修正液溜まりから塗布針の平坦部を露出させ、露出した平坦部に付着した修正液が欠陥部に塗布された後に、補助部材を修正液溜まりとともに下側に相対移動させて修正液溜まりを塗布針の平坦部に接触させ、その平坦部に修正液を供給する駆動手段を含むものである。
【0012】
好ましくは、駆動手段は、塗布針を装着した位置決めアクチュエータと、そのアクチュエータに対してスライド自在に取付けられ、補助部材を装着したスライド部と、スライド部が当接しその位置決めをするストッパとを含む。
【0013】
また好ましくは、補助部材は板状である。
【0014】
【発明の実施の形態】
図1はこの発明の一実施形態の全体の構成を示す図であり、図2はペースト塗布機構を示す図であり、図3は塗布針部を示す図である。
【0015】
図1において、修正装置を大きく分類すると、ペースト焼成用レーザ部を含む観察用の光学系1と、導電性ペーストあるいは欠陥修正用インクを塗布する針を含むペースト塗布機構部2と、装置機構部の動作を制御する制御用コンピュータ3と、その上にワークを搭載するXYテーブル4と、XYテーブル4上でワークを保持するチャック台5と、光学系1やペースト塗布機構部2を上下に駆動するZ軸テーブル6とモニタ7などが設けられている。
【0016】
ペースト塗布機構部2は図2に示すように構成されており、位置決めアクチュエータ15とモータ30は図1のZ軸テーブル6とともに上下に移動するように取付けられている。位置決めアクチュエータ15の先端部には塗布針部8が取付けられている。また、Z軸テーブル6には図3に示すように位置決めアクチュエータ15に対してスライド自在にスライド部19が取付けられており、このスライド部19には塗布針17の近傍で、この塗布針17に沿って移動可能であって、ペーストの付着状態を調整するための補助部材として針または板18が取付けられている。さらに、スライド部19が当接し、その位置決めをするためのストッパ16が位置決めアクチュエータ15に取付けられている。
【0017】
モータ30は回転円板10を回転駆動する。回転円板10はその一部に切欠き部9を含むとともに、複数のインクタンク11〜14が搭載されている。これらのインクタンク11〜14にはそれぞれ塗布用ペーストや洗浄剤などが入れられている。
【0018】
図4は塗布針部の動作を説明するための図であり、図5はこの発明の一実施形態による塗布針部とペーストの状態を示す図である。
【0019】
次に、図1〜図5を参照して、この発明の一実施形態の具体的な動作について説明する。まず、図示しない表示基板をチャック台5に取付けてXYテーブル4上に載置する。パターンが欠けるいわゆるオープン欠陥の修正では、XYテーブル4を駆動し、欠陥の位置までペースト塗布機構部2を移動し、回転円板10にてペーストタンク11〜14を回転させ、適切なタンクを選択した後、図4(a)に示す状態で塗布用位置決めアクチュエータ15を上下して塗布針部8にペーストを供給する。このとき、針17と18には、図5(b)に示すようにペーストが付着している。
【0020】
次に、塗布用位置決めアクチュエータ15を下げ、図4(b)に示すように針18をストッパ16に突き当てて上に移動し、それにより針17の先端付近のペーストを上に引き上げ、図5(c)に示すように塗布可能な状態にし、Z軸テーブル6を下げて修正位置でペーストの塗布を行なう。
【0021】
さらに、位置決めアクチュエータ15を上げることにより、針18を相対的に下げ、針17先端に図5(b)に示すようにペーストを供給した後、位置決めアクチュエータ15を下げ、針18をストッパ16に突き当て、上に相対的に移動することにより図5(c)に示すように再度塗布可能な状態にする。これにより、ペーストタンクにペーストを補給しに行くことなく、数回〜数十回の連続塗布を行なうことができる。ただし、その連続回数はペースト粘度と針18の形状やスライド部19の角度などによって変化する。
【0022】
上述のごとく、この実施形態によれば、塗布針17に沿って補助機構としての針18を上下に移動することによって、ペーストを補給するために針17をペーストタンクまで移動させる必要がなくなり、数回〜数十回の連続塗布を行なうことができ、塗布時間の短縮を図ることができる。しかも、高粘度ペーストを使用することにより、塗布の膜厚を厚くすることができる。
【0023】
なお、今回開示された実施の形態は全ての点で例示であって、制限的なものではないと考えられるべきである。本発明の範囲は上記した説明ではなくて特許請求の範囲によって示され、特許請求の範囲と均等の意味および範囲内でのすべての変更が含まれることが意図される。
【0024】
【発明の効果】
以上のように、この発明によれば、先端の形状が平坦に形成された塗布針の近傍で針に沿って補助部材を上下に相対移動させ、修正液を連続して塗布するようにしたので、修正液補給のために針を修正液タンクまで移動させる必要がなくなり、数回〜数十回の連続塗布を行なうことができ、塗布時間の短縮が図れるばかりでなく、高粘度修正液を使用することにより、塗布の膜厚を厚くすることができる。
【図面の簡単な説明】
【図1】この発明の一実施形態の全体の構成を示す図である。
【図2】ペースト塗布機構を示す図である。
【図3】塗布針部を示す図である。
【図4】塗布針部の動作を説明するための図である。
【図5】この発明の一実施形態による塗布針部とペーストの状態を示す図である。
【図6】従来の塗布針部とペーストの状態を示す図である。
【符号の説明】
1 光学系
2 ペースト塗布機構部
3 制御用コンピュータ
4 XYテーブル
5 チャック台
6 Z軸テーブル
7 モニタ
8 塗布針部
9 切欠き部
10 回転円板
11〜14 ペーストタンク
15 位置決めアクチュエータ
16 ストッパ
17,18 針
19 スライド部
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a defect correction method and a defect correction apparatus, and more particularly to a defect correction method and a defect correction apparatus for correcting pattern defects on a substrate such as an LCD (liquid crystal display), a PDP (plasma display), and a mask.
[0002]
[Prior art]
When a pattern such as a mask in an LCD or PDP is created, defects such as disconnection or omission of the substrate pattern may occur due to excessive etching or contamination with foreign matter. Such a defect is corrected by, for example, applying a paste to the defective portion and correcting the defect with an apparatus described in Japanese Patent Application Laid-Open No. 8-292442.
[0003]
[Problems to be solved by the invention]
FIG. 6 is a view showing a state of a conventional application needle portion and paste. When a paste having a viscosity that can be applied in a short standby time such as 2 to 3 seconds with a coating needle 21 as shown in FIG. Is about 0.1 μm. However, the application diameter is 70 μm, the paste type is an ultrafine gold paste, the viscosity is 10000 cps 4% dilution, and the shrinkage during firing is about 1/10.
[0004]
If a substrate with a high electrode height (electrode height 2 μm, width 70 μm) is corrected under these conditions, a crack will be formed between the electrode and the paste during firing.
[0005]
In order to solve this, it is necessary to increase the coating film thickness. As a method of increasing the film thickness, there is a method of increasing the viscosity of the paste. However, when a conventional paste coating apparatus is used, a coating needle 21 as shown in FIG. After the paste 22 is adhered to the surface, if it is applied to the application surface as shown in FIG. 6C, an excessive amount of paste is applied as shown in FIG. 6D.
[0006]
Therefore, as shown in FIG. 6B, after the paste is attached to the application needle 21, if the state is maintained for a certain time, the paste 22 is pulled upward by the surface tension of the application needle 21, and the state shown in FIG. As shown, the tip of the application needle 21 protrudes from the paste 22. When the application needle 21 is brought into contact with the application surface as shown in FIG. 6 (f) in this state, the paste adhering to the tip portion of the application needle 21 is applied as shown in FIG. 6 (g). Good results are obtained.
[0007]
However, in this method, as shown in FIG. 6 (e), there may be a case where a standby time until it becomes ready for application becomes long or stable application becomes difficult.
[0008]
Another object of the present invention is to provide a defect correction method and defect correction device capable FIG Rukoto to shorten the application time of the correction fluid.
[0009]
[Means for Solving the Problems]
The defect correction method according to the present invention is a defect correction method in which a correction liquid is applied to a defect portion of a pattern on a substrate using an application needle having a flat tip shape , and the defect correction method corrects the defect portion. near by movable its needle the relative longitudinal to the auxiliary member along the needle, after forming the reservoir correction fluid by supplying correction fluid between the tip of coating the needle with the auxiliary member The auxiliary member is moved relative to the base end side of the application needle together with the correction liquid reservoir so that the tip of the application needle is exposed from the correction liquid reservoir, the correction liquid adhering to the tip of the application needle is applied to the defective portion, and the auxiliary member is The correction liquid is continuously applied by repeating the step of moving the correction liquid pool relative to the distal end side of the application needle together with the correction liquid reservoir and bringing the correction liquid reservoir into contact with the distal end of the application needle .
[0010]
Preferably , the application needle and the auxiliary member are lowered, and the auxiliary member comes into contact with the fixing member, so that the auxiliary member relatively moves to the proximal end side of the application needle.
[0011]
Further, defect correction device according to the present invention is a defect correction apparatus for correcting by applying a correction fluid to the defective portion of the pattern on the substrate, board is placed, the XY table movable in a horizontal direction includes a correction fluid application mechanism for applying a correction fluid to the defective portion on the substrate placed on the XY table, a Z table movable correction fluid application mechanism in the vertical direction, correction fluid application mechanism, the supplying a coating needle having a flat portion at the distal end, and an auxiliary member provided movable relative to the vertical I along its needle in the vicinity of the coating needles, the correction fluid between the tip of coating the needle with the auxiliary member Then, the correction liquid supply means for forming the correction liquid reservoir and the auxiliary member are relatively moved upward together with the correction liquid reservoir to expose the flat portion of the application needle from the correction liquid reservoir, and the correction liquid attached to the exposed flat portion is Auxiliary members are corrected after being applied to defective parts Reservoir contacting the reservoir correction fluid is relatively moved to the lower side of the flat portion of the coating needle with those comprising a drive means for supplying correction fluid on the flat portion.
[0012]
Preferably, the driving means includes a positioning actuator having the application needle attached thereto, a slide portion attached to the actuator so as to be slidable, and having an auxiliary member attached thereto, and a stopper which comes into contact with the slide portion and positions .
[0013]
Preferably, the auxiliary member has a plate shape.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 is a diagram showing the overall configuration of an embodiment of the present invention, FIG. 2 is a diagram showing a paste application mechanism, and FIG. 3 is a diagram showing an application needle portion.
[0015]
In FIG. 1, the correction device is roughly classified into an observation optical system 1 including a paste firing laser unit, a paste application mechanism unit 2 including a needle for applying a conductive paste or defect correction ink, and an apparatus mechanism unit. The control computer 3 for controlling the operation, the XY table 4 on which the work is mounted, the chuck base 5 for holding the work on the XY table 4, and the optical system 1 and the paste application mechanism unit 2 are driven up and down. A Z-axis table 6 and a monitor 7 are provided.
[0016]
The paste application mechanism 2 is configured as shown in FIG. 2, and the positioning actuator 15 and the motor 30 are attached so as to move up and down together with the Z-axis table 6 of FIG. An application needle portion 8 is attached to the distal end portion of the positioning actuator 15. Further, as shown in FIG. 3, a slide portion 19 is slidably attached to the Z-axis table 6 with respect to the positioning actuator 15, and the slide portion 19 is adjacent to the application needle 17 in the vicinity of the application needle 17. The needle | hook or board 18 is attached as an auxiliary member which can move along and adjusts the adhesion state of a paste. Further, a stopper 16 is attached to the positioning actuator 15 so that the slide portion 19 contacts and is positioned.
[0017]
The motor 30 rotates the rotary disk 10. The rotating disk 10 includes a notch 9 in a part thereof, and a plurality of ink tanks 11 to 14 are mounted thereon. Each of these ink tanks 11 to 14 contains a coating paste, a cleaning agent, and the like.
[0018]
FIG. 4 is a view for explaining the operation of the application needle portion, and FIG. 5 is a view showing the state of the application needle portion and the paste according to one embodiment of the present invention.
[0019]
Next, with reference to FIGS. 1-5, the specific operation | movement of one Embodiment of this invention is demonstrated. First, a display substrate (not shown) is attached to the chuck base 5 and placed on the XY table 4. To correct a so-called open defect that lacks a pattern, the XY table 4 is driven, the paste application mechanism 2 is moved to the position of the defect, the paste tanks 11 to 14 are rotated by the rotating disk 10, and an appropriate tank is selected. Thereafter, the coating positioning actuator 15 is moved up and down in the state shown in FIG. At this time, the paste is adhered to the needles 17 and 18 as shown in FIG.
[0020]
Next, the application positioning actuator 15 is lowered, and the needle 18 is brought into contact with the stopper 16 and moved upward as shown in FIG. 4B, whereby the paste in the vicinity of the tip of the needle 17 is pulled up. As shown in (c), the coating is made possible and the Z-axis table 6 is lowered to apply the paste at the correction position.
[0021]
Further, by raising the positioning actuator 15, the needle 18 is relatively lowered and the paste is supplied to the tip of the needle 17 as shown in FIG. 5B, and then the positioning actuator 15 is lowered and the needle 18 is pushed against the stopper 16. By making the contact and move relatively upward, as shown in FIG. Thereby, continuous application | coating of several times-dozens of times can be performed, without going to replenish a paste to a paste tank. However, the continuous number of times varies depending on the paste viscosity, the shape of the needle 18, the angle of the slide portion 19, and the like.
[0022]
As described above, according to this embodiment, by moving the needle 18 as an auxiliary mechanism up and down along the application needle 17, it is not necessary to move the needle 17 to the paste tank in order to replenish the paste. It is possible to perform continuous application several times to several tens of times, and shorten the application time. In addition, the coating thickness can be increased by using a high-viscosity paste.
[0023]
It should be understood that the embodiment disclosed this time is illustrative in all respects and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.
[0024]
【The invention's effect】
As described above, according to the present invention, the auxiliary member is relatively moved up and down along the needle in the vicinity of the application needle having a flat tip shape, so that the correction liquid is continuously applied. No need to move the needle to the correction liquid tank for replenishment of correction liquid , continuous application can be performed several times to several tens of times, not only shortening the application time but also using high viscosity correction liquid By doing, the film thickness of application | coating can be thickened.
[Brief description of the drawings]
FIG. 1 is a diagram showing an overall configuration of an embodiment of the present invention.
FIG. 2 is a diagram showing a paste application mechanism.
FIG. 3 is a view showing an application needle portion.
FIG. 4 is a diagram for explaining the operation of an application needle part.
FIG. 5 is a view showing a state of a coating needle part and a paste according to one embodiment of the present invention.
FIG. 6 is a diagram showing a state of a conventional application needle portion and paste.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Optical system 2 Paste application | coating mechanism part 3 Control computer 4 XY table 5 Chuck stand 6 Z-axis table 7 Monitor 8 Coating needle part 9 Notch part 10 Rotating disc 11-14 Paste tank 15 Positioning actuator 16 Stopper 17, 18 Needle 19 Slide part

Claims (5)

その先端の形状が平坦に形成された塗布を用いて基板上のパターンの欠陥部に修正液を塗布し、前記欠陥部を修正する欠陥修正方法において、
前記塗布針の近傍で該針に沿って該針の長さ方向に補助部材を相対移動可能に設け、
前記塗布針の先端部と前記補助部材との間に前記修正液を供給して修正液溜まりを形成した後、
前記補助部材を前記修正液溜まりとともに前記塗布針の基端側に相対移動させて前記修正液溜まりから前記塗布針の先端を露出させ、前記塗布針の先端に付着した修正液を前記欠陥部に塗布し、前記補助部材を前記修正液溜まりとともに前記塗布針の先端側に相対移動させて前記修正液溜まりを前記塗布針の先端に接触させるステップを繰り返すことにより、前記修正液を連続して塗布させるようにしたことを特徴とする、陥修正方法。
In the defect correction method for applying the correction liquid to the defective portion of the pattern on the substrate using the application needle formed with a flat tip shape, and correcting the defective portion ,
Wherein an auxiliary member to be relative movement in the longitudinal direction of the needle along the needle in the vicinity of the coating needles,
After supplying the correction liquid between the tip of the application needle and the auxiliary member to form a correction liquid reservoir,
The auxiliary member is moved relative to the base end side of the application needle together with the correction liquid reservoir to expose the tip of the application needle from the correction liquid reservoir, and the correction liquid adhering to the tip of the application needle is applied to the defect portion. The correction liquid is continuously applied by repeating the step of applying and moving the auxiliary member relative to the tip side of the application needle together with the correction liquid reservoir to bring the correction liquid reservoir into contact with the tip of the application needle. characterized in that so as to, defect correction method.
前記塗布針と前記補助部材とが下降し、該補助部材が固定部材に当接することにより、前記塗布針の基端側に前記補助部材が相対移動することを特徴とする、請求項1に記載の陥修正方法。The said application member and the said auxiliary member descend | fall, and when this auxiliary member contact | abuts to a fixed member , the said auxiliary member moves relatively to the base end side of the said application needle , It is characterized by the above-mentioned. defect correction method. 基板上のパターンの欠陥部に修正液を塗布して修正する欠陥修正装置であって、
前記板が載置され、水平方向に移動可能なXYテーブル、
前記XYテーブルに載置された基板上の前記欠陥部に前記修正液を塗布するための修正液塗布機構、および
前記修正液塗布機構を上下方向に移動可能なZテーブルを備え
前記修正液塗布機構は、
その先端に平坦部を有する塗布針、
前記塗布針の近傍で該に沿って上下に相対移動可能に設けられた補助部材
前記塗布針の先端部と前記補助部材との間に前記修正液を供給して修正液溜まりを形成する修正液供給手段、および
前記補助部材を前記修正液溜まりとともに上側に相対移動させて前記修正液溜まりから前記塗布針の前記平坦部を露出させ、露出した前記平坦部に付着した修正液が前記欠陥部に塗布された後に、前記補助部材を前記修正液溜まりとともに下側に相対移動させて前記修正液溜まりを前記塗布針の前記平坦部に接触させ、該平坦部に前記修正液を供給する駆動手段を含むことを特徴とする、陥修正装置。
A defect correction apparatus for applying and correcting a correction liquid on a defective portion of a pattern on a substrate ,
The board is placed, XY table movable in a horizontal direction,
Wherein comprising a Z table movable correction fluid application mechanism, and the correction fluid coating mechanism in the vertical direction for applying the correction fluid to said defective portion on the substrate placed to the XY table,
The correction fluid application mechanism is
An applicator needle having a flat portion at its tip,
Auxiliary member which is relatively movable vertically me along the said needle in the vicinity of the coating needle,
A correction liquid supply means for supplying a correction liquid between the tip of the application needle and the auxiliary member to form a correction liquid reservoir; and
After the auxiliary member is relatively moved together with the correction liquid reservoir to expose the flat portion of the application needle from the correction liquid reservoir, and the correction liquid adhering to the exposed flat portion is applied to the defective portion Drive means for supplying the correction liquid to the flat portion by moving the auxiliary member together with the correction liquid reservoir downward to bring the correction liquid reservoir into contact with the flat portion of the application needle. to, defect correction device.
前記駆動手段は、
前記塗布針を装着した位置決めアクチュエータと、
前記アクチュエータに対してスライド自在に取付けられ、前記補助部材を装着したスライド部と、
前記スライド部が当接し、その位置決めをするストッパとを含むことを特徴とする、請求項3に記載の陥修正装置。
The driving means includes
A positioning actuator equipped with the application needle;
A slide part attached slidably to the actuator and fitted with the auxiliary member;
The slide portion comes into contact, characterized in that it comprises a stopper for the positioning, defect correction device according to claim 3.
前記補助部材は板状であることを特徴とする、請求項4に記載の陥修正装置。It said auxiliary member is characterized by a plate-like, defect correction device according to claim 4.
JP12598499A 1999-05-06 1999-05-06 Defect correction method and defect correction apparatus Expired - Lifetime JP3758892B2 (en)

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