JP2010224338A - Device and method for manufacturing sealing structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing device of sealing structure which can prevent peeling and facilitate cutting. <P>SOLUTION: The manufacturing device 1 of the sealing structure is provided with: a discharge head 4 which discharges a frit material F to a substrate K; moving mechanisms 3, 5 which relatively move the substrate K and the discharge head 4; and a control unit 7 which controls the discharge head 4 and the moving mechanisms 3, 5 so that the frit material F is applied on the substrate K in the frame shape of a closed loop, wherein the control unit 7 stops discharge of the frit material F, makes the discharge head 4 from which the discharge of the frit material F is stopped face an area between the closed loop in the frame shape and a cutting line outside the frame shape on the substrate K, and controls the discharge head 4 and the moving mechanisms 3, 5 so that the discharge head 4 which faces the area is moved in the direction to be separated from the substrate K. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a sealing structure manufacturing apparatus and a sealing structure manufacturing method, and more particularly to a sealing structure manufacturing apparatus and a sealing structure manufacturing method for applying a frit material to an application target.

  2. Description of the Related Art Sealing structure manufacturing apparatuses are used to manufacture various sealing structures such as liquid crystal display devices, organic EL (Electro Luminescence) display devices, and electron emission display devices. The manufacturing apparatus includes a discharge head that discharges a sealing material (sealing material) to an application target, and the sealing material is placed on the application target while relatively moving the discharge head and the application target. Application is performed, and a predetermined application pattern (seal pattern) is drawn.

  For example, when manufacturing a sealing structure by bonding two substrates together, the manufacturing apparatus applies a sealing material in a rectangular shape so as to surround a predetermined region with respect to one substrate, and the rectangular shape is formed on the substrate. Draw a coating pattern. At this time, since the sealing material applied on the substrate overlaps at the application start position and the application end position, the overlapping seal material may enter the display area when the two substrates are bonded together. In order to prevent this, a technique has been proposed in which application is performed with the application start position and application end position of the sealing material outside the rectangular application pattern (see, for example, Patent Document 1).

  Also, at the application end position, the nozzle of the ejection head is usually raised and retracted, but when the nozzle is raised, a state called stringing occurs due to the viscosity of the frit material, and that part becomes thicker than the others. End up. If the sealing material is sandwiched between the two substrates and crushed when the two substrates are bonded together, there is no problem except that the width of the sealing material at that portion is increased.

JP 2003-43499 A

  However, when performing laser welding at the time of bonding using a frit material such as glass frit paste as a sealing material, the frit material applied on the substrate is baked and does not crush at the time of bonding. When the material is partially thick, stress is concentrated on the thick portion after laser welding, and peeling occurs.

  In addition, if the frit material is present on a cutting line (cutting line) on the outer periphery of the coating pattern, it becomes difficult to cut the substrate, and in some cases, it cannot be cut. Further, a force due to the cutting is applied to the frit material portion, and peeling may occur from the frit material portion.

  The present invention has been made in view of the above, and an object thereof is to provide a sealing structure manufacturing apparatus and a sealing structure manufacturing method capable of preventing peeling and facilitating cutting. It is.

  A first feature according to an embodiment of the present invention is that, in a sealing structure manufacturing apparatus, a discharge head that discharges a frit material to an application target, and a movement that relatively moves the application target and the discharge head And a control means for controlling the discharge head and the moving mechanism so that the frit material is applied in a closed-loop frame shape on the application target. The control means stops the discharge of the frit material and discharges the frit material. The discharge head that has stopped is opposed to the area between the frame-shaped closed loop and the cutting line outside the frame-shaped closed loop in the application object, and the discharge head opposed to the area is separated from the application object. The ejection head and the moving mechanism are controlled so as to be moved.

  A second feature according to the embodiment of the present invention is that, in the manufacturing method of the sealing structure, the application object and the discharge head that discharges the frit material to the application object are relatively moved, and the application object is obtained. A coating process for coating the frit material in a closed loop frame shape. In the coating process, the ejection of the frit material is stopped, and the ejection head in which the discharge of the frit material is stopped is connected to the frame-shaped closed loop and the frame on the coating object. It is to make it face the area | region between the cutting lines outside a closed loop of a shape, and to move the discharge head facing the area | region to the direction spaced apart with respect to a coating target object.

  According to the present invention, it is possible to prevent peeling and facilitate cutting.

It is a perspective view which shows schematic structure of the manufacturing apparatus of the sealing structure which concerns on one Embodiment of this invention. It is explanatory drawing for demonstrating the application | coating operation | movement which the manufacturing apparatus of the sealing structure shown in FIG. 1 performs. It is explanatory drawing which expands and shows a part of FIG. It is sectional drawing for demonstrating the gap of the nozzle of the discharge head with which the manufacturing apparatus of the sealing structure shown in FIG. 1 is provided, and the surface of a board | substrate.

  An embodiment of the present invention will be described with reference to the drawings.

  As shown in FIG. 1, the manufacturing apparatus 1 of the sealing structure body which concerns on embodiment of this invention hold | maintains and moves the stage 2 in which the board | substrate K as a coating target object is mounted. A stage moving mechanism 3; a discharge head 4 that discharges the frit material F to the substrate K on the stage 2; a head moving mechanism 5 that holds and moves the discharge head 4; the stage moving mechanism 3 and the head moving mechanism; 5, and a control unit 7 that controls each part.

  The stage 2 is stacked on the stage moving mechanism 3 and is provided so as to be movable in the X-axis direction and the Y-axis direction (see FIG. 1). The stage 2 is moved in the X-axis direction and the Y-axis direction by the stage moving mechanism 3. A substrate K such as a glass substrate is placed on the placement surface of the stage 2 by its own weight. However, the present invention is not limited to this. For example, a mechanism such as an electrostatic chuck or an adsorption chuck is used to hold the substrate K. May be provided.

  The stage moving mechanism 3 includes a stage X-axis moving mechanism 3a that moves the stage 2 in the X-axis direction, and a stage Y-axis moving mechanism 3b that moves the stage 2 in the Y-axis direction via the stage X-axis moving mechanism 3a. I have.

  The stage X-axis movement mechanism 3a is a movement mechanism that guides and moves the stage 2 in the X-axis direction. This stage X-axis moving mechanism 3 a is provided on the stage Y-axis moving mechanism 3 b and is electrically connected to the control unit 7. As the stage X-axis moving mechanism 3a, for example, a feed screw moving mechanism using a motor as a driving source, a linear motor moving mechanism using a linear motor as a driving source, or the like is used.

  The stage Y-axis moving mechanism 3b is a moving mechanism that guides and moves the stage X-axis moving mechanism 3a in the Y-axis direction. The stage Y-axis moving mechanism 3 b is provided on the gantry 6 and is electrically connected to the control unit 7. As the stage Y-axis moving mechanism 3b, for example, a feed screw moving mechanism using a motor as a driving source, a linear motor moving mechanism using a linear motor as a driving source, or the like is used.

  The discharge head 4 is a dispenser head having a nozzle 4 a for discharging the frit material F. This discharge head 4 discharges the frit material F from the nozzle 4a which is a front-end | tip part with a predetermined pressure. The discharge head 4 is installed with the nozzle 4 a facing the stage 2 and is electrically connected to the control unit 7. A laser displacement meter 8 is fixed in the vicinity of the ejection head 4. The laser displacement meter 8 irradiates the surface of the substrate K on the stage 2 with laser light and measures the separation distance to the surface of the substrate K.

  The head moving mechanism 5 supports a head Z-axis moving mechanism 5a that moves the discharge head 4 in the Z-axis direction (see FIG. 1), and the discharge head 4 so as to be movable in the X-axis direction via the head Z-axis moving mechanism 5a. And a head X-axis moving mechanism 5b that moves along the X-axis direction and a support member 5c that supports the head X-axis moving mechanism 5b.

  The head Z-axis moving mechanism 5 a is a moving mechanism that supports the discharge head 4 and moves the discharge head 4 in the Z-axis direction orthogonal to the mounting surface of the stage 2. As the head Z-axis moving mechanism 5a, for example, a feed screw moving mechanism using a motor as a driving source, a linear motor moving mechanism using a linear motor as a driving source, or the like is used.

  The head X-axis moving mechanism 5b is a moving mechanism that supports the discharge head 4 so as to be movable in the X-axis direction, and moves the discharge head 4 along the X-axis direction, that is, along the support member 5c. As the head X-axis moving mechanism 5b, for example, a feed screw moving mechanism using a motor as a driving source, a linear motor moving mechanism using a linear motor as a driving source, or the like is used.

  The support member 5 c is a portal column that supports the head X-axis moving mechanism 5 b, that is, the ejection head 4. The support member 5 c is positioned so that its extending portion extends along the X-axis direction, and its leg portion is fixed on the upper surface of the gantry 6 and provided on the gantry 6. The head X-axis moving mechanism 5b is provided on the front surface (in FIG. 1) of the extending portion.

  The control unit 7 is provided inside the gantry 6. The control unit 7 includes a control unit such as a microcomputer that centrally controls each unit, and a storage unit that stores application information and various programs related to frit coating. The application information includes information on a predetermined application pattern, a drawing speed (moving speed of the substrate K), and the like.

  The control unit 7 controls the stage moving mechanism 3 and the head moving mechanism 5 based on the application information and various programs, positions the ejection head 4 at the application start position, and then controls the stage movement mechanism 3 and the ejection head 4. The frit material F is applied to the surface of the substrate K while relatively moving the nozzle 4a of the ejection head 4 and the substrate K on the stage 2 along the surface of the substrate K while maintaining a predetermined gap. At this time, the control unit 7 controls the gap between the nozzle 4 a of the ejection head 4 and the surface of the substrate K to be a predetermined gap by performing feedback control based on the separation distance measured by the laser displacement meter 8. ing.

  Next, the application | coating operation | movement which the above-mentioned manufacturing apparatus 1 performs is demonstrated.

  For example, as illustrated in FIG. 2, the manufacturing apparatus 1 applies a frit material F to the substrate K on the stage 2 and continuously draws four rectangular application patterns. For each rectangular application pattern, the manufacturing apparatus 1 linearly applies the frit material F to the substrate K on the stage 2 based on the application information, for example, to draw a rectangular application pattern. Application pattern data relating to this application pattern is stored in the storage unit as part of application information.

  More specifically, first, the control unit 7 controls the stage moving mechanism 3 and the head moving mechanism 5 based on the application information, moves the nozzle 4a of the ejection head 4 to the application start position A1, and the head Z axis moving mechanism 5a. And the ejection head 4 is moved to a position where the gap between the nozzle 4a of the ejection head 4 and the surface of the substrate K becomes a predetermined gap (for example, about several tens of μm) according to the measurement result by the laser displacement meter 8.

  Thereafter, the control unit 7 controls the stage moving mechanism 3 and the ejection head 4 based on the application information, and moves the substrate K on the stage 2 in the X-axis direction and the Y-axis direction with respect to the nozzle 4a of the ejection head 4. However, a discharge operation is performed to discharge the frit material F from the nozzle 4a onto the surface of the substrate K on the stage 2, and the frit material F is applied to the substrate K in a line in a clockwise direction to draw a rectangular application pattern. To do.

  Here, the rectangular application pattern is composed of four linear portions and four corner portions (see FIG. 2). The four corners of this coating pattern are arcuate. This is because the stage moving mechanism 3 is controlled so that the width and thickness of the application line of the frit material F are constant, and the corner portion does not become a right angle.

  Also, as shown in FIGS. 2 and 3, the application start position A1 is at the first linear portion L1 of the rectangular application pattern, and the application end position A2 is a closed loop of the rectangular application pattern and a cut outside the closed loop. It exists in the 1st area | region between the lines S, for example, in the area | region between each cutting line S and the corner part C1 of a coating pattern. The cutting line S is a line provided on the outer periphery of the rectangular coating pattern, and is a line for cutting and dividing the substrate K into a grid pattern for each coating pattern.

  In particular, the application end position A2 is an area included in the first area described above, and includes a first imaginary line La extending from the first straight line portion L1 and a second imaginary line Lb extending from the second straight line portion L2 of the application pattern. It exists in the 2nd area | region enclosed by the corner part C1 which connects those 1st linear part L1 and the 2nd linear part L2.

  The frit material F is linearly applied on the substrate K from the application start position A1 to the application end position A2. The control unit 7 stops the discharge of the frit material F of the discharge head 4 at a timing at which a closed loop of the rectangular coating pattern can be formed, and the discharge head 4 that has stopped discharging the frit material F is moved to the second region on the substrate K. The discharge head 4, the stage moving mechanism 3, and the head moving mechanism are moved so that the discharge head 4 facing the outside of the closed loop is moved in a direction away from the substrate K (for example, upward in FIG. 1). 5 is controlled.

  As a result, the application end position A2 is in the second region on the substrate K. In addition, the nozzle 4a of the ejection head 4 moves in the Y-axis direction (upward in FIG. 3) even after ejection is stopped. Since the frit material F by stringing extends upward in FIG. 3 and is applied onto the substrate K, the application line of the frit material F extending from the discharge stop position (supply stop position) to the application end position A2 is shown in FIG. It gradually becomes thinner toward the inside. At this time, since the supply of the frit material F is stopped, the thickness of the coating line gradually decreases. Accordingly, the application line of the frit material F is formed so as to gradually become thinner and thinner toward the application end position A2 after forming the closed loop of the rectangular application pattern, so that the thickness of the frit material F existing outside the closed loop is It becomes thinner than the frit material F in the closed loop portion that contributes to the joining.

  In this way, the application end position A2 is outside the closed loop of the application pattern, and it is suppressed that the frit material F in the closed loop portion is partially thickened by thread drawing, and the thickness of the frit material F existing outside the closed loop is further reduced. Since it is thinner than the frit material F in the closed loop portion that contributes to joining, it is possible to prevent the stress from being concentrated on a partially thick portion after the sealing by laser welding and causing peeling. Further, since the frit material F does not exist on the cutting line S on the outer periphery of the coating pattern, the substrate K can be easily cut. Further, since the force due to the cutting is not applied to the frit material F portion, it is possible to prevent the frit material F portion from peeling off.

  In particular, since the thickness of the frit material F existing outside the closed loop is thinner than the frit material F in the closed loop portion that contributes to the joining, the substrate K to which the frit material F is applied and the other substrate use the frit material F. When these are bonded together, the substrate K and the other substrate are substantially parallel to each other, so that a bonding failure such as a sealing failure can be suppressed. If the thickness of the frit material F existing outside the closed loop is larger than that of the frit material F in the closed loop portion that contributes to bonding, the substrate K and the other substrate are not parallel, and laser welding becomes difficult. , Bonding failure occurs.

  Here, the discharge stop timing of the frit material F may be any timing at which a closed loop of a rectangular coating pattern can be formed. In addition, after the discharge of the frit material F is stopped, the frit material F by string drawing is stopped. This is the timing at which the cutting line S is not crossed. This timing is experimentally determined and set according to the viscosity of the frit material F, the drawing speed, and the like.

  During such a coating operation, as shown in FIG. 4, the gap G between the nozzle 4a of the ejection head 4 and the surface of the substrate K is kept constant at, for example, about several tens of μm. Move while leveling the surface of the frit material F. Therefore, the cross-sectional shape of the frit material F is trapezoidal, the thickness of the frit material F on the substrate K is constant, and its upper surface is flat. As a result, when the substrate K coated with the frit material F and another substrate are bonded together via the frit material F, the substrate K coated with the frit material F and the other substrate are substantially parallel to each other. Since the contact area between the frit material F on K and the other substrate is larger than the case where the upper surface of the frit material F is not flat, it is possible to suppress a bonding failure such as a sealing failure.

  Finally, the substrate K on which the frit material F has been applied is temporarily fired in a firing furnace, the resin contained in the frit material F is blown off, and is further fired and hardened. As a result, the thickness of the frit material F on the substrate K is about ½ of that before firing, but the width is maintained. Thereafter, the substrate K coated with the frit material F and another substrate are joined together via the frit material F, and the frit material F is welded to the other substrate by laser irradiation. Thereby, the board | substrate K and another board | substrate are joined by the frit material F. FIG.

  As described above, according to the embodiment of the present invention, when the application end position A2 is in the second region on the substrate K, the frit material F in the closed loop portion is partially thickened by string drawing. Further, since the thickness of the frit material F existing outside the closed loop is equal to or less than the thickness of the frit material F in the closed loop portion that contributes to the joining, stress is concentrated on a partially thick portion after sealing by laser welding. Thus, peeling is prevented from occurring. Further, since the frit material F does not exist on the cutting line S on the outer periphery of the coating pattern, the substrate K can be easily cut. Further, since the force due to the cutting is not applied to the frit material F portion, it is possible to prevent the frit material F portion from peeling off. Therefore, prevention of peeling and facilitation of cutting can be realized.

  In particular, when the application end position A2 is in the second region on the substrate K, the frit material F does not protrude from the rectangular region formed by extending the four straight portions of the application pattern, so that cutting is performed. The line S can be moved to the coating pattern side, and the cutting line S can be easily changed. In addition, since the separation distance between the cutting line S and the frit material F is sufficient, even if the cutting position is slightly deviated from the cutting line S, it is possible to suppress the force due to the cutting from being applied to the frit material F portion, so that peeling occurs. Can be suppressed more reliably.

  The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the invention. For example, some components may be deleted from all the components shown in the above-described embodiment. Furthermore, you may combine the component covering different embodiment suitably.

  In the above-described embodiment, a rectangular coating pattern is used. However, the present invention is not limited to this. For example, a coating pattern having another shape such as a square or a circle may be used, and the shape is limited. Not. Further, although one ejection head 4 is used, the present invention is not limited to this, and a plurality of ejection heads 4 may be used, and the number is not limited.

  DESCRIPTION OF SYMBOLS 1 ... Manufacturing apparatus of sealing structure, 3 ... Stage moving mechanism (moving mechanism), 4 ... Discharge head, 5 ... Head moving mechanism (moving mechanism), 7 ... Control unit, F ... Frit material, K ... Substrate (coating) Object)

Claims (6)

An ejection head for ejecting a frit material to an application object;
A moving mechanism for relatively moving the object to be coated and the ejection head;
Control means for controlling the ejection head and the moving mechanism so as to apply the frit material in a closed loop frame shape on the application object;
With
The control means stops the discharge of the frit material, and the discharge head in which the discharge of the frit material has stopped is disposed between the closed loop of the frame shape and the cutting line outside the closed loop of the frame shape on the application target. The sealing structure is characterized in that the discharge head and the moving mechanism are controlled so as to face the region and move the discharge head facing the region in a direction away from the application target. Manufacturing equipment. The control means is configured to apply the frit material and the moving mechanism so as to apply the frit material from an application start position on the application object to an application end position between the cutting line and the frame-shaped corner portion. The apparatus for manufacturing a sealing structure according to claim 1, wherein: The control means is a coating end position outside the closed loop of the frame shape from a coating start position on the coating object, and a first imaginary line extending from the first linear portion of the frame shape and the frame shape The discharge head and the discharge head so as to apply the frit material to a coating end position in a region surrounded by a second imaginary line extending from the second straight portion and a corner portion communicating with the first straight portion and the second straight portion; The apparatus for manufacturing a sealing structure according to claim 1, wherein the moving mechanism is controlled. An application step of relatively moving an application object and a discharge head that discharges the frit material with respect to the application object, and applying the frit material on the application object in a closed-loop frame shape;
In the application step, the discharge of the frit material is stopped, and the discharge head in which the discharge of the frit material is stopped is disposed between the frame-shaped closed loop and the cutting line outside the frame-shaped closed loop in the application target. A method for manufacturing a sealing structure, wherein the discharge head facing the region is moved in a direction away from the application target. 5. The frit material is applied in the application step from an application start position on the application object to an application end position between the cutting line and the frame-shaped corner portion. Manufacturing method of the sealing structure. In the application step, a first imaginary line extending from the first straight line portion of the frame shape and an application end position outside the closed loop of the frame shape from the application start position on the application object, and the frame shape The frit material is applied to a coating end position in a region surrounded by a second imaginary line extending from the second straight portion and a corner portion communicating with the first straight portion and the second straight portion. Item 5. A method for producing a sealing structure according to Item 4.

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