TW201328789A - Nozzle - Google Patents

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Publication number
TW201328789A
TW201328789A TW101127571A TW101127571A TW201328789A TW 201328789 A TW201328789 A TW 201328789A TW 101127571 A TW101127571 A TW 101127571A TW 101127571 A TW101127571 A TW 101127571A TW 201328789 A TW201328789 A TW 201328789A
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TW
Taiwan
Prior art keywords
substrate
nozzle
coating
coating material
discharge port
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TW101127571A
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Chinese (zh)
Inventor
Joon-Young Kim
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Top Eng Co Ltd
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Publication of TW201328789A publication Critical patent/TW201328789A/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/02Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape
    • B05B1/04Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape in flat form, e.g. fan-like, sheet-like

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  • Coating Apparatus (AREA)

Abstract

Disclosed herein is a nozzle, which is optimized in shape to shape an upper surface of a coating material applied to a substrate into a plane that is parallel to the upper surface of the substrate.

Description

噴嘴 nozzle

本發明係關於用在塗佈混有玻璃料(frit)之塗佈材料(coating material)之塗佈裝置(applying apparatus)中的噴嘴(nozzle)。 The present invention relates to a nozzle for use in an coating apparatus for coating a coating material mixed with a frit.

在製造例如OLED顯示器、液晶顯示器、電漿顯示器或場發射顯示器等平面板顯示器的程序中,為了維持一對基板間的預定間隔同時氣密封閉基板間之內部空間,將混有玻璃料的塗佈材料塗佈到該對基板的任一者上,然後將基板彼此附接。 In the process of manufacturing a flat panel display such as an OLED display, a liquid crystal display, a plasma display, or a field emission display, in order to maintain a predetermined interval between a pair of substrates while hermetically sealing the internal space between the substrates, the coating of the glass frit is mixed. The cloth material is applied to any of the pair of substrates, and then the substrates are attached to each other.

此種塗佈材料為膏(paste)的形式,其中粉體相(powder phase frit)的玻璃料係與有機溶劑混合,而將其塗佈到基板上表面的周邊。接著,當塗有塗佈材料的基板經過乾燥及加熱程序時,塗佈材料中的有機溶劑蒸發,結果使玻璃料留在基板上。黏著劑塗佈到與存在玻璃料之玻璃料圖案相距預定間隔(predetermined interval)的外側部分,藉由黏著劑使該對基板接合在一起。再者,若在高溫加熱接合的基板或以雷射光束照射玻璃料,玻璃料熔化且然後硬化,而使該對基板接合並緊密地密封該對基板間的內部空間。之後,在接合基板的區域中,切割塗有黏著劑的區域,而完成在該對基板間具有硬化玻璃料的產品。 Such a coating material is in the form of a paste in which a glass phase of a powder phase frit is mixed with an organic solvent and applied to the periphery of the upper surface of the substrate. Next, when the substrate coated with the coating material is subjected to a drying and heating process, the organic solvent in the coating material evaporates, and as a result, the glass frit remains on the substrate. The adhesive is applied to the outer portion of the predetermined interval from the frit pattern in which the frit is present, and the pair of substrates are joined together by an adhesive. Further, if the bonded substrate is heated at a high temperature or the frit is irradiated with a laser beam, the frit melts and then hardens, and the pair of substrates are bonded and tightly seals the internal space between the pair of substrates. Thereafter, in the region where the substrate is bonded, the region coated with the adhesive is cut, and a product having a hardened glass frit between the pair of substrates is completed.

在此種製造平面板顯示器的程序中,其中一個最重要的因素為使該對基板間的間隔保持固定。該對基板間的間隔取決於塗佈材料的截面形狀,例如塗到基板之塗佈材料的寬度及高度。因此,為了使該對基板間的間隔保持固定,需要在將塗佈 材料塗到基板時同時使其截面形狀保持固定。 One of the most important factors in such a process for manufacturing a flat panel display is to keep the spacing between the pair of substrates constant. The spacing between the pair of substrates depends on the cross-sectional shape of the coating material, such as the width and height of the coating material applied to the substrate. Therefore, in order to keep the interval between the pair of substrates fixed, it is necessary to apply the coating. The material is applied to the substrate while maintaining its cross-sectional shape fixed.

同時,為了將塗佈材料塗到基板,使用具有噴嘴的塗佈裝置,噴嘴的排出埠(discharge port)形成在面對基板的那一端。塗佈裝置相對於基板在水平方向上移動噴嘴,同時透過噴嘴的排出埠排出塗佈材料,因此將塗佈材料塗到基板。 Meanwhile, in order to apply the coating material to the substrate, a coating device having a nozzle is used, and a discharge port of the nozzle is formed at the end facing the substrate. The coating device moves the nozzle in the horizontal direction with respect to the substrate while discharging the coating material through the discharge port of the nozzle, thereby applying the coating material to the substrate.

然而,傳統塗佈裝置的問題在於透過噴嘴排出埠排出的塗佈材料形狀會依據噴嘴端部的形狀改變,因此不是固定的,而使塗到基板的塗佈材料的截面形狀不是固定的。 However, the conventional coating apparatus has a problem in that the shape of the coating material discharged through the nozzle discharge is changed depending on the shape of the nozzle end portion, and thus is not fixed, and the sectional shape of the coating material applied to the substrate is not fixed.

因此,本發明有鑒於先前技術所發生的問題,本發明之一目的在於提供一種噴嘴,能塗佈固定截面形狀之塗佈材料到基板,因而使一對接合基板間的間隔保持固定。 Accordingly, the present invention has been made in view of the problems occurring in the prior art, and an object of the present invention is to provide a nozzle capable of coating a coating material having a fixed cross-sectional shape to a substrate, thereby maintaining a constant interval between the pair of bonding substrates.

為了達成上述目的,本發明提供一種噴嘴,具有一排出埠,用於排出塗佈材料到基板之上表面,此噴嘴包含平面部(plane portion),係形成為鄰近排出埠,而平行於基板之上表面並與塗佈材料進行接觸,其中平面部之面積等於或大於塗佈材料其與平面部進行接觸之面積。 In order to achieve the above object, the present invention provides a nozzle having a discharge port for discharging a coating material to an upper surface of a substrate, the nozzle including a plane portion formed adjacent to the discharge port and parallel to the substrate The upper surface is in contact with the coating material, wherein the area of the planar portion is equal to or larger than the area of the coating material that is in contact with the planar portion.

再者,本發明提供一種噴嘴,具有一排出埠,用於排出塗佈材料到基板之上表面,此噴嘴包含平面部,係形成為鄰近排出埠,而平行於基板之上表面並與塗佈材料進行接觸,其中平面部在與塗佈材料之塗佈方向垂直之方向上的寬度等於或大於 塗到基板之塗佈材料之上表面在與塗佈材料之塗佈方向垂直之方向上的寬度。 Furthermore, the present invention provides a nozzle having a discharge port for discharging a coating material to an upper surface of the substrate, the nozzle including a flat portion formed adjacent to the discharge port and parallel to the upper surface of the substrate and coated The material is in contact, wherein a width of the flat portion in a direction perpendicular to a coating direction of the coating material is equal to or greater than The width of the surface of the coating material applied to the substrate in a direction perpendicular to the coating direction of the coating material.

再者,本發明提供一種噴嘴包含凹部(concave portion),係形成在面對基板之那一端而在塗佈材料之塗佈方向上為開通的(open),其中平面部形成於凹部中而平行於基板之上表面並與塗佈材料進行接觸。 Furthermore, the present invention provides a nozzle including a concave portion formed at an end facing the substrate and opened in a coating direction of the coating material, wherein the planar portion is formed in the concave portion in parallel On the upper surface of the substrate and in contact with the coating material.

由以上說明清楚可知,根據本發明的噴嘴組態成最佳化塗到基板之塗佈材料的形狀,而使塗佈材料的上表面成形為與基板上表面平行的平面,藉此可在基板上成形具有固定截面形狀及平坦上表面的玻璃料圖案。因此,本發明的優點在於可穩固地將該對基板接合在一起,並可使接合基板間的間隔保持固定。 As apparent from the above description, the nozzle according to the present invention is configured to optimize the shape of the coating material applied to the substrate, and the upper surface of the coating material is formed into a plane parallel to the upper surface of the substrate, whereby the substrate can be A frit pattern having a fixed cross-sectional shape and a flat upper surface is formed thereon. Therefore, the present invention is advantageous in that the pair of substrates can be firmly joined together and the interval between the bonding substrates can be kept fixed.

於後,參考伴隨圖式說明本發明較佳實施例之噴嘴。 Hereinafter, the nozzle of the preferred embodiment of the present invention will be described with reference to the accompanying drawings.

首先,如圖1所示,根據本發明第一實施例具有噴嘴的塗佈裝置包含裝設基板S於其上的托台(stage)10、提供於托台20上方的塗佈頭單元支撐框架(dispensing-head-unit-support frame)20、可移動地提供於塗佈頭單元支撐框架20上並具有噴嘴70的塗佈頭單元30以及控制塗佈材料之塗佈操作的控制單元(未顯示)。 First, as shown in FIG. 1, a coating apparatus having a nozzle according to a first embodiment of the present invention includes a stage 10 on which a substrate S is mounted, and a coating head unit support frame provided above the pallet 20. (dispensing-head-unit-support frame) 20. A coating head unit 30 movably provided on the coating head unit support frame 20 and having a nozzle 70, and a control unit for controlling a coating operation of the coating material (not shown) ).

托台移動單元40提供在托台10下方,而在與塗佈頭單元支撐框架20之延伸方向(X軸方向)垂直的方向(Y軸方向)上移動 托台10。塗佈頭單元移動單元50提供在塗佈頭單元支撐框架20上,而在X軸方向上移動塗佈頭單元30。此種架構讓托台10藉由托台移動單元40移動於Y軸方向,而在Y軸方向上將塗佈材料塗佈到基板S,同時讓塗佈頭單元30藉由塗佈頭單元移動單元50移動於X軸方向,而在X軸方向上將塗佈材料塗佈到基板S。各種線性移動機制可用做為托台移動單元40及塗佈頭單元移動單元50,例如包含電磁鐵與永久磁鐵的線性馬達或滾珠螺桿。同時,本發明實施例提出一種托台10移動於Y軸方向且塗佈頭單元30移動於X軸方向的組態。然而,本發明不限於這樣的組態,而可組態成托台10移動於X軸方向及Y軸方向,或塗佈頭單元30移動於X軸方向及Y軸方向。為了使托台10移動於X軸方向及Y軸方向,可在托台10下方安裝兩個線性移動機制,而分別移動托台10於X軸方向及Y軸方向。為了移動塗佈頭單元30於Y軸方向,用於移動塗佈頭單元支撐框架20於Y軸方向的線性移動機制可連接到塗佈頭單元支撐框架20。如此一來,塗佈裝置可藉由移動托台10且塗佈頭單元30維持固定或藉由移動塗佈頭單元30且托台10固定,而將塗佈材料塗到基板S。於後,此種托台10與塗佈頭單元30間的相對移動定義為噴嘴70相對於基板S的移動。 The pallet moving unit 40 is provided below the pallet 10 and moves in a direction (Y-axis direction) perpendicular to the extending direction (X-axis direction) of the coating head unit support frame 20. Pallet 10. The coating head unit moving unit 50 is provided on the coating head unit support frame 20 while moving the coating head unit 30 in the X-axis direction. This configuration allows the pallet 10 to be moved in the Y-axis direction by the pallet moving unit 40, and the coating material is applied to the substrate S in the Y-axis direction while the coating head unit 30 is moved by the coating head unit. The unit 50 is moved in the X-axis direction, and the coating material is applied to the substrate S in the X-axis direction. Various linear movement mechanisms can be used as the pallet moving unit 40 and the coating head unit moving unit 50, such as a linear motor or a ball screw including an electromagnet and a permanent magnet. Meanwhile, the embodiment of the present invention proposes a configuration in which the pallet 10 moves in the Y-axis direction and the coating head unit 30 moves in the X-axis direction. However, the present invention is not limited to such a configuration, but may be configured such that the pallet 10 moves in the X-axis direction and the Y-axis direction, or the coating head unit 30 moves in the X-axis direction and the Y-axis direction. In order to move the pallet 10 in the X-axis direction and the Y-axis direction, two linear movement mechanisms can be attached below the pallet 10, and the pallet 10 is moved in the X-axis direction and the Y-axis direction, respectively. In order to move the coating head unit 30 in the Y-axis direction, a linear movement mechanism for moving the coating head unit support frame 20 in the Y-axis direction may be connected to the coating head unit support frame 20. In this manner, the coating device can apply the coating material to the substrate S by moving the pallet 10 and the coating head unit 30 is maintained stationary or by moving the coating head unit 30 and the pallet 10 is fixed. Thereafter, the relative movement between the pallet 10 and the coating head unit 30 is defined as the movement of the nozzle 70 relative to the substrate S.

塗佈頭單元30包含注射器(syringe)31、噴嘴70、距離感測器33、Y軸驅動單元34以及Z軸驅動單元35。注射器31含有塗佈材料。噴嘴70與注射器31相通並排出塗佈材料。距離感測器33設置成鄰近噴嘴70,以量測噴嘴70與基板S間的間隔。Y軸驅動單元34作用於移動噴嘴70及距離感測器33於Y軸方向上。Z軸驅動單元35作用於移動噴嘴70及距離感測器33於 垂直方向(Z軸方向)。 The coating head unit 30 includes a syringe 31, a nozzle 70, a distance sensor 33, a Y-axis driving unit 34, and a Z-axis driving unit 35. The syringe 31 contains a coating material. The nozzle 70 communicates with the syringe 31 and discharges the coating material. The distance sensor 33 is disposed adjacent to the nozzle 70 to measure the interval between the nozzle 70 and the substrate S. The Y-axis driving unit 34 acts on the moving nozzle 70 and the distance sensor 33 in the Y-axis direction. The Z-axis driving unit 35 acts on the moving nozzle 70 and the distance sensor 33 Vertical direction (Z-axis direction).

注射器31中含有預定量的塗佈材料。注射器31中所含的塗佈材料為膏的形式,係藉由混合粉體相玻璃料與有機溶劑所製成。注射器31可連接壓力源(未顯示),且可在壓力源將壓力供應到注射器31內部的情況下,透過噴嘴70將注射器31中所含的塗佈材料排出到基板S。注射器31可與噴嘴70整合,或可與噴嘴70獨立提供而藉由另外的路徑與噴嘴70連接。 The syringe 31 contains a predetermined amount of coating material. The coating material contained in the syringe 31 is in the form of a paste, which is prepared by mixing a powder phase frit with an organic solvent. The syringe 31 can be connected to a pressure source (not shown), and the coating material contained in the syringe 31 can be discharged to the substrate S through the nozzle 70 with the pressure source supplying the pressure to the inside of the syringe 31. The syringe 31 can be integrated with the nozzle 70 or can be provided separately from the nozzle 70 and connected to the nozzle 70 by an additional path.

距離感測器33包含朝基板S發射雷射光束的光發射部(light emitting part)331以及光接收部(light receiving part)332,光接收部332係與光發射部331相隔預定距離並接收從基板S上表面所反射的光。此種距離感測器33因應電訊號用於量測基板S與噴嘴70間的距離,其中電訊號係基於從基板S上表面所反射之雷射光束在光接收部332形成影像的影像形成位置。 The distance sensor 33 includes a light emitting part 331 that emits a laser beam toward the substrate S, and a light receiving part 332 that is spaced apart from the light emitting part 331 by a predetermined distance and received from the light receiving part 331 Light reflected from the upper surface of the substrate S. The distance sensor 33 is configured to measure the distance between the substrate S and the nozzle 70 in response to the electrical signal, wherein the electrical signal is based on an image forming position at which the laser beam reflected from the upper surface of the substrate S forms an image at the light receiving portion 332. .

如圖2所示,路徑(path)71形成在噴嘴70中而與注射器31相通,且排出埠72形成在噴嘴70面對基板S的那一端而與路徑71相通。此種組態讓注射器31中所含的塗佈材料P在供應壓力到注射器31內部的情況下沿著路徑71流動,然後透過排出埠72排到基板S。 As shown in FIG. 2, a path 71 is formed in the nozzle 70 to communicate with the syringe 31, and a discharge port 72 is formed at the end of the nozzle 70 facing the substrate S to communicate with the path 71. This configuration allows the coating material P contained in the syringe 31 to flow along the path 71 with the supply pressure to the inside of the syringe 31, and then discharged to the substrate S through the discharge port 72.

再者,平面部73形成為在噴嘴70面對基板S之該端係鄰近排出埠72,而平行於基板S的上表面。排出埠72及平面部73形成在相同平面。根據此種組態,當噴嘴70相對於基板S移動時,塗佈材料P從排出埠72排出,而使塗佈材料P塗到基 板S上。在此種程序期間,塗佈材料P與噴嘴70的平面部73進行接觸。因此,塗佈材料P被噴嘴70的平面部73整平,且如圖3所示,塗到基板S之塗佈材料P的上表面成形為與基板S之上表面平行的平面。 Further, the flat portion 73 is formed to be adjacent to the discharge port 72 at the end of the nozzle 70 facing the substrate S, and is parallel to the upper surface of the substrate S. The discharge port 72 and the flat portion 73 are formed on the same plane. According to this configuration, when the nozzle 70 moves relative to the substrate S, the coating material P is discharged from the discharge port 72, and the coating material P is applied to the base. Board S. During such a procedure, the coating material P comes into contact with the flat portion 73 of the nozzle 70. Therefore, the coating material P is leveled by the flat portion 73 of the nozzle 70, and as shown in FIG. 3, the upper surface of the coating material P applied to the substrate S is formed into a plane parallel to the upper surface of the substrate S.

關於塗到基板S的塗佈材料P,其高度Hp是從基板S之上表面計算的高度,其寬度Wp是塗佈材料P之上表面在與噴嘴70相對於基板S之移動方向(塗佈材料P的塗佈方向)垂直之方向上的寬度,高度Hp及寬度Wp係依據要應用到產品之基板S的尺寸或形狀來預設。 Regarding the coating material P applied to the substrate S, the height Hp is a height calculated from the upper surface of the substrate S, and the width Wp is the moving direction of the upper surface of the coating material P with respect to the nozzle 70 with respect to the substrate S (coating) The coating direction of the material P) the width in the vertical direction, the height Hp and the width Wp are preset depending on the size or shape of the substrate S to be applied to the product.

於此,藉由基於使用距離感測器33量測到的基板S與噴嘴70間的間距來控制Z軸驅動單元35的驅動,以及藉由調整基板S與噴嘴70在垂直方向上的間距,來執行調整塗佈材料P之高度Hp的程序。 Here, the driving of the Z-axis driving unit 35 is controlled by the pitch between the substrate S and the nozzle 70 measured based on the use of the distance sensor 33, and by adjusting the pitch of the substrate S and the nozzle 70 in the vertical direction, The procedure of adjusting the height Hp of the coating material P is performed.

再者,依據塗佈材料P之上表面的預設寬度Wp,藉由設定噴嘴70的平面部73在與噴嘴70相對於基板S之移動方向(塗佈材料P的塗佈方向)垂直之方向上的寬度Wn以及平面部73的面積,來執行調整塗佈材料P之上表面的寬度Wp。 Further, depending on the predetermined width Wp of the upper surface of the coating material P, the plane portion 73 of the nozzle 70 is set to be perpendicular to the moving direction of the nozzle 70 with respect to the substrate S (the coating direction of the coating material P). The width Wn of the upper surface and the area of the flat portion 73 are adjusted to adjust the width Wp of the upper surface of the coating material P.

當平面部73的寬度Wn小於塗佈材料P之上表面的預設寬度Wp時,如圖4所示,在塗佈期間塗佈材料P可能沿著噴嘴70的側面爬升,而可能在塗到基板S之塗佈材料P的上表面上形成不規則凹槽。因此,由於這樣的問題,將一對基板S接合在一起時,難以使基板S間的間隔保持固定,而使氣泡不利地 形成在該對基板S之間。因此,如圖2所示,噴嘴70之平面部73的寬度Wn較佳等於或大於塗佈材料P之上表面的預設寬度Wp。亦即,較佳地,噴嘴70之平面部73的面積等於或大於與平面部73進行接觸之塗佈材料P的面積。 When the width Wn of the flat portion 73 is smaller than the predetermined width Wp of the surface above the coating material P, as shown in FIG. 4, the coating material P may climb along the side of the nozzle 70 during coating, and may be applied An irregular groove is formed on the upper surface of the coating material P of the substrate S. Therefore, due to such a problem, when a pair of substrates S are joined together, it is difficult to keep the interval between the substrates S fixed, and the bubbles are disadvantageously Formed between the pair of substrates S. Therefore, as shown in FIG. 2, the width Wn of the flat portion 73 of the nozzle 70 is preferably equal to or larger than the predetermined width Wp of the upper surface of the coating material P. That is, preferably, the area of the flat portion 73 of the nozzle 70 is equal to or larger than the area of the coating material P in contact with the flat portion 73.

此外,如圖2所示,平面部73的寬度Wn大於排出埠72的內徑(inner diameter),而對應於從排出埠72排出塗佈材料P之流速,使平面部73可有效地整平塗到基板S之塗佈材料P的上表面。較佳地,平面部73的寬度Wn至少比排出埠72的內徑大1.5倍。 Further, as shown in FIG. 2, the width Wn of the flat portion 73 is larger than the inner diameter of the discharge port 72, and the flat portion 73 can be effectively leveled corresponding to the flow rate of the discharge of the coating material P from the discharge port 72. The upper surface of the coating material P applied to the substrate S. Preferably, the width Wn of the flat portion 73 is at least 1.5 times larger than the inner diameter of the discharge port 72.

如圖5至圖7所示,當塗佈材料P以封閉形式塗到基板S時,首先排出塗佈材料P。塗佈操作從噴嘴70開始相對於基板S移動的塗佈起點SP開始,並以預定圖案進行。噴嘴70再次回到塗佈起點SP後,就完成塗佈操作。 As shown in FIGS. 5 to 7, when the coating material P is applied to the substrate S in a closed form, the coating material P is first discharged. The coating operation starts from the coating start point SP at which the nozzle 70 starts moving relative to the substrate S, and is performed in a predetermined pattern. After the nozzle 70 is returned to the coating start point SP again, the coating operation is completed.

較佳地,若塗佈操作完成的位置定義為塗佈終點EP,則塗佈終點EP在噴嘴70相對於基板S的移動方向上是位在塗佈起點SP後方,且從排出埠72排出塗佈材料P的操作就在塗佈起點SP前完成。亦即,噴嘴70回到塗佈起點SP並且然後完成塗佈操作,從排出埠72排出塗佈材料P的操作就在噴嘴70位於塗佈起點SP前完成,之後噴嘴70以使其與基板S在垂直方向的間距保持固定的方式通過塗佈起點SP到達塗佈終點EP。因此,從排出埠72排出塗佈材料之塗佈操作完成的狀態中,在噴嘴70下方的塗佈材料P與已塗到塗佈起點並持續移到噴嘴70之塗佈終點EP的塗佈材料P聯合在一起。此時,平面部73整 平塗佈材料。因此,避免在塗佈起點SP與塗佈終點EP碰到的區域重複了塗佈材料P的塗佈,並使塗佈材料P的上表面成形為平面。 Preferably, if the position at which the coating operation is completed is defined as the coating end point EP, the coating end point EP is located behind the coating start point SP in the moving direction of the nozzle 70 with respect to the substrate S, and is discharged from the discharge port 72. The operation of the cloth material P is completed before the coating start point SP. That is, the nozzle 70 is returned to the coating start point SP and then the coating operation is completed, and the operation of discharging the coating material P from the discharge port 72 is completed before the nozzle 70 is positioned at the coating start point SP, after which the nozzle 70 is brought into contact with the substrate S. The manner in which the pitch in the vertical direction is kept fixed reaches the coating end point EP by the coating start point SP. Therefore, in a state where the coating operation of discharging the coating material from the discharge port 72 is completed, the coating material P under the nozzle 70 and the coating material which has been applied to the coating start point and continuously moved to the coating end point EP of the nozzle 70 are applied. P is united. At this time, the flat portion 73 is complete Flat coating material. Therefore, application of the coating material P is prevented from being repeated in the region where the coating starting point SP and the coating end point EP are encountered, and the upper surface of the coating material P is formed into a flat surface.

同時,如圖6所示,在噴嘴70已位於塗佈終點EP時,噴嘴70在水平方向移動並同時在垂直方向上逐漸向上移動而與塗佈材料P分開。相較於噴嘴70在塗佈終點EP僅移動於垂直方向的案例,上述案例避免塗到基板S之塗佈材料P的上表面因為塗佈材料P黏在噴嘴70的端部並隨噴嘴70一起移動而變成不規則形狀。 Meanwhile, as shown in FIG. 6, when the nozzle 70 has been positioned at the coating end point EP, the nozzle 70 is moved in the horizontal direction while being gradually moved upward in the vertical direction to be separated from the coating material P. Compared with the case where the nozzle 70 is only moved in the vertical direction at the coating end point EP, the above case avoids the upper surface of the coating material P applied to the substrate S because the coating material P sticks to the end of the nozzle 70 and is along with the nozzle 70. Move to become an irregular shape.

同時,如圖5及圖6所示,當噴嘴70碰到已塗到塗佈起點SP的塗佈材料P時,為了避免已塗的塗佈材料P與噴嘴70的側表面接觸然後向上移動,漸細部(tapered portion)74較佳藉由漸漸變細而以預定傾斜度形成在噴嘴70面對基板S的端部。漸細部74可為線性形狀或曲形。 Meanwhile, as shown in FIGS. 5 and 6, when the nozzle 70 hits the coating material P that has been applied to the coating start point SP, in order to prevent the applied coating material P from coming into contact with the side surface of the nozzle 70 and then moving upward, The tapered portion 74 is preferably formed at an end of the nozzle 70 facing the substrate S by a predetermined inclination by being tapered. The tapered portion 74 can be a linear shape or a curved shape.

根據此種組態,如圖6所示,即使當噴嘴70通過塗佈起點SP然後移動,已塗到塗佈起點SP位置的塗佈材料P係藉由漸細部74位在噴嘴70的平面部73下方。因此,即使在塗佈起點SP碰到塗佈終點EP的範圍中,塗佈材料P的整個上表面可維持平面形式。 According to this configuration, as shown in Fig. 6, even when the nozzle 70 passes through the coating starting point SP and then moves, the coating material P applied to the coating start point SP is positioned at the flat portion of the nozzle 70 by the tapered portion 74. 73 below. Therefore, even in the range where the coating starting point SP hits the coating end point EP, the entire upper surface of the coating material P can maintain the planar form.

如圖7所示,將塗佈材料P塗到基板S的操作完成時,塗有塗佈材料P的基板S歷經乾燥及加熱程序。藉此,塗佈材料P中的有機溶劑蒸發,而僅玻璃料F留在基板S上。於此案例 中,玻璃料F之圖案的上表面維持為與基板S之上表面平行的平面。再者,如圖8所示,黏著劑A塗到有玻璃料F存在之基板S上並與玻璃料圖案相距預定間隔位置的外側部分。再者,如圖9所示,具有電子裝置E(例如半導體裝置或發光裝置)的基板S與具有玻璃料F並塗有黏著劑A的基板S接合。再者,如圖10所示,若在高溫加熱接合的基板或以雷射光照射玻璃料,則玻璃料熔化然後再次硬化,而使該對基板緊密地接合在一起。再者,如圖11所示,在接合基板的區域中,切割塗有黏著劑A的區域,而完成具有藉由玻璃料F接合之該對基板的產品。 As shown in FIG. 7, when the operation of applying the coating material P to the substrate S is completed, the substrate S coated with the coating material P is subjected to a drying and heating process. Thereby, the organic solvent in the coating material P evaporates, and only the glass frit F remains on the substrate S. This case The upper surface of the pattern of the frit F is maintained as a plane parallel to the upper surface of the substrate S. Further, as shown in Fig. 8, the adhesive A is applied to the outer side portion of the substrate S on which the glass frit F exists and which is spaced apart from the frit pattern by a predetermined interval. Further, as shown in FIG. 9, the substrate S having the electronic device E (for example, a semiconductor device or a light-emitting device) is bonded to the substrate S having the glass frit F and coated with the adhesive A. Further, as shown in FIG. 10, if the bonded substrate is heated at a high temperature or the frit is irradiated with laser light, the frit melts and then hardens again, and the pair of substrates are tightly joined together. Further, as shown in FIG. 11, in the region where the substrate is bonded, the region coated with the adhesive A is cut, and the product having the pair of substrates joined by the glass frit F is completed.

同時,如圖12所示,成形在基板S上之玻璃料F圖案的上表面平行於其上形成有電子裝置E之基板S的下表面。因此,在將該對基板S接合在一起的程序中,基板S的下表面可緊密接觸玻璃料F圖案的上表面。 Meanwhile, as shown in FIG. 12, the upper surface of the frit F pattern formed on the substrate S is parallel to the lower surface of the substrate S on which the electronic device E is formed. Therefore, in the process of joining the pair of substrates S together, the lower surface of the substrate S can closely contact the upper surface of the frit F pattern.

如上所述,將本發明第一實施例之噴嘴70的形狀最佳化,而使含有玻璃料F之塗佈材料P的上表面成形為與基板S之上表面平行的平面。結果,本發明之一優點在於,使用本發明第一實施例之噴嘴70可在基板S上形成上表面為平面的玻璃料F之圖案,因此使該對基板S能穩固地接合在一起,並使接合基板S間的間隔保持固定。 As described above, the shape of the nozzle 70 of the first embodiment of the present invention is optimized, and the upper surface of the coating material P containing the glass frit F is formed into a plane parallel to the upper surface of the substrate S. As a result, an advantage of the present invention is that the nozzle 70 of the first embodiment of the present invention can be used to form a pattern of the glass frit F having a flat upper surface on the substrate S, thereby enabling the pair of substrates S to be firmly joined together, and The interval between the bonded substrates S is kept constant.

於後,參考圖13至圖15說明根據本發明第二實施例的噴嘴80。第一實施例及第二實施例中共同的元件會具有相同的參考符號,並於此省略其詳細說明。 Hereinafter, a nozzle 80 according to a second embodiment of the present invention will be described with reference to Figs. Elements common to the first embodiment and the second embodiment will have the same reference numerals, and detailed description thereof will be omitted herein.

首先,如圖13所示,根據本發明第二實施例的噴嘴80安裝在塗佈頭單元30,而繞垂直軸(Z軸)轉動。為達此目的,轉動單元32提供在塗佈頭單元30上,而使噴嘴80繞著Z軸轉動。轉動單元32可使用電馬達。在本發明第二實施例中已提出噴嘴80會轉動的組態。然而,噴嘴80會轉動的組態亦可以托台10會轉動的組態來取代。為了轉動托台10,例如電馬達的轉動單元可連接到托台10的下部。 First, as shown in Fig. 13, a nozzle 80 according to a second embodiment of the present invention is mounted on a coating head unit 30 to be rotated about a vertical axis (Z-axis). To this end, the rotating unit 32 is provided on the coating head unit 30 to rotate the nozzle 80 about the Z axis. The rotating unit 32 can use an electric motor. The configuration in which the nozzle 80 is rotated has been proposed in the second embodiment of the present invention. However, the configuration in which the nozzle 80 will rotate can also be replaced by a configuration in which the pallet 10 will rotate. In order to rotate the pallet 10, a rotating unit such as an electric motor can be coupled to the lower portion of the pallet 10.

根據此種組態,噴嘴80或基板S會轉動。因此,噴嘴80同時執行相對於基板S的移動以及轉動。藉此在沿著塗佈材料P之塗佈圖案移動時,可改變噴嘴80的方向。於此,可在噴嘴80的移動方向上定義噴嘴80的前部及後部。 According to this configuration, the nozzle 80 or the substrate S is rotated. Therefore, the nozzle 80 simultaneously performs movement and rotation with respect to the substrate S. Thereby, the direction of the nozzle 80 can be changed while moving along the coating pattern of the coating material P. Here, the front and rear portions of the nozzle 80 can be defined in the moving direction of the nozzle 80.

路徑81形成在噴嘴80中而與注射器31相通,且排出埠82形成於噴嘴80面對基板S的那端而與路徑81相通。此種組態讓注射器31中的塗佈材料P在供應壓力到注射器31內部的情況下能沿著路徑81流動,然後透過排出埠82排出到基板S。 The path 81 is formed in the nozzle 80 to communicate with the syringe 31, and the discharge port 82 is formed at the end of the nozzle 80 facing the substrate S to communicate with the path 81. This configuration allows the coating material P in the syringe 31 to flow along the path 81 under the supply pressure to the inside of the syringe 31, and then discharged to the substrate S through the discharge port 82.

再者,平面部83形成為在噴嘴80面對基板S之該端係鄰近排出埠82,而平行於基板S的上表面。排出埠82及平面部83形成在相同平面。根據此種組態,當噴嘴80相對於基板S移動時,塗佈材料P從排出埠82排出,而使塗佈材料P塗到基板S上。在此種程序期間,塗佈材料P與噴嘴80的平面部83進行接觸。因此,塗佈材料P被噴嘴80的平面部83整平,且塗到基板S之塗佈材料P的上表面成形為與基板S之上表面平行的平面。 Further, the flat portion 83 is formed to be adjacent to the discharge port 82 at the end of the nozzle 80 facing the substrate S, and is parallel to the upper surface of the substrate S. The discharge port 82 and the flat portion 83 are formed on the same plane. According to this configuration, when the nozzle 80 is moved relative to the substrate S, the coating material P is discharged from the discharge port 82, and the coating material P is applied onto the substrate S. During such a procedure, the coating material P comes into contact with the flat portion 83 of the nozzle 80. Therefore, the coating material P is leveled by the flat portion 83 of the nozzle 80, and the upper surface of the coating material P applied to the substrate S is formed into a plane parallel to the upper surface of the substrate S.

如圖14及圖15所示,漸細部84藉由漸漸變細而以預定傾斜度形成在噴嘴80的前部,而具有預定寬度的整平構件(flattening member)85形成在噴嘴80的後部。漸細部84可為線性形狀或曲形。整平構件85的下表面與平面部83在相同平面。藉此,在塗佈程序中,整平構件85的下表面與塗佈材料P的上表面進行接觸。整平構件85可與噴嘴80整合,或可與噴嘴80分別提供然後耦接到噴嘴80的側表面。 As shown in FIGS. 14 and 15, the tapered portion 84 is formed at a front portion of the nozzle 80 with a predetermined inclination by being tapered, and a flattening member 85 having a predetermined width is formed at the rear portion of the nozzle 80. The tapered portion 84 can be a linear shape or a curved shape. The lower surface of the leveling member 85 is in the same plane as the flat portion 83. Thereby, in the coating process, the lower surface of the leveling member 85 comes into contact with the upper surface of the coating material P. The leveling member 85 can be integrated with the nozzle 80 or can be provided separately from the nozzle 80 and then coupled to the side surface of the nozzle 80.

如同上述第一實施例,當噴嘴80碰到已塗到塗佈起點SP的塗佈材料P時,漸細部84避免塗佈材料P在接觸到噴嘴80的側表面後沿著噴嘴80的側表面爬升。 As with the first embodiment described above, when the nozzle 80 hits the coating material P that has been applied to the coating start point SP, the tapered portion 84 prevents the coating material P from being along the side surface of the nozzle 80 after contacting the side surface of the nozzle 80. Climb.

根據此種組態,如圖15所示,即使當噴嘴80通過塗佈起點SP然後移動,已塗到塗佈起點SP位置的塗佈材料P係藉由漸細部84位在噴嘴80的平面部83下方。因此,即使在塗佈起點SP碰到塗佈終點EP的範圍中,塗佈材料P的整個上表面可維持平面形狀。 According to this configuration, as shown in Fig. 15, even when the nozzle 80 passes through the coating starting point SP and then moves, the coating material P which has been applied to the coating start point SP is positioned at the flat portion of the nozzle 80 by the tapered portion 84. 83 below. Therefore, even in the range where the coating start point SP hits the coating end point EP, the entire upper surface of the coating material P can maintain a planar shape.

再者,整平構件85壓住並整平從噴嘴80的後部溢出之塗佈材料P的上表面,而使塗到基板S之塗佈材料P的上表面成形為與基板S之上表面平行的平面。此種整平構件85增加壓住塗佈材料P之上表面的面積,而讓塗佈材料P之上表面藉由噴嘴80的整平構件85及平面部83成形為與基板S之上表面平行的平面。 Further, the flattening member 85 presses and flattens the upper surface of the coating material P overflowing from the rear of the nozzle 80, and the upper surface of the coating material P applied to the substrate S is formed to be parallel to the upper surface of the substrate S. The plane. The flattening member 85 increases the area of the upper surface of the coating material P, and the upper surface of the coating material P is formed by the flattening member 85 and the flat portion 83 of the nozzle 80 to be parallel to the upper surface of the substrate S. The plane.

如上所述,在根據本發明第二實施例之噴嘴80中,漸細部84形成在噴嘴80其移動方向上的前部,而整平構件85提供在噴嘴80的後部,而使塗到基板S之塗佈材料的上表面可成形為與基板S之上表面平行的平面。結果,本發明之優點在於,使用本發明第二實施例之噴嘴80可在基板S上形成上表面為平面的玻璃料F之圖案,因此使該對基板S能穩固地接合在一起,並使接合基板S間的間隔保持固定。 As described above, in the nozzle 80 according to the second embodiment of the present invention, the tapered portion 84 is formed at the front portion of the nozzle 80 in the moving direction thereof, and the flattening member 85 is provided at the rear portion of the nozzle 80 to be applied to the substrate S. The upper surface of the coating material may be formed into a plane parallel to the upper surface of the substrate S. As a result, the present invention has an advantage in that the nozzle 80 of the second embodiment of the present invention can be used to form a pattern of the glass frit F having a flat upper surface on the substrate S, thereby enabling the pair of substrates S to be firmly joined together and The interval between the bonded substrates S is kept constant.

於後,參考圖16至圖18說明根據本發明第三實施例的噴嘴。相同的參考符號用於表示第一實施例至第三實施例中共同的元件,並於此省略其詳細說明。 Hereinafter, a nozzle according to a third embodiment of the present invention will be described with reference to Figs. 16 to 18 . The same reference numerals are used to denote elements common to the first to third embodiments, and a detailed description thereof is omitted herein.

如圖16所示,根據本發明第三實施例的噴嘴90組態成凹部96形成在噴嘴90面對基板S的那端,而在噴嘴90相對於基板S的移動方向(塗佈材料P的塗佈方向)為開通,且平面部93形成在凹部96中,而平行於基板S的上表面且在塗佈程序中與塗佈材料P進行接觸。再者,排出埠92形成在與平面部93相同的平面以排出塗佈材料P,排出埠92藉由噴嘴90中所定義的路徑91與注射器31相通。 As shown in FIG. 16, the nozzle 90 according to the third embodiment of the present invention is configured such that the concave portion 96 is formed at the end of the nozzle 90 facing the substrate S, and in the moving direction of the nozzle 90 with respect to the substrate S (coating material P The coating direction is opened, and the flat portion 93 is formed in the concave portion 96 while being in parallel with the upper surface of the substrate S and in contact with the coating material P in the coating process. Further, the discharge port 92 is formed on the same plane as the flat portion 93 to discharge the coating material P, and the discharge port 92 communicates with the syringe 31 via the path 91 defined in the nozzle 90.

於此,排出埠92及平面部93形成在相同平面。根據此種組態,當噴嘴90相對於基板S移動時,從排出埠92排出塗佈材料P,而使塗佈材料P塗到基板S上。於此種程序期間,塗佈材料P與噴嘴90的平面部93進行接觸。因此,噴嘴90的平面部93整平塗佈材料P,而使塗到基板S之塗佈材料P的上表面成形為與基板S之上表面平行的平面。 Here, the discharge port 92 and the flat portion 93 are formed on the same plane. According to this configuration, when the nozzle 90 is moved relative to the substrate S, the coating material P is discharged from the discharge port 92, and the coating material P is applied onto the substrate S. During such a procedure, the coating material P comes into contact with the flat portion 93 of the nozzle 90. Therefore, the flat portion 93 of the nozzle 90 flattens the coating material P, and the upper surface of the coating material P applied to the substrate S is formed into a plane parallel to the upper surface of the substrate S.

凹部96可藉由從噴嘴90的該端向下延伸一對延伸部(extension portion)97而形成。於此,為了使塗到基板S之塗佈材料P的形狀保持固定,平面部93之平面與延伸部97碰到平面部93的表面間的角度較佳形成直角或鈍角。 The recess 96 can be formed by extending a pair of extension portions 97 downward from the end of the nozzle 90. Here, in order to keep the shape of the coating material P applied to the substrate S constant, the angle between the plane of the flat portion 93 and the surface of the extending portion 97 hitting the flat portion 93 preferably forms a right angle or an obtuse angle.

根據此種組態,如圖17及圖18所示,當噴嘴90相對於基板S移動而以預定圖案將塗佈材料P塗到基板S時,塗到基板S的塗佈材料可具有對應於平面部93及凹部96的形狀。 According to this configuration, as shown in FIGS. 17 and 18, when the nozzle 90 is moved relative to the substrate S to apply the coating material P to the substrate S in a predetermined pattern, the coating material applied to the substrate S may have a corresponding The shape of the flat portion 93 and the concave portion 96.

因此,塗到基板S之塗佈材料P的上表面可依據平面部93的形狀成形為與基板S之上表面平行的平面,而塗到基板S之塗佈材料P的側表面可依據凹部96的形狀平滑地修飾。 Therefore, the upper surface of the coating material P applied to the substrate S may be formed into a plane parallel to the upper surface of the substrate S according to the shape of the flat portion 93, and the side surface of the coating material P applied to the substrate S may be depending on the concave portion 96. The shape is smoothly modified.

再者,由於在塗佈程序中塗佈材料P的側表面形狀係由該對延伸部97所控制,塗到基板S之塗佈材料P的上表面的寬度Wp與平面度的寬度Wn相同。因此,塗佈材料P的上表面的寬度Wp可具有正確的預設寬度。 Further, since the side surface shape of the coating material P in the coating process is controlled by the pair of extending portions 97, the width Wp of the upper surface of the coating material P applied to the substrate S is the same as the width Wn of the flatness. Therefore, the width Wp of the upper surface of the coating material P can have a correct preset width.

同時,根據本發明第三實施例的噴嘴90亦可如第二實施例般包含漸細部及整平構件。 Meanwhile, the nozzle 90 according to the third embodiment of the present invention may also include a tapered portion and a leveling member as in the second embodiment.

如此一來,根據本發明第三實施例之噴嘴90的優點在於具有與塗到基板S之塗佈材料P之形狀對應的形狀,因此使塗到基板S之塗佈材料P的上表面精確地形成與基板S之上表面平行的平面。 As a result, the nozzle 90 according to the third embodiment of the present invention has an advantage in that it has a shape corresponding to the shape of the coating material P applied to the substrate S, so that the upper surface of the coating material P applied to the substrate S is accurately A plane parallel to the upper surface of the substrate S is formed.

本發明各實施例中所述的觀點可分開實施或組合實施。再者,本發明噴嘴的組態亦可應用於各種塗佈裝置,例如在製造平面板顯示器程序中用於塗佈含有玻璃料的塗佈材料的塗佈裝置、在半導體製造程序中用於塗佈樹脂的塗佈裝置以及用於塗佈黏著劑到電子部件以裝設電子部件的塗佈裝置。 The ideas described in the various embodiments of the invention may be implemented separately or in combination. Furthermore, the configuration of the nozzle of the present invention can also be applied to various coating devices, such as a coating device for coating a coating material containing a glass frit in a flat panel display program, and for coating in a semiconductor manufacturing process. A coating device for a cloth resin and a coating device for applying an adhesive to an electronic component to mount an electronic component.

10‧‧‧托台 10‧‧‧Terminal

20‧‧‧塗佈頭單元支撐框架 20‧‧‧ Coating head unit support frame

30‧‧‧塗佈頭單元 30‧‧‧ Coating head unit

31‧‧‧注射器31 31‧‧‧Syringe 31

32‧‧‧轉動單元 32‧‧‧Rotating unit

33‧‧‧距離感測器 33‧‧‧Distance sensor

34‧‧‧Y軸驅動單元 34‧‧‧Y-axis drive unit

35‧‧‧Z軸驅動單元 35‧‧‧Z-axis drive unit

40‧‧‧托台移動單元 40‧‧‧Trolley mobile unit

50‧‧‧塗佈頭單元移動單元 50‧‧‧Coating head unit mobile unit

70‧‧‧噴嘴 70‧‧‧ nozzle

71‧‧‧路徑 71‧‧‧ Path

72‧‧‧排出埠 72‧‧‧Exporting

73‧‧‧平面部 73‧‧‧Flat Department

74‧‧‧漸細部 74‧‧‧ Gradual

80‧‧‧噴嘴 80‧‧‧ nozzle

81‧‧‧路徑 81‧‧‧ Path

82‧‧‧排出埠 82‧‧‧Exporting

83‧‧‧平面部 83‧‧‧Flat Department

84‧‧‧漸細部 84‧‧‧ Gradual

85‧‧‧整平構件 85‧‧‧ Flattening members

90‧‧‧噴嘴 90‧‧‧ nozzle

92‧‧‧排出埠 92‧‧‧Exporting

93‧‧‧平面部 93‧‧‧Flat Department

96‧‧‧凹部 96‧‧‧ recess

97‧‧‧延伸部 97‧‧‧Extension

331‧‧‧光發射部 331‧‧‧Light Emitter

332‧‧‧光接收部 332‧‧‧Light Receiving Department

A‧‧‧黏著劑 A‧‧‧Adhesive

E‧‧‧電子裝置 E‧‧‧Electronic device

EP‧‧‧塗佈終點 EP‧‧‧ coating end point

F‧‧‧玻璃料 F‧‧‧Frit

Hp‧‧‧塗佈材料高度 Hp‧‧‧ Coating material height

P‧‧‧塗佈材料 P‧‧‧ Coating materials

S‧‧‧基板 S‧‧‧Substrate

SP‧‧‧塗佈起點 SP‧‧‧ Coating starting point

Wn‧‧‧平面部寬度 Wn‧‧‧ flat section width

Wp‧‧‧塗佈材料寬度 Wp‧‧‧ Coating material width

本發明之上述及其他目的、特徵及優點結合伴隨圖式與詳細說明將更清楚了解,其中:圖1為顯示根據本發明第一實施例具有噴嘴之塗佈裝置的透視示意圖;圖2為顯示根據本發明第一實施例之噴嘴塗佈到基板的截面示意圖;圖3為顯示根據本發明第一實施例之噴嘴塗佈到基板之塗佈材料形狀的透視圖;圖4為顯示塗佈材料之塗佈狀態不佳的截面示意圖;圖5及圖6為顯示本發明第一實施例之噴嘴相對於基板移動時在基板上執行塗佈之狀態的截面示意圖;圖7至圖11為依序顯示使用玻璃料之基板接合程序的示意圖;圖12為顯示將一對基板接合在一起的程序中玻璃料形狀的截面示意圖;圖13為顯示根據本發明第二實施例具有噴嘴之塗佈裝置的透視示意圖;圖14及圖15為顯示本發明第二實施例之噴嘴相對於基板 移動時在基板上執行塗佈之狀態的截面示意圖;圖16為顯示根據本發明第三實施例之噴嘴塗佈到基板的截面示意圖;以及圖17及圖18為顯示本發明第三實施例之噴嘴相對於基板移動時在基板上執行塗佈之狀態的透視示意圖。 The above and other objects, features and advantages of the present invention will become more <RTIgt; A schematic cross-sectional view of a nozzle coated to a substrate according to a first embodiment of the present invention; FIG. 3 is a perspective view showing a shape of a coating material applied to a substrate by a nozzle according to a first embodiment of the present invention; and FIG. 4 is a view showing a coating material. FIG. 5 and FIG. 6 are schematic cross-sectional views showing a state in which the nozzle of the first embodiment of the present invention is coated on the substrate while moving relative to the substrate; FIG. 7 to FIG. A schematic view showing a substrate bonding process using a frit; FIG. 12 is a schematic cross-sectional view showing a shape of a frit in a process of joining a pair of substrates together; and FIG. 13 is a view showing a coating device having a nozzle according to a second embodiment of the present invention. FIG. 14 and FIG. 15 are diagrams showing the nozzle of the second embodiment of the present invention relative to the substrate A schematic cross-sectional view showing a state in which coating is performed on a substrate while moving; FIG. 16 is a schematic cross-sectional view showing a nozzle applied to a substrate according to a third embodiment of the present invention; and FIGS. 17 and 18 are views showing a third embodiment of the present invention. A perspective schematic view of a state in which a coating is performed on a substrate while the nozzle is moved relative to the substrate.

70‧‧‧噴嘴 70‧‧‧ nozzle

71‧‧‧路徑 71‧‧‧ Path

72‧‧‧排出埠 72‧‧‧Exporting

73‧‧‧平面部 73‧‧‧Flat Department

P‧‧‧塗佈材料 P‧‧‧ Coating materials

S‧‧‧基板 S‧‧‧Substrate

Wn‧‧‧平面部寬度 Wn‧‧‧ flat section width

Wp‧‧‧塗佈材料寬度 Wp‧‧‧ Coating material width

Claims (5)

一種噴嘴,具有一排出埠,用於排出一塗佈材料到一基板之一上表面,包含:一平面部,形成為鄰近該排出埠,而平行於該基板之該上表面並與該塗佈材料進行接觸,其中該平面部之一面積等於或大於該塗佈材料其與該平面部進行接觸之一面積。 A nozzle having a discharge port for discharging a coating material to an upper surface of a substrate, comprising: a flat portion formed adjacent to the discharge port and parallel to the upper surface of the substrate and coated The material is contacted, wherein an area of the planar portion is equal to or greater than an area of the coating material that is in contact with the planar portion. 一種噴嘴,具有一排出埠,用於排出一塗佈材料到一基板之一上表面,包含:一平面部,形成鄰近該排出埠,而平行於該基板之該上表面並與該塗佈材料進行接觸,其中該平面部在與該塗佈材料之一塗佈方向垂直之方向上的寬度等於或大於塗到該基板之該塗佈材料之一上表面在與該塗佈材料之該塗佈方向垂直之方向上的寬度。 A nozzle having a discharge port for discharging a coating material to an upper surface of a substrate, comprising: a flat portion formed adjacent to the discharge port and parallel to the upper surface of the substrate and the coating material Making contact, wherein a width of the flat portion in a direction perpendicular to a coating direction of one of the coating materials is equal to or greater than an upper surface of the coating material applied to the substrate at the coating with the coating material The width in the direction perpendicular to the direction. 一種噴嘴,具有一排出埠,用於排出一塗佈材料到一基板之一上表面,包含:一凹部,形成在面對該基板之一端而在該塗佈材料之一塗佈方向上為開通的,其中一平面部形成於該凹部中而平行於該基板之該上表面並與該塗佈材料進行接觸。 A nozzle having a discharge port for discharging a coating material to an upper surface of a substrate, comprising: a recess formed at one end facing the substrate to be opened in a coating direction of one of the coating materials One of the planar portions is formed in the recess and parallel to the upper surface of the substrate and in contact with the coating material. 如申請專利範圍第1至3項任一項所述之噴嘴,其中一漸細部形成在該噴嘴之一端。 A nozzle according to any one of claims 1 to 3, wherein a tapered portion is formed at one end of the nozzle. 如申請專利範圍第1至3項任一項所述之噴嘴,其中一整平構件提供在該噴嘴之一移動方向上的一後部而與該塗佈材料進行接觸,藉此整平該塗佈材料之一上表面。 The nozzle of any one of claims 1 to 3, wherein a flattening member provides a rear portion in a moving direction of one of the nozzles to make contact with the coating material, thereby leveling the coating One of the materials on the upper surface.
TW101127571A 2011-11-30 2012-07-31 Nozzle TW201328789A (en)

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TWI598207B (en) * 2015-12-21 2017-09-11 財團法人工業技術研究院 Coating die
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