TWI688431B - Film forming method and film forming device - Google Patents

Abstract

The present invention provides a film forming method capable of forming an edge with a minimum size in a pattern with high precision using inkjet printing technology. While relatively moving the substrate with respect to the inkjet head, droplets are ejected from the inkjet head to the substrate based on the pattern data defining the pattern of the film to be formed, and a film is formed on the substrate. The relative movement direction of the inkjet head and the substrate is orthogonal to the direction of the smallest size of the pattern defined by the pattern data.

Description

Film forming method and film forming device

This application claims priority based on Japanese Patent Application No. 2016-157066 filed on August 10, 2016. All contents of this application are incorporated into this specification by reference. The present invention relates to a film forming method and a film forming apparatus.

In order to form a resist pattern for patterning the transparent conductive film of the touch panel, photolithography technology or screen printing technology is used. Although the method using photolithography technology can form a high-definition pattern, the cost of equipment and the cost of waste liquid treatment become high. The method using screen printing technology is more advantageous than the method using photolithography in terms of device cost and waste liquid treatment cost, but it is difficult to form a high-definition pattern. The technique of forming a resist pattern using inkjet printing technology has been proposed (Patent Document 1). (Prior Art Literature) (Patent Literature) 　　 Patent Literature 1: Japanese Patent No. 5797277

(Problems to be solved by the invention) 　　Techniques that can pattern transparent conductive films with higher precision are required. An object of the present invention is to provide a film forming method and a film forming apparatus capable of forming an edge with a minimum size in a pattern with high precision using inkjet printing technology. (Technical means to solve the problem) According to an aspect of the present invention, a film forming method is provided, which moves the substrate relative to the inkjet head while moving from the inkjet head based on the pattern data for defining the pattern of the film to be formed. The substrate discharges droplets to form a film on the substrate. The relative movement direction of the inkjet head and the substrate is orthogonal to the direction of the smallest size of the pattern defined by the pattern data. According to another aspect of the present invention, there is provided a film forming apparatus having: a 　　 support portion to support a substrate; a 　　 inkjet head to eject droplets to the substrate; a 　　 moving mechanism to cause the substrate and the substrate One of the inkjet heads moves in at least one direction relative to the other; and a control device that controls the inkjet head and the moving mechanism, and the control device stores patterns for defining the film to be formed on the substrate Pattern data, and controlling the inkjet head and the moving mechanism, while moving the substrate relative to the inkjet head in a direction orthogonal to the direction of the smallest dimension of the pattern defined by the pattern data, based on the pattern data A liquid droplet is discharged from the inkjet head to the substrate to form a film. (Effect of the invention) 　　 can improve the accuracy of giving the relative position of one pair of edges with the smallest size in the pattern of the film to be formed.

1 to 4, the film forming method and film forming apparatus according to the embodiment will be described. FIG. 1 is a schematic diagram of a film forming apparatus according to an embodiment. The base 20 supports the support portion 23 through the moving mechanism 21. The substrate 50 is supported on the upper surface (support surface) of the support portion 23. The moving mechanism 21 can move the substrate 50 in the two-dimensional direction by moving the supporting portion 23 in the two-dimensional direction parallel to the supporting surface. Generally, the supporting surface of the supporting portion 23 is kept horizontal. Define the xyz rectangular coordinate system with the two directions parallel to the support surface as the x-axis and y-axis. The inkjet head 25 is arranged above the substrate 50 supported by the support portion 23. The inkjet head 25 is supported by the base 20 by the gate frame 24. The inkjet head 25 includes a plurality of head blocks 26. A plurality of head blocks 26 are mounted on a common support member 28. Each of the head blocks 26 is provided with a plurality of nozzle holes. The droplet of the film material is discharged from the nozzle hole to the substrate 50.　　 The liquid film material attached to the substrate 50 is hardened to form a film. As the film material, photocurable resin, thermosetting resin, or the like can be used. A light source or a heat source that hardens the film material adhering to the substrate 50 is arranged on the side of the inkjet head 25. The control device 30 controls the movement of the support portion 23 by the moving mechanism 21 and the discharge of the film material from the nozzle hole of the inkjet head 25. The control device 30 includes a memory device 31, and the memory device 31 stores pattern data of the film to be formed. The control device 30 controls the moving mechanism 21 and the inkjet head 25 based on the pattern data, whereby a film of a desired pattern can be formed on the substrate 50.　　 Input various commands or materials from the input device 35 to the control device 30. The input device 35 uses, for example, a keyboard, a pointing device, a USB port, a communication device, or the like. Various information related to the operation of the film forming device is output to the output device 36. The output device 36 uses, for example, a liquid crystal display, a speaker, a USB port, a communication device, or the like. FIG. 2 shows, as an example of a film to be formed, a resist film 53 used as an etching mask when patterning a transparent electrode of a touch panel. The transparent electrode is formed by etching the resist film 53 as an etching mask to form a transparent conductive film including ITO or the like. In FIG. 2, a dot pattern is given to the area where the resist is applied. The plural pad portions 51 are arranged in a matrix, and the connecting portion 52 is connected to the plural pad portions 51 in the column direction. In the xyz rectangular coordinate system defined in FIG. 1, the row direction corresponds to the x direction, and the column direction corresponds to the y direction. The interval G of the pad portions 51 adjacent in the x direction becomes the minimum size of the pattern. The direction of this minimum size is the x direction, and its size is, for example, about 30 μm.　　 If the landing position of one of the droplets with the smallest size used to form the pattern is deviated in the x direction, the pad portions 51 adjacent in the x direction are connected. If the two pads 51 that should be separated are connected, the touch panel cannot operate normally. However, even if the landing position of the droplet deviates in the y direction, the two pad portions 51 separated in the x direction will not be connected. Therefore, it is preferable to make the positional accuracy of the droplet of one of the paired edges 54 of the smallest size in the formed pattern in the x direction higher than the positional accuracy in the y direction.　　 Next, referring to FIGS. 3A and 3B, the accuracy of the landing position of the droplets in the x direction and the y direction will be described. FIG. 3A shows the deviation of the drop target position and the drop position of the droplet. The landing target position 55 is indicated by a solid line, and the plural landing positions where deviation occurs are indicated by a broken line. When coating the film material, while moving the substrate 50 (FIG. 1) in the y direction, droplets of the film material are discharged from the predetermined nozzle hole of the inkjet head 25. The main reasons for the deviation of the droplet landing position are as follows: deviation from the nozzle hole to the discharge direction, deviation of the moving speed of the substrate 50, deviation of the discharge timing from the nozzle hole, deviation of the discharge speed of the droplet, and the like. Among the causes of these deviations, the deviation from the nozzle hole to the discharge direction is the cause of the deviation of the position in both the x direction and the y direction. The other three main causes of deviations are the main causes of positional deviations in the y direction, but they are not the main causes of positional deviations in the x direction. Therefore, the maximum width Dx of the deviation in the x direction is smaller than the maximum width Dy of the deviation in the y direction. FIG. 3B shows an example of the film shape when a strip-shaped film is formed while moving the substrate 50 (FIG. 1) in the y direction. The inkjet head 25 is provided with a plurality of nozzle holes 27 arranged at equal intervals in the x direction. Since the deviation of the droplet landing position in the x direction is smaller than the deviation in the y direction, the sides of the long side along the y-direction of the strip-shaped film 56 have both sides of the long side along the x-direction of the strip-shaped film 57 The sides have higher straightness, and the deviation of the width of the film 56 (the deviation of the position in the x direction) is smaller than the deviation of the width of the film 57 (the deviation of the position in the y direction).　　 Next, referring to FIG. 4, a method of forming a resist film for forming a transparent electrode for a touch panel will be described. FIG. 4 shows the positional relationship between the resist film 53 to be formed and the inkjet head 25. The pattern data is prepared so that the direction of the smallest dimension of the resist film 53 coincides with the x direction. The minimum size is given by the pair of edges 54 of the resist film 53. Based on the pattern data, the control device 30 (FIG. 1) controls the moving mechanism 21 to discharge the droplets of the film material from the nozzle holes 27 of the inkjet head 25 while moving the substrate 50 (FIG. 1) in the y direction. When it is impossible to form the entire resist film 53 over the entire area of the substrate 50 by moving it once in the y direction of the substrate 50 (hereinafter referred to as scanning), the substrate 50 is moved in the x direction to perform the second and subsequent scans. This can form the entire resist film 53. Next, the excellent effects of the embodiments shown in FIGS. 1 to 4 will be described. When forming the film while moving the substrate 50 in the direction (y direction) orthogonal to the direction of the smallest dimension of the film pattern to be formed (x direction), the direction of the edge 54 (FIG. 4) and the direction of movement of the substrate 50 The relationship is the same as the relationship between the direction of the edge of the film 56 of FIG. 3B and the moving direction of the substrate. Therefore, as described with reference to FIGS. 3A and 3B, it is possible to reduce the deviation of the position of the edge 54 (FIG. 4) in one of the smallest dimensions in the pattern in the x direction, and to improve the straightness of the edge 54. With this, it is possible to suppress the two pad portions 51 adjacent to each other in the x direction from being continuous with each other across the smallest-sized portion. In addition, in the above embodiment, as shown in FIG. 1, the inkjet head 25 is stationary with respect to the base 20, and the film is formed while moving the support 23 in the y direction. When the inkjet head 25 is moved relative to the base 20, the posture of the inkjet head 25 slightly changes due to the movement of the inkjet head 25. A change in the posture of the inkjet head 25 changes the direction in which the liquid droplets are discharged, and therefore causes a variation in the positional accuracy of the landing position. In the above-described embodiment, the inkjet head 25 is stationary relative to the base 20 during film formation, and therefore it is possible to reduce the deviation of the landing position caused by the posture change of the inkjet head 25. In the above embodiment, the resist film was formed by the inkjet printing technique, but other films can also be formed. In addition, in the above-mentioned embodiment, the minimum size is given by the gap of the area where the resist is applied, but the minimum size may be given by the area where the resist is applied. For example, the film can also be formed so that the width of the thin line formed by the resist becomes the smallest size. In this case, by applying the method based on the embodiment, it is possible to suppress the occurrence of disconnection in the thin line. In the above embodiment, the inkjet head 25 is stationary, and the substrate 50 is moved during film formation, but conversely, the substrate 50 may be stationary and the inkjet head 25 may be moved. In addition, in this case, although there may be a deviation in the landing position caused by the posture change of the inkjet head 25, the following effect can be obtained, that is, in the direction of the minimum size of the pattern of the film to be formed (x direction) ) The orthogonal direction (y direction) suppresses the positional deviation caused by the relative movement of the substrate 50 and the inkjet head 25.　　 Next, referring to FIG. 5, another embodiment will be described. Hereinafter, the differences from the embodiments shown in FIGS. 1 to 4 will be described, and the description of the common structure will be omitted. FIG. 5 shows the positional relationship between the arrangement of the inkjet head 25 of the film forming apparatus according to this embodiment and the resist film 53 to be formed. The pattern of the resist film 53 is the same as the pattern of the resist film 53 in the embodiments shown in FIGS. 2 and 4. In this embodiment, the inkjet head 25 is provided with a plurality of nozzle holes 27y arranged in a direction (y direction) orthogonal to the direction (x direction) of the smallest dimension of the resist film 53. Except for this, as in the embodiment shown in FIG. 4, a plurality of nozzle holes 27x arranged at equal intervals in the x direction are provided. The plurality of nozzle holes 27y arranged in the y direction are arranged in two rows, and the plurality of nozzle holes 27y in each row are arranged at the same position on the x coordinate.　　 For example, each of the head blocks 26 is provided with a plurality of nozzle holes 27 arranged in a row. The two head blocks 26 are arranged such that the arrangement direction of the nozzle holes 27 is parallel to the y direction. Thereby, two rows of nozzle holes 27y can be realized. By arranging the plurality of head blocks 26 in a posture in which the arrangement direction of the nozzle holes 27 is parallel to the x direction, a plurality of nozzle holes 27x can be realized. The distance between the two rows of nozzle holes 27y in the x direction corresponds to the minimum size of the resist film 53. Here, "corresponding" does not mean that the interval of the nozzle holes 27y in the x direction is equal to the minimum size, but refers to the edge of the film formed by the droplets ejected from the nozzle holes 27y of one row and the nozzles from the other row The distance between the edges of the film formed by the droplets ejected from the hole 27y becomes equal to the minimum size. The control device 30 (FIG. 1) controls the inkjet head 25 and the moving mechanism 21 (FIG. 1 ), and forms the smallest dimension given in the resist film 53 by droplets ejected from a part of the nozzle holes 27y of the plurality of nozzle holes 27y A pair of edges 54. The portion other than the edge 54 is formed by droplets ejected from the nozzle hole 27x. In the embodiment shown in FIG. 5, even if one of the plurality of nozzle holes 27y fails, the other nozzle hole 27y in the same row can still be used to form the edge 54 with the smallest size. This can reduce the frequency of replacement of the head block 26 for edge formation. In the embodiment shown in FIG. 5, the plurality of nozzle holes 27y arranged in the y direction are configured in two rows, but they may be configured in one row. In this case, one edge 54 is formed by the first scan, and the other edge 54 is formed by the second scan.　　 Next, another embodiment will be described with reference to FIG. 6. Hereinafter, the differences from the embodiments shown in FIGS. 1 to 4 will be described, and the description of the common configuration will be omitted. FIG. 6 shows the positional relationship between the arrangement of the inkjet head 25 of the film forming apparatus according to this embodiment and the resist film 53 to be formed. The inkjet head 25 has a plurality of nozzle holes 27 arranged in a direction parallel to the direction of the smallest size (x direction). The pitch of the nozzle holes 27 that discharge the droplets of one of the smallest sizes of the pair of edges 54 in the pattern for forming the resist film 53 is set as the first pitch P1. The row system of the plurality of nozzle holes 27 includes a portion arranged at a second pitch P2 shorter than the first pitch P1, and a portion secured with the first pitch P1. No other nozzle holes are arranged between the two nozzle holes 27 arranged at the first pitch P1.　　 For example, the nozzle holes 27 arranged at the second pitch P2 are provided in each of the plurality of head blocks 26. The pitch of the nozzle holes 27 at the end of one head block 26 (the right end in FIG. 6) and the nozzle holes 27 at the end of the other head block 26 (the left end in FIG. 6) becomes the first pitch P1. The head block 26 is positioned. The control device 30 (FIG. 1) controls the inkjet head in such a manner that a pair of edges 54 of the smallest size given in the resist film 53 is formed by the droplets ejected from the two nozzle holes 27 having the first pitch P1 25 and mobile mechanism 21 (Figure 1). In the embodiment shown in FIG. 6, the nozzle hole 27 is not arranged between the edges 54 with the smallest dimension. Therefore, it is possible to prevent the liquid droplets from landing between the edges 54 due to the failure of the nozzle hole 27 or the like. With this, it is possible to suppress the defect that the portions to be isolated of the resist film 53 are continuous.　　 Next, another embodiment will be described with reference to FIGS. 7A to 8B. Hereinafter, the differences from the embodiments shown in FIGS. 1 to 4 will be described, and the description of the common configuration will be omitted. FIG. 7A shows the positional relationship between the inkjet head 25 of the film forming apparatus according to this embodiment and the resist film 53 to be formed. The area of the resist film 53 indicated by the dotted line indicates the area where the resist has not been applied. The two head blocks 26 are arranged in the y direction. Each of the head blocks 26 is provided with a plurality of nozzle holes 27 arranged at equal intervals in the x direction. One head block 26 is fixed so as to be offset from the other head block 26 by half the pitch of the nozzle holes 27 in the x direction. Therefore, for the entire inkjet head 25, the pitch of the nozzle holes 27 in the x direction is narrowed to half the pitch of the nozzle holes 27 of one head block 26. As shown in FIG. 7B, the resist film 53 is formed while moving the substrate 50 (FIG. 1) in the direction (y direction) orthogonal to the direction (x direction) that is the smallest dimension (x direction). In FIG. 7B, a dot pattern is given to the area where the resist is applied. One of the edges 54 of the resist film 53 with the smallest dimension is formed by droplets ejected from a nozzle hole 27 of a head block 26.　　As shown in FIG. 8A, the substrate 50 (FIG. 1) is moved in the direction of the smallest size (x direction). This makes it possible to apply droplets discharged from the inkjet head 25 to the area where the resist is not applied by the first scan. As shown in FIG. 8B, the resist film 53 is formed while moving the substrate 50 (FIG. 1) in a direction (y direction) orthogonal to the direction of the smallest size (x direction). By this scanning, the other edge 54 which is not formed by the process of FIG. 7B is formed among the pair of edges 54 in the resist film 53 which is given the smallest size. At this time, the discharge of the head block 26 forming the edge 54 is the same as the discharge of the head block 26 forming the edge 54 in the process of FIG. 7B.　　If a pair of edges 54 are formed by droplets ejected from different head blocks 26, their position accuracy will be affected by the mounting accuracy of the head block 26 on the support member 28 (FIG. 1). In the embodiment shown in FIGS. 7A-8B, a pair of edges 54 are formed by droplets ejected from the same head block 26, so the relative position accuracy of the pair of edges 54 is not affected by the mounting position tolerance of the head block 26 Impact. With this, it is possible to suppress a decrease in the relative position accuracy of the pair of edges 54. In the example shown in FIGS. 7A to 8B, the pair of edges 54 with the smallest size is formed by second scanning. When the pitch of the nozzle holes 27 of one head block 26 corresponds to the interval of the pair of edges 54 given the smallest size, a pair of edges 54 can be formed by one scan.　　 Next, another embodiment will be described with reference to FIGS. 9A to 10B. Hereinafter, the differences from the embodiments shown in FIGS. 7A to 8B will be described, and the description of the common configuration will be omitted. FIG. 9A shows the positional relationship between the inkjet head 25 of the film forming apparatus according to this embodiment and the resist film 53 to be formed. The area indicated by the dotted line of the resist film 53 indicates the area to which the resist has not been applied. The inkjet head 25 is provided with a plurality of nozzle holes 27 arranged at equal intervals in the x direction. As shown in FIG. 9B, the resist film 53 is formed while moving the substrate 50 (FIG. 1) in a direction (y direction) orthogonal to the direction of the smallest size (x direction). In FIG. 9B, a dot pattern is given to the area where the resist is applied. One of the edges 54 of the resist film 53 with the smallest size is formed by droplets ejected from one nozzle hole 27A of the inkjet head 25.　　 As shown in FIG. 10A, the substrate 50 (FIG. 1) is moved in the direction of the minimum size (x direction) by the distance corresponding to the minimum size. With this, the other edge 54 that is not formed by the first scan becomes a state that can be formed by the droplet discharged from the nozzle hole 27A. As shown in FIG. 10B, the resist film 53 is formed while moving the substrate 50 (FIG. 1) in a direction (y direction) orthogonal to the direction of the smallest size (x direction). By this scanning, the other edge 54 which is not formed by the process of FIG. 9B among the pair of edges 54 of the minimum size given in the resist film 53 is formed. The nozzle hole 27A that ejects the droplet forming the edge 54 is the same as the nozzle hole 27A that ejects the droplet forming the edge 54 in the process of FIG. 9B. In the embodiment shown in FIGS. 9A to 10B, the position of the edge 54 is not affected by the deviation of the discharge direction of the liquid droplets for each nozzle hole 27. Therefore, the deviation of the relative positional relationship of the pair of edges 54 can be further reduced.　　 Next, another embodiment will be described with reference to FIGS. 11 to 13B. Hereinafter, the differences from the embodiments shown in FIGS. 1 to 4 will be described, and the description of the common configuration will be omitted. In this embodiment, the moving mechanism 21 (FIG. 1) has the function of rotating the substrate 50 in the in-plane direction of the support surface (the rotation direction centered on the axis perpendicular to the support surface). FIG. 11 shows the pattern of the film 60 to be formed. In the embodiments shown in FIGS. 1 to 4, the direction in which the resist film 53 has the smallest size is only one direction in the x direction. In this embodiment, the interval G in the row direction (x direction) and the interval G in the column direction (y direction) of the plurality of isolated patterns arranged in a matrix are equal, and the interval G is the minimum size of the pattern. That is, the direction of the smallest size becomes both the x direction and the y direction. FIG. 12A shows the positional relationship between the inkjet head 25 of the film forming apparatus according to this embodiment and the film 60 to be formed. The area indicated by the dotted line of the film 60 indicates the area that has not been coated with the film material. The inkjet head 25 is provided with a plurality of nozzle holes 27 arranged at equal intervals in the x direction. As shown in FIG. 12B, a part of the film 60 is formed while moving the substrate 50 (FIG. 1) in a direction (y direction) orthogonal to a direction (x direction) of a minimum size. In FIG. 12B, a dot pattern is given to the area coated with the film material. The film material is applied to the area containing one of the pair of edges 61 with the smallest dimension given in the x direction. The area containing one of the pair of edges 62 with one of the smallest dimensions given in the y direction is not coated with the film material. As shown in FIG. 13A, the control device 30 (FIG. 1) controls the moving mechanism 21 to rotate the substrate 50 by 90°. By this, the smallest dimension in the y direction is given by the formed edge 61, and the smallest dimension in the x direction is given by the unformed edge 62. As shown in FIG. 13B, the film 60 is formed while moving the substrate 50 (FIG. 1) in a direction (y direction) orthogonal to the direction (x direction) that is the smallest dimension given by the unformed edge 62. With this scan, the film material is applied to the region of the pair of edges 62 that gives the smallest dimension in the pattern containing the film 60. In the embodiments shown in FIGS. 11 to 13B, any one of the edges that are given the smallest dimension in the mutually orthogonal directions is formed when the substrate is scanned in the direction perpendicular to the smallest dimension direction. Therefore, the straightness can be improved on either edge, and the relative position accuracy of a pair of edges can be improved.　　 Next, another embodiment will be described with reference to FIGS. 14A to 15A. Hereinafter, the differences from the embodiments shown in FIGS. 11 to 13B will be described, and the description of the common configuration will be omitted. FIG. 14A shows the positional relationship between the inkjet head 25 of the film forming apparatus according to this embodiment and the film 60 to be formed. The area indicated by the dotted line of the film 60 indicates the area that has not been coated with the film material. The inkjet head 25 includes a head block 26 provided with a plurality of nozzle holes 27 arranged at equal intervals in the x direction, and another head block 26 provided with a plurality of nozzle holes 27 arranged at equal intervals in the y direction. As shown in FIG. 14B, a part of the film 60 is formed while moving the substrate 50 (FIG. 1) in a direction (y direction) orthogonal to a direction (x direction) of a minimum size. In FIG. 14B, a dot pattern is given to the region coated with the film material. For the region including the pair of edges 61 with the smallest dimension given in the x direction, the film material discharged from the head block 26 having the nozzle holes 27 arranged in the x direction is applied. As shown in FIG. 15A, while moving the substrate 50 (FIG. 1) in a direction (x direction) orthogonal to the direction of the other smallest dimension (y direction), the area where the film material is not coated in the process of FIG. 14B The film material is applied, and the formation of the film 60 is completed. In FIG. 15A, a dot pattern is given to the area coated with the film material. By this scanning, a pair of edges 62 that is the smallest dimension given to the y direction is formed. In this embodiment, as in the embodiments shown in FIGS. 11 to 13B, any one of the edges that are given the smallest dimension in the mutually orthogonal directions is formed when the substrate is scanned in the direction orthogonal to the smallest dimension direction . Therefore, the straightness can be improved on either edge, and the relative position accuracy of a pair of edges can be improved.　　 Next, another embodiment will be described with reference to FIGS. 16A and 16B. Hereinafter, the differences from the embodiments shown in FIGS. 1 to 4 will be described, and the description of the common configuration will be omitted. FIG. 16A shows a schematic diagram of the film forming apparatus according to this embodiment. The flexible substrate 70 is transferred from the unwinding roller 71 to the winding roller 72. The moving mechanism 73 is controlled by the control device 30 to rotate the unwinding roller 71 and the winding roller 72. The inkjet head 25 is disposed above the flexible substrate 70 unwound from the unwinding roller 71 and wound between the take-up rollers 72. The structure of the inkjet head 25 is the same as the structure of the inkjet head 25 of the embodiment shown in FIGS. 1 to 4. The transfer direction of the flexible substrate 70 corresponds to the scanning direction (y direction) of the substrate 50 in the embodiments of FIGS. 1 to 4, and the width direction of the flexible substrate 70 corresponds to the x direction in the embodiments of FIGS. 1 to 4. correspond. While the flexible substrate 70 is conveyed in the y direction, droplets of the film material are discharged from the inkjet head 25, whereby a film can be formed on the flexible substrate 70. FIG. 16B shows an example of the pattern of the film 75 formed on the flexible substrate 70. Let the direction of the smallest dimension of the pattern of the film 75 be the width direction (x direction). The control device 30 (FIG. 16A) controls the transfer speed of the flexible substrate 70 and the discharge of the film material from the inkjet head 25. In this embodiment, as in the embodiments shown in FIGS. 1 to 4, the relative movement direction of the inkjet head 25 and the flexible substrate 70 is orthogonal to the direction of the smallest size of the pattern of the film to be formed. Therefore, the same effect as the embodiments shown in FIGS. 1 to 4 can be obtained.　　 Next, referring to FIG. 17, another embodiment will be described. Hereinafter, the differences between the embodiments shown in FIGS. 1 to 4 will be described, and the description of the common configuration will be omitted. FIG. 17 shows a flowchart of the process performed by the control device 30 of the film forming apparatus based on this embodiment. First, the pattern data input from the input device 35 (FIG. 1) is stored in the memory device 31 (FIG. 1) (step S1). The direction of the smallest size of the pattern defined by the input pattern data is detected (step S2). The direction of the smallest size is compared with the moving direction of the substrate at the time of film formation (step S3). The moving direction of the substrate at the time of film formation is stored in the control device 30 in advance.　　 When the two are in an orthogonal relationship, film formation is performed (step S4). When the two are not in an orthogonal relationship, the control device 30 outputs to the output device 36 (FIG. 1) that the direction in which the direction of the minimum size of the pattern data deviates from the optimal direction (step S5). The operator sees the information output from the output device 36 and can know that the direction of the smallest size of the pattern data deviates from the optimal direction. The operator corrects the pattern data by rotating the direction of the smallest size. The corrected pattern data is input again from the input device 35. With this, it is possible to suppress a decrease in the relative position accuracy of the edge in the pattern given the smallest size.　　 The information output to the output device can also output the direction of the minimum size of the pattern defined by the existing pattern data. In addition, when the direction of the minimum size is not orthogonal to the moving direction of the substrate at the time of film formation, the pattern data may be automatically corrected so that the relationship between them is orthogonal.　　The above embodiments are examples, and of course, partial replacement or combination of the structures shown in the different embodiments is possible. Regarding the same effect produced by the same structure of the plurality of embodiments, it is not mentioned one by one in each embodiment. Furthermore, the present invention is not limited to the above embodiments. For example, various changes, improvements, combinations, etc. are obvious to those having ordinary knowledge in the art.

20‧‧‧Abutment 21‧‧‧Moving mechanism 23‧‧‧Support 24‧‧‧door frame 25‧‧‧Inkjet head 26‧‧‧Head block 27‧‧‧ nozzle hole 27A‧‧‧Nozzle hole 27x‧‧‧ nozzle holes arranged along the x direction 27y‧‧‧ nozzle holes arranged along the y direction 28‧‧‧Supporting member 30‧‧‧Control device 31‧‧‧memory device 35‧‧‧Input device 36‧‧‧Output device 50‧‧‧ substrate 51‧‧‧Pad 52‧‧‧Connection 53‧‧‧resist film 54‧‧‧The edge with the smallest size 55‧‧‧ landing target 56, 57‧‧‧ Ribbon film 60‧‧‧membrane 61, 62‧‧‧ edge 70‧‧‧Flexible substrate 71‧‧‧Unwinding roller 72‧‧‧ Take-up roller 73‧‧‧Moving mechanism 75‧‧‧membrane

FIG. 1 is a schematic diagram of a film forming apparatus according to an embodiment. FIG. 2 is a plan view of a resist pattern used as an etching mask when patterning transparent electrodes of a touch panel as an example of a film to be formed. FIG. 3A is a diagram showing the difference between the landing target position of the droplet and the landing position, and FIG. 3B is a diagram showing an example of the film shape when a strip-shaped film is formed while moving the substrate in the y direction. FIG. 4 is a diagram showing the positional relationship between the resist film to be formed and the inkjet head. FIG. 5 is a diagram showing the positional relationship between the arrangement of the inkjet head of the film forming apparatus according to another embodiment and the resist film to be formed. FIG. 6 is a diagram showing the positional relationship between the arrangement of the inkjet head and the resist film to be formed in the film forming apparatus according to still another embodiment. FIG. 7A and FIG. 7B are diagrams showing the positional relationship between the inkjet head of the film forming apparatus according to still another embodiment and the resist film to be formed. FIGS. 8A and 8B are diagrams showing another positional relationship between the inkjet head of the film forming apparatus according to the embodiment shown in FIGS. 7A and 7B and the resist film to be formed. FIGS. 9A and 9B are diagrams showing the positional relationship between the inkjet head and the resist film to be formed in the film forming apparatus according to still another embodiment. FIGS. 10A and 10B are diagrams showing another positional relationship between the inkjet head of the film forming apparatus according to the embodiments shown in FIGS. 9A and 9B and the resist film to be formed. FIG. 11 is a diagram showing the pattern of the film to be formed by the film forming method according to another embodiment. FIG. 12A and FIG. 12B are diagrams showing the positional relationship between the inkjet head of the film forming apparatus according to the embodiment shown in FIG. 11 and the resist film to be formed. FIGS. 13A and 13B are diagrams showing another positional relationship between the inkjet head of the film forming apparatus according to the embodiments shown in FIGS. 12A and 12B and the resist film to be formed. FIGS. 14A and 14B are diagrams showing the positional relationship between the inkjet head and the resist film to be formed in the film forming apparatus according to still another embodiment. FIG. 15A is a diagram showing another positional relationship between the inkjet head of the film forming apparatus according to the embodiment shown in FIGS. 14A and 14B and the resist film to be formed. FIG. 16A is a schematic diagram of a film forming apparatus according to still another embodiment, and FIG. 16B is a diagram showing an example of a pattern of a film formed on a flexible substrate. FIG. 17 is a flowchart of a process performed by the control device of the film forming apparatus based on still another embodiment.

25‧‧‧Inkjet head

27‧‧‧ nozzle hole

51‧‧‧Pad

52‧‧‧Connection

53‧‧‧resist film

54‧‧‧The edge with the smallest size

Claims (11)

A film forming method is to form a film on the substrate by ejecting droplets from the inkjet head to the substrate based on pattern data defining a pattern of a film to be formed while moving the substrate relative to the inkjet head The relative movement direction of the ink head and the substrate is orthogonal to the direction of the smallest size of the pattern defined by the pattern data. The inkjet head includes a plurality of nozzle holes for discharging liquid droplets, while the substrate is aligned with the The direction of the minimum size is moved in a direction orthogonal to the edge of the minimum size in the pattern, and then the substrate is moved in the direction of the minimum size, and then the substrate is oriented in the direction of the minimum size. Moving in the orthogonal direction, while forming the other edge given the minimum size in the aforementioned pattern, droplets forming the aforementioned one edge and the other edge are ejected from the same nozzle hole among the plurality of nozzle holes. The film forming method as described in item 1 of the patent application range, wherein the inkjet head is supported by the base, and the substrate is moved relative to the base when forming the film. A film forming device having: a support portion that supports a substrate; An inkjet head ejects droplets to the substrate; a moving mechanism moves one of the substrate and the inkjet head supported by the support portion in at least one direction relative to the other; and a control device that controls the inkjet head And the moving mechanism, the control device stores pattern data for defining the pattern of the film to be formed on the substrate, and controls the inkjet head and the moving mechanism while orienting the substrate with respect to the inkjet head The direction of the minimum size of the pattern defined by the pattern data is moved in a direction orthogonal to each other, and a liquid droplet is ejected from the inkjet head to the substrate based on the pattern data to form a film. The inkjet head has a length along the minimum size The plurality of nozzle holes are arranged in a direction parallel to the direction, and when the pitch of the nozzle holes that discharge the droplets that give one of the pair of edges of the minimum size for forming the pattern is the first pitch, the plurality of nozzles The row of holes includes: a part arranged at a second pitch shorter than the first pitch, and a part ensuring the first pitch, the control device is provided with two parts by ensuring the first pitch The droplets ejected from the aforementioned nozzle holes form a pair of edges that are given the aforementioned minimum size in the aforementioned pattern. A film forming apparatus includes: a supporting portion that supports a substrate; an inkjet head that ejects liquid droplets to the substrate; and a moving mechanism that causes the substrate and the spray supported by the supporting portion One of the ink heads moves in at least one direction relative to the other; and a control device that controls the inkjet head and the moving mechanism, and the control device stores pattern data for defining the pattern of the film that should be formed on the substrate , And control the inkjet head and the moving mechanism, while moving the substrate relative to the inkjet head in a direction orthogonal to the direction of the minimum size of the pattern defined by the pattern data, based on the pattern data from the An inkjet head ejects droplets onto the substrate to form a film. The inkjet head includes a plurality of head blocks mounted on a common support member, the plurality of head blocks has a plurality of nozzle holes for ejecting droplets, and the control device is provided by The droplets ejected from any one of the nozzle holes of the plurality of nozzle holes of the same head block among the plurality of head blocks form a pair of edges that are given the minimum size in the pattern. A film forming apparatus comprising: a supporting portion that supports a substrate; an inkjet head that ejects liquid droplets to the substrate; a moving mechanism that causes one of the substrate and the inkjet head supported by the supporting portion to be opposed to the other Moving in at least one direction; and a control device that controls the inkjet head and the moving mechanism, the control device stores pattern data for defining the pattern of the film to be formed on the substrate, and controls the inkjet head and The moving mechanism moves the substrate relative to the inkjet head in a direction orthogonal to the direction of the smallest dimension of the pattern defined by the pattern data, a A film is formed by ejecting droplets from the inkjet head to the substrate based on the pattern data, the moving mechanism has a function of moving the substrate in a two-dimensional direction, and the inkjet head includes a plurality of nozzle holes that eject droplets , The control device moves the substrate in a direction orthogonal to the direction of the minimum size, while forming an edge of the pattern that is given the minimum size, then moves the substrate in the direction of the minimum size, and then , While moving the substrate in the direction orthogonal to the direction of the minimum size, while forming the other edge in the pattern given the minimum size, forming the droplets of the one edge and the other edge from the plurality of The same nozzle hole among the nozzle holes is ejected. A film forming apparatus comprising: a supporting portion that supports a substrate; an inkjet head that ejects liquid droplets to the substrate; a moving mechanism that causes one of the substrate and the inkjet head supported by the supporting portion to be opposed to the other Moving in at least one direction; and a control device that controls the inkjet head and the moving mechanism, the control device stores pattern data for defining the pattern of the film to be formed on the substrate, and controls the inkjet head and The moving mechanism, while orienting the substrate with respect to the inkjet head and the pattern The direction of the minimum dimension of the pattern defined by the data is moved in a direction orthogonal to each other, and a liquid droplet is ejected from the inkjet head to the substrate based on the pattern data to form a film, and the moving mechanism has the The function, the minimum size of the pattern defined by the pattern data, appears in the first direction and the second direction that are orthogonal to each other. The inkjet head includes: a plurality of nozzle holes arranged along the first direction The first head block and the second head block having a plurality of nozzle holes arranged in the second direction, when forming the film, the control device controls the inkjet head and the moving mechanism while causing the substrate to move along the substrate Moving in the first direction, while forming the edge with the smallest dimension in the second direction in the pattern by the droplets ejected from the plurality of nozzle holes in the second head block, and then moving the substrate along the first Moving in two directions, the edge with the smallest dimension in the first direction in the pattern is formed by droplets ejected from the plurality of nozzle holes in the first head block. A film forming apparatus comprising: a supporting portion that supports a substrate; an inkjet head that ejects liquid droplets to the substrate; a moving mechanism that causes one of the substrate and the inkjet head supported by the supporting portion to be opposed to the other Move in at least one direction; and a control device to control the inkjet head and the moving mechanism, The control device stores pattern data for defining the pattern of the film to be formed on the substrate, and controls the inkjet head and the moving mechanism while orienting the substrate with respect to the inkjet head and determined by the pattern data The direction of the smallest dimension of the defined pattern moves in a direction orthogonal to the above, while ejecting droplets from the inkjet head to the substrate based on the pattern data to form a film, further comprising an input device and an output device, the control device is stored in When forming a film, the direction of the minimum size of the pattern defined by the pattern data input from the input device is detected relative to the moving direction of the substrate of the inkjet head, and the detected minimum size direction and the substrate The movement directions of the two are compared, and when the two are not in an orthogonal relationship, the output device is caused to output information informing that the direction of the minimum size of the pattern defined by the pattern data deviates from the optimal direction. The film forming apparatus according to any one of claims 3 to 7, wherein the moving mechanism moves the substrate supported by the supporting portion. The film forming apparatus according to any one of claims 3 to 7 further includes a base supporting the inkjet head, and the moving mechanism moves the substrate relative to the base move. The film forming apparatus according to any one of claims 3 to 7, wherein the inkjet head includes: a plurality of first nozzle holes arranged in a direction orthogonal to the direction of the smallest dimension; The control device controls the inkjet head and the moving mechanism to form a pair of edges in the pattern that are given the minimum size by droplets ejected from a part of the nozzle holes of the plurality of first nozzle holes. The film forming apparatus according to any one of claims 3 to 7, wherein the moving mechanism further has a function of rotating the substrate supported by the supporting portion in the in-plane direction, as defined by the pattern data The minimum size of the pattern appears in the first direction and the second direction that are orthogonal to each other. When the film is formed, the control device controls the inkjet head and the moving mechanism while moving the substrate in the first direction After moving, while forming the edge with the smallest dimension in the second direction in the pattern defined by the pattern data, rotate the substrate by 90°, and then move the substrate in the second direction while moving the substrate Among the patterns defined by the pattern data, the edge with the smallest dimension in the first direction.

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