JP2012086194A - Drawing device and drawing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a drawing device and a drawing method which enable highly precise drawing.SOLUTION: The drawing device has a holding face, a stage for holding a substrate on the holding face, and a first and second discharging area discharging liquid droplets to a substrate held on the holding face. The distance between the substrate held on the holding surface and the first discharging area and the distance between the substrate held on the holding surface and the second discharging area are kept within the respective specific area. On the stage, the substrate is kept in the first direction within the holding face, and relatively movable between the first and the second discharging areas. The second discharging area is disposed at the side parallel to the direction crossing the first direction of the first discharging area in the holding face. The first and the second discharging areas are movable relatively between the substrate and themselves each in the direction parallel to the second and third directions crossing the holding face. Further, according to the warpage of the substrate, the drawing device includes a control device controlling the relative movement of the substrate to the first direction and the relative movement to the direction parallel to the second and third directions in the first and the second discharging areas.

Description

  The present invention relates to a drawing apparatus and a drawing method for drawing a pattern by discharging droplets.

  A liquid material (ink) containing a pattern-forming material is ejected as droplets from an ejection head (inkjet head) onto the pattern formation surface of a liquid crystal substrate or printed wiring board, and a material layer is formed (drawn) on the substrate. The technology to do is known.

  For example, a solder resist pattern is formed by the material layer drawn on the substrate. The solder resist is formed on the wiring board so that the necessary conductor parts are exposed and the parts that do not need to be soldered are not soldered for the soldering of printed wiring boards with conductor wiring formed on the base material. This is an insulating film.

  The liquid crystal substrate has almost no warpage. For this reason, when drawing on the liquid crystal substrate, the distance between the inkjet head and the substrate is kept constant, and high-precision drawing is possible. However, the printed wiring board is warped.

  8A and 8B are schematic cross-sectional views showing warpage of the printed wiring board. FIG. 8A shows the warpage of the aspect in which the central portion of the printed wiring board 10 is raised. Further, FIG. 8B shows a warp in which the end portion of the printed wiring board 10 is warped. The warpage amount h in both figures is, for example, 0.1 mm to 0.5 mm. As an example, the size of the printed wiring board 10 is 300 mm to 500 mm in length, 400 mm to 600 mm in width, and 0.5 mm to 5 mm in thickness.

  When the printed wiring board 10 having the warp is moved in the one-dimensional direction, for example, when a material layer is formed by ejecting ink from the ink-jet head, the distance between the ink-jet head and the printed wiring board 10 is warped. The ink landing position and the landing size are not stable, and the drawing accuracy is deteriorated.

  Even if the ink landing accuracy is different in each part of the substrate, an invention of a drawing device that corrects the relative position between the inkjet head and the substrate in each part to improve the droplet landing precision is disclosed (for example, , See Patent Document 1).

Japanese Patent No. 3982502

  An object of the present invention is to provide a drawing apparatus and a drawing method capable of drawing with high accuracy.

  According to one aspect of the present invention, a stage that includes a holding surface and holds the substrate on the holding surface, and first and second discharge regions that discharge droplets toward the substrate held on the holding surface are provided. A distance between the substrate held on the holding surface and the first discharge region, and a distance between the substrate held on the holding surface and the second discharge region, Each of the drawing devices is maintained within a predetermined range, and the stage moves the substrate in a first direction within the holding surface so as to be relatively movable between the first and second ejection regions. The second discharge region is disposed on a side of the first discharge region in a direction parallel to the direction intersecting the first direction and the holding surface, and the first and second discharge regions. The region is relative to the substrate in a direction parallel to the second and third directions intersecting the holding surface, respectively. And the relative movement of the substrate in the first direction and the second and third of the first and second ejection regions according to the warp of the substrate. A drawing device is provided that includes a control device that controls relative movement in a direction parallel to the direction of the image.

  According to another aspect of the present invention, a holding surface, a stage for holding the substrate on the holding surface, and first and second discharges for discharging droplets toward the substrate held on the holding surface A distance between the substrate held on the holding surface and the first discharge region, and between the substrate held on the holding surface and the second discharge region. A drawing apparatus that maintains a distance within a predetermined range, wherein the stage is movable relative to the first and second ejection regions in a first direction within the holding surface. The substrate is held, and the second ejection region is disposed on a side of the first ejection region in a direction parallel to the direction intersecting the first direction in the holding surface, and further, the first ejection region. And on the side opposite to the first direction with respect to the second discharge area, on the stage A roller that presses the substrate movably in the first direction, and has a length along a direction parallel to the direction orthogonal to the first direction and the holding surface. A drawing device is provided that includes a roller that is shorter than the length along the same direction of the discharge area including the discharge area.

  Furthermore, according to another aspect of the present invention, a stage having a holding surface, holding the substrate on the holding surface, and first and second discharges for discharging droplets toward the substrate held on the holding surface. A distance between the substrate held on the holding surface and the first discharge region, and between the substrate held on the holding surface and the second discharge region. A drawing apparatus that maintains a distance within a predetermined range, wherein the stage is a plurality of suction holes that hold a substrate on which a through-hole is formed on the holding surface and can suck the substrate, A control device comprising a plurality of suction holes capable of controlling whether to suck a substrate for each hole, and further controlling whether to suck a substrate for each of the suction holes, The suction hole placed under the hole is not suctioned, and the suction hole is not placed. Drawing device and a control device for performing is provided.

  According to another aspect of the present invention, a holding surface, a stage for holding the substrate on the holding surface, and first and second discharges for discharging droplets toward the substrate held on the holding surface A distance between the substrate held on the holding surface and the first discharge region, and between the substrate held on the holding surface and the second discharge region. A drawing method performed using a drawing apparatus that maintains a distance within a predetermined range, wherein (a) a step of grasping the warp of the substrate, and (b) the first and first steps according to the warp of the substrate. The position of the two ejection regions is changed relative to the substrate in a direction intersecting with a plane extending as a whole of the substrate, so that the first and second ejection regions are transferred to the substrate. And a drawing method including a step of discharging droplets toward the surface.

  Furthermore, according to another aspect of the present invention, a stage having a holding surface, holding the substrate on the holding surface, and first and second discharges for discharging droplets toward the substrate held on the holding surface. A distance between the substrate held on the holding surface and the first discharge region, and between the substrate held on the holding surface and the second discharge region. A drawing method performed using a drawing apparatus that maintains a distance within a predetermined range, wherein (a) a step of preparing a substrate, and (b) the substrate is placed between the first and second ejection regions. A step of discharging droplets from the first and second discharge regions toward the substrate while relatively moving in the first direction. In the step (b), the first And the second discharge region as a reference, the substrate is entirely on the opposite side of the first direction and the substrate The length of the substrate along the direction perpendicular to the first direction in the extending plane is shorter than the length along the same direction of the discharge region including the first and second discharge regions. A drawing method is provided in which the button is movably pressed in the first direction.

  According to another aspect of the present invention, a holding surface, a stage for holding the substrate on the holding surface, and first and second discharges for discharging droplets toward the substrate held on the holding surface A distance between the substrate held on the holding surface and the first discharge region, and between the substrate held on the holding surface and the second discharge region. A drawing method performed using a drawing apparatus that maintains a distance within a predetermined range, wherein (a) a step of preparing a substrate on which through holes are formed, and (b) the first and second ejection regions And discharging the droplets toward the substrate, and in the step (b), the substrate at the position where the through hole is formed is not sucked and the substrate at the position where the through hole is not formed is sucked In this state, there is provided a drawing method for discharging droplets toward the substrate.

  According to the present invention, it is possible to provide a drawing apparatus and a drawing method capable of drawing with high accuracy.

It is the schematic which shows the drawing apparatus by a 1st Example. It is a schematic plan view of the drawing apparatus showing the vicinity of the inkjet head units 23a to 23d. (A) And (B) is the schematic which shows the droplet discharge surface of an inkjet head unit. It is the schematic which shows a part of drawing apparatus by a 1st Example. It is the schematic which shows a part of drawing apparatus by a 2nd Example. (A) And (B) is the schematic which shows a part of drawing apparatus by a 3rd Example. (A) And (B) is the schematic which shows a part of drawing apparatus by a 4th Example. (A) And (B) is a schematic sectional drawing which shows the curvature of a printed wiring board.

  The drawing apparatus according to the first embodiment will be described with reference to FIGS.

  FIG. 1 is a schematic view showing a drawing apparatus according to the first embodiment. The drawing apparatus according to the first embodiment is fixed to a surface plate 20 installed horizontally (in a plane parallel to the XY plane), a stage 22 arranged on the surface plate 20, and the surface plate 20, and is in the Y-axis direction. , A frame 21 arranged so as to surround the stage 22 in a gate shape, inkjet head units 23a to 23d held by the frame 21, and a control device 40 that controls the operation of the drawing apparatus.

  The stage 22 includes a Y stage 22y, an X stage 22x, a θ stage 22θ, and a chuck plate 22a that are sequentially arranged from the surface plate 20 side. The chuck plate 22 a holds the printed wiring board (substrate) 50 by suction. The θ stage 22θ rotates the held printed wiring board 50 around a rotation axis parallel to the Z axis in a plane parallel to the XY plane. The X stage 22x and the Y stage 22y can move the printed wiring board 50 in the X-axis direction and the Y-axis direction, respectively. The controller 40 controls the chucking of the printed wiring board 50 by the chuck plate 22a and the movement of the printed wiring board 50 by the X, Y, and θ stages 22x, 22y, and 22θ.

  The frame 21 includes two support columns 21a and 21b and a column 21c. The support columns 21 a and 21 b are erected at the approximate center of the surface plate 20 in the Y-axis direction. The column 21c is supported by the support columns 21a and 21b along the X-axis direction.

  The inkjet head units 23a to 23d are held by the column 21c of the frame 21 so as to be movable in the Z-axis direction. Each of the inkjet head units 23a to 23d includes a plurality of inkjet heads. The ink jet head, for example, discharges (drops) ultraviolet curable ink (a liquid material including a pattern forming material) toward the printed wiring board 50 held on the stage 22. By the ejected ink, a material layer of a predetermined pattern, for example, a solder resist pattern is formed (drawn) on the printed wiring board 50.

  The control device 40 includes a storage device 40a which is a memory, for example. The storage device 40a stores data (gerber data) such as a region where a solder resist is to be formed (a region where ink is to be applied) on the printed wiring board 50. The control device 40 discharges ink from the ink jet head units 23a to 23d, and the wiring board by the stage 22 so that ink is applied to a predetermined area on the printed wiring board 50 based on the storage contents of the storage device 40a. Control 50 movements. The printed wiring board 50 is moved in the positive Y-axis direction, and ink is applied vertically below the inkjet head units 23a to 23d (Z-axis negative direction).

  The drawing apparatus according to the first embodiment is a droplet discharge apparatus (inkjet apparatus) that forms, for example, a solder resist having a predetermined pattern on a printed wiring board 50 movably held on a stage 22.

  FIG. 2 is a schematic plan view of the drawing apparatus showing the vicinity of the inkjet head units 23a to 23d. Each inkjet head unit 23a-23d includes a plurality of nozzle rows arranged along the Y-axis direction. Each nozzle row includes a plurality of, for example, 192 inkjet nozzles (ink ejection holes) arranged along the X-axis direction. The length along the X-axis direction of each nozzle row is, for example, about 30 mm. The ink jet head units 23a to 23d are installed such that, for example, the ink jet nozzles are arranged at equal intervals in the X-axis direction when viewed as a whole. For this reason, the ink jet head units 23a to 23d discharge ink from the ink jet nozzles and draw in a range of about 120 mm in width (a range along the X axis direction) of the printed wiring board 50 moving in the Y axis positive direction. It can be carried out.

  Since the units 23a to 23d are provided with blank portions on both sides of the nozzle row, in order to arrange the inkjet nozzles at equal intervals in the X-axis direction, units adjacent to the X-axis direction (for example, the unit 23a and The units 23b) are arranged with an interval of, for example, 20 mm in the Y-axis direction. As a result, the inkjet head units 23a to 23d are, for example, alternately arranged in two rows and arranged so as to extend in the X-axis direction as a whole. The different inkjet head units 23a to 23d are arranged on the direction side parallel to the direction intersecting the Y axis positive direction, which is the moving direction of the printed wiring board 50, in the XY plane.

  Height sensors 24a to 24d are arranged on the Y axis negative direction side (the direction opposite to the moving direction of the printed wiring board 50) of each unit 23a to 23d, respectively. The inkjet head units 23a to 23d and the height sensors 24a to 24d are, for example, 40 mm to 50 mm or more apart in the Y-axis direction.

  The height sensors 24a to 24d are, for example, laser displacement meters, and can measure the distance (height) along the vertically lower side (Z-axis negative direction) of the installation positions of the sensors 24a to 24d with an error range of about 10 μm, for example. it can. When the printed wiring board 50 is held on the stage 22, the height sensors 24a to 24d measure the distance (height) from the sensors 24a to 24d to the position on the printed wiring board 50 vertically below the sensors 24a to 24d. . The measured height data is transmitted to the control device 40.

3A and 3B are schematic views showing a droplet discharge surface of the inkjet head unit. As shown in FIG. 3A, the inkjet head unit 23a includes, for example, inkjet heads 23a _{1 to} 23a ₄ having the same configuration. The inkjet heads 23a _{1 to} 23a ₄ are arranged along the Y-axis direction as a whole while their relative positions are sequentially shifted in the negative X-axis direction.

FIG. 3B shows details of the inkjet head. The inkjet head 23a ₁ includes two nozzle rows, and the nozzles in the same nozzle row are arranged at intervals of 160 μm along the X-axis direction. The nozzle array on the Y axis positive direction side is formed such that the nozzle arrangement position is shifted by 80 μm in the X axis negative direction with respect to the nozzle array on the Y axis negative direction side. For this reason, the inkjet head 23a ₁ includes 384 inkjet nozzles arranged in a staggered manner at intervals of 80 μm in the X-axis direction. Each inkjet nozzle is configured to include a piezo element, and ejects ink in response to voltage application. Ink ejection (voltage application) is controlled by the control device 40.

The inkjet head 23a ₂ is disposed on the X axis negative direction side by 20 μm with respect to the inkjet head 23a ₁ . Similarly, the inkjet heads 23a ₃ and a ₄ are disposed on the X axis negative direction side by 20 μm with respect to the inkjet heads 23a ₂ and a ₃ , respectively. As a result, the inkjet head unit 23a includes nozzles arranged at intervals of 20 μm in the X-axis direction.

  The inkjet head units 23b to 23d also have the same configuration as the inkjet head unit 23a. Therefore, the drawing apparatus according to the first embodiment includes an inkjet nozzle group having a resolution of 20 μm in a range of 120 mm along the X-axis direction.

  FIG. 4 is a schematic diagram showing a part of the drawing apparatus according to the first embodiment. The ball screw 25d is fixed to the column 21c via the connecting member 28a. The inkjet head unit 23d is held by a ball screw 25d so as to be movable in the Z-axis direction by a driving force generated by a motor 26d. The movement of the inkjet head unit 23d in the Z-axis direction is controlled by the control device 40.

  The printed wiring board 50 is moved in the positive direction of the Y axis at, for example, 300 mm / second. The height sensor 24d arranged on the Y axis negative direction side of the inkjet head unit 23d measures the distance (height) to the surface of the printed wiring board 50 and transmits the measured data to the control device 40. Based on the height measured by the height sensor 24d, the control device 40 sets the stage so that the distance from the droplet discharge surface of the inkjet head unit 23d to the printed wiring board 50 is constant, for example, 0.5 mm. 22 controls the movement of the printed wiring board 50 and the movement of the inkjet head unit 23d in the Z-axis direction. For example, when the positions P and Q are respectively arranged in the negative Z-axis direction of the height sensor 24d, and the height sensor 24d measures the height to the printed wiring board 50 as p and q, the inkjet head unit 23d When the ink 51 is ejected to the position Q, the ink 51 is moved by pq in the positive direction of the Z-axis than when the ink 51 is ejected to the position P. The inkjet head unit 23d discharges the ink 51 while moving up and down in the Z-axis direction along the warp of the printed wiring board 50 vertically below.

  The ink 51 ejected from the inkjet head unit 23d and applied onto the wiring board 50 is, for example, ultraviolet light emitted from the light source 27 disposed via the connecting member 28c on the Y axis positive direction side of the inkjet head unit 23d. Thus, the surface portion is cured (temporarily cured). The emission of ultraviolet light by the light source 27 is controlled by the control device 40.

  Although FIG. 4 shows the inkjet head unit 23d, the same applies to the other inkjet head units 23a to 23c. The inkjet head units 23a to 23c are held by the ball screws 25a to 25c so as to be independently movable in the Z-axis direction by the driving force generated by the motors 26a to 26c. The ball screws 25a to 25c are fixed to the column 21c via the connecting member 28a. The movement of the inkjet head units 23a to 23c in the Z-axis direction is controlled by the control device 40. The inkjet head units 23a to 23c are controlled such that the distance to the printed wiring board 50 is always 0.5 mm based on the heights measured by the corresponding height sensors 24a to 24c. Then, the ink 51 is ejected while being moved in the Z-axis direction. The ink 51 ejected and applied onto the wiring board 50 is temporarily cured by ultraviolet light emitted from the light source 27.

  According to the drawing apparatus according to the first embodiment, droplets can be generated while performing control such that the distance from the droplet discharge surface (inkjet nozzle) to the printed wiring board 50 is kept constant in units of the inkjet head units 23a to 23d. Since ejection is performed, it is possible to perform drawing with high accuracy even on the printed wiring board 50 having warpage. For example, the distance from the droplet discharge surface of each unit 23a to 23d to the wiring board 50 is maintained within a range of 0.5 mm ± 0.1 mm, and the landing positions and sizes of the droplets discharged from each unit 23a to 23d are the same. By being stabilized, drawing is performed with high accuracy.

  FIG. 5 is a schematic view showing a part of a drawing apparatus according to the second embodiment. The second embodiment does not include the height sensors 24a to 24d and the connecting member 28b. Further, the printed wiring board 50 on which the warpage (height from the surface of the stage 22 (mounting horizontal plane), which differs depending on the position on the printed wiring board 50) is measured is placed on the stage 22. The warpage data of the printed wiring board 50 is stored in the storage device 40a.

  Based on the warpage data of the printed wiring board 50 stored in the storage device 40a, the control device 40 moves from the droplet discharge surface of the inkjet head units 23a to 23d to the printed wiring board 50 moved by the stage 22. The movement of the printed wiring board 50 by the stage 22 and the movement of the units 23a to 23d in the Z-axis direction are controlled so that the distance is constant, for example, 0.5 mm. At the same time, based on the data of the area where the solder resist is to be formed on the printed wiring board 50, the ink ejection from the inkjet head units 23a to 23d is performed so that the ink is applied to a predetermined area on the printed wiring board 50. Control.

  In the drawing apparatus according to the second embodiment, the movement of the inkjet head units 23a to 23d is controlled according to the warp of the printed wiring board 50, as in the first embodiment. According to the second embodiment, it is possible to perform highly accurate drawing without using the height sensors 24a to 24d.

  6A and 6B are schematic views showing a part of a drawing apparatus according to the third embodiment. As shown in FIG. 6A, the third embodiment does not include the ball screws 25a to 25d, the motors 26a to 26d, the height sensors 24a to 24d, and the connecting member 28b, and includes the roller 29. Different from the embodiment. The ink jet head units 23a to 23d are fixed to the column 21c via the connecting member 28a.

  The roller 29 is disposed on the Y axis negative direction side of the ink 51 dropping position by the ink jet head units 23a to 23d, and presses the printed wiring board 50 so as to be movable in the Y axis direction on the stage 22. By pressing the printed wiring board 50 with the roller 29, the warp of the printed wiring board 50 at the ink 51 dropping position is corrected, and the distance from the droplet discharge surface of the inkjet head units 23a to 23d to the printed wiring board 50 is increased. It is kept constant, for example 0.5 mm. According to the third embodiment, high-precision drawing can be performed without moving the inkjet head units 23a to 23d in the Z-axis direction.

  6B, the length along the X-axis direction of the roller 29 is shorter than the length along the X-axis direction of the inkjet head units 23a to 23d (inkjet nozzles). For drawing on the printed wiring board 50, the wiring board 50 is pressed by the roller 29, and the ink 51 is ejected from the units 23a to 23d while moving the wiring board 50 in the positive direction of the Y-axis, so that the X-axis direction is 120 mm. After the ink 51 is applied and the applied ink 51 is temporarily cured with ultraviolet light emitted from the light source 27, the wiring board 50 is moved by the stage 22 in, for example, the X-axis positive direction and the Y-axis negative direction. Further, while moving the wiring board 50 in the positive Y-axis direction, the ink 51 is applied and temporarily cured in a range of 120 mm in the X-axis direction adjacent to the region where the ink 51 is temporarily cured. By repeating this, drawing is performed on the entire pattern forming surface of the printed wiring board 50. Therefore, when the length along the X-axis direction of the roller 29 is longer than the length along the X-axis direction of the inkjet head units 23a to 23d (inkjet nozzles), the roller 29 presses the temporarily cured ink 51. As a result, the pattern is damaged and the ink 51 adheres to the roller 29. The reason why the length along the X-axis direction of the roller 29 is shorter than the length along the X-axis direction of the inkjet head units 23a to 23d (inkjet nozzles) is to avoid this problem. When the printed wiring board 50 is moved in the X-axis direction by the stage 22, the roller 29 is moved in the Z-axis positive direction, and the pressing of the wiring board 50 is released.

  FIGS. 7A and 7B are schematic views showing a part of a drawing apparatus according to the fourth embodiment. The fourth embodiment is different from the third embodiment in that the roller 29 is not included and the chuck plate 22a of the stage 22 has a feature. Also, the control contents of the control device 40 are different.

As shown in FIG. 7A, the chuck plate 22a includes suction holes 22a ₁ and 22a ₂ for sucking and holding the printed wiring board 50. The suction holes 22a ₁ , 22a _2, etc. have a circular shape with a diameter of 3 mm, for example, and are arranged at intervals of 20 mm in the X-axis direction and the Y-axis direction, respectively.

As shown in FIG. 7B, in the chuck plate 22a of the drawing apparatus according to the fourth embodiment, the suction holes 22a ₁ and 22a ₂ are provided with valves 22A ₁ and 22A ₂ , respectively. The suction holes 22a ₁ and 22a ₂ suck the printed wiring board 50 when the valves 22A ₁ and 22A ₂ are open, respectively, and do not suck when the valves 22A ₁ and 22a ₂ are closed. The control device 40 controls whether or not the valves 22A ₁ and 22A ₂ are opened and closed and the printed wiring board 50 is sucked by the suction holes 22a ₁ and 22a ₂ .

A through hole is formed in the printed wiring board 50. The control device 40 opens the valve when the through hole is not disposed on the suction hole, and sucks through the suction hole, and closes the valve when the through hole is disposed on the suction hole. The suction hole is controlled so as not to suck. The FIG. 7 (B), the exhibited when the through-hole of the printed wiring board 50 on the suction holes 22a ₁ is arranged. In this case, the control unit 40, the valve 22A ₁ closed, the valve 22A ₂ the open state, to suck the printed wiring board 50 by the suction holes 22a _2.

  While the chuck plate 22a does not suck the printed wiring board 50 at the position where the through hole is formed and sucks the printed wiring board 50 at the position where the through hole is not formed, the stage 22 moves the wiring board 50 in the Y-axis positive direction. Moving. Ink 51 is ejected from the inkjet head units 23 a to 23 d toward the moved wiring board 50, and drawing on the printed wiring board 50 is performed.

  According to the drawing apparatus of the fourth embodiment, the suction force of the chuck plate 22a can be increased and the printed wiring board 50 can be held with the warp corrected, so that drawing can be performed with high accuracy. .

  In addition, by placing the printed wiring board 50 on the chuck plate 22a so that the through hole is not disposed on the suction hole, the reliability of the suction is improved and the warp of the printed wiring board 50 is corrected, thereby achieving high accuracy. Can be drawn.

    Although the present invention has been described with reference to the embodiments, the present invention is not limited thereto.

  For example, in the first and second embodiments, the movement of the inkjet head unit in the Z-axis direction is controlled so that the distance from the droplet discharge surface of the inkjet head unit to the printed wiring board is constant. Control may be performed so that the distance between the two is within a predetermined range.

  In the first and second embodiments, the inkjet head unit is moved in the Z-axis direction. For example, a mechanism for holding the printed wiring board so as to be movable in the Z-axis direction is attached to the stage. Can also be moved. For example, the inkjet head unit and the printed wiring board may be relatively moved so that the distance between them is constant.

  Furthermore, in the first and second embodiments, the inkjet head unit is configured to be movable in the Z-axis direction, but the substrate holding surface of the stage (for example, a plane parallel to the XY plane, the printed wiring board extends as a whole. It suffices if it can move in the direction intersecting the plane parallel to the existing plane). In this case, the movable direction may be different for each inkjet head unit.

  Further, in all the embodiments, the printed wiring board is moved in the XY plane direction with respect to the inkjet head unit or the like by the stage. For example, the fixed stage is used to move the frame 21 in the Y-axis direction. 23a to 23d, height sensors 24a to 24d, ball screws 25a to 25d, motors 26a to 26d, light sources 27, and connecting members 28a to 28c may be attached to the frame 21 so as to be movable in the X-axis direction. . In this case, in the third embodiment, the roller 29 is synchronized with the movement of the inkjet head units 23a to 23d in the Y-axis direction, for example, the position along the Y-axis direction of the inkjet head units 23a to 23d, and the roller The printed wiring board 50 is moved in the Y-axis direction while being pressed so that the distance between it and 29 is constant. In addition, the roller 29 that has been released from the press of the printed wiring board 50 and moved in the positive Z-axis direction is configured to be movable in the X-axis direction. In this way, not only in the Z-axis direction but also in the X-axis direction and the Y-axis direction, the inkjet head unit and the printed wiring board may be relatively moved. Even in the case of the apparatus configuration as described above, the operation control of each unit is performed by the control apparatus 40.

  With the drawing apparatus according to all the embodiments, for example, the distance between the printed wiring board 50 held on the stage 22 and the inkjet head units 23a to 23d (nozzles (rows) thereof) is maintained within a predetermined range, respectively. Drawing on the printed wiring board 50 can be performed. In this case, the drawing accuracy can be improved by setting each predetermined range to an equal range, more preferably a constant value.

  It will be apparent to those skilled in the art that other various modifications, improvements, combinations, and the like are possible.

  It can be widely used for pattern drawing performed by discharging droplets.

10 printed wiring board 20 surface plate 21 frame 21a, 21b column 21c column 22 stage 22a chuck plate 22a ₁ , 22a ₂ suction hole 22A ₁ , 22A ₂ valve 22θ θ stage 22x X stage 22y Y stage 23a-23d inkjet head unit 23a ₁ -23a ₄ Inkjet heads 24a-24d Height sensors 25a-25d Ball screws 26a-26d Motor 27 Light sources 28a-28c Connecting member 29 Roller 40 Controller 40a Storage device 50 Printed wiring board 51 Ink

Claims (10)

A stage having a holding surface, and holding the substrate on the holding surface;
First and second discharge regions for discharging droplets toward the substrate held on the holding surface;
The distance between the substrate held on the holding surface and the first discharge region, and the distance between the substrate held on the holding surface and the second discharge region are respectively in predetermined ranges. A drawing device maintained within,
The stage holds the substrate in a first direction within the holding surface so as to be relatively movable between the first and second ejection regions;
The second discharge region is disposed on a side of the first discharge region in a direction parallel to the direction intersecting the first direction and the holding surface,
The first and second ejection regions can be moved relative to the substrate in directions parallel to the second and third directions intersecting the holding surface, respectively.
Further, the relative movement of the substrate in the first direction and the direction parallel to the second and third directions of the first and second ejection regions according to the warp of the substrate. A drawing apparatus including a control device for controlling relative movement of the image. Furthermore, a first measuring instrument that is disposed on the side opposite to the first direction with respect to the first discharge area and measures the distance to the substrate held on the holding surface;
A second measuring instrument that is disposed on the side opposite to the first direction with respect to the second ejection region and measures a distance to the substrate held on the holding surface;
The control device is configured such that the distance between the substrate moved relatively in the first direction and the first discharge region is constant based on the distance measured by the first measuring instrument. In addition, based on the distance measured by the second measuring instrument, the distance between the substrate moved relatively in the first direction and the second ejection region is constant. Controlling relative movement of the substrate in the first direction and relative movement of the first and second ejection regions in a direction parallel to the second and third directions. Item 2. The drawing apparatus according to Item 1.   The drawing apparatus according to claim 1, wherein the second direction and the third direction are parallel directions. And a storage device storing the warpage data of the substrate,
In the control device, the distance between the substrate moved relatively in the first direction and the first and second ejection regions is constant based on data stored in the storage device. As described above, the relative movement of the substrate in the first direction and the relative movement of the first and second ejection regions in a direction parallel to the second and third directions are controlled. The drawing apparatus according to claim 1. A stage having a holding surface, and holding the substrate on the holding surface;
First and second discharge regions for discharging droplets toward the substrate held on the holding surface;
The distance between the substrate held on the holding surface and the first discharge region, and the distance between the substrate held on the holding surface and the second discharge region are respectively in predetermined ranges. A drawing device maintained within,
The stage holds the substrate in a first direction within the holding surface so as to be relatively movable between the first and second ejection regions;
The second discharge region is disposed on a side of the first discharge region in a direction parallel to the direction intersecting the first direction and the holding surface,
Further, the roller is disposed on the opposite side to the first direction with respect to the first and second discharge areas, and presses the substrate movably in the first direction on the stage. A roller having a length along a direction parallel to a direction perpendicular to the first direction and the holding surface is shorter than a length along the same direction of the discharge region including the first and second discharge regions; A drawing apparatus including: A stage having a holding surface, and holding the substrate on the holding surface;
First and second discharge regions for discharging droplets toward the substrate held on the holding surface;
The distance between the substrate held on the holding surface and the first discharge region, and the distance between the substrate held on the holding surface and the second discharge region are respectively in predetermined ranges. A drawing device maintained within,
The stage has a plurality of suction holes for holding a substrate having a through-hole formed on the holding surface and capable of sucking the substrate, and a plurality of suction holes can be controlled for each suction hole. With suction holes
Further, the control device controls whether or not the substrate is sucked for each suction hole, and does not suck the suction hole arranged below the through hole of the substrate, and sucks the suction hole not arranged. A drawing device having a control device for performing control. A holding surface, a stage for holding the substrate on the holding surface, and first and second discharge regions for discharging droplets toward the substrate held on the holding surface; Drawing that maintains the distance between the formed substrate and the first discharge region, and the distance between the substrate held on the holding surface and the second discharge region within a predetermined range, respectively. A drawing method performed using an apparatus,
(A) a step of grasping warpage of the substrate;
(B) According to the warp of the substrate, the positions of the first and second ejection regions are relatively changed with respect to the substrate in a direction intersecting with a plane extending as a whole of the substrate. And a step of discharging droplets from the first and second discharge regions toward the substrate.   In the step (b), the positions of the first and second ejection regions are set between the substrate and the substrate so that the distances between the substrate and the first and second ejection regions are constant. The drawing method according to claim 7, wherein each of them is changed relatively. A holding surface, a stage for holding the substrate on the holding surface, and first and second discharge regions for discharging droplets toward the substrate held on the holding surface; Drawing that maintains the distance between the formed substrate and the first discharge region, and the distance between the substrate held on the holding surface and the second discharge region within a predetermined range, respectively. A drawing method performed using an apparatus,
(A) preparing a substrate;
(B) Dropping droplets from the first and second ejection regions toward the substrate while moving the substrate relative to the first and second ejection regions in a first direction. A step of discharging,
In the step (b), the first direction in the plane opposite to the first direction and the substrate as a whole extends with respect to the first and second ejection regions. A drawing that presses the substrate movably in the first direction in a range in which the length along the direction orthogonal to the length is shorter than the length along the same direction of the discharge region including the first and second discharge regions. Method. A holding surface, a stage for holding the substrate on the holding surface, and first and second discharge regions for discharging droplets toward the substrate held on the holding surface; Drawing that maintains the distance between the formed substrate and the first discharge region, and the distance between the substrate held on the holding surface and the second discharge region within a predetermined range, respectively. A drawing method performed using an apparatus,
(A) preparing a substrate on which a through hole is formed;
(B) discharging droplets from the first and second discharge regions toward the substrate;
A drawing method in which, in the step (b), the substrate at the position where the through hole is formed is not sucked, and the liquid droplet is discharged toward the substrate in the state where the substrate at the position where the through hole is not formed is sucked.

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