WO2017076361A1 - Résonateur à quartz smd et procédé d'usinage de boîtier de carte complète correspondant - Google Patents

Résonateur à quartz smd et procédé d'usinage de boîtier de carte complète correspondant Download PDF

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Publication number
WO2017076361A1
WO2017076361A1 PCT/CN2016/104821 CN2016104821W WO2017076361A1 WO 2017076361 A1 WO2017076361 A1 WO 2017076361A1 CN 2016104821 W CN2016104821 W CN 2016104821W WO 2017076361 A1 WO2017076361 A1 WO 2017076361A1
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WIPO (PCT)
Prior art keywords
metal
whole
quartz crystal
ceramic
plate
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PCT/CN2016/104821
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English (en)
Chinese (zh)
Inventor
黄屹
李斌
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烟台明德亨电子科技有限公司
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Priority to JP2018517366A priority Critical patent/JP2018533869A/ja
Publication of WO2017076361A1 publication Critical patent/WO2017076361A1/fr

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks

Definitions

  • the invention relates to a novel SMD quartz crystal resonator and a whole board packaging processing technology thereof, and belongs to the technical field of electronic components and processing techniques thereof.
  • the production process of the existing SMD quartz crystal resonator is as follows: 1. The ceramic whole plate is processed according to the quartz crystal resonator ceramic substrate production process, and then divided and selected to form a single SMD quartz crystal resonator ceramic base. 2, the wafer is cleaned, coated, and glued in the pedestal to form a single SMD quartz crystal resonator; 3. A single metal piece (ceramic piece) is processed, and the cover is sealed on the resonator to form a single SMD quartz. Crystal resonator.
  • the above production process not only has low production efficiency, but also has high material cost.
  • SMD quartz crystal resonators and metal sheets are sealed in the following four ways: 1. Parallel sealing (metal packaging); 2. Tunnel furnace hot-melt sealing (gold-tin package); 3. Plastic packaging (resin glue or glass glue); 4, electron beam sealing (metal package).
  • the invention solves the deficiencies in the prior art, and provides an SMD quartz crystal resonator with low material cost, small stress and long-term stability of product frequency, and a processing method of the resonator, which does not need
  • the pedestal is transferred to the tooling processing, which has high production efficiency, small space occupation and low production cost.
  • the whole process of the whole board packaging process of a novel SMD quartz crystal resonator of the invention is that the raw material for the production does not use a single SMD quartz crystal resonator ceramic base and a single metal piece, and the whole plate ceramic base is used instead. It is processed into a whole plate resonator, sealed with a metal plate, and finally divided into a single SMD quartz crystal resonator, including the following process steps:
  • a plurality of quartz crystal pedestals 2 arranged in a matrix are processed on the ceramic whole plate 1.
  • the susceptors of the ceramic whole plate 1 may be welded with metal rings or not welded, and the pedestals are connected but not electrically connected;
  • the metal whole plate 4 is processed according to the size and structure of the ceramic whole plate 1, and a plurality of metal pieces 5 having the same matrix shape as the respective bases 2 on the ceramic whole plate 1 are formed on the metal whole plate 4, and the adjacent metal pieces 5 pass between The metal connecting wires 6 are connected;
  • the wafer is placed in each of the susceptors 2 on the ceramic whole plate 1 to be dispensed and solidified to form a plurality of Quartz crystal resonator, further fine-tuning the resonators on the ceramic whole plate 1;
  • the metal whole plate 4 is covered on the respective resonators of the ceramic whole plate 1, and the periphery of each metal piece 5 of the metal whole plate 4 is mounted on the metallization layer 11 of each of the susceptors 2 of the corresponding ceramic whole plate 1. Processed and sealed as a whole;
  • the metal connection lines 6 between the metal sheets 5 are cut, and the respective connected quartz crystal resonators are formed on the ceramic whole board 1;
  • each connected quartz crystal resonator is tested on the ceramic whole board 1, and the defective product is marked, and then the ceramic whole board is divided, and a qualified quartz crystal crystal resonator is sorted and packaged.
  • the ceramic whole board 1 is provided with four ceramic whole board positioning holes 7 on both sides in the longitudinal direction, and the metal whole board positioning holes 8 are also provided at the same position of the corresponding metal whole board 4, the step 4 When the ceramic whole plate 1 and the metal whole plate 4 are packaged, the metal whole plate 4 is covered on the ceramic whole plate 1 by using a clamp and overlapping by the positioning holes;
  • the periphery of each metal piece of the metal whole plate 4 is mounted on the metal plating layer of each pedestal 2 of the corresponding ceramic whole plate 1, and is laser welded. Fusion welding as one; or use metal plate material and base metal plating to heat melt through the tunnel furnace; or apply resin glue or glass glue on the periphery of each metal plate 5 of the metal whole plate 4, and then the base of the ceramic whole plate 1 2 bonding;
  • the respective metal wires 6 are cut by a laser to form respective connected quartz crystal resonators.
  • the novel SMD quartz crystal resonator and the whole board packaging processing technology of the invention have the following beneficial effects: 1.
  • the raw material adopts ceramic whole board, the structure is compact, the dividing process is omitted, the procurement cost is low; 2.
  • the whole process is directly adopted in the production process. Transfer, no need to transfer a single load on the tooling, occupying small space, high production efficiency, low production cost; 3, the metal piece is completed by purchasing the whole plate metal laser cutting, without purchasing the processed metal piece, saving material cost; 4
  • 4 innovatively adopts the current advanced laser cutting and welding process, the product has small deformation and reduced stress, which is conducive to the long-term stability of the product frequency.
  • the material cost and production cost of the product of the invention are lower than that of the conventional product, and the high production efficiency has a good application prospect in the field of electronic component processing.
  • Figure 1 Schematic diagram of a novel SMD quartz crystal resonator ceramic whole plate of the present invention
  • FIG. 2 is a schematic structural view of a novel SMD quartz crystal resonator base according to the present invention.
  • Figure 3 side view of Figure 2;
  • Figure 4 Rear view of Figure 2
  • FIG. 5 is a schematic structural view of a metal whole plate of a novel SMD quartz crystal resonator according to the present invention.
  • FIG. 6 is a schematic structural view of a novel SMD quartz crystal resonator metal piece according to the present invention.
  • FIG. 7 is a schematic structural view of a novel SMD quartz crystal resonant device of the present invention.
  • Fig. 8 is a schematic view showing the melting structure of each of the resonating members of the ceramic plate and the metal plates of the whole metal plate of the novel SMD quartz crystal resonator of the present invention.
  • the ceramic whole plate 1 structure is arranged in a matrix according to each phase of the quartz crystal base 2, and is not conductive; the ceramic whole plate 1 each base 2 is welded with a metal ring or not The welding metal ring can be; the ceramic whole board 1 is provided with ceramic whole board positioning holes 7 on both sides;
  • the wafer 3 is placed in each of the susceptors 2 of the ceramic whole plate 1, and the dispensing platform 9 and the sub-electrode 10 of the wafer 3 are connected by the conductive adhesive 12; and the ceramic whole plate 1 is placed in the tunnel.
  • the furnace is cured and annealed by the conductive adhesive to realize the connection between the wafer 3 and the susceptor 2, and a plurality of quartz crystal resonators arranged in a matrix are formed on the ceramic whole plate 1;
  • each quartz crystal resonator is finely adjusted to reach a target frequency
  • the ceramic whole plate positioning hole 7 and the metal whole plate positioning hole 8 are positioned, the metal whole plate 4 is covered on the ceramic whole plate 1 and pressed, and placed in a vacuum chamber, and the laser is passed through the gap of the clamp plate to perform two weldings. , the metal plate of the metal whole plate 4 and the periphery of each quartz crystal resonator of the ceramic whole plate 1 are welded;
  • the ceramic whole plate 1 of the embodiment realizes several quartz crystal resonators and the metal strip
  • the processing method for forming the metal whole plate 4 is the same as that of the first embodiment. The difference is that when the metal whole plate 4 and the ceramic whole plate 1 are packaged in step 4), the high-temperature ultraviolet resin is coated on the periphery of each metal piece 5 of the metal whole plate 4. The glue or glass glue is bonded to the susceptors 2 of the ceramic whole plate 1 in a vacuum chamber.
  • the ceramic whole plate 1 of the embodiment realizes several quartz crystal resonators and the metal strip
  • the processing method for forming the metal whole plate 4 is the same as that of the first embodiment. The difference is that when the metal whole plate 4 and the ceramic whole plate 1 are packaged in step 4), an alloy material having a melting point of 300 to 400 degrees Celsius is selected as the metal whole plate material.
  • the metallized coating material of the ceramic whole plate 1 is heat-sealed in a tunnel furnace.
  • the invention relates to an SMD quartz crystal resonator and a processing method thereof, which have the following beneficial effects: 1.
  • the raw material adopts a ceramic whole board, the structure is compact, the dividing process is omitted, and the procurement cost is low; 2.
  • the production process is directly transmitted by the whole board, and is not required. Single transfer on the tooling, small footprint, high production efficiency, low production cost; 3, the metal sheet is completed by purchasing the whole plate metal laser cutting, without purchasing the processed metal sheet, saving material cost; 4, innovation adopts the current Advanced laser cutting and welding processes, the product has small deformation and reduced stress, which is conducive to the long-term stability of the product frequency.
  • the material cost and production cost of the product of the invention are lower than that of the conventional product, and the high production efficiency has a good application prospect in the field of electronic component processing.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

L'invention concerne un procédé d'usinage de boîtier de carte complète pour un résonateur à quartz pour montage en surface (SMD). Le procédé d'usinage de boîtier de carte complète comprend les étapes d'usinage suivantes : (1), usinage d'une pluralité de bases en quartz (2) agencées selon une matrice sur une carte complète céramique (1); (2), formation d'une pluralité de feuilles métalliques (5), dans la même forme de matrice que chaque base (2) sur la carte complète céramique (1), sur une carte complète métallique (4), les feuilles métalliques adjacentes (5) étant connectées au moyen d'un fil de connexion métallique (6); (3), usinage d'une partie résonnante en quartz sur la carte complète céramique (1); et (4) encapsulation de la carte complète céramique (1) et de la carte complète métallique (4), et enfin, division du résultat en un résonateur à quartz SMD individuel. Le résonateur SMD présente un faible coût de fabrication et de faibles contraintes, contribue à la stabilité à long terme de la fréquence du produit, et présente un processus de fabrication simple et commode.
PCT/CN2016/104821 2015-11-05 2016-11-07 Résonateur à quartz smd et procédé d'usinage de boîtier de carte complète correspondant WO2017076361A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2018517366A JP2018533869A (ja) 2015-11-05 2016-11-07 Ｓｍｄ水晶共振器及びその一枚板パッケージング加工工程

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201510746226.0 2015-11-05
CN201510746226.0A CN105305995B (zh) 2015-11-05 2015-11-05 一种smd石英晶体谐振器及其整板封装加工工艺

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Cited By (1)

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CN116582102A (zh) * 2023-07-13 2023-08-11 东晶电子金华有限公司 一种石英晶体谐振器提高封装技术的方法

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CN105305995B (zh) * 2015-11-05 2016-11-30 烟台明德亨电子科技有限公司 一种smd石英晶体谐振器及其整板封装加工工艺
CN106067776B (zh) * 2016-07-06 2018-10-02 烟台明德亨电子科技有限公司 表面贴石英晶体谐振器生产中非接触式喷胶系统及方法
CN106067775B (zh) * 2016-07-06 2019-04-26 四川明德亨电子科技有限公司 表面贴石英晶体谐振器生产中整板上片装置及方法
CN108111139B (zh) * 2016-11-25 2023-10-31 四川明德亨电子科技有限公司 一种smd石英谐振器及其加工设备及方法
CN106877833B (zh) * 2016-12-29 2020-04-14 北京晨晶电子有限公司 一种石英晶体谐振器的加工方法
CN107517044B (zh) * 2017-08-10 2024-04-09 四川明德亨电子科技有限公司 一种整板smd石英晶体谐振器基板结构及其加工方法
CN107517043B (zh) * 2017-08-10 2023-10-20 四川明德亨电子科技有限公司 一种smd石英晶体谐振器加工方法及其谐振器
CN109639254B (zh) * 2018-11-28 2023-05-09 江苏浩都频率科技有限公司 一种smd3225晶片的谐振器制造工艺
CN109617535B (zh) * 2018-11-28 2023-09-15 江苏浩都频率科技有限公司 一种smd2016晶片的谐振器制造工艺
CN110086443A (zh) * 2019-05-07 2019-08-02 中山市镭通激光科技有限公司 一种晶振的制造方法
CN110504939A (zh) * 2019-08-29 2019-11-26 北京康特睿科光电科技有限公司 一种晶体振荡器及其制造方法
CN110798164A (zh) * 2019-10-25 2020-02-14 苏师大半导体材料与设备研究院(邳州)有限公司 一种电子元器件的制造方法
CN116455343B (zh) * 2023-05-15 2024-01-23 烟台明德亨电子科技有限公司 一种晶振用陶瓷基座的加工方法

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CN116582102B (zh) * 2023-07-13 2023-09-29 东晶电子金华有限公司 一种石英晶体谐振器提高封装技术的方法

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CN105305995A (zh) 2016-02-03
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