CN107517043B - SMD quartz crystal resonator processing method and resonator thereof - Google Patents
SMD quartz crystal resonator processing method and resonator thereof Download PDFInfo
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- CN107517043B CN107517043B CN201710680528.1A CN201710680528A CN107517043B CN 107517043 B CN107517043 B CN 107517043B CN 201710680528 A CN201710680528 A CN 201710680528A CN 107517043 B CN107517043 B CN 107517043B
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Classifications
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- H—ELECTRICITY
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- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0542—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a lateral arrangement
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
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- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
The invention relates to a processing method of an SMD quartz crystal resonator, firstly providing a semi-finished product of the whole-plate resonator, wherein the semi-finished product of the whole-plate resonator comprises a base whole plate and a cover plate whole plate covered on the base whole plate; cutting the whole cover plate on the whole resonator to form a single base cover plate, and spraying a protective layer on the upper surface and the cut surface of each base cover plate; the method for spraying the protective layer comprises the following steps: a pretreatment process and a spraying process, wherein the pretreatment process comprises the following steps: cleaning, flushing, air showering and drying; the spraying process comprises the following steps: firstly, spraying a spraying material on the upper surface and the cut surface of each base cover plate of the whole resonator plate by adopting an electrostatic spraying process to form a coating, and then curing the coating to form a protective layer on the upper surface and the cut surface of each base cover plate; the purpose is to improve the characteristics of salt spray resistance and high temperature and high humidity resistance of the SMD quartz crystal resonator in a severe environment, and also relates to the resonator prepared by the method.
Description
Technical Field
The invention relates to a processing method of an SMD quartz crystal resonator and the resonator thereof, belonging to the technical field of resonators.
Background
SMD quartz crystal resonators are commonly used electronic devices, and their use is increasing with the development of digitization technology. However, the existing SMD quartz crystal resonator has technical obstacles in terms of improving the processing efficiency and the processing quality from the aspects of the device structure and the processing technology, and in addition, the processing technology has the problem of environmental pollution.
The cover plate of the traditional single-processed SMD quartz crystal resonator is generally formed by chemical nickel plating or electroplating a nickel protective layer, and the cover plate of the traditional single-processed SMD quartz crystal resonator is also formed by chemical nickel plating.
The electroless nickel plating and the electroplated nickel include the following steps: 1. heating to remove oil on the whole cover plate by using strong alkali, and then flushing with three clear water to remove the strong alkali on the whole cover plate; 2. removing rust on the whole cover plate by using strong acid (hydrochloric acid and the like), and then flushing the whole cover plate by using three clear water to remove the strong acid on the whole cover plate; 3. the surface of the product is corroded by using hydrochloric acid or a mixture of sulfuric acid and hydrogen peroxide through chemical grinding, and then three clean water washes are carried out to remove surface residues; 4. electroless nickel or electrolytic nickel plating.
The chemical nickel plating protective layer is required to be washed by strong acid and strong alkali and is required to be washed by clear water for many times, and the washing water contains nickel or strong acid or strong alkali and cannot be directly discharged, so that the chemical nickel plating protective layer is required to be recycled, has high cost, wastes water resources and is not environment-friendly;
the chemical plating and the electroplating can produce waste gas, dust particles and noise pollution; the waste water is large and contains heavy metal nickel, which has great threat to plants and human beings.
The protection effect of nickel plating is not good, nickel plating can only plate 3-5 microns, and if plating is thicker, the leather will be peeled, and the cost is higher.
When the chemical nickel plating is performed, nickel can be plated on the cover plate of the resonator, and nickel can be plated on the gold-plated electrode on the bottom surface of the ceramic substrate of the resonator, so that the nickel has lower weldability than gold, and is not beneficial to welding.
The traditional single resonator processing steps are as follows: 1. finishing the processing of the ceramic whole board according to the production process of the ceramic substrate of the quartz crystal resonator, and then dividing and selecting to form a single SMD quartz crystal resonator ceramic base; 2. the wafer is fixed in the base through cleaning, coating and dispensing to form a single SMD quartz crystal resonator; 3. and processing a single metal sheet (ceramic sheet), and sealing the single metal sheet on the resonant piece to form the single SMD quartz crystal resonator.
9-11, a plurality of quartz crystal bases which are arranged in a matrix are arranged on the ceramic whole plate, the bases are connected, through holes 17 are formed in the positions, connected with the adjacent bases, of the top corners, metal coatings 10 are arranged on the inner walls of the through holes 17, metal rings or annular metallized coatings are arranged on the front surfaces of the bases, dispensing platforms A12 and B13 are arranged on the left sides of the rings, supporting platforms are arranged on the right sides of the rings, four electrodes, namely a first electrode 5, a second electrode 6, a third electrode 7 and a fourth electrode 8, are arranged on the back surfaces of the bases, a second through hole 2 and a fourth through hole 4 are further arranged on the bases, the second electrode 6 and the fourth electrode 8 are respectively connected with the annular metallized coatings in a conducting mode, and the first electrode 5 and the third electrode 7 are respectively connected with the dispensing platforms B13 and A12 in a conducting mode through the metal coatings 10 in the through holes;
if the ceramic whole board produced in the step 1 of the single production process is used in the whole board processing process, after the conductive connection between the adjacent base electrodes is cut off later, as shown by the cutting line 21 in fig. 11, the first electrode and the third electrode cannot be connected with the dispensing platforms B and a in a conductive manner, and thus etching fine adjustment cannot be realized.
Because the traditional SMD quartz crystal resonator is generally manufactured by a single piece, the production efficiency is extremely low, the invention patent application number is 201510746226, the invention name is a novel SMD quartz crystal resonator and a processing method using a ceramic whole board as a substrate in the whole board packaging process thereof, the problem of low production efficiency is solved, a plurality of quartz crystal bases which are arranged in a matrix are arranged on the ceramic whole board, the bases are connected, through holes 17 are formed in the connection vertex angles of every two adjacent bases, four electrodes are arranged on the back surfaces of the bases, and the electrodes between the adjacent bases are connected with each other through electrode connecting wires 19, as shown in fig. 1-2.
Firstly, processing quartz crystal resonators on each base, then performing laser seal welding with a whole plate cover plate to form a whole plate quartz crystal resonator, and finally forming a single resonator by whole plate splinter. The splitting principle is as follows: before sintering the ceramic whole plate, cutting the front surface of the ceramic whole plate by using a cutter, and forming a crack line on the front surface of the ceramic whole plate after sintering; the back of the ceramic whole plate is not provided with a split plate line, and the back of the ceramic plate is cut by laser after the whole plate resonator is processed.
Because the front split line after sintering can generate micro deformation, no matter how high the positioning accuracy is, the laser cutting line on the back of the ceramic plate is difficult to align with the front split line 18 of the ceramic plate, and the edge of a single resonator formed by split is easy to generate the problems of burrs, bevel edges, damage and the like.
If the bottom surface and the front surface of the ceramic whole plate are simultaneously cut by using cutters which are aligned up and down strictly before sintering the ceramic whole plate, two symmetrical split plate lines are formed, and the split plate lines break electrode connecting lines among the bases to connect, so that electroplating cannot be realized by post-processing of the quartz crystal resonator.
If the front and back split plate lines are cut after the quartz crystal resonator is processed, the ceramic whole plate is sintered, so that the ceramic whole plate has high hardness, a common cutter for grooving cannot be used, laser lines are required to be drawn, the symmetry of the upper surface and the lower surface is difficult to ensure, and the problems of burrs, bevel edges, damage and the like of the split resonator still exist.
Disclosure of Invention
The invention aims at the defects in the prior art and provides a processing method of an SMD quartz crystal resonator which can form a good protective layer and has low cost and environmental protection.
The technical scheme for solving the technical problems is as follows: the method for processing the SMD quartz crystal resonator comprises the steps of firstly providing a semi-finished product of the whole-plate resonator, wherein the semi-finished product of the whole-plate resonator comprises a whole base plate, wafers fixed on each base plate and a whole cover plate covered on the whole base plate; cutting the whole cover plate on the whole resonator to form a single base cover plate, and spraying a protective layer on the upper surface and the cut surface of each base cover plate to form the whole resonator; finally, detecting and dividing the whole plate resonator into single SMD quartz crystal resonators;
the concrete method for spraying the protective layer comprises the following steps: a pretreatment process and a spraying process, wherein the pretreatment process and the spraying process are carried out,
the pretreatment process comprises the following steps:
first, the resonator plate after the plate cover plate has been cut is cleaned with a cleaning liquid using an organic acid cleaning agent such as: glycolic acid, oxalic acid, ethylenediamine tetraacetic acid, and the like; then, washing by a plurality of pure water channels to remove foreign matters on the cleaning liquid and the whole resonator plate; then, spraying air on the whole plate of the resonator to blow off residual pure water; finally, drying the whole resonator plate;
the spraying process comprises the following steps:
firstly, spraying a spraying material on the upper surface and the cut surface of each base cover plate of the whole resonator plate by adopting an electrostatic spraying process to form a coating, wherein the spraying material is a powder material or a liquid material, and then curing the coating to form a protective layer on the upper surface and the cut surface of each base cover plate.
The processing method has the beneficial effects that:
(1) The cleaning solution adopts an organic acid cleaning agent, has complexation and weak acidity, does not contain harmful chloride ion components, does not cause equipment cavitation and stress corrosion, and is a safe cleaning agent. Compared with the nickel plating pretreatment process, the method saves water resources, can directly discharge flushing water, does not need to be recycled, can reduce cost and is environment-friendly.
(2) The protective layer made of the sprayed resin material can reach more than 20 microns, and the protective effect is good.
(3) When the spraying process is adopted to prepare the protective layer, the electrostatic spraying powder can be recycled and reprocessed, and the waste of materials is avoided.
(4) A protective layer is directly formed on the resonator cover plate by adopting a spraying process, the protective layer is not formed on the electrode on the bottom surface of the resonator, and the weldability of the electrode is not affected.
Further, the powder material is a resin powder such as epoxy resin, polyimide resin, polyester resin, polyurethane resin, etc., and the liquid material is a ceramic paint, ultraviolet glue or varnish.
Further, the coating in the spraying process is cured, the curing temperature ranges from 180 degrees to 260 degrees, the curing mode can adopt a baking or illumination mode, and the baking mode can adopt an infrared baking or a thermal circulating air oven baking mode.
Further, the detection means performs performance test on each connected quartz crystal resonator on the whole base plate, and marks out defective products;
then dividing, and then braiding and packaging the qualified quartz crystal resonators.
Further, the specific processing steps for processing the semi-finished product of the whole plate resonator comprise:
1) Providing or processing base slabs
Processing and manufacturing a matrix-arranged base on a whole base plate, wherein the back surface of the base is provided with four electrodes, the front surface of the base is provided with an annular metal coating, the left side of the ring is provided with dispensing platforms A and B, the right side of the ring is provided with a supporting platform, the bases are connected with each other, and through holes are formed in the junction points of the adjacent four bases;
2) Integral plate of processing cover plate
Processing a cover plate whole plate according to the size and the structure of the base whole plate, forming a plurality of base cover plates with the same matrix shape as each base on the base whole plate on the cover plate whole plate, and connecting adjacent base cover plates through metal connecting wires;
3) Integral plate for processing crystal resonance piece
Firstly, arranging, cleaning and coating the wafer; placing the coated wafers into each base on the whole base plate, dispensing and solidifying to form a plurality of quartz crystal resonance pieces, and further etching and fine-tuning each resonance piece on the whole base plate;
4) Packaging the whole substrate and the whole cover plate to form a whole resonator plate
And after the electric connection between the bases is removed, covering the whole cover plate on the whole resonant piece, enabling the periphery of each cover plate of the whole cover plate to be carried on the corresponding annular metallized plating layer of each resonant piece, and sealing the annular metallized plating layer into a resonator through laser processing to form the whole resonator plate.
Further, in step 1), the whole base plate is prepared as follows:
a) Preparing or providing a ceramic substrate, wherein the whole base plate adopts two layers of ceramic substrates, namely an upper layer of ceramic substrate and a lower layer of ceramic substrate;
b) Punching, namely punching through holes and through holes on an upper ceramic substrate and a lower ceramic substrate which are aligned vertically to form a plurality of through holes which are arranged in a matrix, wherein each through hole comprises an upper through hole arranged on the upper ceramic substrate and a lower through hole arranged on the lower ceramic substrate;
the through holes comprise a first through hole, a second through hole, a third through hole and a fourth through hole, wherein the first through hole and the third through hole are positioned at diagonal positions, and the second through hole and the fourth through hole are positioned at diagonal positions;
c) Carrying out metallization treatment on the lower through hole to enable the inner wall of the lower through hole to be attached with a metal coating, printing a metal wire between the metal coating and an adjacent electrode, and conducting the electrode between the adjacent bases through the metal coating and the metal wire;
d) Carrying out metallization printing on the upper ceramic substrate and the lower ceramic substrate, wherein the metallization printing comprises printing of a metal layer of an annular metal coating, an electrode, dispensing platforms A and B and a supporting platform, so that the electrode is connected with the dispensing platforms A and B and the annular metal coating in a conducting manner;
e) Laminating, namely printing an adhesive between the upper base integral plate and the lower base integral plate to laminate the upper ceramic substrate and the lower ceramic substrate together to form the base integral plate;
f) Dividing the split plate lines, namely cutting the split plate lines which are arranged in a matrix on the front and back of the whole base plate, wherein the split plate lines pass through the circle centers of the through holes;
g) Sintering the whole base plate;
h) And plating nickel and gold layers on the second metal layer.
The beneficial effects of adopting the further technical scheme are as follows: the front and the back of the whole base plate are respectively provided with a split plate line, after the split plate line is cut on the back, as the metal coating on the inner wall of the through hole can not be completely removed, the electrodes between the bases can still be conducted and connected through the metal wire and the metal coating on the inner wall of the through hole, the problem that the split plate line can not be cut on the two sides of the ceramic substrate simultaneously in the whole resonator processing technology is solved, the split plate line is cut on the two sides so as to be convenient for the subsequent split plate technology, and the single resonator formed after splitting has good surface effect.
Further, the conductive connection between the bases is removed by cutting off the metal wire between the electrode and the metal coating layer so as to achieve the purpose of removing the conductive connection between the bases.
Further, in step d), the front and back surfaces of the ceramic substrate are respectively metallized,
printing a first metal layer at the positions of the annular metal coating, the dispensing platforms A and B, the supporting platform and the four electrodes, wherein the first metal layer is made of metal tungsten;
and after the first metal layer is dried, printing a second metal layer on the first metal coating at the positions of the dispensing platforms A and B and the supporting platform, wherein the second metal layer is made of tungsten.
Further, in step d), after the metallization printing, a step of smoothing the metal layer is further included.
Further, the dispensing platform A and the dispensing platform B are respectively connected with the first electrode and the third electrode which are arranged diagonally through conductive materials poured into the third through hole and the first through hole in a conducting way.
Further, the dispensing platform A is connected to the third through hole through a metal connecting wire.
Further, the ceramic substrate is made of alumina material.
Furthermore, the dispensing platforms A and B, the metal connecting wires and the electrodes all adopt tungsten metal.
The invention also relates to the SMD quartz crystal resonator manufactured by the processing method, which is characterized by comprising a base and a base cover plate, wherein the base is provided with a resonant piece accommodating cavity, the front surface of the base is provided with an annular metal coating, the annular metal coating is covered with the metal cover plate, the upper surface and four sides of the metal cover plate are respectively provided with a protective layer, and the protective layers are made of resin materials, ceramic paint, varnish or ultraviolet glue.
The beneficial effects of the resonator in the invention are as follows: the upper surface and the cut surface of the resonator cover plate are both provided with the protective layers, so that the salt spray resistance and the high-temperature and high-humidity resistance of the SMD quartz crystal resonator in a severe environment can be improved, the protective layers are made of electrostatic materials, the protective effect is good, the back electrode is not covered by nickel, and the weldability is good.
Drawings
FIG. 1 is a schematic view of the front structure of a part of a whole base plate in the prior art;
FIG. 2 is a schematic view of the back structure of a portion of a prior art base plate;
FIG. 3 is a schematic view of the back structure of the base of the present invention;
FIG. 4 is a schematic view of the front structure of the base of the present invention;
FIG. 5 is a schematic view of the front structure of a portion of the entire base plate of the present invention;
FIG. 6 is a schematic view of the back structure of a portion of the entire base plate of the present invention;
FIG. 7 is a schematic view of the front structure of the whole base plate of the present invention;
FIG. 8 is a schematic view of the back structure of the whole base plate of the present invention;
FIG. 9 is a schematic front view of a conventional single-piece processed whole base plate;
FIG. 10 is a schematic view of the back structure of a conventional single-piece processed whole base plate;
FIG. 11 is a schematic view of a portion of the entire base plate after powder spraying in accordance with the present invention;
FIG. 12 is a schematic diagram of a packaged whole-board SMD quartz crystal resonator according to the present invention;
FIG. 13 is a schematic view showing a state of processing a quartz crystal resonator on a whole substrate in the present invention;
in the drawings, the list of component names indicated by the respective reference numerals is as follows: 1. the device comprises a first through hole, 2, a second through hole, 3, a third through hole, 4, a fourth through hole, 5, a first electrode, 6, a second electrode, 7, a third electrode, 8, a fourth electrode, 9, a lower ceramic substrate, 10, a metal coating, 11, an upper ceramic substrate, 12, dispensing platforms A,13, dispensing platforms B,14, an annular metal coating, 15, a metal connecting wire, 16, a supporting platform, 17, a through hole, 18, a split plate wire, 19, an electrode connecting wire, 20, a cover plate whole plate, 20-1, a base cover plate, 21, a coating, 22, a metal connecting wire, 23, a wafer, 24, a wafer electrode, 25, conductive glue, 26, a metal wire, 27 and a protective layer.
Detailed Description
The principles and features of the present invention are described below with reference to the drawings, the examples are illustrated for the purpose of illustrating the invention and are not to be construed as limiting the scope of the invention.
The processing method of the invention discloses two embodiments as follows:
example 1
As shown in fig. 3-8, a method for manufacturing an SMD quartz crystal resonator is provided, first, providing a whole-plate resonator semi-finished product, wherein the whole-plate resonator semi-finished product comprises a base whole plate, wafers fixed on each base and a cover plate whole plate 20 covering the base whole plate; cutting the whole cover plate 20 on the whole resonator to form a plurality of base cover plates 20-1, and spraying a protective layer on the upper surface and the cut surface of each base cover plate 20-1; finally, detecting and dividing the whole plate resonator into single SMD quartz crystal resonators, wherein the method comprises the following steps:
the processing steps of the semi-finished product of the whole plate resonator are as follows:
1) Providing or processing base slabs
The method comprises the steps of processing and manufacturing a matrix-arranged base on a whole base plate, wherein four electrodes are arranged on the back surface of the base, an annular metal coating 14 is arranged on the front surface of the base, dispensing platforms A12 and B13 are arranged on the left side in the ring, a supporting platform 16 is arranged on the right side of the ring, the bases are connected with each other, and through holes 17 are formed in the junction of every two adjacent bases;
the specific steps for preparing the whole base plate are as follows:
a) Preparing or providing a ceramic substrate, wherein the whole base plate adopts two layers of ceramic substrates, namely an upper layer of ceramic substrate 11 and a lower layer of ceramic substrate 9;
b) Punching, namely punching through holes and through holes 17, wherein the upper ceramic substrate 11 and the lower ceramic substrate 9 which are aligned vertically are punched with the through holes 17 which are arranged in a matrix form a plurality of bases which are arranged in a matrix, and the through holes 17 comprise upper through holes arranged on the upper ceramic substrate 11 and lower through holes arranged on the lower ceramic substrate 9;
the through holes comprise a first through hole 1, a second through hole 2, a third through hole 3 and a fourth through hole 4, wherein the first through hole 1 and the third through hole 3 are at diagonal positions, and the second through hole 2 and the fourth through hole 4 are at diagonal positions;
c) Metallizing the lower through hole to attach the metal coating 10 to the inner wall, printing a metal wire 26 between the metal coating 10 and the adjacent electrode, and conducting the electrode between the adjacent bases through the metal coating 10 and the metal wire 26;
d) Carrying out metallization printing on the upper ceramic substrate 11 and the lower ceramic substrate 9, and printing a metal layer comprising an annular metal coating 14, electrodes, dispensing platforms A12 and B13 and a supporting platform 16 to connect the electrodes with the dispensing platforms A12 and B13 and the annular metal coating 14 in a conductive manner;
metallized printing, wherein the front and the back of the ceramic substrate are respectively metallized printed,
printing a first metal layer at the positions of the annular metal coating 14, the dispensing platforms A12 and B13, the supporting platform 16 and the four electrodes, wherein the first metal layer is made of metal tungsten;
and after the first metal layer is dried, printing a second metal layer on the first metal layer at the positions of the dispensing platforms A and B and the supporting platform, wherein the second metal layer is metal tungsten, and finally carrying out smoothing treatment on the formed metal layer.
e) Laminating, namely printing an adhesive between the upper base integral plate 11 and the lower base integral plate 9 to laminate the upper ceramic substrate 11 and the lower ceramic substrate 9 together to form the base integral plate;
f) Dividing the split plate lines, namely cutting split plate lines 18 which are arranged in a matrix on the front and back of the whole base plate, wherein the split plate lines 18 pass through the circle centers of the through holes 17, divide the split plate lines, and form two split plate lines which are vertically symmetrical at one time by utilizing cutters which are vertically symmetrical;
g) Sintering the whole base plate;
h) And plating nickel and gold layers on the second metal layer.
2) Processing cover plate whole plate 20
Processing the cover plate whole plate 20 according to the size and the structure of the base whole plate, forming a plurality of base cover plates 20-1 with the same matrix shape as each base on the base whole plate 20 on the cover plate whole plate 20, and connecting adjacent base cover plates 20-1 through metal connecting wires 22;
3) Integral plate for processing crystal resonance piece
As shown in fig. 13, after the wafer 23 is arranged, cleaned and coated to form electrodes 24, the wafer 23 is placed in each base of the whole base plate, and the dispensing platforms a12 and B13 in the base are respectively connected with the two electrodes 24 of the wafer 23 by using conductive adhesive 25; then the whole base plate is put into a tunnel furnace to solidify and anneal the conductive adhesive 25, so as to realize the connection between the wafer 23 and the base, and a plurality of quartz crystal resonators are formed on the whole base plate in a matrix arrangement;
and further placing the whole base plate into a fine tuning machine to fine tune each quartz crystal resonant piece to reach the target frequency.
4) The package base plate and the cover plate, forming a resonator plate, as shown in figure 12,
after the conduction connection between the bases is removed, the metal wires between the electrodes and the metal coating are cut off to achieve the purpose of removing the conduction connection between the bases, a cover plate whole plate 20 is covered on the base whole plate, the periphery of each base cover plate 20-1 of the cover plate whole plate 20 is carried on each base metallization coating of the corresponding base whole plate, and the resonator is formed by sealing the resonator through laser processing;
then, a protective layer is sprayed on the whole cover plate, as shown in fig. 11, and the specific steps are as follows:
the concrete method for spraying the protective layer comprises the following steps: a pretreatment process and a spraying process, wherein the pretreatment process and the spraying process are carried out,
the pretreatment process comprises the following steps:
firstly, cleaning the resonator whole plate after the whole plate cover plate 20 is cut by using a cleaning liquid, wherein the cleaning liquid adopts an organic acid cleaning agent (glycolic acid, oxalic acid, ethylenediamine tetraacetic acid and the like); then, washing by a plurality of pure water channels to remove foreign matters on the cleaning liquid and the whole resonator plate; then, spraying air on the whole plate of the resonator to blow off residual pure water; finally, drying the whole resonator plate;
the spraying process comprises the following steps:
firstly, a spraying material is sprayed on the upper surface and the cut surface of each base cover plate of the whole resonator plate by adopting an electrostatic spraying process to form a coating, wherein the spraying material adopts a powder material or a liquid material, the powder material is resin powder such as epoxy resin, polyimide resin, polyester resin, polyurethane resin and the like, the liquid material is ceramic coating, ultraviolet glue or varnish, and then the coating is cured to form a protective layer on the upper surface and the cut surface of each base cover plate 20-1.
Finally, the split plate forming a single resonator specific step includes:
detecting, namely performing performance test on each connected quartz crystal resonator on the whole base plate, and marking defective products;
dividing the whole base plate;
packaging, namely sorting qualified quartz crystal resonators for taping packaging.
The whole base plate prepared by the method can be used for cutting the split plate lines on both sides, and the whole plate processing technology can be realized, so that the production efficiency is high, and the product quality is good.
Example 2
As shown in fig. 1-2, the difference from embodiment 1 is that the through hole does not need to be metallized, the back of the whole base plate has no crack line, and when the crack plate is cut, the crack line only needs to be cut on the front of the whole base plate, which is the same as the whole base plate processing technology in the prior art; in the scheme, although a spraying process is used for forming the protective layer, the back surface of the whole base plate is not provided with a split plate line, and the surface effect of a single resonator after splitting is not good enough. Other steps are the same as those of embodiment 1, and will not be repeated.
The invention also relates to an SMD quartz crystal resonator prepared by adopting the processing method, which comprises a base and a base cover plate, wherein the base is provided with a resonant piece accommodating cavity, the front surface of the base is provided with an annular metal coating, the annular metal coating is covered with the metal cover plate, the upper surface and four side surfaces of the metal cover plate are respectively provided with a protective layer, and the protective layers are made of resin materials, ceramic paint, varnish or ultraviolet glue.
As shown in fig. 3 and fig. 4, the left side in the ring of the annular metal coating 14 is provided with dispensing platforms a12 and B13 for dispensing wafers, the right side in the ring is provided with a supporting platform for supporting wafers, four corners of the back are respectively provided with four electrodes, the annular metal coating 14, the dispensing platforms a12 and B13 and the four electrodes are in conductive connection, the base is provided with a through hole filled with a conductive material, the through hole comprises a first through hole 1, a second through hole 2, a third through hole 3 and a fourth through hole 4, the four electrodes are respectively a first electrode 5, a second electrode 6, a third electrode 7 and a fourth electrode 8, and the annular metal coating 14 is respectively in conductive connection 8 with the diagonally arranged second electrode 6 and fourth electrode through the conductive material filled in the second through hole 2 and the fourth through hole 4;
the dispensing platform A12 and the dispensing platform B13 are respectively connected with the first electrode 5 and the third electrode 7 which are diagonally arranged through conductive materials poured into the third through hole 3 and the first through hole 1 in a conducting way, and the dispensing platform A12 is connected to the third through hole 3 through a metal connecting wire 15.
The foregoing description of the preferred embodiments of the invention is not intended to limit the invention to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and scope of the invention are intended to be included within the scope of the invention.
Claims (9)
1. The processing method of the SMD quartz crystal resonator is characterized in that a semi-finished product of the whole-plate resonator is provided firstly, and the semi-finished product of the whole-plate resonator comprises a base whole-plate, wafers fixed on the bases and a cover plate whole-plate covered on the base whole-plate; cutting the whole cover plate on the whole resonator to form a single base cover plate, and spraying a protective layer on the upper surface and the cut surface of each base cover plate to form the whole resonator; finally, detecting and dividing the whole plate resonator to form a single SMD quartz crystal resonator;
the concrete method for spraying the protective layer comprises the following steps: a pretreatment process and a spraying process;
the pretreatment process comprises the following steps:
firstly, cleaning a resonator whole plate after a whole plate cover plate is cut by using a cleaning solution, wherein the cleaning solution adopts an organic acid cleaner; then, washing by a plurality of pure water channels to remove foreign matters on the cleaning liquid and the whole resonator plate; then, spraying air on the whole plate of the resonator to blow off residual pure water; finally, drying the whole resonator plate;
the spraying process comprises the following steps:
firstly, spraying a spraying material on the upper surface and the cut surface of each base cover plate of the whole resonator plate by adopting an electrostatic spraying process to form a coating, wherein the spraying material is a powder material or a liquid material, and then, curing the coating to form a protective layer on the upper surface and the cut surface of each base cover plate;
the specific processing steps of the whole plate resonator semi-finished product comprise:
1) Providing or processing a whole base plate, and processing and manufacturing a matrix-arranged base on the whole base plate, wherein the back surface of the base is provided with four electrodes, the front surface of the base is provided with an annular metal coating, the left side in the ring is provided with dispensing platforms A and B, the right side in the ring is provided with a supporting platform, the bases are connected with each other, and through holes are formed in the junction of every two adjacent bases;
2) Processing the whole cover plate according to the size and structure of the whole base plate, forming a plurality of base cover plates with the same matrix shape as each base on the whole base plate on the whole cover plate, and connecting the adjacent base cover plates through metal connecting wires;
3) Firstly, arranging, cleaning and coating wafers on the whole plate resonance piece; placing the coated wafer into each base on the whole base plate, dispensing and solidifying, and further etching and trimming each resonance piece on the whole base plate to form a whole plate resonance piece;
4) And packaging the whole base plate and the whole cover plate to form a whole resonator plate, removing the electric connection between the bases, covering the whole cover plate on the whole resonator piece, enabling the periphery of each cover plate of the whole cover plate to be carried on the corresponding annular metalized plating layers of each resonator piece, and sealing the whole resonator plate into a resonator through laser processing to form a semi-finished resonator plate.
2. The method of claim 1, wherein the powder material is resin powder, and the liquid material is ceramic paint, ultraviolet glue, or varnish.
3. The method of claim 2, wherein the coating curing process in the spraying process is performed by baking or irradiation, and the baking is performed by infrared baking or thermal circulating air oven baking.
4. The method of claim 1, wherein the detecting means performs performance test on each connected quartz crystal resonator on the whole base board, and marks defective products.
5. The method of claim 4, wherein the whole substrate is prepared by the steps of:
a) Preparing or providing a ceramic substrate, wherein the whole base plate adopts two layers of ceramic substrates, namely an upper layer of ceramic substrate and a lower layer of ceramic substrate;
b) Punching, namely punching through holes and through holes on an upper ceramic substrate and a lower ceramic substrate which are aligned vertically to form a plurality of through holes which are arranged in a matrix, wherein each through hole comprises an upper through hole arranged on the upper ceramic substrate and a lower through hole arranged on the lower ceramic substrate; the through holes comprise a first through hole, a second through hole, a third through hole and a fourth through hole, wherein the first through hole and the third through hole are positioned at diagonal positions, and the second through hole and the fourth through hole are positioned at diagonal positions;
c) Carrying out metallization treatment on the lower through hole to enable the inner wall of the lower through hole to be attached with a metal coating, printing a metal wire between the metal coating and an adjacent electrode, and conducting the electrode between the adjacent bases through the metal coating and the metal wire;
d) Carrying out metallization printing on the upper ceramic substrate and the lower ceramic substrate, wherein the metallization printing comprises printing of a metal layer of an annular metal coating, an electrode, dispensing platforms A and B and a supporting platform, so that the electrode is connected with the dispensing platforms A and B and the annular metal coating in a conducting manner;
e) Laminating, namely printing an adhesive between the upper base integral plate and the lower base integral plate to laminate the upper ceramic substrate and the lower ceramic substrate together to form the base integral plate;
f) Dividing the split plate lines, namely cutting the split plate lines which are arranged in a matrix on the front and back of the whole base plate, wherein the split plate lines pass through the circle centers of the through holes;
g) Sintering the whole base plate;
h) And plating nickel and gold layers on the second metal layer.
6. The method of claim 5, wherein in step 4), the conductive connection between the pedestals is removed by cutting metal wires between the electrodes and the metal coating, so as to remove the conductive connection between the pedestals.
7. The method of claim 5, wherein in step d), the front and back surfaces of the ceramic substrate are respectively metallized, and a first metal layer is printed at the positions of the annular metal coating, the dispensing platforms a and B, the supporting platform and the four electrodes, wherein the first metal layer is made of tungsten; and after the first metal layer is dried, printing a second metal layer on the first metal coating at the positions of the dispensing platforms A and B and the supporting platform, wherein the second metal layer is made of tungsten.
8. The method of claim 5, further comprising the step of smoothing the metal layer after the metallization printing in the step d).
9. The SMD quartz crystal resonator manufactured by the processing method according to any of the claims 2-8, characterized by comprising a base and a base cover plate, wherein a resonator receiving cavity is arranged on the base, an annular metal coating is arranged on the front surface of the base, the base cover plate is covered on the annular metal coating, protective layers are arranged on the upper surface and four sides of the base cover plate, and the protective layers are made of resin materials, ceramic paint, varnish or ultraviolet glue.
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| CN201710680528.1A CN107517043B (en) | 2017-08-10 | 2017-08-10 | SMD quartz crystal resonator processing method and resonator thereof |
| PCT/CN2018/073701 WO2019029133A1 (en) | 2017-08-10 | 2018-01-23 | Processing method for smd quartz crystal resonator and resonator thereby |
| TW107105038A TWI682560B (en) | 2017-08-10 | 2018-02-12 | The processing methods for a type of surface-mounted crystal unit and the crystal unit |
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| CN107517043B (en) * | 2017-08-10 | 2023-10-20 | 四川明德亨电子科技有限公司 | SMD quartz crystal resonator processing method and resonator thereof |
| CN109768783B (en) * | 2019-01-21 | 2023-06-02 | 潮州三环（集团）股份有限公司 | Ceramic packaging base capable of being selectively electroplated, combined board and processing method |
| CN110149101B (en) * | 2019-05-20 | 2023-08-01 | 成都泰美克晶体技术有限公司 | Method for protecting quartz wafer electrode |
| CN111112018A (en) * | 2019-12-10 | 2020-05-08 | 廊坊中电熊猫晶体科技有限公司 | Direct-insertion type quartz crystal resonator dispensing device and using method thereof |
| CN113038819B (en) * | 2021-03-02 | 2022-04-22 | 浙江机电职业技术学院 | Micro vibration SMD surface mounting switch processing equipment and use method thereof |
| CN114531127A (en) * | 2022-02-21 | 2022-05-24 | 浙江蓝晶芯微电子有限公司 | Moving coating process for quartz crystal resonator with drying mechanism |
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| WO2019029133A1 (en) | 2019-02-14 |
| CN107517043A (en) | 2017-12-26 |
| TW201911612A (en) | 2019-03-16 |
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