CN102355225B - Low-temperature co-fired ceramic entire flat substrate pedestal for quartz crystal resonator - Google Patents
Low-temperature co-fired ceramic entire flat substrate pedestal for quartz crystal resonator Download PDFInfo
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- CN102355225B CN102355225B CN201110219262.3A CN201110219262A CN102355225B CN 102355225 B CN102355225 B CN 102355225B CN 201110219262 A CN201110219262 A CN 201110219262A CN 102355225 B CN102355225 B CN 102355225B
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Abstract
The invention relates to a low-temperature co-fired ceramic entire flat substrate pedestal for a quartz crystal resonator. The low-temperature co-fired ceramic entire flat substrate pedestal comprises low-temperature co-fired ceramic pedestals, silver/copper layer conducting wires, chip holders, pillows and pouring holes. The low-temperature co-fired ceramic pedestal consists of at least two single pedestals. Quartz chip areas are formed on the single pedestals. The silver/copper layer conducting wires, the chip holders and the pillows are all arranged above the low-temperature co-fired ceramic pedestals. The left and right sides of the single pedestal are provided with a recess respectively. After two single pedestals are combined, the recesses on the left and right sides form the pouring holes. The pouring holes are electroplated or chemically plated switched-on lines for connecting the single pedestals before the cutting of the low-temperature co-fired ceramic flat substrate pedestal. The chip holders are arranged at one end of each quartz chip area, and the pillows are arranged at the other end of each quartz chip area. The pouring holes are connected with the chip holders by the silver/copper layer conducting wires. The silver/copper layer conducting wires are switched on in a single-sided form around the single pedestals. The low-temperature co-fired ceramic entire flat substrate pedestal can satisfy the integrated production needs of the quartz crystal resonator.
Description
Technical field
The present invention relates to quartz-crystal resonator technical field, particularly relate to the low temperature ceramic entire plate-type flat substrate pedestal that a kind of quartz-crystal resonator is used.
Background technology
The mode that quartz-crystal resonator industry is all used refractory ceramics (HTCC) to encapsulate by single pedestal at present, increase and amass bodyization and produce along with output and material cost require future trend certainly will change the whole plate-type flat substrate of low-temp ceramics (LTCC) into, wherein the most formidable problem is how in the situation that whole plate connects conducting, single pedestal to be carried out to frequency adjustment processing procedure.Take a broad view of the whole plate-type flat substrate design of existing low-temp ceramics (LTCC) (seeing Fig. 1, Fig. 2 and Fig. 3), chip carrier 3 and pillow 4 are arranged on low-temp ceramics pedestal 1, solve and electroplate or chemical silvering/copper layer conductor 2 by the mode of the three-dimensional circle of grout 5 inwalls wall coating conducting, but this method is still because the mutual conducting of each single pedestal causes carrying out frequency adjustment under whole tabular condition, and must just can overcome being cut into after single pedestal, produce conception therefore cannot realize long-pending bodyization.
Summary of the invention
Technical problem to be solved by this invention is to provide the low temperature ceramic entire plate-type flat substrate pedestal that a kind of quartz-crystal resonator is used, and meets the long-pending body Production requirement of quartz-crystal resonator.
The technical solution adopted for the present invention to solve the technical problems is: the low temperature ceramic entire plate-type flat substrate pedestal that provides a kind of quartz-crystal resonator to use, comprises low-temp ceramics pedestal, silver/copper layer conductor, chip carrier, pillow and grout; Described low-temp ceramics pedestal is made up of at least two single pedestals, and described single pedestal is provided with quartz chip region, and described silver/copper layer conductor, chip carrier, pillow are all above described low-temp ceramics pedestal; The left and right sides of described single pedestal is equipped with depression; After described two single base combination, the left and right sides be recessed to form described grout; Described grout be the flat substrate pedestal of low-temp ceramics before not cutting for connecting single pedestal as electroplating or the conducting circuit of chemical plating; Described chip carrier is arranged on the one end in quartz chip region, and described pillow is arranged on the other end in quartz chip region; Described grout is connected by described silver/copper layer conductor with described chip carrier; Described silver/copper layer conductor carries out conducting with one side form around single pedestal.
Described silver/copper layer conductor is by electroplating or chemical plating mode coating copper layer conductor on silver layer wire.
Described single pedestal is provided with two chip carriers, and wherein, a chip carrier is connected with the grout that is positioned at single pedestal left side by silver/copper layer conductor, and another chip carrier is connected with the grout that is positioned at single pedestal right side by silver/copper layer conductor.
Described low-temp ceramics pedestal adopts LTCC low-temp ceramics to make.
Described silver/copper layer conductor after precut, between single pedestal by not conducting mutually.
Beneficial effect
Owing to having adopted above-mentioned technical scheme, the present invention compared with prior art, there is following advantage and good effect: the present invention is by changing grout position, and utilize single pedestal around one side conduction mode improved the problem that whole plate cannot frequency be adjusted, thereby meet the long-pending body Production requirement of quartz-crystal resonator.
Brief description of the drawings
Fig. 1 is single base interior structure vertical view in low temperature ceramic entire plate-type flat substrate in prior art;
Fig. 2 is single base interior structure front view in low temperature ceramic entire plate-type flat substrate in prior art;
Fig. 3 is low temperature ceramic entire plate-type flat substrate internal structure vertical view in prior art;
Fig. 4 is single base interior structure vertical view in low temperature ceramic entire plate-type flat substrate of the present invention;
Fig. 5 is single base interior structure front view in low temperature ceramic entire plate-type flat substrate of the present invention;
Fig. 6 is low temperature ceramic entire plate-type flat substrate internal structure vertical view of the present invention;
Fig. 7 is the internal structure vertical view of low temperature ceramic entire plate-type flat substrate of the present invention after precut.
Embodiment
Below in conjunction with specific embodiment, further set forth the present invention.Should be understood that these embodiment are only not used in and limit the scope of the invention for the present invention is described.In addition should be understood that those skilled in the art can make various changes or modifications the present invention after having read the content of the present invention's instruction, these equivalent form of values fall within the application's appended claims limited range equally.
Embodiments of the present invention relate to the low temperature ceramic entire plate-type flat substrate pedestal that a kind of quartz-crystal resonator is used, and as shown in Figure 5, comprise low-temp ceramics pedestal 1, silver/copper layer conductor 2, chip carrier 3, pillow 4 and grout 5; Described low-temp ceramics pedestal 1 is made up of at least two single pedestals, and as shown in Figure 3 and Figure 4, described single pedestal is provided with quartz chip region.Described silver/copper layer conductor 2, chip carrier 3, pillow 4 are all above described low-temp ceramics pedestal 1.The left and right sides of described single pedestal is equipped with depression, after described two single base combination, the left and right sides be recessed to form described grout 5.Described grout 5 for the flat substrate pedestal 1 of low-temp ceramics before not cutting for connecting single pedestal as electroplating or the conducting circuit of chemical plating.Described chip carrier 3 is arranged on the one end in quartz chip region, and described pillow 4 is arranged on the other end in quartz chip region, and described grout 5 is connected by described silver/copper layer conductor with described chip carrier 3.As shown in Fig. 3, Fig. 4 and Fig. 5, single pedestal is provided with two chip carriers 3, wherein, a chip carrier 3 is connected with the grout 5 that is positioned at single pedestal left side by silver/copper layer conductor 2, another chip carrier 3 is connected with the grout 5 that is positioned at single pedestal right side by silver/copper layer conductor 2, and described silver/copper layer conductor 2 carries out conducting with one side form around single pedestal.Wherein, low-temp ceramics pedestal 1 adopts LTCC low-temp ceramics to make.
As shown in Figure 7, silver/copper layer conductor 2 after precut, between single pedestal by not conducting mutually.The volume of single pedestal is not more than 2.04*1.64*0.25mm.Be not difficult to find, the present invention is by changing grout position, and utilizes the mode of single pedestal one side conducting around to improve the problem that whole plate cannot frequency be adjusted, thereby meets the long-pending body Production requirement of quartz-crystal resonator.
Claims (5)
1. the low temperature ceramic entire plate-type flat substrate pedestal that quartz-crystal resonator is used, comprises low-temp ceramics pedestal (1), silver/copper layer conductor (2), chip carrier (3), pillow (4) and grout (5); Described low-temp ceramics pedestal (1) is made up of at least two single pedestals, described single pedestal is provided with quartz chip region, it is characterized in that, described silver/copper layer conductor (2), chip carrier (3), pillow (4) are all in described low-temp ceramics pedestal (1) top; The left and right sides of described single pedestal is equipped with depression; After described two single base combination, the left and right sides be recessed to form described grout (5); Described grout (5) for connecting the conducting circuit of single pedestal as plating or chemical plating before low-temp ceramics pedestal (1) does not cut; Described chip carrier (3) is arranged on the one end in quartz chip region, and described pillow (4) is arranged on the other end in quartz chip region; Described grout (5) is connected by described silver/copper layer conductor (2) with described chip carrier (3); Described silver/copper layer conductor (2) carries out conducting with one side form around single pedestal.
2. the low temperature ceramic entire plate-type flat substrate pedestal that quartz-crystal resonator according to claim 1 is used, is characterized in that, described silver/copper layer conductor (2) is by electroplating or chemical plating mode coating copper layer conductor on silver layer wire.
3. the low temperature ceramic entire plate-type flat substrate pedestal that quartz-crystal resonator according to claim 1 is used, it is characterized in that, described single pedestal is provided with two chip carriers (3), wherein, a chip carrier (3) is connected with the grout (5) that is positioned at single pedestal left side by silver/copper layer conductor (2), and another chip carrier (3) is connected with the grout (5) that is positioned at single pedestal right side by silver/copper layer conductor (2).
4. the low temperature ceramic entire plate-type flat substrate pedestal that quartz-crystal resonator according to claim 1 is used, is characterized in that, described low-temp ceramics pedestal (1) adopts LTCC low-temp ceramics to make.
5. the low temperature ceramic entire plate-type flat substrate pedestal that quartz-crystal resonator according to claim 1 is used, is characterized in that, described silver/copper layer conductor (2) after precut, between single pedestal by not conducting mutually.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110219262.3A CN102355225B (en) | 2011-08-02 | 2011-08-02 | Low-temperature co-fired ceramic entire flat substrate pedestal for quartz crystal resonator |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110219262.3A CN102355225B (en) | 2011-08-02 | 2011-08-02 | Low-temperature co-fired ceramic entire flat substrate pedestal for quartz crystal resonator |
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| CN102355225A CN102355225A (en) | 2012-02-15 |
| CN102355225B true CN102355225B (en) | 2014-07-02 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104283524B (en) | 2014-10-22 | 2017-07-14 | 应达利电子股份有限公司 | A kind of piezoelectric quartz crystal resonator and preparation method thereof |
| CN105305995B (en) * | 2015-11-05 | 2016-11-30 | 烟台明德亨电子科技有限公司 | A kind of SMD quartz crystal resonator and imposite encapsulation process technique thereof |
| CN107517043B (en) * | 2017-08-10 | 2023-10-20 | 四川明德亨电子科技有限公司 | SMD quartz crystal resonator processing method and resonator thereof |
| CN107517044B (en) * | 2017-08-10 | 2024-04-09 | 四川明德亨电子科技有限公司 | Substrate structure of whole-board SMD quartz crystal resonator and processing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1213891A (en) * | 1997-10-01 | 1999-04-14 | 株式会社村田制作所 | Piezoelectric component |
| CN1630184A (en) * | 2003-12-19 | 2005-06-22 | 株式会社村田制作所 | High frequency oscillator |
| CN201383796Y (en) * | 2009-04-23 | 2010-01-13 | 杭州鸿星电子有限公司 | Base structure of quartz resonator |
| CN202218201U (en) * | 2011-08-02 | 2012-05-09 | 台晶(宁波)电子有限公司 | Low temperature ceramic entire plate-type flat substrate pedestal used for quartz crystal resonator |
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- 2011-08-02 CN CN201110219262.3A patent/CN102355225B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1213891A (en) * | 1997-10-01 | 1999-04-14 | 株式会社村田制作所 | Piezoelectric component |
| CN1630184A (en) * | 2003-12-19 | 2005-06-22 | 株式会社村田制作所 | High frequency oscillator |
| CN201383796Y (en) * | 2009-04-23 | 2010-01-13 | 杭州鸿星电子有限公司 | Base structure of quartz resonator |
| CN202218201U (en) * | 2011-08-02 | 2012-05-09 | 台晶(宁波)电子有限公司 | Low temperature ceramic entire plate-type flat substrate pedestal used for quartz crystal resonator |
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