JP2540942B2 - Hybrid integrated circuit packaging method. - Google Patents
Hybrid integrated circuit packaging method.Info
- Publication number
- JP2540942B2 JP2540942B2 JP1129315A JP12931589A JP2540942B2 JP 2540942 B2 JP2540942 B2 JP 2540942B2 JP 1129315 A JP1129315 A JP 1129315A JP 12931589 A JP12931589 A JP 12931589A JP 2540942 B2 JP2540942 B2 JP 2540942B2
- Authority
- JP
- Japan
- Prior art keywords
- frame
- lid
- integrated circuit
- hybrid integrated
- heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Casings For Electric Apparatus (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、気密封止を確実に、かつ簡単に行えるよ
うにした混成集積回路のパッケージ方法に関するもので
ある。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of packaging a hybrid integrated circuit capable of reliably and easily performing hermetic sealing.
従来、混成集積回路のパッケージ方法は、第４図，第
５図に示すように蓋を樹脂によりフレームに接着してい
た。Conventionally, in a method of packaging a hybrid integrated circuit, a lid is adhered to a frame with resin as shown in FIGS. 4 and 5.
すなわち、第４図，第５図において、１はパッケージ
される蓋で、この蓋１がフレーム２に接着樹脂８で接着
される。３はリードフレーム、４は金属放熱板で、あら
かじめフレーム２と接着されている。That is, in FIGS. 4 and 5, 1 is a lid to be packaged, and the lid 1 is bonded to the frame 2 with an adhesive resin 8. Reference numeral 3 is a lead frame, and 4 is a metal heat dissipation plate, which is previously bonded to the frame 2.
上記のように接着樹脂８を用いてパッケージする方法
は、以下のような問題点があった。The method of packaging using the adhesive resin 8 as described above has the following problems.
すなわち、接着樹脂８の硬化時間を短時間で行うため
には、加熱硬化性樹脂を使用する必要があり、これを加
熱すると、硬化中に接着樹脂８にパッケージ内圧上昇に
よる気泡が発生し、気密封止ができない。そのため、蓋
１に気泡抜き穴を設け、さらにそれを特殊な方法で封止
しなければならなず、作業が煩雑である。That is, in order to cure the adhesive resin 8 in a short time, it is necessary to use a thermosetting resin, and when this is heated, bubbles are generated in the adhesive resin 8 due to an increase in package internal pressure during curing, and Cannot be tightly sealed. Therefore, it is necessary to provide a bubble vent hole in the lid 1 and further seal it by a special method, which makes the work complicated.
この発明は、上記のような問題点を除去するためにな
されたもので、熱カシメ技術により確実な気密封止を容
易に行える混成集積回路のパッケージ方法を得ることを
目的とする。The present invention has been made in order to eliminate the above problems, and an object of the present invention is to provide a packaged method of a hybrid integrated circuit capable of easily performing reliable hermetic sealing by a thermal crimping technique.
この発明に係る混成集積回路のパッケージ方法は、表
面に混成集積回路が形成された金属放熱板があらかじめ
接着された熱可塑性樹脂からなるフレームに同じく可塑
性樹脂からなる蓋を嵌め込み、フレームと蓋との接合部
に所定形状の圧接部を有する加熱治具を圧接して加熱
し、フレームと蓋との接合部を溶融して熱カシメするも
のである。A method of packaging a hybrid integrated circuit according to the present invention is such that a lid made of a plastic resin is fitted into a frame made of a thermoplastic resin to which a metal heat dissipation plate having a hybrid integrated circuit formed on the surface thereof is previously bonded, and the frame and the lid are joined together. A heating jig having a press-contacting portion of a predetermined shape is pressed against the joint to heat it, and the joint between the frame and the lid is melted and heat-crimped.
この発明においては、熱可塑性樹脂からなるフレーム
と蓋との接合部を加熱治具を圧接して加熱せしめ、その
部分のフレームと蓋とを溶融して熱カシメするので、局
部加熱でパッケージの気密封止が可能となる。In this invention, the joint between the frame made of the thermoplastic resin and the lid is heated by pressing a heating jig, and the frame and the lid at that portion are melted and caulked by heat. Tight sealing is possible.
以下、この発明の一実施例を図面について説明する。 An embodiment of the present invention will be described below with reference to the drawings.
第１図はこの発明の一実施例を示す混成集積回路のパ
ッケージ方法を説明する断面図であり、第２図はパッケ
ージ後の斜視図である。FIG. 1 is a sectional view for explaining a method of packaging a hybrid integrated circuit showing an embodiment of the present invention, and FIG. 2 is a perspective view after packaging.
第１図，第２図において、１〜４は第４図，第５図と
同じものであり、５は加熱治具、６はエアー冷却器、７
は封止器である熱カシメ部である。この動作は、表面に
混成集積回路が形成された金属放熱板４をあらかじめフ
レーム２に樹脂で接着した後、フレーム２に蓋１を嵌め
込み、その後、加熱治具５を蓋１とフレーム２の接合部
に圧接すると、熱可塑性樹脂を材料としている蓋１とフ
レーム２は、その融点以上になると、溶融し一体化す
る。その直後、エアー冷却器６により、加熱治具５と一
緒に冷却することにより、溶けた熱可塑性樹脂は固化
し、加熱治具５より型離れ可能となり、第１図（ｂ）に
示すように、加熱治具５の圧接部5aの形状に従った熱カ
シメ部７の形状で蓋１とフレーム２の接触部は溶融一体
化成形され気密封止される。In FIGS. 1 and 2, 1-4 are the same as those in FIGS. 4 and 5, 5 is a heating jig, 6 is an air cooler, and 7 is
Is a heat caulking part which is a sealing device. In this operation, the metal heat sink 4 having the hybrid integrated circuit formed on the surface is preliminarily adhered to the frame 2 with a resin, the lid 1 is fitted into the frame 2, and then the heating jig 5 is joined to the lid 1 and the frame 2. When pressure is applied to the portion, the lid 1 and the frame 2, which are made of a thermoplastic resin, are melted and integrated at the melting point or higher. Immediately thereafter, by cooling together with the heating jig 5 by the air cooler 6, the melted thermoplastic resin is solidified and can be released from the heating jig 5, as shown in FIG. 1 (b). The contact portion between the lid 1 and the frame 2 is melt-integrated and hermetically sealed in the shape of the heat-crimped portion 7 according to the shape of the pressure contact portion 5a of the heating jig 5.
なお、金属放熱板４の表面には、フレーム２との接着
前に混成集積回路が形成されており、フレーム２と接着
後、リードフレーム３と内部で結線されている。A hybrid integrated circuit is formed on the surface of the metal heat dissipation plate 4 before being bonded to the frame 2, and after being bonded to the frame 2, the lead frame 3 is internally connected.
上記のように加熱治具５により局部的加熱で短時間に
蓋１とフレーム２を溶融するため、パッケージ内温度上
昇には至らず、温度上昇によるパッケージ内圧上昇が発
生せず、蓋１とフレーム２の溶融層における気泡発生を
防止できる。また、加熱治具５の圧接部5aの形状を任意
の形状とすることにより熱カシメ部７を所定形状にする
ことも可能である。As described above, since the lid 1 and the frame 2 are melted in a short time by the local heating by the heating jig 5, the temperature inside the package does not rise, the rise in the package internal pressure due to the temperature rise does not occur, and the lid 1 and the frame 2 do not occur. It is possible to prevent bubbles from being generated in the molten layer of No. 2. Further, the heat crimping portion 7 can be formed into a predetermined shape by forming the pressure contact portion 5a of the heating jig 5 into an arbitrary shape.
上記実施例では蓋１とフレーム２は、熱可塑性樹脂で
あることが必要条件であるが、融点の違う異質材料でも
両者が溶け合い、一体化すれば気密封止は可能である。In the above embodiment, the lid 1 and the frame 2 are required to be made of a thermoplastic resin, but even if different materials having different melting points are melted and integrated, airtight sealing is possible.
また、パッケージ形状と同形状の加熱治具を製作して
おけば、容易に機種切替えは可能となり、自動化も容易
となるとともに、同時に多数のパッケージが可能とな
る。Further, if a heating jig having the same shape as the package shape is manufactured, the model can be easily switched, automation can be facilitated, and a large number of packages can be simultaneously made.
また、混成集積回路として実装される素子の耐熱性が
低い場合には、温度ストレスを避けられるパッケージ法
として、有効である。Further, when the heat resistance of the element mounted as the hybrid integrated circuit is low, it is effective as a packaging method which can avoid temperature stress.
さらに、第３図に示すように、蓋１とベース板９とを
この発明を用いて封止することにより、モールド樹脂か
ら受ける機械的応力を避ける必要がある素子を実装する
場合、中空パッケージとして効果的である。Furthermore, as shown in FIG. 3, by sealing the lid 1 and the base plate 9 using the present invention, when mounting an element that needs to avoid mechanical stress received from the mold resin, a hollow package is formed. It is effective.
以上説明したように、この発明は表面に混成集積回路
が形成された金属放熱板があらかじめ接着された熱可塑
性樹脂からなるフレームに同じく熱可塑性樹脂からなる
蓋を嵌め込み、フレームと蓋との接合部に所定形状の圧
接部を有する加熱治具を圧接して加熱し、フレームと蓋
との接合部を溶融して熱カシメするので、局部加熱で気
密封止ができ、パッケージ内温度上昇には至らず、温度
上昇によるパッケージ内圧上昇が発生しないことから、
従来のような気泡発生を防止できる。したがって、容易
な作業工程で確実に気密封止が実現できる効果が得られ
る。As described above, according to the present invention, a lid made of a thermoplastic resin is fitted into a frame made of a thermoplastic resin to which a metal radiator plate having a hybrid integrated circuit formed on its surface is previously attached, and a joint portion between the frame and the lid is joined. Since a heating jig having a pressure contact portion of a predetermined shape is pressed and heated to melt and caulk the joint portion between the frame and the lid, local heating can be hermetically sealed, and the temperature inside the package does not rise. As the package internal pressure does not rise due to temperature rise,
It is possible to prevent generation of bubbles as in the conventional case. Therefore, it is possible to obtain the effect that the airtight sealing can be surely realized by the easy work process.
第１図（ａ），（ｂ）はこの発明の一実施例を示す断面
図、第２図は、第１図（ｂ）の斜視図、第３図はこの発
明の他の実施例を示す断面図、第４図は従来のパッケー
ジの断面図、第５図は、第４図の斜視図である。 図において、１は蓋、２はフレーム、３はリードフレー
ム、４は金属放熱板、５は加熱治具、６はエアー冷却
器、７は熱カシメ部である。 なお、各図中の同一符号は同一または相当部分を示す。1 (a) and 1 (b) are sectional views showing an embodiment of the present invention, FIG. 2 is a perspective view of FIG. 1 (b), and FIG. 3 is another embodiment of the present invention. FIG. 4 is a sectional view of a conventional package, and FIG. 5 is a perspective view of FIG. In the figure, 1 is a lid, 2 is a frame, 3 is a lead frame, 4 is a metal radiator plate, 5 is a heating jig, 6 is an air cooler, and 7 is a heat caulking portion. The same reference numerals in each drawing indicate the same or corresponding parts.
Claims (1)
板があらかじめ接着された熱可塑性樹脂からなるフレー
ムに同じく熱可塑性樹脂からなる蓋を嵌め込み、前記フ
レームと蓋との接合部に所定形状の圧接部を有する加熱
治具を圧接して加熱し、前記フレームと蓋との接合部を
溶融して熱カシメすることを特徴とする混成集積回路の
パッケージ方法。1. A lid made of a thermoplastic resin is fitted into a frame made of a thermoplastic resin to which a metal radiator plate having a hybrid integrated circuit formed on its surface is previously adhered, and a predetermined shape is formed at a joint portion between the frame and the lid. A method for packaging a hybrid integrated circuit, comprising: heating a heating jig having a pressure contact portion by pressure contact and heating, and melting and jointing the joint portion between the frame and the lid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1129315A JP2540942B2 (en) | 1989-05-23 | 1989-05-23 | Hybrid integrated circuit packaging method. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1129315A JP2540942B2 (en) | 1989-05-23 | 1989-05-23 | Hybrid integrated circuit packaging method. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02307249A JPH02307249A (en) | 1990-12-20 |
| JP2540942B2 true JP2540942B2 (en) | 1996-10-09 |
Family
ID=15006536
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1129315A Expired - Lifetime JP2540942B2 (en) | 1989-05-23 | 1989-05-23 | Hybrid integrated circuit packaging method. |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2540942B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4135493B2 (en) * | 2002-12-19 | 2008-08-20 | アイシン精機株式会社 | Rotation detection sensor |
| JP4893281B2 (en) * | 2006-04-03 | 2012-03-07 | 株式会社デンソー | Cover cap mounting structure |
| JP2010263117A (en) * | 2009-05-08 | 2010-11-18 | Fuji Electric Systems Co Ltd | Semiconductor package, method for manufacturing semiconductor package, and device for manufacturing semiconductor package |
| JP5692453B1 (en) * | 2014-01-14 | 2015-04-01 | Ｃｒｏｓｓ大阪株式会社 | Sealing apparatus and sealing method |
-
1989
- 1989-05-23 JP JP1129315A patent/JP2540942B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02307249A (en) | 1990-12-20 |
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