JPH02307249A - Method of packaging hybrid integrated circuit - Google Patents
Method of packaging hybrid integrated circuitInfo
- Publication number
- JPH02307249A JPH02307249A JP1129315A JP12931589A JPH02307249A JP H02307249 A JPH02307249 A JP H02307249A JP 1129315 A JP1129315 A JP 1129315A JP 12931589 A JP12931589 A JP 12931589A JP H02307249 A JPH02307249 A JP H02307249A
- Authority
- JP
- Japan
- Prior art keywords
- frame
- cover
- heating jig
- thermoplastic resin
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 12
- 238000004806 packaging method and process Methods 0.000 title claims description 8
- 238000010438 heat treatment Methods 0.000 claims abstract description 22
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 13
- 239000002184 metal Substances 0.000 claims abstract description 9
- 238000007789 sealing Methods 0.000 abstract description 8
- 238000005516 engineering process Methods 0.000 abstract description 2
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Casings For Electric Apparatus (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、気密封止を確実に、かつ簡単に行えるよう
にした混成集積回路のパッケージ方法に関ずろものであ
る。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method of packaging a hybrid integrated circuit in which hermetic sealing can be performed reliably and easily.
従来、混成集積回路のパッケージ方法は、第４図、第５
図に示すように蓋をＦＡ脂によりフレームに接着してい
た。Conventionally, packaging methods for hybrid integrated circuits are as shown in Figures 4 and 5.
As shown in the figure, the lid was adhered to the frame using FA resin.
すなわち、第４図、第５図において、１はバ・ソケーン
されろ蓋で、乙の蓋１がフレーム２に接看樹ＩＩＩ ８
で接着されろ。３はリードフレーム、４は金属放熱板で
、あらかしめフレーム２と接着されている。That is, in Figs. 4 and 5, 1 is the lid that is attached to the base, and the lid 1 is attached to the frame 2.
Be glued with. 3 is a lead frame, and 4 is a metal heat sink, which are bonded to the caulking frame 2.
上記のように接Ｍ ｉ ＩＩ！ ８を用いてバ？／ ’
、ｒ ｉ；ずろ方法は、以下のような問題点があった
、。As mentioned above, contact M i II! Ba? using 8? /'
, r i; The ZERO method had the following problems.
すなわち、接着＋１１］１８の硬化時間を短時間で行う
ためには、加熱硬化性樹脂を１史用する必要があり、こ
れを加熱すると、硬化中に接着ＶＪＪ脂８にバッケーじ
・内圧上昇による気泡が発生し、気密封止ができない。In other words, in order to shorten the curing time of adhesion + 11] 18, it is necessary to use a thermosetting resin for one cycle. Bubbles are generated and airtight sealing is not possible.
そのため、蓋１に気泡抜き穴を設け、さらにそれを特殊
な方法で封止しなければならなず、作業が煩雑である。Therefore, it is necessary to provide a bubble vent hole in the lid 1 and seal it using a special method, which is a complicated operation.
この発明は、上記のような問題点を除去するためになさ
れたもので、熱カンメ技術により確実な気密封止を容易
に行える混成集積回路のバラ）１−し方ン去を１＠ろこ
とを目的とする。This invention was made in order to eliminate the above-mentioned problems. With the goal.
乙の発明に係る混成集積回路のパッケ−ジ方法は、表面
に混成集積回路が形成された金属放熱板−があらかじめ
接着された熱可塑性樹脂からなるフレームに同じく可塑
性樹脂からなる蓋を嵌め込み、フし・−ムと蓋との接合
部に所定形状の圧接部を有する加熱治具を圧接して加熱
し、フし・−ムと蓋との接合部を溶融して熱カンメする
ものである。The method of packaging a hybrid integrated circuit according to the invention of B involves fitting a lid made of a plastic resin into a frame made of a thermoplastic resin to which a metal heat sink on which a hybrid integrated circuit is formed has been bonded in advance; A heating jig having a pressure welding part of a predetermined shape is pressed and heated to the joint between the frame and the lid, and the joint between the frame and the lid is melted and hot-stamped.
この発明においては、熱可塑性例ｍからなるフし−ムと
蓋との接合部を加熱治具を圧接して加熱せしめ、その部
分の７し・−ムと蓋とを溶融して熱カンメするので、局
部加熱でバ・ソケージの気密封止が可能となる。In this invention, a heating jig is pressed to heat the joint between the thermoplastic frame and the lid, and that portion of the frame and the lid are melted and hot-stamped. Therefore, it is possible to hermetically seal the bass cage by local heating.
以下、この発明の一実施例を図面について説明する。 An embodiment of the present invention will be described below with reference to the drawings.
第１図はこの発明の一実施例を示す混成集積回路のパッ
ケージ方法を説明する断面図であり、第２図はバッケー
じ後の斜視図である。FIG. 1 is a sectional view illustrating a method of packaging a hybrid integrated circuit according to an embodiment of the present invention, and FIG. 2 is a perspective view after packaging.
第１図、第２図において、１〜４は第３図、第４図と同
じものであり、５は加熱治具、６はエアー冷却器、７は
封止部である熱カレメ部である。In FIGS. 1 and 2, 1 to 4 are the same as in FIGS. 3 and 4, 5 is a heating jig, 6 is an air cooler, and 7 is a heat sealing part. .
この動作は、表面に混成集積回路が形成された金属放熱
板４をあらかじめフし・−ム２に樹脂で接着した後、フ
レーム２に蓋１を嵌め込み、その後、加熱治具５を蓋１
とフし・−ム２の接合部に圧接すると、熱可塑性例（１
ｄを材料としている蓋１とフレーム２は、その融点以上
になると、溶融し一体化する。その直後、エアー冷＃器
６により、加熱治具５と一緒に冷却することにより、解
けた熱可塑性樹脂は固化し、加熱治具５より型離れ可能
となり、第１図（ｂ）に示すように、加熱治具５の圧接
部５ａの形状に従った熱カンメ部７の形状で蓋１とフし
・−ム２の接触部は溶融一体化成形され気密封止される
、。In this operation, a metal heat sink 4 with a hybrid integrated circuit formed on its surface is adhered to the frame 2 with resin in advance, the lid 1 is fitted onto the frame 2, and then the heating jig 5 is attached to the lid 1.
When pressed against the joint of frame 2, thermoplastic example (1
The lid 1 and the frame 2, which are made of material d, melt and become integrated when the temperature exceeds their melting point. Immediately thereafter, the melted thermoplastic resin is cooled together with the heating jig 5 by the air cooler 6, and the melted thermoplastic resin is solidified and can be separated from the mold from the heating jig 5, as shown in Fig. 1(b). Then, the contact portion between the lid 1 and the frame 2 is integrally melted and hermetically sealed with the shape of the heat-contact portion 7 that conforms to the shape of the pressure contact portion 5a of the heating jig 5.
なお、金属放熱板４の表面には、７し・−ム２との接着
前に混成集積回路が形成されており、フレーム２と接着
後、リードフし・−ム３と内部で結線されている。A hybrid integrated circuit is formed on the surface of the metal heat sink 4 before it is bonded to the frame 2, and after bonded to the frame 2, it is internally connected to the lead frame 3. .
上記のように加熱冶具５により局部的加熱で短時間に蓋
１とフし一ム２を溶融するため、パッケージ内温度上昇
には至らず、温度上昇によるパッケーご内圧上昇が発生
せず、蓋１と７レーム２の溶融層におけろ気泡発生を防
止できろ。また、加熱冶具５の圧接部５ａの形状を任意
の形状とすることにより熱かシメ部７を所定形状にする
ことも可能である。As mentioned above, since the lid 1 and the lid 2 are melted in a short time by local heating using the heating jig 5, the temperature inside the package does not rise, and the internal pressure of the package does not increase due to the temperature rise. It should be possible to prevent the generation of bubbles in the molten layer of 1 and 7 rem 2. Further, by making the pressure contact portion 5a of the heating jig 5 into an arbitrary shape, it is also possible to form the heat sealing portion 7 into a predetermined shape.
上記実施例では蓋１とフレーム２は、熱可塑性樹脂であ
ることが必要条件であるが、融点の違う異質材料でも両
者が溶は合い、一体化すれば気密封止は可能である。In the above embodiment, the lid 1 and the frame 2 are required to be made of thermoplastic resin, but even if they are different materials with different melting points, they can be melted together and an airtight seal can be achieved if they are integrated.
また、パッケージ形状と同形状の加熱治具を製作してお
けば、容易に機種切替λは可能となり、自動化も容易と
なるとともに、同時に多数のパッケージが可能となる。Furthermore, if a heating jig having the same shape as the package is manufactured, model switching λ can be easily performed, automation can be facilitated, and a large number of packages can be manufactured at the same time.
また、混成集積回路として実装される素子の耐熱性が低
い場合には、温度ストレスを避けられるパッケージ法と
して、有効である。１
さらに、第３図に示すように、蓋１とベース板９とをこ
の発明を用いて封１ヒずろことにより、モールド例ｍか
ら受ける機械的応力を避ける必要がある素子を実装する
場合、中空パッケージとして効果的である。Further, when the heat resistance of the element mounted as a hybrid integrated circuit is low, it is effective as a packaging method that can avoid temperature stress. 1. Furthermore, as shown in FIG. 3, when mounting an element that requires sealing the lid 1 and the base plate 9 using the present invention to avoid mechanical stress from the mold example m, Effective as a hollow package.
以上説明したように、この発明は表面に混成集積回路が
形成された金属放熱板があらかじめ接着された熱可塑性
樹脂からなる７７ Ｌ−一ムに同じく熱可塑性樹脂から
なる蓋を嵌め込み、フレームと蓋との接合部に所定形状
の圧接部を有ずろ加熱治具を圧接して加熱し、フレーム
と蓋との接合部を溶融して熱カンメずろので、局部加熱
で気密封止がてき、パッケージ内温度上昇には至らず、
温度上界によるパッケージ内圧上界が発生しないことか
ら、従来のような気泡発生を防止できる。したがって、
容易な作業工程で確実な気密封止が実現できる効果が得
られる。As explained above, the present invention involves fitting a lid also made of thermoplastic resin into a 77L-piece made of thermoplastic resin to which a metal heat sink with a hybrid integrated circuit formed on its surface has been bonded in advance, and connecting the frame and the lid. A heating jig that has a predetermined shape of pressure welding part at the joint between the frame and the lid is heated and the joint between the frame and the lid is melted and heated, so the local heating creates an airtight seal and seals the inside of the package. The temperature does not rise,
Since the upper limit of the internal pressure of the package does not occur due to the upper limit of the temperature, it is possible to prevent the generation of bubbles as in the conventional case. therefore,
The effect of achieving reliable airtight sealing can be achieved with a simple work process.
第１図（ａ ）、 （ｂ ）はこの発明の一実施例を示
す断面図、第２図は、第１図（ｂｌの斜視図、第３図は
この発明の他の実施例を示す断面図、第４図は従来のパ
２ｉ ノｒ−ジの断面図、第５図は、第４図の斜視図で
ある。
図において、１は蓋、２はフし・−ム、３はり一１・７
し一ム、４は金属放熱板、５は加熱治具、６はエアー冷
却器、７は熱カンメ部である。
なお、各図中の同一符号は同一または相当部分を示す。
代理人 大 岩 増 雄 （外２名）第１図
第２図
第３図
第４図Figures 1 (a) and (b) are cross-sectional views showing one embodiment of the present invention, Figure 2 is a perspective view of Figure 1 (bl), and Figure 3 is a cross-sectional view showing another embodiment of the present invention. 4 is a cross-sectional view of a conventional P2i nose, and FIG. 5 is a perspective view of FIG. 1・7
4 is a metal heat sink, 5 is a heating jig, 6 is an air cooler, and 7 is a thermal contact portion. Note that the same reference numerals in each figure indicate the same or corresponding parts. Agent Masuo Oiwa (2 others) Figure 1 Figure 2 Figure 3 Figure 4
Claims (1)
め接着された熱可塑性樹脂からなるフレームに同じく熱
可塑性樹脂からなる蓋を嵌め込み、前記フレームと蓋と
の接合部に所定形状の圧接部を有する加熱治具を圧接し
て加熱し、前記フレームと蓋との接合部を溶融して熱カ
ンメすることを特徴とする混成集積回路のパッケージ方
法。A lid made of thermoplastic resin is fitted into a frame made of thermoplastic resin to which a metal heat sink on which a hybrid integrated circuit is formed is previously bonded, and a pressure contact portion of a predetermined shape is provided at the joint between the frame and the lid. A method for packaging a hybrid integrated circuit, characterized in that a heating jig is pressed and heated to melt and thermally seal the joint between the frame and the lid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1129315A JP2540942B2 (en) | 1989-05-23 | 1989-05-23 | Hybrid integrated circuit packaging method. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1129315A JP2540942B2 (en) | 1989-05-23 | 1989-05-23 | Hybrid integrated circuit packaging method. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02307249A true JPH02307249A (en) | 1990-12-20 |
| JP2540942B2 JP2540942B2 (en) | 1996-10-09 |
Family
ID=15006536
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1129315A Expired - Lifetime JP2540942B2 (en) | 1989-05-23 | 1989-05-23 | Hybrid integrated circuit packaging method. |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2540942B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6903546B2 (en) * | 2002-12-19 | 2005-06-07 | Aisin Seiki Kabushiki Kaisha | Rotation detection sensor |
| JP2007300058A (en) * | 2006-04-03 | 2007-11-15 | Denso Corp | Cover cap attachment structure |
| JP2010263117A (en) * | 2009-05-08 | 2010-11-18 | Fuji Electric Systems Co Ltd | Semiconductor package, method for manufacturing semiconductor package, and device for manufacturing semiconductor package |
| CN104779184A (en) * | 2014-01-14 | 2015-07-15 | 交叉大阪股份有限公司 | Packaging device and packaging method |
-
1989
- 1989-05-23 JP JP1129315A patent/JP2540942B2/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6903546B2 (en) * | 2002-12-19 | 2005-06-07 | Aisin Seiki Kabushiki Kaisha | Rotation detection sensor |
| JP2007300058A (en) * | 2006-04-03 | 2007-11-15 | Denso Corp | Cover cap attachment structure |
| JP2010263117A (en) * | 2009-05-08 | 2010-11-18 | Fuji Electric Systems Co Ltd | Semiconductor package, method for manufacturing semiconductor package, and device for manufacturing semiconductor package |
| CN104779184A (en) * | 2014-01-14 | 2015-07-15 | 交叉大阪股份有限公司 | Packaging device and packaging method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2540942B2 (en) | 1996-10-09 |
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