JPS63213349A - Resin sealing member of semiconductor device - Google Patents

Abstract

PURPOSE:To prevent air from penetrating and to prevent voids from being generated, by shaping a box on the upper part of frame-shaped resin by adhesion of resin whose viscosity is smaller than that of this frame-shaped resin during fusion. CONSTITUTION:A semiconductor sealing member 8 comprises the following parts: resin which becomes high viscosity liquid during fusion, a frame 6 which surrounds a prescribed range inclusive of a semiconductor chip 4 and a wire 5 on a substrate 3 for a semiconductor device, resin whose viscosity becomes smaller than that of the frame 6 during fusion, and a plate 7 which adheres to the upper surface of the frame 6. When high temperature fusion is performed to seal a semiconductor component, resin 7 on the upper part firstly starts flowing due to its low viscosity so that the semiconductor component 4 is sealed inside the frame-shaped resin 6, and because the frame shaped resin 6 is then high in viscosity, the resin 7 of low viscosity is prevented from sagging so that the semiconductor component 4 is sealed. Hence, voids can be prevented from being generated inside the sealing.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application] The present invention relates to a sealing member for sealing one or more semiconductor components mounted on a substrate for a semiconductor device.

[Conventional technology]

Conventionally, this sealing member for Yuzu products is shown in Figures 5, 6, 7, and 8.
2 is a resin lid-shaped semiconductor sealing member, and 2 is a space for storing the semiconductor component. 3 is a semiconductor device substrate, 4
0ζr:a is a semiconductor chip fixed to a predetermined location on this semiconductor device substrate 3, 5 is a wire 0ζr:a In FIG. O Next, the operation of resin sealing will be explained. First, as shown in FIG. 6 and FIG. 7, a #? The conductor sealing member 1 is attached so that the semiconductor chip 4 and the wire 5 are housed in the space 2. Next, as shown in FIG. 8, the semiconductor sealing member 1 is heated by heating means (not shown). The semiconductor chip 4 and the wires 5 are melted in a bath, and then the semiconductor chip 4 and the wires 5 are sealed, and then the resin is cured by cooling.[Problems to be solved by the invention] Conventional semiconductor sealing members are constructed as described above. As a result, air is drawn in when the sealing member is heated and melted, creating voids lb as shown in Figure 8, or the resin on the side of the sealing member falls directly onto the semiconductor chip 4 as a molten lump, causing the semiconductor damage the chip 4 and wire 5, and
(/J TxJ(There are problems such as it leaking out.

・This invention was made to solve the above problems.
It is an object of the present invention to obtain a semiconductor sealing member which prevents air from being entrained, suppresses the generation of voids, does not damage semiconductor chips and wires, and does not cause leakage to the outside.

(Step + for solving the problem T/)] The semiconductor sealing member according to the invention of σ is formed into a box shape by bonding a resin having a lower viscosity than the frame-shaped resin on the upper part of the frame-shaped resin when melted. This is what I did.

[Effect]

In the semiconductor encapsulation member of the present invention, when the semiconductor component is melted at a high temperature for encapsulation, the resin in the clay part flows out due to its low viscosity and begins to encapsulate the semiconductor component inside the frame-shaped resin. Since the time frame resin has a high viscosity, it prevents the low viscosity resin from collapsing to the outside and seals the semiconductor component.

〔Example〕

An embodiment of the present invention will be described below regarding (2).

1, 2, and 8, the semiconductor device substrate 3 is made of a resin that becomes a highly viscous liquid when melted in a 6G bath.
It is a frame that surrounds a predetermined area including the upper semiconductor chip 4 and wire No. 5, and is set thicker than the semiconductor component including the semiconductor chip 4 and wire 5. Reference numeral 7 is made of a resin having a lower viscosity than the frame 6 when melted, and is adhered to the soil surface of the frame 6 to form two plates. Incidentally, the surrounding frame 6 and the plate 7 constitute a semiconductor sealing member 8.

Next, the sealing operation will be explained. As shown in FIGS. 2 and 8, the semiconductor sealing member 8 is attached and fixed at a predetermined σj portion of the semiconductor device substrate 3 from above. Next, Figure 4 σ]
Thus, the semiconductor sealing member 8 is melted by a heating means (not shown) to seal the semiconductor chip 4 and the wires 5, and then it is cooled to harden the resin to complete the sealing.

By the way, at the time of heating and melting, since the resin plate 7 has a low viscosity, it starts to flow into the inside of the frame 6 and seal it.
At this time, the frame body 6 prevents the resin from flowing out to the outer periphery.

In the above embodiments, the semiconductor components to be sealed are semiconductor chips and wires, but they may also be wireless 7-lip chips or other semiconductor components. Further, although the shape of the frame body 6 is shown as a rectangle, it goes without saying that it may be cylindrical or other shapes.

[Effect of enlightenment]

As described above, according to the present invention, two types of resins with and without viscosity σ when melted are bonded together as a semiconductor sealing member, so there is no molten resin raft on the outer periphery. 7e There is an effect that highly reliable sealing can be obtained without forming voids in the sealing portion and without damaging the semiconductor components to be sealed.

[Brief explanation of the drawing]

1 is a perspective view of a semiconductor sealing member according to an embodiment of the present invention; FIGS. The figure shows the state where the TP is heated and melted and sealed after being attached to a semiconductor device substrate.
#A side view, FIG. 5 is a perspective view showing a conventional semiconductor sealing member,
FIGS. 6 and 7 are perspective views showing the state in which a conventional semiconductor sealing member is attached to a semiconductor device substrate, and FIG. 8 is a perspective view showing a state in which a conventional semiconductor sealing member is attached to a semiconductor device substrate. FIG. 3 is a cross-sectional view showing a state in which the device is melted and sealed in a heating bath. In the figure, 2 is a space, 3 is a substrate for a semiconductor device, 4 is a semiconductor chip, 5 is a wire, 6 is a frame made of a high-viscosity resin, 7 is a plate made of a low-viscosity resin, and 8 is a semiconductor sealing member. Note that the same reference numerals in the figures indicate the same or corresponding parts. Agent Masuo Oiwa Figure 1 θ 4 I'll pay you 1,000 kilos - hehe. tJ-' Tsuiya Figure 3 Figure 4 Figure 4

Claims (2)

[Claims] (1) A solid resin sealing member capable of accommodating semiconductor components such as semiconductor chips attached to a predetermined location on the substrate is attached to a semiconductor device substrate, and this sealing member is heated to a predetermined temperature. In a sealing member that is melted to seal the semiconductor component, the resin surrounds the outer periphery of a predetermined range including the semiconductor component on the semiconductor device substrate, and becomes a highly viscous liquid when melted. 1. A resin sealing member for a semiconductor device, comprising: a frame; and a resin that is bonded to the upper part of the frame and becomes a low-viscosity liquid when melted from the resin. (2) A plate-shaped resin made of a resin having a lower viscosity than the frame is adhered to the side surface of a frame made of a resin that becomes a liquid with high viscosity when melted to form a concave box shape. A resin sealing member for a semiconductor device according to claim 1.