JPH0582567A - Structure for mounting electronic part - Google Patents
Structure for mounting electronic partInfo
- Publication number
- JPH0582567A JPH0582567A JP24389791A JP24389791A JPH0582567A JP H0582567 A JPH0582567 A JP H0582567A JP 24389791 A JP24389791 A JP 24389791A JP 24389791 A JP24389791 A JP 24389791A JP H0582567 A JPH0582567 A JP H0582567A
- Authority
- JP
- Japan
- Prior art keywords
- lsi
- tab
- substrate
- sealing resin
- cap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電子部品の実装構造に
係り、特にＴＡＢ（Ｔａｐｅ Ａｕｔｏｍａｔｅｄ Ｂ
ｏｎｄｉｎｇ）方式で組み立てられたＬＳＩの実装構造
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure for electronic parts, and more particularly to a TAB (Tape Automated B).
The present invention relates to a mounting structure of an LSI assembled by an on-dose method.
【０００２】[0002]
【従来の技術】従来、この種の電子部品の実装構造は、
図２に示すようにセラミックス又はＰＷＤ（Ｐｒｉｎｔ
ｅｄ Ｗｉｒｉｎｇ Ｂｏａｒｄｓ）等の基板２１と、
この基板２１の接続用パッド２２に接続用リード端子２
３を介して接続されるＴＡＢ−ＬＳＩ２４をその放熱と
絶縁を目的として、良熱伝導性接着剤２でダイ・ボンデ
ィングして気密に封止した絶縁性の高いキャップ２６と
を備えている。2. Description of the Related Art Conventionally, the mounting structure of this type of electronic component is
As shown in FIG. 2, ceramics or PWD (Print
a substrate 21 such as ed Wiring Boards),
The connection lead terminals 2 are connected to the connection pads 22 of the substrate 21.
A TAB-LSI 24 connected via 3 is provided with a highly insulating cap 26 which is hermetically sealed by die bonding with a good thermal conductive adhesive 2 for the purpose of heat dissipation and insulation.
【０００３】図２において２７は基板２１上面に設けら
れた接続用リングで、キャップ２６が接合されるもので
ある。又、２８は基板２１の内部配線で、基板２１上面
の接続用パッド２２と裏面の接続用バンプ２９とを電気
的に導通している。In FIG. 2, reference numeral 27 denotes a connecting ring provided on the upper surface of the substrate 21, to which the cap 26 is joined. Further, 28 is an internal wiring of the substrate 21, which electrically connects the connection pad 22 on the upper surface of the substrate 21 and the connection bump 29 on the back surface.
【０００４】上記ＴＡＢ−ＬＳＩの実装構造において、
ＴＡＢ−ＬＳＩ２４から発生する熱は、キャップ２６を
通して放熱されるものである。In the above-mentioned TAB-LSI mounting structure,
The heat generated from the TAB-LSI 24 is radiated through the cap 26.
【０００５】[0005]
【発明が解決しようとする課題】この従来の電子部品の
実装構造では、封止用のキャップを封着する際に、ＴＡ
Ｂ−ＬＳＩを上方より押しながらダイ・ボンディングす
るため、ＴＡＢ−ＬＳＩの接続用リード端子が、図３に
示すように変形してしまう問題があった。In this conventional mounting structure for electronic parts, when the cap for sealing is sealed, the TA
Since the die bonding is performed while pushing the B-LSI from above, there is a problem that the connecting lead terminals of the TAB-LSI are deformed as shown in FIG.
【０００６】又、上方より押す力によって、ＴＡＢ−Ｌ
ＳＩが下方に下がってしまい、ＴＡＢ−ＬＳＩとキャッ
プの密着が十分に行われず、十分な放熱が行われないこ
とがある問題があった。[0006] Further, the TAB-L is pushed by the pushing force from above.
There is a problem that the SI drops downward, the TAB-LSI and the cap are not sufficiently adhered, and sufficient heat is not released.
【０００７】更に基材にセラミックス等の材料を使用す
る際は、その材料から発生されるα線等により、ＴＡＢ
−ＬＳＩが動作不良を起こす問題があった。Further, when a material such as ceramics is used as the base material, the TAB is generated by the α rays or the like generated from the material.
-There was a problem that the LSI malfunctioned.
【０００８】そこで、本発明は、ＴＡＢ−ＬＳＩの接続
用リード端子が変形することがないと共に、放熱が十分
に行われ、かつＴＡＢ−ＬＳＩが動作不良を起こすこと
のない電子部品の実装構造の提供を目的とする。Therefore, the present invention provides a mounting structure of an electronic component in which the connecting lead terminals of the TAB-LSI are not deformed, heat is sufficiently dissipated, and the TAB-LSI does not malfunction. For the purpose of provision.
【０００９】[0009]
【課題を解決するための手段】本発明の電子部品の実装
構造は、中央部分に穴を設けたセラミックス等からなる
基板と、この基板に接続されるＴＡＢ−ＬＳＩをダイ・
ボンディングして封止したキャップと、前記基板とＴＡ
Ｂ−ＬＳＩとの間に基板の穴を密閉するように充填され
た封止樹脂とを備えている。The electronic component mounting structure of the present invention comprises a substrate made of ceramics or the like having a hole in the center thereof, and a TAB-LSI connected to the substrate.
Bonded and sealed cap, the substrate and TA
A sealing resin filled so as to seal the hole of the substrate between the B-LSI and the B-LSI.
【００１０】封止樹脂は、硬化前において所要の粘性を
有していることが好ましい。The sealing resin preferably has a required viscosity before being cured.
【００１１】又、封止樹脂は、透明であることが好まし
い。Further, the sealing resin is preferably transparent.
【００１２】[0012]
【作用】上記手段においては、ＴＡＢ−ＬＳＩのダイ・
ボンディング時に封止樹脂を注入して、ＴＡＢ−ＬＳＩ
に圧力を加えることにより、ＴＡＢ−ＬＳＩのダイ・ボ
ンディングが完全に行われ、かつＴＡＢ−ＬＳＩの回路
面全体が封止樹脂によってカバーされる。In the above means, the TAB-LSI die
Injection of sealing resin at the time of bonding, TAB-LSI
By applying pressure to the TAB-LSI, the die-bonding of the TAB-LSI is completed, and the entire circuit surface of the TAB-LSI is covered with the sealing resin.
【００１３】封止樹脂が硬化前において所要の粘性を有
していることにより、ＴＡＢ−ＬＳＩに加える圧力がコ
ントロールされる。Since the sealing resin has a required viscosity before being cured, the pressure applied to the TAB-LSI is controlled.
【００１４】又、封止樹脂が透明であることにより、Ｔ
ＡＢ−ＬＳＩの回路面の観察が外部より行うことが可能
となる。Further, since the sealing resin is transparent, T
It becomes possible to observe the circuit surface of the AB-LSI from the outside.
【００１５】[0015]
【実施例】次に、本発明の実施例について図面を参照し
て説明する。Embodiments of the present invention will now be described with reference to the drawings.
【００１６】図１は本発明の一実施例の電子部品の実装
構造の縦断面図である。FIG. 1 is a vertical cross-sectional view of a mounting structure for electronic components according to an embodiment of the present invention.
【００１７】セラミックス又はＰＷＢ等からなる基板１
は、中央部分に穴２を設けてあると共に上面の接続用パ
ッド３と裏面の接続用バンプ４とを内部配線５により接
続している。基板１上面には、回路面を下向きのフェー
スダウンとしたＴＡＢ−ＬＳＩ６が、接続用リード端子
７を接続用パッド３にはんだ付け、あるいは熱圧着、又
は超音波ボンディング等の方法により接続してマウント
されている。ＴＡＢ−ＬＳＩ６の接続用リード端子７
は、上記接続方法とするため、はんだメッキリード、錫
メッキリード、又は金メッキリード等のメッキが施され
ている。Substrate 1 made of ceramics or PWB
Has a hole 2 in the central portion, and connects the connection pad 3 on the upper surface and the connection bump 4 on the back surface with the internal wiring 5. On the upper surface of the substrate 1, a TAB-LSI 6 having a circuit face facing down is mounted by connecting a connecting lead terminal 7 to a connecting pad 3 by a method such as soldering, thermocompression bonding, or ultrasonic bonding. Has been done. Lead terminal 7 for connection of TAB-LSI 6
In order to use the above-mentioned connection method, a plating such as a solder-plated lead, a tin-plated lead, or a gold-plated lead is applied.
【００１８】ＴＡＢ−ＬＳＩ６は、その上面と絶縁性の
高いキャップ８の内面との間に介在した良熱伝導性の接
着剤９によりキャップ８にダイ・ボンディングされてお
り、キャップ８はその周縁を基板１上面に設けた接続用
リング５とはんだ付け、溶接又はロー付け等の方法によ
り接合し、基板１に封着されている。そして、基板１と
ＴＡＢ−ＬＳＩ６との間には、硬化前において所要の粘
性を有する透明な封止樹脂１１が基板１の穴２を密閉す
るように充填されている。The TAB-LSI 6 is die-bonded to the cap 8 with an adhesive 9 having good heat conductivity interposed between the upper surface of the TAB-LSI 6 and the inner surface of the cap 8 having high insulation properties. It is joined to the connecting ring 5 provided on the upper surface of the substrate 1 by a method such as soldering, welding or brazing, and is sealed to the substrate 1. Then, a space between the substrate 1 and the TAB-LSI 6 is filled with a transparent sealing resin 11 having a required viscosity before curing so as to seal the hole 2 of the substrate 1.
【００１９】上記ＴＡＢ−ＬＳＩ６のダイ・ボンディン
グに際しては、適量の接着剤９をＴＡＢ−ＬＳＩ６又は
キャップ８の内面に均一に塗布し、キャップ８をＴＡＢ
−ＬＳＩ６に被せてこれに上方から圧力を加え、ＴＡＢ
−ＬＳＩ６とキャップ８の間の接着剤９をなじませるよ
うにして接着すると同時に、基板１の穴２から封止樹脂
１１を注入し、ＴＡＢ−ＬＳＩ６に下方から圧力を加
え、さらに強くＴＡＢ−ＬＳＩ６とキャップ８とが圧着
されて接着剤９が十分に広がるようにする。この封止樹
脂１１の粘性は、ＴＡＢ−ＬＳＩ６の接続用リード端子
７が変形しないように、ＴＡＢ−ＬＳＩ６に下方から加
える圧力をコントロールできる程度のものである。又、
封止樹脂１１の注入量は、図１に示すようにＴＡＢ−Ｌ
ＳＩ６の接続用リード端子７によって包絡される領域内
までとするか、キャップ８内全領域までとするかは、Ｔ
ＡＢ−ＬＳＩ６に対する封止樹脂１１の影響、又はこの
後のキャップ８の封差工程への影響により、適量が選択
される。At the time of die bonding of the TAB-LSI 6, the appropriate amount of adhesive 9 is uniformly applied to the inner surface of the TAB-LSI 6 or the cap 8, and the cap 8 is attached to the TAB.
-Cover the LSI6 and apply pressure from above to TAB,
-At the same time as bonding the adhesive 9 between the LSI 6 and the cap 8 so that the adhesive 9 fits in, the sealing resin 11 is injected from the hole 2 of the substrate 1 and pressure is applied to the TAB-LSI 6 from below to make the TAB-LSI 6 stronger. And the cap 8 are pressure-bonded to each other so that the adhesive 9 spreads sufficiently. The viscosity of the sealing resin 11 is such that the pressure applied from below to the TAB-LSI 6 can be controlled so that the connecting lead terminals 7 of the TAB-LSI 6 are not deformed. or,
As shown in FIG. 1, the injection amount of the sealing resin 11 is TAB-L.
Whether it is within the area enveloped by the connecting lead terminals 7 of SI6 or within the entire area of the cap 8 is T
An appropriate amount is selected depending on the effect of the sealing resin 11 on the AB-LSI 6 or the subsequent sealing process of the cap 8.
【００２０】又、キャップ８の封着に際しては、キャッ
プ８に上方から圧力を加え、内部に封入された封止樹脂
１１の必要な量を押し出しながら行う。そして、キャッ
プ８の封着後、基板１の穴２からはみ出た封止樹脂１１
の余分な部分を取り除き、封止樹脂１１を硬化処理す
る。封止樹脂１１の硬化処理は、封止樹脂１１の種類に
より、熱硬化、自然硬化又は紫外線硬化処理等が施さ
れ、封止樹脂１１の硬化によって、電子部品が完成す
る。When the cap 8 is sealed, pressure is applied to the cap 8 from above, and a necessary amount of the sealing resin 11 sealed inside is pushed out. Then, after sealing the cap 8, the sealing resin 11 protruding from the hole 2 of the substrate 1
The excess portion of is removed and the sealing resin 11 is cured. The encapsulating resin 11 is cured by heat curing, natural curing, ultraviolet curing, or the like depending on the type of the encapsulating resin 11, and the electronic component is completed by curing the encapsulating resin 11.
【００２１】[0021]
【発明の効果】以上説明したように本発明によれば、Ｔ
ＡＢ−ＬＳＩのダイ・ボンディング時に封止樹脂を注入
してＴＡＢ−ＬＳＩに圧力を加えることにより、ＴＡＢ
−ＬＳＩのダイ・ボンディングが完全に行われるので、
ＴＡＢ−ＬＳＩの接続用リード端子が変形することがな
いと共に、ＴＡＢ−ＬＳＩの放熱をキャップを介して、
効率よく行うことができる。As described above, according to the present invention, T
By injecting the sealing resin and applying pressure to the TAB-LSI during die bonding of the AB-LSI,
-Since the die bonding of the LSI is completed,
The connecting lead terminals of the TAB-LSI will not be deformed, and the heat dissipation of the TAB-LSI will be transferred through the cap.
It can be done efficiently.
【００２２】又、ＴＡＢ−ＬＳＩの回路面全体が封止樹
脂によってカバーされるので、基板材料等から発生され
るα線等を吸収することができ、ＴＡＢ−ＬＳＩの動作
不良の発生を防止できると共に、ＴＡＢ−ＬＳＩの放熱
を封止樹脂を介して効率良く行うことができ、上記キャ
ップを介した放熱と相俟ってＴＡＢ−ＬＳＩの放熱を十
分に行うことができる。Further, since the entire circuit surface of the TAB-LSI is covered with the sealing resin, it is possible to absorb the α rays and the like generated from the substrate material and the like, and prevent the occurrence of malfunction of the TAB-LSI. At the same time, the heat dissipation of the TAB-LSI can be efficiently performed through the sealing resin, and the heat dissipation of the TAB-LSI can be sufficiently performed in combination with the heat dissipation through the cap.
【００２３】一方、封止樹脂が硬化前において所要の粘
性を有していることにより、ＴＡＢ−ＬＳＩに加える圧
力をコントロールできる。On the other hand, since the sealing resin has the required viscosity before being cured, the pressure applied to the TAB-LSI can be controlled.
【００２４】又、封止樹脂が透明であることにより、Ｔ
ＡＢ−ＬＳＩの回路面の観察が外部より行うことが可能
となり、解析等を行いやすいという効果を有する。Further, since the sealing resin is transparent, T
It is possible to observe the circuit surface of the AB-LSI from the outside, and it is easy to perform analysis and the like.
【図１】本発明の一実施例の電子部品の実装構造の縦断
面図である。FIG. 1 is a vertical sectional view of a mounting structure for an electronic component according to an embodiment of the present invention.
【図２】従来の電子部品の実装構造の縦断面図である。FIG. 2 is a vertical cross-sectional view of a conventional electronic component mounting structure.
【図３】図２の部分拡大図である。FIG. 3 is a partially enlarged view of FIG.
１ 基板 ２ 穴 ６ ＴＡＢ−ＬＳＩ ８ キャップ １１ 封止樹脂 1 substrate 2 hole 6 TAB-LSI 8 cap 11 sealing resin
Claims (3)
なる基板と、この基板に接続されるＴＡＢ−ＬＳＩをダ
イ・ボンディングして封止したキャップと、前記基板と
ＴＡＢ−ＬＳＩとの間に基板の穴を密閉するように充填
された封止樹脂とを備えることを特徴とする電子部品の
実装構造。1. A substrate made of ceramics or the like having a hole in its central portion, a cap formed by die bonding a TAB-LSI connected to this substrate and sealed, and between the substrate and the TAB-LSI. A mounting structure for an electronic component, comprising: a sealing resin filled so as to seal a hole of a substrate.
て、前記封止樹脂が硬化前において所要の粘性を有して
いることを特徴とする電子部品の実装構造。2. The electronic component mounting structure according to claim 1, wherein the sealing resin has a required viscosity before being cured.
において、前記封止樹脂が透明であることを特徴とする
電子部品の実装構造。3. The mounting structure for an electronic component according to claim 1 or 2, wherein the sealing resin is transparent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24389791A JPH0582567A (en) | 1991-09-25 | 1991-09-25 | Structure for mounting electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24389791A JPH0582567A (en) | 1991-09-25 | 1991-09-25 | Structure for mounting electronic part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0582567A true JPH0582567A (en) | 1993-04-02 |
Family
ID=17110629
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24389791A Pending JPH0582567A (en) | 1991-09-25 | 1991-09-25 | Structure for mounting electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0582567A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6404049B1 (en) | 1995-11-28 | 2002-06-11 | Hitachi, Ltd. | Semiconductor device, manufacturing method thereof and mounting board |
| US7193306B2 (en) | 1998-08-28 | 2007-03-20 | Micron Technology, Inc. | Semiconductor structure having stacked semiconductor devices |
-
1991
- 1991-09-25 JP JP24389791A patent/JPH0582567A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6404049B1 (en) | 1995-11-28 | 2002-06-11 | Hitachi, Ltd. | Semiconductor device, manufacturing method thereof and mounting board |
| US6563212B2 (en) | 1995-11-28 | 2003-05-13 | Hitachi, Ltd. | Semiconductor device |
| US6621160B2 (en) | 1995-11-28 | 2003-09-16 | Hitachi, Ltd. | Semiconductor device and mounting board |
| US7193306B2 (en) | 1998-08-28 | 2007-03-20 | Micron Technology, Inc. | Semiconductor structure having stacked semiconductor devices |
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