JP3409673B2 - Method of assembling electronic circuit device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for assembling an electronic circuit device that is capable of reduicing defective filling of a sealing element and provide an electronic circuit device with improved reliability, as well as reduce number of assembling processes. SOLUTION: In an electronic circuit device 20, an element mounting raging of a circuit substrate 22 has a sealing element supplying hole 22H that penetrates from the upper surface through the bottom. The sealing element supplying hole 22H is filled with a sealing element 23B supplied from the bottom of the circuit substrate 22, so that the sealing element 23B is filled between the element mounting area and an electronic circuit element 24. The sealing element 23B is filled from the central part of the element mounting area towards the outer parts under the electronic circuit element 24. The sealing element 23B is formed using a fluid material used to form an adhesive 23A bonding the circuit substrate 22 onto a substrate holder 21. The process for forming the sealing element 23B and that for forming the adhesive 23A are generally the same.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit device and a method of assembling the same, and more particularly, an electronic circuit element is mounted on a device mounting surface of a circuit board via a protruding electrode, and a space between the circuit board and the electronic circuit element is provided. The present invention relates to an electronic circuit device sealed with a sealing body and an assembling method thereof.

[0002]

2. Description of the Related Art FIG. 11 is a sectional structural view of an electronic circuit device according to the prior art. The electronic circuit device 1 includes a board support 2 used as a heat dissipation plate, a circuit board 3 mounted on the surface of the board support 2, leads 8 for electrically connecting the circuit board 3 and an external device, And a package 10 for hermetically sealing them. That is, this type of electronic circuit device 1 is called a hybrid IC and has a well-known structure.

A bare semiconductor chip 5 is mounted on the element mounting surface of the circuit board 3. The bare semiconductor chip 5 is mounted by a flip-chip method using the protruding electrodes (bump electrodes) 5A by face-down bonding with the integrated circuit surface and the element mounting surface of the circuit board 3 facing each other. The protruding electrode 5A is formed of, for example, a solder ball. A resin encapsulant 6 is filled between the bare semiconductor chip 5 and the element mounting surface, and the resin encapsulant 6 protects the integrated circuit surface of the bare semiconductor chip 5 and the protruding electrode 5A.
Used as a protective film.

The circuit board 3 is attached and fixed to the board support 2 by an insulating resin adhesive 4 applied to the back surface thereof. An electronic circuit element 7 such as a resistance element, a capacitance element or another semiconductor chip is mounted on the substrate support 2.

The outer portion of the lead 8 is the package 10
The outer part is directly connected to an external device. The inner portion of the lead 8 exists inside the package 10, and the inner portion and a terminal (not shown) of the circuit board 3 are electrically connected by a bonding wire 9. In addition, the terminals of the circuit board 3 and the electronic circuit element 7
Are electrically connected by a bonding wire 9.

The package 10 is made of, for example, an epoxy resin, and this epoxy resin is molded by a transfer molding method.

[0007]

SUMMARY OF THE INVENTION The electronic circuit device 1 described above.
The following points have not been taken into consideration. Figure 1
2 and FIG. 13 are side views of essential parts of the electronic circuit device showing the step of filling the resin sealing body 6 in the assembly process.
As shown in FIG. 12, a dispenser discharge device is used for filling the resin sealing body 6. The dispenser discharge device supplies the fluid resin 6A filled in the dropper-shaped container 11 from the nozzle 11A. The fluid resin 6A is supplied from the peripheral edge of the bare semiconductor chip 5 between the element mounting region of the element mounting surface and the bare semiconductor chip 5, and the fluidity of the fluid resin 6A supplied is removed to seal the resin. A body 6 is formed.

However, in the formation of the resin sealing body 6 using the dispenser discharging device, as shown in FIG. 12, the viscosity of the fluid resin 6A is changed due to the temperature change, the humidity change, the slight difference of the added substance, and the like. This occurs, and the change in viscosity of the fluid resin 6A causes uneven supply. When a large amount of the fluid resin 6A is supplied to the peripheral portion of the bare semiconductor chip 5, the fluid resin 6A is not sufficiently supplied between the bare semiconductor chip 5 and the element mounting region, and A defective filling occurs in which the resin 6A is not properly supplied. As a result, the function as a protective film, the adhesiveness, the heat dissipation property, and the like of the resin sealing body 6 are deteriorated, and the reliability and characteristics of the electronic circuit device 1 are deteriorated.

Further, as shown in FIG.
When the resin pool 6B is generated in A, the supply direction of the fluid resin 6A is changed by the resin pool 6B, and the fluid resin 6A is not properly supplied between the bare semiconductor chip 5 and the element mounting region. Poor filling occurs and the reliability and performance of the electronic circuit device 1 deteriorate.

The present invention has been made to solve the above problems. Therefore, an object of the present invention is to provide an electronic circuit device having improved reliability by reducing the filling failure of the sealing body.

Another object of the present invention is to improve the heat dissipation characteristics of the bare semiconductor chip by realizing the uniform adhesion between the bare semiconductor chip and the circuit board and between the circuit board and the substrate support, and to stabilize a large power. An object of the present invention is to provide an electronic circuit device such as a power IC (hybrid IC) capable of outputting, a power semiconductor device, or an LSI having large power consumption.

Still another object of the present invention is to realize uniform adhesion between the bare semiconductor chip and the circuit board, and between the circuit board and the substrate support, thereby relaxing the stress at the interface of the adhering surface, and for hybrid IC and power application. It is to realize stable and highly reliable operation of an electronic circuit device such as a semiconductor device.

Still another object of the present invention is to provide an assembling method of an electronic circuit device which can reduce the number of steps in the assembling process.

Still another object of the present invention is to provide an assembling method of an electronic circuit device, which enables uniform bonding between a bare semiconductor chip and a circuit board, and between the circuit board and a substrate support, easily and with a high yield. It is to be.

Still another object of the present invention is an LSI having a structure in which stress at the interface between the bare semiconductor chip and the circuit board and the bonding surface between the circuit board and the substrate support can be easily eased and the heat dissipation characteristics are good. Another object of the present invention is to provide a method for assembling an electronic circuit device such as a semiconductor device for electric power or a power device.

[0016]

In order to solve the above-mentioned problems, a first feature of the present invention is to penetrate the element mounting area of the element mounting surface to the back surface facing the element mounting surface and mount the element from the back surface side. A circuit board in which a sealing body supply hole for supplying a sealing body to the area is formed, an electronic circuit element mounted in the element mounting area of the circuit board via a protruding electrode, and a sealing body from the back side of the circuit board The electronic circuit device is provided with a sealing body which is supplied to the element mounting area through the supply hole and is filled between the element mounting surface and the electronic circuit element. Preferably, a bare semiconductor chip is used for the electronic circuit element, the bare semiconductor chip is face-down bonded to the element mounting region of the circuit board by a flip chip method, and a resin sealing body is used for the sealing body. Further, preferably, the circuit board is provided with a sealing body supply hole in the central portion of the element mounting region. Further, specifically, it is preferable that the circuit board is attached and fixed to the board support through a sealing body formed on the back surface of the circuit board. Here, the electronic circuit device is L
SI, power IC, power semiconductor device, and the like are suitable.
In particular, it is suitable for a hybrid IC in which a circuit board is attached and fixed to a substrate such as an insulating metal substrate or a substrate support such as a mother board.

In the electronic circuit device configured as described above, between the electronic circuit element and the element mounting surface on which the electronic circuit element is mounted in the element mounting area of the circuit board, specifically, directly below the electronic circuit element. Then, the sealing body is directly supplied through the sealing body supply hole. Therefore, the sealing body can be filled without being affected by the change in the characteristics of the sealing body, for example, the change in the viscosity of the sealing body. Further, since it is not necessary to use a conventional filling device (dispenser discharge device), defective filling of the sealing body can be reduced, and an electronic circuit device having excellent reliability can be realized. Furthermore, in the electronic circuit device, since the sealing body supplied from the back surface side of the circuit board to the element mounting region through the sealing body supply hole is uniformly filled from the central portion of the element mounting region toward the periphery, Poor filling can be prevented.

A second feature of the present invention is that the circuit board is provided with a sealing body supply hole penetrating from the front surface to be the element mounting surface to the back surface, and the circuit board is mounted on the element mounting area of the circuit board via a protruding electrode. And an electronic circuit element, at least a part of the inside of the sealing body supply hole, and a first fluid substance having at least a sealing function, which is filled between the element mounting surface and the electronic circuit element, and an adhesive function. It is an electronic circuit device provided with a substrate support adhered to a circuit substrate via the second fluid substance.

According to the second aspect of the present invention, the first fluid substance is directly supplied as a sealing body directly below the electronic circuit element through the sealing body supply hole. Therefore, the sealing body can be filled without being affected by the change in the characteristics of the sealing body, for example, the change in the viscosity of the sealing body, and the conventional filling device (dispenser discharge device).
Since there is no need to use, the filling failure of the sealing body can be reduced,
An electronic circuit device with excellent reliability can be realized. Furthermore, in the electronic circuit device, since the sealing body supplied from the back surface side of the circuit board to the element mounting region through the sealing body supply hole is uniformly filled from the central portion of the element mounting region toward the periphery, Poor filling can be prevented. At the same time, the second fluid substance having an adhesive function can surely adhere the circuit substrate to the substrate support such as the insulating metal substrate. If a material having a high thermal conductivity is selected as the second fluid substance, the heat dissipation characteristic is also improved. That is, since it is possible to independently select the viscosity, the electric insulation, the thermal conductivity, the adhesive force, etc. of the first fluid substance and the second fluid substance, it is possible to select the optimum material.
It is possible to comprehensively improve the characteristics of the electronic circuit device such as adhesiveness, heat dissipation, stress relaxation characteristics at the interface, and reliability.

A third feature of the present invention is that a sealing body supply hole that penetrates from the element mounting area of the element mounting surface to the back surface facing the element mounting surface and supplies the sealing body from the back surface side to the element mounting area is provided. A step of mounting an electronic circuit element on the element mounting area of the formed circuit board through a protruding electrode, and a step of forming a fluid substance having fluidity and having at least a sealing function and an adhesive function on the back surface of the circuit board. The circuit board is attached and fixed to the board support by using the fluid substance as an adhesive, and the fluid substance is supplied from the back side of the circuit board to the element mounting area through the sealing body supply hole. It is a method of assembling an electronic circuit device including a step of filling a space between an element mounting surface and an electronic circuit element as a sealing body.

According to the third aspect of the present invention, defective filling of the sealing body during assembly of the electronic circuit device can be reduced, so that the manufacturing yield can be improved, and an electronic circuit device having excellent reliability can be provided. Easy to assemble. In addition, an assembly process in which the fluid material has a sealing function and an adhesive function, and the fluid material is used as an adhesive body to attach and fix the circuit board to the substrate support, and the fluid material is used as a sealing body for electronic circuit elements Each of the assembling steps of filling immediately below can be performed substantially simultaneously. Therefore, the number of assembling steps can be reduced in the assembling process of the electronic circuit device.

A fourth feature of the present invention is that a sealing body supply hole that penetrates from the element mounting area of the element mounting surface to a back surface facing the element mounting surface and supplies a sealing body from the back surface side to the element mounting area is provided. In the formed circuit board, a step of mounting an electronic circuit element in an element mounting area via a protruding electrode, and forming a first fluid material having at least a sealing function in a sealing body supply hole portion on a back surface of the circuit board. And a step of forming a second fluent substance having at least an adhesive function by covering the first fluent substance, and using the second fluent substance as an adhesive to attach and fix the circuit board to the substrate support, A step of supplying a first fluid material to the element mounting region from the back surface side of the substrate through the sealing material supply hole and filling the first fluid material as a sealing material between the element mounting surface and the electronic circuit element. Equipped electronic circuit It is that it is a method of assembling the location.

According to the fourth aspect of the present invention, defective filling of the first fluid material as a sealing body at the time of assembling the electronic circuit device can be reduced, and the manufacturing yield is improved. Furthermore, according to the fourth aspect of the present invention, an electronic circuit device having excellent overall characteristics can be easily assembled. This is because the first fluid substance as the sealing body and the second fluid substance as the adhesive body are respectively formed of different fluid substances, so that the viscosity, the electrical insulating property, the thermal conductivity, and the adhesion are obtained. This is due to the ability to select powers independently. That is, it is possible to select the optimum material for the sealing body and the adhesive body, and it is easy to comprehensively improve the characteristics of the electronic circuit device such as the adhesiveness, the heat dissipation, the stress relaxation characteristic at the interface, and the reliability. is there. Further, the number of assembling steps of the electronic circuit device can be reduced as in the third feature.

[0024]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiment 1 Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
1 is a sectional structural view of an electronic circuit device according to Embodiment 1 of the present invention. The electronic circuit device 20 includes a board support (support board) 21 used as a heat dissipation plate, a circuit board 22 mounted on the surface of the board support 21, and an electrical connection between the circuit board 22 and an external device. Lead 26 and a package 28 for hermetically sealing them.

The circuit board 22 and the electronic circuit element 25 are mounted on the board mounting surface (upper surface in FIG. 1) of the board support 21. The electronic circuit element 25 is, for example, a resistance element, a capacitance element, a semiconductor element (for example, a semiconductor chip), or the like. The substrate support 21 is formed of a material having a good thermal conductivity and a small difference in coefficient of thermal expansion from the circuit board 22, for example, a ceramic such as alumina, beryllia, aluminum nitride, or a material such as silicon carbide.

FIG. 2 is an enlarged cross-sectional view of the main part of the circuit board 22, and FIG. 3 is an enlarged plan view of the circuit board 22. An electronic circuit element 24 is mounted in the element mounting area of the element mounting surface (upper surface in FIGS. 1 and 2) of the circuit board 22. Circuit board 22
For example, a ceramics substrate is used for this, and wiring (for example, thick film wiring conductor) 22L, bump connection pads 22P, bonding pads 22B, etc. are formed on the element mounting surface. In the present embodiment, a bare semiconductor chip is used as the electronic circuit element 24. The bare semiconductor chip is mounted by the flip-chip method by using the protruding electrodes (bump electrodes) 24A by face-down bonding with the integrated circuit surface and the element mounting surface of the circuit board 22 facing each other. A solder ball, a conductive adhesive, a metal rod, or the like may be used as the protruding electrode 24A. For example,
When a solder ball is used, the solder ball is formed on at least one of the bump connection pad (not shown) of the bare semiconductor chip and the bump connection pad 22P of the circuit board 22, and then the solder ball is reflowed to form the protruding electrode. 24A is formed. Electronic circuit element 24 and circuit board 2
2 is spaced from each other with a protruding electrode 24A interposed therebetween,
This separation dimension is set to, for example, 60 to 100 μm.

Although not limited to this number, the protruding electrode 24
Four A are provided, one for each corner of the peripheral portion of the bare semiconductor chip. The circuit board 22 is attached and fixed on the board mounting surface of the board support 21 by an adhesive 23A. A specific example of this adhesive 23A will be described later.

In the element mounting area of the circuit board 22 (the area corresponding to the mounting position of the electronic circuit element 24 indicated by the dotted line 24 in FIG. 3 and indicated by the broken line), the element mounting surface faces the element mounting surface. Sealing body supply hole 22H penetrating the back surface
Is provided. One sealing body supply hole 22H is provided in the central portion of the element mounting region in the present embodiment. More specifically, the sealing body supply hole 22H is arranged in the central portion of the region surrounded by the plurality of protruding electrodes 24A. The sealing body supply hole 22H is directly provided between the electronic circuit element 24 and the element mounting region from the back surface side of the circuit board 22 to the front surface (element mounting surface), that is, directly below the electronic circuit element 24. It is used as a through hole for supplying 23B. The sealing body supply hole 22H is formed to have a diameter of, for example, 50 to 1000 μm, preferably 100 to 500 μm, and is formed by, for example, mechanical punching.

As shown in FIG. 1, the circuit board 22 is attached and fixed on the circuit board mounting surface of the board support 21 by an adhesive 23A. On the other hand, the sealing body 23B is filled between the element mounting region of the circuit board 22 and the electronic circuit element 24. In the present embodiment, the adhesive body 23A and the sealing body 2
The same material is used for each of 3B, and the sealing body 23B
Is supplied from the back surface side of the circuit board 22 to the element mounting region through the sealing body supply hole 22H and filled. The adhesive 23A basically has an adhesive function of adhering the substrate support 21 and the circuit board 22 to each other, while the encapsulant 23B protects the integrated circuit surface of the electronic circuit element 24 and the protruding electrode 24A. It has a protection function such as protection. An epoxy resin, for example, a bisphenol epoxy resin containing a curing agent and a small amount of filler as a filler is used for each of the adhesive body 23A and the sealing body 23B. Sealing body 23B
In order to cover and protect at least the integrated circuit surface of the electronic circuit element 24 and the protruding electrode 24A, the film thickness from the element mounting surface of the circuit board 22 is set to, for example, 90 to 110 μm.

As shown in FIG. 1, the outer portion of the lead 26 projects outside the package 28, and this outer portion is directly connected to an external device. The inner portion of the lead 26 exists inside the package 28, and the inner portion and the bonding pad 22B of the circuit board 22 are electrically connected by a bonding wire 27. Also,
The bonding pad 22B of the circuit board 22 and the electronic circuit element 25 directly mounted on the substrate support 21 are electrically connected by a bonding wire 27. A gold wire or an aluminum wire is used for the bonding wire 27, and the gold wire or the aluminum wire is wire-bonded by using an ultrasonic bonding device or the like.

The package 28 is formed of, for example, an epoxy resin, and the epoxy resin is molded by a transfer molding method or the like, if necessary.

Next, a process of assembling the electronic circuit device 20 described above will be described. 4 to 7 are enlarged cross-sectional views of the essential part of the electronic circuit device 20 showing each step for explaining the assembly process.

(1) As shown in FIG. 2 described above, the electronic circuit element 24 is provided on the element mounting surface of the circuit board 22 in the element mounting area by the flip chip method via the protruding electrodes 24A.
Implement. Before mounting the electronic circuit element 24, the sealing body supply hole 22H is already formed in the circuit board 22. The sealing body supply hole 22H is formed during the manufacturing process of the circuit board 22 or after the manufacturing process of the circuit board 22 is completed.

(2) Next, as shown in FIG. 4, a fluid substance 23 having at least an adhesive function and a sealing function is formed on the entire rear surface of the circuit board 22. As the fluid substance 23, a bisphenol epoxy resin containing a curing agent and a filler is used as described above, and the epoxy resin is formed by, for example, a transfer method. Further, the epoxy resin may be formed by a coating method. Since the fluid substance 23 forms the adhesive 23A and is supplied to the element mounting region from the back surface side of the circuit board 22 through the sealing body supply holes 22H to form the sealing body 23B, the fluid material 23 is formed on the back surface side of the circuit board 22. Is slightly thicker, for example, about 80 to 150 μm, preferably 100 to 120 μm.

(3) Next, as shown in FIG. 5, the circuit board 22 is suction-held by the vacuum suction jig (vacuum suction collet) 40 so that the element mounting surface side of the circuit board 22 forms a vacuum system. Then, as shown in FIG.
With the circuit board 22 adsorbed and held by the circuit board 22, the circuit board 22 is pressed against the board mounting surface of the board support 21 with an appropriate force, and the circuit board 2 is mounted on the circuit board mounting surface of the board support 21.
Equipped with 2. By mounting the circuit board 22 on the substrate support 21, a part of the fluid substance 23 previously formed on the back surface side of the circuit board 22 is used as an adhesive 23A, and the circuit board 22 is supported by the adhesive 23A. Bonded to body 21. On the other hand, the other part of the fluid material 23 is pressed from the vacuum suction jig 40 and the vacuum force from the vacuum suction jig 40 through the sealing body supply hole 22H from the back surface side of the circuit board 22 to the element mounting surface side ( It is pulled up to the front surface side) and filling is started between the electronic circuit element 24 and the circuit board 22 as the sealing body 23B. The vacuum force obtained by the vacuum suction jig 40 promotes the lifting and filling of the fluid material 23 in the sealed body supply hole 22H, so that it is basically preferable to use the vacuum force together, but the vacuum force is not always necessary. Not.

(4) Next, as shown in FIG.
By pressing the circuit board 22 against the substrate support 21 and using a vacuum force together, the fluid material 23 spreads from the central portion of the element mounting area toward the periphery thereof to the outside of the protruding electrode 24A, and the element mounting area and the electronic circuit element. The flowable substance 23 is formed almost in the entire area between 24 and 24. That is, the filling of the sealing body 23A made of the fluid substance 23 is completed. Then, if necessary, the fluidity of the fluid substance 23 is removed, and the adhesive body 23A and the sealing body 23B are respectively cured.

(5) Thereafter, the bonding pads 22B of the circuit board 22 and the leads 26 are electrically connected by the bonding wires 27, and the board support 21 and the circuit board mounting surface of the board support 21 are connected. Mounted circuit board 22
The electronic circuit device 20 according to the present embodiment is completed by packaging the above with the package 28. For example, an epoxy resin is used for the package 28, and this epoxy resin is molded by the transfer molding method.

In the electronic circuit device 20 having the above-described structure, between the electronic circuit element 24 and the element mounting surface on which the electronic circuit element 24 is mounted in the element mounting area of the circuit board 22, in detail, Immediately below the circuit element 24, the sealing body 23B is directly supplied through the sealing body supply hole 22H. Therefore, the sealing body 23B can be filled without being affected by the change in the characteristics of the sealing body 23B, for example, the change in the viscosity of the sealing body 23B, and the conventional filling device is not used. The electronic circuit device 20 that can be reduced and has excellent reliability can be realized. Further, the electronic circuit device 20
The sealing body supply hole 2 from the back side of the circuit board 22.
Since the sealing body 23B supplied to the element mounting region through 2H is evenly filled from the central portion of the element mounting region toward the periphery, defective filling can be further prevented.

Further, in the method of assembling the electronic circuit device 20, as described above, since the filling failure can be reduced and the electronic circuit device 20 having excellent reliability can be realized, the manufacturing yield can be improved. The fluid substance 23 has a sealing function and an adhesive function, and the fluid substance 23 is bonded to the adhesive body 2.
3A, the assembly process of mounting and fixing the circuit board 22 to the substrate support 21, and the assembly process of using the fluid substance 23 as the sealing body 23B and filling the electronic circuit element 24 directly below can be performed substantially at the same time. . Therefore, in the assembly process of the electronic circuit device 20, the number of assembly steps can be reduced.

Embodiment 2 In this embodiment, in the electronic circuit device 20 according to Embodiment 1 described above, an adhesive 23A for adhering the circuit board 22 to the substrate support 21, a circuit board 22 and an electronic circuit element 24. A case in which each of the sealing bodies 23B to be filled between and is optimized will be described.

8 to 10 are enlarged cross-sectional views of essential parts showing respective assembling steps for explaining the assembling process of the electronic circuit device according to the second embodiment of the present invention.

(1) Similar to the assembling process of the electronic circuit device 20 according to the first embodiment, as shown in FIG.
The electronic circuit element 24 is mounted on the circuit board 22 by the flip chip method.

(2) Next, as shown in FIG. 8, a first fluid material 23D having at least a sealing function is formed in the sealing body supply hole 22H on the back surface of the circuit board 22 and its peripheral portion, and A second fluid material 23C having at least an adhesive function is formed on the entire surface of the back surface of the circuit board 22 on the front surface of the first fluid material 23D. First liquid substance 23
D will be used later as the sealing body 23B, for example, a bisphenol epoxy resin containing a curing agent and a slightly small amount of filler. This epoxy resin is formed by, for example, a transfer method. When the amount of the filler is small, the viscosity of the bisphenol-based epoxy resin becomes particularly low, and the circuit board 2
It is possible to smoothly fill the sealing body 23B through the sealing body supply hole 22H from the back surface of 2 to the element mounting surface side. The second fluid material 23C is later used as the adhesive 23A, and for example, a bisphenol epoxy resin containing a curing agent and a slightly large amount of filler is used. This epoxy resin is formed by, for example, a transfer method. If there is a large amount of filler,
The bisphenol-based epoxy resin has particularly high thermal conductivity and viscosity, improves the adhesion between the circuit board 22 and the board support 21, improves the heat dissipation from the circuit board 22 to the board support 21, and improves the circuit performance. The stress generated between the substrate 22 and the substrate support 21 is relaxed.

(3) Next, as in the assembly process of the electronic circuit device 20 described above, as shown in FIG.
Is suction-held by the vacuum suction jig 40. Then, as shown in FIG. 10, in a state where the circuit board 22 is suction-held by the vacuum suction jig 40, the circuit board 22 is pressed against the board mounting surface of the board support body 21 with an appropriate force, and the board support body 21 is pressed.
The circuit board 22 is mounted on the board mounting surface. By mounting the circuit board 22 on the substrate support 21, the second fluid substance 23C previously formed on the back surface side of the circuit board 22 is the adhesive 2
The circuit board 22 is adhered to the substrate support 21 by the adhesive 23A. On the other hand, the first fluid material 23D is pulled up from the back surface side of the circuit board 22 to the element mounting surface side through the sealing body supply hole 22H by the pressing force of the vacuum suction jig 40 and the vacuum force from the vacuum suction jig 40. It is filled between the electronic circuit element 24 and the circuit board 22 as the sealing body 23B.

(4) After that, the bonding pads 22B of the circuit board 22 and the leads 26 are electrically connected by the bonding wires 27, and the board supporting body 21 and the circuit board mounting surface of the board supporting body 21 are connected. Mounted circuit board 22
The electronic circuit device 20 according to the present embodiment is completed by packaging the above with the package 28.

In the electronic circuit device 20 and the assembling process thereof configured as described above, in addition to the function and effect obtained by the electronic circuit device 20 of the first embodiment, the sealing body 2 is obtained.
Since each of 3B and the adhesive body 23A is formed of the first fluid substance 23D and the second fluid substance 23C which are different from each other, both the sealing body 23B and the adhesive body 23A can be optimized.

The present invention is not limited to the above embodiment. For example, according to the present invention, in the electronic circuit device 20 described above, a plurality of sealing body supply holes 22H may be formed in the element mounting region of the circuit board 22.

Furthermore, the present invention is based on the electronic circuit device 2 described above.
0, a plurality of electronic circuit elements (for example, a plurality of bare semiconductor chips) 24 are mounted on the element mounting surface of the circuit board 22, and a sealing body supply hole 22H is formed in each element mounting area of the circuit board 22. You may. Sealing body supply hole 22
The sealing bodies 23B filled from H to the plurality of element mounting areas are formed of the same material or different materials in the respective element mounting areas.

Further, in the present invention, a substrate such as an insulating metal substrate or a PCB substrate may be used as the substrate support 21 instead of the above-mentioned heat dissipation plate. Alternatively, a printed circuit board or a motherboard may be used as the board support 21, and the above-described circuit board 22 may be mounted as a daughter board (or baby board) on the surface of the board support 21 which is the motherboard.

[0050]

As described above, according to the present invention, it is possible to provide an electronic circuit device in which defective filling of the sealing body is reduced and reliability is improved.

According to the present invention, the element mounting regions of the bare semiconductor chip and the circuit board, and the circuit board and the substrate support are uniformly bonded, and the heat dissipation characteristics of the bare semiconductor chip are improved. Therefore, it is possible to provide an electronic circuit device such as a hybrid IC (power IC) capable of stably outputting a large amount of power or a power semiconductor device.

According to the present invention, since the adhesion between the bare semiconductor chip and the circuit board and the adhesion between the circuit board and the substrate support are made uniform, the stress at the adhesion surface interface is relieved,
This enables stable and highly reliable operation of electronic circuit devices such as power ICs and power semiconductor devices.

According to the assembling method of the present invention, the number of steps in the assembling process of the electronic circuit device can be reduced.

According to the assembling method of the present invention, the bare semiconductor chip and the element mounting region of the circuit board can be evenly bonded with ease and at high yield.

According to the assembling method of the present invention, the stress at the bonding surface interface between the bare semiconductor chip and the circuit board and between the circuit board and the substrate support is relaxed, and the power semiconductor device has a structure with good heat dissipation characteristics. It is possible to easily assemble electronic circuit devices such as.

[Brief description of drawings]

FIG. 1 is a sectional structural view of an electronic circuit device according to a first embodiment of the present invention.

FIG. 2 is an enlarged cross-sectional view of a main part of a circuit board of an electronic circuit device.

FIG. 3 is an enlarged plan view of the electronic circuit device.

FIG. 4 is an enlarged cross-sectional view of a main part of the electronic circuit device in a first step for explaining an assembly process.

FIG. 5 is an enlarged sectional view of an essential part of the electronic circuit device in a second step.

FIG. 6 is an enlarged sectional view of an essential part of the electronic circuit device in a third step.

FIG. 7 is an enlarged sectional view of an essential part of the electronic circuit device in a fourth step.

FIG. 8 is an enlarged sectional view of an essential part of the electronic circuit device in a first step for explaining an assembly process according to the second embodiment of the present invention.

FIG. 9 is an enlarged sectional view of an essential part of the electronic circuit device in a second step.

FIG. 10 is an enlarged sectional view of an essential part of the electronic circuit device in a third step.

FIG. 11 is a sectional structural view of an electronic circuit device according to a conventional technique.

FIG. 12 is a side view of essential parts of the electronic circuit device showing a step of filling the resin sealing body in the assembly process according to the conventional technique.

FIG. 13 is a side view of essential parts of the electronic circuit device showing a step of filling another resin sealing body in the assembly process according to the conventional technique.

[Explanation of symbols]

20 Electronic circuit device 21 Substrate support 22 circuit board 22H Sealing body supply hole 22P bump connection pad 23 Liquid substances 23A adhesive 23B sealed body 23D First fluid substance 23C Second fluid substance 24 Electronic circuit element 24A protruding electrode 26 Lead 27 Bonding wire 28 packages

Continuation of front page (58) Fields surveyed (Int.Cl. ⁷ , DB name) H01L 23/29 H01L 23/28 H01L 23/31

Claims (13)

(57) [Claims] 1. A surface facing an element mounting surface facing the surface
Preparing a circuit board in which the sealing body supply hole penetrating to the back surface is formed to be a step of mounting an electronic circuit element via a protruding electrode in the element mounting area of the surface of the circuit board, the circuit board wherein the back surface only of the steps of introducing a step of forming a flowable material having a sealing function and adhesive function, a portion of the flowable material from the back side to the inside of the sealing body supply holes, the Using the other part of the fluid material remaining on the back surface as an adhesive body, attaching and fixing the back surface of the circuit board to a substrate support, and the fluidity from the sealing body supply hole to the surface. It said of the substance
On the back side to supply a part and replenish the part
Still another part of the remaining fluid substance is supplied to the sealing body.
The method of assembling an electronic circuit device, comprising the step of supplying the fluid to a supply hole and filling the part of the fluid substance between the element mounting surface and the electronic circuit element. Wherein introducing said portion of said flowable material inside said sealed body supply holes by selectively vacuum only the table <br/> surface side of the circuit board The method for assembling an electronic circuit device according to claim 1, which is carried out. 3. The step of introducing the part of the fluid material into the inside of the sealing body supply hole is performed by contacting an opening of a vacuum suction jig with a peripheral portion of the circuit board. The method for assembling an electronic circuit device according to claim 1 or 2, wherein the method is carried out by selectively applying a vacuum to only the front surface side of the electronic circuit device. 4. The thickness of the fluid substance in the step of forming the fluid substance only on the back surface of the circuit board is
4. The method of assembling an electronic circuit device according to claim 1, wherein the thickness of the fluid material is greater than that of the fluid material after the step of attaching and fixing the circuit board to a board support. 5. The thickness of the fluid substance in the step of forming the fluid substance only on the back surface of the circuit board is:
It is 80 to 150 μm.
5. The method for assembling the electronic circuit device according to any one of 4 above. 6. The electronic device according to claim 1, wherein the step of forming the fluid material only on the back surface of the circuit board is performed with the back surface facing upward. Assembling method of circuit device. 7. A surface facing an element mounting surface facing the surface
Preparing a circuit board in which the sealing body supply hole penetrating to the back surface is formed to be a step of mounting an electronic circuit element via a protruding electrode in the element mounting area of the surface of the circuit board, the circuit board of at the back, forming a first fluid material having a sealing function to the portion of the sealing body supply holes, from the back side of the first fluid material to the interior of the sealing body supply hole introducing a portion, in the back surface of the circuit board, forming overlapping a second flowable substance having an adhesive function to the first fluid material so as to cover the first fluid material, The circuit board using the second fluid material as an adhesive.
Attaching and fixing the back surface to the substrate support, and supplying the first fluid material to the front surface through the sealing body supply hole, the first fluid material being attached to the element mounting surface and the electronic circuit element. And a step of filling the space between the electronic circuit device and the electronic circuit device. 8. introducing said first fluid material into the interior of the sealing body supply holes, which comprises carrying out by selectively vacuum only the surface side of the circuit board A method of assembling the electronic circuit device according to claim 7. 9. The step of introducing the first fluid material into the inside of the sealing body supply hole is performed by contacting an opening of a vacuum suction jig with a peripheral portion of the circuit board and using the vacuum suction jig. 9. The method for assembling an electronic circuit device according to claim 7, wherein only the front surface side is selectively evacuated. 10. The thickness of the second fluent material in the step of forming the second fluent material on the back surface of the circuit board is the first value after the step of attaching and fixing the circuit board to a substrate support. The method for assembling an electronic circuit device according to any one of claims 7 to 9, wherein the two-fluid material is thicker than the fluid material. 11. The method according to claim 7, further comprising the step of introducing a part of the second fluid substance into the sealing body supply hole from the back surface side. A method for assembling the described electronic circuit device. 12. The electron according to claim 7, wherein the step of forming the first fluid material on the back surface of the circuit board is performed with the back surface facing upward. Assembling method of circuit device. 13. The method of assembling the electronic circuit device according to claim 1, wherein the sealing body supply hole is provided in a central portion of the element mounting region.