JP2000077440A - Resin sealing method of resin-sealed hybrid integrated circuit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To dispense with a process, in which a dam is formed to prevent sealing resin from flowing out by a method wherein thermosetting liquid sealing resin is heated, together with a circuit board and cured, a resin frame is dismounted from the cured sealing resin, and a semiconductor chip and bonding wires are sealed up with resin. SOLUTION: A resin frame 8 of fluororesin or the like which is high in releasability is mounted on a circuit board 2, surrounding a region where a semiconductor chip 3 and bonding wires 4 are located. Thermosetting liquid sealing resin 5 is made to flow by natural diffusion inside the resin frame 8, whereby the semiconductor chip 3 and the bonding wires 4 are covered with the sealing resin. Thereafter, the liquid sealing resin 5 is heated together with the circuit board 2 to be cured, the resin frame 8 is dismounted from the cured sealing resin 5, and thus the semiconductor chip 3 and the bonding wires 4 are sealed with sealing resin.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin sealing method for a resin-sealed hybrid integrated circuit in which a plurality of semiconductor chips are mounted on a circuit board and sealed with a resin.

[0002]

2. Description of the Related Art In a resin-sealed hybrid integrated circuit, a plurality of semiconductor chips are mounted on a circuit board, the semiconductor chip is covered and sealed with a resin, and external connection leads are attached to the circuit board. It has a desired electrical function using external connection leads as input / output terminals, and various types are used as hybrid ICs and multichip modules. In the case of a resin-encapsulated hybrid integrated circuit, a thermosetting liquid sealing resin is dropped and coated on a semiconductor chip mounted on a circuit board and a bonding wire connecting the semiconductor chip and the circuit board. The semiconductor chip and the bonding wire are sealed by curing the resin, thereby protecting the semiconductor chip and the bonding wire from corrosion and external stress. Because of its cost, it is often used in the field of small consumer goods.

In a resin-sealing process of a resin-sealed hybrid integrated circuit, a semiconductor chip is mounted and a bonding board of the circuit board made of glass epoxy or the like connected to the semiconductor chip by a wire bonding method. A step of applying a thermosetting liquid resin of the same type as the sealing resin to form a dam for preventing the sealing resin from flowing out, and then forming a dam for preventing the sealing resin from flowing out from above the semiconductor chip and the bonding wires. A step of dropping a thermosetting liquid sealing resin to cover the semiconductor chip and the bonding wire, and a step of heating and curing the sealing resin, whereby the semiconductor chip and the bonding wire are sealed. Is done.

FIG. 13 is a sectional view showing the structure of a conventional resin-encapsulated hybrid integrated circuit. Reference numeral 2 denotes a circuit board on which a semiconductor chip 3 is mounted and which is electrically connected to the semiconductor chip 3 by bonding wires 4. Numeral 5 is a sealing resin covering the semiconductor chip 3 and the bonding wires 4. Reference numeral 6 denotes a dam provided around the semiconductor chip 3 and the bonding wires 4 on the circuit board 2 to prevent the resin from flowing out when the liquid sealing resin 5 is dropped on the semiconductor chip. Reference numeral 7 denotes an external connection lead, which constitutes the resin-sealed hybrid integrated circuit 1 having a desired electrical function using the lead as an input / output terminal.

FIG. 14 is a perspective view of the one shown in FIG. First, the semiconductor chip 3 is attached to the circuit board 2, and the circuit board 2 and the semiconductor chip 3 are connected by bonding wires 4. Next, a thermosetting liquid resin is applied to the area of the semiconductor chip 3 and the bonding wires 4 on the circuit board 2 to form a dam 6 for preventing the sealing resin from flowing out. Then, the semiconductor chip 3 and the bonding wires 4
A liquid sealing resin 5 is dripped from above by a dispenser or the like, and is allowed to flow by natural diffusion to cover the regions of the semiconductor chip 3 and the bonding wires 4. Further, the sealing resin 5 is heated and cured to seal the semiconductor chip 3 and the bonding wires 4.

[0006]

SUMMARY OF THE INVENTION In the resin sealing method for a resin-sealed hybrid integrated circuit as described above, the liquid sealing resin 5 is used.
When the resin is dropped onto the semiconductor chip 3 and the bonding wires 4, the sealing resin 5 flows excessively by natural diffusion, so that the sealing resin 5 does not flow out of a required area. There is a problem that it needs to be formed on the substrate 2 and it takes a long time to manufacture.

Further, since the dam 6 for preventing outflow is formed by applying a resin to the circuit board 2, the height of the dam 6 which can be formed is limited. When used, the sealing resin 5 flows out of the required area beyond the dam 6, and as a result, the height of the sealing resin 4 is insufficient to expose the bonding wires 4, and parts outside the required area, There is a problem that the sealing resin adheres to the wiring and the like.

Further, the final shape, height and area of the sealing resin 5 after the curing step depend on the flow of the sealing resin 5 due to natural diffusion. There is a problem that it is difficult to control the final shape, height and area.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems. In a resin-sealed hybrid integrated circuit, a step of forming a dam for preventing a sealing resin from flowing out is unnecessary, and the sealing is performed. An object of the present invention is to provide a resin sealing method capable of controlling the shape, height and area of a resin.

[0010]

A resin sealing method for a resin-sealed hybrid integrated circuit according to a first aspect of the present invention is as follows.
Secondly, a resin frame formed of a highly releasable resin surrounding the semiconductor chip and the bonding wire area is attached, and second, a thermosetting liquid sealing resin is dropped inside each of the resin frames. Thirdly, the semiconductor chip and the bonding wires are covered by natural diffusion, and thirdly, the liquid sealing resin is heated and cured together with the circuit board, and fourthly, the resin frame is removed from the cured sealing resin. The bonding wire is sealed with a resin.

According to a second aspect of the present invention, there is provided a resin sealing method for a resin-sealed hybrid integrated circuit. First, each semiconductor chip and bonding wire region on a circuit board surrounds the semiconductor chip and bonding wire region. Secondly, a resin frame formed of a resin having a high release property is attached, and secondly, a thermosetting liquid sealing resin is dropped and spontaneously diffused inside each of the resin frames, and the semiconductor chip and the bonding wires are removed. Thirdly, a pressure plate made of a highly releasable resin is pressed from above the sealing resin to flatten and deform the upper surface of the sealing resin, and fourthly, the sealing resin is pressed. The semiconductor chip is sealed by removing the resin frame and the pressure plate from the fifth cured sealing resin by heating together with the circuit board and curing the resin.

A resin sealing method for a resin-sealed hybrid integrated circuit according to a third aspect of the present invention is as follows. First, each semiconductor chip and bonding wire region on a circuit board surrounds the semiconductor chip and bonding wire region. Secondly, a resin frame formed of a resin having a high release property is attached, and second, a cover of a resin having a high release property having an opening at an injection portion of the sealing resin is joined to an upper portion of the resin frame. 3 is filled with a thermosetting liquid sealing resin from an opening of the cover to cover the semiconductor chip and the bonding wires. Fourth, the liquid sealing resin is heated and cured together with the circuit board, Fifth, the resin frame and the cover are removed from the cured sealing resin, and the semiconductor chip and the bonding wires are sealed with the resin.

The resin sealing method for a resin-sealed hybrid integrated circuit according to a fourth aspect of the present invention is as follows. First, a semiconductor chip and a bonding wire region are formed in each semiconductor chip and a bonding wire region on a circuit board. Secondly, the surrounding metal frames are attached after the release agent is applied, and secondly, the metal frames are heated, and a thermosetting liquid sealing resin is dropped inside each of the metal frames to allow natural diffusion. Thirdly, the semiconductor chip and the bonding wires are covered by heating and curing the liquid sealing resin together with the circuit board, and the fourth step is to remove the metal frame from the cured sealing resin. Is sealed with a resin.

According to a fifth aspect of the present invention, there is provided a resin sealing method for a resin-sealed hybrid integrated circuit. First, a semiconductor chip and a bonding wire region are formed in a region of each semiconductor chip and a bonding wire on a circuit board. Secondly, the surrounding metal frames are attached after the release agent is applied, and secondly, the metal frames are heated, and a thermosetting liquid sealing resin is dropped inside each of the metal frames to allow natural diffusion. Third, a metal pressure plate coated with a release agent is pressed from above the sealing resin to flatly deform the upper surface of the sealing resin by pressing, from above the sealing resin. In addition, the sealing resin is heated and cured together with the circuit board while being pressurized, and the semiconductor frame is sealed by removing the metal frame and the pressure plate from the fifth cured sealing resin.

The resin sealing method for a resin-sealed hybrid integrated circuit according to a sixth aspect of the present invention is as follows. First, a semiconductor chip and a bonding wire region are formed in a region of each semiconductor chip and a bonding wire on a circuit board. The surrounding metal frame is attached after the release agent is applied, and secondly, the opening of the sealing resin injection portion is provided. The metal cover is joined to the upper portion of the metal frame after the release agent is applied. Thirdly, the metal frame is heated, and a thermosetting liquid sealing resin is filled from the opening of the cover to cover the semiconductor chip and the bonding wires. The semiconductor chip is sealed by heating and curing together with the substrate, and removing the metal frame and the cover from the fifth cured sealing resin.

In the resin sealing method for a resin-sealed hybrid integrated circuit according to a seventh aspect of the present invention, first, openings are provided at positions corresponding to all the semiconductor chips and bonding wire regions on the circuit board. Second, a resin mask formed of a resin having a high mold release property is mounted on a circuit board, and second, a thermosetting liquid sealing resin is dropped into each opening of the resin mask and naturally diffused, thereby forming a semiconductor. Thirdly, the chip and the bonding wires are covered, and thirdly, the liquid sealing resin is heated and cured together with the circuit board. Fourth, the resin mask is removed from the cured sealing resin, and the semiconductor chips and the bonding wires are removed from the resin. It is to be sealed.

In the resin sealing method for a resin-sealed hybrid integrated circuit according to the eighth invention, first, openings are provided at positions corresponding to all the semiconductor chips and bonding wire regions on the circuit board. Second, a resin mask formed of a resin having a high mold release property is mounted on a circuit board, and second, a thermosetting liquid sealing resin is dropped into each opening of the resin mask and naturally diffused, thereby forming a semiconductor. Thirdly, the chip and the bonding wire are covered, and thirdly, a pressure plate made of a highly releasable resin is pressed from above the sealing resin, and the upper surface of the sealing resin is flatly deformed by pressure. The resin is heated and cured together with the circuit board while the resin is being pressed, and the resin mask and the pressure plate are removed from the fifth cured sealing resin to seal the semiconductor chip.

In the resin sealing method for a resin-sealed hybrid integrated circuit according to the ninth aspect, first, openings are provided at positions corresponding to all the semiconductor chips and bonding wire regions on the circuit board. Second, a resin mask formed of a resin having a high release property is mounted on a circuit board, and second, a cover of a resin having a high release property is provided on an upper surface of the resin mask, with an opening provided at an injection portion of a sealing resin. Thirdly, a thermosetting liquid sealing resin is filled from the opening of the cover to cover the semiconductor chip and the bonding wires, and fourthly, the liquid sealing resin is heated together with the circuit board. Fifth, the resin mask and the cover are removed from the cured sealing resin to seal the semiconductor chip and the bonding wires with the resin.

In the resin sealing method for a resin-sealed hybrid integrated circuit according to the tenth aspect, first, openings are provided at positions corresponding to all the semiconductor chips and bonding wire regions on the circuit board. After applying the release agent, the metal mask is mounted on the circuit board. Second, the metal mask is heated, and a thermosetting liquid sealing resin is dropped into each opening of the metal mask. Third, the semiconductor chip and the bonding wires are covered by natural diffusion, and thirdly, the liquid sealing resin is heated and cured together with the circuit board.
Then, the metal mask is removed from the cured sealing resin, and the semiconductor chip and the bonding wires are sealed with resin.

In the resin sealing method for a resin-sealed hybrid integrated circuit according to an eleventh aspect, first, openings are provided at positions corresponding to all the semiconductor chips and bonding wire regions on the circuit board. After applying the release agent, the metal mask is mounted on the circuit board. Second, the metal mask is heated, and a thermosetting liquid sealing resin is dropped into each opening of the metal mask. Thirdly, the semiconductor chip and the bonding wires are covered, and thirdly, a metal pressure plate coated with a release agent is pressed from above the sealing resin to flatly deform the upper surface of the sealing resin. Fourth,
The sealing resin is heated and cured together with the circuit board while being pressed, and the semiconductor chip is sealed by removing the metal mask and the pressure plate from the fifth cured sealing resin.

In the resin sealing method for a resin-sealed hybrid integrated circuit according to the twelfth aspect, first, openings are provided at positions corresponding to all the semiconductor chips and bonding wire regions on the circuit board. After applying the release agent, the metal mask is mounted on the circuit board. Secondly, an opening is formed in the injection portion of the sealing resin. The metal cover is covered with the release agent. Thirdly, the metal mask is heated, and a thermosetting liquid sealing resin is filled from the opening of the cover to cover the semiconductor chip and the bonding wires. Is heated and cured together with the circuit board, and the metal mask and the cover are removed from the fifth cured sealing resin to seal the semiconductor chip.

[0022]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 FIG. 1 is a sectional view showing Embodiment 1 of the present invention, and FIG. 2 is a perspective view of the one shown in FIG. In the figure, reference numeral 2 denotes a semiconductor chip 3 attached, and the semiconductor chip 3 and a bonding wire 4 are attached.
Is a circuit board electrically connected to the circuit board. First, in the region of the semiconductor chip 3 and the wire bonding 4 on the circuit board 2, the semiconductor chip 3 and the bonding wire 4
A resin frame 8 made of fluororesin or the like having high releasability, surrounding the region of (1). Next, a thermosetting liquid sealing resin 5 is dropped into the inside of the resin frame 8 with a dispenser or the like, and flows by natural diffusion to cover the semiconductor chip 3 and the bonding wires 4. Thereafter, the liquid sealing resin 5 is applied to the circuit board 2.
And heat to cure. Further, the resin frame 8 is removed from the cured sealing resin 5, and the semiconductor chip 3 and the bonding wires 4 are resin-sealed. In the resin sealing method for a resin-sealed hybrid integrated circuit as described above, the semiconductor chip 3
And a resin frame 8 attached to the area of the bonding wire 4
Since the sealing resin 5 is dropped on the inside of the substrate, the step of forming a dam for preventing the sealing resin 5 from flowing out on the circuit board 2 by the resin becomes unnecessary, and at the same time, the resin frame 8 is formed with the required sealing resin 5. By setting the height higher than the height, it is possible to reliably prevent the sealing resin 5 from flowing out of a required area.

Embodiment 2 FIG. FIG. 3 is a sectional view showing Embodiment 2 of the present invention, and FIG. 4 is a perspective view of the one shown in FIG. In the figure, reference numeral 2 denotes a circuit board on which a semiconductor chip 3 is mounted and which is electrically connected to the semiconductor chip 3 via bonding wires 4. First, in the area of the semiconductor chip 3 and the wire bonding 4 on the circuit board 2, a metal frame 9 made of stainless steel or the like surrounding the area of the semiconductor chip 3 and the bonding wire 4 is used. After applying to the inside of 9, it is attached. Next, the metal frame 9 is heated, and a thermosetting liquid sealing resin 5 is dropped inside the metal frame 9 with a dispenser or the like and flows by natural diffusion to cover the semiconductor chip 3 and the bonding wires 4. I do. Thereafter, the liquid sealing resin 5 is heated and cured together with the circuit board 2. Further, the metal frame 9 is removed from the cured sealing resin 5, and the semiconductor chip 3 and the bonding wires 4 are resin-sealed. In the resin sealing method for a resin-sealed hybrid integrated circuit as described above, the sealing resin 5 is dropped on the inside of the metal frame 9 attached to the area of the semiconductor chip 3 and the bonding wires 4. The step of forming a dam for preventing the sealing resin 5 from flowing out of the resin becomes unnecessary, and at the same time,
By making the metal frame 9 higher than the required height of the sealing resin 5, it is possible to reliably prevent the sealing resin 5 from flowing out of a required area. In addition, since the sealing resin 5 is heated, the fluidity is increased by heating. By dropping the sealing resin 5 while heating the metal frame 9, spontaneous diffusion of the dropped sealing resin 5 is promoted, and the fluidity is increased. Even when the high sealing resin 5 is used, the resin can be sealed in a certain shape. Further, since the release agent 10 is also applied to the metal frame 9, the metal frame 9 can be easily removed from the cured sealing resin 5.

Embodiment 3 FIG. FIG. 5 is a sectional view showing Embodiment 1 of the present invention, and FIG. 6 is a perspective view of what is shown in FIG. In the figure, reference numeral 2 denotes a circuit board on which a semiconductor chip 3 is mounted and which is electrically connected to the semiconductor chip 3 via bonding wires 4. First, a resin mask 11 made of fluororesin or the like having high releasability and having an opening at a position corresponding to the region of the semiconductor chip 3 and the wire bonding 4 of the circuit board 2 is mounted on the circuit board 2.
Next, a thermosetting liquid sealing resin 5 is dropped into each opening of the resin mask 11 with a dispenser or the like, and is allowed to flow by natural diffusion to cover the semiconductor chip 3 and the bonding wires 4. Thereafter, the liquid sealing resin 5 is heated and cured together with the circuit board 2. Further, the resin mask 11 is removed from the cured sealing resin 5, and the semiconductor chip 3 and the bonding wires 4 are resin-sealed. In the resin sealing method of the resin-sealed hybrid integrated circuit as described above,
Since the sealing resin 5 is dropped onto the opening of the resin mask 11 having openings at positions corresponding to the regions of the semiconductor chip 3 and the bonding wires 4, the resin is prevented from flowing out onto the circuit board 2 by the resin. The step of forming the dam is unnecessary, and at the same time, by setting the resin mask 11 higher than the required height of the sealing resin 5, it is possible to reliably prevent the sealing resin 5 from flowing out of a required area. . Further, since all the semiconductor chips 3 and the bonding wires 4 on the circuit board 2 can be resin-sealed by using one resin mask 11, the resin mask 11 is mounted on the circuit board 2 and the cured sealing resin 5 Is easy to remove.

Embodiment 4 FIG. 7 is a sectional view showing Embodiment 1 of the present invention, and FIG. 8 is a perspective view of what is shown in FIG. In the figure, reference numeral 2 denotes a circuit board on which a semiconductor chip 3 is mounted and which is electrically connected to the semiconductor chip 3 via bonding wires 4. First, a metal mask 12 made of stainless steel or the like having an opening at a position corresponding to the region of the semiconductor chip 3 and the wire bonding 4 of the circuit board 2 is placed on a mold release agent 10 such as silicon grease inside the opening of the metal mask 12. And then mounted on the circuit board 2. Next, the metal mask 12 is heated, and a thermosetting liquid sealing resin 5 is dropped into each opening of the metal mask 12 with a dispenser or the like, and is allowed to flow by natural diffusion, so that the semiconductor chip 3 and the bonding are formed. The wire 4 is covered. Thereafter, the liquid sealing resin 5 is heated and cured together with the circuit board 2. Further, the metal mask 12 is removed from the cured sealing resin 5, and the semiconductor chip 3 and the bonding wires 4 are resin-sealed. In the resin sealing method for a resin-sealed hybrid integrated circuit as described above, the sealing resin 5 is dropped onto the opening of the metal mask 12 having openings at positions corresponding to the regions of the semiconductor chip 3 and the bonding wires 4. Therefore, the step of forming a dam for preventing the sealing resin 5 from flowing out of the resin on the circuit board 2 becomes unnecessary. It is possible to reliably prevent the resin 5 from flowing out of a required area. Also, since all the semiconductor chips 3 and the bonding wires 4 on the circuit board 2 can be resin-sealed using one metal mask 12, the metal mask 12 is mounted on the circuit board 2 and the cured sealing resin 5 Is easy to remove. Also,
Since the sealing resin 5 is heated, the fluidity thereof is increased. By dropping the sealing resin 5 while heating the metal mask 12, spontaneous diffusion of the dropped sealing resin 5 is promoted, and the fluidity is high. Even when the sealing resin 5 is used, the resin can be sealed in a certain shape. Furthermore, metal frame 1
Since the release agent 10 has been applied to the metal 2, the metal frame 12 can be easily removed from the cured sealing resin 5.

Embodiment 5 FIG. 9 is a sectional view showing Embodiment 5 of the present invention, and FIG. 10 is a perspective view of what is shown in FIG. 9. In Embodiment 3, a thermosetting liquid After the sealing resin 5 is dropped and spontaneously diffused to cover the semiconductor chip 3 and the bonding wires 4, a pressure plate 13 made of a resin such as a fluororesin having high releasability is pressed from above the sealing resin 5. Then, the upper surface of the sealing resin 5 is pressed and deformed flat. Thereafter, the sealing resin 5 is heated and cured together with the circuit board 2 while pressing the sealing resin 5 from above. Further, the pressure plate 13 and the resin mask 10 are removed from the cured sealing resin 5, and the semiconductor chip 3 and the bonding wires 4 are resin-sealed. In the resin sealing method for the resin-sealed hybrid integrated circuit as described above, a step of forming a dam for preventing the sealing resin 5 from flowing out on the circuit board 2 with a resin is unnecessary as in the third embodiment. At the same time, it is possible to reliably prevent the sealing resin 5 from flowing out of a required area, and to further deform the pressure of the sealing resin 5 dropped by the pressing plate 13 so that the upper portion becomes flat. Resin sealing can be performed at a fixed height and shape.

Embodiment 6 FIG. FIG. 11 is a sectional view showing a sixth embodiment of the present invention, and FIG. 12 is a perspective view of the structure shown in FIG. 11. In the third embodiment, a sealing resin 5 is injected into the upper opening of the resin mask 11. A resin cover 14 provided with an opening for bonding is attached, and the resin mask 11 to which the cover 14 is joined is mounted on the circuit board 2. Next, a thermosetting liquid sealing resin 5 is dripped from each opening of the cover 14 with a dispenser or the like, and is allowed to flow by natural diffusion to cover regions of the semiconductor chip 3 and the bonding wires 4. Thereafter, the liquid sealing resin 5 is heated and cured together with the circuit board 2. Further, the resin mask 11 and the cover 14 are removed from the cured sealing resin 5, and the semiconductor chip 3 and the bonding wires 4 are resin-sealed. In the resin sealing method for the resin-sealed hybrid integrated circuit as described above, a step of forming a dam for preventing the sealing resin 5 from flowing out on the circuit board 2 with a resin is unnecessary as in the third embodiment. At the same time, it is possible to reliably prevent the sealing resin 5 from flowing out of a required area, and to perform resin sealing at a certain height and shape without pressing the upper surface of the sealing resin 5. Can be.

[0028]

According to the first aspect of the present invention, since the sealing resin is dropped into the resin frame attached to the semiconductor chip and the bonding wire region, the sealing resin is prevented from flowing out on the circuit board by the resin. The step of forming the dam becomes unnecessary, and at the same time, by making the resin frame higher than the required height of the sealing resin, it is possible to reliably prevent the sealing resin from flowing out of the required area.

According to the second aspect of the present invention, since the sealing resin is dropped into the resin frame attached to the semiconductor chip and the bonding wire, a dam for preventing the sealing resin from flowing out is formed on the circuit board by the resin. The step of forming is not required, and at the same time, by making the resin frame higher than the required height of the sealing resin, it is possible to reliably prevent the sealing resin from flowing out of the required area. Further, since the upper portion of the sealing resin dropped by the pressing plate is deformed by pressing so as to be flat, the resin can be sealed with a certain height and shape.

According to the third aspect, the cover is joined to the upper portion of the resin frame attached to the area of the semiconductor chip and the bonding wire, and the sealing resin is filled from the opening of the cover, so that the resin is placed on the circuit board. This eliminates the step of forming a dam for preventing leakage of the sealing resin, and at the same time, makes the resin frame higher than the required height of the sealing resin to ensure that the sealing resin flows out of the required area. Can be prevented. In addition, the presence of the cover allows the resin to be sealed at a fixed height and shape without pressing the upper surface of the sealing resin.

According to the fourth aspect of the present invention, the sealing resin is dropped on the inside of the metal frame attached to the area of the semiconductor chip and the bonding wire. The step of forming the dam becomes unnecessary, and at the same time, by making the metal frame higher than the required height of the sealing resin, it is possible to reliably prevent the sealing resin from flowing out of the required area. In addition, since the sealing resin is heated, the fluidity is increased by heating. By dropping the sealing resin while heating the metal frame, the natural diffusion of the dropped sealing resin is promoted, and the sealing with high fluidity is performed. Even when a resin is used, the resin can be sealed in a certain shape. Furthermore, since the release agent is applied to the metal frame, the metal frame from the cured sealing resin can be easily removed.

According to the fifth aspect of the present invention, the sealing resin is dropped on the inside of the metal frame attached to the area of the semiconductor chip and the bonding wire. The step of forming the dam becomes unnecessary, and at the same time, by making the metal frame higher than the required height of the sealing resin, it is possible to reliably prevent the sealing resin from flowing out of the required area. In addition, since the sealing resin is heated, the fluidity is increased by heating. By dropping the sealing resin while heating the metal frame, the natural diffusion of the dropped sealing resin is promoted, and the sealing with high fluidity is performed. Even when resin is used, it can be sealed with a certain shape,
Further, since the upper portion of the sealing resin dropped by the pressing plate is deformed by pressing so as to be flat, the resin can be sealed with a certain height and shape. Furthermore, since the release agent is applied to the metal frame, the metal frame from the cured sealing resin can be easily removed.

According to the sixth aspect of the present invention, the cover is joined to the upper part of the metal frame attached to the area of the semiconductor chip and the bonding wires, and the sealing resin is filled from the opening of the cover, so that the circuit board can be used. At the same time, the step of forming a dam for preventing the sealing resin from leaking out of the resin becomes unnecessary, and at the same time,
By making the metal frame higher than the required height of the sealing resin, it is possible to reliably prevent the sealing resin from flowing out of the required area. In addition, since the sealing resin has higher fluidity when heated, by filling the sealing resin while heating the metal frame, the natural diffusion of the dropped sealing resin is promoted, and the sealing with high fluidity is performed. Even when a resin is used, the resin can be sealed in a certain shape, and the presence of the cover allows the resin to be sealed in a certain height and shape without pressing the upper surface of the sealing resin. Can be.
Furthermore, since the release agent is applied to the metal frame, the metal frame from the cured sealing resin can be easily removed.

According to the seventh aspect of the present invention, the sealing resin is dropped on the opening of the resin mask having openings at positions corresponding to the regions of the semiconductor chip and the bonding wires. The step of forming a dam for preventing the sealing resin from flowing out becomes unnecessary, and at the same time, the resin mask is made higher than the required height of the sealing resin, thereby reliably preventing the sealing resin from flowing out of the required area. can do. Further, since all the semiconductor chips and the bonding wires on the circuit board can be sealed with a resin using one resin mask, it is easy to mount the resin mask on the circuit board and remove the resin mask from the cured sealing resin.

According to the eighth aspect of the present invention, the sealing resin is dropped on the opening of the resin mask having the opening at the position corresponding to the region of the semiconductor chip and the bonding wire. The step of forming a dam for preventing the sealing resin from flowing out becomes unnecessary, and at the same time, the resin mask is made higher than the required height of the sealing resin, thereby reliably preventing the sealing resin from flowing out of the required area. can do. Further, since the upper portion of the sealing resin dropped by the pressing plate is deformed by pressing so as to be flat, the resin can be sealed with a certain height and shape. Further, since all the semiconductor chips and the bonding wires on the circuit board can be sealed with a resin using one resin mask, it is easy to mount the resin mask on the circuit board and remove the resin mask from the cured sealing resin.

According to the ninth aspect, the cover is joined to the upper portion of the resin mask having openings at positions corresponding to the regions of the semiconductor chip and the bonding wires, and the sealing resin is supplied from the openings of the cover. Filling eliminates the need for the step of forming a dam for preventing leakage of the sealing resin on the circuit board with resin, and at the same time makes the resin mask higher than the required height of the sealing resin, thereby Outflow from the area can be reliably prevented. Also,
With the cover, the resin can be sealed at a fixed height and shape without pressing the upper surface of the sealing resin. Further, since all the semiconductor chips and the bonding wires on the circuit board can be sealed with a resin using one resin mask, it is easy to mount the resin mask on the circuit board and remove the resin mask from the cured sealing resin.

According to the tenth aspect, the sealing resin is dropped on the opening of the metal mask having the opening corresponding to the area of the semiconductor chip and the bonding wire. The step of forming a dam for preventing the sealing resin from flowing out becomes unnecessary, and at the same time, the metal mask is made higher than the required height of the sealing resin, thereby reliably preventing the sealing resin from flowing out of the required area. can do. Further, since all the semiconductor chips and bonding wires on the circuit board can be sealed with a resin using a single metal mask, it is easy to mount the metal mask on the circuit board and remove it from the cured sealing resin. In addition, since the sealing resin has high fluidity when heated, by dropping the sealing resin while heating the metal mask, the natural diffusion of the dropped sealing resin is promoted, and the sealing with high fluidity is performed. Even when a resin is used, the resin can be sealed in a certain shape. Further, since the release agent is applied to the metal mask, the metal mask can be easily removed from the cured sealing resin.

According to the eleventh aspect, the sealing resin is dropped on the opening of the metal mask having openings at positions corresponding to the regions of the semiconductor chip and the bonding wires. The step of forming a dam for preventing the sealing resin from flowing out becomes unnecessary, and at the same time, the metal mask is made higher than the required height of the sealing resin, thereby reliably preventing the sealing resin from flowing out of the required area. can do. Further, since all the semiconductor chips and the bonding wires on the circuit board can be sealed with a resin using one metal mask, it is easy to dispose the metal mask on the circuit board and to remove the metal mask from the cured sealing resin. In addition, since the sealing resin has high fluidity when heated, by dropping the sealing resin while heating the metal mask, the natural diffusion of the dropped sealing resin is promoted, and the sealing with high fluidity is performed. Even when a resin is used, the resin can be sealed in a certain shape, and the upper portion of the sealing resin dropped by the pressing plate is deformed by pressing so as to be flat. It can be resin-sealed. further,
Since the release agent is applied to the metal mask, the metal mask from the cured sealing resin can be easily removed.

According to the twelfth aspect, the cover is joined to the upper portion of the metal mask having openings at positions corresponding to the regions of the semiconductor chip and the bonding wires, and the sealing resin is removed from the openings of the cover. Filling eliminates the need for the step of forming a dam for preventing leakage of the sealing resin with the resin on the circuit board, and at the same time, the sealing resin is required by making the metal mask higher than the required height of the sealing resin. Outflow from the area can be reliably prevented. Further, since all the semiconductor chips and bonding wires on the circuit board can be sealed with a resin using a single metal mask, it is easy to mount the metal mask on the circuit board and remove it from the cured sealing resin. In addition, since the sealing resin has high fluidity when heated, by dropping the sealing resin while heating the metal mask, the natural diffusion of the dropped sealing resin is promoted, and the sealing with high fluidity is performed. Even when a resin is used, the resin can be sealed in a certain shape, and the presence of the cover allows the resin to be sealed in a certain height and shape without pressing the upper surface of the sealing resin. Can be. Further, since the release agent is applied to the metal mask, the metal mask can be easily removed from the cured sealing resin.

[Brief description of the drawings]

FIG. 1 is a sectional view showing Embodiment 1 of a resin sealing method for a resin-sealed hybrid integrated circuit according to the present invention.

FIG. 2 is a perspective view showing Embodiment 1 of a resin sealing method for a resin-sealed hybrid integrated circuit according to the present invention.

FIG. 3 is a sectional view showing Embodiment 2 of a resin sealing method for a resin-sealed hybrid integrated circuit according to the present invention.

FIG. 4 is a perspective view showing Embodiment 2 of a resin sealing method for a resin-sealed hybrid integrated circuit according to the present invention.

FIG. 5 is a sectional view showing Embodiment 3 of a resin sealing method for a resin-sealed hybrid integrated circuit according to the present invention.

FIG. 6 is a perspective view showing Embodiment 3 of a resin sealing method for a resin-sealed hybrid integrated circuit according to the present invention.

FIG. 7 is a sectional view showing Embodiment 4 of the resin sealing method for a resin-sealed hybrid integrated circuit according to the present invention.

FIG. 8 is a perspective view showing Embodiment 4 of a resin sealing method for a resin-sealed hybrid integrated circuit according to the present invention.

FIG. 9 is a sectional view showing Embodiment 5 of a resin sealing method for a resin-sealed hybrid integrated circuit according to the present invention.

FIG. 10 is a perspective view showing Embodiment 5 of a resin sealing method for a resin-sealed hybrid integrated circuit according to the present invention.

FIG. 11 is a sectional view showing Embodiment 6 of a resin sealing method for a resin-sealed hybrid integrated circuit according to the present invention.

FIG. 12 is a perspective view showing Embodiment 6 of a resin sealing method for a resin-sealed hybrid integrated circuit according to the present invention.

FIG. 13 is a sectional view showing this conventional resin-encapsulated hybrid integrated circuit.

FIG. 14 is a perspective view showing this conventional resin-encapsulated hybrid integrated circuit.

[Explanation of symbols]

Reference Signs List 1 resin-encapsulated hybrid integrated circuit, 2 circuit board, 3 semiconductor chip, 4 bonding wire, 5 sealing resin, 6
Dam, 7 leads, 8 resin frame, 9 metal frame, 10
Release agent, 11 resin mask, 12 metal mask, 13
Pressure plate, 14 covers.

Claims (12)

[Claims] At least one semiconductor chip is mounted on a circuit board, and the semiconductor chip and the circuit board are connected to each other by using a wire bonding method to form a bonding wire. In a resin-sealed hybrid integrated circuit to be sealed, a plurality of resin frames formed of a highly releasable resin material and surrounding the regions of the respective semiconductor chips and bonding wires on the circuit board are formed on the circuit board. A first semiconductor chip to be attached to each of the semiconductor chips and the bonding wires above;
A second step of dripping a thermosetting liquid sealing resin into each of the insides surrounded by the resin frame and allowing the liquid to diffuse naturally, and covering the semiconductor chip and the bonding wires; A resin sealing method for a resin-encapsulated hybrid integrated circuit, comprising: a third step of heating and curing a sealing resin together with the circuit board; and a fourth step of removing the resin frame from the cured sealing resin. . 2. A method for mounting a plurality of semiconductor chips on a circuit board, connecting the semiconductor chips to the circuit board using a wire bonding method to form bonding wires, and connecting the semiconductor chip and the bonding wires to a resin. In a resin-sealed hybrid integrated circuit to be sealed, a plurality of resin frames formed of a highly releasable resin material and surrounding the regions of the respective semiconductor chips and bonding wires on the circuit board are formed on the circuit board. A first semiconductor chip to be attached to each of the semiconductor chips and the bonding wires above;
A second step of dripping a thermosetting liquid sealing resin into each of the insides surrounded by the resin frame and allowing the liquid to diffuse naturally, and covering the semiconductor chip and the bonding wires; A third step of pressing a pressure plate made of a resin material having high releasability from above the sealing resin to flatten and deform the upper surface of the sealing resin, and curing the sealing resin together with the circuit board by heating; 2. The resin sealing method for a resin-encapsulated hybrid integrated circuit according to claim 1, further comprising: a fourth step of removing the resin frame and the pressure plate from the cured sealing resin. 3. A plurality of semiconductor chips are mounted on a circuit board, and the semiconductor chips and the circuit board are connected to each other by using a wire bonding method to form bonding wires. In a resin-sealed hybrid integrated circuit to be sealed, a plurality of resin frames formed of a highly releasable resin material and surrounding the regions of the respective semiconductor chips and bonding wires on the circuit board are formed on the circuit board. A first semiconductor chip to be attached to each of the semiconductor chips and the bonding wires above;
And a second step of joining a cover of a highly releasable resin material having an opening at an injection portion of the sealing resin to an upper portion of the resin frame, respectively. A third step of filling a curable liquid sealing resin and covering the semiconductor chip and the bonding wires;
The resin encapsulation according to claim 1, comprising: a fourth step of heating and curing the sealing resin together with the circuit board; and a fifth step of removing the resin frame and the cover from the cured sealing resin. Resin sealing method for mold hybrid integrated circuit. 4. A plurality of semiconductor chips are mounted on a circuit board, and the semiconductor chip and the circuit board are connected by using a wire bonding method to form a bonding wire, and the semiconductor chip and the bonding wire are connected to each other. In a resin-encapsulated hybrid integrated circuit for resin-encapsulation, a plurality of metal frames formed of a metal material, surrounding the area of each semiconductor chip and bonding wire on the circuit board, are coated with a release agent. A first step of attaching to the semiconductor chip and bonding wire regions on the circuit board, respectively, and heating the metal frame;
A second step of dropping and naturally diffusing a thermosetting liquid sealing resin inside each of the metal frames, and covering the semiconductor chip and the bonding wires; A resin sealing method for a resin-encapsulated hybrid integrated circuit, comprising: a third step of heating and curing together with the circuit board; and a fourth step of removing the metal frame from the cured sealing resin. 5. A method for mounting a plurality of semiconductor chips on a circuit board, connecting the semiconductor chips to the circuit board using a wire bonding method to form bonding wires, and connecting the semiconductor chip and the bonding wires to a resin. In a resin-sealed hybrid integrated circuit to be sealed, a plurality of metal frames formed of a metal material are applied to a region of each semiconductor chip and bonding wire on the circuit board after applying a release agent. A first step of heating the metal frame and dropping a thermosetting liquid sealing resin inside each of the metal frames to allow the semiconductor chip and the bonding wires to diffuse naturally; And pressing a metal pressure plate coated with a release agent from above the sealing resin to flatly deform the top surface of the sealing resin. A third step of heating and curing the sealing resin together with the circuit board, and a fifth step of removing the metal frame and the pressure plate from the cured sealing resin. A resin sealing method for a resin-sealed hybrid integrated circuit according to claim 4. 6. A plurality of semiconductor chips are mounted on a circuit board, and the semiconductor chips and the circuit board are connected by using a wire bonding method to form a bonding wire, and the semiconductor chip and the bonding wire are connected to a resin. In a resin-sealed hybrid integrated circuit to be sealed, a plurality of metal frames formed of a metal material are applied to a region of each semiconductor chip and bonding wire on the circuit board after applying a release agent. A first step, a second step of bonding a cover made of a metal material having an opening at an injection portion of a sealing resin to an upper portion of the metal frame after applying a release agent, and A third step of heating and filling a thermosetting liquid sealing resin from each opening of the cover to cover the semiconductor chip and the bonding wires. A fourth step of heating and curing the sealing resin together with the circuit board, and a fifth step of removing the metal frame and the cover from the cured sealing resin.
5. The resin sealing method for a resin-sealed hybrid integrated circuit according to claim 4, comprising the steps of: 7. A plurality of semiconductor chips are mounted on a circuit board, and the semiconductor chips and the circuit board are connected by using a wire bonding method to form bonding wires. In a resin-encapsulated hybrid integrated circuit to be sealed, a resin mask formed of a highly releasable resin material having openings at positions corresponding to all semiconductor chip and bonding wire regions on the circuit board. A first step of attaching the semiconductor chip and the bonding wires to a first step of attaching the semiconductor chip and the bonding wires to the respective openings of the resin mask by dripping a thermosetting liquid sealing resin. A second step of heating the sealing resin together with the circuit board to cure the sealing resin; And a fourth step of removing the resin mask. 8. A plurality of semiconductor chips are mounted on a circuit board, and the semiconductor chips and the circuit board are connected by using a wire bonding method to form bonding wires. In a resin-encapsulated hybrid integrated circuit to be sealed, a resin mask formed of a highly releasable resin material having openings at positions corresponding to all semiconductor chip and bonding wire regions on the circuit board. A first step of attaching the semiconductor chip and the bonding wires to a first step of attaching the semiconductor chip and the bonding wires to the respective openings of the resin mask by dripping a thermosetting liquid sealing resin. And pressing a sealing plate of a highly releasable resin material from above the sealing resin to flatten and deform the upper surface of the sealing resin. A third step of heating, and a fourth step of heating and curing the sealing resin together with the circuit board;
8. The resin sealing method for a resin-encapsulated hybrid integrated circuit according to claim 7, further comprising a fifth step of removing the resin mask and the pressure plate from the cured sealing resin. 9. A plurality of semiconductor chips are mounted on a circuit board, and the semiconductor chips and the circuit board are connected to each other by using a wire bonding method to form bonding wires. In a resin-encapsulated hybrid integrated circuit to be sealed, a resin mask formed of a highly releasable resin material having openings at positions corresponding to all semiconductor chip and bonding wire regions on the circuit board. A first step of attaching the cover onto the circuit board; and a second step of joining a cover of a highly releasable resin material having an opening at an injection portion of the sealing resin to an upper surface of the resin mask; A third step of filling a thermosetting liquid sealing resin from each opening of the cover and covering the semiconductor chip and the bonding wires; The resin sealing mold according to claim 7, comprising: a fourth step of heating and curing together with the sealing resin and the circuit board; and a fifth step of removing the resin mask and the cover from the cured sealing resin. Resin sealing method for hybrid integrated circuit. 10. A plurality of semiconductor chips are mounted on a circuit board, and the semiconductor chips and the circuit board are connected to each other by using a wire bonding method to form bonding wires. In a resin-sealed hybrid integrated circuit to be sealed, a metal mask formed of a metal material and having openings at positions corresponding to all the semiconductor chips and bonding wire regions on the circuit board is used as a release agent. After applying
A first step of mounting on the circuit board, heating the metal mask, and dropping a thermosetting liquid sealing resin into each opening of the metal mask to allow the semiconductor chip to diffuse naturally; A second step of coating the bonding wire, a third step of heating and curing the sealing resin together with the circuit board, and a fourth step of removing the metal mask from the cured sealing resin. A resin sealing method for a resin-sealed hybrid integrated circuit having: 11. A plurality of semiconductor chips are mounted on a circuit board, and the semiconductor chips and the circuit board are connected by using a wire bonding method to form bonding wires. In a resin-sealed hybrid integrated circuit to be sealed, a metal mask formed of a metal material and having openings at positions corresponding to all the semiconductor chips and bonding wire regions on the circuit board is used as a release agent. After applying
A first step of mounting on the circuit board, heating the metal mask, and dropping a thermosetting liquid sealing resin into each opening of the metal mask to allow the semiconductor chip to diffuse naturally; And a second step of covering the bonding wire, and a third step of pressing a pressure plate of a metal material coated with a release agent from above the sealing resin to flatten and deform the upper surface of the sealing resin. The method according to claim 10, further comprising: a fourth step of heating and curing the sealing resin together with the circuit board, and a fifth step of removing the metal mask and the pressure plate from the cured sealing resin. A resin sealing method for a resin-sealed hybrid integrated circuit. 12. A plurality of semiconductor chips are mounted on a circuit board, and the semiconductor chips and the circuit board are connected by using a wire bonding method to form bonding wires. In a resin-sealed hybrid integrated circuit to be sealed, a metal mask formed of a metal material and having openings at positions corresponding to all the semiconductor chips and bonding wire regions on the circuit board is used as a release agent. After applying
A first step of mounting on the circuit board, a second step of applying a release agent to a cover of a metal material having an opening at an injection portion of the sealing resin, and then bonding the cover to the upper surface of the metal mask; A third step of filling a thermosetting liquid sealing resin from each opening of the cover and covering the semiconductor chip and the bonding wires, and curing the sealing resin together with the circuit board by heating; A fourth step of causing
The resin sealing method for a resin-encapsulated hybrid integrated circuit according to claim 10, further comprising a fifth step of removing the metal mask and the cover from the cured sealing resin.