JP2011146491A - Sealing device for electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To achieve sealing of high bonding quality by efficiently heating a container, with respect to a sealing device which bonds a lid to the container containing an electronic component. <P>SOLUTION: The sealing device includes a pallet 15 where pluralities of containers 17 and lids 18 are mounted, a heating means 20, press protrusions 22 provided below the heating means 20 to move up and down, and a transfer means 19 for positioning the pallet 15 at gaps between the heating means 20 and press protrusions 22. The press protrusions 22 are provided right below the pluralities of containers 17 and lids 18 corresponding thereto, and the pallet 15 is provided with through-holes 16A that the press protrusions 22 penetrate. The press protrusions 22 move up to press the containers 17 upward with the lids 18 interposed, to make the containers 17 abut on the heating means 20. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

The present invention relates to an electronic component sealing device that hermetically seals a container by bonding a lid, which is a lid, to an opening of a container containing an electronic component such as a crystal resonator and a surface acoustic wave filter. More specifically, the invention relates to a device for sealing a plurality of workpieces at a time by arranging a plurality of containers and lids (hereinafter also referred to as workpieces together) on a pallet and heating them. It is.

2. Description of the Related Art Conventionally, a method of hermetically sealing electronic components such as a crystal resonator and a surface acoustic wave filter in a container has been widely used. FIG. 7 is a cross-sectional view of a conventional container (seal ring-less package). First, a container 52 in which a metal layer is formed by metallizing the peripheral edge 51A of the ceramic substrate 51 is prepared. An electronic component 53 such as a vibrator is accommodated. Further, an electrode that is electrically connected to the outer lead 55 by the wire 54 from the electrode of the electronic component 53 is prepared. A lid 56 made of Kovar or the like is positioned and placed in the opening of the container 52 and is sealed by being joined via a brazing material 57.

  There are various methods for joining the lid, such as micro-parallel seam joining by rolling the roller electrode to the periphery of the lid, and a method of irradiating the periphery of the lid with an electron beam or a laser beam. A brazing material is interposed between the peripheral edges of the container opening, and the brazing material is melted and joined. Further, there are the following bonding methods using an Au—Sn alloy brazing material that melts at a relatively low temperature unlike a brazing material such as Ag. FIG. 8 is a schematic view of a sealing device used in the method, FIG. 8 (a) is a front view showing the whole, and FIG. 8 (b) is a perspective view showing a state in which a container and a lid are mounted. .

  In FIG. 8, reference numeral 61 is a sealing device, 62 is a vacuum chamber capable of discharging internal air, 63 is a pallet on which many containers and lids are mounted, and 64 is a container. FIG. 9 is a detailed view showing a state in which the container and the lid are mounted on the pallet. FIG. 9 is a cross-sectional view depicting one set of a container and a lid, and illustration of electronic components inside the container 64 is omitted. Reference numeral 66 denotes a brazing material made of an Au—Sn alloy formed in the vicinity of the periphery of the lid 65. Here, a recess 63A is formed in the pallet 63, and a lid 65 is dropped into the bottom surface of the recess 63A with the brazing material 66 facing upward. Further, the container 64 is dropped from above the lid 65 with the opening facing downward.

  In this way, a large number of containers 64 and lids 65 are accommodated in the pallet 63 and accommodated in the vacuum chamber 62 shown in FIG. Thereafter, the air in the vacuum chamber 62 is discharged, and the pallet 63 including the container 64 and the lid 65 is heated, so that the environment inside the container 64, that is, the internal electronic components is sealed in a vacuum state. And the said heating is performed by the method currently described in patent document 1 conventionally.

  In Patent Document 1, as shown in FIG. 10, the heating means 67 is in contact with the pallet 63 so as to sandwich the pallet 63 from above and below to perform heating. The heating means 67 that contacts from above is provided with a pressing protrusion 68 that presses a part of the container 64. By pressing the container 64 against the lid 65 by the pressing protrusion 68, the sealing quality is not impaired. Stable bonding is possible. The pressing protrusion 68 is disposed in a hole provided in a part of the bottom surface of the heating unit 67 so as to slightly protrude from the bottom surface of the heating unit 67 via a spring member 69. The pressing projection 68 is in contact with the container 64 and presses the container 64 by the urging force of the spring member 69.

JP 2009-55193 A (page 6, FIG. 4)

  However, when heating is performed in the configuration of FIG. 10, the pallet 63 is heated by heat conduction from the lower heating means 67 and the lid 65 is further heated by heat conduction, so that the temperature of the lid 65 is efficiently increased. Although it rises, there is a gap for dropping between the inner wall of the recess 63 </ b> A and the outer periphery of the container 64, and heat from the heating means 67 is less likely to be transmitted to the container 64 compared to the lid 65. Therefore, the brazing material 66 is melted before the container 64 is sufficiently heated, and insufficient brazing of the brazing material 66 toward the container 64 occurs. Further, when the temperature of the heating means 67 is increased for the purpose of sufficiently heating the container 64, the brazing material 66 spreads from the side surface of the lid 65 to the surface, and in any case, the incidence of defective products increases. Yield decreases.

  Therefore, the present invention provides an electronic component sealing device that melts the brazing material 66 in a state in which the container 64 is sufficiently heated, and joins the container 64 and the lid 65 in a good state.

According to a first aspect of the present invention, there is provided an electronic component sealing device in which a lid is disposed in an opening of a container that accommodates an electronic component, and the periphery of the lid is hermetically sealed by joining the opening to the opening. A pallet for positioning and mounting the container and the lid, a heating means, a pressing protrusion provided below the heating means so as to be movable up and down, and the pallet is positioned in a gap between the heating means and the pressing protrusion. The pressing protrusion is provided directly below the plurality of containers and the lid, and the pallet is provided with a through-hole through which the pressing protrusion passes, and the pressing protrusion rises. An electronic component sealing device is provided, wherein the container is pressed upward through the lid, and the container is brought into contact with the heating means.

As a second aspect, the present invention has a second heating means in addition to the heating means, and the second heating means is provided with the pressing protrusion, and the second heating means is raised together with the pressing protrusion. Then, the electronic component sealing apparatus according to the first aspect is provided, which is in contact with the lower surface of the pallet.

According to a third aspect of the present invention, there is provided the electronic component sealing according to any one of the first and second aspects, further comprising a vacuum chamber that houses at least the heating unit and the pressing protrusion in one chamber. A stop device is provided.

  According to the first aspect of the present invention, the pressing protrusion causes the container to contact the heating means via the lid, so that the container is heated by the heat conduction from the heating means, and the brazing material to the periphery of the opening of the container Improves wettability. Further, since the heating to the lid becomes gentle, the brazing material does not crawl on the surface of the lid and the appearance quality is not deteriorated.

  According to the second aspect of the present invention, since the pallet can be heated from both the upper and lower sides, heat is not released from the lower surface of the pallet, and the heating process is completed in a shorter time. Can be increased.

  According to the third aspect of the present invention, since the electronic component (for example, a crystal resonator) in the container is sealed in a vacuum environment, the characteristics of the internal electronic component are stable even in the use state, and the component is highly reliable. Can be supplied.

The front view of the sealing device which shows embodiment of this invention A perspective view of a pallet and a work showing an embodiment of the present invention Sectional drawing of the pallet and workpiece | work which show embodiment of this invention Sectional drawing of this heating area which shows embodiment of this invention Sectional drawing of this heating area which shows operation | movement of embodiment of this invention Sectional drawing of this heating area which shows operation | movement of other embodiment of this invention. Cross section of workpiece showing conventional technology Front view of sealing device showing conventional technology and perspective view of pallet Cross section of pallet and workpiece showing conventional technology Sectional view of a heating section showing conventional technology

  Next, an embodiment of an electronic component sealing device according to the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a schematic front view of a sealing device according to the present invention. In FIG. 1, reference numeral 1 is a sealing device, 2 is a load chamber, 3 is a preheating area, 4 is a main heating area, 5 is a cooling chamber, 6 is an unload chamber, 7 is a vacuum generator, and 8 is a vacuum. A first control unit for controlling the generation operation and heating, 9 is a second control unit for controlling the entire operation, 10 is a power supply unit, and 11, 12 and 13 are gate valves. In this sealing device, the preheating area 3, the main heating area 4 and the cooling chamber 5 constitute a vacuum chamber.

  Next, the overall operation of the sealing device 1 shown in FIG. 1 will be described. First, a work is prepared in advance before using this sealing device. Here, the work means a container in which electronic parts are stored and a lid to close the opening of the container. The workpiece is mounted on a pallet having a plurality of recesses formed in a matrix on the surface (not shown). The pallet ready for sealing is set in the load chamber 2 shown in FIG. At this time, the gate valve 11 is in a closed state, and the vacuum in the vacuum chamber is maintained even when the front door of the load chamber 2 is opened.

  Next, the vacuum generator 7 exhausts the air in the load chamber 2, and the gate valve 11 is opened. A pallet (not shown) is transported to the preheating area 3 by transport means, stopped for a predetermined time, preheated, and then transported in the direction of arrow a. Next, the pallet is transported to the main heating area 4, where it is heated for a predetermined time. At this time, the container and the lid are joined via the brazing material, and sealing in a vacuum environment is performed. Details of this main heating will be described later.

The workpieces that have been joined for sealing in the main heating area 4 are transported in the direction of the arrow a together with the pallet on which these workpieces are mounted, and are transported to the cooling chamber 5 through the gate valve 12. Here, reference numeral 14 denotes a cooling means using cooling running water, the pallet is stopped for a predetermined time, is cooled to approximately room temperature together with the workpiece, and is conveyed in the direction of arrow c. Thereafter, after the gate valve 12 is closed, the gate valve 13 is opened, and the pallet is transferred into the unload chamber 6, and the workpiece that has been sealed is taken out from the sealing device 1 together with the pallet.

  Next, the heating operation in the main heating area 4 and the configuration of the heating means will be described in detail. FIG. 2 is a perspective view showing a state in which the lid 18 and the container 17 are mounted on the pallet 15. A plurality of recesses 16 are formed in the pallet 15, and a lid 18 made of Kovar and a container 17 made of ceramics are mounted so as to be dropped into the recess 16. First, the lid 18 is dropped into the recess 16 with the surface on which the brazing material is provided on the upper side, and then the container 17 is dropped on the opening part on the lower side. Therefore, since the lid 18 is hidden under the container 17 here, the illustration of the lid 18 is omitted. The recess 16 is formed such that the opening is large and the bottom is smaller than the opening, that is, the four inner walls are inclined surfaces.

  As shown in the sectional view of FIG. 3, the outer shape of the main surface of the lid 18 is slightly smaller than the outer shape of the corresponding container, so that the end of the lid 18 protrudes from the outer shape of the container 17. The inner wall is inclined for positioning. When the inner wall is vertical as shown in FIG. 9 shown in the description of the prior art, the lid with a small outer shape is biased with respect to the container, and in an extreme case, the end of the lid protrudes from the outer shape of the container. In contrast, there is a possibility that the inner wall has an inclined surface in order to perform positioning without deviation.

  FIG. 4 shows a state in which the pallet 15 on which a plurality of workpieces described above are mounted and the configuration of the heating means and the like in the main heating area 4 are viewed from the transport direction. In FIG. 4, reference numeral 19 denotes a conveying means, and a chain-like support portion supports both ends of the pallet 15, and is configured to move the pallet 15 in the front-rear direction as viewed in the figure. Reference numeral 20 denotes a heating means having a resistance heating element therein, and is fixed so as to be positioned above the pallet 15. Reference numeral 21 denotes a pin plate, which is supported by a drive means (not shown) so as to be movable up and down.

  The pin plate 21 is provided with a pressing protrusion 22 that protrudes from the upper surface. The pressing protrusion 22 biases the pressing pin supported so as to be slidable in the vertical direction with respect to the pin plate 21 and the lower end of the pressing pin. And a compression coil spring 23. The pressing protrusions 22 are provided corresponding to the positions of all the recesses 16 formed in the pallet 15, and the bottoms of the respective recesses 16 are positioned so as to be penetrated when the pressing protrusions 22 are raised. A through hole 16A is provided.

  Next, the operation of the configuration shown in FIG. 4 will be described with reference to FIG. FIG. 5A shows a state where the pallet 15 is conveyed to the heating position of the main heating area 4. Here, the container 17 and the lid 18 are positioned and mounted on the pallet 15 so as to drop into the recess 16. In addition, the pallet 15 is supported by the transport unit 19 and is positioned in a gap between the heating unit 20 and the pressing protrusion 22 and is stationary. In this state, the center of the through-hole 16A and the center of the pressing protrusion 22 coincide with each other in plan view. In this state, when driving means (not shown) is driven and the pin plate 21 is raised in the direction of the arrow O, the state changes to the state shown in FIG.

  FIG. 5B shows a state where the pin plate 21 is raised and its upper surface is in contact with the lower surface of the pallet 15. Here, the pressing protrusion 22 rises together with the pin plate 21, passes through the through hole 16 </ b> A provided in the bottom surface of the recess 16, and pushes the lid 18 upward. As a result, the container 17 placed on the lid 18 rises together with the lid 18, and the height 17 A of the bottom surface of the container 17 (the upper surface in this posture) is higher than the height 15 A of the upper surface of the pallet 15. It becomes. Thereafter, the pin plate 21 further rises and changes to the state shown in FIG.

  FIG. 5C shows a state in which the pin plate 21 is lifted and comes into contact with the pallet 15 and the pallet 15 is lifted from the conveying means 19 and further lifted. At this time, the bottom surface of the container 17 contacts the heating unit 20 before the upper surface of the pallet 15 contacts the lower surface of the heating unit 20. When the upper surface of the pallet 15 comes into contact with the heating means 20, the compression coil spring 23 is compressed, and the bottom surface of the container 17 is urged by the heating means 20 with a predetermined pressing force. That is, the pressing protrusion 22 presses the container 17 upward via the lid 18 and urges the heating means 20 with a predetermined pressing force, so that the container 17 is efficiently heated by heat conduction from the heating means 20. In addition, a predetermined pressing force can be applied to the joint surface between the lid 18 and the container 17.

  Next, a case where the pressing protrusion 22 is provided in the second heating means will be described with reference to FIG. In the case of the present embodiment, the pressing protrusion 22 is provided on the second heating means 24 as shown in FIG. The other constituent elements are the same as those described with reference to FIG. Here, like the pin plate 21 shown in FIG. 5, the second heating means 24 is provided so as to be movable up and down by a driving means (not shown). Then, as shown in FIG. 6A, when the pallet 15 is positioned at the heating position by driving the conveying means 19, the second heating means 24 rises in the direction of arrow E.

  The subsequent heating operation is the same as that described with reference to FIG. 5, and the pressing protrusion 22 penetrates the through hole 16 </ b> A and pushes up the container 17 through the lid 18, so that the bottom surface of the container 17 contacts the heating means 20. In contact, the container 17 is heated by direct heat conduction. In addition, as shown in FIG. 6C, in the present embodiment, the heating unit 20 and the second heating unit 24 heat the pallet 15 from above and below. As a result, the heating efficiency is increased and the time required for joining, that is, sealing between the container 17 and the lid 18 can be shortened.

DESCRIPTION OF SYMBOLS 1 Sealing device 2 Load chamber 3 Preheating area 4 Main heating area 5 Cooling room 6 Unload chamber 7 Vacuum generator 8 First control part 9 Second control part 10 Power supply part 11, 12, 13 Gate valve 14 Cooling Means 15 Palette 16 Recess 17 Container 18 Lid 19 Conveying means 20 Heating means 21 Pin plate 22 Pressing protrusion 23 Compression coil spring 24 Second heating means

Claims (3)

In an electronic component sealing device that arranges a lid in an opening of a container that accommodates an electronic component, and joins the periphery of the lid to the opening to hermetically seal the lid,
A pallet for positioning and mounting a plurality of containers and lids;
Heating means, and a pressing protrusion provided below the heating means so as to be movable up and down,
Conveying means for positioning the pallet in a gap between the heating means and the pressing protrusion,
The pressing protrusion is provided immediately below the plurality of containers and the lid,
The pallet is provided with a through hole through which the pressing protrusion penetrates,
The pressing protrusion rises and presses the container upward through the lid,
An electronic component sealing device, wherein the container is brought into contact with the heating means. A second heating means in addition to the heating means;
The pressing protrusion is provided on the second heating means,
2. The electronic component sealing device according to claim 1, wherein the second heating unit rises together with the pressing protrusion and contacts the lower surface of the pallet. 3. The electronic component sealing device according to claim 1, further comprising a vacuum chamber that houses at least the heating unit and the pressing protrusion in one chamber. 4.

Images