JP3466580B2 - Automatic sealing device for electronic components - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an automatic sealing device for electronic parts in which a package containing a semiconductor element, a crystal oscillator, a piezoelectric element and the like is hermetically sealed by a lid.

[0002]

2. Description of the Related Art Conventionally, a semiconductor element, a crystal oscillator, a piezoelectric element, etc. (hereinafter collectively referred to as an electronic component element) is housed in a container (hereinafter referred to as a package), and an opening of the package is covered with a lid. As a method for sealing a package in an electronic component that is hermetically sealed with a lid (hereinafter, referred to as a lid), a micro parallel seam bonding method described in Japanese Patent Publication No. 1-38373 is widely used. In this micro parallel seam joining method, a package is usually formed of ceramics, a frame-shaped metal seal frame is fixed to the opening by brazing, and a metal lid is seam-welded to the seal frame. Is hermetically sealed to produce an electronic component. In seam welding, a pair of roller electrodes are brought into contact with two sides of the lid, which face each other, for example, the side edges on the short side, under constant pressurization conditions to roll and simultaneously energize the roller electrodes. When the roller electrodes are energized, the Joule heat generated at this time melts the side edges of the two short sides, and seams the lid to the seal frame. When the seam joining on the short side is completed, both side edges on the long side are seam-welded in the same manner to complete the electronic component.

When this kind of electronic component is used in a small and lightweight communication device such as a mobile phone, further downsizing and cost reduction are required. In particular, recently, the demand for miniaturization is strict, and for example, the vertical and horizontal height dimensions are 2.5 mm × 2 mm × 2 mm.
Less than is required. However, for such a small electronic component, there is a problem that it is technically difficult to apply the roller electrode to a desired position of the lid and perform seam welding in a stable state.

Therefore, recently, Japanese Unexamined Patent Publication No. 11-21455.
The "sealing device and sealing method for a package of an electronic component" disclosed in Japanese Patent No. 1 has been proposed. This encapsulation method applies solder to the lid in advance, mounts the lid on the heater chip with the solder-coated surface facing upward, and mounts the package with the opening downward on the lid. Pressurize and heat the heater chip by the pulse heating method, that is, apply a large pulsed current, and use the Joule heat generated at this time to heat and melt the solder applied to the lid, and the lid is instantly packaged. It is a method of soldering and sealing hermetically.

In such a sealing method, since no roller electrode is required, even a small electronic component can be surely sealed as compared with seam welding, and the package is placed on the lid. combined is placed, since the soldered by heating the lid from below, a possibility is less adhered to the electronic component element to scatter the molten solder particles in the package by heating, electrical characteristics of the electronic component element Has the advantage that it can be maintained stable.

[0006]

However, the above-mentioned sealing device disclosed in Japanese Unexamined Patent Publication No. 11-214551 does not automatically seal a plurality of electronic components continuously, so that productivity is improved. There was a problem of low. Therefore, development of an automatic sealing device with high productivity is required. In addition, since a cap-shaped jig is used as a positioning jig for positioning the electronic component on the heater chip, and the jig is fitted into the electronic component for positioning, the electronic component is improved in order to improve the positioning accuracy. If the outer dimensions of the jig and the inner shape of the jig are made to substantially match, the jig cannot be fitted to the electronic component if the relative displacement between the lid and the package is large, while If the geometrical dimension is increased so that the jig can be easily fitted, it becomes impossible to perform positioning with high accuracy because a gap is created between the jig and the electronic component. Therefore, in either case, positioning cannot be performed quickly and with high accuracy, and there is a problem that it takes time for the operator to perform positioning work.

The present invention has been made in order to meet the above-mentioned problems and demands of the related art. The object of the present invention is to continuously and automatically seal electronic parts,
It is an object of the present invention to provide an automatic sealing device that enhances productivity and saves labor.

[0008]

In order to achieve the above object, a first invention is a package containing an electronic component element, and the package is hermetically sealed by being soldered to an opening of the package. A device for automatically sealing an electronic component, which comprises a lid, and a lid supply unit that supplies a plurality of lids having solder applied to a bonding surface to the package to a lid suction position, and the electronic component element. A package supply unit that supplies a plurality of packages to a package suction position, a heater tool that integrally has a plurality of heating protrusions on the upper surface, is installed on a heat stage, and is heated by pulsed energization; and the lid suction position. When a plurality of lids conveyed to the above are sucked and held by the suction means, the lids are conveyed to above the heater tool so that the lids are heated above the heating projections. And a lid transporting device for each placed in the above said joining surface, when holding the plurality of packages conveyed to the package suction position, the respective heating projections conveys the package above the heater tool comprising a package carrier for supporting respectively the opening over the lid placed on the top facing down, and a positioning mechanism for positioning the said lid and the package placed on top of each heating projections , The package carrier
The holder holds the package by suction and holds the package.
Transport it above the tool and place it on the heating projection.
Up and down movable suction hand to be placed on the lid
It has a step and pressurizes the package by this suction means.
Solder the package and the lid together.
Cormorant is intended.

In the first invention, the lid is carried by the lid carrying device and placed on the heating projection of the heater tool. The package is transported by the package transport device and placed on the lid mounted on the heating projection of the heater tool. The lid and the package placed on the protrusion are positioned by the positioning mechanism. The heater tool is momentarily heated by applying a pulsed electric current to heat the lid from below. This melts the solder and solders the lid and package,
The package is hermetically sealed. Therefore, the package sealing operation can be continuously and automatically performed. The time required to solder the package and lid and seal the package, that is, the time until the solder is solidified by lowering the temperature of the heater tool after heating the heater tool to a predetermined temperature and melting the solder by heating, A few seconds (3 ~
Since it is about 6 seconds, there is little thermal influence on the electronic component elements in the package. When the package is hermetically sealed,
Since the package is placed on the lid with the opening facing down, the particles of the solder melted by heating are less likely to be scattered and attached to the electronic component element in the package.
The positioning mechanism positions by removing the relative displacement between the package and the lid, rotation, and the like. Package is
Under constant pressure conditions by the suction means of the cage transfer device
Soldered so the lid and package float
And will not be displaced.

[0010]

[0011]

A second invention is the same as the first invention,
Heating projection of the heater tool, the package, before
Serial is formed smaller than the lid, the positioning mechanism, before
Serial are respectively disposed corresponding to the respective heating projections on both sides of the heater tool, by approaching in synchronization with each other from one diagonal direction of the lid and the package resting on the protrusion, the said lid a plurality of positioning pieces for positioning and pressing the corners of the package, the positioning piece is adjacent to each other with said lid on one edge of the distal end portion of the diagonal line of the package <br/> over di It has a concave portion in contact with two sides orthogonal to each other.

In the second invention, the positioning pieces approach each other in the diagonal direction of one of the lid and the package and press the concave portion against the corner portion of the lid and the package. Therefore, the lid and the package are positioned with their two sides, which are adjacent to each other with the corners sandwiched therebetween, being in contact with the recesses and the relative displacement and rotation thereof being corrected. Since the outer peripheral edge portions of the package and the lid protrude to the outside of the heating protrusion, the package and the lid can be pressed from both sides for positioning when positioning.

[0014]

[0015]

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described below in detail based on the embodiments shown in the drawings. FIG. 1 is a sectional view showing an electronic component sealed by the automatic sealing device according to the present invention. The electronic component 1 includes a package 2 that houses an electronic component element 3 such as a semiconductor element, a crystal oscillator, or a piezoelectric element,
It is configured with a lid 4 that hermetically seals the opening of the package 2. The package 2 is formed in a box shape whose upper side is opened by an insulating material such as ceramics. Tungsten 5 is metallized on the opening end surface so that the lid 4 can be soldered. Further, a gold plating 6 is formed on the surface of the tungsten 5. It has been subjected. Incidentally package 2
The dimensions are 2 x 2.5 x 2 mm in length, width and height.
It is a degree.

The electronic component element 3 is disposed on the inner bottom surface of the package 2 and is electrically connected to the conductive pin 7 penetrating the bottom of the package 2.

The lid 4 is made of Kovar (Fe 54%, Ni 29%, which has a thermal expansion coefficient close to that of glass and ceramics).
It is made of a metal such as a 17% Co alloy) or SUS, and has a size that matches the shape of the opening of the package 2, that is, the same size as the opening, and a plate thickness of about 0.1 mm. Solder 8 is previously applied to the back surface (joint surface) of the lid 4, and the solder 8 is heated and melted by the automatic sealing device according to the present invention to solder the package 2 and the lid 4 to each other. The electronic component 1 obtained by hermetically sealing the package 2 is completed.

Since the lid 4 is manufactured by cutting a thin metal plate having the entire back surface coated with solder into a predetermined size, the entire back surface is coated with the solder 8. However, the present invention is not limited to this. It may be applied only to the outer peripheral edge portion of the back surface which comes into contact with the opening end surface of the second opening 2. As the solder 8, for example, a Pb—Sn solder having a melting point of 280 ° C. is used, but a solder in which a small amount of metal (silver, bismuth, etc.) is mixed with lead or tin may be used. Such hermetic sealing of the package 2 in the electronic component 1, the lid 4, in order to prevent oxidation of the solder 8 conducted in an atmosphere of inert gas, the inert gas is sealed inside the package 2 It Nitrogen is used as the inert gas.

Next, the structure and the like of the automatic sealing device according to the present invention will be described with reference to FIGS. FIG. 2 is a schematic plan view showing the inside of the automatic sealing device, FIGS. 3 (a) and 3 (b),
(C) is a plan view of a lid (package) transport tray,
FIG. 3 is a perspective view of a main portion of a lid transport tray on which a lid is mounted and a perspective view of a main portion of a package transport tray on which a package is mounted. 4A and 4B are a plan view and a sectional view showing a positioning mechanism of a lid (package),
FIG. 5 is a plan view showing the suction / reversal mechanism of the package transfer device, and FIG. 6 is a side view showing a part of the suction / reversal mechanism in a cutaway manner. FIG. 7 is a front view of the third package conveying means,
8 is a side view of the package conveying means, FIG. 9 is a plan view of the heat stage, FIG. 10 is a front view of the heat stage,
11 (a), (b), and (c) are a front view, a plan view, and a side view of the heater tool. FIG. 12 is a perspective view showing a state in which the lid is placed on the heating projection of the heater tool,
13 is a schematic perspective view of a positioning mechanism for the package and the lid, FIG. 14 is a plan view showing how the positioning piece positions the package and the lid, and FIG. 15 is an enlarged view of the arrow A in FIG.

First, the overall structure of the automatic sealing device will be briefly described. In FIG. 2, the automatic sealing device indicated by reference numeral 20 as a whole has a box-shaped chamber 21 into which nitrogen is supplied as an inert gas. The chamber 21 is covered with glass so that the inside can be visually recognized from the outside, and a lid supply unit 22, a package supply unit 23, a heat stage 24, and the like are provided inside. The lid supply unit 22
A tray transfer device 2 for transferring the lid transfer tray 26 (FIG. 3) having the lid 4 to the lid suction position B1.
Equipped with 7. The package supply unit 23 includes a package transfer tray 28 on which the package 2 is mounted (FIG. 3).
Tray transport device 2 for transporting the package to the package suction position B2
9 is equipped. The heat stage 24 is a heater tool 30 (FIGS. 11 and 12) for melting the solder 8 applied to the lid 4 by heating and soldering the lid 4 to the package 2, and a package before soldering the lid 4. Positioning mechanism 31 (FIG. 9, FIG. 10, FIG. 13 to FIG. 15) for positioning the 2 and the lid 4, and when the solder 8 is heated and melted, the heater tool 30 is cooled to a required temperature (for example, 1
The cooling mechanism 32 (FIGS. 9 and 10) for lowering the temperature to 00 ° C. is provided.

In the chamber 21, a lid transport device 34 for transporting the lid 4 from the lid suction position B1 to the heat stage 24, a package transport device 35 for transporting the package 2 from the package suction position B2 to the heat stage 24, A product box 36 with an opening / closing door for housing the completed electronic component 1 after the soldering work of the package 2 and the lid 4 is completed.

Further, the detailed structure of the automatic sealing device 20 will be described. The lid supply unit 22 is provided at the rear left corner in the chamber 21, and the tray transport device 27 that transports the lid transport tray 26 (FIG. 3) to the lid suction position B1 and the automatic sealing. The apparatus 20 includes a loader 40 and an unloader 41 that are arranged apart from each other in the front-rear direction (Y direction) of the apparatus 20. The loader 40 is disposed behind the unloader 41, and stores the lid transport trays 26 carrying the plurality of lids 4 to which the solder 8 is applied in a stack in the height direction at regular intervals. ing. The loader 40 and the unloader 41 each have 20 tray storage stages. Note that the supply of the lid transport tray 26 from the outside of the apparatus to the loader 40 and the removal of the lid transport tray 26 from the unloader 41 to the outside of the apparatus are performed by the operator.

The lid transport tray 26 is shown in FIG.
As shown in (a) and (b), it is made of a square metal plate and has a plurality of recesses 43 for accommodating the lid 4 and long grooves 44 formed on the upper surface. Ten recesses 43 are formed in a matrix at predetermined intervals in the vertical and horizontal directions, and the recesses 43 in each column are connected in series by the long groove 44. The recess 43 is a rectangular recess slightly larger than the lid 4 in order to facilitate the removal of the lid 4, and the depth thereof is set to be substantially equal to the thickness of the lid 4 or slightly shallower. The lid 4 is a joint surface with the package 2,
That is, the surface coated with the solder 8 faces upward and is housed in the recess 43.

The lid carrying tray 26, which carries the lid 4 and is accommodated in the loader 40, is intermittently taken out from below by the tray carrying device 27.
It is conveyed to the lid suction position B1. Lid suction position B1
Is provided in front of the lid supply unit 22. The tray transfer device 27 reciprocates between the lid suction position B1 and the lower part of the loader 40 and the unloader 41 by driving a drive motor (not shown). When the tray 26 is received, it moves forward and is transported to the lid suction position B1. When the lid 4 is completely removed to seal the package 2, the empty lid transport tray 26 is removed. It is configured to be conveyed below the unloader 41 from the suction position B1. Below the unloader 41, there is an empty lid transport tray 26.
An appropriate push-up mechanism (not shown) for pushing up and storing it in the unloader 41 is provided. As the device and mechanism for taking out the lid transport tray 26 from the loader 40 and transporting it, and returning it to the unloader 41, the same transporting device and mechanism used for transporting wafers in the semiconductor manufacturing apparatus should be used. Is possible.

The lid transport device 34 includes a first, second, and
It is composed of third lid transfer means 50, 51 and 52, and is provided between the lid suction position B1 and the heat stage 24.

[0027] The first lid transport means 50, when holding the lid 4 of the predetermined number by adsorption from the lid supply position B1 the lid transfer tray 26 conveyed to, and transported to the first lid transfer position D1 And a second transfer means 51, and a slider 54 movably disposed on an X guide rail 53 extending in the left-right direction (X direction), and a drive motor 55 provided on the slider 54 to move the slider up and down. The moving lifting arm 56 and the lifting arm 5
6, 10 suction means 57 arranged in parallel in the front-rear direction at a predetermined interval, a drive motor 58 for reciprocating the slider 54, and the like. When the suction means 57 descends a predetermined distance together with the lifting arm 56 at the lid suction position B1 and comes into contact with the bonding surface above the lid 4 mounted on the lid transport tray 26, the suction means 57 is evacuated by a vacuum pump. By which the lid 4 is absorbed
It is configured to hold the. Adsorption means 57
The arrangement pitch is equal to the arrangement pitch of the concave portions 43 arranged in the vertical direction of the lid transport tray 26.

The lifting arm 56 rises returning the suction means 57 holds the lid 4 by adsorption, the slider 54
2 moves to the right in FIG. 2 along the X guide rail 53 and stops above the first lid transfer position D1 and then descends again, and the lid 4 held by the suction means 57 by suction .
Is configured to be delivered to the second lid transport means 51. The suction surface of the suction means 57 is formed in a rectangular shape having a size matching the outer shape of the lid 4.

The second lid transfer means 51 transfers the lid 4 to the second lid transfer position D2 when it receives the lid 4 from the first lid transfer means D1 at the first lid transfer position D1. A slider 61 that is movably disposed on a Y guide rail 60 that extends in a vertical direction; a drive motor 62 that reciprocates the slider 61; and a slider 61 that is provided on the lower surface side of the slider 61 side by side at a predetermined interval in the front-rear direction. And the adsorption surface is exposed on the upper surface of the slider 61. 1
It is composed of zero suction means 63 and the like.

From the first lid transfer means 50 to the second lid transfer means 5 at the first lid transfer position D1
Passing the lid 4 to 1, the suction means 57 by the suction
This is performed by the suction means 63 holding the lid 4 that is being held by suction. That is, the suction means 57
When the lid 4 is lowered and is held by suction on the upper surface of the slider 61 and on each suction means 63 and the holding by suction is released, the suction means 63 is evacuated and replaced from below. the lid 4 is held by adsorption.
When the suction means 63 holds the lid 4 by suction , the slider 61 of the second lid transport means 51 moves to the second lid delivery position D2 along the Y guide rail 60 by the drive of the drive motor 62. The lid 4 is stopped and the lid 4 is delivered to the third lid transporting means 52.

The second lid transfer means 51 is
A positioning mechanism 66 for the lid 4 is provided. The positioning mechanism 66 includes a reference plate 67, a movable plate 68 provided on one side of the reference plate 67, and a positioning pin 6 as shown in FIG.
9 and an air cylinder (not shown) for moving the movable plate 68 and the positioning pin 69, respectively.
1 on the left side edge of the upper surface of the reference plate 67 facing the movable plate 68.
Zero long grooves 70 are formed. The long groove 70 is formed of a rectangular elongated groove that is long in the front-rear direction of the reference plate 67, and has a front wall 70a and a rear wall 70b that are parallel to each other in the front-rear direction, and a back wall 70c that connects these both side walls. Is set to be slightly smaller than the length of the short side of the lid 4. The rear wall 70b forms a reference surface for positioning the lid 4 in the front-rear direction, and the rear end of the inner wall 70c forms a reference surface for positioning the lid 4 in the left-right direction. Further, at the rear end portion of the long groove 70, a convex portion 71 forming the suction means 63 is integrally provided along the rear wall 70b. The convex portion 71 is
It is composed of a rectangular protrusion slightly smaller than the lid 4, and has an upper surface that is horizontal and forms a suction surface 72 that suctions and holds the lid 4. The suction surface 72 is located below the upper surface of the reference plate 67, and a suction port 73 is formed in the center thereof.
Reference numeral 3 is connected to a vacuum pump (not shown) through an exhaust passage 74 provided inside the reference plate 67.

The movable plate 68 is arranged on the left side of the reference plate 67 so as to be movable in the left-right direction (arrow A), and the right side surface 68a facing the reference plate 67 in parallel to presses the lid 4. Is formed. When the lid 4 is positioned, the movable plate 68 is moved toward the reference plate 67 by a drive device such as an air cylinder (not shown) to press the left side surface of the lid 4 and press it against the rear end of the inner wall 70c. Thus, the lid 4 is positioned in the left-right direction.

The positioning pin 69 penetrates through a long pin insertion hole 76 formed in the bottom surface of the long groove 70 in the front-rear direction and has an upper end protruding into the long groove 70. Normally, the pin is used as shown by a solid line. It is located on the front side of the insertion hole 76.
The upper surface of the pin 69 is located above the upper surface of the convex portion 71. When the lid 4 is positioned, the positioning pin 69 is moved rearward along the pin insertion hole 76 as shown by a chain double-dashed line by a drive device such as an air cylinder (not shown) to press the lid 4 and press it against the rear wall 70b. As a result, the lid 4 is positioned in the front-rear direction. Then, when the positioning of the lid 4 in the front-rear direction and the left-right direction is completed, the lid 4 is sucked from below by the suction means 63.
To hold by.

Referring again to FIG. 2, when the second lid transfer means 51 passes downward, it is sucked by the suction means 63 at an intermediate position between the first lid transfer position D1 and the second lid transfer position D2. Then, a discrimination camera 77 for discriminating whether or not the held lid 4 is turned upside down is installed. The determination camera 77 determines that the lid 4 is adsorbed and held with the joint surface facing upward by detecting (color detection) the solder 8 applied to the joint surface of the lid 4.

When the third lid transport means 52 receives the lid 4 from the second lid transport means 51 at the second lid delivery position D2, the heat stage 24
Of the slider 81 movably arranged on the X guide rail 80 and the reciprocating movement of the slider 81 along the X guide rail 80 are omitted. A drive motor and an elevating arm 82 vertically movable on the slider 81.
And a drive motor 83 for raising and lowering the raising and lowering arm 82.
The suction arm 84 and the like are arranged in parallel with each other in the front-rear direction at predetermined intervals on the elevating arm 82.

Second at the second lid transfer position D2
When the lid 4 is transferred from the lid transporting means 51 to the third first lid transporting means 52, the suction means 63 sucks it.
Adsorption means 84 of the lid 4 that is held by the adsorption I
It is carried out by holding. That is, at the second lid delivery position D2, the third lid transport means 52
The elevating arm 82 descends and the suction means 84 is sucked and held by the suction means 63 of the second lid transport means 51.
The lid 4 which is in contact therewith is contacted from above. Then, the suction / holding state of the lid 4 by the suction means 63 is released. By evacuating the suction means 84 by the vacuum pump at the same time as this, the suction means 84 is <br/> hold lid 4 by adsorption, receives the lid 4. Then, the elevating arm 82 rises again, the slider 81 moves rightward along the X guide rail 80, and stops the elevating arm 82 above the heater tool 30. The lifting arm 82 is used for the heater tool 3
When it moves above 0 and stops, it is lowered by the drive of the drive motor 83, and the lid 4 held by the suction means 84 by suction is placed on the heater tool 30 and delivered to the heater tool 30.

The package supply section 23 has the same structure as the lid supply section 22, and is arranged symmetrically with respect to the lid supply section 22 at the rear right corner of the chamber 21. For this reason, the package supply unit 23 is separated from the tray transfer device 29 in the front-rear direction by the loader 8 arranged.
5 and an unloader 86. The loader 85 is located behind the unloader 86, and stores the package transfer trays 28 on which a plurality of packages 2 are mounted in a stack in the height direction horizontally at regular intervals. The loader 85 and the unloader 86 each have 20 tray storage stages.

The package transfer tray 28 is shown in FIG.
This is the same as the lid transport tray 26 shown in (b). That is, as shown in FIG. 3C, a square metal plate is formed, and a plurality of recesses 89 for housing the package 2 and long grooves 90 are formed on the upper surface. Ten recesses 89 are formed in a matrix shape at predetermined intervals in vertical and horizontal directions, and the recesses 89 in each column are connected in series by the long groove 90. The recess 89 is the package 2
In order to facilitate the removal of the package, it is composed of a rectangular recess slightly larger than the package 2 and has a shallow depth. The package 2 is fitted into the recess 89 with the opening facing upward.

Referring again to FIG. 2, the package transfer trays 28 stored in the loader 85 are intermittently taken out from below by the tray transfer device 29 and transferred to the package suction position B2. The package suction position B2 is provided in front of the package supply section 23. The second tray transfer device 29 reciprocates between the package suction position B2 and the lower part of the loader 85 and the unloader 86 by driving a drive motor (not shown), and is the lowermost package housed in the loader 85. When the transport tray 28 is received, it moves forward and is transported to the package suction position B2. When all the packages 2 are removed at the package suction position B2 and become empty, the empty package transport tray 28 is transported from the package suction position B2 to below the unloader 86. Below the unloader 86, there is provided an elevator mechanism (not shown) that pushes up the empty package transport tray 28 and stores it in the unloader 86. The supply of the package transfer tray 28 from the outside of the apparatus to the loader 85 and the removal of the package transfer tray 28 from the unloader 86 to the outside of the apparatus are performed by an operator.

The package transfer device 35 comprises first, second and third package transfer means 93, 94, 95 and the like, and is provided between the package suction position B2 and the heat stage 24.

When the first package transfer means 93 sucks and holds a predetermined number of packages 2 from the package transfer tray 28 transferred to the package suction position B2, the first package transfer means 93 transfers the package 2 to the first package delivery position E1. It is delivered to the second package conveying means 94. The first package transfer means 93 is the first lid transfer means 50.
And have the same structure and are arranged symmetrically. Therefore, the first package conveying means 93 is moved up and down by a slider 101 movably arranged on the X guide rail 100 extending in the left-right direction, and a drive motor 104 provided movably up and down on the slider 101. Lifting arm 103, ten suction means 105 arranged in parallel with the lifting arm 103 at a predetermined interval in the front-rear direction, a drive motor 106 for reciprocating the slider 101 along the X guide rail 100, and the like. It is composed of.

The suction means 105 has a package suction position B.
2, when the drive motor 104 is driven to lower the movable arm 103 by a predetermined distance, it comes into contact with the opening end face of the package 2 mounted on the package transfer tray 28 and is evacuated by a vacuum pump to evacuate the package 2 Adsorb and hold. The lifting arm 103 is
When the suction means 105 holds the package 2 by suction , the pickup means 105 moves up and returns, and the slider 101 moves the X guide rail 100.
1 to the left in FIG. 1 and when it stops above the first package delivery position E1, it descends again and the suction means 10
The package 2 held by 5 by suction is delivered to the second package transport means 94. The suction surface of the suction means 105 is formed in a rectangular shape having a size matching the outer shape of the opening of the package 2.

The second package transfer means 94 transfers the package 2 from the first package transfer means 93 at the first package transfer position E1 to the second package transfer position E2. Two
The lid transporting means 51 has substantially the same structure as the lid transporting means 51 and is symmetrically arranged. Therefore, the second package transfer means 94
Is a slider 112 movably arranged on a Y guide rail 111 extending in the front-rear direction, and this slider 112.
Drive motor 113 that reciprocates the slider, and the slider 1
The lower surface of the slider 12 is arranged in parallel in the front-rear direction at predetermined intervals, and the suction surface is composed of ten suction means 114 and the like exposed on the upper surface of the slider 112.

The delivery of the package 2 from the first package transfer means 93 to the second package transfer means 94 at the first package transfer position E1 is performed by the suction means 105 sucking the package 2 held by the suction means 105. This is performed by sucking and holding 114. That is, at the first package transfer position E1,
Placing the package 2 package transfer means 93 adsorption means 105 of the holds by suction and lowered onto the upper surface a and the adsorption means 114 of the slider 112 of the second package transfer means 94. Then, to release the adsorbed state of the suction unit 105, by evacuating the suction means 114 by vacuum pump instead, suction means 114 is held by the adsorption of the package 2. When the delivery of the package 2 is completed, the slider 112 moves to the Y guide rail 11
Move forward along 1 and stop at the second package delivery position E2.

Further, the second package transfer means 94
Is provided with a positioning mechanism 120 for positioning the package 2 in the front-rear direction and the left-right direction when receiving the package 2 from the first package conveying means 93, and a suction / reversal mechanism 121 for vertically inverting the positioned package 2. There is. The positioning mechanism 121 that positions the package in the front-rear and left-right directions has exactly the same structure as the positioning mechanism 66 that positions the lid 4 shown in FIG. 4, and the object to be positioned is the package 2 instead of the lid 4. Since they are different, the detailed description thereof will be omitted.

In FIGS. 5 and 6, the suction / reversal mechanism 121 of the package 2 has a rotating shaft 123 provided on the left side of the slider 112 having a horizontal shaft 122, and the rotating plate 123 described above. A drive motor 124 for rotating a predetermined angle together with the shaft 122, a plurality of suction means 125 arranged side by side on the rotating plate 123 in the front-rear direction, and an encoder 126.
Etc. The suction means 125 includes the suction means 114 of the second package transfer means 94 and the shaft 122.
So as to be symmetrical with respect to each other, in other words, the rotating plate 123
Is attached to the lower surface side of the rotating plate 123 so that when it rotates 180 ° upward about the shaft 122 and overlaps with the slider 112, it faces the suction means 114, and its suction port 125a is provided. An opening is formed on the upper surface of the movable plate 123. The encoder 126 detects the rotation angle of the rotating plate 123, and based on the detection signal, the drive motor 124.
Are driven and controlled.

In such a suction / reversal mechanism 121, the rotary plate 123 is normally held horizontally with its upper surface facing upward as shown by the solid line in FIG. located in, when reversing to hold the package 2 by adsorption, moves upward of the slider 112 upside down by being 180 ° rotated upward as shown by two-dot chain line in FIG. 6, Adsorption means 12
5 is brought into contact with the opening end surface of the package 2 which is attracted and held by the attraction means 114 from above. Adsorption means 12
When 5 contacts the package, the suction means 114 releases the suction state of the package 2. On the other hand, the adsorption means 125 is held by suction to the package 2 by being evacuated, it receives a package 2. Then, when the transfer of the package 2 from the suction means 114 to the suction means 125 is completed, the rotary plate 123 is pivotally returned to the initial position, and the package 2 is turned upside down. That is, the package 2 is the rotating plate 1
23, the opening faces downward, and is held by suction from below by the suction means 125.

Here, in the present embodiment, the package 2 is loaded in the recess 89 (FIG. 3) of the package transfer tray 28 with the opening facing upward, so
The reversing mechanism 121 is required, but it is not necessary when the package 2 is loaded in the recess 89 with the opening facing down.
In addition, when the lid 4 is loaded into the recess 43 of the lid transport tray 26 with the joining surface facing down, it is necessary to invert the joining surface so that the joining surface faces upward and supply the heater tool 30. The reversing mechanism 121 may be provided in the second lid transporting means 51 so that the lid 4 is reversed.

In FIG. 2, FIG. 7 and FIG.
When the package 2 is received from the suction / reversal mechanism 121 at the second package delivery position E2, the package transport means 95 transports the package 2 above the heat stage 24 and mounts it on the heater tool 30. Place on top. Further, when the soldering of the package 2 and the lid 4 is completed and the manufacture of the electronic component 1 is completed, the electronic component 1 is conveyed from the heater tool 30 to above the product box 36 and is dropped and stored in the product box 36. It has a slider 130 movably arranged on the X guide rail 80 and a drive motor (not shown) that reciprocates the slider 130. Further, an elevating arm 131 provided on the slider 130 so as to be vertically movable, a drive motor 132 for elevating the elevating arm 131, and the elevating arm 131 arranged in parallel at a predetermined interval in the front-rear direction.
Zero (only five in FIG. 7) adsorbing means 133
And the like by means of these suction means 133.
The package 2 is received from the suction means 125 of the reversing mechanism 121. Also, the suction means 133 is
During the soldering process of the package 2 and the lid 4, it is attached to the elevating arm 131 so that the package 2 can be pressed against the lid 4 with a required pressure (described later). The reason why the package 2 is pressed and pressed against the lid 4 is to prevent relative displacement, floating, and rotation of the package 2 and the lid 4 during soldering.

Further, the structure of the third package transfer means 95 will be described in detail. The elevating arm 131 is provided with a movable body 136 which is vertically movable along a linear rail 135. A weight 137 is mounted on the upper surface of the movable body 136 via a pin 138, and the suction means 133 is mounted on the lower end of the movable body 136.
Is installed. The weight 137 is the package 2
It is used to press the suction means 133 against the package 2 with a required pressing force (about 40 to 100 g) at the time of soldering the lid 4 and the lid 4, and various thicknesses (weight) formed in a ring shape are various. The pins 13 are prepared and appropriately selected according to the size of the package 2.
8 is fitted. In addition, the movable body 136 is a stopper 139.
Since the stopper 139 is supported by the fixing plate 140, the downward movement is restricted. Therefore, in this state, the weight of the weight 137 does not act on the suction means 133.

On the surface of the elevating arm 131 opposite to the surface on which the movable body 136 is attached,
A counterweight 144 is provided. The counterweight 144 is mounted on an L-shaped mounting bracket 143 which is mounted on the lifting arm 131 via a linear rail 142 so as to be lifted and lowered. The movable body 136 and the mounting bracket 144 are connected by a wire 145, and an intermediate portion of the wire 145 is the lifting arm 131.
It is attached to a rotatable pulley 146 provided above. The counterweight 144 is balanced with the total weight of the movable body 136 including the suction means 133 (excluding the weight 137).

The third package transfer means 95 is
Adsorption means 133 when soldering the package 2 and the lid 4
Is provided with a photo sensor 150 for detecting whether or not the package 2 is being pressed. This photo sensor 150
Is a shading plate 151 attached to the movable body 136 side.
And a light emitting element 152 (152a, 1a) disposed on the fixed plate 140 side so as to face the light blocking plate 151 with the light shielding plate 151 interposed therebetween.
52b). When the elevating arm 131 is moved downward by a predetermined stroke, the movable body 136 and the suction means 133 are also lowered together therewith.
The package 2 adsorbed and held by 33 is superposed on the lid 4 placed on the heater tool 30 with the opening portion facing downward. Package 2 lid 4
Then, the suction means 133 is stopped because it is prevented from further descending, and the suction state of the package 2 is released. On the other hand, the elevating arm 131 is stopped after the suction means 133 is stopped due to the contact between the package 2 and the lid 4 and further after the lowering of the required stroke. That is, the elevating arm 131 descends by a stroke larger than the stroke by which the suction means 133 can descend. Therefore, the fixing plate 14
0 also moves downward to release the support of the stopper 139, so that the movable plate 136 can be lowered with respect to the elevating arm 131. However, since the suction means 133 is placed on the package 2, the weight of the weight 137 (for example, 65 g) is applied to the package 2 as the pressure applied by the suction means 133.

When the suction means 133 pressurizes the package 2 as the elevating arm 131 descends,
Since the light-receiving and light-emitting elements 152a and 152b move below the light-shielding plate 151, the light-receiving element 152a becomes the light-emitting element 152b.
By receiving the light emitted from the photosensor 150, the pressurization state of the package 2 is detected by the photosensor 150.

In FIGS. 2 and 9 to 12, the heater tool 30 is mounted on the pedestal 161 on the heat stage 24.
Is installed in the center of the upper surface of the. The heater tool 30 is formed of a high resistance material such as molybdenum or titanium into an elongated rod-like body having a downward U-shaped cross section as shown in FIG. It is composed of a plate 30b and a top plate 30c that connects the upper ends of the left side plate 30a and the right side plate 30b. The lower ends of the left side plate 30a and the right side plate 30b are the power supply terminals 1
62 and 163 (FIG. 10), respectively. The left side plate 30a and the right side plate 30b are formed in unequal thicknesses so that the plate thickness at the lower end portion is thicker than that at the upper end portion. Top plate 30
c has a plate thickness that is substantially the same as the plate thickness of the upper ends of the left side plate 30a and the right side plate 30b, and 10 pieces are provided on the upper surface (however, 5 pieces are provided in FIGS. 9 and 11). ) The heating projections 164 are provided in a row in the longitudinal direction of the heater tool 30 at a predetermined interval.

The heating protrusion 164 is formed on the package 2,
The lid 4 and the package 2 are sequentially supplied and placed on the upper surface, which are rectangular projections that are similar to the lid 4 but are smaller than the lid 4. That is, as described above, the lid 4 is supplied and placed on the heater tool 30 by the third lid transport means 52 receiving the lid 4 from the second lid transport means 51 at the second lid delivery position D2. This is performed by moving and raising and lowering the arm 82, placing the lid 4 sucked and held by the suction means 84 on the heating projection 164, and releasing the suction / holding state.
In this case, the lid 4 is placed with the joint surface coated with the solder 8 facing up as shown in FIG. Package 2
The third package transfer means 95 receives the package 2 from the suction / reversal mechanism 121 and moves it above the heater tool 30, and the elevating arm 131 descends and the suction means 133 sucks and holds the package. The package 2 is placed on the lid 4 placed on the heating projection 164 with the opening facing downward.

2, FIG. 9, FIG. 10, and FIG. 13 to FIG. 15, the heating stage 1 is provided on the heat stage 24.
The positioning mechanism 3 for positioning the lid 4 and the package 2 which are placed on top of each other on the board 64 before soldering
1 is provided. The positioning mechanism 31 includes two sets of stages 171 (171L, 17L, 17L, 171L, 17L) having the same structure and arranged symmetrically on both sides of the heater tool 30.
1R) and a cylinder 176 for operating these stages 171 in conjunction with each other. When the left and right stages 171 are described separately, the left stage is denoted by the subscript L, the right stage is denoted by the subscript R, and the other stages are not denoted by the subscript.

The stage 171 is composed of an X stage 172 and a Y stage 173, which are arranged in two layers. The X stage 172 is installed on the pedestal 161 in parallel and has two linear rails extending in the left-right direction. 174 is movably arranged via a linear guide 175, and is configured to be reciprocally moved in the left-right direction (X direction) by a cylinder 176, that is, to be moved toward and away from the heater tool 30. The cylinder 176 includes two operating rods 176a, 1 that move in directions toward and away from each other.
The X stage 172 of the left and right stages 171L and 171R is connected to the operating rods 176a and 176b through the connecting arm 177, respectively. The operating rods 176a and 176b are most distant from each other when the cylinder 176 is OFF, and the left and right stages 171 are
The X stage 172 of L and 171R is held at the initial position.

The Y stage 173 is movably arranged on a linear rail 178 provided on the upper surface of the X stage 172 via a linear guide. Y stage 17
A cam follower 183, which constitutes a cam mechanism 181 together with a cam plate 182, is provided on the lower surface side of No. 3 via a support shaft 184, and a plurality of positioning positions for positioning the package 2 and the lid 4 on the side surface facing the heater tool 30. A piece 185 is provided so as to correspond to each heating projection 164. In addition, the Y stage 173 is a tension coil spring 1.
79 (FIG. 13) urges the cam follower 183 in the Y direction and in a direction in which the cam follower 183 is in pressure contact with the cam surface 186 of the cam plate 182. The biasing direction of the Y stage 173 by the tension coil spring 179 is the left stage 171.
The Y stage 173 of L is behind the automatic sealing device 20, and the Y stage 173 of the right stage 171R is
Is ahead of. Furthermore, the left and right stages 171
The Y stages 173 of L and 171R are urged by the two tension coil springs 180 so as to approach each other toward the heater tool 30.

The cam plate 182 of the cam mechanism 181
Is fixed to the upper surface of the gantry 161 and the end surface facing the heater tool 30 forms the cam surface 186. The cam surface 186 forms a cam surface which is an inclined surface inclined by a required angle with respect to the moving direction (X direction) of the X stage 172. In this case, as shown in FIG. 9, the cam surfaces 186 of the cam plates 182 of the left and right cam mechanisms 181, 181 are inclined in the same direction so as to be parallel to each other.

In this way, the cam surface 186 is tilted, the Y stage 173 is urged by the tension coil spring 179 in the direction in which the cam follower 183 presses against the cam surface 186 of the cam plate 182, and the left and right stages 171L, 171L,
171R Y stage 173 pulls coil spring 180
When the cylinders 17 are biased toward each other,
When the X stage 172 of the left and right stages 171L and 171R is moved in synchronization with each other along the linear rail 174 by the drive of 6, the Y stage 173 of the left and right stages 171L and 171R moves on the cam surface 186. The positioning piece 185 moves in synchronization with the tilt direction, that is, in the P1 and P2 directions (see FIG. 9).
Bring them closer to each other. The P1 and P2 directions, which are the moving directions of the Y stage 173, are the directions of one diagonal line S of the two diagonal lines of the lid 4 and the package 2 placed on the heating protrusion 164 as shown in FIG. Is consistent with Here, the P1 direction is the diagonal left front direction of the automatic sealing device 20, and the P2 direction is the diagonal right rear direction.

The positioning piece 185 has a recess 190 (see FIGS. 13 and 14) for pressing the package 2 and the lid 4 at one corner of the tip. The recesses 190 are formed point-symmetrically so as to face each other with respect to the left and right positioning pieces 185. That is, the concave portion 190 of the positioning piece 185 provided on the Y stage 173 of the left stage 171L is
Since the moving direction of 73 is the P1 direction, the Y stage 1 of the stage 171R on the right side is provided at the rear side corner portion of the tip end portion.
The concave portion 190 of the positioning piece 185 provided on the reference numeral 73.
Is provided at the front side corner of the tip because the moving direction of the Y stage 173 is the P2 direction. Recess 190
Is a rectangular recess and is composed of two orthogonal positioning walls 19
1a and 191b (FIG. 13). Positioning wall 1
91a is a wall parallel to the X direction, and the positioning wall 191b is Y.
It is a wall parallel to the direction.

In addition, the left and right stages 171L and 171R
Positioning piece 185 provided on the Y stage 173 of
Is shifted in the front-back direction in consideration of the moving directions P1 and P2 of the Y stage 173. That is, as shown in FIG. 14, the positioning piece 185 of the stage 171L located on the left side of the heater tool 30 is located in front of the positioning piece 185 of the stage 171R located on the right side of the heater tool 30. As described above, when the left and right positioning pieces 185 are provided so as to be displaced in the front-rear direction, the left and right stages 171L,
When the Y stage 173 of the 171R moves in the P1 and P2 directions and approaches each other, the left and right positioning pieces 18
Since 5 also approaches each other in the P1 and P2 directions, the recess 190 can be pressed against the two corners of the package 2 and the lid 4 on the heater tool 30 that face each other in the diagonal S direction. At this time, if the package 2 and the lid 4 are relatively displaced or rotated,
The recesses 190 of the left and right positioning pieces 185 have positioning walls 191a and 191b on all side surfaces of the package 2 and the lid 4.
The package 2 and the lid 4 are pressed and moved until they come into contact with. Therefore, the package 2 and the lid 4 are accurately positioned so as to be overlapped with each other, and their centers are aligned with each other. Then, the package 2 and the lid 4 by the positioning mechanism 31
When the positioning of is completed, the driving direction of the cylinder 176 is switched, and the X stage 172 is retracted to return to the initial position. Therefore, the Y stage 173 also moves backward in association with the X stage 172, so that the positioning piece 18
5 is separated from the package 2 and the lid 4, and these pressed states are released. The positioning of the package 2 and the lid 4 by the positioning mechanism 31 is performed while the package 2 is pressed against the lid 4 by the suction means 133.

9 and 10, the heat stage 24 is provided with the cooling mechanism 32 for cooling the heater tool 30. The cooling mechanism 32 urges the two cooling pipes 201, 201 arranged on both sides of the heater tool 30 so as to be movable in the left-right direction, and urges the cooling pipes 201, 201 toward each other.
Tension coil springs 202 and the cooling tubes 201, 201
A cylinder 204 for synchronizing 01 and moving them closer to and away from each other
Etc. Cooling pipe 201, the cooling water inside in plan view hollow square shape is supplied by the circulation, is held at a standby position away from the heater tool 30 during OFF of the cylinder 204, the cylinder 204 during the cooling of the heater tool 30 When the heater tool 30 is moved forward, the surface facing the heater tool 30 is in contact with the side surface of the heater tool 30 for a certain period of time, and the heater tool 30 has a required temperature (about 100 ° C.)
It is configured to cool down to.

The cylinder 204 corresponds to the stage 17
It has the same structure as the cylinder 176 for driving 1, and has two working rods (not shown) that move in the directions of approaching and separating from each other, and the left and right cooling pipes 201, 201 are respectively connected to these working rods via connecting arms. It is connected. Cooling pipe 2
The timing for cooling the heater tool 30 by 01 is immediately after the heater tool 30 is heated to a predetermined temperature (for example, 280 ° C.) by energization and the solder 8 of the lid 4 is melted by heating. It is possible to accelerate the solidification of the solder 8 and shorten the soldering cycle. The heating and cooling time is about 6 seconds.

Next, the automatic sealing device 20 having the above structure
The sealing operation according to (1) will be described mainly based on the flowchart of the sealing operation shown in FIGS. 2 and 16. The automatic sealing device 20 automatically and continuously solders the package 2 and the lid 4 to hermetically seal them by driving and controlling the respective mechanical units according to a sequence based on a control signal from the control unit. The electronic component 1 shown in FIG. 1 is manufactured.
When manufacturing the electronic component 1, first, the lid transport tray 26 accommodating the lid 4 is placed in the loader 4 of the lid supply unit 22.
It is set to 0 (step S1 in FIG. 16). Further, the package carrying tray 28 accommodating the package 2 is set in the loader 85 of the package supply section 23 (step S2). The operator sets the lid transport tray 26 and the package transport tray 28 on the loaders 40 and 85. Then, the start switch is turned on to activate the automatic sealing device 20.

When the automatic sealing device 20 is activated, the tray transfer device 27 receives the lid transfer tray 26 in the loader 40 and transfers it to the lid suction position B1. When the lid transport tray 26 is transported to the lid suction position B1, the first lid transport means 50 of the lid transport device 34 holds the lids 4 mounted on the lid transport tray 26 by suction of a required number of them. It is conveyed to the first delivery position D1 and delivered to the second lid conveying means 51 (step S4).

The second lid transport means 51 that has received the lid 4 is moved by the positioning mechanism 66 (FIG. 4).
Is provisionally positioned and conveyed to the second lid delivery position D2. During this transportation, the discrimination camera 77 moves the lid 4
The front and the back of is determined (step S5).

At the second package delivery position D2, when the third lid carrying means 52 receives the lid 4 from the second lid carrying means 51 and holds it by suction , it is carried to the heat stage 24 and each of the heater tools 30 is held. It is placed on the heating projection 164 (step S6).

On the other hand, in the package supply section 23, when the tray transfer device 29 receives the package transfer tray 28 on which the package 2 stored in the loader 85 is mounted, it is transferred to the package suction position B2 (step S7). .

When the package transfer tray 28 is transferred to the package suction position B2, the package transfer device 35
The first package conveying means 93 sucks a required number of packages 2 mounted on the package conveying tray 28.
Transported to the first transfer position E1 and held by the second
It is delivered to the package transporting means 94.

The second package carrying means 94 having received the package 2 carries the package 2 to the second package delivery position E2. During this time, the positioning mechanism 12
The package 2 is temporarily positioned by 0 (FIG. 4). Also, the package 2 is reversed by the suction / reversal mechanism 121 (FIG. 6) to lower the opening (step S8).

At the second package delivery position E2, the third package transport means 95, upon receiving the inverted package 2 from the suction / reversal mechanism 121, transports it above the heat stage 24 for heating the heater tool 30. The lid 4 placed on the protrusion 164 is placed with the opening downward (step S9).

When the package 2 is placed on the lid 4, the positioning mechanism 31 (FIG. 13) operates and the left and right positioning pieces 185 sandwich the package 2 and the lid 4 from both sides, so that the package 2 The centers of the lids 4 are matched (step S10). The positioning by the positioning mechanism 31 is performed in a state where the suction means 133 of the third package transport means 95 presses the package 2 with a predetermined pressure.

When the positioning process of the package 2 and the lid 4 by the positioning mechanism 31 is completed, the positioning piece 185
Is released to release the sandwiched state between the package 2 and the lid 4 (step S11).

Next, a large pulsed current is applied to the heater tool 30 for a predetermined time while the package 2 is pressed by the suction means 133 with a predetermined pressure. The energization time to the heater tool 30 is several seconds (about 3 seconds), and the Joule heat generated at this time causes the heater tool 30 to reach a predetermined temperature (280
C.), and the solder 8 applied to the lid 4 is instantaneously heated and melted to solder the package 2 and the lid 4 (step S12). Such a heating method of the heater tool 30 is called a pulse heating method.

When the energization is completed, the cooling mechanism 32 operates to bring the cooling pipe 201 into contact with the side surface of the heater tool 30 to cool the heater tool 30 to about 100 ° C. When the heater tool 30 is cooled, the solder 8 melted by heating
Rapidly solidifies to join the package 2 and the lid 4.
Therefore, the package 2 is hermetically sealed by the lid 4, and the electronic component 1 is completed.

[0077] When the package 2 and the electronic component 1 soldering is completed the lid 4 is completed, the third package carrier means 95 is held by suction the electronic component 1 (step S13). Then, when it is moved backward along the linear rail 80 to the position above the product box 36 and stopped, the suction state of the package 2 by the suction means 133 is released, and the electronic component is dropped and stored in the product box 36 (step S14). ),
One cycle of the soldering process is completed. Hereinafter, by repeating the above operation, the supply of the package 2 and the lid 4 and the soldering work are continuously performed. The work of taking out the completed electronic component is performed by the operator after the work of soldering all the packages 2 and the lid 4 is completed.

In the above embodiment, 1
Although the ten packages 2 and the lid 4 are soldered by one soldering operation, the present invention is not limited to this, and the heating projection 164 of the heater tool 30, the transport device 34, The number can be increased or decreased as appropriate by changing the number of the suction means of 35. Further, the present invention is not limited to the above-described embodiment,
It is possible to variously change and modify each mechanism without departing from the scope of the present invention.

[0079]

As described above, the automatic sealing device according to the present invention has the following working effects. 1) The package and the lid can be automatically and continuously soldered, and the worker only needs to supply the package and the lid to the supply section and take out the completed electronic component. It is possible to save labor and improve productivity. 2) Since the heater tool is configured to be instantaneously heated and soldered by the pulse heating method, it is possible to solder in a short time. 3) Since the protrusions smaller than the package and the lid are provided on the upper surface of the heater tool and the lid and the package are placed on top of each other, it is possible to position the lid and the package by sandwiching the lid and the package from both sides. It is possible and can be positioned reliably. 4) Since the package is placed on the lid with the opening facing down and soldered, there is no possibility that particles of the molten solder will scatter and adhere to the electronic component element in the package. Good electrical characteristics can be maintained. 5) Soldering is performed while the package is pressed with a predetermined pressure and pressed against the lid, so that the package and the lid are not displaced relative to each other and soldering can be performed with high accuracy .

[Brief description of drawings]

FIG. 1 is a sectional view showing an electronic component sealed by an automatic sealing device according to the present invention.

FIG. 2 is a schematic plan view showing the inside of the automatic sealing device.

3A, 3B, and 3C are plan views of a lid (package) transport tray, a perspective view of a main part of a lid transport tray on which the lid is mounted, and package transport on which the package is mounted. It is a perspective view of the principal part of the tray for use.

4A and 4B are a plan view and a cross-sectional view showing a lid (package) positioning mechanism.

FIG. 5 is a plan view showing a suction / reversal mechanism of the package transfer device.

FIG. 6 is a side view showing a part of the suction / reversal mechanism in a cutaway manner.

FIG. 7 is a front view of a third package transfer unit.

FIG. 8 is a side view of the package carrying means.

FIG. 9 is a plan view of a heat stage.

FIG. 10 is a front view of the heat stage.

11 (a), (b) and (c) are a front view, a plan view and a side view of a heater tool.

FIG. 12 is a perspective view showing a state in which a lid is placed on a heating protrusion of a heater tool.

FIG. 13 is a schematic perspective view of a positioning mechanism for a package and a lid.

FIG. 14 is a plan view showing how the positioning piece positions the package and the lid.

FIG. 15 is an enlarged view of FIG. 14 as viewed in the direction of arrow A.

FIG. 16 is a flowchart of a sealing operation.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Electronic component, 2 ... Package, 3 ... Electronic component element, 4
... lid, 7 ... conductive pin, 8 ... solder, 20 ... automatic sealing device, 21 ... chamber, 22 ... lid supply section, 23 ... package supply section, 24 ... heat stage, 26 ... lid transport tray, 27 ... tray Transporting device, 28 ... Package transporting tray, 29 ... Tray transporting device, 30 ... Heater tool, 31 ... Positioning mechanism, 32 ... Cooling mechanism, 34 ...
Lid transport device, 35 ... Package transport device, 87 ... Package transport tray, 121 ... Suction / reversal mechanism, 13
3 ... Adsorption means, 164 ... Heating projections, 172 ... X stage, 173 ... Y stage, 179, 180 ... Tensile coil springs, 181 ... Cam mechanism, 182 ... Cam plate, 1
85 ... Positioning piece, 190 ... Recessed portion, B1 ... Lid suction position, B2 ... Package suction position.

Continuation of front page (58) Fields surveyed (Int.Cl. ⁷ , DB name) H01L 23/02 H01L 23/10

Claims (2)

(57) [Claims] 1. A package containing an electronic component element,
An automatic sealing device for electronic parts, comprising a lid for hermetically sealing the package by being soldered to an opening of the package, wherein a plurality of lids having solder applied to a joint surface with the package are provided. To a lid suction position, a package supply unit that supplies a plurality of packages containing the electronic component elements to a package suction position, and a heating stage having a plurality of heating protrusions integrally formed on the upper surface. When a heater tool installed and heated by pulsed energization and a plurality of lids conveyed to the lid suction position are sucked and held by suction means, the lids are conveyed above the heater tool and heated. A lid transport device that mounts the bonding surface upward on the projecting projection, and a plurality of lid transport devices that are transported to the package suction position. Holding the Kkeji a package carrier for each mounting opening in the bottom of the package on the lid and conveyed upward is placed on the respective heating projections of the heater tool, wherein The package carrying apparatus includes the lid mounted on each heating projection and a positioning mechanism for positioning the package, and the package transfer device sucks the package.
Hold it and convey it above the heater tool.
Placed on the lid that is placed on the heat projection
It is equipped with a suction means that can move up and down.
The package and the package are
An automatic encapsulation device for electronic parts, which is characterized by soldering the head . 2. The electronic component automatic sealing device according to claim 1, wherein the heating projection of the heater tool is the package, the front part.
It is smaller than the lid, and the positioning mechanism is provided on each side of the heater tool for heating.
Corresponding to each projection, and placed on the projection
From one side of the lid and package
By approaching in synchronization with each other, the lid and the
Multiple positioning to press the corners of the package to position
It has a female piece, and this positioning piece is at one corner of the tip.
Adjacent to the lid and the package with the diagonal line between them
An automatic sealing device for electronic parts, characterized in that it has a concave portion that is in contact with two mutually orthogonal sides .