JP2002343896A - Automatic sealing equipment of electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide automatic sealing equipment for improving productivity and saving power by continuously and automatically sealing electronic components. SOLUTION: When a lid 4 is carried to a lid suction position B1 by a carrying device 27 from a lid supply part 22 within a chamber 21, this lid is sucked and held by a lid carrying device 34 to be carried to over a heat stage 24 and to placed with its soldering surface faced up on a heater tool. When a package 2 is carried to a package suction position B2 by a carrying device 29 from a package supply part, this package is sucked and held by a package carrying device 35 to be carried to the upper side of the heat stage and overlapped with an opening part facing down on the lid 4 over the tool 30. A heater tool 31 is heated by energizing, and soldering applied to the lid 4 is heated and melted to solder the package 2 and the lid 4.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for automatically sealing an electronic component in which a package containing a semiconductor element, a quartz oscillator, a piezoelectric element and the like is hermetically sealed with a lid.

[0002]

2. Description of the Related Art Conventionally, a semiconductor device, a quartz oscillator, a piezoelectric device and the like (hereinafter collectively referred to as electronic component devices) are housed in a container (hereinafter referred to as a package), and an opening of the package is covered with a lid. As a method for sealing a package in an electronic component hermetically sealed with a lid (hereinafter, referred to as a lid), a micro parallel seam joining method described in Japanese Patent Publication No. 1-38737 or the like is widely used. In this micro parallel seam joining method, the package is usually formed of ceramics, a frame-shaped metal seal frame is fixed to the opening by brazing, etc., and a metal lid is seam-welded to this seal frame. This is a method for manufacturing an electronic component by sealing hermetically. At the time of seam welding, a pair of roller electrodes are brought into contact with two opposing sides of the lid, for example, side edges on the short side under a certain pressurizing condition, and are rolled, and at the same time, electricity is supplied to the roller electrodes. When the roller electrode is energized, the side edges of the two short sides are melted by Joule heat generated at this time, and the lid is seam-joined to the seal frame. When the seam joining on the short side is completed, the both side edges on the long side are seam-welded in the same manner to complete the electronic component.

[0003] When this kind of electronic component is used for a small and lightweight communication device such as a mobile phone, further reduction in size and cost is required. In particular, recently, demands for miniaturization are severe, and for example, the height and width dimensions are 2.5 mm × 2 mm × 2 mm
Less than is required. However, such a small electronic component has a problem that it is technically difficult to apply a roller electrode to a desired position of a lid and perform seam welding in a stable state.

Therefore, recently, Japanese Patent Application Laid-Open No. H11-21455
Japanese Patent Application Publication No. JP-A-2005-11095 proposes a "sealing device and a sealing method for a package of an electronic component". In this sealing method, solder is applied to the lid in advance, the lid is placed on the heater chip with the solder application side up, and the package is placed on the lid with the opening down. By applying pressure, the heater chip is heated by the pulse heating method, that is, a large pulse current is applied, and the solder applied to the lid is heated and melted using the Joule heat generated at this time, so that the lid is instantly placed on the package. This is a method of air-tightly sealing by soldering.

In such a sealing method, since a roller electrode is not required, even a small electronic component can be reliably sealed as compared with seam welding, and the package is placed on the lid. Since the lids are mounted together and the lid is heated from below and soldered, there is little risk that the heated and melted solder particles will scatter in the package and adhere to the electronic component elements. Can be maintained stably.

[0006]

However, the sealing device disclosed in Japanese Patent Application Laid-Open No. H11-214551 does not automatically seal a plurality of electronic components in a continuous manner. Was low. For this reason, development of an automatic sealing device with high productivity is demanded. In addition, a cap-shaped jig is used as a positioning jig for positioning the electronic component on the heater chip, and the jig is fitted to the electronic component for positioning. When the outer dimensions of the jig and the inner dimensions of the jig are substantially matched, the jig cannot be fitted to the electronic component when the relative displacement between the lid and the package is large. If the shape and dimensions are made large so that they can be fitted easily, a gap is created between the jig and the electronic component, so that positioning cannot be performed with high accuracy. Therefore, in any case, positioning cannot be performed quickly and with high accuracy, and there is a problem that it takes time for a positioning operation by an operator.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned conventional problems and demands, and has as its object to continuously and automatically seal electronic components.
It is an object of the present invention to provide an automatic sealing device that can improve productivity and save labor.

[0008]

According to a first aspect of the present invention, a package accommodating an electronic component element is hermetically sealed by being soldered to an opening of the package. A lid supply unit for supplying a plurality of lids having solder applied to a bonding surface with the package to a lid suction position, and the electronic component element is housed therein. A package supply unit for supplying a plurality of packages to a package suction position, a heater tool integrally provided with a plurality of heating protrusions on an upper surface, which is installed on a heat stage, and heated by pulsed energization; When the plurality of lids conveyed to the heater are sucked and held by the suction means, the plurality of lids are conveyed above the heater tool and the bonding surface is formed on each heating protrusion. And a plurality of packages transported to the package suction position are sucked and held by suction means, and are transported above the heater tool and mounted on the respective heating projections. And a positioning mechanism for positioning the package and the package placed on each of the heating projections. .

In the first invention, the lid is transported by the lid transport device, and is mounted on the heating projection of the heater tool. The package is transported by the package transport device and is placed on a lid placed on the heating projection of the heater tool. The lid and the package placed on the projection are positioned by the positioning mechanism. The heater tool is instantaneously heated by applying a pulsed current, and heats the lid from below. Thereby, the solder is heated and melted to solder the lid and the package, and hermetically seal the package. Therefore, the operation of sealing the package can be automatically performed continuously. The time required for soldering the package and lid and sealing the package, that is, the time required to energize the heater tool and heat it to a predetermined temperature, and then heat and melt the solder until the solder solidifies due to the temperature drop of the heater tool, A few seconds (3 ~
6 seconds), so there is little thermal influence on the electronic component elements in the package. When hermetically sealing the package,
Since the package is placed on the lid with the opening facing down, there is little risk that the heated and melted solder particles will scatter and adhere to the electronic component elements in the package. The positioning mechanism removes the relative displacement, rotation, and the like of the package and the lid for positioning.

[0010] The second invention is the above-mentioned first invention, wherein:
A package transport device that includes a vertically movable suction unit that sucks and holds the package, transports the package above the heater tool, and mounts the package on a lid mounted on the heating protrusion; The package and the lid are soldered while the package is pressed.

In the second aspect of the present invention, the package is soldered by the suction means under a constant pressurizing condition, so that the lid and the package do not float or displace.

According to a third aspect of the present invention, in the first or second aspect, the heating projection of the heater tool is formed smaller than the package and the lid, and the positioning mechanism corresponds to each heating projection on both sides of the heater tool. Are arranged respectively,
By approaching in synchronization with each other from one diagonal direction of the lid and the package mounted on the protrusion,
It has a plurality of positioning pieces for pressing and positioning the corners of the lid and the package, and the positioning pieces are adjacent to each other at one of the corners of the front end with the diagonal lines of the lid and the package interposed therebetween. It has a concave portion in contact with the side.

In the third aspect of the invention, the positioning pieces approach each other from one diagonal direction of the lid and the package to press the concave portion against the corner of the lid and the package. Therefore, the lid and the package are positioned by correcting the relative misalignment and rotation by contacting two sides orthogonal to each other across the corner with the recess. Since the outer peripheral edges of the package and the lid protrude outside the heating projection, the package and the lid can be positioned by pressing the package and the lid from both sides when positioning.

According to a fourth aspect of the present invention, the first, second or third aspect is provided.
In the invention, a cooling mechanism is provided for cooling the heater tool to a predetermined temperature when the solder applied to the lid is heated and melted by energizing the heater tool.

In the fourth aspect, the cooling mechanism cools the heater tool and lowers the temperature to a predetermined temperature when the solder is melted, so that the melted solder is quickly solidified and the sealing cycle time is reduced.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail based on an embodiment shown in the drawings. FIG. 1 is a sectional view showing an electronic component sealed by the automatic sealing device according to the present invention. The electronic component 1 includes a package 2 for housing an electronic component element 3 such as a semiconductor element, a quartz oscillator, and a piezoelectric element;
And a lid 4 for hermetically sealing the opening of the package 2. The package 2 is formed in a box shape whose upper side is opened with an insulating material such as ceramics. Tungsten 5 is metallized on the opening end surface to enable soldering of the lid 4, and further, a gold plating 6 is formed on the surface of the tungsten 5. It has been subjected. By the way, package 2
The size of the height, width, height is 2 × 2.5 × 2mm
It is about.

The electronic component element 3 is disposed on the inner bottom surface of the package 2 and is electrically connected to conductive pins 7 provided through the bottom of the package 2.

The lid 4 is made of Kovar (54% Fe, 29% Ni,
It is made of a metal such as SUS or the like, and has a size matching the shape of the opening of the package 2, that is, the same size as the opening, and a plate thickness of about 0.1 mm. Solder 8 is applied in advance to the back surface (joining surface) of lid 4, and this solder 8 is heated and melted by the automatic sealing device according to the present invention to solder package 2 and lid 4. The electronic component 1 in which the package 2 is hermetically sealed is completed.

Since the lid 4 is manufactured by cutting a thin metal plate coated with solder on the entire back surface to a predetermined size, the solder 8 is coated on the entire back surface. The coating may be applied only to the outer peripheral edge of the back surface that comes into contact with the opening end surface of the second. As the solder 8, for example, a Pb—Sn solder having a melting point of 280 ° C. is used, but a solder in which a small amount of metal (silver, bismuth, or the like) is mixed with lead or tin may be used. The hermetic sealing of the package 2 in the electronic component 1 is performed in an atmosphere of an inert gas in order to prevent the lid 4 and the solder 8 from being oxidized, and the inert gas is sealed inside the package 2. You. Nitrogen is used as the inert gas.

Next, the configuration and the like of the automatic sealing device according to the present invention will be described with reference to FIGS. FIG. 2 is a schematic plan view showing the inside of the automatic sealing device, and FIGS.
(C) is a plan view of a lid (package) transfer tray,
FIG. 3 is a perspective view of a main part of a lid transport tray on which a lid is mounted, and a perspective view of a main part of a package transport tray on which a package is mounted. 4A and 4B are a plan view and a cross-sectional view showing a lid (package) positioning mechanism.
FIG. 5 is a plan view showing a suction / reversal mechanism of the package transport device, and FIG. 6 is a side view showing a part of the suction / reversal mechanism. FIG. 7 is a front view of a third package conveying means,
8 is a side view of the package transfer means, FIG. 9 is a plan view of the heat stage, FIG. 10 is a front view of the heat stage,
FIGS. 11A, 11B, and 11C are a front view, a plan view, and a side view of the heater tool. FIG. 12 is a perspective view showing a state where a lid is placed on a heating protrusion of a heater tool,
13 is a schematic perspective view of a package and lid positioning mechanism, FIG. 14 is a plan view showing how the package and the lid are positioned by a positioning piece, and FIG. 15 is an enlarged view as viewed from the direction of arrow A in FIG.

First, the overall configuration of the automatic sealing device will be schematically described. In FIG. 2, the automatic sealing device generally indicated by reference numeral 20 has a box-shaped chamber 21 in which nitrogen is supplied as an inert gas. The periphery of the chamber 21 is glass-coated so that the inside can be visually recognized from the outside, and a lid supply unit 22, a package supply unit 23, a heat stage 24, and the like are provided inside. The lid supply unit 22
Tray transport device 2 for transporting the lid transport tray 26 (FIG. 3) on which the lid 4 is mounted to the lid suction position B1.
7 is provided. The package supply unit 23 includes a package transport tray 28 on which the package 2 is mounted (FIG. 3).
Transfer device 2 for transferring the sheet to the package suction position B2
9 is provided. The heat stage 24 heats and melts the solder 8 applied to the lid 4 and solders the lid 4 to the package 2 (see FIG. 11,
12), a positioning mechanism 31 for positioning the package 2 and the lid 4 before soldering the lid 4 (FIGS. 9 and 1).
0, FIGS. 13 to 15), when the solder 8 is heated and melted, the heater tool 30 is cooled to a required temperature (for example, 100 ° C.).
And a cooling mechanism 32 (FIGS. 9 and 10) for descending.

In the chamber 21, a lid transfer device 34 for transferring the lid 4 from the lid suction position B1 to the heat stage 24, a package transfer device 35 for transferring the package 2 from the package suction position B2 to the heat stage 24, A product box 36 with an opening / closing door for accommodating the electronic component 1 which has been completed after the soldering operation of the package 2 and the lid 4 is provided.

Further, a detailed configuration of the automatic sealing device 20 will be described. The lid supply section 22 is provided at a rear left corner in the chamber 21 and has a tray transport device 27 for transporting the lid transport tray 26 (FIG. 3) to the lid suction position B1, and an automatic sealing. The apparatus includes a loader 40 and an unloader 41 that are disposed apart from each other in the front-rear direction (Y direction) of the device 20. The loader 40 is disposed behind the unloader 41, and stores a plurality of lid transfer trays 26 on which the plurality of lids 4 coated with the solder 8 are mounted horizontally at regular intervals in the height direction. ing. Each of the loader 40 and the unloader 41 has 20 tray storage stages. The supply of the lid transfer tray 26 from the outside of the apparatus to the loader 40 and the removal of the lid transfer tray 26 from the unloader 41 to the outside of the apparatus are performed by an operator.

The lid transfer tray 26 is shown in FIG.
As shown in (a) and (b), a plurality of recesses 43 for accommodating the lid 4 and a long groove 44 are formed on a top surface of a square metal plate. The concave portions 43 are formed in a matrix of ten at predetermined intervals in the vertical and horizontal directions, and the concave portions 43 in each column are communicated in series by the long grooves 44. The recess 43 is a rectangular recess slightly larger than the lid 4 for facilitating removal of the lid 4, and has a depth substantially equal to or slightly smaller than the thickness of the lid 4. The lid 4 is a joint surface with the package 2,
That is, it is stored in the recess 43 with the surface on which the solder 8 is applied facing upward.

The lid transfer tray 26 loaded with the lid 4 stored in the loader 40 is intermittently taken out from the bottom by the tray transfer device 27 in sequence.
It is transported to the lid suction position B1. Lid suction position B1
Is provided in front of the lid supply unit 22. The tray transport device 27 reciprocates between the lower part of the loader 40 and the unloader 41 and the lid suction position B1 by driving a drive motor (not shown). When the tray 26 is received, it is moved forward and conveyed to the lid suction position B1, and when all the lids 4 are removed and emptied for sealing the package 2, the empty lid transport tray 26 is removed. It is configured to be conveyed from the suction position B1 to below the unloader 41. An empty lid transfer tray 26 is provided below the unloader 41.
There is provided a suitable push-up mechanism (not shown) for pushing up and storing it in the unloader 41. In addition, as a device and a mechanism for taking out the lid transfer tray 26 from the loader 40 and transferring the same to the unloader 41, a transfer device and a mechanism similar to those used for transferring a wafer in a semiconductor manufacturing apparatus may be used. Is possible.

The lid transport device 34 includes first, second,
The third lid transport means 50, 51, 52 is provided between the lid suction position B1 and the heat stage 24.

When the first lid transport means 50 sucks and holds a predetermined number of the lids 4 from the lid transport tray 26 transported to the lid supply position B1, the first lid transport means 50
To the lid transfer position D1 and the second transfer means 51
A slider 54 movably disposed on an X guide rail 53 extending in the left-right direction (X direction);
An elevating arm 56 provided on the slider 54 and vertically moved by a drive motor 55; ten suction means 57 arranged in parallel with the elevating arm 56 at predetermined intervals in the front-rear direction; And a driving motor 58 for driving the motor. The suction means 57 is moved down by a predetermined distance together with the lifting arm 56 at the lid suction position B1, and the lid 4 mounted on the lid transfer tray 26 is moved.
The lid 4 is configured to be sucked and held by being evacuated by a vacuum pump when it comes into contact with the upper joint surface. The arrangement pitch of the suction means 57 is equal to the arrangement pitch of the concave portions 43 arranged in the longitudinal direction of the lid transfer tray 26.

When the suction means 57 sucks and holds the lid 4, the lifting arm 56 returns to the up position, and the slider 54 moves rightward in FIG. 2 along the X guide rail 53 to move the lifting arm 56 to the first lid transfer position D 1. When stopped above, it is lowered again, and the lid 4 sucked and held by the suction means 57 is transferred to the second lid transport means 51. The suction surface of the suction means 57 is formed in a rectangular shape having a size matching the outer shape of the lid 4.

The second lid transporting means 51 receives the lid 4 from the first lid transporting means 50 at the first lid transfer position D1, and transports the lid 4 to the second lid transfer position D2. A slider 61 movably disposed on a Y guide rail 60 extending in a direction, a drive motor 62 for reciprocating the slider 61, and a predetermined distance in the front-rear direction on the lower surface side of the slider 61 are arranged side by side. And the suction surface is exposed on the upper surface of the slider 61.
It is composed of zero suction means 63 and the like.

At the first lid transfer position D1, the first lid transport means 50 to the second lid transport means 5
Delivery of the lid 4 to 1 is performed by the suction means 63 sucking and holding the lid 4 sucked and held by the suction means 57. That is, when the suction means 57 is lowered and the lid 4 held by suction / holding is placed on the upper surface of the slider 61 and on each suction means 63 to release suction / holding, the suction means 63 is replaced by a vacuum. After being exhausted, the lid 4 is sucked and held from below. When the suction means 63 suctions and holds the lid 4, the slider 61 of the second lid transport means 51 moves to the second lid transfer position D2 along the Y guide rail 60 by the driving of the drive motor 62. After stopping, the lid 4 is delivered to the third lid transporting means 52.

The second lid transfer means 51 is
A positioning mechanism 66 for the lid 4 is provided. The positioning mechanism 66 includes a reference plate 67, a movable plate 68 provided on one side of the reference plate 67, and a positioning pin 6 as shown in FIG.
9, and an air cylinder (not shown) for moving the movable plate 68 and the positioning pin 69, respectively.
The left edge of the upper surface of the reference plate 67 facing the movable plate 68 has
Zero long grooves 70 are formed. The long groove 70 is formed of a rectangular elongated groove that is long in the front-rear direction of the reference plate 67, has a front wall 70a and a rear wall 70b facing in front and rear in parallel, and a back wall 70c connecting these both side walls. Is set slightly smaller than the length of the short side of the lid 4. The rear wall 70b forms a reference surface for positioning the lid 4 in the front-rear direction, and the rear end of the rear wall 70c forms a reference surface for positioning the lid 4 in the left-right direction. At the rear end of the long groove 70, a projection 71 forming the suction means 63 is integrally provided along the rear wall 70b. The protrusion 71
It consists of a rectangular projection slightly smaller than the lid 4, has a horizontal upper surface, and forms a suction surface 72 for sucking and holding the lid 4. The suction surface 72 is located below the upper surface of the reference plate 67, and a suction port 73 is formed at the center.
Reference numeral 3 is connected to a vacuum pump (not shown) via an exhaust passage 74 provided inside the reference plate 67.

The movable plate 68 is disposed movably in the left-right direction (arrow A) on the left side of the reference plate 67, and a right side surface 68 a facing the reference plate 67 in parallel is a pressing surface for pressing the lid 4. Is formed. The movable plate 68 is moved in the direction of the reference plate 67 by a driving device such as an air cylinder (not shown) at the time of positioning the lid 4, thereby pressing the left side surface of the lid 4 and pressing it against the rear end of the inner wall 70 c. Thereby, the lid 4 is positioned in the left-right direction.

The positioning pin 69 has a top end projecting into the long groove 70 through a long pin insertion hole 76 formed in the bottom surface of the long groove 70 and extending in the front-rear direction. It is located on the front side of the insertion hole 76.
The upper surface of the pin 69 is located above the upper surface of the projection 71. When the lid 4 is positioned, the positioning pin 69 is moved rearward along a pin insertion hole 76 as shown by a two-dot chain line by a driving device such as an air cylinder (not shown) to press the lid 4 and press it against the rear wall 70b. Thus, the positioning of the lid 4 in the front-rear direction is performed. When the positioning of the lid 4 in the front, rear, left and right directions is completed, the lid 4 is sucked and held by the suction means 63 from below.

Referring again to FIG. 2, at the intermediate position between the first lid transfer position D1 and the second lid transfer position D2, when the second lid transfer means 51 passes below, the suction means 63 sucks. A discriminating camera 77 for discriminating whether or not the held lid 4 is upside down is provided. The discrimination camera 77 discriminates that the lid 4 is sucked and held with the joint surface up by detecting the solder 8 applied to the joint surface of the lid 4 (color detection).

When the third lid transport means 52 receives the lid 4 from the second lid transport means 51 at the second lid transfer position D 2, the heat stage 24
The slider 81 is conveyed to the heater tool 30 and transferred to the heater tool 30. The slider 81 is movably disposed on the X guide rail 80, and illustration of reciprocating the slider 81 along the X guide rail 80 is omitted. A drive motor and a lifting arm 82 movably provided on the slider 81
And a drive motor 83 for raising and lowering the lifting arm 82
And ten suction means 84 and the like arranged side by side at predetermined intervals in the front-rear direction on the lifting arm 82.

At the second lid transfer position D2, the second
The delivery of the lid 4 from the lid transport means 51 to the third first lid transport means 52 is performed by the suction means 84 sucking and holding the lid 4 which the suction means 63 sucks and holds. That is, at the second lid transfer position D2, the lifting / lowering arm 82 of the third lid transport means 52 descends to move the suction means 84 to the second lid transport means 5.
The lid 4 held by the first suction means 63 is brought into contact with the lid 4 from above. Then, the suction / hold state of the lid 4 by the suction means 63 is released. At the same time, the suction means 84 is evacuated by a vacuum pump, so that the suction means 84 sucks and holds the lid 4 and
Receive. Then, the lifting arm 82 moves up again, and the slider 81 moves rightward along the X guide rail 80,
The lifting arm 82 is stopped above the heater tool 30. When the lifting arm 82 moves above the heater tool 30 and stops, it is lowered by the drive of the drive motor 83, and places the lid 4 that is sucked and held by the suction means 84 on the heater tool 30. Transfer to the tool 30.

The package supply unit 23 has the same structure as the lid supply unit 22 and is disposed symmetrically with the lid supply unit 22 at the right rear corner in the chamber 21. For this reason, the package supply unit 23 is provided with the loader 8 disposed separately from the tray transport device 29 in the front-rear direction.
5 and an unloader 86. The loader 85 is located behind the unloader 86, and houses the package transport trays 28 on which a plurality of packages 2 are mounted, horizontally at regular intervals in the height direction. Each of the loader 85 and the unloader 86 has 20 tray storage stages.

The package transfer tray 28 is shown in FIG.
This is the same as the lid transfer tray 26 shown in FIG. That is, as shown in FIG. 3 (c), it is made of a square metal plate, and has a plurality of concave portions 89 for accommodating the package 2 and a long groove 90 formed on the upper surface. Ten recesses 89 are formed in a matrix at predetermined intervals in the vertical and horizontal directions, and the recesses 89 in each column are communicated in series by the long grooves 90. The recess 89 is provided in the package 2
In order to facilitate removal of the package 2, it is formed of a rectangular recess slightly larger than the package 2 and has a shallow depth. The package 2 is fitted into the recess 89 with the opening facing upward.

Referring again to FIG. 2, the package transfer tray 28 stored in the loader 85 is intermittently taken out from the bottom by the tray transfer device 29 and transferred to the package suction position B2. The package suction position B2 is provided in front of the package supply section 23. The second tray transport device 29 reciprocates between the lower part of the loader 85 and the unloader 86 and the package suction position B2 by driving a drive motor (not shown). The lowermost package stored in the loader 85 When the transfer tray 28 is received, it is moved forward and transferred to the package suction position B2. When the entire package 2 is removed and emptied at the package suction position B2, the empty package transfer tray 28 is transferred from the package suction position B2 to below the unloader 86. Below the unloader 86, there is provided an unillustrated elevating mechanism for pushing up the empty package transport tray 28 and storing it in the unloader 86. The supply of the package transfer tray 28 from the outside of the apparatus to the loader 85 and the removal of the package transfer tray 28 from the unloader 86 to the outside of the apparatus are performed by an operator.

The package transfer device 35 comprises first, second and third package transfer means 93, 94, 95 and the like, and is provided between the package suction position B2 and the heat stage 24.

When the predetermined number of packages 2 are sucked and held from the package transfer tray 28 transferred to the package suction position B2, the first package transfer means 93 transfers the package 2 to the first package transfer position E1. The package is transferred to the second package transport means 94. The first package transfer means 93 is provided with the first lid transfer means 50.
Are symmetrically arranged with the same structure. For this reason, the first package transport means 93 is provided with a slider 101 movably disposed on an X guide rail 100 extending in the left-right direction, and a first motor provided on the slider 101 so as to be movable up and down. Elevating arm 103, ten suction means 105 arranged in parallel with the elevating arm 103 at predetermined intervals in the front-rear direction, a drive motor 106 for reciprocating the slider 101 along the X guide rail 100, and the like. It is composed of

The suction means 105 is provided at the package suction position B.
When the package 2 is lowered by a predetermined distance together with the lifting arm 103 in accordance with the driving of the drive motor 104 in FIG. Adsorb and hold. The lifting arm 103 is
When the suction means 105 sucks and holds the package 2, it rises and returns, and the slider 101 moves to the left in FIG. 1 along the X guide rail 100 to move to the first package transfer position E.
When it stops above 1, it lowers again and transfers the package 2 sucked and held by the suction means 105 to the second package transport means 94. The suction surface of the suction means 105 is formed in a rectangular shape whose size matches the outer shape of the opening of the package 2.

The second package transfer means 94, when receiving the package 2 from the first package transfer means 93 at the first package transfer position E1, transfers the package 2 to the second package transfer position E2. 2
And has a substantially identical structure to the lid transport means 51 and is symmetrically disposed. Therefore, the second package conveying means 94
A slider 112 movably disposed on a Y guide rail 111 extending in the front-rear direction;
A drive motor 113 for reciprocating the slider 1 and the slider 1
The slider 12 is constituted by ten suction means 114 and the like, which are arranged side by side at predetermined intervals in the front-rear direction on the lower surface side of the slider 12 and whose suction surface is exposed on the upper surface of the slider 112.

The delivery of the package 2 from the first package transfer means 93 to the second package transfer means 94 at the first package transfer position E 1 is performed by sucking the package 2 held by the suction means 105. 1
14 is performed by suction and holding. That is,
At the first package transfer position E1, the suction means 105 of the first package transport means 93 descends to hold
The held package 2 is placed on the upper surface of the slider 112 of the second package transport means 94 and on the suction means 114. Then, the suction state of the suction means 105 is released, and the suction means 114 is evacuated by a vacuum pump instead, so that the suction means 114 suctions and holds the package 2. When the delivery of package 2 is completed,
The slider 112 moves forward along the Y guide rail 111 and stops at the second package transfer position E2.

The second package transfer means 94
Is provided with a positioning mechanism 120 for positioning the package 2 in the front-rear and left-right directions when the package 2 is received from the first package conveying means 93, and a suction / reversal mechanism 121 for reversing the positioned package 2 up and down. I have. The positioning mechanism 121 for positioning the package in the front, rear, left and right directions has exactly the same structure as the positioning mechanism 66 for positioning the lid 4 shown in FIG. Since they are different only, the details are omitted.

5 and 6, a suction / reversing mechanism 121 of the package 2 has a horizontal shaft 122 and a rotating plate 123 provided on the left side of the slider 112. A drive motor 124 for rotating by a predetermined angle together with the shaft 122, a plurality of suction means 125 arranged side by side on the rotating plate 123 in the front-rear direction, and an encoder 126
And so on. The suction means 125 includes the suction means 114 of the second package transport means 94 and the shaft 122.
, In other words, the rotation plate 123
Is attached to the lower surface side of the rotating plate 123 so that when it is rotated upward by 180 ° about the shaft 122 and overlaps with the slider 112, it is close to and opposed to the suction means 114. It is open on the upper surface of the movable plate 123. The encoder 126 detects the rotation angle of the rotation plate 123, and based on the detection signal, the drive motor 124
Is drive-controlled.

In such a suction / reversing mechanism 121, the rotating plate 123 is normally held horizontally with its upper surface facing upward as shown by a solid line in FIG. When the package 2 is sucked and held and turned over, the package 2 is turned upside down by 180 ° as shown by a two-dot chain line in FIG. Package 2 holding suction unit 125 by suction unit 114
From above. When the suction means 125 comes into contact with the package, the suction means 114
Release the adsorption state of. On the other hand, the suction means 125 sucks and holds the package 2 by being evacuated and receives the package 2. Then, the suction means 114 is moved from the suction means 114
25, the delivery of the package 2 to the rotating plate 1 is completed.
Numeral 23 returns to the initial position and turns the package 2 upside down. That is, the opening of the package 2 faces upward with the rotating plate 123 facing upward, and is sucked and held by the suction means 125 from below.

In this embodiment, the package 2 is loaded into the concave portion 89 (FIG. 3) of the package transport tray 28 with the opening facing upward.
Although the reversing mechanism 121 is required, it is not necessary when the package 2 is loaded in the concave portion 89 with the opening facing downward.
In addition, when the lid 4 is loaded into the recess 43 of the lid transfer tray 26 with the bonding surface facing down, it is necessary to supply the lid 4 to the heater tool 30 with the bonding surface turned upside down. The reversing mechanism 121 may be provided in the second lid transport means 51 to reverse the lid 4.

Referring to FIG. 2, FIG. 7 and FIG.
When the package transport means 95 receives the package 2 from the suction / reversal mechanism 121 at the second package transfer position E2, the package transport means 95 transports the package 2 above the heat stage 24 and the lid 4 placed on the heater tool 30. Place on top of. When the soldering of the package 2 and the lid 4 is completed and the manufacture of the electronic component 1 is completed, the electronic component 1 is transported from the heater tool 30 to above the product box 36 and dropped and stored in the product box 36. The slider 130 includes a slider 130 movably disposed on the X guide rail 80 and a drive motor (not shown) for reciprocating the slider 130. An elevating arm 131 provided on the slider 130 so as to be vertically movable, a drive motor 132 for elevating the elevating arm 131, and a drive motor 132 arranged in parallel with the elevating arm 131 at predetermined intervals in the front-rear direction.
Zero (only five are shown in FIG. 7) suction means 133
And the like.
The package 2 is configured to receive the package 2 from the suction unit 125 of the reversing mechanism 121. Further, the suction means 133 is
The package 2 is attached to the lift arm 131 so that the package 2 can be pressed against the lid 4 with a required pressure during the soldering process of the package 2 and the lid 4 (described later). The reason why the package 2 is pressed and pressed against the lid 4 is to prevent relative displacement, floating, rotation, etc. of the package 2 and the lid 4 during soldering.

Further, the structure and the like of the third package transport means 95 will be described in detail. A movable body 136 that can move up and down along a linear rail 135 is provided on the elevating arm 131. The movable body 136 has a weight 137 mounted on an upper surface thereof via a pin 138, and a lower end provided with the suction means 133.
Is installed. The weight 137 is a package 2
Used to press the suction means 133 against the package 2 with a required pressing force (approximately 40 to 100 g) at the time of soldering the lid 4 and various kinds of ring-shaped members having different thicknesses (weights). The pins 13 are selected as appropriate according to the size of the package 2.
8 is fitted. The movable body 136 is provided with a stopper 139.
The downward movement is restricted by supporting the stopper 139 with the fixing plate 140. Therefore, in this state, the weight of the weight 137 does not act on the suction means 133.

The surface of the lifting arm 131 opposite to the surface on which the movable body 136 is mounted is
A counterweight 144 is provided. The counterweight 144 is disposed on an L-shaped mounting bracket 143 that is disposed on the lift arm 131 via a linear rail 142 so as to be able to move up and down. The movable body 136 and the mounting bracket 144 are connected by a wire 145, and an intermediate portion of the wire 145 is connected to the lifting arm 131.
Is attached to a rotatable pulley 146 provided above the pallet. The counterweight 144 is balanced with the total weight of the movable body 136 including the suction means 133 (excluding the weight 137).

Further, the third package conveying means 95 comprises:
At the time of soldering package 2 and lid 4, suction means 133
Has a photo sensor 150 for detecting whether or not the package 2 is pressurized. This photo sensor 150
Is a light shielding plate 151 attached to the movable body 136 side.
And a light-receiving element 152 (152a, 1a) disposed on the side of the fixed plate 140 so as to face the light-shielding plate 151.
52b). When the elevating arm 131 is lowered downward by a predetermined stroke, the movable body 136 and the suction means 133 also move down integrally therewith.
The package 2 sucked and held by 33 is superposed on the lid 4 placed on the heater tool 30 with the opening part down. When the package 2 is placed on the lid 4, the suction means 133 stops because further lowering is prevented, and releases the suction state of the package 2. On the other hand, the lifting arm 131 includes the package 2 and the lid 4.
Even after the suction means 133 is stopped by the contact of, the stroke is further stopped after the required stroke is further lowered. That is, the lifting arm 131 descends by a stroke larger than the stroke that the suction means 133 can descend. For this reason, the fixing plate 140
Is also moved downward to release the support of the stopper 139, and the movable plate 136 can be lowered with respect to the lifting arm 131. However, since the suction means 133 is on the package 2, the weight (for example, 65 g) of the weight 137 is applied to the package 2 as a pressing force by the suction means 133.

When the suction means 133 presses the package 2 as the lifting arm 131 descends,
Since the light receiving and light emitting elements 152a and 152b move below the light shielding plate 151, the light receiving element 152a is
By receiving the light emitted from, the pressurized state of the package 2 is detected by the photo sensor 150.

In FIGS. 2 and 9 to 12, the heater tool 30 is mounted on the gantry 161 on the heat stage 24.
It is installed and arranged at the center of the upper surface. As shown in FIG. 11, the heater tool 30 is formed of a high resistance material such as molybdenum, titanium, or the like into an elongated rod-like body having a downward U-shaped cross section, so that the left side plate 30a and the right side opposed to each other in the left-right direction. A plate 30b and an upper plate 30c connecting the upper ends of the left plate 30a and the right plate 30b, and the lower ends of the left plate 30a and the right plate 30b are connected to the power supply terminal 1.
62, 163 (FIG. 10). The left side plate 30a and the right side plate 30b are formed to be unequal in thickness such that the plate thickness at the lower end is larger than that at the upper end. Top plate 30
c has a plate thickness substantially equal to the plate thickness of the upper end portions of the left side plate 30a and the right side plate 30b, and shows 10 examples on the upper surface (however, FIG. 9 and FIG. The heating projections 164 are provided in a row at predetermined intervals in the longitudinal direction of the heater tool 30.

The heating projection 164 is provided in the package 2,
It consists of a rectangular projection similar in shape to the lid 4 but slightly smaller, and the lid 4 and the package 2 are sequentially supplied and placed on the upper surface. That is, as described above, the supply and placement of the lid 4 is performed by the third lid transfer means 52 receiving the lid 4 from the second lid transfer means 51 at the second lid transfer position D2 and placing the lid 4 above the heater tool 30. The lifting and lowering arm 82 moves down, and the lid 4 sucked and held by the suction means 84 is placed on the heating protrusion 164 to release the sucked and held state.
In this case, as shown in FIG. 12, the lid 4 is placed with the joint surface to which the solder 8 is applied facing up. Package 2
The third package transfer means 95 receives the package 2 from the suction / reversal mechanism 121 and moves above the heater tool 30, and the elevating arm 131 descends to suck and hold by the suction means 133. The package 2 is mounted on the lid 4 placed on the heating projection 164 with the opening part down.

2, 9, 10, 13 to 15, the heating stage 24 has the heating projection 1.
The positioning mechanism 3 for positioning the lid 4 and the package 2 which are placed on top of each other before being soldered.
1 is provided. The positioning mechanism 31 is composed of two sets of stages 171 (171L, 171L) having the same structure and arranged on both sides of the heater tool 30 in a point-symmetric manner.
1R), and a cylinder 176 for operating these stages 171 in conjunction with each other. When the left and right stages 171 are distinguished from each other, the left stage is denoted by a suffix L, the right stage is denoted by a suffix R, and the other stages are not denoted by a suffix.

The stage 171 is composed of an X stage 172 and a Y stage 173 which are stacked and arranged in two stages. The X stage 172 is installed on the gantry 161 in parallel and has two long linear rails extending in the left-right direction. 174 is provided so as to be movable via a linear guide 175, and is configured to be reciprocated in the left-right direction (X direction) by a cylinder 176, that is, moved in a direction approaching and separating from the heater tool 30. The cylinder 176 has two operating rods 176a, 176 that operate in directions approaching and separating from each other.
The X stages 172 of the left and right stages 171L, 171R are connected to the operating rods 176a, 176b via connecting arms 177, respectively. The operating rods 176a and 176b are most separated when the cylinder 176 is off, and the left and right stages 171
The X stage 172 of L, 171R is held at the initial position.

The Y stage 173 is movably disposed on a linear rail 178 provided on the upper surface of the X stage 172 via a linear guide. Y stage 17
A cam follower 183 constituting a cam mechanism 181 together with a cam plate 182 is provided on a lower surface side of the support tool 182 via a support shaft 184, and a plurality of positioning members for positioning the package 2 and the lid 4 are provided on a side surface facing the heater tool 30. A piece 185 is provided so as to correspond to each heating projection 164. The Y stage 173 is a tension coil spring 1
79 (FIG. 13) urges the cam follower 183 in the Y direction and the direction in which the cam follower 183 is pressed against the cam surface 186 of the cam plate 182. The biasing direction of the Y stage 173 by the tension coil spring 179 is the same as that of the left stage 171.
The Y stage 173 of the right stage 171R is behind the automatic sealing device 20 with respect to the L Y stage 173.
To the front. In addition, the left and right stages 171
The L and 171R Y stages 173 are urged by two tension coil springs 180 in directions approaching the heater tool 30.

The cam plate 182 of the cam mechanism 181
Is fixed to the upper surface of the gantry 161, and the end surface facing the heater tool 30 forms the cam surface 186. The cam surface 186 forms a cam surface composed of a slope inclined at a required angle with respect to the moving direction (X direction) of the X stage 172. In this case, as shown in FIG. 9, the cam surfaces 186 of the cam plates 182 in the left and right cam mechanisms 181 and 181 are inclined in the same direction so as to be parallel to each other.

As described above, the cam surface 186 is inclined, the Y stage 173 is urged by the tension coil spring 179 in the direction in which the cam follower 183 is pressed against the cam surface 186 of the cam plate 182, and the left and right stages 171L, 171L,
The Y stage 173 of the 171R is extended by a tension coil spring 180.
The cylinder 17
When the X stage 172 of the left and right stages 171L and 171R is moved synchronously in the direction approaching each other along the linear rail 174 by the drive of the sixth stage, the Y stages 173 of the left and right stages 171L and 171R are moved along the cam surface 186. The positioning piece 185 moves in synchronization with the same direction as the inclination direction, that is, in the directions P1 and P2 (see FIG. 9).
To each other. The directions P1 and P2, which are the directions of movement of the Y stage 173, are the directions of one diagonal S of the two diagonals of the lid 4 and the package 2 placed on the heating projection 164 as shown in FIG. Matches. Here, the P1 direction is the diagonally left front direction of the automatic sealing device 20, and the P2 direction is the diagonally right rear direction.

The positioning piece 185 has a recess 190 (see FIGS. 13 and 14) for pressing the package 2 and the lid 4 at one corner of the tip. The recesses 190 are formed point-symmetrically so as to face the left and right positioning pieces 185. That is, the concave portion 190 of the positioning piece 185 provided on the Y stage 173 of the left stage 171L is
Since the movement direction of 73 is the P1 direction, it is provided at the rear corner of the tip, and the Y stage 1 of the right stage 171R
73, the concave portion 190 of the positioning piece 185
Is provided at the front corner of the tip because the moving direction of the Y stage 173 is the direction P2. Recess 190
Consists of a rectangular recess, two orthogonal positioning walls 19
1a and 191b (FIG. 13). Positioning wall 1
91a is a wall parallel to the X direction, and the positioning wall 191b is a Y wall.
It is a wall parallel to the direction.

The left and right stages 171L, 171R
Positioning piece 185 provided on the Y stage 173 of FIG.
Are shifted in the front-rear direction in consideration of the movement directions P1 and P2 of the Y stage 173. That is, as shown in FIG. 14, the positioning piece 185 of the stage 171L located on the left side of the heater tool 30 is located ahead of the positioning piece 185 of the stage 171R located on the right side of the heater tool 30. By disposing the left and right positioning pieces 185 in the front-rear direction in this way, the left and right stages 171L, 171L,
When the Y stage 173 of the 171R moves in the directions of P1 and P2 and approaches each other, the left and right positioning pieces 18
5 also approach each other from the P1 and P2 directions, so that the concave portion 190 can be pressed against two corners of the package 2 and the lid 4 on the heater tool 30 which are opposed to each other in the diagonal direction S. At this time, if the package 2 and the lid 4 are relatively displaced or rotated,
The concave portions 190 of the left and right positioning pieces 185 are formed by positioning walls 191a and 191b on all sides of the package 2 and the lid 4.
The package 2 and the lid 4 are pressed and moved until they come into contact. Therefore, the package 2 and the lid 4 are accurately positioned so as to overlap with each other, and their centers coincide with each other. Then, the package 2 and the lid 4 by the positioning mechanism 31
Is completed, the driving direction of the cylinder 176 is switched, and the X stage 172 is moved backward to return to the initial position. For this reason, the Y stage 173 also moves backward in conjunction with the X stage 172, and the positioning piece 18
5 is separated from the package 2 and the lid 4 to release their pressed state. The positioning of the package 2 and the lid 4 by the positioning mechanism 31 is performed while the package 2 is pressed against the lid 4 by the suction means 133.

9 and 10, the heat stage 24 is provided with the cooling mechanism 32 for cooling the heater tool 30. The cooling mechanism 32 is provided with two cooling pipes 201, 201 movably arranged on both sides of the heater tool 30 in the left-right direction, respectively, and biases the cooling pipes 201, 201 in a direction approaching each other.
Two tension coil springs 202 and the cooling tubes 201 and
Cylinders 204 which synchronize 01 and move closer to and away from each other
And so on. The cooling pipe 201 has a rectangular shape in plan view, in which cooling water is circulated and supplied.
When the heater tool 30 is OFF, the heater tool 30 is held at a standby position separated from the heater tool 30, and when the heater tool 30 is moved forward by the cylinder 204 during cooling, the surface facing the heater tool 30 contacts the side surface of the heater tool 30 for a certain time, The heater tool 30 is configured to be cooled to a required temperature (about 100 ° C.).

The cylinder 204 is mounted on the stage 17
1 has the same structure as that of the cylinder 176, and has two operating rods (not shown) that operate in directions approaching and separating from each other, and left and right cooling pipes 201, 201 are respectively connected to these operating rods via connecting arms. Are linked. Cooling pipe 2
The timing at which the heater tool 30 is cooled by 01 is immediately after the heater tool 30 is heated to a predetermined temperature (for example, 280 ° C.) by energization, and the solder 8 of the lid 4 is heated and melted. The solidification of the solder 8 can be accelerated to shorten the soldering cycle. The heating and cooling time is about 6 seconds.

Next, the automatic sealing device 20 having the above structure
Will be described mainly with reference to flowcharts of the sealing operation shown in FIGS. The automatic sealing device 20 automatically and continuously solders and hermetically seals the package 2 and the lid 4 by controlling the driving of each mechanism according to a sequence based on a control signal from the control unit. The electronic component 1 shown in FIG. 1 is manufactured.
When manufacturing the electronic component 1, first, the lid transfer tray 26 containing the lid 4 is placed in the loader 4 of the lid supply unit 22.
It is set to 0 (step S1 in FIG. 16). Further, the package transport tray 28 containing the package 2 is set on the loader 85 of the package supply unit 23 (step S2). The setting of the lid transfer tray 26 and the package transfer tray 28 on the loaders 40 and 85 is performed by an operator. Then, the start switch is turned ON to start the automatic sealing device 20.

When the automatic sealing device 20 is activated, the tray transfer device 27 receives the lid transfer tray 26 in the loader 40 and transfers it to the lid suction position B1. When the lid transfer tray 26 is transferred to the lid suction position B1, the first lid transfer means 50 of the lid transfer device 34 sucks and holds a required number of the lids 4 mounted on the lid transfer tray 26, and holds the lid. 1 and transferred to the second lid transfer means 51 (step S4).

The second lid transporting means 51 having received the lid 4 moves the lid 4 by the positioning mechanism 66 (FIG. 4).
Is temporarily positioned and transported to the second lid transfer position D2. During this conveyance, the discriminating camera 77 moves the lid 4
Is determined (step S5).

At the second package transfer position D 2, when the third lid transport means 52 receives and holds the lid 4 from the second lid transport means 51, the third lid transport means 52 transports the lid 4 to the heat stage 24, and It is placed on the heating projection 164 (step S6).

On the other hand, in the package supply section 23, when the tray transport device 29 receives the package transport tray 28 loaded with the package 2 stored in the loader 85, it transports it to the package suction position B2 (step S7). .

When the package transfer tray 28 is transferred to the package suction position B2, the package transfer device 35
The first package transport means 93 sucks and holds a required number of packages 2 mounted on the package transport tray 28, transports them to the first delivery position E1, and delivers them to the second package transport means 94.

The second package carrying means 94 having received the package 2 carries the package 2 to the second package delivery position E2. During this time, the positioning mechanism 12
0 (FIG. 4), the package 2 is provisionally positioned. The package 2 is inverted by the suction / inversion mechanism 121 (FIG. 6), and the opening is turned down (step S8).

At the second package transfer position E 2, when the third package transport means 95 receives the inverted package 2 from the suction / inversion mechanism 121, it transports the inverted package 2 above the heat stage 24 and heats the heater tool 30. The lid is placed on the lid 4 placed on the projection 164 with the opening part down (step S9).

When the package 2 is placed on the lid 4, the positioning mechanism 31 (FIG. 13) operates, and the package 2 and the lid 4 are sandwiched by the left and right positioning pieces 185 from both sides. The centers of the lids 4 are matched (step S10). The positioning by the positioning mechanism 31 is performed in a state where the package 2 is pressed at a predetermined pressure by the suction means 133 of the third package transport means 95.

When the step of positioning the package 2 and the lid 4 by the positioning mechanism 31 is completed, the positioning pieces 185
Is retracted to release the sandwiched state between the package 2 and the lid 4 (step S11).

Next, a large pulse current is applied to the heater tool 30 for a predetermined time while the package 2 is pressed at a predetermined pressure by the suction means 133. The power supply time to the heater tool 30 is several seconds (about 3 seconds), and the heater tool 30 is heated at a predetermined temperature (280
C.), and the package 8 and the lid 4 are soldered by instantaneously heating and melting the solder 8 applied to the lid 4 (step S12). Such a heating method of the heater tool 30 is called a pulse heating method.

When the energization is completed, the cooling mechanism 32 operates to bring the cooling pipe 201 into contact with the side surface of the heater tool 30 to cool the heater tool 30 to about 100 ° C. When the heater tool 30 is cooled, the heated and melted solder 8 is rapidly solidified to join the package 2 and the lid 4. Therefore, the package 2 is hermetically sealed by the lid 4, and the electronic component 1 is completed.

When the work of soldering the package 2 and the lid 4 is completed and the electronic component 1 is completed, the third package transport means 95 sucks and holds the electronic component 1 (step S13). Then, the product box 36 is moved along the linear rail 80.
When it moves backward to a position above and stops, the suction means 13
Then, the electronic component is dropped and stored in the product box 36 (step S14), and one cycle of the soldering process is completed. Hereinafter, the supply of the package 2 and the lid 4 and the soldering operation are continuously performed by repeating the above operation. The work of taking out the completed electronic component is performed by an operator after the work of soldering all the packages 2 and the lid 4 is completed.

In the above embodiment, 1
Although the ten packages 2 and the lid 4 are soldered in a single soldering operation, the present invention is not limited to this, and the heating projections 164 of the heater tool 30, the transfer device 34, The number can be appropriately increased or decreased by changing the number of the 35 suction means. Further, the present invention is not limited to the above-described embodiment at all,
The various mechanisms can be variously changed and modified without departing from the scope of the present invention.

[0079]

As described above, the automatic sealing device according to the present invention has the following functions and effects. The package and the lid can be soldered automatically and continuously, and the operator only has to supply the package and the lid to the supply unit and take out the completed electronic components. And save labor and improve productivity. Since the heater tool is configured to be instantaneously heated and soldered by the pulse heating method, the soldering can be performed in a short time. A projection smaller than the package and the lid is provided on the upper surface of the heater tool, and the lid and the package are configured to be placed on top of each other.Therefore, the lid and the package can be sandwiched and positioned from both sides by the positioning pieces, and positioned. Positioning can be performed reliably. Since the package is placed on the lid with its opening down and soldered, there is no risk that the molten solder particles will scatter and adhere to the electronic component elements in the package,
Good electrical characteristics of the electronic component element can be maintained. Since the soldering is performed in a state where the package is pressed with a predetermined pressure and pressed against the lid, the package and the lid can be soldered with high precision without relative displacement. Since the heater tool is cooled by the cooling mechanism after the solder is heated and melted, the soldering cycle can be shortened, and the productivity can be further improved.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing an electronic component sealed by an automatic sealing device according to the present invention.

FIG. 2 is a schematic plan view showing the inside of the automatic sealing device.

FIGS. 3A, 3B and 3C are plan views of a lid (package) transfer tray, perspective views of main parts of the lid transfer tray on which the lid is mounted, and package transfer on which a package is mounted; FIG. 2 is a perspective view of a main part of the tray for use.

4A and 4B are a plan view and a cross-sectional view showing a lid (package) positioning mechanism.

FIG. 5 is a plan view showing a suction / reversal mechanism of the package transport device.

FIG. 6 is a side view showing a part of the suction / reversal mechanism cut away.

FIG. 7 is a front view of a third package conveying means.

FIG. 8 is a side view of the package carrying means.

FIG. 9 is a plan view of a heat stage.

FIG. 10 is a front view of the heat stage.

FIGS. 11 (a), (b) and (c) are a front view, a plan view and a side view of a heater tool.

FIG. 12 is a perspective view showing a state where a lid is placed on a heating projection of a heater tool.

FIG. 13 is a schematic perspective view of a package and lid positioning mechanism.

FIG. 14 is a plan view showing a state where the package and the lid are positioned by the positioning pieces.

FIG. 15 is an enlarged view as viewed from an arrow A in FIG. 14;

FIG. 16 is a flowchart of a sealing operation.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Electronic component, 2 ... Package, 3 ... Electronic component element, 4
... lid, 7 ... conductive pin, 8 ... solder, 20 ... automatic sealing device, 21 ... chamber, 22 ... lid supply part, 23 ... package supply part, 24 ... heat stage, 26 ... lid transfer tray, 27 ... tray Transport device, 28: Package transport tray, 29: Tray transport device, 30: Heater tool, 31: Positioning mechanism, 32: Cooling mechanism, 34 ...
Lid transport device, 35: package transport device, 87: package transport tray, 121: suction / inversion mechanism, 13
3 suction means, 164 heating protrusion, 172 X stage, 173 Y stage, 179, 180 tension coil spring, 181 cam mechanism, 182 cam plate, 1
85: positioning piece, 190: recess, B1: lid suction position, B2: package suction position.

Claims (4)

[Claims] A package containing an electronic component element;
A lid for hermetically sealing the package by being soldered to an opening of the package; and a lid having solder applied to a joint surface with the package. A lid supply unit for supplying a plurality of packages accommodating the electronic component elements to a package suction position; and a heat stage integrally having a plurality of heating protrusions on an upper surface. A heater tool which is installed and heated by pulse-shaped energization; and a plurality of lids conveyed to the lid suction position are suctioned and held by suction means, and are conveyed above the heater tool to be over each heating protrusion. A lid transport device for placing the packages with the joining surfaces facing up, and a plurality of packages transported to the package suction position. A package transfer device that, when sucked and held by the means, conveys above the heater tool and mounts each of the lids mounted on each of the heating projections with the opening part down, An automatic sealing device for electronic components, comprising: a positioning mechanism for positioning the lid mounted on the projection for use and a package. 2. The electronic component automatic sealing device according to claim 1, wherein the package transport device transports the package by suctioning and holding the package above the heater tool, and is mounted on the heating projection. An automatic sealing device for electronic parts, comprising a vertically movable suction means mounted on a lid, and soldering the package and the lid in a state where the package is pressed by the suction means. 3. The automatic sealing device for an electronic component according to claim 1, wherein the heating protrusion of the heater tool is formed smaller than the package and the lid, and the positioning mechanism is provided on both sides of the heater tool. The lid and the package placed on the protrusions respectively approach and synchronize with each other from one of the diagonal directions of the package to press and position the corners of the lid and the package. With a positioning piece of
An automatic sealing device for an electronic component, characterized in that the positioning piece has a concave portion at one corner of the front end portion, the concave portion being in contact with two sides that are orthogonal to each other and sandwich the diagonal line of the lid and the package. 4. The automatic sealing device for an electronic component according to claim 1, wherein when the solder applied to the lid is heated and melted by energizing the heater tool, the heater tool is moved to a required position. An automatic sealing device for electronic components, comprising a cooling mechanism for cooling to a temperature.